JP2001038913A - Manufacture of ink-jet head - Google Patents

Abstract

PROBLEM TO BE SOLVED: To obtain an ink-jet head of a superior ink droplet discharge stability by masking front and rear entire faces of a nozzle hole form member with a dry film resistor, forming a water-repellent planted coat by nickel eutectic plating and removing the masking. SOLUTION: A nozzle hole form member 61 is formed by electroforming, and a negative type dry film resistor(DFR) 63 is thermo compression bonded to a rear face. At this time, the DFR 63 extrudes from nozzle holes 62 to the side of a front face of the nozzle hole from member 61, thereby forming extrude pats 63a. Also a DFR 64 is thermo compression pressure bonded to the side of an ink discharge face of the nozzle hole from member 61. The nozzle hole from member 61 is exposed from the side of an ink liquid chamber, whereby a setting DFR 65 for masking the inside of nozzle holes 62 and an entire face of the side of the ink liquid chamber is formed. A water-repellent planted coat 66 is formed to the side of the ink discharge face of the nozzle hole form member 61. The water-repellent coat 66 can be formed by eutectic plating with a fluorocarbon resin particles fine particles dispersed. The coat is formed in a thickness of 1.5 μm or more with a content, a water repellency and a wiping resistance of the fluorine fine particles taken into consideration.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method of manufacturing an ink jet head, and more particularly to a method of manufacturing an ink jet head having a water repellent film formed on a surface of a nozzle hole forming member.

[0002]

2. Description of the Related Art In general, an ink jet head in an ink jet recording apparatus used for an image recording apparatus (including an image forming apparatus) such as a printer, a facsimile, a copying machine, a plotter, and the like includes a nozzle forming member having a plurality of nozzles formed therein; An ink liquid chamber to which each nozzle communicates, an electromechanical conversion element such as a piezoelectric element for pressurizing ink in each ink liquid chamber, or an electrothermal conversion element such as a heater, and energy generating means such as a diaphragm and an electrode. The ink droplets are ejected from the nozzles by pressurizing the ink in the ink liquid chamber with the energy generated by the energy generating means.

Here, a nozzle hole forming member and a method of manufacturing the same are described in JP-A-1-108056 and JP-A-2-1080.
As described in JP-A-121842 and the like, a plate made of an organic resin material having nozzle holes formed by an excimer laser, or Japanese Patent Application Laid-Open No. 63-396.
No. 3, JP-A-1-42939, etc., after forming a resist pattern corresponding to the nozzle diameter using a photosensitive resin material such as a dry film resist on an electroformed support substrate, A nozzle plate is formed by depositing a metal material such as nickel by electroforming using the resist pattern, and a nozzle hole is formed by pressing.

In an ink jet head,
Since recording is performed by ejecting ink droplets (ink droplets) ejected from the nozzle holes, the shape, accuracy, etc. of the nozzle holes affect the ejection characteristics (ink droplet ejection performance) of the ink droplets. The characteristics of the surface of the formed nozzle hole forming member affect the ejection characteristics of ink droplets. For example,
If the ink adheres to the periphery of the nozzle hole on the surface of the nozzle hole forming member and uneven ink accumulation (so-called wetting unevenness) occurs, the ejection direction of the ink droplet is bent or the size of the ink droplet varies. It is known that inconveniences such as an unstable flying speed of ink droplets occur.

[0005] Therefore, as described in, for example, Japanese Patent Application Laid-Open No. 4-294145, an electrolytic nickel nozzle, a press-perforated metal nozzle is provided on the surface (ink ejection surface) of the nozzle hole forming member of such an ink jet head. A water-repellent film (water-repellent film, water-repellent surface treatment) such as a fluorine-based polymer coating film or eutectoid plating film is applied to the surface of a nozzle hole forming member such as a nozzle formed by extruding a polymer material such as polycarbonate or an excimer laser. Film) to impart ink repellency (water repellency), enhance the uniformity of the surface of the nozzle hole forming member, and stabilize the flight characteristics of ink droplets. (In addition, for example, see
43587).

