JP2001053130A - Apparatus for carrying in and carrying out of vessel, and method of carrying in and carrying out - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an apparatus for vessel-carrying in and out and a method enabling carrying in/out of vessels, housing and taking out substrates in/from the vessels successively. SOLUTION: An apparatus 2 for carrying in and out is provided with a before-cleaning side out-port 12, a before-cleaning side in-port 13, an after- cleaning side in-port 15, an after-cleaning side out-port 16, a loader/unloader part 20, a carriage arm 10 for carrying carriers C between stock parts 14, 17, 31, 32, 33 and 34. The carriage arm 10 carries the carriers C from the in-port 13 to the loader/unloader part 20 and from the loader/unloader part 20 to the out-port 12 via the stock parts 14, 31 and 32, and carries the carries C from the in-port 15 to the loader/unloader part 20 and from the loader/unloader part 20 to the out-port 16 via the stock parts 17, 33 and 34.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a container loading / unloading device for loading and unloading containers and a method thereof.

[0002]

2. Description of the Related Art For example, in a semiconductor device manufacturing process, a semiconductor wafer (hereinafter, referred to as a "wafer") as a substrate is washed with a predetermined chemical solution or a cleaning solution such as pure water.
2. Description of the Related Art A cleaning apparatus for removing contamination such as particles, organic contaminants, and metal impurities attached to the surface of a wafer is used. Among them, a cleaning system using a wet-type cleaning apparatus that performs a cleaning process by immersing a wafer in a cleaning tank filled with a cleaning liquid has been widely used.

In such a cleaning system, a worker in a factory or an AGV (Auto Guided Vehicle) is used.
The carrier storing 25 wafers before cleaning is carried into the carrier carrying-in device via the carrying-in side in / out port by an unmanned carrier such as that shown in le). Then, for example, two carriers are transferred from the loading-side in / out port to the loader unit, and the loader unit collectively removes 50 wafers from the two carriers. Then 5
Zero wafers are conveyed to a cleaning / drying processing unit in which a large number of cleaning devices and drying devices are arranged, and the cleaning and drying processes are performed in a batch system. On the other hand, the carrier from which the wafer has been taken out and emptied during that time is returned from the loader unit to the carry-in side in / out port and carried out of the carrier carry-in device. The wafer W that has been subjected to the predetermined cleaning and drying processing in the cleaning / drying processing unit is transported to the unloader unit of the carrier unloading device and stored in an empty carrier that has been waiting in advance. The carrier is transported out of the cleaning system via the carrier.

In this case, the carrier carry-in device is provided with a stock portion for storing a plurality of carriers accommodating 25 wafers before cleaning, so that a large number of cleaning devices and drying devices are not always in a standby state, but are always in a standby state. It is running. That is, instead of waiting for the wafer taken out from the previous carrier to take out the wafer from the next carrier until the predetermined washing and drying processing in the washing / drying processing section is completed, the previous wafer is not waited. The next two carriers previously stored in the stock unit are transferred to the loader unit at a time so as not to overlap with the progress of the washing and drying processes. Then, 50 wafers are taken out from the carrier and transferred to the cleaning / drying processing section. Also,
The carrier unloading device is also provided with a stock unit, and stores a plurality of empty carriers for storing the washed wafer. Thus, while the wafers are successively transferred to the cleaning / drying processing unit in units of 50, the wafers subjected to the predetermined cleaning and drying processing are successively carried out of the cleaning system.

[0005]

However, in the conventional carrier carrying-in device, what is stored in the stock portion is either the carrier containing the wafer before cleaning or the empty carrier from which the wafer before cleaning is taken out. Was limited. For example, if only the carrier containing the wafer before cleaning can be stored in the stock section,
When the GV is transporting the carrier to another system, unloading of the empty carrier is delayed after taking out the wafer from the carrier, and the carrier is placed at the loading-side in / out port or loader. It remains as it is. As described above, conventionally, the function of the loader unit cannot be sufficiently exhibited because the carrier loading device has a configuration without versatility. Then, if new wafers cannot be successively carried into the cleaning / drying processing section, the cleaning by the cleaning system is interrupted. Further, every time a wafer is taken out of the carrier by the loader unit, if the carrier is to be carried out of the cleaning system, an operator or the like must always wait near the cleaning system, which is troublesome.

[0006] In the conventional carrier unloading device as well, the storage in the stock section is limited to either an empty carrier for storing the cleaned wafer or a carrier for storing the cleaned wafer. For example, if only an empty carrier for storing the cleaned wafer can be stored in the stock section, the cleaned wafer is used as the carrier when the AGV is transporting the carrier to another system. After being stored, the unloading of the carrier is delayed, and the carrier remains in the unloading-side in / out port or unloader section. As described above, conventionally, since the carrier unloading device has a configuration that is not versatile, the function of the unloader unit cannot be sufficiently exhibited. If the wafers having been subjected to the predetermined cleaning process cannot be successively carried out of the cleaning system, the cleaning by the cleaning system is interrupted. Furthermore, as in the case of the carrier carrying-in device, it takes time and effort to carry out the carrier containing the washed wafer every time.

Accordingly, an object of the present invention is to provide a container loading / unloading device and a loading / unloading method capable of continuously loading / unloading a container, storing / unloading a substrate from / into the container, and the like.

[0008]

In order to solve the above-mentioned problems, an invention according to a first aspect of the present invention is directed to an import for carrying in a container containing a substrate, an outport for carrying out an empty container from which a substrate has been taken out, A take-out unit for taking out the container from the container, a stock unit for storing the container, and a transfer mechanism for transferring the container between the import / outport, the take-out unit and the stock unit.
Provided is a container loading / unloading device.

According to the container loading / unloading device of the first aspect, the container storing the substrates is loaded into the import. This loading is performed by, for example, an operator or a suitable container transport device. Thus, the containers brought into the import
It is transferred from the import to the stock section by the transfer mechanism. In this case, if there is no container at the take-out part,
Containers may be transferred from the import to the removal station. As a result, there is no container in the import, so that the next container storing the substrates can be carried in after the import. Then, when the next container storing the substrates is carried into the import, the container is transferred from the import to the stock unit or the take-out unit by the transfer mechanism as described above. Then, when the container storing the substrates is transferred by the transfer mechanism from the import or stock unit to the take-out unit, the substrates are thereafter taken out of the container at the take-out unit. Thus, the substrate taken out of the container is then carried into an appropriate processing section, where a predetermined process is performed on the substrate.

The empty container after the substrate is taken out of the take-out unit is transferred from the take-out unit to the stock unit by the transfer mechanism. In this case, if there is no container at the outport, the container may be transferred from the take-out unit to the outport. As a result, since there is no container in the take-out unit, the next container containing the substrate can be transferred from the import or stock unit to the take-out unit. Then, when the next container storing the substrate is transferred to the take-out unit, the substrate is taken out of the container at the take-out unit as before. Then, when the empty container from which the substrate has been taken out is transferred by the transfer mechanism from the take-out portion or the stock portion to the outport, the empty container from which the substrate has been taken out is then carried out from the outport. The unloading is performed by, for example, an operator or a suitable container transport device. As a result, since there is no container in the outport, the next empty container from which the substrate has been taken out can be continuously transferred from the take-out part or stock part to the outport by the transfer mechanism. Then, when the next empty container from which the substrate has been taken out is transferred to the outport by the transfer mechanism, the container is unloaded as before.

In the loading / unloading device according to the first aspect,
As described above, since the transfer of the container from the import unit to the unloading unit and / or the transfer of the container from the unloading unit to the outport is performed through the stock unit for storing the container, the transfer of the container storing the substrate and the transfer from the container are performed. Take out the substrate,
The empty container from which the substrate has been taken out can be continuously carried out. Therefore, the substrates can be successively carried into an appropriate processing section or the like, and the processing of the substrates can be performed continuously. In addition, when workers and container transporters carry in the next container for import, the empty containers that had been waiting in the outport or stock section should also be unloaded.
It is possible to collectively carry in the container containing the substrate and carry out the empty container from which the substrate has been taken out. Therefore, the loading and unloading of the container can be performed efficiently.

According to a second aspect of the present invention, there is provided an import for carrying in an empty container for accommodating a substrate, an outport for carrying out a container accommodating a substrate, a storage unit for accommodating a substrate in a container, and a storage unit for accommodating a container. And a transfer mechanism for transferring the container between the import / outport, the storage unit and the stock unit.

According to the container loading / unloading method of the present invention, an empty container for storing a substrate is loaded into the post-processing import. This loading is performed by, for example, an operator or a suitable container transport device. Thus, the containers carried into the import are transferred from the import to the stock unit by the transfer mechanism. In this case, if there is no container in the storage unit, the container may be transferred from the import to the storage unit. As a result, since there is no container in the import, it is possible to carry in the next empty container for storing the substrate following the import. Then, when the next empty container for storing the substrate is carried into the import, the container is transferred from the import to the stock unit or the take-out storage unit by the transfer mechanism in the same manner as described above. Then, when an empty container for storing the substrate is transferred from the import or stock unit to the storage unit by the transfer mechanism, the substrate that has already been subjected to the predetermined processing is stored in the container in the storage unit. Thus, the container storing the substrates is transferred from the storage section to the stock section by the transfer mechanism. In this case, if there is no container at the outport, the container may be transferred from the storage section to the outport. As a result, there is no container in the storage section, so that the next empty container for storing the substrate can be carried into the storage section continuously.

Then, when the next empty container for storing the substrate is transferred to the storage unit, the substrate, which has been subjected to the predetermined processing, is stored in the container in the storage unit, as described above.
In this way, the container storing the substrate is transferred from the storage unit to the stock unit or the outport by the transfer mechanism as described above. Then, the container storing the substrate is carried out from the out port. The unloading is performed by, for example, an operator or a suitable container transport device. As a result, since there is no container in the outport, the next container storing the substrate can be transferred from the storage unit or the stock unit to the outport by the transfer mechanism. Then, when the next empty container storing the substrate is transferred to the outport by the transfer mechanism, the container is unloaded as before.

In the loading / unloading device according to the second aspect,
As described above, since the transfer of the container from the import to the storage unit and / or the transfer of the container from the storage unit to the outport is performed through the stock unit that stores the container, the empty container for storing the substrate is stored. Loading, storage of the substrate in the container, and unloading of the container storing the substrate can be performed continuously. Therefore, the substrates can be unloaded one after another from an appropriate processing unit or the like, and the processing of the substrates can be performed continuously. Furthermore, when a worker or a container transporter carries in the next container for import, the container that has been waiting in the outport or the stock unit is also unloaded. The loading of the container and the unloading of the container storing the substrate can be performed at a time. Therefore, the loading and unloading of the container can be performed efficiently.

According to a third aspect of the present invention, there is provided a pre-processing side import for carrying in a container containing a substrate before processing, a pre-processing side out port for carrying out an empty container from which a substrate before processing is taken out, and a post-processing side out port. Post-processing import for loading empty containers for storage, post-processing out-port for unloading containers containing processed substrates, and unprocessed substrates out of the containers and post-processed substrates in containers A container to be taken out and a stocking part to store the container, and a container to be transferred between the pre-processing side import, the pre-processing side outport, the post-processing side import, the post-processing side outport, the taking-out storage part and the stocking part. A transfer device for a container, comprising: a transfer mechanism.

