JP2001030424A - Chip composite molding and its manufacture - Google Patents

Chip composite molding and its manufacture

Info

Publication number
JP2001030424A
JP2001030424A JP11203689A JP20368999A JP2001030424A JP 2001030424 A JP2001030424 A JP 2001030424A JP 11203689 A JP11203689 A JP 11203689A JP 20368999 A JP20368999 A JP 20368999A JP 2001030424 A JP2001030424 A JP 2001030424A
Authority
JP
Japan
Prior art keywords
elastic
layer
chip
plate
unvulcanized rubber
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP11203689A
Other languages
Japanese (ja)
Inventor
Hideo Kamiozawa
秀夫 上小澤
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Inoac Corp
Inoac Elastomer Co Ltd
Original Assignee
Inoue MTP KK
Inoac Corp
Inoac Elastomer Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Inoue MTP KK, Inoac Corp, Inoac Elastomer Co Ltd filed Critical Inoue MTP KK
Priority to JP11203689A priority Critical patent/JP2001030424A/en
Publication of JP2001030424A publication Critical patent/JP2001030424A/en
Pending legal-status Critical Current

Links

Landscapes

  • Heating, Cooling, Or Curing Plastics Or The Like In General (AREA)
  • Casting Or Compression Moulding Of Plastics Or The Like (AREA)
  • Laminated Bodies (AREA)

Abstract

PROBLEM TO BE SOLVED: To rigidly bond a base material layer to a surface elastic material layer by manufacturing a chip composite molding by providing the elastic material layer obtained by binding many elastic chips by a binder and the base material layer of a plate-like rigid material, and heating an unvulcanized rubber to cure the rubber to thereby integrally bond the base material layer to the elastic material layer. SOLUTION: The chip composite molding formed by recycling and using rubber and resin wastes comprises a surface elastic material layer 12 to become a surface layer, a rubber layer 14 to become an intermediate layer and a base material layer 16. As the layer 16, a metal plate or a rigid material 40 such as a concrete or the like is suitably adopted. The layer 12 is molded of an elastic material 20 obtained from elastic chips 24 and a binder 26. The material 20 is charged on an unvulcanized rubber 30 to become the layer 14 by heating and curing, molded as a chip composite molding by compression thermoforming and simultaneously molded as the layer 12. A vulcanized adhesive 50 is given between the material 40 and the rubber 30.

Description

【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION

【0001】[0001]

【発明の属する技術分野】この発明は、チップ複合成形
体およびその製造方法に関し、更に詳細には、弾性物質
を粉砕して得られる弾性チップからなる表面弾性体層
と、剛性体からなる基材層とを結合して複合成形体とす
る際に、該表面弾性体層と、基材層との間にゴム層を介
在させることで、この両層を強固に結合させ得るように
したチップ複合成形体およびその製造方法に関するもの
である。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a chip composite molded article and a method for producing the same, and more particularly, to a surface elastic layer made of an elastic chip obtained by pulverizing an elastic substance, and a substrate made of a rigid body. A chip composite in which a rubber layer is interposed between the surface elastic body layer and the base material layer when the layers are combined to form a composite molded body, so that the two layers can be firmly bonded to each other. The present invention relates to a molded article and a method for producing the same.

【0002】[0002]

【従来の技術】最近、廃棄物の排出量増大による環境悪
化が社会問題として認識されている。この廃棄物問題に
関連して、利用される産業分野が広範に及び、その排出
量が膨大なゴム・樹脂系廃棄物の排出量削減が急務とな
っている。この排出量削減に向けた極めて有望な方法の
1つとして、前記ゴム・樹脂系廃棄物の再生利用が考え
られている。
2. Description of the Related Art Recently, environmental degradation due to an increase in the amount of waste discharged has been recognized as a social problem. In connection with this waste problem, the industrial fields used are widespread, and there is an urgent need to reduce the amount of rubber / resin-based waste that emits a huge amount. As one of the very promising methods for reducing this emission, recycling of the rubber / resin waste is considered.

