JP2001043739A - Electrode - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide assembling workability of a substrate by taking a positioning part as a positioning claw, having the tip to be brought into pressure-contact with the inner wall of a positioning hole formed on the substrate and to be hooked and fixed to the positioning hole. SOLUTION: An electrode 20 is arranged with a positioning claw 20a aligned with a positioning hole 18 and a bent part aligned with the end surface of a substrate. When the electrode 20 is pressed so as to be bonded to the substrate, the positioning claw 20a is fitted from a V-shaped bent part to the positioning hole 18, and the claw tip is pressed in along the inner wall of the positioning hole 18. Since the claw tip is brought into pressure-contact with the inner wall of the positioning hole 18 and hooked on the inner wall of the positioning hole 18 in relation to the drawing direction, the positioning claw 20a is fixed to the substrate, and therefore, the electrode 20 is prevented from being floated from the substrate. Next, a projecting part 20b of the electrode 20 is soldered.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

[0001] The present invention relates to an electrode to be soldered to a substrate.

[0002]

2. Description of the Related Art A conventional electrode will be described below with reference to the drawings. Elements common to the drawings are assigned the same reference numerals.

FIG. 9 is an exploded perspective view showing a conventional portable electronic device, and FIG. 10 is a sectional view taken along the line AA of FIG. 9 and 10, the portable electronic device 1 includes an upper cover 2, a lower cover 3, and a substrate 4 provided to be covered by the upper cover 2 and the lower cover 3. Part of the upper cover 2 and part of the lower cover 3 are opposed to each other when they are assembled.
a notch 2a and the notch 3
When the memory card 12 is opposed to a, the hole becomes a hole for inserting the memory card 12 into the portable electronic device 1.

[0006] A holder guide 5 is formed inside the upper cover 2, and a hole 6 is formed in the substrate 4 for receiving an electrode positioning claw, which will be described later. An electrode pad 7 is provided. An electrode 8 is provided on the substrate 4, and a positioning claw 8 a
Is placed in a state where the position in the planar direction on the substrate 4 is determined. The electrode 8 is fixed by clamping the substrate 4 and the electrode 8 against the floating in the thickness direction.

[0005] A coin-type battery 9, a battery holder 10, and a holder guide 5 are provided on the electrode 8. Then, the soldering of the electrode 8 is performed at the protrusion 8 b formed on the electrode 8. The coin-type battery 9 and the battery holder 10
Then, the soldering work is performed after covering the non-soldering area R with a masking tape (not shown) so that the solder 11 does not interfere with the holder guide 5. After soldering, dimension measurement is performed on the upper cover 2 to check whether the height H of the solder 11 is as high as the limit.

[0006]

When the above-mentioned conventional electrodes are soldered to a substrate, the electrodes are clamped to fix the electrodes to the substrate, or a masking tape is applied to the non-soldering area R, and then the soldering operation is performed. And the work of measuring the dimensions of the height of the solder is required, so that the workability of assembling the substrate is poor. And as a result,
There was a problem that the product cost was increased.

[0007]

According to a first aspect of the present invention, there is provided a positioning device having a positioning portion and a soldering portion, wherein the positioning portion is provided in a positioning hole formed in a substrate. The position on the substrate is determined by being fitted, and the soldering portion is placed on the electrode pad provided on the substrate, and the soldering portion is soldered to the electrode pad. In the electrode to be soldered on the substrate, the positioning portion is a positioning claw that is caught and fixed in the positioning hole by the tip portion being in pressure contact with the inner wall of the positioning hole formed in the substrate. There is something.

A second solution provided by the present invention for solving the above-mentioned problem is that the positioning means includes a positioning part and a soldering part, and the positioning part is fitted into a positioning hole formed in the substrate. The position on the substrate is determined by the above, and the soldering portion is placed on the electrode pad provided on the substrate, and the soldering portion is soldered to the electrode pad, thereby soldering on the substrate. In the electrode to be formed, the soldering portion is provided with a protrusion whose height is set to a height that defines the height of the solder and that blocks the flow of the solder flowing through the soldering portion. is there.

According to the configuration of the first solution, the positioning claw is fitted into the hole formed in the substrate before soldering. Then, the tip of the positioning claw presses against the inner wall of the positioning hole, and the hooking electrode is fixed to the substrate.

