JP2001050888A - Environmental testing apparatus - Google Patents

Abstract

PROBLEM TO BE SOLVED: To conduct an environmental test with good efficiency by a method, where a test chamber is set under a prescribed environmental condition, a plurality of circuit boards are installed in an installation part side by side at nearly equal intervals and in the vertical state and a mechanism, which prevents water drops form falling on the boards, is installed. SOLUTION: In an installation part 11, a plurality of grooves 12 which are at nearly equal intervals and in parallel are formed on the surface in a width, corresponding to the thickness of each circuit board 2 and at a prescribed depth, and respective boards 2 are installed side by side in the grooves 12, at nearly equal intervals and in a vertical state. A gable-shaped roof part 41 whose surface and rear surface are tilted for preventing water drops from falling and support parts 42 which are installed vertically for supporting four corners constitute a water drop fall preventing structure. The structure is installed, so as to cover the upper part of the plural circuit boards 2. With this constitution, it is possible to prevent water drops form falling, and an unintentional external factors will not be added. In addition, the plural circuit boards 2 can be installed in the installation part 11 side by side at nearly equal intervals and in the vertical state, respective circuit boards can be held under identifically set testing environment, reproducibility of an environmental testing is enhanced, and high reliability of the testing can be obtained.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an environmental test apparatus for performing an environmental test on a circuit board.

[0002]

2. Description of the Related Art As shown in FIG. 4, a conventional environmental test apparatus 90 has a test tank 91 provided with a plurality of shelves 93.
On these shelves 93, wiring 94 is connected by soldering to each circuit board 92 to be tested, and the test tank 91 is placed in a high-temperature and high-humidity condition with each circuit board 92 placed flat at an arbitrary position. An environmental test of each circuit board 92 is performed under predetermined environmental conditions such as dew condensation conditions.

[0003]

However, the conventional environmental test apparatus 90 shown in FIG. 4 has a problem that the test environment varies depending on the place where the circuit board 92 is mounted and the position of the shelf 93.

[0004] Further, there is another problem that steam generated in the test tank 91 is condensed, and water droplets fall on a circuit board 92 placed on a shelf 93 of the test tank 91 in a plane.

For this reason, in the conventional environmental test apparatus, it is difficult to maintain each circuit board in the same constant test environment.
Due to the addition of unintended external factors or the like, the reliability of the test result data is lowered, and the test may be repeated.

Furthermore, since the wiring board is connected to each circuit board by soldering to perform an environmental test of the circuit board, when observing the circuit board or performing data measurement in an intermediate stage of the test, the soldering is performed. It is necessary to remove the wiring once, and then to continue the environmental test, the wiring must be connected to each circuit board again by soldering, so such work is troublesome and the environmental test cannot be performed efficiently. There was a problem. In addition, there is a problem that water droplets adhere to each circuit board through wiring. In addition, at the time of soldering, the flux of the solder scatters and adheres to the circuit board, which is an obstacle when observing the circuit board.

SUMMARY OF THE INVENTION The present invention solves the above-mentioned problems of the prior art, and can maintain each circuit board in the same constant test environment without adding unintended external factors. It is an object of the present invention to provide an environmental test apparatus having high reproducibility and high reliability.

Another object of the present invention is to facilitate the mounting and dismounting of each circuit board when observing the circuit board or performing data measurement at an intermediate stage of the environmental test. An object of the present invention is to provide an environmental test device that can be efficiently performed.

[0009]

According to the present invention, there is provided an environmental test apparatus comprising: a test chamber in which predetermined environmental conditions can be set; and a plurality of circuit boards to be tested in the test chamber are vertically spaced at substantially equal intervals. And a water-drop prevention structure for preventing water drops from falling on the circuit board provided side-by-side with the installation part. More specifically, the water drop prevention structure is configured to have a roof-like member that covers the juxtaposed portions of the circuit board to be tested.

According to the above configuration, it is possible to set the test chamber to a predetermined environmental condition, and to arrange a plurality of circuit boards in a vertical state at substantially equal intervals by the installation section. Can be maintained in a test environment. Furthermore,
By adopting the water drop prevention structure, it is possible to prevent water drops from dropping on the circuit boards juxtaposed to the installation section, and to prevent an unintended external factor from being added.
Therefore, the reproducibility of the environmental test in the environmental test apparatus is improved, and high reliability is obtained.

In the present invention, when the installation section has a wiring fixing section for fixing the wiring of each circuit board at a position lower than each circuit board, it is possible to prevent water droplets from traveling along the wiring and adhering to each circuit board. This makes it possible to further uniform the test environment of each circuit board including the wiring.

Further, if dummy boards are provided on both sides of the juxtaposed portions of the circuit boards to be tested, the test environment of each circuit board can be further uniformed.

Further, when the installation section has an electric connection section for electrically connecting each circuit board to the outside by mounting the circuit board, when the circuit board is observed or data is measured at an intermediate stage of an environmental test. In addition, each circuit board can be easily attached and detached, and an environmental test of the circuit board can be efficiently performed.