According to the container loading / unloading device of the third aspect, the container storing the substrate before processing is loaded into the pre-processing side import. This loading is performed by, for example, an operator or a suitable container transport device. In this way, the container carried into the pre-processing import is transferred from the pre-processing import to the stock unit by the transfer mechanism. In this case, if there is no container in the removal storage unit, the container may be transferred from the pre-processing side import to the removal storage unit. As a result, there is no container in the pre-processing side import, so that the next container storing the substrate before processing can be carried in following the pre-processing side import. Then, when the next container storing the substrate before processing is carried into the pre-processing side import, the container is transferred from the pre-processing side import to the stock unit or the take-out storage unit by the transfer mechanism as before. Then, when the container storing the substrate before processing is removed from the pre-processing side import or stock unit by the transfer mechanism and transferred to the storage unit, the substrate before processing is removed from the container in the removal storage unit. Thus, the substrate taken out of the container is then carried into an appropriate processing section, where a predetermined process is performed on the substrate.

The empty container after the substrate before processing is taken out from the take-out storage unit is transferred from the take-out storage unit to the stock unit by the transfer mechanism. In this case, if there is no container in the pre-processing outport, the container may be transferred from the take-out storage unit to the pre-processing outport. As a result, since there is no container in the unloading and storing unit, the next container storing the unprocessed substrate can be transferred from the pre-processing side import or stock unit to the unloading and storing unit. Then, when the next container containing the substrate before processing is taken out and transferred to the storage unit,
As before, the unprocessed substrate is taken out of the container in the take-out storage unit. In this manner, the substrate taken out of the container is carried into an appropriate processing unit and processed as described above. Then, when the empty container from which the substrate before processing is taken out is transferred by the transfer mechanism from the take-out storage unit or the stock unit to the pre-processing side out port, the empty container from which the substrate before processing is taken out is taken out. Removed from port. The unloading is performed by, for example, an operator or a suitable container transport device. As a result, there is no container in the pre-processing side outport, so the next empty container from which the substrate before processing has been taken out is taken out by the transfer mechanism and is continuously transferred from the storage unit or the stock unit to the pre-processing side outport. Becomes possible. Then, when the next empty container from which the substrate before processing has been taken out is transferred to the pre-processing-side outport by the transfer mechanism, the container is unloaded as before.

On the other hand, an empty container for storing the processed substrate is carried into the post-processing import. This import is
For example, it is performed by a worker or an appropriate container transport device.
In this manner, the container carried into the post-processing import is transferred from the post-processing import to the stock unit by the transfer mechanism. In this case, if there is no container in the removal storage unit, the container may be transferred from the post-processing side import to the removal storage unit. As a result, since there is no container in the post-processing side import, it is possible to carry in the next empty container for storing the processed substrate following the post-processing side import. Then, when the next empty container for storing the processed substrate is carried into the post-processing side import, the container is transferred from the post-processing side import to the stock unit or the take-out storage unit by the transfer mechanism as before. Be transported. Then, when the empty container for storing the processed substrate is removed from the post-processing side import or stock unit by the transfer mechanism and transferred to the storage unit, then the substrate that has been subjected to the predetermined processing is removed from the storage unit. In the container. Thus, the container storing the processed substrate is taken out by the transfer mechanism and transferred from the storage section to the stock section. In this case, if there is no container in the post-processing outport, the container may be transferred from the take-out storage unit to the post-processing outport. As a result, since there is no container in the take-out storage unit, the next empty container for storing the processed substrate can be transferred to the take-out storage unit continuously.

Then, when the next empty container for storing the processed substrate is transferred to the take-out and storage section, the substrate, which has been subjected to the predetermined processing, is stored in the container in the take-out storage section, as before. Is done. In this manner, the container storing the processed substrate is taken out from the storage unit and transferred to the stock unit or the post-processing side outport by the transfer mechanism as described above. Then, the container storing the processed substrate is carried out from the post-process side out port. The unloading is performed by, for example, an operator or a suitable container transport device. As a result, there is no container in the post-processed outport, and the next container containing the processed substrate is taken out by the transfer mechanism and is continuously transferred from the storage unit or the stock unit to the post-processed outport. Becomes possible. And
When the next empty container storing the processed substrate is transferred to the post-processing-side outport by the transfer mechanism, the container is unloaded as before.

In the loading / unloading device according to the third aspect,
Thus, transfer of containers from the pre-processing import to the removal storage unit, transfer of containers from the removal storage unit to the post-processing outport, transfer of containers from the post-processing import to the removal storage unit, and / or removal and storage. The transfer of the container from the section to the post-processing out port is performed through the stock section for storing the container, so that the container containing the substrate before processing is loaded, the substrate before processing is removed from the container,
Unloading an empty container from which a substrate before processing is taken out, loading an empty container to store the processed substrate, storing the substrate in the container after processing, and unloading the container storing the processed substrate. Can be done Therefore, the substrates before processing can be successively carried into an appropriate processing unit and the like, and the substrates after processing can be unloaded one after another from the appropriate processing unit and the like. Can be.

Further, when a worker or a container transporting apparatus carries in the next container to the pre-processing side import, the empty container which has been waiting in the pre-processing side out port or the stock unit is also unloaded. In addition, it is possible to collectively carry in a container containing a substrate before processing and carry out an empty container from which a substrate before processing is taken out. Similarly, when carrying an empty container into the post-processing side import, if the post-processing side outport or the container that has been waiting in the stock unit is also carried out, the processed substrate is stored. For emptying the container and unloading of the container storing the processed substrate can be performed collectively. Therefore, the loading and unloading of the container can be performed efficiently.

In the container loading / unloading device according to the first, second, and third aspects, the stock unit may be capable of storing a plurality of containers. According to this configuration, since a plurality of containers can be stored in the stock unit, a certain number of containers can be carried in and out of the carrying-in / out device at a time. Therefore, the loading and unloading of the container can be performed more efficiently.

According to a fifth aspect of the present invention, a container accommodating a substrate is transferred from a carry-in import to a take-out unit, the substrate is taken out of the container at the take-out unit, and an empty container from which the substrate is taken out is taken out. A method of transferring a container from the import to a take-out unit and / or transferring a container from the take-out unit to an out port via a stock unit for storing the container. Provide a method for loading and unloading containers.

According to a sixth aspect of the present invention, an empty container for storing a substrate is transferred from a carry-in import to a storage unit,
A method of storing a substrate in a container in a storage unit and transferring the container storing the substrate to an outport for unloading, wherein the container is transferred from the import to the storage unit and / or
Alternatively, there is provided a method for carrying in / out a container, wherein the transfer of the container from the storage section to the outport is performed through a stock section for storing the container.

According to a seventh aspect of the present invention, a container accommodating a substrate before processing is taken out of the pre-processing side import for carrying in, taken out and transferred to the accommodating section. The empty container from which the substrate has been removed is transferred to the pre-processing outport for unloading, while the empty container for storing the processed substrate is transferred from the post-processing import for unloading to the unloading storage unit. And storing the processed substrate in a container in the unloading and storing unit, and transferring the container storing the processed substrate to a post-processing out port for unloading. Transfer of the container from the take-out and storage section to the post-processing side outport,
The transfer of the container from the post-import side to the take-out storage unit and / or the transfer of the container from the take-out storage unit to the post-processing out port is performed via a stock unit for storing the container. ， Provides a method for loading and unloading containers.

[0027]

DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, embodiments of the present invention will be described based on a cleaning system for cleaning a wafer W as an example of a substrate. FIG. 1 is a plan view of the cleaning system 1, and FIG. 2 is a side view thereof. The cleaning system 1 is configured to carry in the wafer W in units of the carrier C, perform cleaning and drying of a plurality of wafers W in a batch manner, and carry out the wafer W in units of the carrier C. I have. The carrier C is configured to hold a plurality of wafers W arranged in parallel at equal intervals.

The cleaning system 1 includes a loading / unloading device 2 for loading / unloading the carrier C, a cleaning / drying processing unit 3 for performing a predetermined cleaning and drying process on the wafer W, and a loading / unloading device 2 for cleaning / drying. A transfer arm 4 for transferring the wafer W to and from the drying processing unit 3 is provided.

As shown in FIG. 3, in the loading / unloading device 2, a mounting table 5 is arranged along one side of the cleaning system 1. On the opposite side of the mounting table 5, a mounting table 7 is sandwiched with a passage 6 therebetween. It is arranged adjacent to the cleaning / drying processing unit 3. Further, mounting plates 8 and 9 are arranged above the mounting table 5. Further, a transfer arm 10 is provided that is movable in the X, Z, and θ directions along a path 6 formed between the mounting table 5 and the mounting table 7. This transfer arm 1
0 denotes a carrier C between the mounting tables 5 and 7 and the mounting plates 8 and 9.
Is configured to be able to move freely.

The mounting table 5 has a pre-cleaning out port 12 for unloading an empty carrier C from which the uncleaned wafer W has been taken out, a pre-cleaning import 13 for carrying in the carrier C containing the uncleaned wafer W, A stock unit 14 capable of storing both the carrier C containing the unwashed wafer W and the empty carrier C from which the unwashed wafer W has been taken out is provided adjacently. Empty carrier C for storing later wafer W
, A post-cleaning side import port 15 for carrying a wafer W, a post-cleaning side out port 16 for carrying out a carrier C containing a cleaned wafer W, an empty carrier C for storing a cleaned wafer W, and a cleaned wafer. Carrier C containing W
Are provided adjacent to a stock unit 17 that can store any of them.

The mounting table 7 takes out the wafer W before cleaning from the carrier C and places the wafer W after cleaning on the carrier C.
And a loader / unloader section 20 for storing the data in the storage area. That is, a station 21 formed by an opening is provided on the upper surface of the mounting table 7, while hands 22 and 23 which can move up and down are provided inside the loader / unloader unit 20. The station 21 has a portion opened to the hand 22 as a station 21a, and a portion opened to the hand 23 as a station 21b.
, The hand 23 passes through the station 21b,
Each can protrude above the mounting table 7.

Here, as shown in FIG. 4, when carriers C containing, for example, unwashed wafers W are placed on the stations 21a and 21b, the hands 22 and 23 move upward from below. In this case, an opening is formed at the bottom of the carrier C so that it can enter the carrier C. An opening is also formed in the upper part of the carrier C. In each of the stations 21a and 21b, the hands 22, 23 that have entered the carrier C move upward as they are, and the wafer reaches the position shown by the solid line in FIG. W can be pushed up and taken out of the carrier C. After that, the hands 22 and 23 relatively approach each other to perform so-called width shifting, and the wafers W for two carriers C are arranged at equal intervals. Then, the transfer arm 4 receives the wafers W from the hands 22 and 23. , And is conveyed to the cleaning / drying processing section 3.