According to the configuration of the second solving means, at the time of soldering, the solder flows to the electrode pad and the soldered portion of the electrode. Then, the solder flowing on the electrode pad stops flowing within a range where the electrode pad exists, and the solder flowing on the soldering portion is blocked by the ejection and stopped flowing. Thus, it is possible to prevent the solder from flowing on the electrode to the non-soldering area. Also, the height of the solder pile can be easily confirmed from the setting of the height of the protrusion.

[0011]

Embodiments of the present invention will be described below with reference to the drawings. Elements common to the drawings are assigned the same reference numerals.

[0012] First Embodiment FIG. 1 partially enlarged view showing the electrodes of the first embodiment, FIG. 2
FIG. 3 is an exploded perspective view showing the portable electronic device according to the first embodiment, FIG. 3 is a sectional view taken along the line BB of FIG. 2, and FIG. 4 is a partially enlarged view showing an electrode according to the first embodiment. 5 is a cross-sectional view showing a part of the projection of the conventional electrode, and FIG. 6 is a cross-sectional view showing a part of the projection of the electrode of the first embodiment. 2, 3,
4, the portable electronic device 13 includes an upper cover 14, a lower cover 15, and a substrate 16 provided to be covered by the upper cover 14 and the lower cover 15.
A notch 14a and a notch 15a are formed at positions facing each other when the upper cover 14 and the lower cover 15 are assembled, respectively.
a and the notch 15a are opposed to each other, and serve as a hole for inserting the memory card 22 into the portable electronic device 13.

A holder guide 17 is provided inside the upper cover 14.
The substrate 16 is formed with a positioning hole (hereinafter simply referred to as a hole) 18 into which a positioning claw that is an electrode positioning portion described later is fitted, and is formed of a metal member. An electrode pad 19 for soldering an electrode partially in contact with the hole 18 is provided.
The substrate 16 is provided with an electrode 20, which is a metallic member,
0 is placed in a state where the position on the substrate 16 is determined by fitting a positioning claw described later into the hole 18.

On the electrode 20, a coin-type battery 21, a battery holder 22, and a holder guide 17 are provided.

The electrode 20 has a projection 20b which is a soldering portion for soldering.
Is mounted on the electrode pad 19 when the electrode 20 is mounted on the substrate 16. Further, as shown in FIG.
The electrode pad 1 of the holder guide 17 in the range of b
Holder guide 1 of end 17a on the 9 side and pad 19 for electrode
In the space L between the end portion 19a on the 7th side, a projection 20c as a projecting portion is formed. The height J of this launch 20c
Is arbitrary within a range allowed in view of the dimensional relationship with the upper cover 14. The bending start position 20d of the embossing 20c
Is formed to be slightly inside the space L, that is, to be within the range of the space L.

In FIG. 4, a positioning claw 20a is formed substantially at the center of the projection 20b, and the positioning claw 20a is continuous from the inclined surface of the punch 20c.
A V-shaped bent portion 20e is formed in a direction opposite to the above-mentioned embossing 20c.
A first bent portion 20f formed to extend to the first bent portion 20e, and a claw tip portion 20g, which is a return portion, which is bent in the opposite direction to the first bent portion 20f at the V-shaped bent portion 20e and extends. I have. The first bend 20f is located at a position that does not penetrate the hole 18 at the time of mounting.
And the claw tip 2
0 g is processed so as not to protrude from the hole 18 at the time of mounting. Further, by forming the positioning claw 20a, a hole 20h is formed in the electrode 20. Further, as shown in FIG. 2, the electrode 20 has a bent portion 20 which is joined to an end face of the substrate 16 when the electrode 20 is soldered to the substrate 16.
j is formed.

Next, the electrode 20 having the above configuration is connected to the substrate 16.
The operation when soldering is described. First, the electrode 20 is inserted into the hole 18 as shown in FIG.
The bent portion 20j is arranged on the substrate 20 so as to match the end surface of the substrate 16. When the electrode 20 is pressed so as to be in close contact with the substrate 16, the positioning claw 20a is fitted into the hole 18 from the V-shaped bent portion 20e, and then the claw tip 20g is fitted into the hole 1
8 along the inner wall. 20g of nail tip is hole 18
20g in contact with the inner wall of the claw in a press-contact state.
As it gets caught on the inner wall of the hole 18 in the direction of pulling out,
The positioning claws 20 a are fixed to the substrate 16, and the electrodes 20 are prevented from floating from the substrate 16.

