JP2001053318A - Solar battery module - Google Patents

Abstract

PROBLEM TO BE SOLVED: To improve workability of a soldering work performed on the soldered connection of a conductive path, from a bus bar to a terminal box and reliability of the soldered connection. SOLUTION: A slit-like cut section 31 is provided in either of conductive paths 18, which connect the terminal box of a solar battery module to a bus bar 13 and the bus bar 13, to which the first route member 18a of the path 18 is connected by soldering. The bus bar 13 and path member 18a are combined together, so that the bar 13 and member 18a curb the free actions of the others by engaging the bar 13 with the member 18a in on overlapping state, on both their front and rear surfaces by passing the bar 13 or member 18a through the cut section 31. Then the bar 13 and path 18 are connected to each other by soldering 34 the overlapping section.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a solar cell module which is used, for example, by being installed on a roof or the like. In particular, the present invention relates to a solar cell module in which the structure of a soldering connection of a conductive path from a bus bar to a terminal box is improved. About.

[0002]

2. Description of the Related Art In order to guide the output of a solar cell module to a terminal box installed on the back of the module, see Japanese Patent Application Laid-Open No.
As described in Japanese Patent No. 26497, lead wires connected to the terminal box are soldered to positive and negative bus bars (electrodes) provided at both ends of the solar cell module. This soldering is performed by bringing the bus bar and the end of the lead wire close to each other or overlapping them, and by laying solder over both of them. Similarly, in the case where the wiring direction is changed in the middle of the conductive path from the bus bar to the terminal box, first and second lead wires conventionally separately prepared are prepared, and these ends and the like are used. Are crossed at a predetermined angle, and soldering is performed by embedding solder in the overlapping portion to change the direction of the conductive path.

[0003]

As described above, in the conventional configuration, a pair of conductors (bus bars, lead wires, etc.) to be soldered are merely approached or overlapped, and the opposing conductors are restrained from each other. Have no engagement relationship. For this reason, the mutual positional relationship tends to be misaligned at the time of soldering, so that the soldering is performed with attention to this point, so that the soldering workability is not good, and the reliability of the soldering connection is impaired due to the misalignment. Therefore, the improvement is desired to improve the quality of the solar cell module.

[0004] The problem to be solved by the present invention is to provide a solar cell module capable of improving the workability of soldering a soldering connection portion of a conductive path from a bus bar to a terminal box and the reliability of the soldering connection. .

[0005]

The present invention comprises a transparent substrate,
A plurality of solar cells formed on the back surface of the transparent substrate, bus bars connected to these solar cells, and the solar cells and the bus bars are provided on the back side of the transparent substrate to seal the solar cells and the bus bars. Filling material, a sealing material laminated on the back surface of the filling material, a terminal box disposed on the back side of the sealing material, and a conductive path provided by connecting the terminal box and the bus bar. It is assumed that a solar cell module is provided.

According to another aspect of the present invention, there is provided a pair of conductors to be connected by soldering, wherein the soldered connecting portion of the conductive path from the bus bar to the terminal block is to be connected by soldering. Are engaged by the shape of at least one of the conductors so as to keep each other overlapping,
The overlapping portion of the two conductors is soldered.

According to the first aspect of the present invention, the pair of conductors to be connected to each other to be connected by soldering are not simply overlapped or soldered close to each other, but are mutually moved by the shape of at least one conductor. Are regulated and soldered together in an overlapping state. Therefore, displacement of the two conductors during soldering of the overlapping portion of the two conductors is prevented, so that the soldering workability can be improved and the movement of the pair of conductors to be connected as described above is reduced. Not only can they be held in an appropriate state by being restrained by each other, but also the reliability of the soldering connection can be improved with the increase in the catch of the solder.

In carrying out the invention of claim 1,
As in the invention of claim 2 which depends on this invention, a cut portion is provided in at least one of the pair of conductors to be connected by soldering, and the other conductor is passed through the cut portion. The conductors may be engaged so as to maintain a state in which the conductors overlap each other on both front and back surfaces.

According to the second aspect of the present invention, the pair of conductors to be connected to each other by soldering are not simply overlapped or soldered close to each other, but the conductors are passed through the cut portions. Accordingly, the conductors are combined in a state where they overlap with each other on both front and back surfaces to regulate and restrain each other's movement. Therefore, displacement of the two conductors is prevented during soldering of the overlapping portion of the two conductors, so that soldering workability can be improved, and the movement of the pair of conductors to be connected as described above. Are not restricted to each other to maintain an appropriate combination state, but also the reliability of soldering connection can be improved with the increase in the amount of solder caught. In addition, since the shape to be restricted is the notch, the front and back surfaces of both conductors are overlapped with each other by a simple operation of passing at least the end of the conductor to be connected through the notch, and the movement of each other is performed. Can be combined with each other in a state of restraining.

