JP2001045624A - Method of terminating semiconductor layer of electric cable - Google Patents

Method of terminating semiconductor layer of electric cable

Info

Publication number
JP2001045624A
JP2001045624A JP11212370A JP21237099A JP2001045624A JP 2001045624 A JP2001045624 A JP 2001045624A JP 11212370 A JP11212370 A JP 11212370A JP 21237099 A JP21237099 A JP 21237099A JP 2001045624 A JP2001045624 A JP 2001045624A
Authority
JP
Japan
Prior art keywords
cable
semiconductive layer
insulator
terminal
semiconductive
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP11212370A
Other languages
Japanese (ja)
Inventor
Satoru Sadahiro
哲 貞廣
Kiyoshi Takatsuka
潔 高塚
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujikura Ltd
Original Assignee
Fujikura Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujikura Ltd filed Critical Fujikura Ltd
Priority to JP11212370A priority Critical patent/JP2001045624A/en
Publication of JP2001045624A publication Critical patent/JP2001045624A/en
Pending legal-status Critical Current

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  • Processing Of Terminals (AREA)
  • Cable Accessories (AREA)

Abstract

PROBLEM TO BE SOLVED: To prevent the occurrence of partial discharge, at terminal connection time or middle connection of an electric cable, having a semiconductor layer. SOLUTION: The figure shows the vicinity of the terminal of a cable semiconductor layer 5, in the enlarged sectional view of one part of the terminal connection of a power cable 2. A conductive or semiconductive ring 20, consisting of soft material, is fitted around the exposed insulator 4 of a power cable 2 (figure a), and a connector is slid onto the power cable 2, together with a semiconductor layer 13 on an apparatus side (figure b). A void 19 at the terminal of the cable semiconductor layer 5 is filled with a flexible conductive or semiconductive ring 20, and partial discharge phenomena, which were occurring due to the existence of this void 19, can be removed.

Description

【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION

【0001】[0001]

【発明の属する技術分野】この発明は、電力ケーブルの
終端接続部や中間接続部に適用して好適な電気ケーブル
の半導電層端末処理方法に関する。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for processing a terminal of a semiconductive layer of an electric cable, which is suitable for application to a terminal connection or an intermediate connection of a power cable.

【0002】[0002]

【従来の技術】例えば電力ケーブルの終端接続部や中間
接続部等の接続部において、接続機器を電力ケーブルに
取り付ける場合、接続機器を電力ケーブルに単純に差し
込む工法を採用している。図2は本発明の適用対象の一
例を示すもので、電力ケーブルの終端接続部1の部分断
面図であり、本発明および従来例に共通する。同図にお
いて、2は電力ケーブルで、この電力ケーブル2は、中
心の導体3の外周に、内側から順に、架橋ポリエチレン
等の絶縁体4、カーボン等を混入したEPゴム(エチレ
ンプロピレンゴム)等による半導電層(ケーブル半導電
層)5、遮蔽層6を被覆し、さらに例えばPVC等のシ
ース7を被覆している。また、図示の終端接続部1は、
エポキシがい管式の終端接続部であり、11は導体引出
棒、12はEPゴム等による絶縁体、13は例えばカー
ボン等を混入したEPゴム等による半導電層、14はブ
ラケット、15は絶縁体押し金具、16はケーブル保持
金具、17はエポキシがい管である。なお、上記の終端
接続部1における電力ケーブル2およびケーブル保持金
具16以外の部分を接続機器18と呼ぶ。
2. Description of the Related Art For example, when a connection device is attached to a power cable at a connection portion such as a terminal connection portion or an intermediate connection portion of the power cable, a method of simply inserting the connection device into the power cable is employed. FIG. 2 shows an example of an object to which the present invention is applied, and is a partial cross-sectional view of a terminal connecting portion 1 of a power cable, which is common to the present invention and the conventional example. In the figure, reference numeral 2 denotes a power cable. The power cable 2 is made of an EP rubber (ethylene propylene rubber) or the like mixed with an insulator 4 such as cross-linked polyethylene, carbon, and the like in this order from the inside to the outer periphery of a central conductor 3. A semiconductive layer (cable semiconductive layer) 5 and a shielding layer 6 are covered, and a sheath 7 of, for example, PVC or the like is further covered. In addition, the illustrated terminal connection unit 1
Reference numeral 11 denotes a conductor connecting rod, 12 is a conductor lead rod, 12 is an insulator made of EP rubber or the like, 13 is a semiconductive layer made of EP rubber or the like mixed with carbon or the like, 14 is a bracket, and 15 is an insulator. A push fitting, 16 is a cable holding fitting, and 17 is an epoxy pipe. Note that a portion other than the power cable 2 and the cable holding bracket 16 in the above-described terminal connection portion 1 is referred to as a connection device 18.

