JP2001055502A - Curable resin composition - Google Patents

Abstract

PROBLEM TO BE SOLVED: To improve the flame retardance, chemical resistance and heat resis tance of a polyphenylene ether after curing, while maintaining the excellent dielectric property, by incorporating curable polyphenylene ether resin compsn. and a dyestuff with a specific light absorption peak and a specific fluorescence yield. SOLUTION: A curable polyphenylene ether resin compsn. (A) is prepd. by blending a polyphenylene ether resin having a viscosity number (30 deg.C, in a 0.5 g/dL chloroform soln.) of 0.1-1.0 with a thermoplastic or thermosetting resin, a radical initiator or a curing agent and a filler. One hundred pts.wt. of the component A is blended with 0.0001-5 pts.wt. of (B) a dyestuff having a light absorption peak at 350-480 nm and having a fluorescence yield of >=0.1 to provide a curable resin compsn. This compsn. and a substrate (C) are blended to form a curable composite material wherein the total of the components A and B is 95-10 pts.wt. and the component C is 5-90 pts.wt. based on 100 pts.wt. of the total of the components A, B and C.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

The present invention relates to a curable resin composition and a cured product obtained by curing the same. Further, the present invention provides a curable composite material comprising the resin composition and a substrate,
The present invention relates to the cured product and a laminate comprising the cured product and a metal foil. The curable resin composition of the present invention can be used in the electronics industry, space and
It can be used as a dielectric material, an insulating material, and a heat-resistant material in fields such as the aircraft industry.

[0002]

2. Description of the Related Art In recent years, there has been a remarkable trend toward miniaturization and high-density mounting methods in the field of electronic devices for communication, consumer use, industrial use, and the like, and accordingly, materials have become more excellent. Heat resistance, dimensional stability, and electrical properties are being demanded. For example, a copper-clad laminate made of a thermosetting resin such as a phenol resin or an epoxy resin has been used as a printed wiring board. Although these have various performances in a well-balanced manner, they have a drawback that electric characteristics, particularly dielectric characteristics in a high frequency range, are poor. As a new material for solving this problem, polyphenylene ether has recently attracted attention and is being applied to copper-clad laminates.

[0003] Considering the application to printed wiring boards, in order to adapt to the object determination method of recent automatic inspection machines, 4
It is required that the insulating resin shows strong fluorescence under the irradiation of 42 nm laser light. However, although polyphenylene ether absorbs ultraviolet rays to some extent, 44
Since these materials hardly absorb visible light of 2 nm and have low fluorescence quantum yields, these materials emit weak fluorescence when irradiated with 442 nm laser. However, in a technique such as simply adding a fluorescent whitening agent, the light absorption by the polyphenylene ether molecule itself and the light absorption wavelength region of the fluorescent whitening agent often overlap, and a large amount is added to obtain a sufficient amount of fluorescent light. In addition, the excellent dielectric properties, heat resistance, and insulation reliability of the polyphenylene ether-based thermosetting resin may be impaired.

[0004]

SUMMARY OF THE INVENTION The present invention has been made in view of the above circumstances, and retains the excellent dielectric properties of polyphenylene ether, and has excellent flame retardancy, chemical resistance and the like after curing. Heat resistant and 442nm
An object of the present invention is to provide a novel curable resin composition which efficiently absorbs light and emits fluorescence efficiently.

[0005]

Means for Solving the Problems The inventors of the present invention have conducted intensive studies to solve the above-mentioned problems, and as a result, have found a novel resin composition that meets the object of the present invention, and have completed the present invention. It has arrived. The present invention is constituted by the following six inventions. A first aspect of the present invention is (a) a curable polyphenylene ether-based resin composition, and (b) 350 to 480.
Provided is a curable resin composition containing a dye having a light absorption peak at nm and a fluorescence quantum yield of 0.1 or more. (First invention) The second invention provides a cured resin composition obtained by curing the curable resin composition of the first invention. (Second invention) A third invention is a curable resin composition comprising the components (a) and (b) of the first invention and a curable composite material comprising (c) a base material, The total of the components (a) and (b) is 95 to 10 parts by weight, and the component (c) is 5 to 90 parts by weight based on 100 parts by weight of the sum of the components (a), (b) and (c). The present invention provides a curable composite material curable resin composition characterized by the following. (Third invention) A fourth invention provides a cured composite material obtained by curing the curable composite material of the third invention. (Fourth Invention) A fifth invention of the present invention provides a laminate comprising the cured composite material of the fourth invention and a metal foil. (Fifth invention) A sixth invention provides a resin-attached metal foil having a film of the curable resin composition of the first invention on one surface of the metal foil.
(Sixth Invention) Hereinafter, the present invention will be described in detail.

