JP2001044677A - Heat radiating structure of electronic equipment - Google Patents

Abstract

PROBLEM TO BE SOLVED: To form the case of electronic equipment, such as the electronic organizer, etc., having a heat radiating property only of a resin. SOLUTION: In both resin cases 1 and 2, a circuit board 6, a liquid crystal display panel 7, and a touch panel 8 are successively provided from the bottom side. An IC chip 9 is mounted on a prescribed spot of the upper surface of the circuit board 6. In the cover housing section 4 of the upper case 2, a cover 11 constituted in a foldable shutter structure is housed. The cover 11 is composed of a plurality of metallic sheets 11a, and the lowermost metallic plate 11a is connected to the IC chip 9 through a heat pipe 12.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

The present invention relates to a heat dissipation structure for electronic equipment.

[0002]

2. Description of the Related Art In recent years, mobile communication devices that can be connected to a notebook-type personal computer and a host have been used, and these devices require an increased amount of data to be controlled. Development for speeding up the control operation is being rapidly promoted. In general, such electronic devices have a sealed structure in which a circuit board is provided in a case and a liquid crystal display panel and a touch panel are provided above the circuit board. As a result, the amount of heat generated by the control IC chip increases, and it is necessary to employ a heat dissipation structure in the device. Conventionally, as such a heat radiation structure, for example, there is a structure in which a case is made of metal and heat radiated from an IC chip is radiated and cooled by the metal case.

[0003]

However, in a conventional electronic device having such a heat dissipation structure, the material of the case is limited to metal, which not only impairs the tactile sensation at the time of use or at the time of carrying, but also reduces the case of the resin case. There is a fatal defect that it is difficult to adopt various designs.
In this case, it is possible to form a case in which the metal plate is integrally formed with the resin. However, if the resin is outside, the heat dissipation is lost, so that the area of the resin cannot be increased, and the above-described drawbacks can be avoided. Is not fundamentally solved. It is an object of the present invention to provide a case that can be formed only of a resin while having heat dissipation properties.

[0004]

According to the present invention, there is provided an electronic apparatus comprising a resin case in which a control IC chip is disposed and a metal cover, wherein the control IC chip and the cover are connected to each other. They are connected via a heat pipe or a heat conductive sheet. According to the present invention, since the control IC chip arranged in the case and the metal cover are connected via the heat pipe or the heat conductive sheet, the metal cover can be used as a heat radiating member. Therefore, the case can be formed only of resin while having heat dissipation.

[0005]

FIG. 1A is a cross-sectional view of an electronic device such as a mobile communication device capable of exchanging data by connecting to a notebook personal computer or a host according to an embodiment of the present invention. Specifically, a cross-sectional view of a state where a cover of a main part of the electronic device is closed is shown, and FIG. 1B is a cross-sectional view of a state where the cover is opened. This electronic device includes a lower case 1 and an upper case 2 made of resin.
An opening 3 for operation and display is provided in the center of the upper case 2. A cover storage unit 4 is provided at a predetermined location in the upper case 2. A plurality of small heat radiation holes 5 are provided in the upper case 2 above the cover storage portion 4.

In both cases 1 and 2, a circuit board 6, a liquid crystal display panel 7, and a touch panel 8 are provided in this order from the bottom. An IC chip 9 is mounted on the upper surface of the circuit board 6. Although a plurality of IC chips are built in the device, only one IC chip 9 for high-speed drive control is typically shown in FIG. A cover 1 having a foldable shutter structure is provided in a cover storage portion 4 of the upper case 2.
1 is stored. The cover 11 is composed of a plurality of metal plates 11 made of Al or Mg having a high thermal conductivity.
The lowermost metal plate 11a is fixed to a predetermined position in the cover storage unit 4. The lowermost metal plate 11a is connected to the heat pipe 12, and the IC chip 9 is connected to the heat pipe 12 directly or via a metal (not shown) having good thermal conductivity. As is generally known, the heat pipe 12 is provided with a fine net-like metal film called a wick in a metal pipe having good heat conductivity, and depressurizing the inside of the pipe, A small amount of hydraulic fluid is sealed.

As described above, in this electronic device, the IC chip 9 and the metal cover 1 provided in the two cases 1 and 2 are provided.
1 is connected via the heat pipe 12, so that the metal cover 11 can be used as a heat radiating member. That is, the heat generated from the IC chip 9 evaporates the working fluid sealed in the pipe of the heat pipe 12, thereby generating a pressure gradient of steam in the pipe and transferring the heat as a substance. Its thermal conductivity is several hundred to several thousand times more efficient than with metal. The gas that has moved toward the metal cover 11 due to the pressure gradient is condensed by being cooled through the metal cover 11, and is returned by the wick capillary action. As described above, since the heat transfer by the heat pipe 12 is high in efficiency, the two cases 1 and 2 can be formed only of resin, and sufficient heat radiation can be achieved even if the area of the metal cover 11 is small.

By the way, when using this electronic device,
As shown in FIG. 1B, the cover 11 is opened, and all of the opened cover 11 is stored in the cover storage unit 4. 5 is provided, heat radiation from the cover 11 can be improved.

[0009] Instead of the heat pipe 12, a heat conductive sheet may be used. Also, the cover 11
Instead of a foldable shutter structure, an ordinary single-plate shutter may be used.

[0010]

As described above, according to the present invention, the control IC chip disposed in the case and the metal cover are connected via the heat pipe or the heat conductive sheet. Cover can be used as a heat dissipating member, so that it has heat dissipating properties and the case can be formed only of resin.

[Brief description of the drawings]

FIG. 1A is a cross-sectional view of a state where a cover of a main part of an electronic device according to an embodiment of the present invention is closed, and FIG. 1B is a cross-sectional view of a state where a cover is opened.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Lower case 2 Upper case 4 Cover storing part 5 Small hole for heat dissipation 6 Circuit board 7 Liquid crystal display panel 8 Touch panel 9 IC chip 11 Cover 12 Heat pipe

──────────────────────────────────────────────────続 き Continued on the front page (51) Int.Cl. ⁷ Identification symbol FI Theme coat ゛ (Reference) H01L 23/467 H01L 23/46 D

Claims (3)

[Claims] 1. An electronic apparatus comprising a resin case in which a control IC chip is disposed and a metal cover, wherein the control IC chip and the cover are connected via a heat pipe or a heat conductive sheet. A heat dissipation structure for electronic devices, wherein the heat dissipation structure is connected. 2. A heat dissipation structure for an electronic device according to claim 1, wherein said cover has a foldable shutter structure. 3. The heat dissipation structure for an electronic device according to claim 2, wherein a heat dissipation hole communicating with a cover storage portion in the case is provided on an upper surface side of the case.