【0003】図3は従来の半導電層端末処理方法を示す
もので、図2のA部に相当する箇所の拡大図である。接
続機器18側の半導電層(機器側半導電層)13の内面
には、電力ケーブル2側の半導電層(ケーブル半導電
層)5の端末部分に対応して凹所13aを形成してお
り、接続機器18を機器側半導電層13とともに電力ケ
ーブル2に差し込んだ時、前記凹所13aにケーブル半
導電層5が入る形で、機器側半導電層13が絶縁体4お
よびケーブル半導電層5の外周面に接触する。
FIG. 3 shows a conventional method for treating a semiconductive layer terminal, and is an enlarged view of a portion corresponding to a portion A in FIG. On the inner surface of the semiconductive layer (device-side semiconductive layer) 13 on the connection device 18 side, a recess 13a is formed corresponding to the terminal portion of the semiconductive layer (cable semiconductive layer) 5 on the power cable 2 side. When the connecting device 18 is inserted into the power cable 2 together with the device-side semiconductive layer 13, the device-side semiconductive layer 13 is inserted into the recess 13a so that the device-side semiconductive layer 13 is insulated from the insulator 4 and the cable semiconductive layer. It contacts the outer peripheral surface of the layer 5.

【0004】[0004]

【発明が解決しようとする課題】上述の通り、電力ケー
ブル2に終端接続部等の接続機器を取り付ける場合、電
力ケーブル2に接続機器18を単純に差し込む工法を採
用しているが、その場合、半導電層5、13のゴム弾性
等のために、図示のように、機器側半導電層13とケー
ブル半導電層5の端末端面部にボイド(隙間)19が発
生し易いという問題があった。このようなボイド19が
存在すると、部分放電が発生し、電力ケーブル2および
接続機器18の破壊を引き起こす場合がある。なお、従
来は、接続機器18の差し込み時に、電力ケーブル2の
絶縁体4の表面にシリコーン油を塗布することで、絶縁
耐力を向上させていたが、必ずしも効果的ではなかっ
た。本発明は上記従来の欠点を解消するためになされた
もので、半導電層を持つ電気ケーブルの終端接続あるい
は中間接続等に際して、部分放電を発生させない半導電
層端末処理方法を提供することを目的とする。
As described above, when a connection device such as a terminal connection portion is attached to the power cable 2, a method of simply inserting the connection device 18 into the power cable 2 is employed. Due to the rubber elasticity of the semiconductive layers 5 and 13, there is a problem that voids (gaps) 19 are likely to be generated at the terminal end surfaces of the device-side semiconductive layer 13 and the cable semiconductive layer 5 as shown in the figure. . When such a void 19 exists, partial discharge may occur, which may cause breakage of the power cable 2 and the connection device 18. Conventionally, when the connecting device 18 is inserted, the surface of the insulator 4 of the power cable 2 is coated with silicone oil to improve the dielectric strength, but this is not always effective. SUMMARY OF THE INVENTION The present invention has been made to solve the above-mentioned conventional disadvantages, and an object of the present invention is to provide a method for treating a semiconductive layer terminal that does not generate a partial discharge at the time of terminal connection or intermediate connection of an electric cable having a semiconductive layer. And

【0005】[0005]

【課題を解決するための手段】上記課題を解決する本発
明は、導体外周の絶縁体の外周に半導電層を備えた電気
ケーブルに、露出させた前記絶縁体および半導電層に接
触する半導電層を備えた接続機器を取り付ける際の半導
電層端末処理方法であって、露出させた前記絶縁体の外
周における、前記電気ケーブル側の半導電層の端末端面
の位置に、柔軟材料からなる導電性または半導電性のリ
ングを嵌装して、接続機器を電気ケーブルに取り付ける
ことを特徴とする。
According to the present invention, there is provided an electric cable provided with a semiconductive layer on the outer periphery of an insulator on the outer periphery of a conductor. A semiconductive layer terminal treatment method for attaching a connection device having a conductive layer, comprising a flexible material at a position of a terminal end surface of the semiconductive layer on the electric cable side on an exposed outer periphery of the insulator. The connection device is attached to the electric cable by fitting a conductive or semiconductive ring.