The curable polyphenylene ether-based resin composition used in the present invention is a composition containing a polyphenylene ether-based resin (including a modified product) as a component. Preferred examples of the polyphenylene ether-based resin include poly (2,6-dimethyl-1,4-phenylene ether) and poly (2,6-dimethyl-1,4) obtained by homopolymerization of 2,6-dimethylphenol. 4-phenylene ether), a copolymer of 2,6-dimethylphenol and 2,3,6-trimethylphenol, a copolymer of 2,6-dimethylphenol and 2-methyl-
Copolymer of 6-phenylphenol, polyfunctional polyphenylene ether resin obtained by polymerization in the presence of 2,6-dimethylphenol and polyfunctional phenol compound, for example, JP-A-63-301222, JP-A-1 -297
And copolymers containing units of general formulas (A) and (B) as disclosed in JP-A-428.

With respect to the molecular weight of the polyphenylene ether resin described above, the viscosity number ηsp / c measured at 30 ° C. in a 0.5 g / dl chloroform solution is 0.1 to 1.
Those in the range of 0 can be used favorably. The polyphenylene ether-based resin referred to in the present invention also includes modified products. Examples of such modified products include polyphenylene ether resins containing unsaturated groups (JP-A-64
-69628, JP-A-1-113425, JP-A-1
And the reaction products of polyphenylene ether resins with unsaturated carboxylic acids and / or acid anhydrides.

Next, as the resin to be blended in addition to the above-mentioned polyphenylene ether-based resin, any resin may be used as long as it does not impair the physical properties of the substrate as a material for a printed substrate, which is the object of the present invention. Specific examples of such a resin include a phenol resin, an epoxy resin, diallyl phthalate, divinylbenzene, a polyfunctional acryloyl compound, a polyfunctional methacryloyl compound, a polyfunctional maleimide, a polyfunctional methacryloyl compound, a polyfunctional methacryloyl compound. Maleimide, polyfunctional cyanate ester, polyfunctional isocyanate, unsaturated polyester, triallyl isocyanurate, triallyl cyanurate, polybutadiene,
Examples include crosslinkable polymers such as styrene-butadiene, styrene-butadiene-styrene, various thermoplastic resins, various thermosetting resins, and the like. These are generally blended for the purpose of improving the physical properties of a cured product produced by molding and curing.

Preferred examples of the resin composition used in the present invention include polyphenylene ether and triallyl isocyanurate and / or triallyl cyanurate, polyphenylene ether and epoxy resin, polyphenylene ether and styrene butadiene block copolymer and triallyl isocyanurate. and/
Or triallyl cyanurate, polyphenylene ether containing unsaturated group and triallyl isocyanurate and / or triallyl cyanurate, polyphenylene ether containing unsaturated group and triallyl isocyanurate and / or triallyl cyanurate and epoxy resin, polyphenylene Reaction product of ether resin with unsaturated carboxylic acid and / or acid anhydride and reaction product of triallyl isocyanurate and / or triallyl cyanurate, reaction product of polyphenylene ether resin with unsaturated carboxylic acid and / or acid anhydride Reaction products of epoxy resins, polyphenylene ether resins with unsaturated carboxylic acids and / or acid anhydrides, and triallyl isocyanurate and / or triallyl cyanurate and epoxy resins. Carboxymethyl resins. The amount of each component in these systems is selected according to the purpose.

In order to accelerate the curing reaction, the polyphenylene ether resin used in the present invention may contain a usual radical initiator or a usual curing agent for an epoxy resin. Further, fillers and additives can be blended and used in an amount that does not impair the original properties for the purpose of imparting desired performance according to the application. Such fillers include carbon black, silica, alumina, barium titanate, talc, mica, glass beads,
Glass hollow spheres and the like can be given. In addition, examples of the additive include an antioxidant, a heat stabilizer, an antistatic agent, an ultraviolet absorber, a plasticizer, a pigment, a dye, and a colorant. Further, bromine-based, chlorine-based, phosphorus-based, and silicon-based flame retardants and flame retardant assistants such as antimony trioxide and antimony pentoxide can be used in combination for the purpose of further improving flame retardancy.