On the other hand, when the transfer arm 4 transfers the washed wafer W to a position above the station 21 of the mounting table 7, the hands 22, 23 waiting inside the loader / unloader unit 20 move upward. To start. in this case,
Empty carriers C for accommodating the washed wafer W are previously mounted on the stations 21a and 21b, respectively.
The wafer W passes through each carrier C placed on the carrier 21b, and receives the cleaned wafer W from the transfer arm 4 above the carrier C. Thereafter, while the hands 22, 23 start to move downward and return to the original standby state, the respective carriers C placed in the stations 21a, 21b are moved.
The wafer W after cleaning is accommodated therein.

A gap 30 is formed between the mounting plate 8 and the mounting plate 9.
Rises, and the mounting plate 8 and the mounting plate 9 can be accessed. On the mounting plate 8, like the stock unit 10,
Stock units 31 and 32 are provided which can store both the carrier C containing the wafer W before cleaning and the empty carrier C from which the wafer W before cleaning is taken out. Stock portions 33 and 34 are provided which can store both an empty carrier C for storing the wafer W after cleaning and a carrier C for storing the wafer W after cleaning.

The transfer arm 10 has an arm portion 40 configured to hold the upper part of the carrier C. The arm portion 40 is horizontally supported by a support portion 42 connected to a rotary elevating shaft 41. . Further, the rotary elevating shaft 41 is mounted on the drive mechanism 43. Therefore, the driving mechanism 43
The arm 40 is configured to be rotatable in the θ direction in FIG. 3 and to be able to move up and down in the Z direction (vertical direction) in FIGS.
The arm 40 shown by a solid line in FIG. 3 shows a state facing the mounting table 6, and the arm 40 shown by a two-dot chain line 40 'in FIG. , A state facing the mounting table 7 side. Further, the arm portion 40 indicated by a two-dot chain line 40 ″ in FIG.
The state where it rose to the upper part of the mounting plates 8 and 9 is shown.

As shown in FIG. 1 and FIG.
The transfer arm 10 itself is attached to the base 44 provided on the mounting table 5, and as described above, the transfer arm 10 is moved in the X direction in FIG. (A direction parallel to the arrangement direction of the front import 13, the stock portion 14, the washed side import 15, the washed out port 16, the stock portion 17, and a direction parallel to the arrangement direction of the stock portions 31, 32, 33, and 34.) It is configured to be able to move to. Therefore, the arm part 40
Are located in the loading / unloading device 2, namely, the outport 12 before cleaning, the import 13 before cleaning, the import 15 after cleaning, the outport 16 after cleaning, the stock unit 14,
17, 31, 32, 33, 34 and the loader / unloader section 20 can be freely moved.

FIG. 5 is a plan view of the arm section 40. FIG. As shown in FIG. 5, chuck members 45 are provided at four corners of the arm portion 40, and these chuck members 45 are configured to be extendable and contractible by a cylinder mechanism (not shown) built in the arm portion 40. Each is connected to a piston rod 46. Further, on the upper surface of the arm portion 40,
A rotation shaft 47 of a motor (not shown) built in the support portion 42 is connected, and the arm portion 40 can be rotated about the rotation shaft 47.

When the transfer arm 10 grips the carrier C, first, the transfer arm 10 extends the piston rod 46 to open the chuck member 45 as shown by the solid line 45 in FIG. Then, the arm portion 40 is positioned above the carrier C by moving the support portion 42 downward. Thereafter, when the piston rod 46 is contracted, the chuck member 45 moves to a position indicated by a two-dot chain line 45 'in FIG. Can be gripped. The carrier C can be lifted by moving the support portion 42 upward.
Further, in this state, by rotating the rotating shaft 47 by 90 °, the carrier C together with the arm portion 40 can be rotated by 90 ° to change the direction of the wafer W stored in the carrier C.

On the other hand, when the transfer arm 10 releases the carrier C from the arm section 40, the transfer arm 10 holding the carrier C lowers the support section 42 and places the carrier C at an arbitrary place. . Thereafter, if the piston rod 46 is extended, the grip of the chuck member 45 can be released. Thereafter, the transfer arm 10 moves the support section 42 upward to leave the carrier C at an arbitrary position. In this way, the transfer arm 10 moves to an arbitrary position of the carry-in / out device 2, lifts the carrier C placed at that position, and can transfer this carrier C to another place for mounting. ing.

Next, as shown in FIG. 1, the cleaning / drying processing section 3 includes a drying device 5 for finally drying the wafer W using, for example, isopropyl alcohol (IPA) vapor.
Single tank type (single tank type, one bath type, etc.), which has the function of alternately supplying and discharging chemical solution and pure water, and capable of performing both chemical solution treatment and rinsing treatment. ), A wafer chuck cleaning / drying device 52 for cleaning and drying the wafer chucks 4a and 4b of the transfer arm 4, and a chemical solution different from the cleaning device 51 for chemical solution processing and rinsing processing. A one-bath type cleaning device 53 configured to perform both is sequentially arranged. Thus, in the cleaning / drying processing section 3, the cleaning device 5
3, 51, the wafer W is transported in the order of the drying device 50,
A predetermined cleaning and drying process is performed.

Since the cleaning devices 51 and 53 have the same configuration, the cleaning device 51 will be described as an example. As shown in FIG. 6, the wafer W is contained in the casing 51a.
In a cleaning apparatus 51 provided with a cleaning tank 60 for performing a cleaning process, a holding section 61 for holding the wafer W in an upright state is provided in the cleaning tank 60, and the holding section 61 is configured to be able to move up and down. As shown in FIG. 7, covers 62 and 63 are attached to the upper surface of the cleaning device 51. During the cleaning process, the covers 62 and 63 are closed so that the chemical liquid atmosphere is not diffused to the surroundings. It has a configuration.

As shown in FIG. 8, on the surface of the holding portion 61, for example, 50 holding grooves 61a into which the peripheral edge of the wafer W is inserted are formed, and the interval (groove pitch) between these holding grooves 61a is any one. Are also arranged at a predetermined distance so as to be equal. An elevating shaft 65 is attached to the back surface of a support 64 that supports the holding portion 61 in a horizontal posture. The elevating shaft 65 is connected to an elevating mechanism 66 provided below the cleaning tank 60. ing. Therefore, the cover 62,
When the opening 63 is opened, the elevating mechanism 66 is operated, and the
The holding unit 61 can be moved up and down between the inside of 0 and the upper part of the cleaning device 51.

Next, the loading / unloading method of the carrier C performed by the loading / unloading device 2 according to the present embodiment configured as described above will be described based on the cleaning of the wafer W performed by the cleaning system 1 of FIG. explain.

First, a worker in the factory or an AGV (Auto
For example, 25 wafers W before cleaning are stored by a Guided Vehicle (unmanned carrier) 4 or the like.
The carrier C group is carried into the cleaning system 1 and, for example, 50 wafers W for two carriers C are taken out of the carrier C, and the transfer arm 4 collectively holds the wafers W in units of 50 wafers. Then, the wafer W is transported to the cleaning / drying processing unit 3 to perform cleaning for removing impurities such as particles attached to the surface of the wafer W.

In the loading / unloading device 2, for example, four carriers C1, C2, C
3 and C4 are carried into the carry-in / out device 2 via the pre-cleaning side import 13, and the wafer W before cleaning is taken out from the carriers C1 to C4. Then, for example, four empty carriers C ′ 1, C ′ 2, for storing the cleaned wafer W,
The cleaned wafers W are stored in C'3 and C'4, and the carriers C'1 to C'4 storing the cleaned wafers W are unloaded from the loading / unloading device 2 through the out-port 16 after cleaning. Is done. The above steps are shown in Tables 1, 2 and 3.

[0046]

[Table 1]

[0047]

[Table 2]

[0048]

[Table 3]

The above steps will be described in detail with reference to Tables 1, 2 and 3. Four carriers C1 to C4 accommodating wafers W before cleaning are carried in, and carriers C1 to C4 are loaded.
The process of taking out the wafer W before cleaning from C4 to C4 is performed by Steps 1 to 10 in Table 1 below. Step 1: The first carrier C1 is carried into the pre-cleaning import 13. This loading is performed by a worker or an AGV in the factory. Step 2: The carrier C1 is transferred from the pre-cleaning import 13 to the station 21a by the transfer arm 10. As a result, the carrier C1 does not exist in the pre-cleaning import 13, and the second carrier C2 is subsequently carried into the pre-cleaning import 13. Step 3: The carrier C2 is moved from the pre-cleaning import 13 to the station 21b by the transfer arm 10.
Is transferred to After that, the loader / unloader unit 20
The wafers W before cleaning are taken out of the carriers C1 and C2 by the hands 22 and 23. Thus, carrier C
The wafers W taken out of the wafers 1 and 2 are received by the transfer arm 4 and carried into the cleaning / drying processing unit 3. Wafer W
Are transported in the order of the cleaning devices 53, 51 and the drying device 50, and are subjected to predetermined cleaning and drying processes. Further, since the carrier C2 is not present in the pre-cleaning import 13, the third carrier C3 is in the pre-cleaning import 13.
It is carried in. The step of taking out the wafer W from the carriers C1 and C2 may be performed in step 5. Step 4: Since the carriers C1 and C2 are placed on the loader / unloader unit 20, the carrier C3 is transferred from the pre-cleaning import 13 to the stock unit 14 by the transfer arm 10. As a result, there is no carrier C3 in the pre-cleaning side import 13, so that the fourth carrier C4 is continuously carried into the pre-cleaning side import 13. Step 5: In the loader / unloader section 20, the empty carriers C1,
C2 is placed. The carrier C3 is placed on the stock unit 14, and the carrier C4 is placed on the pre-cleaning import 13. Step 6: The empty carrier C1 is moved from the station 21a to the stock unit 32 by the transfer arm 10.
Is transferred to Step 7: The empty carrier C2 is moved from the station 21b to the stock unit 31 by the transfer arm 10.
Is transferred to Thereby, the loader / unloader unit 20
No empty carriers C1 and C2 exist. Step 8: The carrier C3 is transferred from the stock unit 14 to the station 21a by the transfer arm 10. Step 9: The carrier C4 is transferred by the transfer arm 10 from the pre-cleaning import 13 to the station 21b. Thereafter, in the loader / unloader section 20, the wafers W before cleaning are transferred to the carrier C by the hands 22 and 23.
3, C4. Thus, carrier C3
The wafer W taken out of C4 is received by the transfer arm 4 and carried into the cleaning / drying processing unit 3. These uncleaned wafers W are sequentially transferred to the cleaning devices 53, 51, and the drying device 50 while taking time so as not to overlap with the progress of the cleaning and drying processes of the wafers W taken out of the carriers C1 and C2. A predetermined washing and drying process is performed. Step 10: The loader / unloader unit 20 removes the empty carrier C3 from the wafer W before cleaning.
C4 is placed. An empty carrier C1 is placed on the stock unit 32, and an empty carrier C2 is placed on the stock unit 31.