【0003】前記再生利用のうち殊に有望なものとし
て、排出される前記ゴム・樹脂系廃棄物を粉砕してチッ
プ化し、これに例えばポリウレタン等のバインダを所定
量添加して混合後、所定の型中で成形することで弾性を
有する再生品を得る方法があり、既に各方面で利用され
ている。殊に、これまでコンクリートや鉄板等の剛性体
の利用が大部分であった舗装材等の分野に、衝撃緩和・
吸水性等の各機能を発現する前記ゴム・樹脂系廃棄物か
らの再生弾性体が好適に使用されている。しかし前記弾
性体を剛性体に完全に置き換えたのでは、形状維持のた
めの強度が不足する等の難点が指摘されるため、前記剛
性体を下層とし、前記弾性体を上層とした複合層状構造
が好適に用いられている。
As a particularly promising example of the recycling, the discharged rubber / resin-based waste is pulverized into chips, a predetermined amount of a binder such as polyurethane is added thereto, mixed, and then mixed. There is a method of obtaining a regenerated product having elasticity by molding in a mold, and is already used in various fields. In particular, in the field of pavement materials, etc., where rigid bodies such as concrete and iron plates have been mostly used, impact mitigation and
Regenerated elastic bodies made from the above-mentioned rubber / resin-based waste, which exhibit various functions such as water absorption, are suitably used. However, if the elastic body is completely replaced with a rigid body, difficulties such as insufficient strength for maintaining the shape are pointed out. Therefore, a composite layered structure in which the rigid body is a lower layer and the elastic body is an upper layer. Are preferably used.

【0004】[0004]

【発明が解決しようとする課題】しかし、前記コンクリ
ートまたは金属等からなる剛性体の表面は、一般的に大
きな凹凸がなく平滑であるのに対して、前記ゴム・樹脂
系廃棄物から得られる弾性体の表面は非常に凹凸の富ん
だ状態となっている。従って前記剛性体に弾性体を結合
させても、微視的には両者は、所謂点接触状態で接合さ
れているに過ぎない。このため両者の接合状態は充分に
強固なものではなく、歩行に伴う衝撃や、季節的な温度
変動等の諸要因によって簡単に剥がれてしまう重大な欠
点が指摘される。
However, the surface of the rigid body made of concrete, metal, or the like is generally smooth without large irregularities, whereas the elastic body obtained from the rubber-resin waste is generally smooth. The body surface is very uneven. Therefore, even if an elastic body is connected to the rigid body, microscopically, they are merely joined in a so-called point contact state. For this reason, the joining state of the two is not sufficiently strong, and a serious drawback is pointed out that the two are easily peeled off due to various factors such as an impact caused by walking and seasonal temperature fluctuation.

【0005】[0005]

【発明の目的】本発明は、前述した従来の技術に内在し
ている前記欠点に鑑み、これを好適に解決するべく提案
されたものであって、チップ複合成形体を構成する基材
層および表面弾性体層の間に未加硫ゴムを介在させ、該
未加硫ゴムをチップ複合成形体成形の圧縮加熱に伴って
加熱・硬化させることで、該基材層および表面弾性体層
を強固に結合させるようにしたチップ複合成形体および
その製造方法を提供することを目的とする。
SUMMARY OF THE INVENTION The present invention has been made in view of the above-mentioned drawbacks inherent in the prior art, and has been proposed in order to preferably solve the problem. An unvulcanized rubber is interposed between the surface elastic layers, and the unvulcanized rubber is heated and cured in accordance with the compression heating of the chip composite molded article, whereby the base layer and the surface elastic layer are solidified. It is an object of the present invention to provide a chip composite molded body and a method of manufacturing the same.