The proportion of the component (b) used in the present invention is not particularly limited, but is usually 0.0001 to 5 parts by weight, preferably 0.00 parts by weight, based on 100 parts by weight of the component (a).
005 to 0.5 parts by weight, more preferably 0.001 to 0.5 parts by weight
0.3 parts by weight. The component (b) used in the present invention is a dye having a light absorption peak at 350 to 480 nm and a fluorescence quantum yield of 0.1 or more. When the light absorption peak wavelength is less than 350 nm, the overlap with the light absorption band of polyphenylene ether is too large, and it is difficult to effectively use photons. When the light absorption peak wavelength exceeds 480 nm, 44
Not only does the rate of absorbing 2 nm excitation light drop,
There is a problem that the fluorescence wavelength becomes too long and the fluorescence detection efficiency is reduced.

The fluorescence quantum yield is, of course, preferably large, but if it is 0.1 or more, it is effective as the component (b) of the present invention. Since the fluorescence quantum yield is affected by the matrix in which the fluorescent molecules are placed, the fluorescence quantum yield referred to here is a film prepared by dissolving or dispersing the component (b) in polyphenylene ether by solvent casting. It is assumed that the sample was measured in air using excitation light of 442 nm.

Examples of such component (b) include coumarin derivatives, salicylic acid derivatives, benzophenone derivatives, benzotriazole derivatives, hydroxybenzoate derivatives, cyanoacrylate derivatives, thiophene derivatives, pyrazoline derivatives, diaminostilbene dyes, acenaphthene derivatives , Flavonoids, flavin coenzymes, etc. Specific examples include, but are not limited to, fluorescein, thioflavin, eosin, diaminodiphenylmethane, and the like.

The cured resin composition of the second invention of the present application is obtained by curing the curable resin composition of the first invention described above. The curing method is optional,
A method using heat, light, an electron beam, or the like can be employed.
Further, the curable composite material of the third invention of the present application is characterized by comprising the curable resin composition of the first invention and (c) a base material, increasing the mechanical strength of the curable resin composition, and improving dimensional stability. Properties can be increased.

Examples of the substrate used in the present invention include various glass cloths such as roving cloth, cloth, chopped mat, and surfacing mat, asbestos cloth, metal fiber cloth and other synthetic or natural inorganic fiber cloths; polyvinyl alcohol fiber, Woven or non-woven fabric obtained from synthetic fibers such as polyester fiber, wholly aromatic polyester fiber, acrylic fiber, wholly aromatic polyamide fiber, polybenzoxazole fiber and polytetrafluoroethylene fiber; natural fiber cloth such as cotton cloth, linen cloth and felt Carbon fiber cloth; natural cellulosic cloths such as kraft paper, cotton paper, and paper-glass mixed paper are used alone or in combination of two or more.

The ratio of the substrate (c) in the curable composite material of the present invention is 5 to 90% by weight, more preferably 10 to 80% by weight, based on 100 parts by weight of the curable composite material.
%, More preferably 20 to 70% by weight. If the amount of the base material is less than 5% by weight, the dimensional stability and strength after curing of the composite material are insufficient, and if the amount of the base material is more than 90% by weight, the dielectric properties and flame retardancy of the composite material are inferior. The method of combining the resin composition of the present invention with the substrate is not particularly limited, and a melting method in which the resin composition is melted and impregnated into the substrate, the resin composition is dissolved in a solvent, and then the substrate is dissolved. A wet method of obtaining a prepreg by impregnating and then drying the solvent can be employed.

The cured composite material of the fourth invention of the present application is obtained by curing the curable composite material thus obtained by a method such as heating. The production method is not particularly limited. For example, a plurality of the curable composite materials are stacked, and the respective layers are adhered to each other under heat and pressure, and simultaneously heat-cured to obtain a cured composite material having a desired thickness. be able to. Examples of the metal foil used for the laminate (fifth invention) and the metal foil with resin (sixth invention) of the present invention include a copper foil and an aluminum foil.
The thickness is not particularly limited, but is preferably 3-200 microns, more preferably 5-105 microns.

The copper foil with resin of the present invention is a so-called build-up method in which the copper foil with resin is laminated on the upper and lower sides of a printed wiring board, and then a via hole is formed by laser irradiation, followed by plating to form a connection and pattern of the via hole. It can be used as a composite sheet for a construction method. The molding and curing of the curable resin composition, the curable composite material, and the resin-attached copper foil of the present invention are performed at a temperature of 80 to 300 ° C., a time of 1 minute to 10 hours, and a pressure of 0.1 to 500 kg / cm ^2. , More preferably, temperature: 150-250 ° C., time: 1 minute-
The operation is performed for 5 hours at a pressure of 1 to 100 kg / cm ² .