[0010]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, a first embodiment of the present invention will be described with reference to FIGS.

FIG. 1 is a rear view showing the structure of the solar cell module. FIG. 2 is a sectional view taken along the line Z--Z in FIG.
1 is a cross-sectional view taken along line YY in FIG. 1. As shown in these figures, the solar cell module M includes a transparent substrate 11.
, A plurality of solar cells 12, a pair of bus bars 13 for a positive electrode and a negative electrode, a filler 14, a spacer 15, a sealing material 16, a terminal box 17, a terminal box 17 and a bus bar 13.
And a conductive path 18 as an output extraction line provided by electrically connecting these.

As the transparent substrate 11, a substrate having electrical insulation, such as a glass substrate, is used. A plurality of solar cells 12 are provided on the rear surface of the transparent substrate 11 except for the peripheral portion of the substrate 11. These cells 12 may be crystalline or amorphous, but in the present embodiment, the amorphous solar cells 12
Is used. These solar cells 12 are made of transparent substrate 1
1. A transparent electrode layer, an amorphous semiconductor layer such as amorphous silicon, and a back electrode layer are sequentially formed on the back surface of the substrate 1. A plurality of lines are arranged in a row by patterning using a laser or the like. In addition to being integrated in unit cells, the semiconductor layers of each cell 12 are connected in series by a back electrode layer made of metal foil, conductive paste, or the like.

A pair of busbars 13 serving as module electrodes for taking out the output of the entire solar cell module M are provided on the back surface of the transparent substrate 11 at both sides of the unit cell, and the solar cell 12 at both ends and the busbar 13 are provided. They are electrically connected via the back electrode layer. For the bus bar 13, a bus bar material that can be bent such as a rectangular copper wire having a horizontally long rectangular cross section and that can maintain the bent state is used. A conductive path 18 soldered to one end of each of the positive and negative bus bars 13 as described later
6 and is routed to the back surface of the
Are connected to the terminal box 17. The terminal box 17 is disposed on the back surface of the solar cell module M, specifically, on the back surface of the sealing material 14.

The filler 14 is provided on the back side of the transparent substrate 11 by burying the solar cell 12, the bus bar 13, and a part of the conductive path 18 and sealing them. EVA (ethylene / vinyl acetate copolymer), PVB (polyvinyl butyral), silicone resin, or the like can be used for the filler 14, and EVA is employed in the present embodiment.

The spacer 15 is provided between the solar cell 12 and the conductive path 18. In this embodiment, a material having an electric insulation property, preferably an electric insulation material having a performance capable of impregnating the filler 14, for example, a nonwoven fabric made of glass fiber is used for the spacer 15. When the height is increased, the same kind of sealing material as the sealing material 16 can be used.

The sealing material 16 is an electrically insulating protective layer provided on the back surface of the filling material 14.
6 is an insulating film having excellent moisture resistance and water resistance such as a fluorine-based film, a PET film, or a Tedlar (trade name).

The conductive path 18 is, for example, a first path member 18.
a and the second path member 18b. As the first path member 18a, a bendable conductor such as a rectangular copper wire having a horizontally long rectangular cross section is used like the bus bar material. The second path member 18b may be a conductor of the same type as the bus bar 13, but in the present embodiment, an external lead wire with an insulating coating is employed. One end of the first path member 18a is the bus bar 1
3 and the other end is connected to the second path member 18b.
And the other end of the second path member 18b is connected to the terminal box 17. In FIGS. 1 and 2 and the like, reference symbol A denotes the bus bar 13 and the first path
And B indicates a conductive path 18
2 shows the second soldering connection portion of the two path members 18a and 18b in the middle of FIG. The details of these solder connection parts A and B will be described later.

Next, a manufacturing process of the solar cell module M having the above configuration will be described with reference to FIGS. In the first step shown in FIG. 4, a pair of bus bars 13 is attached to the transparent substrate 11 on which the solar cells 12 have already been formed on the back surface. These busbars 13 are longer than the transparent substrate 11, and one end thereof is protruded from one piece 11 a of the transparent substrate 11, and is soldered onto the transparent electrode of the transparent substrate 11. Therefore, both bus bars 13 are formed by a bus bar base 13a located in the area of the transparent substrate 11 and soldered, and an output extraction end 13b integrally extending therefrom and projecting from one side 11a of the transparent substrate 11. Is formed.