Next, the carriers C3 and C4, which have been taken out of the wafer W before cleaning and are emptied, are transferred from the loader / unloader section 20 to another location, while the carriers C3 and C4 for storing the wafer W after cleaning are stored. Empty carriers C'1, C '
2, C'3 and C'4 are carried in. These steps are performed by steps 11 to 17 in Table 1 below. Step 11: The empty carrier C1 is
From the stock section 32 to the out-port 12 before cleaning.
Is transferred to Step 12: Empty carrier C2 is transferred to transfer arm 10
Is transferred from the stock unit 31 to the stock unit 14. Step 13: The empty carrier C3 is moved from the station 21a to the stock unit 32 by the transfer arm 10.
Is transferred to Step 14: The empty carrier C4 is moved from the station 21b to the stock unit 31 by the transfer arm 10.
Is transferred to On the other hand, the first empty carrier C′1 is carried into the cleaning-side import 15. This loading is performed by a worker or an AGV in the factory. Step 15: The empty carrier C′1 carried into the post-wash import 15 is transferred from the post-clean import 15 to the stock unit 34 by the transfer arm 10. As a result, the carrier C'1 is added to the post-wash side import 15.
Therefore, the second empty carrier C ′ 2 is carried in after the cleaning side import 15. Step 16: Empty carrier C'2 is transferred to transfer arm 1
The stock part 33 from the side import 15 after washing by 0
Is transferred to As a result, there is no carrier C'2 in the post-cleaning import 15, so that the third empty carrier C'3 is carried in after the cleaning-side import 15. Step 17: Empty carrier C'3 is transferred to transfer arm 1
Stock part 17 from back side import 15 after washing by 0
Is transferred to As a result, the carrier C'3 does not exist in the post-cleaning side import 15, so that the fourth empty carrier C'4 is carried in after the cleaning-side side import 15.

Next, in the cleaning / drying section 3, predetermined cleaning and drying processes are performed on the wafers W taken out of the carriers C1 to C4, during which the wafers W before cleaning are stored. The next four carriers C5 and C
6, C7 and C8 are carried in. Note that carriers C5 and C
When carrying in C6, C7 and C8, empty carriers C1 to C4 are carried out instead. These steps are performed by steps 18 to 22 in Table 1 and steps 23 to 29 in Table 2 below. Step 18: The fifth carrier C5 is carried into the pre-cleaning side import 13. On the other hand, the empty carrier C1 is carried out from the pre-cleaning-side out port 12. The loading and unloading is performed by workers and AGVs in the factory. As a result, there is no empty carrier C1 in the pre-wash out port 12. Step 19: The empty carrier C2 is
From the stock section 14 to the out-port 12 before cleaning.
Is transferred to Step 20: The carrier C5 is transferred from the pre-cleaning import 13 to the stock unit 14 by the transfer arm 10. As a result, there is no carrier C5 in the pre-cleaning side import 13. Step 21: The sixth carrier C6 is carried into the pre-cleaning import 13. On the other hand, the empty carrier C2 is carried out from the pre-wash out port 12. This gives
There is no empty carrier C2 in the out-port 12 before cleaning. Step 22: Empty carrier C3 is transferred to transfer arm 10
From the stock section 32 to the out-port 12 before cleaning.
Is transferred to Step 23: The carrier C5 is transferred from the stock unit 14 to the stock unit 32 by the transfer arm 10. Step 24: The carrier C6 is transferred from the pre-cleaning import 13 to the stock unit 14 by the transfer arm 10. As a result, there is no carrier C6 in the pre-cleaning side import 13. Step 25: The seventh carrier C7 is carried into the pre-cleaning import 13. On the other hand, the empty carrier C3 is carried out from the out-port 12 before cleaning. This gives
There is no empty carrier C3 in the pre-wash out port 12. Step 26: Empty carrier C4 is transferred to transfer arm 10
From the stock unit 31 to the out-port 12 before cleaning.
Is transferred to Step 27: The carrier C6 is transferred from the stock unit 14 to the stock unit 31 by the transfer arm 10. Step 28: The carrier C7 is transferred from the pre-cleaning import 13 to the stock unit 14 by the transfer arm 10. As a result, there is no carrier C7 in the pre-cleaning import 13. Step 29: The eighth carrier C8 is carried into the pre-cleaning import 13. On the other hand, the empty carrier C4 is carried out from the out-port 12 before cleaning.

Thus, according to the loading / unloading apparatus 2 of the present invention, the carriers C1 to C8 are transferred from the pre-cleaning import 13 to the loader / unloader unit 20 and the carriers are transferred from the loader / unloader unit 20 to the pre-cleaning outport 12. Stock unit 1 for storing carrier C by transferring C1 to C8
4, 31, and 32, the loading of the carriers C1 to C8 accommodating the wafers W, the removal of the wafers W from the carriers C1 to C8, and the unloading of the empty carriers C1 to C8 from which the wafers W have been taken out are continuously performed. Can be done
Therefore, the wafers W can be successively carried into the cleaning / drying processing section 3, and the cleaning and drying processing of the wafers W can be continuously performed. As a result, each device of the cleaning / drying processing unit 3 can be operated efficiently. Further, when carrying the carriers C5 to C8 accommodating the wafers W before the cleaning, the outports 12 before the cleaning and the stock units 14 and 3 are loaded.
Since the empty carriers C1 to C4 that have been waiting at the first and the second 32 are also unloaded, the unloading of the empty carriers C1 to C4 and the unloading of the carriers C5 to C8 storing the wafers W can be performed at a time. Therefore, the carriers C1 to C8 can be efficiently loaded and unloaded.

When predetermined cleaning and drying processes are completed on the wafers W taken out of the carriers C1 to C4, the cleaned wafers W are replaced with the empty carriers C'1 to C4.
C′4 are sequentially stored. On the other hand, carrier C
The wafer W before cleaning is taken out from 5-C8. These steps are performed by steps 30 to 44 in Table 2 and steps 45 to 53 in Table 3 below. Step 30: Empty carrier C'1 is transferred to transfer arm 1
0 transfers from the stock unit 34 to the station 21a. Step 31: Empty carrier C'2 is transferred to transfer arm 1
0 transfers from the stock unit 33 to the station 21b. Thereafter, the wafer W, which has been subjected to the predetermined cleaning and drying processes, is transferred to the loader / unloader unit 20 by the transfer arm 4 and stored in the carriers C ′ 1 and C ′ 2 by the hands 22 and 23. Step 32: Carriers C′1 and C′2 that store the cleaned wafer W are placed on the loader / unloader unit 20. Also, the empty carrier C'3 is in the stock unit 17 and the empty carrier C'4 is in the cleaning side
The carrier C5 is in the stock section 32, the carrier C6 is in the stock section 31, the carrier C7 is in the stock section 14,
The carriers C8 are placed on the pre-cleaning import 13 respectively. Step 33: The carrier C'1 is moved from the station 21a by the transfer arm 10 to the out port 1 after cleaning.
Transferred to 6. Step 34: Empty carrier C'3 is transferred to transfer arm 1
By 0, it is transferred from the stock unit 17 to the stock unit 34. Step 35: Empty carrier C'4 is transferred to transfer arm 1
The stock part 33 from the side import 15 after washing by 0
Is transferred to Step 36: The carrier C'2 is transferred from the station 21b to the stock unit 17 by the transfer arm 10. As a result, there is no carrier C'1 and C'2 in the loader / unloader unit 20. Step 37: The carrier C5 is transferred from the stock section 32 to the station 21a by the transfer arm 10. Step 38: The carrier C6 is transferred from the stock unit 31 to the station 21b by the transfer arm 10. Then, the hand 2 is loaded by the loader / unloader unit 20.
2 and 23, the wafer W before cleaning is transferred to carriers C5 and C
Take out from 6. Thus, the wafer W taken out of the carriers C5 and C6 is received by the transfer arm 4 and carried into the cleaning / drying processing unit 3. The wafers W before cleaning are the wafers W taken out of the carriers C3 and C4.
The cleaning and drying processes are sequentially carried to the cleaning devices 53 and 51 and the drying device 50 while taking time so as not to overlap with the progress of the cleaning and drying processes. Step 39: The loader / unloader unit 20 removes the empty carrier C5 from the wafer W before cleaning.
C6 is placed. The carrier C7 is in the stock unit 14, the carrier C8 is in the pre-cleaning import 13,
The carrier C'1 is in the out port 16 after cleaning, the carrier C'2 is in the stock section 17, the empty carrier C'3 is in the stock section 34, and the empty carrier C'4 is in the stock section 33.
Respectively. Step 40: The empty carrier C5 is transferred by the transfer arm 10 from the station 21a to the out-port 12 before cleaning. Step 41: The carrier C7 is transferred from the stock unit 14 to the stock unit 32 by the transfer arm 10. Step 42: The empty carrier C6 is moved from the station 21b to the stock unit 14 by the transfer arm 10.
Is transferred to Thereby, the loader / unloader unit 20
No empty carriers C5 and C6. Step 43: The carrier C8 is transferred from the pre-cleaning import 13 to the stock unit 31 by the transfer arm 10. Step 44: Empty carrier C'3 is transferred to transfer arm 1
0 transfers from the stock unit 34 to the station 21a. Step 45: The empty carrier C'4 is moved to the transfer arm 1
0 transfers from the stock unit 33 to the station 21b. Thereafter, the wafer W, which has been subjected to the predetermined cleaning and drying processing, is transferred to the loader / unloader unit 20 by the transfer arm 4 and stored in the carriers C′3, C′4 by the hands 22,23. Step 46: Carriers C′3 and C′4 containing the wafer W after cleaning are placed on the loader / unloader unit 20. Also, the carrier C′1 is in the out port 16 after cleaning, the carrier C′2 is in the stock section 17, the empty carrier C5 is in the out port 12 before cleaning, the empty carrier C6 is in the stock section 14, and the carrier C7 is The carrier C <b> 8 is placed on the stock section 32, respectively. Step 47: The carrier C'3 is transferred from the station 21a to the stock section 34 by the transfer arm 10. Step 48: The carrier C'4 is transferred from the station 21b to the stock section 33 by the transfer arm 10. As a result, there is no carrier C'3, C'4 in the loader / unloader section 20. Step 49: The carrier C7 is transferred from the stock section 32 to the station 21a by the transfer arm 10. Step 50: The carrier C8 is transferred from the stock unit 31 to the station 21b by the transfer arm 10. Then, the hand 2 is loaded by the loader / unloader unit 20.
2 and 23, the wafer W before cleaning is transferred to carriers C7 and C
8 Thus, the wafer W taken out of the carriers C7 and C8 is received by the transfer arm 4 and carried into the cleaning / drying processing unit 3. The wafers W before cleaning are the wafers W taken out of the carriers C5 and C6.
The cleaning and drying processes are sequentially carried to the cleaning devices 53 and 51 and the drying device 50 while taking time so as not to overlap with the progress of the cleaning and drying processes. Step 51: The loader / unloader unit 20 has the empty carrier C7 from which the unwashed wafer W has been taken out.
C8 is mounted. Further, the empty carrier C5 is in the out port 12 before cleaning, the empty carrier C6 is in the stock section 14, and the carrier C'1 is in the out port 16 after cleaning.
, The carrier C'2 is in the stock unit 17, and the carrier C '
3 is the stock unit 34, and carrier C'4 is the stock unit 3.
3 respectively. Step 52: The empty carrier C7 is moved from the station 21a to the stock unit 32 by the transfer arm 10.
Is transferred to Step 53: The empty carrier C8 is moved from the station 21b to the stock unit 31 by the transfer arm 10.
Is transferred to