【0006】[0006]

【課題を解決するための手段】前記課題を克服し、所期
の目的を達成するため本発明のチップ複合成形体は、弾
性物質を粉砕して得た多数の弾性チップをバインダで結
合させた弾性体からなる表面弾性体層と、板状の剛性体
からなる基材層と、前記表面弾性体層および基材層の間
に介在し、未加硫ゴムを加熱して硬化させることでこれ
ら表面弾性体層および基材層を結合させるゴム層とから
なることを特徴とする。
Means for Solving the Problems In order to overcome the above-mentioned problems and achieve the intended object, the chip composite molded article of the present invention has a large number of elastic chips obtained by pulverizing an elastic substance, which are joined by a binder. A surface elastic body layer made of an elastic body, a base material layer made of a plate-shaped rigid body, and an intermediate material interposed between the surface elastic body layer and the base material layer, which are heated and cured by heating the unvulcanized rubber. It is characterized by comprising a surface elastic body layer and a rubber layer for bonding the base material layer.

【0007】前記課題を克服し、所期の目的を達成する
ため本願の別の発明のチップ複合成形体の製造方法は、
弾性物質を粉砕して得た多数の弾性チップからなる弾性
体と板状の剛性体とを結合させたチップ複合成形体の製
造方法であって、所定の金型内に載置した前記板状の剛
性体上に予め接着手段を付与し、この接着手段上に所定
厚さで未加硫状態のゴムシートを敷設し、この未加硫状
態のゴムシート上に、前記弾性体の原料となる弾性チッ
プとバインダとの混合物を投入して層状とし、前記金型
による圧縮加熱を行なって、前記混合物から弾性体を成
形すると共に、前記未加硫状態のゴムシートを加硫・硬
化させることで該弾性体と前記板状の剛性体とを結合さ
せるようにしたことを特徴とする。
[0007] In order to overcome the above-mentioned problems and achieve the intended object, a method for manufacturing a chip composite molded article according to another invention of the present application is as follows.
A method of manufacturing a chip composite molded body in which an elastic body composed of a number of elastic chips obtained by crushing an elastic substance and a plate-shaped rigid body are combined, wherein the plate-shaped molded body is placed in a predetermined mold. A bonding means is provided in advance on the rigid body, and an unvulcanized rubber sheet is laid with a predetermined thickness on the bonding means, and the raw material of the elastic body is provided on the unvulcanized rubber sheet. The mixture of the elastic chip and the binder is put into a layer to form a layer, compression heating is performed by the mold, an elastic body is molded from the mixture, and the unvulcanized rubber sheet is vulcanized and cured. The elastic body and the plate-shaped rigid body are connected to each other.

【0008】前記課題を克服し、所期の目的を達成する
ため本願のまた別の発明のチップ複合成形体の製造方法
は、弾性物質を粉砕して得た多数の弾性チップからなる
弾性体と板状の剛性体とを結合させたチップ複合成形体
の製造方法であって、所定の金型内に載置した前記板状
の剛性体上に予め接着手段を付与し、この接着手段上に
所定厚さで未加硫状態のゴムシートを敷設し、この未加
硫状態のゴムシート上に、前記弾性チップとバインダと
の混合物から予め成形しておいた弾性体を敷設して層状
とし、前記金型による圧縮加熱を行なって、前記未加硫
状態のゴムシートを加硫・硬化させることで前記弾性体
と板状の剛性体とを結合させるするようにしたことを特
徴とする。
[0008] In order to overcome the above-mentioned problems and achieve the intended object, a method of manufacturing a chip composite molded article according to another aspect of the present invention comprises an elastic body comprising a large number of elastic chips obtained by pulverizing an elastic substance. A method of manufacturing a chip composite molded body in which a plate-shaped rigid body is combined with a plate-shaped rigid body, wherein a bonding means is provided in advance on the plate-shaped rigid body placed in a predetermined mold, and Laying an unvulcanized rubber sheet with a predetermined thickness, on this unvulcanized rubber sheet, laying an elastic body previously molded from a mixture of the elastic chip and the binder to form a layer, The elastic body and the plate-like rigid body are joined by compressing and heating by the mold to cure and cure the unvulcanized rubber sheet.

