JP2001041647A - Dryer - Google Patents
DryerInfo
- Publication number
- JP2001041647A JP2001041647A JP11218092A JP21809299A JP2001041647A JP 2001041647 A JP2001041647 A JP 2001041647A JP 11218092 A JP11218092 A JP 11218092A JP 21809299 A JP21809299 A JP 21809299A JP 2001041647 A JP2001041647 A JP 2001041647A
- Authority
- JP
- Japan
- Prior art keywords
- conveyor
- cylinder
- hot air
- workpiece
- heating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Abstract
Description
【0001】[0001]
【発明の属する技術分野】本発明は、加熱により製品を
乾燥又は反応させる乾燥装置に関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a drying apparatus for drying or reacting a product by heating.
【0002】[0002]
【従来の技術】従来、図2(a),(b)の通り、フェ
ライト等の電子部品102を多数樹脂塗装し、その両面
を反応させようとする場合、モータ103で回転板10
5を加熱装置104で加熱しながら1回転させ、片面の
樹脂を反応させた後、電子部品102を反転させ他面を
上にして1回転させて反応させていた。また、回転板1
05の裏面を冷却装置106の冷水で冷却していた。2. Description of the Related Art Conventionally, as shown in FIGS. 2 (a) and 2 (b), when a large number of electronic parts 102 such as ferrite are coated with a resin and both surfaces thereof are to be reacted, a motor 103 is used to rotate the rotating plate 10 and the like.
5 was rotated once while being heated by the heating device 104 to react the resin on one side, and then the electronic component 102 was turned over and rotated once with the other side up to react. Rotating plate 1
05 was cooled by the cold water of the cooling device 106.
【0003】[0003]
【発明が解決しようとする課題】したがって、乾燥作業
(反応)に時間を要し、電子部品の多数個の乾燥作業に
時間を要するという問題があった。Accordingly, there has been a problem that a long time is required for a drying operation (reaction) and a long time is required for drying a large number of electronic components.
【0004】そこで、本発明の課題は、乾燥作業の時間
を短縮することにある。[0004] Therefore, an object of the present invention is to reduce the time of the drying operation.
【0005】[0005]
【課題を解決するための手段】上記課題に鑑みなされた
請求項1に記載の発明は、被加工物を搬送するコンベア
と、該コンベアにより搬送される被加工物を加熱する加
熱装置と、前記コンベアの出口に立設された筒と、該筒
の下部に設けた水槽と、前記筒の上部から下方に又は該
筒の下部から上方に熱風を供給する熱風供給装置と、を
備えたことを特徴とする乾燥装置である。これにより、
被加工物を短時間で乾燥(反応)させることができ、上
記課題が好適に解決できる。SUMMARY OF THE INVENTION In view of the above problems, the invention according to claim 1 includes a conveyor for transporting a workpiece, a heating device for heating the workpiece transported by the conveyor, A cylinder erected at an outlet of the conveyor, a water tank provided at a lower part of the cylinder, and a hot air supply device for supplying hot air downward from an upper part of the cylinder or upward from a lower part of the cylinder. It is a drying apparatus characterized by the following. This allows
The workpiece can be dried (reacted) in a short time, and the above problem can be suitably solved.
【0006】ここで、熱風供給装置は、ヒータ、熱風装
置など様々な加熱装置が挙げられる。被加工物は、代表
的には電子部品(フェライト等)であり、大量の乾燥作
業を短時間で行うには極めて好都合である。Here, the hot air supply device includes various heating devices such as a heater and a hot air device. The workpiece is typically an electronic component (e.g., ferrite), which is extremely convenient for performing a large amount of drying work in a short time.