In this case, for example, Japanese Patent Application Laid-Open No. 5-116327
As described in the publication, the entire back surface (surface on the liquid chamber side) other than the periphery of the nozzle hole of the nozzle plate is covered with a resist tape, and the surface of the nozzle plate, the inner wall surface of the nozzle hole, and the periphery of the nozzle hole on the back surface are repelled. Some form an aqueous film.

However, in general, when a water-repellent material penetrates into the inside of the nozzle hole to form a water-repellent film, the ink liquid surface (meniscus surface) of the nozzle hole is drawn deeply into the nozzle hole immediately after the ink is ejected. Occasionally, bubbles are involved, and the ejection direction of the ink droplets varies due to the influence of the bubbles, or the ejection of the ink droplets becomes impossible. Thus, a method of forming a water-repellent film inside the nozzle hole has not been adopted.

Rather, it has been proposed to perform a water-repellent surface treatment so that a water-repellent film is not formed inside the nozzle hole. For example, as described in JP-A-6-143587, urethane foam impregnated with a water-repellent material is brought into contact with the surface of the nozzle hole forming member so as not to enter the inside of the nozzle hole. It is known to form aqueous coatings.

Further, as described in JP-A-7-329303, the surface of the nozzle hole forming member is covered with a masking tape with a water-repellent adhesive and the back surface of the nozzle hole forming member (ink liquid chamber). Surface) and the inner surface of the nozzle hole, a masking tape is peeled off, and the adhesive remaining on the surface of the nozzle hole forming member is heated to form a water-repellent film.

Further, as described in JP-A-7-125220, a fixed amount of a dry film resist is penetrated into a nozzle hole by thermocompression bonding to regulate the amount of a water-repellent film penetrating into the nozzle hole. Some have tried to do so.

Further, as described in JP-A-6-246921, a mask made of a photosensitive resin film is provided inside the nozzle hole, immediately above the nozzle hole, and in a region of about 1.4 times the nozzle diameter around the nozzle hole. In some cases, a water-repellent film is formed by covering the ink liquid chamber surface (back surface) with a resist.

[0012]

However, in the method of forming a water-repellent film using a urethane foam as a method of forming a water-repellent film (water-repellent film), the thickness of the water-repellent film that can be formed is zero. It is about 1 μm. However, in the inkjet head, in order to stabilize the ink ejection direction, the surface of the nozzle forming member is wiped with a blade of silicon rubber or the like before and after the ink ejection. Therefore, the water-repellent film has a thickness of 0.
If it is about 1 μm, the water-repellent film may be worn due to long-term wiping, and the water-repellency may be lost. In addition, in this method, if the thickness of the water-repellent film is to be increased, the water-repellent material enters the inside of the nozzle hole.

In the method using a masking tape with an adhesive having water repellency, when the masking tape is peeled off, the nozzle hole portion can be peeled off in a clean circle along the circumference of the nozzle hole. It is difficult, and the adhesive may block the nozzle hole, or the adhesive may not remain around the nozzle hole, and the water-repellent film may not be formed.
Moreover, when the adhesive is subjected to heat treatment, the adhesive melted by heat may enter the inside of the nozzle hole.

Further, the above-mentioned method using a dry film resist does not aim at preventing the penetration of the water-repellent film into the nozzle holes, and the dry film resist is not removed when the dry film resist is removed after the formation of the water-repellent film. It may remain in the nozzle hole.

Further, in the above-described method of forming a mask made of a photosensitive resin film in the nozzle hole, immediately above the nozzle hole, and in a region of about 1.4 times the nozzle diameter around the nozzle hole, the repellent is formed around the nozzle hole. Since there is no aqueous film, the stability of ink droplet ejection cannot be obtained, and new equipment is required because the photosensitive resin film that blocks the inside of the nozzle hole and the resist that covers the ink liquid chamber surface are different, resulting in cost reduction. Will be higher.

SUMMARY OF THE INVENTION The present invention has been made in view of the above circumstances, and has as its object to provide a method of manufacturing an ink jet head excellent in ink droplet ejection stability at a low cost with a high yield.