[0014]

Embodiments of the present invention will be specifically described below with reference to the drawings.

(First Embodiment) FIG. 1 shows a first embodiment of the present invention.
1 shows a configuration example of an environmental test apparatus 10 according to the embodiment.

The environmental test apparatus 10 includes a test chamber 1 in which environmental conditions such as temperature, humidity, and wind speed can be set, and a plurality of circuit boards 2 in the test chamber 1 which are vertically arranged at substantially equal intervals. An installation part 11 to be installed, and a water drop prevention structure 4 for preventing water drops from falling on the circuit board 2 arranged in parallel with the installation part 11
And

More specifically, the installation unit 11 is, for example,
As shown in FIG. 1B, a plurality of grooves 12 which are parallel to each other at substantially equal intervals are formed on the upper surface at a predetermined depth with a width corresponding to the thickness of the circuit board 2. The circuit boards 2 can be arranged vertically at substantially equal intervals.
It is preferable to use a material having a low thermal conductivity, such as plastic, for the installation portion 11 so as not to absorb the heat of the circuit board 2.

As shown in FIGS. 1 (a) and 1 (c), for example, the water drop prevention structure 4
A gable-shaped roof portion 41 having an upper surface and a lower surface inclined, and a support portion 42 vertically provided to support four corners of the roof portion 41
And a plurality of circuit boards 2 arranged side by side in the installation section 11.
It is installed so as to cover the upper part of.

With this structure, even if the vapor condenses on the ceiling of the test room 1 and falls as water droplets, the water droplets are received by the upper surface of the roof portion 41 and flow along the slope of the roof portion 41. , Reaches one of the side edges of the roof portion 41, from which water drops drop.

Further, even if the vapor condenses on the lower surface of the roof portion 41 to form water droplets, since the lower surface of the roof portion 41 is also inclined, the water droplets flow along the inclination of the lower surface of the roof portion 41, and One of the side edges of 41 is reached, from which water drops fall.

For this reason, it is possible to prevent water drops from dropping on the plurality of circuit boards 2 arranged in parallel with the installation section 11 whose upper part is covered by the roof section 41.

The roof 41 and the support 42 are kept to a minimum area so as not to deviate from the state of the entire test environment.

Further, in the installation section 11 in which a plurality of circuit boards 2 are arranged vertically at substantially equal intervals in the test chamber 1, both ends of the installation section 11 are provided in order to make the test environment of each circuit board 2 uniform. A dummy substrate 5 having the same shape as the circuit board 2 is vertically provided in the groove 12.

According to this configuration, the water droplet falling prevention structure 4 can prevent water droplets from falling onto the circuit board 2 juxtaposed to the installation portion 11, and an unintended external factor is added. Disappears. Further, the installation section 11 allows the plurality of circuit boards 2 to be arranged side by side at substantially equal intervals in a vertical state, so that each circuit board can be maintained in the same constant test environment. Therefore, the reproducibility of the environmental test in the environmental test apparatus is improved, and high reliability is obtained.

(Second Embodiment) FIG. 2 shows a second embodiment of the present invention.
1 shows a configuration example of an environmental test apparatus according to the embodiment.

In this environmental test apparatus 20, the installation unit 21 differs from the first embodiment in that the wiring 2 of each circuit board 2
7 is different from that of the first embodiment in that it has a wiring fixing portion 23 for fixing each of the fixing members 7.

More specifically, as shown in FIG. 2A, for example, as shown in FIG. 2A, the cable fixing portion 23 corresponds to each of the circuit boards 2 arranged vertically in the installation portion 21 so as to correspond to the cable band 24. Is provided, whereby the wires 27 are bundled and held on the side surface of the installation portion 21 so that the wires 27 can be fixed at a position lower than the circuit boards 2. See Figure 2 for details.
As shown in (b), one end of the cable band 24 is fixed to the fixing portion 25 on the side surface of the installation portion 21, and the other end can be locked at a desired position by the lock mechanism 26. The wiring holding dimensions can be adjusted.

According to this configuration, it is possible to prevent water droplets from traveling along the wiring and adhering to each circuit board, and to further uniform the test environment of each circuit board including the wiring.

(Third Embodiment) FIG. 3 shows a third embodiment of the present invention.
1 shows a configuration example of an environmental test apparatus according to the embodiment.

The environmental test apparatus differs from the first embodiment in that the installation section 31 has an electric connection section 30 for electrically connecting each circuit board 2 to the outside when the circuit board 2 is mounted. The other configuration is the same as that of the first embodiment.

More specifically, for example, as shown in FIG. 3, the electric connection portion 30 is provided on the upper surface of the installation portion 31 in order to arrange a plurality of circuit boards 2 in a vertical state at substantially equal intervals. In the plurality of grooves 32, the circuit board 2 inserted into the grooves 32
Corresponding to the position of the electrode 3 on the side wall of the groove 32.
Is provided. A wiring 34 is connected to the electrode 33, and a connector 35 is provided at an end of the wiring 34. This connector 35 is connected to the wiring 3 connected to the power supply.
The power is supplied to the circuit board 2 by being connected to the connector 36 which is the mating member 7.