【0007】請求項2記載の発明は、被加工物が樹脂を
塗布されるものであり、該樹脂の反応温度には近いが該
反応温度より低い温度に到るまで前記被加工物を前記加
熱装置が加熱することを特徴とする請求項1記載の乾燥
装置である。これにより予め反応温度に近づけておくこ
とで、反応が短時間で終了できる。According to a second aspect of the present invention, a workpiece is coated with a resin, and the workpiece is heated until a temperature close to, but lower than, the reaction temperature of the resin is reached. The drying device according to claim 1, wherein the device is heated. Thus, by bringing the temperature close to the reaction temperature in advance, the reaction can be completed in a short time.
【0008】[0008]
【発明の実施の形態】以下、図1を参照して本発明の実
施形態である乾燥装置1を説明する。この乾燥装置1
は、フェライト製の電子部品2を搬送するコンベア3
と、コンベア3上部に配置され、コンベア3により搬送
される電子部品2を加熱するヒータを備えた加熱装置4
と、コンベア3の出口付近に立設され電子部品2を自然
落下させて反応させることができる筒5と、筒5の下部
に設けた常温水を貯留した水槽6と、筒5の下部に接続
され上方に熱風を供給する管7を備えた熱風供給装置8
と、を備えたことを特徴とするものである。ここで、筒
5の上部には排気口が設けられ、管7から供給された熱
風を排出することができるようになっている。ここで、
反応とは、硬化剤と主剤の入った樹脂材料の硬化を促進
させるためのものである。エポキシ樹脂、ポリエステル
樹脂等が対象となる。熱硬化性の樹脂は化学反応、熱可
塑性は樹脂塗装の場合、溶融反応である。また、めっき
後のベーキング処理、テンパ処理、調湿処理にも好適で
ある。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS A drying apparatus 1 according to an embodiment of the present invention will be described below with reference to FIG. This drying device 1
Is a conveyor 3 for transporting electronic parts 2 made of ferrite.
And a heating device 4 provided above the conveyor 3 and provided with a heater for heating the electronic components 2 conveyed by the conveyor 3
And a tube 5 erected near the outlet of the conveyor 3 and capable of allowing the electronic component 2 to naturally fall and react, a water tank 6 provided at the lower portion of the tube 5 for storing room-temperature water, and connected to the lower portion of the tube 5 Hot air supply device 8 provided with a pipe 7 for supplying hot air upward
And characterized in that: Here, an exhaust port is provided in the upper part of the cylinder 5 so that the hot air supplied from the pipe 7 can be discharged. here,
The reaction is for accelerating the curing of the resin material containing the curing agent and the main agent. Epoxy resins, polyester resins, etc. are targeted. Thermosetting resin is a chemical reaction, and thermoplasticity is a melting reaction in the case of resin coating. It is also suitable for baking, tempering, and humidity control after plating.
【0009】<乾燥装置1の動作>この乾燥装置1に入
る前に電子部品2は前工程で被加工物が樹脂を塗布され
る。この樹脂の反応温度には近いが反応温度より低い温
度に上昇するまで電子部品2を加熱装置4が加熱する。
具体的には反応する前の温度(反応温度が150度とす
ると145度)で前加温を行い反応時間を短縮させる。
コンベア3から放出された電子部品2は筒5の内部空間
を落下し、熱風供給装置8で加熱した温風は下から吹き
あげており、この熱風が電子部品を加熱し反応させると
ともに表面を乾燥させる。自然落下筒5内は300度程
度の熱風であり、電子部品2の温度は145度から40
度程度上がり、筒5の出口では185度程度となり、そ
して、水槽6に落下し常温水で冷却される。<Operation of Drying Apparatus 1> Before entering the drying apparatus 1, a work is applied to the electronic component 2 in a pre-process by applying a resin. The heating device 4 heats the electronic component 2 until the temperature rises to a temperature close to the reaction temperature of the resin but lower than the reaction temperature.
Specifically, preheating is performed at a temperature before the reaction (145 degrees when the reaction temperature is 150 degrees) to shorten the reaction time.