【0006】請求項2は、導体外周の絶縁体の外周に半
導電層を備えた電気ケーブルに、露出させた前記絶縁体
および半導電層に接触する半導電層を備えた接続機器を
取り付ける際の半導電層端末処理方法であって、露出さ
せた前記絶縁体の外周における、前記電気ケーブル側の
半導電層の端末近傍部分に、導電性または半導電性塗料
を塗布して、接続機器を電気ケーブルに取り付けること
を特徴とする。
A second aspect of the present invention is to attach a connection device having a semiconductive layer in contact with the exposed insulator and the semiconductive layer to an electric cable having a semiconductive layer on the outer periphery of the insulator around the conductor. A semi-conductive layer terminal treatment method, wherein a conductive or semi-conductive paint is applied to a portion near the end of the semi-conductive layer on the side of the electric cable on the outer periphery of the exposed insulator, to thereby form a connection device. It is characterized by being attached to an electric cable.

【0007】[0007]

【発明の実施の形態】以下、本発明の実施の形態を図
1、図2を参照して説明する。この実施形態が対象とす
る電気ケーブルの接続部は、図2に示した終端接続部、
すなわちエポキシがい管式の終端接続部1である。図2
の再度の詳細説明は省略するが、図1(イ)は図2のA
部に相当する箇所であり、接続機器18側の半導電層
(機器側半導電層)13の内面には、電力ケーブル(電
気ケーブル)2側の半導電層(ケーブル半導電層)5の
端末部分に凹所13aを形成しており、接続機器18を
機器側半導電層13とともに電力ケーブル2に差し込ん
だ時、機器側半導電層13は、絶縁体4およびケーブル
半導電層5の外周面に接触する。
DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described below with reference to FIGS. The connection part of the electric cable targeted by this embodiment is a terminal connection part shown in FIG.
That is, the terminal connection part 1 is of an epoxy tube type. FIG.
1 is not described again, but FIG.
A terminal of the semiconductive layer (cable semiconductive layer) 5 on the side of the power cable (electric cable) 2 is provided on the inner surface of the semiconductive layer (device-side semiconductive layer) 13 on the connected device 18 side. When the connecting device 18 is inserted into the power cable 2 together with the device-side semiconductive layer 13, the device-side semiconductive layer 13 forms the outer peripheral surface of the insulator 4 and the cable semiconductive layer 5. Contact

【0008】本発明では、接続機器18を電力ケーブル
2に差し込む前に、図1(ロ)に示すように、電力ケー
ブル2の絶縁体4の外周に、導電性または半導電性のリ
ング20を嵌装しておく。この場合、リング20は、図
示の通り、ケーブル半導電層5の端末端面に接触する位
置に嵌装しておく。リング20の材質としては、例えば
カーボンを混入したEPゴム(エチレンプロピレンゴ
ム)等を用いることができる。次いで、接続機器18を
機器側半導電層13とともに図1(ロ)の矢印のように
さらに差し込むと、図1(イ)のように、機器側半導電
層13の凹所13aがケーブル半導電層5でほぼ埋まる
とともに、ケーブル半導電層5の端末端面との間のボイ
ド(隙間)19が、押しつぶされた柔軟なリング20で
埋まる。このリング20は導電性または半導電性を有す
るので、このボイド19が存在していた部分で発生する
部分放電現象を無くすことができる。
In the present invention, before the connecting device 18 is inserted into the power cable 2, as shown in FIG. 1 (b), a conductive or semiconductive ring 20 is placed around the insulator 4 of the power cable 2. Fit it in. In this case, the ring 20 is fitted at a position in contact with the terminal end face of the cable semiconductive layer 5 as shown in the figure. As a material of the ring 20, for example, EP rubber (ethylene propylene rubber) mixed with carbon can be used. Next, when the connecting device 18 is further inserted together with the device-side semiconductive layer 13 as shown by the arrow in FIG. 1B, the recess 13a of the device-side semiconductive layer 13 becomes the cable semiconductive layer as shown in FIG. The void 19 between the cable semi-conductive layer 5 and the terminal end face of the cable semi-conductive layer 5 is almost completely filled with the layer 5 and is filled with the crushed flexible ring 20. Since the ring 20 has conductivity or semi-conductivity, it is possible to eliminate a partial discharge phenomenon occurring in a portion where the void 19 was present.