[0017]

In order to solve the above-mentioned problems, a method of manufacturing an ink jet head according to the present invention comprises:
Mask the inside of the nozzle hole and just above the front surface side of the nozzle hole and the entire back surface with a negative dry film resist, and perform eutectoid plating in a nickel plating solution in which fine particles of fluororesin are dispersed to form a water-repellent plating film. The film is formed, and then the negative dry film resist is removed.

Here, it is preferable that the negative type dry film resist is removed with an organic solvent-based stripping solution which does not corrode nickel. In this case, the use temperature of the stripping solution is 95 ° C to 1 ° C.
It is preferable that the temperature be in the range of 30 ° C. Further, the immersion time in the stripping solution is preferably in the range of 10 minutes to 20 minutes. Further, it is preferable to apply ultrasonic waves after immersion in the stripping solution. This ultrasonic wave is preferably applied at an output of 200 W to 400 W for 3 to 10 minutes.

[0019]

Embodiments of the present invention will be described below with reference to the accompanying drawings. FIG. 1 is an exploded perspective view of an ink jet head to which the present invention is applied, FIG. 2 is an enlarged cross-sectional view of a main part of the head in a direction orthogonal to a channel direction (nozzle arrangement direction), and FIG. It is an expanded sectional view.

This ink jet head includes a drive unit 1, a liquid chamber unit 2, and a head cover 3. The drive unit 1 has a plurality of laminated piezoelectric elements 12 as energy generating elements arranged in two rows on a ceramic substrate, for example, an insulating substrate 11 such as barium titanate, alumina, or forsterite, and joined. A frame member (liquid chamber supporting member) 13 made of resin, ceramic, or the like surrounding the periphery of each of the two rows of piezoelectric elements 12 is joined by an adhesive 14.

The plurality of piezoelectric elements 12 are provided between piezoelectric elements 17 (to be referred to as "driving units") to which driving pulses for applying ink to form droplets and fly. A piezoelectric element (hereinafter, referred to as a “non-driving unit”) serving as a liquid chamber support member that is located and receives a driving pulse and simply fixes the liquid chamber unit 2 to the substrate 11.
... are alternately configured. Here, the plurality of piezoelectric elements 1
Reference numeral 2 denotes a single piezoelectric element which is formed by dividing a plurality of slits into a plurality of slits by performing slit processing on a single piezoelectric element. A slit groove 11a is formed on the substrate 11 by cutting the piezoelectric element into the substrate 11 during the slit processing.

Here, as the piezoelectric element 12, a laminated piezoelectric element having ten or more layers is used. This laminated piezoelectric element has a thickness of 10 to 50 μm / 1, for example, as shown in FIG.
Layer of lead zirconate titanate (PZT) 20 and a thickness of several μ
An internal electrode 21 made of silver / paradium (AgPd) of m / 1 layer is alternately laminated, but the material used for the piezoelectric element is not limited to the above, and other electromechanical conversion elements may be used. Can also.

The internal electrodes 21 of each piezoelectric element 12 are left and right end electrodes 22 and 23 made of AgPd every other layer (the opposing surfaces of the two piezoelectric element rows are end electrodes 22 and the non-opposing surfaces are end electrodes. 23). On the other hand, as shown in FIG.
Each pattern of the common electrode 24 and the individual electrode 25 is provided by Au plating, AgPt paste printing, AgPd paste printing, or the like.

The opposite end electrodes 22 of each row of the piezoelectric elements 12 are connected to the common electrode 24 via a conductive adhesive 26.
On the other hand, the non-opposing end surface electrodes 23 of the piezoelectric elements 12 in each row are connected to the individual electrodes 25 via the conductive adhesive 26 in the same manner. Thereby, the driving unit 17
When a drive voltage is applied to the drive unit 17, an electric field is generated in the stacking direction, and the driving unit 17 is displaced in the stacking direction (d 33).
Direction displacement) occurs. As shown in FIG. 2, the common electrode 24 has a hole 13a formed in the frame member 13.
By filling the inside with the conductive adhesive 26, the pattern connected to each piezoelectric element is conducted.