The electronic components 2 discharged from the conveyor 3 fall in the internal space of the cylinder 5, and the hot air heated by the hot air supply device 8 blows up from below, and the hot air heats the electronic components to react and dry the surface. Let it. The inside of the natural fall tube 5 is hot air of about 300 degrees, and the temperature of the electronic component 2 is from 145 degrees to 40 degrees.
About 185 degrees at the outlet of the cylinder 5, and then falls into the water tank 6 and is cooled by room temperature water.
【0010】<乾燥装置1の効果>乾燥装置1は、電子
部品2を自然落下させるうちに反応させ乾燥させるの
で、図2の従来例と比較して乾燥作業の時間を短縮でき
る。<Effects of Drying Apparatus 1> The drying apparatus 1 reacts and dries the electronic components 2 while they fall naturally, so that the time required for the drying operation can be reduced as compared with the conventional example shown in FIG.
【0011】なお、本発明は、上述の実施の形態又は実
施例に限定されるものではなく、本発明の技術的思想を
逸脱しない範囲に於て、改変等を加えることが出来るも
のであり、それらの変更等も本発明の技術的範囲に含ま
れることとなる。被加工物は中空又は中実いずれでも適
用できる。例えば、熱風を上方から下方に吹き降ろすよ
うにしても良い。It should be noted that the present invention is not limited to the above-described embodiments or examples, but may be modified without departing from the technical idea of the present invention. Such changes are also included in the technical scope of the present invention. The workpiece can be applied either hollow or solid. For example, hot air may be blown down from above.
【0012】[0012]
【発明の効果】請求項1及び2に記載の発明によれば、
乾燥装置の乾燥作業時間が短縮できる。According to the first and second aspects of the present invention,
The drying operation time of the drying device can be reduced.
【図1】本発明の実施の形態の乾燥装置を示す正面図で
ある。FIG. 1 is a front view showing a drying device according to an embodiment of the present invention.
【図2】(a)は従来例の乾燥装置の平面図、(b)は
同正面図である。FIG. 2A is a plan view of a conventional drying apparatus, and FIG. 2B is a front view thereof.
1…乾燥装置 2…フェライト 3…コンベア 4…加熱装置 5…筒 6…水槽 7…管 8…熱風供給装置 DESCRIPTION OF SYMBOLS 1 ... Drying device 2 ... Ferrite 3 ... Conveyor 4 ... Heating device 5 ... Tube 6 ... Water tank 7 ... Pipe 8 ... Hot air supply device
Claims (2)
置と、 前記コンベアの出口に立設された筒と、 該筒の下部に設けた水槽と、 前記筒の上部から下方に又は該筒の下部から上方に熱風
を供給する熱風供給装置と、 を備えたことを特徴とする乾燥装置。1. A conveyor for transporting a workpiece, a heating device for heating the workpiece transported by the conveyor, a cylinder erected at an outlet of the conveyor, and a water tank provided below the cylinder And a hot air supply device for supplying hot air downward from the upper part of the cylinder or upward from the lower part of the cylinder.
り、該樹脂の反応温度には近いが該反応温度より低い温
度に到るまで前記被加工物を前記加熱装置が加熱するこ
とを特徴とする請求項1記載の乾燥装置。2. The method according to claim 1, wherein the workpiece is coated with a resin, and the heating device heats the workpiece until a temperature close to, but lower than, the reaction temperature of the resin is reached. The drying device according to claim 1, wherein
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP11218092A JP2001041647A (en) | 1999-07-30 | 1999-07-30 | Dryer |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP11218092A JP2001041647A (en) | 1999-07-30 | 1999-07-30 | Dryer |
Publications (1)
Publication Number | Publication Date |
---|---|
JP2001041647A true JP2001041647A (en) | 2001-02-16 |
Family
ID=16714514
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP11218092A Pending JP2001041647A (en) | 1999-07-30 | 1999-07-30 | Dryer |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP2001041647A (en) |
-
1999
- 1999-07-30 JP JP11218092A patent/JP2001041647A/en active Pending
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