【0009】前記課題を克服し、所期の目的を達成する
ため本願の更に別の発明のチップ複合成形体の製造方法
は、弾性物質を粉砕して得た多数の弾性チップからなる
弾性体と板状の剛性体とを結合させたチップ複合成形体
の製造方法であって、所定の金型内に前記板状の剛性体
を載置し、この板状の剛性体上に未加硫ゴム生液と加硫
剤との混合液を所定量投入し、この混合液上に、前記弾
性チップとバインダとの混合物から予め成形しておいた
弾性体を敷設して層状とし、前記金型による圧縮加熱を
行なって、前記未加硫ゴム生液と加硫剤との混合液を加
硫・硬化させることで前記弾性体と板状の剛性体とを結
合させるようにしたことを特徴とする。
In order to overcome the above-mentioned problems and achieve the intended object, a method of manufacturing a chip composite molded article according to still another invention of the present application is to provide an elastic body comprising a large number of elastic chips obtained by pulverizing an elastic substance. A method of manufacturing a chip composite molded article in which a plate-shaped rigid body is combined with a plate-shaped rigid body, wherein the plate-shaped rigid body is placed in a predetermined mold, and unvulcanized rubber is placed on the plate-shaped rigid body. A predetermined amount of a mixed liquid of a raw liquid and a vulcanizing agent is charged, and an elastic body pre-molded from a mixture of the elastic chip and the binder is laid on the mixed liquid to form a layer, and the mixture is formed by the mold. The elastic body and the plate-like rigid body are combined by performing compression heating and vulcanizing and curing the mixed liquid of the unvulcanized rubber raw liquid and the vulcanizing agent. .

【0010】前記課題を克服し、所期の目的を達成する
ため本願の更に別の発明のチップ複合成形体の製造方法
は、弾性物質を粉砕して得た多数の弾性チップからなる
弾性体と板状の剛性体とを結合させたチップ複合成形体
の製造方法であって、所定の金型内に、前記弾性体の原
料となる弾性チップおよびバインダの混合物と、加硫剤
を含有し、かつ予め所定厚さに形成された未加硫状態の
ゴムシートとを層状になるよう設置し、前記金型で圧縮
加熱を行なうことで、これにより得られる前記弾性体と
未加硫状態のゴムシートとが結合した中間成形体を成形
し、前記中間成形体と別途用意した前記板状の剛性体と
を所要の接着手段により接着させることで、前記弾性体
と該剛性体とを結合させるようにしたことを特徴とす
る。
[0010] In order to overcome the above-mentioned problems and achieve the intended object, a method of manufacturing a chip composite molded article according to still another invention of the present application comprises an elastic body comprising a large number of elastic chips obtained by pulverizing an elastic substance. A method of manufacturing a chip composite molded body combined with a plate-shaped rigid body, in a predetermined mold, a mixture of an elastic chip and a binder as a raw material of the elastic body, containing a vulcanizing agent, An unvulcanized rubber sheet previously formed to a predetermined thickness is placed in a layered state, and is subjected to compression heating with the mold, thereby obtaining the elastic body and the unvulcanized rubber. The elastic body and the rigid body are joined by forming an intermediate molded body in which a sheet is joined and bonding the intermediate molded body and the separately prepared plate-shaped rigid body by a required adhesive means. It is characterized by the following.