Next, the projection 20b of the electrode 20 is soldered. Then, the solder 23 is attached to the electrode pad 19 and the projection 20.
It flows over b. Since the solder 23 flows only in the metal portion, the flow of the solder 23 flowing on the electrode pad 19 is stopped within a range where the electrode pad 19 exists. At this time, the bending start position 20d of the embossing 20c is the electrode pad 1
Since the solder 23 does not exist, the solder 23 does not enter the back side of the embossed portion 20c from the electrode pad 19, and does not enter the non-soldering area R along the back side of the embossed portion 23c.

On the other hand, the solder 23 flowing on the protrusion 20b
As long as an appropriate amount is supplied, it flows to the ejection 20c, and the flow is blocked by the ejection 20c. At this time, the height H of the solder 23 is lower than the height J of the embossed portion 20c, or substantially equal to the height J of the embossed portion 20c. Accordingly, if the height of the embossed portion 26c is set to a predetermined height, it is possible to determine whether or not the height of the solder 23 is the limit height without measuring the size of the height of the solder 23.
Further, the solder 23 flowing on the projection 20b also flows onto the electrode pad 19 from a hole 20h formed by forming the positioning claw 20a, and as shown in FIG.
As shown in FIG. 6, the bonding area between the solder 23 and the electrode pad 19 can be increased as compared with the case where there is no h.

As described above, in the first embodiment, the electrode 2
The positioning claw 20a of the substrate 16 is V-shaped, and the hole 1 of the substrate 16 is formed.
Since the claw tip 20g is in pressure contact with the inner wall of 8 and does not easily get caught and caught easily, clamping work between the electrode 20 and the substrate 16 becomes unnecessary, and improvement in workability and cost reduction can be expected.

Also, since a structure is employed in which a part of the electrode 20 is punched out to block the solder 23 flowing on the surface of the electrode 20, the solder 2
(3) The work of attaching the masking tape to the unacceptable area becomes unnecessary, and improvement in workability and cost reduction can be expected.

Since the height of the solder 23 can be easily confirmed by setting the height of the projection of the electrode 20, it is not necessary to measure the height of the solder 23, thereby improving workability. In addition, cost reduction can be expected.

Further, since the positioning claw 20a is formed integrally from the protruding portion 20b, the solder 23 flows into the electrode pad 19 from the punched hole 20h, thereby increasing the bonding area and increasing the soldering area. We can expect strength up.

Second Embodiment Next, a second embodiment will be described. The same parts as those in the first embodiment are denoted by the same reference numerals, and description thereof will be omitted. FIG. 7 is a partial cross-sectional view illustrating a portable electronic device according to the second embodiment, and FIG. 8 is a partially enlarged view illustrating an electrode according to the second embodiment. In the second embodiment, since the structure of the electrode 26 of the portable electronic device 25 is different from that of the first embodiment, only the structure of the electrode 26 will be described.

In FIG. 7 and FIG.
6 is placed in a state where the position on the substrate 16 is determined by fitting a positioning claw (described later) of the electrode 26 into the hole 18.

On the electrode 26, a coin-type battery 21, a battery holder 22, and a holder guide 17 are provided as in the first embodiment.

The electrode 2 has a projection 2 for soldering.
6b are formed. The protruding portion 26b is mounted on the electrode pad 19 when the electrode 26 is mounted on the substrate 16, and is located within the range of the protruding portion 26b on the electrode guide 19 side end of the holder guide 17 shown in FIG. An embossed portion 26c is formed in a space L between the portion 17a and the end portion 19a of the electrode pad 19 on the holder guide 17 side. This launch 2
The height of 6c is arbitrary within a range allowed due to the dimensional relationship with the upper cover 14. Also, the bending start position 26d of the embossing 26c is slightly inside the space L,
That is, it is formed so as to be within the range of the space L.