Next, the carriers C'1 to C'4 accommodating the cleaned wafer W are carried out, while the next four empty carriers C'5 for accommodating the cleaned wafer W are carried out.
C'6, C'7, and C'8 are carried in. These steps are
This is performed by steps 54 to 65 in Table 3 below. Step 54: The empty carrier C'5 is carried into the after-cleaning side import 15. On the other hand, the carrier C′1 is carried out from the out port 16 after cleaning. The loading and unloading is performed by workers and AGVs in the factory. As a result, there is no empty carrier C′1 in the out-port 16 after cleaning. Step 55: The carrier C'2 is transferred by the transfer arm 10 from the stock section 17 to the out-port 16 after cleaning. Step 56: The fifth empty carrier C′5 is transferred from the post-wash side import 15 to the stock unit 17 by the transfer arm 10. As a result, there is no carrier C'5 in the post-wash import 15. Step 57: The sixth empty carrier C'6 is carried into the post-cleaning side import 15. On the other hand, carrier C'2
Is carried out from the out port 16 after cleaning. As a result, the empty carrier C'2 is provided in the out-port 16 after cleaning.
There is no state. Step 58: The carrier C'3 is transferred by the transfer arm 10 from the stock section 34 to the out-port 16 after cleaning. Step 59: Empty carrier C'5 is transferred to transfer arm 1
By 0, it is transferred from the stock unit 17 to the stock unit 34. Step 60: Empty carrier C'6 is transferred to transfer arm 1
Stock part 17 from back side import 15 after washing by 0
Is transferred to As a result, there is no carrier C ′ 6 in the post-wash side import 15. Step 61: The seventh empty carrier C'7 is carried into the after-cleaning side import 15. On the other hand, carrier C'3
Is carried out from the out port 16 after cleaning. As a result, an empty carrier C'3 is provided in the out-port 16 after cleaning.
There is no state. Step 62: The carrier C'4 is transferred by the transfer arm 10 from the stock section 33 to the out-port 16 after cleaning. Step 63: Empty carrier C'6 is transferred to transfer arm 1
By 0, it is transferred from the stock unit 17 to the stock unit 33. Step 64: Empty carrier C'7 is transferred to transfer arm 1
Stock part 17 from back side import 15 after washing by 0
Is transferred to As a result, there is no carrier C'7 in the post-cleaning side import 15. Step 65: The eighth empty carrier C'8 is carried into the post-cleaning side import 15. On the other hand, carrier C'4
Is carried out from the out port 16 after cleaning.

Thus, empty carriers C'5 to C 'are prepared in advance.
When the predetermined cleaning and drying processes are completed for the wafers W taken out of the carriers C5 to C8 by carrying in the wafers 8, the cleaned wafers W are transferred to the empty carriers C'5 to C'8. Each is stored. This gives
These cleaned wafers W can be carried out of the cleaning / drying processing unit 3.

Thus, according to the loading / unloading device 2 of the present invention, the carriers C'1 to C'8 are transferred from the post-cleaning side import 15 to the loader / unloader unit 20, and the carrier after the cleaning is removed from the loader / unloader unit 20. Since the transfer of the carriers C′1 to C′8 to the out port 16 is performed via the stock units 17, 33, and 34 that store the carrier C, the empty C′1 for storing the cleaned wafer W is stored. To C'8, storage of the cleaned wafer W in the carriers C'1 to C'8, and carriers C'1 to C 'storing the cleaned wafer W.
8 can be continuously carried out. Accordingly, the wafers W can be carried out one after another from the cleaning / drying processing section 3, and the cleaning and drying processing of the wafers W can be continuously performed. As a result, each device of the cleaning / drying processing unit 3 can be operated efficiently. Further, when carrying empty carriers C'5 to C'8, the carriers C'1 to C'4 containing the washed wafers W which have been waiting in the outports 12 before cleaning and the stock units 33 and 34 are stored. Is carried out at the same time, it is possible to carry in the carriers C'1 to C'4 accommodating the washed wafers W and carry out the empty carriers C'5 to C'8 collectively, and to carry out the carrier C ' 1-C '
8 can be carried in and out efficiently.

Thereafter, four carriers C containing the wafers W before cleaning are carried in, four empty carriers C from which the wafers W are taken out are carried out, and four carriers C for containing the wafers W after cleaning are stored. Loading of the empty carrier C and unloading of the four carriers C containing the washed wafers W are repeated in the same manner,
The wafers W before cleaning are successively carried into the cleaning / drying processing unit 3, and the wafers W after cleaning are sequentially carried out from the cleaning / drying processing unit 3.

Next, the cleaning process performed by the cleaning devices 53 and 51 will be described by taking the cleaning device 51 as an example.

First, in the cleaning apparatus 51 of a single tank system (also called a single tank system, a one-bath system, etc.),
The wafer W is immersed in the chemical solution filled in the cleaning tank 60 to perform the chemical solution treatment. In this case, the wafer W is stored in the cleaning tank 60 by being held by the holding unit 61. After the chemical treatment is completed, the wafer W is rinsed by draining the chemical from the cleaning tank and then supplying pure water to the cleaning tank 60. And
When the wafer W after the rinsing process is carried out of the cleaning tank 60, the cleaning device 60 drains pure water and supplies a chemical solution again to the cleaning tank in preparation for the next wafer W cleaning processing. .

However, in the conventional cleaning apparatus, the holding section for holding the wafer is fixedly provided in the tank, so that when the temperature of the chemical solution is controlled in the tank, the holding section provided in the cleaning tank is used. This will have a negative effect on the department. That is, the holding portion expands due to the temperature of the chemical solution. for that reason,
The spacing between the holding grooves formed on the surface of the holding unit is broken, and when transferring the wafer from the transfer arm to the holding unit, smooth transfer cannot be performed. Further, such temperature control of the chemical solution causes deterioration of the holding portion to be accelerated.

The cleaning device 51 shown in this embodiment realizes a smooth wafer delivery and a prolonged product life of the holding section by preventing the holding section from being adversely affected by the temperature control of the chemical solution. Things.

The cleaning process performed by the cleaning device 51 will be described with reference to FIGS. First, the holding unit 61
After the wafer W stored in the cleaning tank 60 is subjected to the chemical treatment, the chemical is drained and filled with pure water, and the cleaning liquid in the cleaning tank 60 is replaced with the pure water from the chemical liquid. A rinsing process is performed as shown in FIG.

After the rinsing process is completed, the covers 62, 6
3 is opened and the upper surface of the cleaning tank 60 is opened. Next, FIG.
As shown in (1), the holding unit 61 moves up and unloads the wafer W from the cleaning tank 60. Next, as shown in FIG.
The wafer chuck 4a of the transfer arm 4 which has been waiting in advance,
4b closes the leg, grips the wafer W, and receives the wafer W from the holding unit 61. The covers 62 and 63 are closed and the cleaning tank 60 is closed.
Cover the top of the. Next, as shown in FIG. 12, the transfer arm 4 transfers the wafer W to the drying device 50. Holder 61
Moves slightly, and waits above the cleaning device 51.

Next, as shown in FIG. 13, the cleaning liquid in the cleaning tank 60 is changed from pure water to a chemical, and the temperature of the chemical is adjusted.
In this case, since the holding unit 61 is on standby outside the cleaning tank 60, it is not adversely affected by the temperature control of the chemical solution. This gives
The shape of the holding portion 61 is maintained, and the interval between the holding grooves 61a is maintained at a predetermined distance.

Next, as shown in FIG.
As a result, the wafer W to be cleaned next is cleaned by the cleaning device 51.
Transported to As shown in FIGS. 11 and 12, since the holding unit 61 previously moved slightly down and was on standby, if the holding unit 61 moves up from this state, the peripheral edge of the wafer W is inserted into the holding groove 61a. Will be. Next, as shown in FIG. 15, the holding portion 61 moves upward,
When the wafer chucks 4a and 4b are opened, the holding unit 61 receives the wafer W from the transfer arm 4. As described above, since the interval between the holding grooves 61a does not collapse, the wafer W can be smoothly transferred between the holding unit 61 and the transfer arm 4. In addition, cover 6
2 and 63 are opened, and the upper surface of the cleaning tank 60 is opened.

Next, as shown in FIG. 16, the holding unit 61 moves down to store the wafer W in the cleaning tank 60. Thereafter, the chemical solution treatment is started in the cleaning tank 60 by closing the covers 62 and 63 so that the chemical solution atmosphere is not diffused. Thereafter, even if the cleaning process of the wafer W is repeated by the cleaning device 51, the holding unit 61 is not adversely affected by the temperature control of the chemical solution when the cleaning solution in the cleaning tank 60 is replaced with the chemical solution from the pure water. Prevents early deterioration of the holding part 61
Product life can be extended.

Next, as a second embodiment, the carrier C containing the wafer W before cleaning is loaded, the empty carrier C from which the wafer W before cleaning is taken out, and the wafer W after cleaning is stored. The loading / unloading device 70 configured to carry in empty carriers to carry out the cleaning and carry out the carriers accommodating the washed wafers W in units of six will be described.

As shown in FIG. 17, the loading / unloading device 70
Four stock units 31, 32, 35, and 36 for storing a carrier C containing the wafer W before cleaning and an empty carrier C from which the wafer W before cleaning is taken out, and for storing the wafer W after cleaning. There are provided four stock units 33, 34, 37, and 38 for storing an empty carrier and a carrier containing the wafer W after cleaning.

On the upper surface of the mounting plate 8, stock portions 31, 3
2, 35 are provided adjacent to each other. On the upper surface of the mounting plate 9, stock portions 36, 33, 34 are provided adjacent to each other. The stock units 37 and 38 are provided adjacent to the upper surface of the mounting table 7. Stocks department 35, 36, 37,
Since the configuration is the same as that of the loading / unloading device 2 described above except that the 38 is provided, the components having the same functions and configurations in FIGS. A duplicate description is omitted.

Next, Table 4, Table 5, Table 6, Table 7, and Table 8 will be described with respect to the loading / unloading method of the carrier C performed by the loading / unloading device 70 according to the second embodiment configured as described above. It will be described based on.