On the other hand, the liquid chamber unit 2 comprises a metal thin film and / or
Alternatively, a diaphragm 31 having a multilayer structure composed of a laminate of a metal thin film and a resin film, and a liquid chamber partition member 32 having a two-layer structure composed of a photosensitive resin layer composed of a dry film resist (DFR)
And a nozzle plate 33 made of metal, resin, or the like, are sequentially laminated, and are formed by heat fusion. These members provide a pressurized liquid chamber 35 that is pressurized by the piezoelectric element 12 (driving unit 17) via the diaphragm 34, and a pressurized liquid chamber 35 located on both sides of the pressurized liquid chamber 35. Common liquid chambers 36, 36 for introducing ink to be supplied, and ink supply paths 37, 3 for communicating between the pressurized liquid chamber 35 and the common liquid chambers 36, 36.
7 are formed.

The diaphragm 31 is made of a nickel plating film having a two-layer structure, and is formed integrally with the diaphragm portion 34 corresponding to the driving portion 17 and at the center of the diaphragm portion 34 for joining with the driving portion 17. Corresponding to the island-shaped convex portion 40, the partition wall portion 41 which becomes a beam to be joined to the non-driving portion 18 and makes each channel (nozzle) independent, the peripheral thick portion 42 to be joined to the frame member 13, and the common liquid chamber 36. An elastic body portion (damper portion) 43 that absorbs the pressure applied is formed.

The liquid chamber partition member 32 is formed by applying a dry film resist on the diaphragm 31 side in advance, exposing it using a required mask, and developing it to form a first liquid chamber pattern.
The photosensitive resin layer 45 and the second photosensitive resin layer 46 on which a dry film resist is applied in advance on the nozzle plate 33 side, exposed using a required mask, and developed to form a predetermined liquid chamber pattern are heated. It is joined by crimping.

A large number of nozzles 38 are formed on the nozzle plate 33 as fine discharge ports for ejecting ink droplets, and a water-repellent film 47 is formed on the ink discharge surface (nozzle surface side) as shown in FIG. The film has been formed.

The nozzle hole forming member (base material for forming the water repellent film 47) of the nozzle plate 33 is formed of a nickel plating film by an electroforming (electroforming) method. In addition, a resin obtained by subjecting a resin such as polyimide to excimer laser processing, or a metal plate obtained by forming a hole by press working can also be used.

The water-repellent coating 47 is formed by electrolytic or electroless nickel eutectoid plating (PTFE-N) in which fine particles of polytetrafluoroethylene, which are fine particles of fluororesin, are dispersed.
(i-eutectoid plating).

The drive unit 1 and the liquid chamber unit 2
After processing and assembling separately, the vibration plate 31 of the liquid chamber unit 2 and the piezoelectric element 12 and the frame member 13 of the drive unit 1 are joined with an adhesive 49.

Then, the substrate 11 is supported and held on a spacer (head holder) 50 as a head support member, and a PCB substrate having a head driving IC and the like disposed in the spacer 50 and each of the drive unit 1 are provided. The electrodes 24 and 25 connected to the piezoelectric element 12 (drive unit 17) are connected via FPC cables 51 and 51.

The nozzle cover (head cover) 3
Is formed in a box shape that covers the periphery of the nozzle plate 33 and the side surface of the head, and is bonded to the periphery of the nozzle plate 33 with an adhesive. Further, this ink jet head is provided with ink supply holes 52 to 55 in the spacer 50, the substrate 11, the frame member 13, and the vibration plate 31 for supplying ink from an ink cartridge (not shown) to the liquid chamber.

In the ink jet head configured as described above, by applying a drive waveform (pulse voltage of 10 to 50 V) to the drive unit 17 in accordance with the recording signal, displacement of the drive unit 17 in the stacking direction occurs. Diaphragm 31
The pressurized liquid chamber 35 is pressurized through the diaphragm section 34 of the above, and the pressure rises, and ink droplets are ejected from the nozzle 38. At this time, ink flows also in the direction of the ink supply paths 37, 37 leading from the pressurized liquid chamber 35 to the common liquid chamber 36. However, the ink supply paths 37, 37 function as a fluid resistance part and serve as the common liquid chamber 36. , 36 are reduced.