【0009】また、前記リング20に代えて、電力ケー
ブル2の絶縁体4の外周に導電性または半導電性塗料を
塗布することもできる。この場合、ケーブル半導電層5
の端末近傍における絶縁体4表面に塗布する。次いで、
接続機器18を機器側半導電層13とともに電力ケーブ
ル2に差し込む。これにより、電力ケーブル2のボイド
部分における絶縁体4の表面が導電性を帯びることとな
り、ボイドの内側表面が同電位となって、ボイド内の部
分放電現象を防止できる。
In place of the ring 20, a conductive or semiconductive paint can be applied to the outer periphery of the insulator 4 of the power cable 2. In this case, the cable semiconductive layer 5
Is applied to the surface of the insulator 4 in the vicinity of the terminal. Then
The connection device 18 is inserted into the power cable 2 together with the device-side semiconductive layer 13. As a result, the surface of the insulator 4 in the void portion of the power cable 2 becomes conductive, and the inner surface of the void becomes the same potential, so that the partial discharge phenomenon in the void can be prevented.

【0010】上記の実施形態は終端接続部に適用したも
のであるが、本発明は電力ケーブルの中間接続部その他
の接続部に適用することも可能である。また、導体外周
の絶縁体の外周に半導電層を備えた電気ケーブルであれ
ば、電力ケーブル以外の電気ケーブルにも適用すること
ができる。
Although the above embodiment is applied to the terminal connection, the present invention can also be applied to the intermediate connection and other connection of the power cable. In addition, the present invention can be applied to an electric cable other than the power cable as long as the electric cable has a semiconductive layer on the outer periphery of the insulator around the conductor.

【0011】[0011]

【発明の効果】本発明によれば、電気ケーブル2の露出
させた絶縁体4の外周における、ケーブル半導電層5の
端末端面の位置に、柔軟材料からなる導電性または半導
電性のリング20を嵌装するので、ケーブル半導電層5
の端末のボイド(隙間)19が導電性または半導電性の
リング20で埋まることとなり、ボイド19の存在のた
めに生じていた部分放電現象を無くすことができる。ま
た、ケーブル半導電層5の端末近傍部分におけるケーブ
ル絶縁体4の外周面に導電性または半導電性の塗料を塗
布することによっても、同様に部分放電現象の発生を防
止することができる。
According to the present invention, a conductive or semiconductive ring 20 made of a flexible material is provided on the exposed outer periphery of the insulator 4 of the electric cable 2 at the terminal end surface of the cable semiconductive layer 5. So that the cable semi-conductive layer 5
The void (gap) 19 of the terminal is filled with the conductive or semi-conductive ring 20, and the partial discharge phenomenon caused by the existence of the void 19 can be eliminated. Also, by applying a conductive or semiconductive paint to the outer peripheral surface of the cable insulator 4 in the vicinity of the terminal of the cable semiconductive layer 5, the occurrence of the partial discharge phenomenon can be similarly prevented.

【図面の簡単な説明】[Brief description of the drawings]

【図1】本発明の一実施形態の電気ケーブルの半導電層
端末処理方法を示すもので、(イ)は図2の終端接続部
のA部に相当し、(ロ)は接続機器を電力ケーブルに差
し込む際の途中段階の図である。
FIG. 1 shows a method for treating a semiconductive layer terminal of an electric cable according to an embodiment of the present invention, wherein (A) corresponds to a part A of a terminal connection part in FIG. It is a figure in the middle stage at the time of inserting in a cable.

【図2】本発明の適用対象の一例を示すもので、エポキ
シがい管式の終端接続部の部分断面図であり、本発明お
よび従来例に共通である。
FIG. 2 is a partial cross-sectional view showing an example of an object to which the present invention is applied, which is a partial cross-sectional view of an epoxy tube type terminal connection portion, which is common to the present invention and the conventional example.