[0019]

BEST MODE FOR CARRYING OUT THE INVENTION Hereinafter, the present invention will be described by way of examples to further clarify the present invention.

[0020]

REFERENCE EXAMPLE 1 Poly (2,4) having a viscosity number ηsp / c of 0/44 as measured with a chloroform solution of 0.5 g / dl at 30 ° C.
6-dimethyl-1,4-phenylene ether): 100
Parts by weight, maleic anhydride: 1.5 parts by weight, and 2,
5-dimethyl-2,5-di (t-butylperoxy) hexane (Perhexa 25B manufactured by NOF Corporation): 1.
0 parts by weight were dry-blended at room temperature, and then heated at a cylinder temperature of 300 ° C. and a screw rotation speed of 230 rpm.
It was extruded by a screw extruder. This reaction product is referred to as polymer A. The viscosity number ηsp / C of each polymer described in the following Reference Examples and Examples was measured by the same method as in Reference Example 1.

[0021]

Reference Example 2 Using poly (2,6-dimethyl-1,4-phenylene ether) having ηsp / C = 0.56, ηsp / C was determined according to a known method disclosed in JP-A-64-69629. An allyl group-substituted polyphenylene ether with c = 0.62 (average substitution rate 14%) was synthesized. This allyl-substituted polyphenylene ether is referred to as polymer B.

[0022]

Example 1 <Copper foil with resin> 60 parts by weight of polymer A
Triallyl isocyanurate 40 parts by weight, 2,5-dimethyl-2,5-di (t-butylperoxy) hexane 4
Parts by weight, 1-phenyl-3- (4-tert-butyl-
Styryl) -5- (4-tert-butyl-phenyl)
-0.01 parts by weight of pyrazoline are mixed using toluene as a solvent, applied to an electrolytic copper foil having a thickness of 12 μm, and dried,
A copper foil with resin was obtained. The thickness of the resin part was 60 μm.

A resin-coated copper foil on both sides of a glass cloth reinforced thermosetting polyphenylene ether resin laminate (TLC-596, manufactured by Toshiba Chemical Co., Ltd.) having a thickness of 0.8 mm is applied at 180 ° C. for 2 hours under a pressure of 20 kg. / Cm ² by applying heat and pressure to form a double-sided copper-clad laminate. This double-sided copper-clad laminate was selectively etched by a photographic method to form a conductor circuit pattern. When a fluorescent detection type optical automatic appearance inspection apparatus was used under the same detection conditions as those for the glass epoxy substrate for the laminate on which the conductor circuit pattern was formed, it was confirmed that the apparatus operated without any problem.
Selective etching using JI
A sample for measuring dielectric properties specified in SC6481 was prepared. The dielectric constant and the dielectric loss tangent measured by the automatic equilibrium bridge method were 3.6 and 0.003, respectively.

[0024]

Comparative Example 1 <Copper foil with resin> 60 parts by weight of polymer A, 40 parts by weight of triallyl isocyanurate, 2,5-
4 parts by weight of dimethyl-2,5-di (t-butylperoxy) hexane was mixed using toluene as a solvent, applied to a 12 μm-thick electrolytic copper foil, and dried to obtain a resin-coated copper foil. The thickness of the resin part was 60 μm.

A resin-coated copper foil on both sides of a glass cloth reinforced thermosetting type polyphenylene ether resin laminate (TLC-596, manufactured by Toshiba Chemical Co., Ltd.) having a thickness of 0.8 mm is applied at 180 ° C. for 2 hours under a pressure of 20 kg. / Cm ² by applying heat and pressure to form a double-sided copper-clad laminate. This double-sided copper-clad laminate was selectively etched by a photographic method to form a conductor circuit pattern. When a fluorescence detection-type optical automatic appearance inspection apparatus was used for the laminated body on which the conductor circuit pattern was formed under the same detection conditions as those for the glass epoxy substrate, a defect detection error was rarely generated. Using the above double-sided copper-clad laminate, a sample for measuring dielectric properties specified in JIS C 6481 was prepared by selective etching. The dielectric constant and the dielectric loss tangent measured by the automatic equilibrium bridge method were 3.6 and 0.003, respectively.