With the end of the ink droplet ejection, the ink pressure in the pressurized liquid chamber 35 decreases, and a negative pressure is generated in the pressurized liquid chamber 34 due to the inertia of the ink flow and the discharge process of the drive pulse. To the ink filling process. At this time, the ink supplied from the ink tank flows into the common liquid chambers 36, 36, and from the common liquid chambers 36, 36 to the ink supply paths 37, 3.
After that, it is filled into the pressurized liquid chamber 35. Then, the vibration of the ink meniscus surface near the outlet of the nozzle 38 is attenuated,
When the ink is returned to the vicinity of the outlet of the nozzle 38 due to surface tension (refill) and reaches a stable state, the operation shifts to the next ink droplet ejection operation.

Next, the method of manufacturing the nozzle plate 33 will be described in detail with reference to FIGS. First, as shown in FIG. 1A, a nozzle hole forming member (a nozzle plate base material) 61 in which a nozzle hole 62 is formed is formed by an electroforming (electroforming) method. By forming the nozzle hole forming member with a metal, a plating method can be adopted for the surface treatment, and by adopting the electroforming method, the nozzle hole becomes tapered, and the nozzle hole and the water-repellent film (repellent film) are formed. The smoothness can be easily achieved by eliminating the step with the holes of the aqueous surface treatment film).

Thereafter, as shown in FIG. 2B, a negative dry film resist (hereinafter referred to as "DFR") 63 is thermocompression-bonded to the back side (ink liquid chamber side) of the nozzle hole forming member 61. The softened negative DFR 63 is extruded from the nozzle hole 62 and protrudes to the surface side (ink ejection surface side) of the nozzle hole forming member 61 so that the protruding portion 63a is formed.

Here, the negative type DFR is more resistant to acids and alkalis than the positive type, and has sufficient resistance to alkali degreasing and acid washing as pretreatments for later eutectoid plating. Because it is. In addition, since the nozzle hole forming member 61 itself plays a role of a light shielding mask during exposure,
Exposure masks are not required, and costs can be reduced. Mask alignment is also unnecessary, and work efficiency is improved. In this respect, manufacturing costs can be suppressed.

The DFR 63 has no meaning as a mask unless it protrudes from the nozzle hole 62 and completely closes the nozzle hole 62. Therefore, the thickness of the DFR 63 is the thickness of the nozzle hole forming member (nozzle plate base material) 61. Is preferably 70% or more. Therefore, it is preferable to use a DFR 63 having high thermoplasticity. Specifically, SR-3000 (trade name) manufactured by Hitachi Chemical is suitable.

Next, as shown in FIG. 4C, the negative DFR 64 is also provided on the ink ejection surface side of the nozzle hole forming member 61.
(Same as DFR63). The thickness of the DFR 64 is made larger than the thickness of the water-repellent film (plating film) formed in a later step. The reason why thermocompression bonding is not performed on both surfaces simultaneously is to prevent air bubbles from getting into the nozzle holes 62. When air bubbles are caught in the nozzle hole 62,
Ultraviolet rays are scattered by the bubbles during the parallel ultraviolet exposure, so that precise patterning cannot be performed.

Thereafter, as shown in FIG. 4D, the parallel ultraviolet light (UV) is applied from the ink liquid chamber side of the nozzle hole forming member 61.
By exposing with light, the nozzle hole forming member 61 becomes an exposure mask.
Of DF corresponding to DFR 63 and nozzle hole 62
R64 is exposed and cured, and is developed to have a tower (projection) 65a projecting right above the nozzle hole 62 of the nozzle hole forming member 61 from the nozzle hole 62, and the inside of the nozzle hole 62 and immediately above the nozzle hole 62 and the ink liquid. A cured DFR 65 for masking the entire chamber side is formed.

Therefore, a water-repellent plating film (water-repellent film) 66 is formed on the ink ejection surface side of the nozzle hole forming member 61 as shown in FIG. In this case, the nozzle hole 6
The inside of the nozzle hole 2 is filled with DFR 65, and the tower portion 65a is erected from the inside of the nozzle hole to the nozzle discharge surface side, and precision masking is performed, so that the water repellent film 66 does not enter the nozzle hole 62 It is formed with high accuracy.