[0071]

[Table 4]

[0072]

[Table 5]

[0073]

[Table 6]

[0074]

[Table 7]

[0075]

[Table 8]

The process of loading the four carriers C1 to C6 accommodating the wafers W before cleaning and taking out the wafers W before cleaning from the carriers C1 to C6 is performed by steps 1 to 20 in Table 1 below. Will be Step 1: The first carrier C1 is carried into the pre-cleaning import 13. This loading is performed by a worker or an AGV in the factory. Step 2: The carrier C1 is transferred by the transfer arm 10 from the pre-cleaning import 13 to the station 21a. As a result, there is no carrier C1 in the pre-cleaning side import 13, so that 2
The second carrier C2 is carried in after the pre-cleaning import 13. Step 3: The carrier C2 is transferred by the transfer arm 10 from the pre-cleaning import 13 to the station 21b. Thereafter, in the loader / unloader section 20, the wafers W before cleaning are transferred to the carrier C by the hands 22 and 23.
1, C2. Thus, the carrier C1,
The wafer W taken out of C2 is received by the transfer arm 4 and carried into the cleaning / drying processing unit 3. Wafer W is
It is sequentially transported to the cleaning devices 53 and 51 and the drying device 50,
A predetermined washing and drying process is performed. Also, since there is no carrier C2 in the import 13 before cleaning,
The third carrier C3 is carried into the pre-cleaning import 13. The step of taking out the wafer W from the carriers C1 and C2 may be performed in step S7. Step 4: Since the carriers C1 and C2 are placed on the loader / unloader unit 20, the carrier C3 is transferred from the pre-cleaning import 13 to the stock unit 36 by the transfer arm 10. As a result, there is no carrier C3 in the pre-cleaning side import 13, so that the fourth carrier C4 is continuously carried into the pre-cleaning side import 13. Step 5: The carrier C4 is transferred from the pre-cleaning import 13 to the stock unit 35 by the transfer arm 10. As a result, there is no carrier C4 in the pre-cleaning side import 13, so that the fifth carrier C5
Is carried into the pre-cleaning import 13. Step 6: The carrier C5 is transferred from the pre-cleaning import 13 to the stock unit 14 by the transfer arm 10. As a result, the carrier C5 is not present in the pre-cleaning side import 13, so that the sixth carrier C6 is not provided.
Is carried into the pre-cleaning import 13. Step 7: In the loader / unloader section 20, the empty carriers C1,
C2 is placed. The carrier C3 is placed on the stock unit 36, the carrier C4 is placed on the stock unit 35, the carrier C5 is placed on the stock unit 14, and the carrier C6 is placed on the pre-cleaning import 13. Step 8: The empty carrier C1 is moved from the station 21a to the stock unit 32 by the transfer arm 10.
Is transferred to Step 9: The empty carrier C2 is moved from the station 21b to the stock unit 31 by the transfer arm 10.
Is transferred to Thereby, the loader / unloader unit 20
No empty carriers C1 and C2 exist. Step 10: The carrier C3 is transferred from the stock unit 36 to the station 21a by the transfer arm 10. Step 11: The carrier C4 is transferred from the stock unit 35 to the station 21b by the transfer arm 10. Then, the hand 2 is loaded by the loader / unloader unit 20.
2 and 23, the wafer W before cleaning is transferred to carriers C3 and C
4 Thus, the wafer W taken out of the carriers C3 and C4 is received by the transfer arm 4 and carried into the cleaning / drying processing unit 3. The wafers W before cleaning are the wafers W taken out of the carriers C1 and C2.
The cleaning and drying processes are sequentially carried to the cleaning devices 53 and 51 and the drying device 50 while taking time so as not to overlap with the progress of the cleaning and drying processes. Step 12: Empty carrier C1 is transferred to transfer arm 10
From the stock section 32 to the out-port 12 before cleaning.
Is transferred to Step 13: The carrier C5 is transferred from the stock unit 14 to the stock unit 32 by the transfer arm 10. Step 14: The empty carrier C2 is
Is transferred from the stock unit 31 to the stock unit 14. On the other hand, in the loader / unloader section 20, the carriers C3 and C4, which have been taken out of the wafer W before cleaning and become empty, are placed. In addition, the empty carrier C1 is in the out port 12 before cleaning, the carrier C5 is in the stock unit 32,
The carriers C6 are placed on the pre-cleaning import 13 respectively. Step 15: The empty carrier C3 is moved from the station 21a to the stock unit 36 by the transfer arm 10.
Is transferred to Step 16: The empty carrier C4 is moved from the station 21b to the stock unit 35 by the transfer arm 10.
Is transferred to Thereby, the loader / unloader unit 20
No empty carriers C3 and C4 exist. Step 17: The carrier C5 is transferred from the stock section 32 to the station 21a by the transfer arm 10. Step 18: The carrier C6 is transferred from the pre-cleaning import 13 to the stock 25b by the transfer arm 10. Thereafter, in the loader / unloader section 20, the wafers W before cleaning are transferred to the carriers C5 and C5 by the hands 22 and 23.
Removed from C6. Thus, the carriers C5 and C6
The wafer W taken out of the wafer is received by the transfer arm 4 and carried into the cleaning / drying processing unit 3. The wafers W before cleaning are sequentially sent to the cleaning devices 53, 51, and the drying device 50 while taking time so as not to overlap with the progress of the cleaning and drying processes of the wafers W taken out of the carriers C1, C2, C3, and C4. The wafer is conveyed and subjected to a predetermined washing and drying process. Step 19: The unloaded carrier C5, from which the wafer W before cleaning is taken out and emptied, is placed in the loader / unloader section 20.
C6 is placed. In addition, the carrier C1 is in the out port 12 on the pre-cleaning side, and the carrier C2 is in the stock portion 14.
The carrier C3 is placed on the stock unit 36, and the carrier C4 is placed on the stock unit 35. Step 20: The empty carrier C5 is moved from the station 21a to the stock unit 32 by the transfer arm 10.
Is transferred to

Next, six empty carriers C'1, C'2, C'3, C 'for accommodating the wafer W after cleaning.
4, C'5 and C'6 are carried in. Thereafter, the empty carriers C1 to C6 from which the wafers W before cleaning have been taken out are carried out. On the other hand, the next six carriers C7, C8, C9, C10, C11, and C12 containing the wafers W before cleaning are carried in. These steps are performed by the following steps 21 to 22 in Table 1, steps 23 to 44 in Table 2, and steps 45 and 46 in Table 3. Step 21: The empty carrier C6 is moved from the station 21b to the stock unit 31 by the transfer arm 10.
Is transferred to On the other hand, the first empty carrier C′1 is carried into the cleaning-side import 15. This loading is performed by a worker or an AGV in the factory. Step 22: The empty carrier C′1 carried into the post-wash import 15 is transferred from the post-clean import 15 to the stock unit 34 by the transfer arm 10. As a result, the carrier C'1 is added to the post-wash side import 15.
Since there is no carrier, the second empty carrier C ′ 2 is carried in after the cleaning side import 15. Step 23: The empty carrier C'2 is transferred from the post-wash side import 15 to the stock unit 33 by the transfer arm 10. As a result, there is no carrier C'2 in the post-cleaning import 15, so that the third empty carrier C'3 is carried in after the cleaning-side import 15. Step 24: Empty carrier C'3 is transferred to transfer arm 1
Stock portion 38 from import 15 after cleaning by 0
Is transferred to As a result, the carrier C'3 does not exist in the post-cleaning side import 15, so that the fourth empty carrier C'4 is carried in after the cleaning-side side import 15. Step 25: Empty carrier C'4 is transferred to transfer arm 1
Stock part 37 from import side 15 after washing by 0
Is transferred to As a result, the carrier C'4 does not exist in the post-cleaning side import 15, so that the fifth empty carrier C'5 is carried in after the cleaning-side side import 15. Step 26: Empty carrier C'5 is transferred to transfer arm 1
Stock part 17 from back side import 15 after washing by 0
Is transferred to As a result, the carrier C'5 does not exist in the post-cleaning side import 15, so that the sixth empty carrier C'6 is carried in after the cleaning-side side import 15. Step 27: The seventh carrier C7 is carried into the pre-cleaning import 13. On the other hand, the empty carrier C1 is carried out from the pre-cleaning-side out port 12. The loading and unloading is performed by workers and AGVs in the factory. As a result, there is no empty carrier C1 in the pre-wash out port 12. Step 28: The empty carrier C2 is
From the stock section 14 to the out-port 12 before cleaning.
Is transferred to Step 29: The carrier C7 is transferred from the pre-cleaning import 13 to the stock unit 14 by the transfer arm 10. As a result, there is no carrier C7 in the pre-cleaning import 13. Step 30: The eighth carrier C8 is carried into the pre-cleaning side import 13. On the other hand, the empty carrier C2 is carried out from the pre-wash out port 12. This gives
There is no empty carrier C2 in the out-port 12 before cleaning. Step 31: Empty carrier C3 is transferred to transfer arm 10
From the stock part 36 to the out-port 12 before cleaning.
Is transferred to Step 32: The carrier C7 is transferred from the stock section 14 to the stock section 36 by the transfer arm 10. Step 33: The carrier C8 is transferred from the pre-cleaning import 13 to the stock unit 14 by the transfer arm 10. As a result, there is no carrier C8 in the pre-cleaning side import 13. Step 34: The ninth carrier C9 is carried into the pre-cleaning side import 13. On the other hand, the empty carrier C3 is carried out from the out-port 12 before cleaning. This gives
There is no empty carrier C3 in the pre-wash out port 12. Step 35: Empty carrier C4 is transferred to transfer arm 10
Out port 12 from the stock section 35
Is transferred to Step 36: The carrier C8 is transferred from the stock section 14 to the stock section 35 by the transfer arm 10. Step 37: The carrier C9 is transferred from the pre-cleaning import 13 to the stock unit 14 by the transfer arm 10. As a result, there is no carrier C9 in the pre-cleaning side import 13. Step 38: The tenth carrier C10 is carried into the pre-cleaning side import 13. On the other hand, empty carrier C4
Is carried out from the out-port 12 before cleaning. As a result, there is no empty carrier C4 in the out-port 12 before cleaning. Step 39: Empty carrier C5 is transferred to transfer arm 10
From the stock section 32 to the out-port 12 before cleaning.
Is transferred to Step 40: The carrier C9 is transferred from the stock section 14 to the stock section 32 by the transfer arm 10. Step 41: The carrier C10 is transferred from the pre-cleaning import 13 to the stock unit 14 by the transfer arm 10. As a result, the carrier 13 is not in the pre-cleaning import 13. Step 42: The eleventh carrier C11 is carried into the pre-cleaning side import 13. On the other hand, empty carrier C5
Is carried out from the out-port 12 before cleaning. As a result, there is no empty carrier C5 in the out-port 12 before cleaning. Step 43: The empty carrier C6 is moved to the transfer arm 10
From the stock unit 31 to the out-port 12 before cleaning.
Is transferred to Step 44: The carrier C10 is transferred from the stock unit 14 to the stock unit 31 by the transfer arm 10. Step 45: The carrier C11 is transferred from the pre-cleaning import 13 to the stock unit 14 by the transfer arm 10. As a result, there is no carrier C11 in the pre-cleaning side import 13. Step 46: The twelfth carrier C12 is carried into the pre-cleaning side import 13. On the other hand, empty carrier C6
Is carried out from the out-port 12 before cleaning.