[0026]

Example 2 <Resin-containing resin sheet> Polymer B6
0 parts by weight, 40 parts by weight of triallyl isocyanurate,
2,5-dimethyl-2,5-di (t-butylperoxy) hexane 4 parts by weight, flame retardant (1,2-ethylene-bis- (tetrabromophthalimide)) 20 parts by weight, acenaphthene 0.02 parts by weight Is mixed using toluene as a solvent and applied to a polyester film having a thickness of 50 μm,
After drying, it was peeled off to obtain a resin sheet. The thickness of the resin sheet was 80 μm.

An electrolytic copper foil having a thickness of 18 μm, ten upper resin sheets, and an electrolytic copper foil having a thickness of 18 μm are laminated in this order, and they are bonded by heating and pressing at a pressure of 20 kg / cm ² at 180 ° C. for 2 hours. It was cured to form a 0.8 mm thick double-sided copper-clad laminate. This double-sided copper-clad laminate was selectively etched by a photographic method to form a conductor circuit pattern. When a fluorescent detection type optical automatic appearance inspection apparatus was used for the laminate having the conductor circuit pattern formed thereon under the same conditions as the glass epoxy substrate, it was confirmed that the apparatus could be operated without any problem. Using the above double-sided copper-clad laminate, a sample for measuring dielectric properties specified in JIS C 6481 was prepared by selective etching. The dielectric constant and the dielectric loss tangent were measured by the automatic equilibrium bridge method.
003. When the copper foil of the upper double-sided copper-clad laminate was removed by etching and subjected to a flammability test, UL94
It had flame retardancy equivalent to V-0.

[0028]

[Comparative Example 2] <Resin-containing resin sheet> Polymer B6
0 parts by weight, 40 parts by weight of triallyl isocyanurate,
4 parts by weight of 2,5-dimethyl-2,5-di (t-butylperoxy) hexane and 20 parts by weight of a flame retardant (1,2-ethylene-bis- (tetrabromophthalimide)) were used using toluene as a solvent. The mixture was mixed, applied to a polyester film having a thickness of 50 μm, dried, and then peeled to obtain a resin sheet. The thickness of the resin sheet was 80 μm.

An 18 μm-thick electrolytic copper foil, 10 upper resin sheets, and an 18 μm-thick electrolytic copper foil are laminated in this order, and they are bonded by heating and pressing at a pressure of 20 kg / cm ² at 180 ° C. for 2 hours. It was cured to form a 0.8 mm thick double-sided copper-clad laminate. This double-sided copper-clad laminate was selectively etched by a photographic method to form a conductor circuit pattern. When a fluorescent detection type optical automatic appearance inspection apparatus was used for the laminate on which the conductor circuit pattern was formed under the same conditions as the glass epoxy substrate, a defect detection error sometimes occurred on rare occasions. Using the above double-sided copper-clad laminate, a sample for measuring dielectric properties specified in JIS C 6481 was prepared by selective etching. The dielectric constant and the dielectric loss tangent measured by the automatic equilibrium bridge method were 3.0 and 0.003, respectively.

[0030]

Example 3 <Copper clad laminate> 60 parts by weight of polymer A, 40 parts by weight of triallyl isocyanurate, 4 parts by weight of 2,5-dimethyl-2,5-di (t-butylperoxy) hexane, flame retardant ( 1,2-bis (pentabromophenyl)
Ethane) (20 parts by weight) and 1,3,5-triphenylpyrazoline (0.02 parts by weight) were mixed using toluene as a solvent, impregnated into a style 2116 glass cloth, and dried to obtain a prepreg. The resin content of the prepreg was 60% by weight.

An electrolytic copper foil having a thickness of 18 μm, five upper prepregs, and an electrolytic copper foil having a thickness of 18 μm are laminated in this order, and they are bonded and cured by heating and pressing at 180 ° C. for 2 hours under a pressure of 20 kg / cm ^2. Thus, a double-sided copper-clad laminate having a thickness of 0.8 mm was formed. This double-sided copper-clad laminate was selectively etched by a photographic method to form a conductor circuit pattern. When a fluorescent detection type optical automatic appearance inspection apparatus was used for the laminate having the conductor circuit pattern formed thereon under the same conditions as the glass epoxy substrate, it was confirmed that the apparatus could be operated without any problem. Using the above double-sided copper-clad laminate, a sample for measuring dielectric properties specified in JIS C 6481 was prepared by selective etching. When the permittivity and the dielectric loss tangent were measured by the automatic equilibrium bridge method, they were 3.6 and 0.0, respectively.
03. The copper foil of the upper double-sided copper-clad laminate was removed by etching, and a flammability test was performed.
It had a flame retardancy of −0.