In the second step shown in FIG.
EVA first sheet 14 a is laminated on the back surface of transparent substrate 11. The first sheet 14a is slightly larger than the transparent substrate 11 and has notches 21 at both corners on one side 11a of the transparent substrate 11. Therefore, by setting the first sheet 14a, the bus bar base 1 of the bus bar 13 is set.
3a is covered, and the output extraction end 13b extends outside the transparent substrate 11 through the cutout 21. This notch 21
Is provided, even if the output take-out end 13b is turned back as described later, the take-out end 13b is
It can be prevented from protruding outward from the first region. The portion of the bus bar 13 facing the notch 21 is not soldered.

In a subsequent third step, as shown in FIG. 6, one spacer 15 made of glass nonwoven fabric is extended on the first sheet 14a on one side 11a of the transparent substrate 11 in the width direction of the sheet 14a. Are laminated as follows. The length of the spacer 15 is slightly longer than the width of the first sheet 14a. At the time of the lamination, the spacer 15 has one side 15a formed by the notch 21.
Along the edge 21a (see FIG. 5). The lamination state is maintained by a temporary attachment process at several places. FIG.
The mark x in the middle indicates a temporary fixing portion.

In the next fourth step shown in FIG. 7, the projecting output take-out end 13b is bent so as to be located in the area of the transparent substrate 11 (inside the periphery). That is, first, after being bent from the bus bar base 13a along the thickness direction of the one side 15a and the edge 21a, the spacer 15
Fold over the back of

Next, as shown in a fifth step of FIG. 8, one end of the first path member 18a of the conductive path 18 is soldered to the output extraction end 13b overlapping the back surface of the spacer 15. This soldering will be described with reference to FIG.
As shown in FIG. 12, one end 3 of the first path member 18a
0 is a slit-shaped cut portion 3 cut from the tip.
1 at the center in the width direction, and first and second connection portions 32, 33 located on both sides of the cut portion 31.
It is formed with. One of the two connection portions 32, 33, for example, the first connection portion 32 is longer than the second connection portion 33,
The length of the second connection portion 33 is equal to or less than the width of the one end 30. The output take-out end 13b to be soldered to the one end 30 is shown in FIG.
After the step (B), they are combined so as to obtain a mechanically connected state shown in FIG.

That is, first, as shown in FIG. 12A, the one end 30 is brought close to the output take-out end 13b, and as shown in FIG. Insert and pass. In this case, the second connection portion 3 is provided on the surface (in the working state) of the output extraction end 13b.
3 so that the first connection portion 32 overlaps the back surface (in the working state) of the output extraction end 13b. Next, as shown in FIG. 12C, the first connection portion 32 is folded back so as to overlap the surface of the output extraction end portion 13b. The overlapping of both ends 13b and 30 due to the insertion of the output take-out end 13b into the cut-out portion 31 may be reversed from that in FIG. 12B, however, as shown in FIG. 32 can be bent on the front side, which is excellent in workability. Lastly, as shown by a two-dot chain line in FIG. 12C, the solder 34 is laid from the front side around the cut portion 31 so that the output extraction end 13 b of the bus bar 13 and the first path of the conductive path 18 are formed. Member 18a
Is soldered to the one end 30 of the slab. FIGS. 2 and 3 show the configuration of the first solder connection portion A obtained by this soldering.

As described above, the output take-out end 13b is the first
By passing through the cut portion 31 provided at the end portion 30 of the path member 18a, and by bending the first connection portion 32 and sandwiching the output extraction end portion 13b from the front and back at this portion 32, these ends are formed. The portions 13a and 30 are combined in a state where they overlap each other on both front and back sides to regulate the movement of each other.

Therefore, in the above-mentioned soldering to the overlapping portion of both ends 13a, 30, both ends 13a, 30
a, 30 are prevented from being displaced from each other. Therefore, the workability of soldering can be improved, and not only the both ends 13a, 30 to be soldered and connected as described above not only restrain each other's movement, but also the solder 34 becomes more caught (contact area). Accordingly, the reliability of the solder connection can be improved.

The other end 35 of the first path member 18a soldered to the bus bar 13 as described above is bent upward at right angles as shown in FIG. As a result, the other end portions 35 of the first path members 18a approach each other and are substantially parallel to each other and protrude toward the rear surface of the solar cell module M.

In a subsequent sixth step, a second sheet 14b made of EVA for the filler 14 is laminated on the back surface of the spacer 15 as shown in FIG. The width of the second sheet 14b is the spacer 15
The width of the notch 21 is larger than the width of the notch 21. A notch groove 14b1 is provided at the center of one side of the second sheet 14b.
The root of the other end 35 of the pair of first path members 18 is passed through b1. Note that the arrow in FIG. 9 indicates the mounting direction of the second sheet 14b.

