JP2001034194A - Spacer spraying device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To obtain a spacer spraying device capable of uniformly spraying spacers on a substrate of any size, improving the maintainability and shortening the tact time. SOLUTION: This device is provided with a substrate holding means 2 to hold a substrate 1 on which spacers are to be sprayed, a dispersion liquid supply means 11 to supply a volatile dispersion liquid prepared by dispersing the spacers, a nozzle 10 to spray the volatile dispersion liquid 12 in a mist state, an X-axis movement mechanism 20 and Y-axis movement mechanism 21 to move and scan the nozzle 10 in the two axial directions perpendicular to each other, a control means 22 to control the X-axis movement mechanism 20 and the Y-axis movement mechanism 21, and a spraying booth 3 to house these means. The device is further provided with a charge imparting means 15 to electrostatically electrify the volatile dispersion liquid supplied from the dispersion liquid supply means.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a spacer dispersing apparatus, and more particularly to a spacer dispersing apparatus capable of uniformly dispersing and dispersing spacers in a short time.

[0002]

2. Description of the Related Art In general, in order to maintain the distance between substrates in a liquid crystal display device, it is necessary to provide spacers such as glass fibers, plastic beads and silica beads on the substrate. At this time, from the viewpoint of quality, the spacers need to be dispersed uniformly, but when the substrate is a film, it is necessary to have a higher density than when a glass substrate is used.
Therefore, it becomes more difficult to create a uniformly dispersed state. The spraying method is a more general and popular method in which a spacer is present on a substrate. In this spraying method, a spacer is mixed with a volatile solution such as alcohol at a certain ratio, and the dispersion is sprayed using a spray fixed above the substrate,
It is sprayed on a substrate. At this time, the temperature of the atmosphere is raised using a heater, the volatile solution is evaporated to form a spacer atmosphere, and the spacer is sprayed by waiting for the floating spacer to fall naturally.

[0003] The problems of this spray application method are as follows.
It looks like this: In other words, this method requires a considerable distance (generally about 1 m) between the spray and the substrate in order to form the spacers uniformly on the substrate, and scatters the spacer dispersion in the spray booth. It needs to be scattered. For this reason, 1) the spacer dispersion liquid easily adheres to a wall surface or the like, and maintenance is difficult. 2) The spraying efficiency is extremely low. 3) The device becomes large. 4) In order to increase the spraying efficiency as much as possible and to improve the distribution in the substrate, it is necessary to take a long time for the raised spacers to sink, which hinders a reduction in tact time. . Such a problem becomes conspicuous in the case of a PF substrate in which spacers need to be distributed at a higher density.

[0004] In order to solve these problems, there is a method of applying a thin film coating technique. That is, micro ejection,
This method uses a nozzle capable of spraying the dispersion liquid in a mist state at a low air volume while spraying the surface of the substrate while scanning. In this case, the distance between the spraying nozzle and the substrate can be reduced to a fraction of that in the case of the above-described spraying method. And spraying efficiency can be improved. However, the closer the distance between the spray nozzle and the substrate, the more difficult it is for the volatile solution to evaporate, resulting in increased aggregation. Further, in consideration of dispersing different kinds of spacers in the same apparatus, it is required to further reduce the scattering. Further, when a higher density of spacers is required to be scattered as in the case of a film substrate, it is necessary to reduce the tact time.

[0005] In addition, a method has been developed in which the spacers are sprayed in a powder state without mixing the spacers with a volatile solution such as alcohol. This is a method in which the charged spacer powder is sprayed and sprayed from above the substrate. At this time, the substrate is grounded, a potential difference is provided between the substrate and the spacer, and the substrate is electrically sucked, thereby improving the spraying efficiency. In addition, since the individual spacers are charged with the same polarity, there is an advantage that the spacers repel each other and aggregation can be reduced. However, this method also requires a considerable distance (generally, about 1 m) between the spray and the substrate in order to uniformly distribute the spacers on the substrate, especially for large substrates.
Since it is necessary to remove the spacers, the spacers are scattered in the spray booth as in the case of the spraying method described above, so that the spacers are likely to adhere to the walls and the like, making maintenance difficult and increasing the size of the apparatus. The problem remains. Furthermore, if the potential difference on the surface of the substrate to be sprayed is not kept uniform,
It is difficult to uniformly disperse the spacers, and in particular, in the case of a film substrate, it is difficult to keep the potential difference uniform in the plane, and rather, the influence of uneven distribution of the spacers appears remarkably.