In FIG. 8, a positioning claw 26a is formed substantially at the center of the projection 26b, and the positioning claw 26a is continuous from the inclined surface of the punch 26c.
It is formed so as to extend in the opposite direction to the above-mentioned embossing 26c. The positioning claw 26a is processed so as not to penetrate the hole 18 at the time of mounting, and the tip is formed in an arrowhead shape. The maximum width W of the arrowhead-shaped portion is set to be the same as or slightly larger than the diameter D of the hole 18. By forming the positioning claws 26a, a hole 26h is formed in the electrode 26. Further, the electrode 26 is formed with a bent portion (not shown) that is joined to an end face of the substrate 16 when the electrode 26 is soldered to the substrate 16.

Next, the electrode 26 having the above structure is connected to the substrate 16.
The operation when soldering is described. First, the electrode 26 is arranged on the substrate 20 in such a manner that the positioning claw 26a is aligned with the hole 18 and the bent portion (not shown) is aligned with the end surface of the substrate 16. When the electrode 26 is pressed so as to be in close contact with the substrate 16, the arrowhead-shaped portion of the positioning claw 26 a is press-fitted along the inner wall of the hole 18. Since the arrowhead-shaped portion comes into contact with the tip of the hole 18 in a press-contact state and is caught, that is, bites,
The positioning claw 26a is fixed to the substrate 16, and the electrode 26 is prevented from floating from the substrate 16.

Next, the projection 26b of the electrode 26 is soldered. Then, the solder 23 is attached to the electrode pad 19 and the projection 26.
It flows over b. The flow of the solder 23 flowing on the electrode pad 19 is stopped within a range where the electrode pad 19 exists. At this time, the bending start position 26d of the embossing 26c
Does not exist in the electrode pad 19, so that the solder 23 does not enter the non-solderable region R from the electrode pad 19 on the back side of the embossing 26c.

On the other hand, the solder 23 flowing on the protrusion 26b
As long as an appropriate amount is supplied, it flows up to the ejection 26c, and the flow is blocked by the ejection 26c. At this time, the height of the solder 23 is lower than the height of the embossed portion 26c or substantially equal to the height of the embossed portion 26c. Thus, if the height of the embossing 26c is set to a predetermined height, the height of the solder 23 can be measured without measuring the height of the solder 23.
Can be determined whether or not the height of the upper limit is the limit height. Further, the solder 23 flowing on the protrusion 26 b is
By flowing the holes 26h formed by forming the holes 6a onto the electrode pads 19, the bonding area between the solder 23 and the electrode pads 19 can be increased as compared with the case where there is no hole 26h.

In the second embodiment, the electrode 2
The positioning claw 26 a of the substrate 16 is made to have an arrowhead shape,
Since the maximum width portion of the arrowhead-shaped portion is pressed against the inner wall of the substrate 8 and is not easily caught, the electrode 26 and the substrate 1
6 becomes unnecessary, and improvement in workability and cost reduction can be expected.

Further, since a structure is employed in which a part of the electrode 26 is punched out to block the solder 23 flowing on the surface of the electrode 26, the solder 2
(3) The work of attaching the masking tape to the unacceptable area becomes unnecessary, and improvement in workability and cost reduction can be expected.

Since the height of the solder 23 can be easily confirmed by setting the height of the projection of the electrode 26, the dimension measurement of the height of the solder 23 becomes unnecessary, and workability is improved. In addition, cost reduction can be expected.

Further, since the positioning claw 26a is formed integrally from the protruding portion 26b, the solder 23 flows into the electrode pad 19 from the formed hole 26h, so that the bonding area increases, and the soldering area is increased. We can expect strength up.

[0036]

As described above in detail, according to the present invention, the positioning portion is hooked and fixed to the positioning hole when the tip portion contacts the inner wall of the positioning hole formed in the substrate in a pressure-contact state. By providing the claws, the positioning claws do not easily come out of the positioning holes, so that clamping work between the electrode and the substrate becomes unnecessary. In addition, the height of the soldering portion is set to a height that defines the height of the solder, and a protrusion for blocking the flow of the solder flowing through the soldering portion is provided. Since the solder flowing on the surface is blocked, it is not necessary to attach a masking tape to a non-soldering area. Furthermore, since the height of the solder can be easily confirmed by setting the height of the protruding portion, it is not necessary to measure the dimension of the height of the solder. As a result, improvement in workability and cost reduction can be expected.