Next, in a seventh step shown in FIG. 10, the sealing material 16 made of Tedlar is finally laminated from the back side. The sealing material 16 is one size larger than the first sheet 14a, and has one through hole 16a at an end on the side 11a in the longitudinal direction. This through hole 16a
The other end 35 of the pair of first path members 18a is passed through the first path member 18a. The lamination state of the sealing material 16 is maintained by a temporary attachment process at several places.

In the subsequent eighth step, as shown in FIG. 11, each of the pair of end portions 30 passing through the through hole 16a is
After being bent in the opposite directions so as to overlap along the back surface of the sealing material 16, these are fixed to the back surface of the sealing material 16 with an adhesive tape 22. The first path member 18a of the conductive path 18 soldered to the bus bar 13 by the above procedure
It is routed to the back of. As a result of this routing, the spacer 15 is interposed between the solar cell 12 and the output take-out end 13b and the first path member 18a that are folded back as described above, and the back side of the first path member 18a. The second sheet 14b and the sealing material 16 are stacked on the second sheet 14b, and the other end 35 of the first path member 18a is
Is drawn out to the back side of the sealing material 16 through the through hole 16a.

Thereafter, the assembly assembled in the above procedure is subjected to a hot melt treatment. Thereby, the first and second sheets 14a and 14b are melted, and the solar cell 12 and the bus bar base 1 of the bus bar 13 are melted.
3a, the spacer 15, and the portion other than the other end 35 of the first path member 18a are buried, and the transparent substrate 11 and the sealing material 1 are removed.
And between 6.

After this process, the second path member 18b of the conductive path 18 is soldered to the other end 35, and the bus bar 13 and the terminal box disposed on the back surface of the solar cell module M via this member 18b. 17 are electrically connected.

Next, the first and second path members 18a, 18
b. The mutual soldering connection will be described with reference to FIG.

As shown in FIG. 13A, the other end 35 of the first path member 18a is provided with concave cuts 36 on both sides in the width direction.
The space between them is a neck 35a that is narrower than the other parts. As shown in FIG. 13 (B), the flexible core wire 37 of the second path member 18b is wound around the neck portion 35a while being hooked on the cut portion 36 and entangled. And finally, Figure 1
As shown by a two-dot chain line in FIG. 3B, the first and second path members 18a and 18b are soldered to each other by soldering the solder 38 from the front side around the portion where the core wire 37 is wound. FIG. 3 shows the configuration of the second soldering connection portion B obtained by this soldering.

As described above, the notch provided at the other end 35 of the first path member 18a is inserted into the core 37 of the second path member 18b.
, The other end portion 35 and the core wire 37 are combined with each other so as to overlap with each other on both front and back surfaces thereof and to regulate the movement of each other.

Therefore, in the above-mentioned soldering of the first and second path members 18a and 18b in the conductive path 18 where the first and second path members 18a and 18b overlap, displacement between the two members 18a and 18b is prevented. Therefore, the soldering workability can be improved, and as described above, not only the two members 18a and 18b to be soldered and connected restrict each other's movement but also the solder 38 is more likely to be caught. The reliability of the solder connection can be improved.

In the solder connection between the bus bar 13 and the first path member 18a according to the first embodiment, a slit-like cut portion 31 is provided at the output extraction end 13b of the bus bar 13, and the cut portion 31 First path member 18a
12C through the end 30 having no slit of FIG.
It is also possible to obtain and implement the same mechanical coupling state.
In addition, the connecting portions on both sides of the slit-shaped cut portion 31 do not necessarily need to be folded back to the front side or the back side.
It is excellent in that the front and back surfaces of each other are more overlapped with each other to more easily restrain each other's movement.

FIG. 14 shows a second embodiment of the present invention. The second embodiment is applied to, for example, a soldering connection portion in which a plurality of path members forming a conductive path are continuously soldered in the axial direction thereof, and will be described below.

In FIG. 14, reference numerals 41 and 42 denote path members to be connected by soldering, each of which is a rectangular copper wire having a horizontally long rectangular cross section. One path member 41
The end 43 has a slit-shaped cut portion 44 cut in from the front end thereof at the center in the width direction, and the first and second connection portions of the same length located on both sides of the cut portion 44. It is formed by parts 43a and 43b. The other path member 42
Of the notch 44 as shown in FIG.
And is connected to the path member 41. Thereafter, as shown by a two-dot chain line in FIGS.
By placing solder 47 from the front side around the center,
The first and second path members 41 and 42 are soldered to each other.