The water repellent film 66 has abrasion resistance,
Electrochemical eutectoid plating (for example, Metaflon (trade name) manufactured by Uemura Kogyo Co., Ltd.) in which fine particles of fluorine resin such as PTFE are dispersed in an electrolytic nickel plating solution ) Or electroless eutectoid plating in which fluorine-based resin particles are dispersed in an electroless nickel plating solution (for example, Nimflon (trade name) manufactured by Uemura Kogyo Co., Ltd.)
Etc.) to form an eutectoid plating.

The thickness of the water-repellent film 66 is 1.5 μm
In the following, the content of the fluororesin fine particles is reduced and the water repellency is not sufficient, and the wiping resistance is not sufficient,
A film thickness of 1.5 μm or more is provided to ensure water repellency and to sufficiently provide wiping resistance. The thickness of the water-repellent film 66 is 1/1 of the thickness of the nozzle hole forming member 61.
If it is 0 or more, warpage due to internal stress occurs. Therefore, the thickness is set to less than 1/10 of the thickness of the nozzle hole forming member 61.

Next, as shown in FIG. 5A, the nozzle hole forming member 61 on which the water repellent film 66 has been formed as described above is immersed in a stripping solution 70 filled in a stripping tank 71. In this case, a stripping solution generally used as a resist stripping solution (for example, 502A (trade name) manufactured by Tokyo Oka,
710 (trade name), Sibley remover 1165 (trade name) and the like often attack nickel. Since the above-described eutectoid plating is nickel plating, when it is immersed in such a stripping solution, it is sulfurized or oxidized and changes color to black or white, and water repellency and abrasion resistance cannot be maintained. Therefore,
As the stripping liquid 70, an organic solvent-based stripping liquid that does not corrode nickel (for example, Green Strip MF (trade name) manufactured by Tokyo Ohka) is used.

If the temperature of the stripping solution 70 is lower than 95 ° C., the DFR 65 cannot be stripped, and if it exceeds 130 ° C., the water-repellent film (plating film) 66 starts to be eroded by the stripping solution 70. Furthermore, if the immersion time in the stripping liquid 70 is less than 10 minutes, the remaining of the DFR 65 will be left, and if it is more than 20 minutes, the fluororesin fine particles adhering to the surface of the water-repellent film 66 will be removed, and Decrease. Accordingly, the stripping conditions are such that the stripping solution temperature is in the range of 95 ° C. to 130 ° C. and the immersion time is in the range of 10 to 20 minutes.

As a result, the DFR 65 is separated from the nozzle hole forming member 61 as shown in FIG. Therefore, an ultrasonic wave is further applied to the nozzle hole forming member 61 by an ultrasonic generator 72 provided in the separation tank 71.

The output of the ultrasonic wave at this time is 200 W to 40
0 W, and the application time is in the range of 3 minutes to 10 minutes. This makes it possible to completely remove the DFR residue slightly adhering and remaining on the nozzle hole forming member 61. If the ultrasonic output is less than 200 W, the removal of DFR residue is insufficient and
If it exceeds 00W, the water repellent film (plated film) 66 itself will be damaged. In addition, if the ultrasonic wave application time is less than 3 minutes, the removal of the DFR residue becomes insufficient,
If the time exceeds 10 minutes, the fluorine resin fine particles adhering to the surface of the plating film 66 are removed, and the water repellency is reduced.

In this manner, the DFR 65 including the scum can be completely removed from the nozzle hole forming member 61, and the scum of the DFR can be prevented from causing nozzle clogging and causing defective discharge. In addition, it is possible to manufacture an ink jet head having good ink droplet ejection stability at low cost and with good yield.

Then, the nozzle hole forming member 61 is taken out of the stripping tank 71 and subjected to a required cleaning step, whereby the nozzle plate 33 having the water repellent film 66 as the water repellent film 47 as shown in FIG. can get.

In the above embodiment, the present invention is applied to an ink jet head using an electromechanical transducer as energy generating means, but an ink jet head using an electrothermal transducer as energy generating means, a diaphragm and an electrode. The present invention can be similarly applied to an electrostatic ink jet head using the same, and can be similarly applied to not only a side shooter type ink jet head but also an edge shooter type ink jet head.