[0006]

As described above, in the conventional spacer dispersing apparatus, it is difficult to uniformly distribute the spacers on the substrate, the tact time tends to be long, and a heat source such as a heater is required. There is a problem that the apparatus tends to be large and maintenance is difficult. An object of the present invention is to realize a spacer dispersing apparatus capable of uniformly dispersing spacers on a substrate of an arbitrary size with a relatively simple configuration and improving maintenance and shortening tact time. .

[0007]

In order to achieve the above object, the present invention provides a substrate holding means for holding a substrate on which spacers are to be sprayed, and a dispersion supply means for supplying a volatile dispersion in which spacers are dispersed. Nozzle means for spraying the volatile dispersion liquid supplied from the dispersion liquid supply means in the form of a mist, scanning means for moving the nozzle means or the substrate holding means in two orthogonal directions for scanning, and A spacer controlling device for controlling a scanning speed and a scanning position of the device, and a shielding device for shielding at least the substrate holding device, the nozzle device, and the scanning device. It is characterized by having a charge providing means for electrostatically charging the volatile dispersion supplied from the liquid supply means. Accordingly, it is possible to realize a spacer dispersing apparatus capable of reducing aggregation of the spacers and uniformly dispersing the spacers and having a short tact time.

[0008]

BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a perspective view showing a spacer dispersing apparatus according to the present invention.

The present invention is an apparatus for dispersing spacers for keeping the distance between substrates of a liquid crystal display element constant. The distance between the dispersing nozzle and the substrate can be reduced without using a heat source such as a heater. More particularly, the present invention relates to a spacer spraying apparatus capable of spraying a nozzle in the X and Y directions and spraying a spacer dispersion locally, which is capable of extremely minute discharge and low air volume spraying. An object of the present invention is to reduce the agglomeration by giving an electric charge to the spacer dispersion liquid at the time of spraying to generate an electric repulsive force between the spacers as gap materials. Another object of the present invention is to provide a spacer dispersing apparatus which reduces the scattering of spacers, improves maintainability of the apparatus, and effectively controls movement of a plurality of dispersing noises, thereby shortening the tact time. I have. In addition, the present invention enables the spray nozzle or the substrate holding means to perform XY scanning at an arbitrary scanning position at an arbitrary speed,
The spacers can be uniformly dispersed at an arbitrary density. It is also an object of the present invention to be able to spray an arbitrary area and to achieve efficient spraying according to the substrate size.

FIG. 1 is a plan view showing a basic structure of a spacer spraying apparatus according to the present invention, and FIG. 2 is a side sectional view thereof. 1 and 2, a substrate 1 for a liquid crystal display device is placed on a substrate holding means 2. At the time of holding, a suction holding mechanism and a positioning mechanism of the substrate 1 are provided as necessary. A spray nozzle 10 is disposed above the substrate 1, and a dispersion liquid 12 in which a spacer is mixed with a volatile solution such as alcohol at a predetermined ratio is supplied to the spray nozzle 10 using a liquid supply unit 11 such as a pump. The compressed gas supplied by the compressed gas supply means 13 is used for the spacer dispersion 1.
2 is discharged in the form of a mist. The spacers are sprayed in a spray booth 3 having a closed structure.

The spray nozzle 10 is configured to be movable in two orthogonal directions above the substrate by an X-axis moving mechanism 20 and a Y-axis moving mechanism 21. The moving range covers the entire range where the spacer of the substrate 1 needs to exist. Further, the X-axis moving mechanism 20 and the Y-axis moving mechanism 2
1 means that the position and the moving speed are controlled by the control means 22, and the spraying nozzle 10 can move to an arbitrary position within the moving range at an arbitrary speed. When spraying the spacers, the spray nozzle 10 is scanned over the substrate 1 while discharging the spacer dispersion liquid 12 in the form of mist.

FIG. 3 is a plan view showing a basic configuration of an embodiment of the spacer spraying apparatus according to the present invention, and FIG. 4 is a side sectional view thereof. In this embodiment, in addition to the basic structure of FIGS. 1 and 2, a charge applying means 15 is further added to charge the spacer dispersion liquid 12 to the same electrostatic polarity. As the charge applying means 15, a means using corona charging is generally used. When spacers charged to the same polarity are arranged in a close position, they are separated from each other to generate an electric repulsion. This allows
The effect of reducing aggregation is obtained.