By inserting the end portion 46 into the cut portion 44, as shown in FIG.
Since the upper and lower surfaces 46 are combined so as to overlap with each other on the front and back surfaces thereof to regulate the movement of each other, misalignment of the mutually overlapping end portions 43 and 46 is prevented in the soldering. Therefore, the soldering workability can be improved, and as described above, not only the mutual movement of both ends 43, 46 of the path members 41, 42 to be connected by soldering is restricted, but also the catch of the solder 47 is prevented. As the number increases, the reliability of the solder connection can be improved.

In the second embodiment, a slit-shaped notch is provided not only in the path member 41 but also in the end of the path member 42 so that the end portions 4 of the two members 41 and 42 are provided.
Both ends 43 and 46 may be connected by soldering in a combined state in which the cuts 3 and 46 are respectively passed through the cutouts on the other side.

The present invention also provides a solder connection between a terminal fitting built into a terminal block and a conductive path, in addition to the above-described solder connection between the bus bar and the conductive path or the solder connection in the conductive path. Also applicable to parts.

[0042]

According to the present invention, the positions of the two conductors connected by soldering are inadvertently shifted at the time of soldering at the soldering connection portion of the conductive path from the bus bar to the terminal box of the solar cell module. As a result, the workability of soldering and the reliability of soldering connection can be improved, and therefore the quality of the solar cell module can be improved.

[Brief description of the drawings]

FIG. 1 is a back view showing the configuration of a solar cell module according to a first embodiment of the present invention.

FIG. 2 is a sectional view taken along the line ZZ in FIG.

FIG. 3 is a sectional view taken along the line YY in FIG. 1;

FIG. 4 is a perspective view showing a first step of obtaining an output extraction structure of the solar cell module according to the first embodiment.

FIG. 5 is a perspective view showing a second step of obtaining the output take-out structure in the first embodiment.

FIG. 6 is a perspective view showing a third step of obtaining the output take-out structure in the first embodiment.

FIG. 7 is a perspective view showing a fourth step of obtaining the output extraction structure according to the first embodiment.

FIG. 8 is a plan view showing a fifth step of obtaining the output extraction structure in the first embodiment.

FIG. 9 is a perspective view showing a sixth step of obtaining the output extraction structure according to the first embodiment.

FIG. 10 is a perspective view showing a seventh step for obtaining the output extraction structure according to the first embodiment.

FIG. 11 is a perspective view showing an eighth step of obtaining the output extraction structure according to the first embodiment.

FIGS. 12A to 12C are plan views sequentially showing the assembling of a first soldering connection portion in the output extraction structure according to the first embodiment.

FIGS. 13A and 13B are plan views sequentially showing the assembly of a second soldering connection part in the output extraction structure according to the first embodiment.

FIGS. 14A and 14B are plan views showing, in order, the assembling of a solder connection portion in an output extraction structure in a solar cell module according to a second embodiment of the present invention.
FIG. 15C is a sectional view taken along line XX in FIG.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 11 ... Transparent substrate 12 ... Solar cell 13 ... Bus bar (conductor) 13b ... Output take-out end part of bus bar 14 ... Filler 16 ... Sealing material 17 ... Terminal box 18 ... Conductive path 18a ... First path member of conductive path ( Conductor 18b Second path member (conductor) 30 of conductive path 30 One end of first path member 31 Notch 34 Solder 35 Other end of first path member 36 Notch 37 Second member of path Core wire (conductor) 38 ... Solder 41, 42 ... Path member (conductor) of conductive path 43, 46 ... End part of path member 44 ... Notch 47 ... Solder M ... Solar cell module A, B ... Soldering connection part

Claims (2)

[Claims] 1. A transparent substrate, a plurality of solar cells formed on the back surface of the transparent substrate, a bus bar connected to these solar cells, and a solar cell on the back side of the transparent substrate. A filler provided by sealing the bus bar, a sealing material laminated on the back surface of the filler, a terminal box disposed on the back side of the sealing material, and the terminal box and the bus bar In a solar cell module including a conductive path provided by being connected, a soldering connection portion of the conductive path from the bus bar to the terminal box connects a pair of conductors to be connected by soldering to each other. A solar cell module characterized by being engaged by the shape of at least one of the conductors so as to maintain an overlapping state, and soldering an overlapping portion between the two conductors. 2. A notch is provided in at least one of a pair of conductors to be connected by soldering, and the other conductor is passed through the notch to connect the two conductors to each other on both front and back sides. The solar cell module according to claim 1, wherein the solar cell module is engaged so as to maintain an overlapping state.