Next, when predetermined cleaning and drying processes are completed on the wafers W taken out of the carriers C1 to C6, the wafers W after these cleanings are removed from the empty carrier C'1.
To C'6. On the other hand, the wafer W before cleaning is taken out from the loaded carriers C7 to C12. These steps correspond to steps 47 to 66 in Table 2 below and Table 3
Steps 67 to 81 are performed. Step 47: Empty carrier C'1 is transferred to transfer arm 1
0 transfers from the stock unit 34 to the station 21a. Step 48: Empty carrier C'2 is transferred to transfer arm 1
0 transfers from the stock unit 33 to the station 21b. Thereafter, the wafer W, which has been subjected to the predetermined cleaning and drying processes, is transferred to the loader / unloader unit 20 by the transfer arm 4, and the hands W, 23 store the wafer W in the carriers C'1, C'2. Step 49: Empty carrier C'5 is transferred to transfer arm 1
By 0, it is transferred from the stock unit 17 to the stock unit 34. Step 50: The empty carrier C'6 is moved to the transfer arm 1
The stock part 33 from the side import 15 after washing by 0
Is transferred to On the other hand, the loader / unloader unit 20 includes:
Carriers C′1 and C′2 in which wafers W after cleaning are stored
Is placed. The empty carrier C'3 is in the stock unit 38, the empty carrier C'4 is in the stock unit 37,
The empty carrier C'5 is stored in the stock unit 34, and the carrier C7 is
Is the stock unit 36, and the carrier C8 is the stock unit 35.
The carrier C9 is in the stock section 32, and the carrier C10
Is the stock unit 31, and the carrier C11 is the stock unit 14.
The carrier C12 is placed on the pre-cleaning import 13 respectively. Step 51: The carrier C′1 is moved from the station 21a by the transfer arm 10 to the out-port 1 after cleaning.
Transferred to 6. Step 52: The carrier C'2 is transferred from the station 21b to the stock unit 17 by the transfer arm 10. As a result, the loader / unloader section 20 has no carriers C1 'and C2'. Step 53: The carrier C7 is transferred from the stock unit 36 to the station 21a by the transfer arm 10. Step 54: The carrier C8 is transferred from the stock unit 35 to the station 21b by the transfer arm 10. Then, the hand 2 is loaded by the loader / unloader unit 20.
2 and 23, the wafer W before cleaning is transferred to carriers C7 and C
8 Thus, the wafer W taken out of the carriers C7 and C8 is received by the transfer arm 4 and carried into the cleaning / drying processing unit 3. The wafers W before cleaning are sequentially sent to the cleaning devices 53, 51, and the drying device 50 while taking time so as not to overlap with the progress of the cleaning and drying processes of the wafers W taken out of the carriers C3, C4, C5, and C6. The wafer is conveyed and subjected to a predetermined washing and drying process. Step 55: The carrier C9 is transferred from the stock section 32 to the stock section 36 by the transfer arm 10. Step 56: The carrier C10 is transferred from the stock unit 31 to the stock unit 35 by the transfer arm 10. Step 57: The carrier C11 is transferred from the stock unit 14 to the stock unit 32 by the transfer arm 10. Step 58: The carrier C12 is transferred from the pre-cleaning import 13 to the stock unit 31 by the transfer arm 10. On the other hand, the loader / unloader unit 20 has an empty carrier C7 from which the unwashed wafer W has been taken out.
C8 is mounted. Also, the carrier C9 is in the stock section 36, the carrier C10 is in the stock section 35, the carrier C11 is in the stock section 32, the carrier C'1 is in the post-wash out port 16, and the carrier C'2 is in the stock section 1.
7, the empty carrier C'3 is in the stock unit 38, the empty carrier C'4 is in the stock unit 37, and the empty carrier C'5 is
Are placed on the stock section 34, and the empty carrier C'6 is placed on the stock section 33. Step 59: The empty carrier C7 is transferred by the transfer arm 10 from the station 21a to the out-port 12 before cleaning. Step 60: The empty carrier C8 is moved from the station 21b to the stock unit 14 by the transfer arm 10.
Is transferred to Thereby, the loader / unloader unit 20
No carriers C7 and C8 are empty. Step 61: Empty carrier C'3 is transferred to transfer arm 1
0 transfers from the stock unit 38 to the station 21a. Step 62: Empty carrier C'4 is transferred to transfer arm 1
0 transfers from the stock unit 37 to the station 21b. Thereafter, the wafer W, which has been subjected to the predetermined cleaning and drying processing, is transferred to the loader / unloader unit 20 by the transfer arm 4, and the wafers W are stored in the carriers C'3, C'4 by the hands 22,23. Step 63: Carriers C′3 and C′4 containing the washed wafer W are placed on the loader / unloader unit 20. Further, the carrier C′1 is in the out port 16 after cleaning, the carrier C′2 is in the stock section 17, the empty carrier C′5 is in the stock section 34, the empty carrier C′6 is in the stock section 33, and the empty carrier C′6 is in the stock section 33. Of the carrier C7 in the out port 12 before cleaning, the empty carrier C8 in the stock section 14, the carrier C9 in the stock section 36, and the carrier C
10 is mounted on the stock unit 35, the carrier C11 is mounted on the stock unit 32, and the carrier C12 is mounted on the stock unit 31. Step 64: The carrier C'3 is transferred from the station 21a to the stock section 38 by the transfer arm 10. Step 65: The carrier C'4 is transferred from the station 21b to the stock unit 37 by the transfer arm 10. As a result, there is no carrier C'3, C'4 in the loader / unloader section 20. Step 66: The carrier C9 is transferred from the stock unit 36 to the station 21a by the transfer arm 10. Step 67: The carrier C10 is transferred from the stock unit 35 to the station 21b by the transfer arm 10. Then, the hand 2 is loaded by the loader / unloader unit 20.
2 and 23, the wafer W before cleaning is transferred to carriers C9 and C9.
Removed from 10. Thus, the carriers C9 and C1
The wafer W taken out from 0 is received by the transfer arm 4 and carried into the cleaning / drying processing unit 3. The wafers W before cleaning are sequentially sent to the cleaning devices 53, 51, and the drying device 50 while taking time so as not to overlap with the progress of the cleaning and drying processes of the wafers W taken out of the carriers C5, C6, C7, and C8. The wafer is conveyed and subjected to a predetermined washing and drying process. Step 68: The loader / unloader unit 20 includes the empty carrier C9 from which the uncleaned wafer W has been taken out.
C10 is mounted. The empty carrier C7 is in the out port 12 before cleaning, the empty carrier C8 is in the stock section 14, the carrier C11 is in the stock section 32, the carrier C12 is in the stock section 31, and the carrier C'1 is in the out port after cleaning. 16, the carrier C'2 is in the stocking section 17, the carrier C'3 is in the stocking section 38, the carrier C'4 is in the stocking section 37, the empty carrier C'5 is in the stocking section 34, and the empty carrier C ' 6 are placed on the stock sections 33, respectively. Step 69: The empty carrier C9 is moved from the station 21a to the stock unit 36 by the transfer arm 10.
Is transferred to Step 70: The empty carrier C10 is moved from the station 21b to the stock unit 3 by the transfer arm 10.
Transferred to 5. Thereby, the loader / unloader unit 2
There is no empty carrier C9, C10 at 0. Step 71: Empty carrier C'5 is transferred to transfer arm 1
0 transfers from the stock unit 34 to the station 21a. Step 72: Empty carrier C'6 is transferred to transfer arm 1
0 transfers from the stock unit 33 to the station 21b. Thereafter, the wafer W, which has been subjected to the predetermined cleaning and drying processing, is transferred to the loader / unloader unit 20 by the transfer arm 4, and the wafers W are stored in the carriers C'5, C'6 by the hands 22,23. Step 73: The carriers C'5 and C'6 each containing the washed wafer W are placed on the loader / unloader unit 20. Also, the carrier C′1 is in the out port 16 after cleaning, the carrier C′2 is in the stock unit 17, the carrier C′3 is in the stock unit 38, the carrier C′4 is in the stock unit 37, and the empty carrier C7 is The empty carrier C8 is in the stock unit 14, the empty carrier C9 is in the stock unit 36, the empty carrier C1 is in the outport 12 before cleaning.
0 is the stock unit 35, and carrier C11 is the stock unit 3.
2, a carrier C12 is placed on the stock unit 31, respectively. Step 74: The carrier C'5 is transferred from the station 21a to the stock unit 34 by the transfer arm 10. Step 75: The carrier C'6 is transferred from the station 21b to the stock unit 33 by the transfer arm 10. As a result, there is no carrier C'5, C'6 in the loader / unloader section 20. Step 76: The carrier C11 is transferred from the stock section 32 to the station 21a by the transfer arm 10. Step 77: The carrier C12 is transferred from the stock unit 31 to the station 21b by the transfer arm 10. Then, the hand 2 is loaded by the loader / unloader unit 20.
2 and 23, the wafer W before cleaning is transferred to the carrier C11,
Removed from C12. Thus, the carrier C11,
The wafer W taken out from C12 is received by the transfer arm 4 and carried into the cleaning / drying processing unit 3. These pre-cleaning wafers W are cleaned by the cleaning devices 53, 5 while taking care not to overlap with the progress of the cleaning and drying processes of the wafers W taken out of the carriers C7, C8, C9, C10.
1, are sequentially conveyed to the drying device 50, and are subjected to predetermined cleaning and drying processes. Step 78: In the loader / unloader section 20, the empty carrier C1 is taken out of the wafer W before cleaning.
1 and C12 are placed. Also, the carrier C′1 is in the out port 16 after cleaning, the carrier C′2 is in the stock section 17, the carrier C′3 is in the stock section 38, the carrier C′4 is in the stock section 37, and the carrier C′5 is in the stock section. In the stock section 34, the carrier C'6 is in the stock section 33, the empty carrier C7 is in the front out port 12, the empty carrier C8 is in the stock section 14, the empty carrier C9 is in the stock section 36, and the empty carrier. C10 is the stock unit 35
Respectively. Step 79: The empty carrier C11 is moved from the station 21a to the stock unit 3 by the transfer arm 10.
Transferred to 2. Step 80: The empty carrier C12 is moved from the station 21b to the stock unit 3 by the transfer arm 10.
Transferred to 1. Thereby, the loader / unloader unit 2
There is no empty carrier C11, C12 at 0