[0052]

As described above, according to the method of manufacturing an ink jet head according to the present invention, the inside of the nozzle hole of the nozzle hole forming member, the surface immediately above the nozzle hole, and the entire surface on the back surface are formed of the negative type dry film resist. Perform masking, perform eutectoid plating in a nickel plating solution in which fluororesin fine particles are dispersed to form a water-repellent film, and then remove the negative dry film resist.
High-precision masking can be performed easily at low cost, and a head having good ink droplet ejection characteristics can be manufactured at low cost and with high yield.

Here, by using a nickel plating solution as a plating solution and removing the mask of the negative dry film resist with an organic solvent-based stripping solution that does not corrode nickel, the water repellency and abrasion resistance of the water repellent film are reduced. Drop can be prevented.

In this case, the use temperature of the stripping solution is 95 ° C. to 1
By setting the temperature within the range of 30 ° C., the negative dry film resist can be reliably peeled off, and a decrease in the water repellency of the water repellent film can be prevented. By setting the immersion time in the stripping solution within the range of 10 minutes to 20 minutes, the negative dry film resist can be reliably stripped, and a decrease in the water repellency of the water repellent film can be prevented.

Further, by applying ultrasonic waves after immersion in the stripping solution, the residue of the negative type dry film resist can be removed, and clogging can be reliably prevented and reliability is improved. This ultrasonic wave has an output of 200 W to 400 W for 3 minutes to 10 minutes.
By applying for minutes, the residue of the negative type dry film resist can be reliably removed, and a decrease in the water repellency of the water repellent surface treatment film can be prevented.

[Brief description of the drawings]

FIG. 1 is an exploded perspective view of an inkjet head to which the present invention has been applied.

FIG. 2 is an enlarged sectional view of a main part of the head in a direction orthogonal to a channel direction.

FIG. 3 is an enlarged cross-sectional view of a main part of the head in a channel direction.

FIG. 4 is an explanatory diagram for explaining a manufacturing process of a nozzle plate of the head.

FIG. 5 is an explanatory view provided for description of a step that follows the step of FIG. 4;

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 1 ... Drive unit, 2 ... Liquid chamber unit, 3 ... Frame member, 12 ... Piezoelectric element, 33 ... Nozzle plate, 38 ... Nozzle, 47 ... Water-repellent film, 61 ... Nozzle hole forming member, 6
2 ... Nozzle holes, 63, 64 ... Dry film resist,
65: cured dry film resist, 65a: tower, 6
6 ... water repellent film, 70 ... release liquid, 71 ... release tank, 72 ...
Ultrasonic generator.

Claims (6)

[Claims] 1. A method of manufacturing an ink jet head in which a water-repellent film is formed on a surface of a nozzle hole forming member having a nozzle hole for discharging an ink droplet, wherein the inside of the nozzle hole of the nozzle hole forming member and the surface side of the nozzle hole are provided. Immediately above and on the entire back side, masking is performed with a negative dry film resist, and a water-repellent film is formed on the surface of the nozzle forming member by nickel eutectoid plating in which fluorine-based resin fine particles are dispersed, and then the negative dry film is formed. A method for manufacturing an ink jet head, comprising removing a resist. 2. The method for manufacturing an ink jet head according to claim 1, wherein said negative type dry film resist is removed with an organic solvent-based stripping solution which does not corrode nickel. 3. The method for manufacturing an ink jet head according to claim 2, wherein the temperature of the stripping liquid for immersing the nozzle hole forming member is in a range of 95 ° C. to 130 ° C. Production method. 4. The method for manufacturing an ink jet head according to claim 2, wherein the immersion time of the nozzle hole forming member in the stripping liquid is within a range of 10 minutes to 20 minutes. Head manufacturing method. 5. The method for manufacturing an ink jet head according to claim 2, wherein the ultrasonic wave is applied while the nozzle hole forming member is immersed in the stripping liquid. Production method. 6. The method for manufacturing an ink jet head according to claim 5, wherein an output of said applied ultrasonic wave is set to 20.
A method for manufacturing an ink jet head, wherein the application time is from 0 W to 400 W and the application time is from 3 minutes to 10 minutes.