However, as described in the prior art powder dispersal, if a charge is generated between the substrate 1 and the spacers so as to be electrically attracted, it is difficult to make the potential difference in-plane uniform in the PF substrate or the like. In this case, a bias is generated instead of the spacer distribution. Therefore, it is necessary to generate a repulsive force between the spacers and to generate a charge distribution between the spacers and the substrate 1 such that no attraction force is generated. further,
Depending on the material of the spacer, the charging effect changes, so a method of adjusting the charging amount is required. Reference numeral 16 in FIGS. 3 and 4 denotes a charge adjusting means for this purpose, and it is possible to appropriately set the charge application amount, that is, the charge amount of the spacer. Although it depends on the spraying conditions such as the distance between the spray nozzle 10 and the substrate 1 and the scanning speed, -20 kV
By negatively charging the spacer dispersion liquid 12 with an applied voltage of about -30 kV, it is possible to reduce the occurrence of aggregation.

FIG. 5 shows the effect of reducing the occurrence of aggregation due to charging. Here, the singular rate on the vertical axis indicates the ratio of non-aggregated spacers per unit area, and the horizontal axis indicates the density of spacers, that is, the number of spacers scattered per 1 mm ² . As can be seen from this figure, an improvement of about 10% to 25% in the single rate by charging is observed.

FIG. 6 is a plan view showing a basic configuration of another embodiment of the spacer spraying apparatus according to the present invention, and FIG. 7 is a side sectional view thereof. The spray nozzle 10 is fixed, and the X-axis moving mechanism 23 and the Y-axis moving mechanism 24 scan the substrate holding means 2 and scan the substrate 1 held thereon. In this method, since the spray nozzle 10 is fixed, foreign substances such as dust are less likely to fall on the substrate 1 than in the case of FIGS. 3 and 4 in which the spray nozzle 10 is scanned.
Foreign matter can be prevented from being mixed.

In the spacer spraying by the spacer spraying apparatus of the present invention, since the spraying is local and the spraying range is widened by scanning, it is conceivable that the spacer spraying distribution varies in various ways depending on the scanning method. A device for optimally setting the distribution of the scatter, that is, for making the distribution uniform, will be described. FIG.
FIG. 3 is a diagram schematically showing a spacer distribution. In this schematic diagram, the state of dispersion on the substrate 1 is represented by one section in the Y-axis direction. In the figure, the dotted line indicates the spacer distribution obtained by one scan in the X-axis direction, and the spacer distribution on the substrate 1 when the pitch (feed amount in the Y-axis direction) is changed is indicated by a thick line. ing.

If FIG. 8B is an ideal state, FIG.
FIG. 8A shows a case where the pitch width is too short, resulting in a distribution difference between the central portion and both ends, and FIG. 8C shows a case where the pitch width is too long, causing uneven distribution. However, FIG.
In the case of (1), uniformization is possible by devising an XY scanning method as described below. 1) The scanning speed in the X-axis direction at the center and both ends is changed to increase the speed at the end and decrease the speed at the center. 2) Increase the number of scans only at the end. 3) The pitch (feed amount in the Y-axis direction) between the center and both ends is changed, and the pitch is shortened at the end and longer at the center.

As described above, by setting the optimum conditions in accordance with the spraying characteristics of the spraying nozzle 10, it is possible to distribute the spacers to a considerable extent. As a matter of course, since the spray nozzle 10 can move to an arbitrary position at an arbitrary speed, the spray amount of the spacer, that is, the spray density of the spacer on the substrate 1 can be performed under a desired condition. Also, by changing conditions such as the concentration of the spacer dispersion liquid 12, the discharge amount of the spray nozzle 10, and the supply pressure of the compressed gas as needed, the spray amount and the spray time can be adjusted in a considerably wide range.

Spray nozzle 1 of spacer spray apparatus of the present invention
The spraying operation of 0 will be described with reference to FIGS. FIG.
Shows a spraying operation when the number of the spraying nozzles 10 is one, and the spraying is performed by scanning over the substrate as shown in FIG. When there are a plurality of spray nozzles 10, the spray time can be shortened accordingly. For example, two spray nozzles 10a, 10
b is arranged as shown in FIG. 10 and half the area of the substrate 1 is scanned and sprayed by each of the spray nozzles 10a and 10b, so that the moving distance of the scan of each of the spray nozzles 10a and 10b is １ ／. And the spraying time can be halved.