【0011】前記課題を克服し、所期の目的を達成する
ため本願の更に別の発明のチップ複合成形体の製造方法
は、弾性物質を粉砕して得た多数の弾性チップからなる
弾性体と板状の剛性体とを結合させたチップ複合成形体
の製造方法であって、所定の金型内に、弾性チップおよ
びバインダの混合物から予め成形しておいた弾性体と、
未加硫ゴムとを層状になるよう設置し、前記金型で圧縮
加熱を行なうことで、前記弾性体と未加硫ゴムとが結合
した中間成形体を成形し、前記中間成形体と別途用意し
た前記板状の剛性体とを所要の接着手段により接着させ
ることで、前記弾性体と該剛性体とを結合させるように
したことを特徴とする。
In order to overcome the above-mentioned problems and achieve the intended object, a method of manufacturing a chip composite molded article according to still another invention of the present application is directed to a method for manufacturing an elastic body comprising a large number of elastic chips obtained by pulverizing an elastic substance. A method for manufacturing a chip composite molded body in which a plate-shaped rigid body is combined with an elastic body previously molded from a mixture of an elastic chip and a binder in a predetermined mold,
The unvulcanized rubber is placed in a layered state, and compression heating is performed with the mold, thereby forming an intermediate molded body in which the elastic body and the unvulcanized rubber are combined, and separately prepared from the intermediate molded body. The elastic body and the rigid body are connected by bonding the plate-shaped rigid body to the rigid body by a required adhesive means.

【0012】[0012]

【発明の実施の形態】次に、本発明に係るチップ複合成
形体およびその製造方法につき、好適な実施例を挙げ
て、添付図面を参照しながら以下説明する。本願の発明
者は、コンクリート等の板状の剛性体からなる基材層上
に、ゴム・樹脂系の弾性チップにバインダを混合して得
た混合物から形成される表面弾性体層を結合させたチッ
プ複合成形体を作成する際に、この基材層と表面弾性体
層との間に未加硫ゴムを介在させた層状物を構成し、こ
の層状物に圧縮加熱を施すことで得られるチップ複合成
形体は、該基材層およひ表面弾性体層が物理的および化
学的な力により強固に結合されることを知見したもので
ある。
BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a perspective view of a chip composite molded article according to the present invention; The inventor of the present application bonded a surface elastic body layer formed from a mixture obtained by mixing a binder with a rubber-resin-based elastic chip on a base layer made of a plate-like rigid body such as concrete. When forming a chip composite molded body, a chip obtained by forming a layered material in which an unvulcanized rubber is interposed between the base material layer and the surface elastic material layer, and applying compression heating to the layered material The composite molded article has been found that the base layer and the surface elastic layer are firmly bonded to each other by physical and chemical forces.

【0013】本発明の好適な実施例に係るチップ複合成
形体は、図1に示す如く、表層部となる表面弾性体層1
2と、中間層部となるゴム層14と、土台部となる基材
層16とから基本的に構成される。前記基材層16とし
ては、充分な強度・硬度を有すると共に、所定寸法に加
工可能であり、板状に加工された金属板またはコンクリ
ート等の剛性体40が好適に採用される。前記表面弾性
体層12は弾性チップ24とバインダ26から得られる
弾性体20から成形される。前記弾性体20は、加熱・
硬化によりゴム層14となる未加硫ゴム30(後述)上に
投入され、圧縮加熱成形により前記チップ複合成形体の
成形と同時に表面弾性体層12として成形される。前記
ゴム層14としては、加熱により加硫・硬化する未加硫
状態の未加硫ゴム30が使用される。また前記剛性体4
0および未加硫ゴム30の間には、両者の接着手段50
として加硫接着剤が付与される。
As shown in FIG. 1, a chip composite molded article according to a preferred embodiment of the present invention has a surface elastic layer 1 serving as a surface layer.
2, a rubber layer 14 serving as an intermediate layer, and a base material layer 16 serving as a base. The base material layer 16 has a sufficient strength and hardness and can be processed to a predetermined size, and a rigid body 40 such as a metal plate or concrete processed into a plate shape is suitably used. The surface elastic body layer 12 is formed from an elastic body 20 obtained from an elastic chip 24 and a binder 26. The elastic body 20 is heated and
It is put on an unvulcanized rubber 30 (to be described later) which becomes a rubber layer 14 by curing, and is molded as a surface elastic body layer 12 simultaneously with the molding of the chip composite molded body by compression and heat molding. As the rubber layer 14, an unvulcanized rubber 30 in an unvulcanized state that is vulcanized and cured by heating is used. The rigid body 4
0 and the unvulcanized rubber 30, a bonding means 50
As a vulcanizing adhesive.