According to this configuration, when observing the circuit board or performing data measurement at an intermediate stage of the environmental test, it is not necessary to remove the wiring by soldering as in the related art, and each circuit board can be easily mounted. The circuit board can be easily attached and detached, and the work of mounting and wiring the circuit board can be easily performed in a short time, so that an environmental test of the circuit board can be efficiently performed.

Further, since there is no wiring directly connected to each circuit board, water droplets do not travel along the wiring and adhere to each circuit board, and there is no need to perform soldering as in the prior art. At the time of attachment, the problem that the flux of the solder is scattered and adheres to the circuit board, thereby obstructing observation of the circuit board can be solved.

As described above, the environmental test apparatus of the present invention is not limited to the specific configuration of each of the above-described embodiments, and it is needless to say that the configuration may be modified, added, or deleted as needed. . For example, in the above description, an example in which the installation units 11, 21, and 31 are installed horizontally has been described.
1, 21, 31 may be installed vertically. Further, the water drop falling prevention structure 4 is provided with a gable-shaped roof portion 41 and a pillar portion 4 which is vertically provided to support four corners of the roof portion 41.
2, the support portion 42 is eliminated, and the roof portion 41 is supported by a support member provided on the side wall of the test room.
The roof 41 may be suspended by a suspension member provided on the ceiling of the test room.

[0035]

As described above, according to the environmental test apparatus of the present invention, the test chamber is set to a predetermined environmental condition, and a plurality of circuit boards are arranged vertically at substantially equal intervals by the installation section. As a result, each circuit board can be maintained in the same constant test environment. Further, by adopting the water drop prevention structure, it is possible to prevent the water drops from falling on the circuit boards juxtaposed to the installation portion, and to prevent an unintended external factor from being added. Therefore, the reproducibility of the environmental test in the environmental test apparatus is improved, and high reliability is obtained.

If the installation section has a wiring fixing section for fixing the wiring of each circuit board at a position lower than each circuit board, water droplets can be prevented from traveling along the wiring and adhering to each circuit board, and the wiring can be prevented. The test environment of each circuit board including the above can be further uniformized.

Further, if dummy substrates are provided on both sides of the juxtaposed portions of the circuit boards to be tested, the test environment of each circuit board can be further uniformed.

When the installation section has an electric connection section for electrically connecting each circuit board to the outside by mounting the circuit board, the circuit board is observed or data is measured at an intermediate stage of the environmental test. In this case, it is not necessary to remove the wiring by soldering as in the related art, and each circuit board can be easily attached and detached, and an environmental test of the circuit board can be efficiently performed. Also, since there is no wiring directly connected to each circuit board, water droplets do not adhere to each circuit board along the wiring, and there is no need to perform soldering as in the past. In addition, the problem that the solder flux is scattered and adheres to the circuit board, which is an obstacle to observing the circuit board, can be solved.

[Brief description of the drawings]

FIG. 1 is a diagram showing a configuration example of an environmental test apparatus according to a first embodiment of the present invention, wherein (a) is a perspective view showing the entire apparatus, (b) is a perspective view showing details of an installation unit, FIG. 3C is a sectional view taken along the line P-P in FIG.

2A and 2B are diagrams illustrating a configuration example of an environmental test apparatus according to a second embodiment of the present invention, wherein FIG. 2A is a perspective view illustrating the entire apparatus, and FIG. 2B is a perspective view illustrating details of a wiring fixing unit. It is.

FIG. 3 is a diagram illustrating a configuration example of an electrical connection unit in an environmental test device according to a third embodiment of the present invention.

FIG. 4 is a perspective view showing a configuration example of a conventional environmental test apparatus.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Test room 2 Circuit board 3, 33 electrode 4 Drop prevention structure 5 Dummy board 10, 20 Environmental test device 11, 21, 31 Installation part 12, 22, 32 Groove 23 Wiring fixing part 30 Electrical connection part

Claims (5)

[Claims] 1. A test chamber in which predetermined environmental conditions can be set, a mounting section for vertically arranging a plurality of circuit boards to be tested in the test chamber at substantially equal intervals, and An environmental test apparatus comprising: a water droplet drop prevention structure for preventing water droplets from falling on the circuit board arranged in parallel. 2. The environmental test apparatus according to claim 1, wherein the installation section has a wiring fixing section for fixing the wiring of each circuit board. 3. The environmental test apparatus according to claim 1, wherein the installation section has an electric connection section for electrically connecting each circuit board to the outside by mounting the circuit board. 4. The environmental test apparatus according to claim 1, wherein the water drop prevention structure has a roof-like member that covers a juxtaposed portion of a circuit board to be tested. 5. The environmental test apparatus according to claim 1, wherein dummy substrates are provided on both sides of the juxtaposition of the circuit boards to be tested.