The spraying speed can be doubled and the spraying time can be halved by arranging as shown in FIG. 11, and the spraying nozzles 10a and 10b can be arranged as shown in FIG.
And the spraying time can be halved by reducing the moving distance of each scan to の. In particular, when spraying is performed in the arrangement shown in FIG. 11, two spray nozzles 10a and 10b
Is exactly the same, even if there is a difference in characteristics such as a variation in the discharge amount between the spray nozzle 10a and the spray nozzle 10b, the distribution of the spacers spread on the substrate 1 The effect does not appear.

FIG. 13 shows the configuration of another embodiment of the spacer spraying apparatus of the present invention. In this embodiment,
The substrate 1, the substrate holding means 2, the spraying nozzle 10, and the moving means of the spraying nozzle 10 or the substrate holding means 2 can be integrally tilted at an arbitrary angle.
Is provided. By providing an inclination by the inclination means 30, the spray nozzle 10 can be prevented from coming directly above the substrate 1 by inclining it to a specific angle or more. In such a state, the spacers are sprayed. . Accordingly, even if foreign matter such as dust attached to the spray nozzle 10 falls during spraying, the foreign matter does not fall on the substrate 1, thereby preventing foreign matter from entering the substrate 1. it can. In an extreme case, if the spray nozzle 10 is tilted and rotated so as to be disposed below the substrate 1 as shown in FIG. 14 and sprayed upward, the effect of preventing foreign matter from entering the substrate 1 is reduced. The largest.

FIG. 15 shows the configuration of another embodiment of the spacer spraying apparatus according to the present invention. In the configuration of this embodiment,
A compressed gas heating means 14 for warming the compressed gas supplied by the compressed gas supply means 13 is provided. The compressed gas is heated by passing through the compressed gas heating means 14 and is supplied at a higher temperature than usual. Thereby, when the spacer dispersion liquid 12 is atomized and discharged from the spray nozzle 10, the volatile solution such as alcohol, which is the solvent of the spacer dispersion liquid 12, can be evaporated more quickly. Thus, the distance between the substrate 1 and the spray nozzle 10 can be further reduced, so that the adhesion efficiency of the sprayed spacers can be increased, and the spray efficiency can be improved. If the spraying efficiency is improved, it is naturally possible to increase the scanning movement speed of the spraying nozzle 10 and shorten the spraying time.

FIG. 16 shows the configuration of another embodiment of the spacer spraying apparatus of the present invention. In the configuration of this embodiment,
Blowing means 4 for sending air from any position of spray booth 3
0, and the exhaust means 41 is provided below the spray booth 3.
Was provided. The blowing means 40 does not necessarily need to be directly above the spray booth 3, but may be any as long as air can be blown from above. As long as a spray gun is used as the spray nozzle 10, it is impossible to prevent the spacers from scattering at all. Since the scattered spacers adhere to the components in the spray booth 3, if the spraying is repeated, there is a risk that the adhered materials will eventually come off and be mixed into the substrate 1 as a lump of spacers. Therefore, maintenance such as cleaning at a constant frequency is required.

In this embodiment, a fixed amount of air blows to generate a flow as shown by an arrow in FIG. 16 to forcibly evacuate the scattered and floating spacers. Adhesion to components in the spray booth 3 due to scattering is reduced. Furthermore, since the floating of the spacer itself is suppressed, improvement in the spraying efficiency can be expected. However,
It is necessary that the air volume is in an appropriate state. If the air volume is too large, not only the scattered air but also the spray nozzle 10
There is a possibility that the spacer immediately after atomization is pulled by the exhaust means 41 and conversely lowers the spraying efficiency.

FIG. 17 shows the structure of still another embodiment of the spacer spraying apparatus of the present invention. As shown in FIG.
For example, when it is desired to reduce the spacer distribution density at the left and right end portions of the substrate 1, an insulating member 50 such as a resin is disposed at that portion of the substrate holding means 2. It is assumed that the insulating member 50 has the same electrostatic polarity as the spacer charged during spraying and is electrically insulated from the substrate holding means 2. At this time, a potential difference is generated between the substrate holding means 2 and the insulating member 50, and when the spacers are sprayed in this state, the charged spacers electrostatically repel the insulating members 50 having the same polarity. Reduce the application density of that part.