[Brief description of the drawings]

FIG. 1 is a partially enlarged view showing an electrode according to a first embodiment.

FIG. 2 is an exploded perspective view showing the portable electronic device according to the first embodiment.

FIG. 3 is a sectional view taken along a line BB in FIG. 2;

FIG. 4 is a partially enlarged view showing an electrode according to the first embodiment.

FIG. 5 is a cross-sectional view showing a part of a protruding portion of a conventional electrode.

FIG. 6 is a cross-sectional view showing a part of a projection of the electrode according to the first embodiment.

FIG. 7 is a partial cross-sectional view illustrating a portable electronic device according to a second embodiment.

FIG. 8 is a partially enlarged view showing an electrode according to the second embodiment.

FIG. 9 is an exploded perspective view showing a conventional portable electronic device.

10 is a sectional view taken along the line AA of FIG. 9;

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 13 Portable electronic device 16 Substrate 18 Positioning hole 19 Electrode pad 20 Electrode 20a Positioning claw 20b Projection 20c Driving 23 Solder 25 Portable electronic device 26 Electrode 26a Positioning claw 26b Projection 26c Driving

Claims (6)

[Claims] 1. A positioning part and a soldering part, wherein a position on the substrate is determined by fitting the positioning part into a positioning hole formed in the substrate, and an electrode for an electrode provided on the substrate is determined. In an electrode in which the soldering portion is placed on a pad and the soldering portion is soldered to the electrode pad and soldered on a substrate, the positioning portion includes a positioning portion formed on the substrate. An electrode, which is a positioning claw that is caught and fixed in the positioning hole by the tip portion contacting the inner wall of the hole in a press-contact state. 2. A positioning device comprising a positioning portion and a soldering portion, wherein the positioning portion is fitted into a positioning hole formed in the substrate to determine a position on the substrate and an electrode for the electrode provided on the substrate. An electrode which is soldered on a substrate by mounting the soldering portion on a pad and soldering the soldering portion to the electrode pad, wherein the height of the solder is An electrode, wherein the projection is set to a height that defines a height and has a protrusion for blocking a flow of the solder flowing through the soldering portion. 3. A positioning part and a soldering part, wherein a position on the substrate is determined by fitting the positioning part into a positioning hole formed in the substrate, and an electrode for the electrode provided on the substrate is determined. In an electrode in which the soldering portion is placed on a pad and the soldering portion is soldered to the electrode pad and soldered on a substrate, the positioning portion includes a positioning portion formed on the substrate. A positioning claw that is caught and fixed in the positioning hole by the tip portion contacting the inner wall of the hole in a press-contact state, and the height of the soldering portion is set to the height that defines the height of the solder. An electrode provided with a projection that is set and blocks a flow of the solder flowing through the soldering portion. 4. The positioning claw of the electrode, wherein a part of the electrode is cut out and continuously extends from an inclined surface of the projection in a direction opposite to a direction in which the projection is launched. At the time of mounting, it is bent and extended in the opposite direction at a position that does not penetrate the positioning hole, and the bent tip is processed to a length that does not protrude from the positioning hole at the time of mounting. The distal end portion comes into contact with the inner wall of the hole in a press-contact state to be hooked and fixed to the positioning hole, and the through hole formed by forming the positioning claw is positioned on the electrode pad when the electrode is mounted. The electrode according to claim 1 or 3, wherein 5. The positioning claw of the electrode, wherein a part of the electrode is cut out and continuously extends from an inclined surface of the projection in a direction opposite to a launch direction of the projection. It is processed to a length that does not penetrate the positioning hole at the time of mounting, the tip is formed in an arrowhead shape, and the maximum width of the arrowhead portion is the same as the diameter of the positioning hole. Slightly larger dimensions are set, and the inner wall of the positioning hole is brought into contact with the inner wall of the positioning hole in a pressure-contact state, so that the positioning hole is hooked and fixed. 4. The electrode according to claim 1 or 3, wherein the electrode is sometimes positioned on the electrode pad. 6. The protruding portion of the electrode is formed by stamping out a part of a soldered portion of the electrode.
Or the electrode according to 3.