Next, while the carriers C'1 to C'6 accommodating the cleaned wafer W are unloaded, the next six empty carriers C'7,
C'8, C'9, C'10, C'11, and C'12 are carried in. These steps are performed by steps 81 to 83 in Table 7 and steps 84 to 102 in Table 8 below. Step 81: The seventh empty carrier C'7 is carried into the post-cleaning side import 15. On the other hand, carrier C'1
Is carried out from the out port 16 after cleaning. The loading and unloading is performed by workers and AGVs in the factory. As a result, there is no carrier C′1 in the out-port 16 after cleaning. Step 82: The carrier C'2 is transferred by the transfer arm 10 from the stock unit 17 to the out-port 16 after cleaning. Step 83: Empty carrier C'7 is transferred to transfer arm 1
Stock part 17 from back side import 15 after washing by 0
Is transferred to As a result, there is no carrier C'7 in the post-cleaning side import 15. Step 84: The eighth empty carrier C'8 is carried into the after-cleaning side import 15. On the other hand, carrier C'2
Is carried out from the out port 16 after cleaning. As a result, there is no carrier C'2 in the out-port 16 after cleaning. Step 85: The carrier C'3 is transferred by the transfer arm 10 from the stock section 38 to the post-wash out port 16. Step 86: Empty carrier C'7 is transferred to transfer arm 1
0 transfers from the stock unit 17 to the stock unit 38. Step 87: Empty carrier C'8 is transferred to transfer arm 1
Stock part 17 from back side import 15 after washing by 0
Is transferred to As a result, there is no carrier C'8 in the post-wash side import 15. Step 88: The ninth empty carrier C'9 is carried into the post-cleaning side import 15. On the other hand, carrier C'3
Is carried out from the out port 16 after cleaning. As a result, there is no carrier C′3 in the out-port 16 after cleaning. Step 89: The carrier C'4 is transferred by the transfer arm 10 from the stock unit 37 to the out-port 16 after cleaning. Step 90: The empty carrier C'8 is moved to the transfer arm 1
0 transfers from the stock unit 17 to the stock unit 37. Step 91: Empty carrier C'9 is transferred to transfer arm 1
Stock part 17 from back side import 15 after washing by 0
Is transferred to As a result, there is no carrier C ′ 9 in the post-wash side import 15. Step 92: The tenth empty carrier C'10 is carried into the post-cleaning side import 15. On the other hand, the carrier C ′ 4 is carried out from the out port 16 after cleaning. As a result, the carrier C ′ is connected to the out-port 16 after cleaning.
There is no four. Step 93: The carrier C'5 is transferred by the transfer arm 10 from the stock section 34 to the out-port 16 after cleaning. Step 94: Empty carrier C'7 is transferred to transfer arm 1
0 transfers from the stock unit 38 to the stock unit 34. Step 95: Empty carrier C'9 is transferred to transfer arm 1
0 transfers from the stock unit 17 to the stock unit 38. Step 96: The empty carrier C ′ 10 is moved from the post-wash side import 15 by the transfer arm 10 to the stock unit 1.
Transferred to 7. As a result, the import after cleaning 15
Is in a state without the carrier C'10. Step 97: The 11th empty carrier C'11 is carried into the after-cleaning side import 15. On the other hand, the carrier C'5 is carried out from the out port 16 after cleaning. As a result, the carrier C ′ is connected to the out-port 16 after cleaning.
5 is not present. Step 98: The carrier C'6 is transferred by the transfer arm 10 from the stock unit 33 to the out-port 16 after cleaning. Step 99: The empty carrier C'8 is moved to the transfer arm 1
Due to 0, it is transferred from the stock unit 37 to the stock unit 33. Step 100: The empty carrier C'10 is transferred from the stock unit 17 to the stock unit 37 by the transfer arm 10. Step 101: The empty carrier C'11 is moved from the post-wash side import 15 to the stock unit 1 by the transfer arm 10.
Transferred to 7. As a result, the import after cleaning 15
Is in a state without the carrier C′11. Step 102: The twelfth empty carrier C′12 is carried into the after-cleaning side import 15. On the other hand, the carrier C ′ 6 is carried out from the out port 16 after cleaning.

Thereafter, as in the loading / unloading device 2, the loading / unloading device 70 repeats loading / unloading of the carrier C in the same procedure, so that the cleaning and drying of the wafer W can be performed continuously. In addition, this loading / unloading device 70
Because the number of carriers C that can be carried in and out at one time has increased,
The carrier C can be carried in and out more efficiently than the carry-in / out device 2. Further, as compared with the loading / unloading device 2, the period during which the worker or the like may be absent becomes longer.

Although the embodiments of the present invention have been described, the present invention is not limited to these embodiments, and can take various forms. For example, even if the number of carriers to be carried in and out at one time increases sequentially to eight and ten, the stock part to be stored is increased accordingly, and the carrier transfer in the carry-in / out device is performed via the stock part. As a result, as described above, the wafer can be continuously taken out and stored, and the carrier can be efficiently loaded and unloaded.

[0082]

According to the first and fifth aspects of the present invention, it is possible to continuously carry in a container containing a substrate, take out the substrate from the container, and carry out an empty container from which the substrate has been taken out. Therefore, the substrates can be successively carried into an appropriate processing section or the like, and the processing of the substrates can be performed continuously. Furthermore, it is possible to collectively carry in the container storing the substrate and carry out the empty container from which the substrate is taken out. Therefore,
Containers can be efficiently loaded and unloaded.

According to the second and sixth aspects of the present invention, it is possible to continuously carry in an empty container for accommodating a substrate, accommodate a substrate in the container, and carry out a container accommodating the substrate. Therefore, the substrates can be unloaded one after another from an appropriate processing unit or the like, and the processing of the substrates can be performed continuously. Further, it is possible to collectively carry in an empty container for accommodating the substrate and carry out the container accommodating the substrate. Therefore, the loading and unloading of the container can be performed efficiently.

According to the third and seventh aspects of the present invention, a container accommodating a substrate before processing is carried in, a substrate before processing is taken out of the container, an empty container from which the substrate before processing is taken out is taken out, and after processing, It is possible to continuously carry in an empty container for storing the substrate, store the processed substrate in the container, and unload the container storing the processed substrate. Therefore, the substrates before processing can be successively carried into an appropriate processing unit and the like, and the substrates after processing can be unloaded one after another from the appropriate processing unit and the like. Can be.
Further, it is possible to collectively carry in a container storing the substrates before processing and carry out an empty container from which the substrates before processing are taken out. On the other hand, it is possible to collectively carry in an empty container for storing the processed substrate and unload the container storing the processed substrate. Therefore, the loading and unloading of the container can be performed efficiently.

According to the fourth aspect of the present invention, the loading and unloading of containers can be performed more efficiently.

[Brief description of the drawings]

FIG. 1 is a plan view of a cleaning system including a loading / unloading device according to an embodiment of the present invention.

FIG. 2 is a side view of the cleaning system.

FIG. 3 is a perspective view of the loading / unloading device.

FIG. 4 is an enlarged side view of a main part of the cleaning system.

FIG. 5 is a plan view of an arm unit provided in the transfer arm.

FIG. 6 is an explanatory diagram showing an internal state of the cleaning device.

FIG. 7 is a perspective view showing a state of an upper portion of the cleaning device.

FIG. 8 is a perspective view showing the inside of the cleaning tank.

FIG. 9 is an explanatory view showing a state when a rinsing process is performed on the wafer in the cleaning tank.

FIG. 10 is an explanatory diagram showing a state in which a wafer is carried out of a cleaning tank by moving up a holding unit.

FIG. 11 is an explanatory diagram showing a state when the transfer arm receives a wafer from a holding unit.

FIG. 12 is an explanatory diagram illustrating a state in which the holding unit is on standby above the cleaning tank.

FIG. 13 is an explanatory diagram showing a state in which the cleaning liquid in the cleaning tank is replaced with pure chemicals from pure water.

FIG. 14 is an explanatory diagram showing a state when a wafer to be next cleaned is transferred to a cleaning device by a transfer arm.

FIG. 15 is an explanatory diagram showing a state when the holding unit receives a wafer from the transfer arm.

FIG. 16 is an explanatory diagram showing a state in which a wafer in a cleaning tank is stored by lowering a holding unit.

FIG. 17 is a perspective view of a carry-in / out device according to a second embodiment.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Cleaning system 2 Carry-in / out apparatus 10 Transfer arm 12 Out port before washing 13 Into port before washing 14, 17, 31, 32, 33, 34 Stock part 15 Import after washing 16 Out port after washing 20 Loader / unloader part C Carrier W wafer

 ────────────────────────────────────────────────── ─── Continuing on the front page (72) Inventor Masahiro Somezaki 1375-41, Nishishinmachi, Tosu-shi, Saga F-term in the Saga office of Tokyo Electron Kyushu Co., Ltd. (Reference) 3B201 AA03 AB23 AB44 BB02 BB82 BB92 BB93 CB12 CC01 CD33 5F031 CA02 DA17 FA03 FA09 FA11 GA48 GA49 HA73 MA13 MA23

Claims (7)

[Claims] 1. An import for carrying in a container containing substrates, an outport for carrying out an empty container from which a substrate has been taken out, a takeout unit for taking out a substrate from a container, a stock unit for storing a container, And a transfer mechanism for transferring the container between the outport, the take-out part, and the stock part. 2. An import for loading an empty container for storing substrates, an outport for discharging a container storing substrates, a storage unit for storing substrates in a container, and a stock unit for storing containers. And a transfer mechanism for transferring the container between the import / outport, the storage unit and the stock unit. 3. A pre-processing side import for loading a container containing a substrate before processing, a pre-processing side out port for unloading an empty container from which a substrate before processing is taken out, and an empty port for storing a processed substrate. Post-processing import for loading the container, Post-processing out port for unloading the container containing the processed substrate, and unloading and storing unit for unloading the substrate before processing from the container and storing the processed substrate in the container And a stock unit for storing containers, and a transfer mechanism for transferring containers between the pre-processing side import, pre-process side outport, post-process side import, post-process side outport, unloading storage unit and stock unit. A device for loading and unloading containers. 4. The container loading / unloading device according to claim 1, wherein said stock unit is capable of storing a plurality of containers. 5. A method of transferring a container containing substrates from an import for import to an extraction unit, extracting the substrate from the container at the extraction unit, and transferring an empty container from which the substrate has been extracted to an outport for unloading. Wherein the transfer of the container from the import unit to the take-out unit and / or the transfer of the container from the take-out unit to the outport is performed via a stock unit for storing the container. How to get out. 6. An empty container for accommodating the substrate is transferred from the import for import to the accommodating section, and the substrate is accommodated in the container in the accommodating section, and the container accommodating the substrate is transferred to the out port for unloading. A method of transferring, wherein the transfer of the container from the import to the storage unit and / or the transfer of the container from the storage unit to the outport is performed via a stock unit for storing the container. Container loading / unloading method. 7. A container accommodating a substrate before processing is taken out from a pre-processing side import for carrying in, taken out and transferred to a storage section, and the substrate before processing is taken out of the container in the extraction storage section, and the substrate before processing is taken out. The empty container is transferred to the pre-processing outport for unloading, while the empty container for storing the processed substrate is transferred from the post-processing import for unloading to the unloading and unloading unit. Wherein the processed substrate is stored in a container, and the container storing the processed substrate is transferred to a post-processing outport for unloading, wherein the container is transferred from the pre-processing import to the storage unit. Transfer of the container from the removal storage unit to the post-processing out port, transfer of the container from the post-import to the removal storage unit, and / or from the removal storage unit. A method for carrying in / out a container, wherein the container is transferred to an outport after the treatment via a stock unit for storing the container.