FIG. 18 shows the structure of still another embodiment of the spacer spraying apparatus of the present invention. In this configuration, the insulating member 50 and the charging means 5 for controlling the charging of the insulating member 50 are provided.
The charging means 51 can adjust the counter electrode property of the insulating member 50 and the charge amount thereof. Thereby, for example, when it is desired to reduce the amount of spacers to be sprayed on the left and right ends of the substrate 1, the insulating member 50 is charged to the same polarity as the spacers, and when it is desired to increase the spacers, the spraying density is arbitrarily adjusted. It is possible. The configuration of the embodiment shown in FIG. 17 or FIG. 18 is suitable for applications where it is desired to selectively adjust the spraying amount within the substrate 1, such as when it is not desired to have a spacer at the handling position for transporting the substrate 1. It is effective to use.

[0027]

As described above, according to the first aspect of the present invention, there is provided a substrate holding means for holding a substrate on which spacers are to be dispersed, and a dispersion liquid supply means for supplying a volatile dispersion liquid in which spacers are dispersed. Nozzle means for spraying the volatile dispersion supplied from the dispersion supply means in the form of a mist, scanning means for moving the nozzle means or the substrate holding means in two orthogonal directions for scanning, and scanning by the scanning means In a spacer dispersing apparatus having a scanning control unit for controlling a speed and a scanning position, and a shielding unit for accommodating and shielding at least a substrate holding unit, a nozzle unit, and a scanning unit, supplied from a dispersion liquid supplying unit. It is characterized by having charge applying means for electrostatically charging the volatile dispersion. This allows
It is possible to charge the spacer dispersion liquid at the time of spraying, to reduce the aggregation of the spacers by utilizing the repulsive force of the spacers, and to improve the dispersibility and uniformity of the spacer spraying.

According to a second aspect of the present invention, there is provided a charge amount control means for controlling the amount of charge of the volatile dispersion by the charge applying means, wherein the charge amount control means comprises a substrate to which spacers are to be sprayed, a nozzle means, The amount of charge is controlled in accordance with the relative positional relationship of. This makes it possible to adjust the charge amount of the spacer dispersion, control the cohesiveness of the spacer and the spraying efficiency, and obtain a desired spraying condition.

According to a third aspect of the present invention, the scanning control means controls the scanning speed and the scanning position of the scanning means in consideration of the spraying characteristics of the nozzle means. This makes it possible to determine optimum scanning conditions based on the spraying characteristics of the nozzle means, and to improve the uniformity of spacer spraying.

The invention according to a fourth aspect of the present invention is characterized in that the apparatus has a plurality of nozzle means, and the scanning control means controls the relative positional relationship of the plurality of nozzle means via the scanning means.
Thus, by setting the number of nozzles and their relative positional relationship, it is possible to obtain a desired spacer distribution density and a tact time.

According to a fifth aspect of the present invention, at least the substrate holding means, the nozzle means, and the scanning means are integrally formed, and the integrated substrate holding means, the nozzle means, and the scanning means are formed at an arbitrary angle. It is characterized by having a tilting means for tilting. This prevents the nozzle from coming above the substrate and sets the angle of inclination according to the size of the substrate and the distance between the substrate and the nozzle, thereby preventing foreign matter such as dust generated around the nozzle from being mixed. Can be
Manufacturing quality can be stabilized.

The invention of claim 6 of the present invention is characterized in that it has a gas heating means for heating the compressed gas supplied to the nozzle means in order to spray the volatile dispersion in the form of a mist.
This can promote evaporation of the volatile solution,
The distance between the nozzle and the substrate can be shortened, so that the spraying efficiency can be improved and the tact time can be shortened.

The invention according to claim 7 of the present invention is characterized in that it has a means for blowing air from an arbitrary position of the shielding means and an exhaust means for exhausting from below the substrate holding means. Thereby, the scattering of the spacers can be reduced, and the maintenance can be facilitated and the spraying efficiency can be improved.

According to a further aspect of the present invention, there is provided an insulating member provided at a desired position around the substrate holding means and electrically insulated, and the insulating member is charged to a potential different from that of the substrate holding means. It is characterized by making it.

According to a ninth aspect of the present invention, there is provided an insulating member charging control means for charging the insulating member to the same polarity or a different polarity as the charge of the volatile dispersion by the charge applying means. These make it possible to selectively change the distribution density of the spacers.

[Brief description of the drawings]

FIG. 1 is a plan view showing a basic configuration of a spacer spraying device of the present invention.

FIG. 2 is a side sectional view showing a basic configuration of the spacer spraying device of the present invention.

FIG. 3 is a plan view showing a basic configuration of one embodiment of the spacer spraying device of the present invention.

FIG. 4 is a side sectional view showing a basic configuration of the embodiment of FIG. 3;

FIG. 5 is a diagram showing the effect of reducing the occurrence of aggregation due to spacer charging.