【0014】前記弾性体20としては、前記弾性チップ
24およびバインダ26を混合して、成形を施さず流動
性を有する混合物状態での利用が好適であり、他の構成
物と積層させてチップ複合成形体の成形時に同時に該混
合物を成形してチップ複合成形体を得るようにしてい
る。
As the elastic body 20, it is preferable to use the elastic chip 24 and the binder 26 in the form of a mixture having fluidity without being formed by mixing. The mixture is molded simultaneously with the molding of the molded article to obtain a chip composite molded article.

【0015】前記弾性チップ24としては、各種のゴム
または樹脂を所定の大きさに予め粉砕したもの等が使用
される。そしてこの粉砕後の大きさは、チップ複合成形
体成形後の表面弾性体層12の密度を決定する重要な要
素であるが、製造コスト等を考慮して、未加硫ゴム30
の厚さ等との関係で決定され、好適には該未加硫ゴム3
0の厚さが前記弾性チップ24の大きさの0.5〜1.5
倍程度になるように設定される。本実施例においては、
前記弾性チップ24の原料として廃棄物等が好適に使用
されるが、これに限定されるものではない。また前記ゴ
ムまたは樹脂の種類については、殊に制限はないが、チ
ップ複合成形体等の使用目的によって適宜好適に選択し
得る。例えば高い弾性が必要な場合にはゴムが、硬度が
必要な場合には樹脂が夫々好適に使用される。なお、前
記表面弾性体層12の弾性が損われない程度であれば、
前記弾性チップ24内にガラス片または金属片等の不純
物が混入していてもよい。
As the elastic chip 24, various kinds of rubber or resin which have been crushed to a predetermined size in advance are used. The size after pulverization is an important factor for determining the density of the surface elastic body layer 12 after molding the chip composite molded body.
And the thickness of the unvulcanized rubber 3
The thickness of the elastic tip 24 is 0.5 to 1.5.
It is set to be about twice. In this embodiment,
A waste or the like is preferably used as a raw material of the elastic chip 24, but is not limited thereto. The type of the rubber or resin is not particularly limited, but can be suitably selected depending on the intended use of the chip composite molded article. For example, rubber is preferably used when high elasticity is required, and resin is preferably used when hardness is required. If the elasticity of the surface elastic layer 12 is not impaired,
Impurities such as glass pieces or metal pieces may be mixed in the elastic chip 24.

【0016】前記バインダ26としては、湿分硬化型の
ポリウレタン等が好適に使用されるが、その他熱硬化型
のポリウレタンやゴム系接着剤も使用可能である。前述
の各バインダは、前記弾性チップ24の材質に合わせて
適宜選択的に使用される。そしてこれらバインダ26の
前記チップ24への付与は、ミキサーによる混合、スプ
レー噴射または含浸等により行われる。
As the binder 26, moisture-curable polyurethane or the like is preferably used, but other thermosetting polyurethanes or rubber-based adhesives can also be used. Each of the above-mentioned binders is selectively used as appropriate according to the material of the elastic chip 24. The application of the binder 26 to the chips 24 is performed by mixing with a mixer, spraying or impregnation.

【0017】前述の弾性チップ24およびバインダ26
から得られる弾性体20については、該弾性チップ24
およびバインダ26の混合割合等の諸要素を変化させる
ことで、多孔性等の機能性、すなわち透水性、脱臭に代
表される吸着性等といった機能を与えることが可能であ
る。
The aforementioned elastic tip 24 and binder 26
Of the elastic body 20 obtained from
By changing various factors such as the mixing ratio of the binder 26 and the like, it is possible to provide functionality such as porosity, that is, functions such as water permeability and adsorptivity represented by deodorization.

