JP2001057408A5 - - Google Patents
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- JP2001057408A5 JP2001057408A5 JP2000169388A JP2000169388A JP2001057408A5 JP 2001057408 A5 JP2001057408 A5 JP 2001057408A5 JP 2000169388 A JP2000169388 A JP 2000169388A JP 2000169388 A JP2000169388 A JP 2000169388A JP 2001057408 A5 JP2001057408 A5 JP 2001057408A5
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Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2000169388A JP4421081B2 (en) | 1999-06-09 | 2000-06-06 | Power module and manufacturing method thereof |
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11-162541 | 1999-06-09 | ||
| JP16254199 | 1999-06-09 | ||
| JP2000169388A JP4421081B2 (en) | 1999-06-09 | 2000-06-06 | Power module and manufacturing method thereof |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2001057408A JP2001057408A (en) | 2001-02-27 |
| JP2001057408A5 true JP2001057408A5 (en) | 2007-04-19 |
| JP4421081B2 JP4421081B2 (en) | 2010-02-24 |
Family
ID=26488297
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2000169388A Expired - Fee Related JP4421081B2 (en) | 1999-06-09 | 2000-06-06 | Power module and manufacturing method thereof |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP4421081B2 (en) |
Families Citing this family (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4200285B2 (en) * | 2003-04-02 | 2008-12-24 | パナソニック株式会社 | Circuit board manufacturing method |
| EP1686512A1 (en) * | 2005-02-01 | 2006-08-02 | NagraID S.A. | method for placing an electronic device on a substrate and placing device |
| CN101273453B (en) | 2005-09-27 | 2012-09-26 | 松下电器产业株式会社 | Heat dissipating wiring board, method for manufacturing same, and electric device using heat dissipating wiring board |
| JP4978235B2 (en) * | 2007-02-26 | 2012-07-18 | パナソニック株式会社 | HEAT CONDUCTIVE BOARD FOR HYBRID MOUNTING, ITS MANUFACTURING METHOD, AND CIRCUIT MODULE |
| JP2009071059A (en) * | 2007-09-13 | 2009-04-02 | Sanyo Electric Co Ltd | Semiconductor device |
| KR100957218B1 (en) * | 2007-12-27 | 2010-05-11 | 삼성전기주식회사 | light emitting diode unit |
| JP2010161425A (en) * | 2010-04-26 | 2010-07-22 | Panasonic Corp | Manufacturing method of module, and manufacturing facility therefor |
| JP2012099697A (en) * | 2010-11-04 | 2012-05-24 | Denki Kagaku Kogyo Kk | Circuit board, electronic apparatus |
| JP2012169440A (en) * | 2011-02-14 | 2012-09-06 | Fujitsu Semiconductor Ltd | Semiconductor device and manufacturing method of the same |
| JP2013110264A (en) * | 2011-11-21 | 2013-06-06 | Fujitsu Semiconductor Ltd | Semiconductor device and semiconductor device manufacturing method |
| JP6048481B2 (en) * | 2014-11-27 | 2016-12-21 | 株式会社豊田自動織機 | Electronics |
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2000
- 2000-06-06 JP JP2000169388A patent/JP4421081B2/en not_active Expired - Fee Related