FIG. 6 is a plan view showing a basic configuration of another embodiment of the spacer spraying device of the present invention.

FIG. 7 is a side sectional view showing a basic configuration of the embodiment of FIG. 6;

FIG. 8 is a schematic diagram schematically showing the distribution of spacers.

FIG. 9 is a view showing a spraying operation of a spray nozzle of the spacer spraying device of the present invention.

FIG. 10 is a view showing a spraying operation of a spray nozzle of the spacer spraying device of the present invention.

FIG. 11 is a view showing a spraying operation of a spray nozzle of the spacer spraying device of the present invention.

FIG. 12 is a view showing a spraying operation of a spray nozzle of the spacer spraying device of the present invention.

FIG. 13 is a diagram showing a configuration of another embodiment of the spacer spraying device of the present invention.

FIG. 14 is a view showing an example of the operation of the embodiment in FIG. 13;

FIG. 15 is a side sectional view showing the configuration of another embodiment of the spacer spraying apparatus of the present invention.

FIG. 16 is a side sectional view showing the configuration of another embodiment of the spacer spraying apparatus of the present invention.

FIG. 17 is a plan view showing a configuration of another embodiment of the spacer spraying apparatus of the present invention.

FIG. 18 is a plan view showing the configuration of another embodiment of the spacer spraying device of the present invention.

[Explanation of symbols]

 REFERENCE SIGNS LIST 1 liquid crystal display element substrate 2 substrate holding means 3 spray booth 10, 10 a, 10 b spray nozzle 11 spacer dispersion liquid supply means 12 spacer dispersion liquid 13 compressed gas supply means 14 compressed gas heating means 15 charge application means 16 charge control means 20 X-axis moving mechanism (for moving nozzle) 21 Y-axis moving mechanism (for moving nozzle) 22 Moving mechanism control means 23 X-axis moving mechanism (for moving substrate) 24 Y-axis moving mechanism (for moving substrate) 30 Tilt means 40 Blowing means 41 exhaust means 50 insulating member 51 insulating member charging means

Claims (9)

[Claims] 1. A substrate holding means for holding a substrate on which spacers are to be dispersed, a dispersion liquid supply means for supplying a volatile dispersion liquid in which spacers are dispersed, and a volatile dispersion liquid supplied from the dispersion liquid supply means Nozzle means for spraying the liquid in the form of a mist, scanning means for moving the nozzle means or the substrate holding means in two orthogonal directions for scanning, scanning control means for controlling a scanning speed and a scanning position of the scanning means, In a spacer dispersing apparatus including at least the substrate holding unit, the nozzle unit, and the scanning unit, and a shielding unit that accommodates and shields the inside, the volatile dispersion liquid supplied from the dispersion liquid supply unit is electrostatically charged. A spacer dispersing device comprising a charge applying means for charging the spacer. 2. The method according to claim 1, further comprising a charge control unit configured to control a charge amount of the volatile dispersion by the charge providing unit, wherein the charge control unit controls a relative position between the substrate on which the spacer is to be sprayed and the nozzle unit. The spacer dispersing device according to claim 1, wherein the amount of charge is controlled according to the relationship. 3. The spacer spraying apparatus according to claim 1, wherein said scanning control means controls a scanning speed and a scanning position of said scanning means in consideration of spraying characteristics of said nozzle means. 4. The spacer scatterer according to claim 1, further comprising a plurality of said nozzle means, wherein said scanning control means controls a relative positional relationship between said plurality of nozzle means via said scanning means. apparatus. 5. At least the substrate holding means, the nozzle means, and the scanning means are integrally formed, and the integrated substrate holding means, the nozzle means, and the scanning means are inclined at an arbitrary angle. The spacer spraying device according to claim 1, further comprising an inclination means. 6. The spacer spraying apparatus according to claim 1, further comprising gas heating means for heating the compressed gas supplied to said nozzle means for spraying said volatile dispersion in a mist state. 7. The spacer spraying apparatus according to claim 1, further comprising: means for blowing air from an arbitrary position of the shielding means, and exhaust means for exhausting air from below the substrate holding means. 8. An insulating member provided at a desired position around the substrate holding means and electrically insulated, and the insulating member is charged to a potential different from that of the substrate holding means. The spacer spraying device according to claim 1. 9. The spacer according to claim 8, further comprising an insulating member charging control means for charging the insulating member to the same polarity or a different polarity as the charge of the volatile dispersion by the charge applying means. Spraying device.