【図3】従来の半導電層端末処理方法の問題点を説明す
る図であり、図2のA部に相当する。
FIG. 3 is a diagram for explaining a problem of a conventional method for treating a semiconductive layer terminal, and corresponds to a portion A in FIG. 2;

【符号の説明】[Explanation of symbols]

1 終端接続部 2 電力ケーブル(電気ケーブル) 3 導体 4 絶縁体(ケーブル絶縁体) 5 半導電層(ケーブル半導電層) 6 遮蔽層 7 シース 11 導体引出棒 12 絶縁体(機器側絶縁体) 13 半導電層(機器側半導電層) 16 ケーブル保持金具 18 接続機器 19 ボイド 20 導電性または半導電性のリング DESCRIPTION OF SYMBOLS 1 Termination connection part 2 Power cable (Electrical cable) 3 Conductor 4 Insulator (Cable insulator) 5 Semiconductive layer (Cable semiconductive layer) 6 Shielding layer 7 Sheath 11 Conductor lead-out rod 12 Insulator (insulator on device side) 13 Semi-conductive layer (device-side semi-conductive layer) 16 Cable holding bracket 18 Connection device 19 Void 20 Conductive or semi-conductive ring

Claims (2)

【特許請求の範囲】[Claims] 【請求項1】 導体(3)外周の絶縁体(4)の外周に
半導電層(5)を備えた電気ケーブル(2)に、露出さ
せた前記絶縁体(4)および半導電層(5)に接触する
半導電層(13)を備えた接続機器(18)を取り付け
る際の半導電層端末処理方法であって、 露出させた前記絶縁体(4)の外周における、前記電気
ケーブル(2)側の半導電層(5)の端末端面の位置
に、柔軟材料からなる導電性または半導電性のリング
(21)を嵌装して、接続機器(18)を電気ケーブル
(2)に取り付けることを特徴とする電気ケーブルの半
導電層端末処理方法。
An electric cable (2) provided with a semiconductive layer (5) on the outer periphery of an insulator (4) on the outer periphery of a conductor (3) is exposed to the insulator (4) and the semiconductive layer (5). ), Wherein the connecting device (18) provided with the semiconductive layer (13) that comes into contact with the electrical cable (2) is mounted on the outer periphery of the exposed insulator (4). A conductive or semiconductive ring (21) made of a flexible material is fitted to the position of the terminal end face of the semiconductive layer (5) on the side of ()), and the connection device (18) is attached to the electric cable (2). A method for treating a semiconductive layer of an electric cable.
【請求項2】 導体(3)外周の絶縁体(4)の外周に
半導電層(5)を備えた電気ケーブル(2)に、露出さ
せた前記絶縁体(4)および半導電層(5)に接触する
半導電層(13)を備えた接続機器(18)を取り付け
る際の半導電層端末処理方法であって、 露出させた前記絶縁体(4)の外周における、前記電気
ケーブル(2)側の半導電層(5)の端末近傍部分に、
導電性または半導電性塗料を塗布して、接続機器(8)
を電気ケーブル(2)に取り付けることを特徴とする電
気ケーブルの半導電層端末処理方法。
2. An electric cable (2) provided with a semiconductive layer (5) on the outer periphery of an insulator (4) on the outer periphery of a conductor (3), the insulator (4) and the semiconductive layer (5) being exposed. ), Wherein the connecting device (18) provided with the semiconductive layer (13) that comes into contact with the electrical cable (2) is mounted on the outer periphery of the exposed insulator (4). )) Near the terminal of the semiconductive layer (5),
Applying conductive or semiconductive paint to connect equipment (8)
Is attached to an electric cable (2).
JP11212370A 1999-07-27 1999-07-27 Method of terminating semiconductor layer of electric cable Pending JP2001045624A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP11212370A JP2001045624A (en) 1999-07-27 1999-07-27 Method of terminating semiconductor layer of electric cable

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP11212370A JP2001045624A (en) 1999-07-27 1999-07-27 Method of terminating semiconductor layer of electric cable

Publications (1)

Publication Number Publication Date
JP2001045624A true JP2001045624A (en) 2001-02-16

Family

ID=16621450

Family Applications (1)

Application Number Title Priority Date Filing Date
JP11212370A Pending JP2001045624A (en) 1999-07-27 1999-07-27 Method of terminating semiconductor layer of electric cable

Country Status (1)

Country Link
JP (1) JP2001045624A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN100421322C (en) * 2001-12-28 2008-09-24 盟友技研株式会社 Method and device for working electric connection terminal in coaxial cable

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN100421322C (en) * 2001-12-28 2008-09-24 盟友技研株式会社 Method and device for working electric connection terminal in coaxial cable

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