[0032]

Comparative Example 3 <Copper clad laminate> 60 parts by weight of polymer A, 40 parts by weight of triallyl isocyanurate, 4 parts by weight of 2,5-dimethyl-2,5-di (t-butylperoxy) hexane, flame retardant ( 1,2-bis (pentabromophenyl)
Ethane) (20 parts by weight) was mixed using toluene as a solvent, impregnated in a style 2116 glass cloth, and dried to obtain a prepreg. The resin content of the prepreg was 60% by weight.

An electrolytic copper foil having a thickness of 18 μm, five upper prepregs and an electrolytic copper foil having a thickness of 18 μm are laminated in this order, and they are adhered and cured by heating and pressing at 180 ° C. for 2 hours under a pressure of 20 kg / cm ^2. Thus, a double-sided copper-clad laminate having a thickness of 0.8 mm was formed. This double-sided copper-clad laminate was selectively etched by a photographic method to form a conductor circuit pattern. When a fluorescent detection type optical automatic appearance inspection apparatus was used for the laminate on which the conductor circuit pattern was formed under the same conditions as the glass epoxy substrate, a defect detection error sometimes occurred on rare occasions. Using the above double-sided copper-clad laminate, a sample for measuring dielectric properties specified in JIS C 6481 was prepared by selective etching. The dielectric constant and the dielectric loss tangent were measured by the automatic equilibrium bridge method.
003.

[0034]

As described above, the curable resin composition of the present invention efficiently absorbs 442 nm excitation light of a fluorescence detection type optical automatic appearance inspection device, emits fluorescence, and provides a large contrast with a metal foil portion. It is suitable for using an automatic visual inspection machine that is indispensable for the manufacture of high-precision printed wiring boards. In addition, the polyphenylene ether resin maintains excellent electrical insulation, dielectric properties, and heat resistance. Therefore, the material of the present invention
It can be suitably used as a dielectric material, an insulating material, a heat-resistant material, and the like in the fields of the electric industry, the electronics industry, the space and aircraft industries, and the like.

──────────────────────────────────────────────────の Continued on the front page (51) Int.Cl. ⁷ Identification code FI Theme coat ゛ (Reference) H01B 17/62 H01B 17/62 F term (Reference) 4F100 AB01C AB17C AB33C AK54A AT00B BA02 BA03 BA10A BA10B BA10C CA13A GB41 GB43 JA20B JB12A JG04 JG05 JJ03 YY00A YY00B 4J002 BD153 BE023 BG003 BL012 BP012 CC032 CD002 CF003 CF163 CF212 CH071 CL063 CM023 DA068 DJ028 DL008 EA046 EA067 EE037 EH106 EL097 EN077 ER006 ET006 EUE FD 010 006 HA05 4J027 AB01 AC01 AJ08 BA13 BA18 BA19 BA22 BA23 BA29 CA02 CA03 CA04 CA06 CA07 CA08 CA09 CA10 CA12 CA19 CA22 CA25 CA26 CA29 CA34 CA36 CA38 CB03 CC02 CD02 5G305 AA06 AA12 AB08 AB40 BA09 BA18 BA21 BA25 CA13 CB05 A03 AB20 A20 BA05 CA03 DA03 DA23 DA28 DB01 FB03 FB09 FB13

Claims (6)

[Claims] 1. A curable resin composition comprising (a) a curable polyphenylene ether-based resin composition and (b) a dye having a light absorption peak at 350 to 480 nm and a fluorescence quantum yield of 0.1 or more. object. 2. A cured resin composition obtained by curing the curable resin composition according to claim 1. 3. A curable resin composition comprising the components (a) and (b) according to claim 1, and (c) a curable composite material comprising a base material, wherein (a), (b), And a total of 95 to 10 parts by weight of the components (a) and (b) and 5 to 90 parts by weight of the component (c), based on 100 parts by weight of the sum of the components (c) and (c). material. 4. A cured composite material obtained by curing the curable composite material according to claim 3. 5. A laminate comprising the cured composite material according to claim 4 and a metal foil. 6. A resin-coated metal foil having a film of the curable resin composition according to claim 1 on one side of the metal foil.