【0018】前記未加硫ゴム30としては、予めシート
形状に加工された未加硫状態のゴムシート32が好適に
使用される。前記未加硫状態のゴムシート32は、所定
の厚さを有すると共に、チップ複合成形体の成形時の圧
縮加熱により該未加硫状態のゴムシート32が加硫・硬
化されるように、予め加硫剤が必要充分に混合されたも
のである。従って、各構成物が積層されて圧縮加熱され
るまでは柔軟な状態を維持し、この圧縮加熱後には必要
充分な強度を維持し得るものである。
As the unvulcanized rubber 30, an unvulcanized rubber sheet 32 previously processed into a sheet shape is preferably used. The unvulcanized rubber sheet 32 has a predetermined thickness, and is pre-cured so that the unvulcanized rubber sheet 32 is vulcanized and cured by compression heating during molding of the chip composite molded body. A vulcanizing agent is a necessary and sufficient mixture. Therefore, it is possible to maintain a flexible state until the components are stacked and heated by compression, and to maintain a necessary and sufficient strength after the compression and heating.

【0019】また他の構成として、図2に示す如く、未
加硫ゴム生液と加硫剤とを混合した未加硫ゴムの混合液
34、すなわち液体状態のまま利用する方法もある。こ
の場合、液体状態である前記未加硫ゴムの混合液34
が、各構成物を層状にした際に、上下に位置する剛性体
40および弾性体20にしみ込まないように構成する必
要がある。すなわち、前記剛性体40としては、表面に
気孔等が少ない金属板等を使用し、前記弾性体20は混
合物の状態ではなく、予め成形した状態としておく必要
がある。このような構成とすると、前記剛性体40およ
び弾性体20内にしみ込んだ状態で前記未加硫ゴムの混
合液34が加熱・硬化されることになるので、このしみ
込んで硬化した部分が物理的に強固な結合力を提供し得
る利点がある。この場合、前記剛性体40と未加硫ゴム
30との間の接着手段50は不要となる。
As another configuration, as shown in FIG. 2, there is a method of using an unvulcanized rubber mixture 34 obtained by mixing an unvulcanized rubber raw liquid and a vulcanizing agent, that is, a liquid state. In this case, the mixed liquid 34 of the unvulcanized rubber in a liquid state
However, when each component is formed into a layer, it is necessary to configure the component so that it does not penetrate into the rigid body 40 and the elastic body 20 positioned above and below. That is, as the rigid body 40, a metal plate or the like having a small number of pores or the like on its surface is used, and the elastic body 20 needs to be formed in advance, not in a mixture state. With such a configuration, the mixed liquid 34 of the unvulcanized rubber is heated and hardened in a state where it is impregnated in the rigid body 40 and the elastic body 20. Has the advantage that it can provide a strong binding force. In this case, the bonding means 50 between the rigid body 40 and the unvulcanized rubber 30 becomes unnecessary.

【0020】[0020]

【製造方法】チップ複合成形体の製造方法の概略を述べ
ると、図3および図4に示す如く、密閉的に閉成するこ
とでキャビティ60cを画成する上型60aおよび下型
60bから構成され、図示しない制御機構により開閉お
よび温度制御自在になっている金型60中に、チップ複
合成形物の構成物を順次入れて積層状態とした後、該金
型60を密閉状態として圧縮しながら所定温度・時間の
加熱を施すことでチップ複合成形体10を得るものであ
る。また前記金型60は、電気ヒーター等の加熱手段6
2を備える熱板64,64により狭持されるように構成
されている。また構成によっては前記金型60を構成す
る上型60aおよび下型60b自体に前記加熱手段62
を備えるようにしてもよい。
The manufacturing method of the chip composite molded body will be briefly described. As shown in FIGS. 3 and 4, the chip composite molded body is composed of an upper mold 60a and a lower mold 60b which define a cavity 60c by being hermetically closed. After the components of the chip composite molded article are sequentially placed in a mold 60 that can be freely opened and closed and controlled in temperature by a control mechanism (not shown) to form a laminated state, the mold 60 is sealed and compressed to a predetermined state. The chip composite molded body 10 is obtained by heating at a temperature and time. The mold 60 is provided with a heating means 6 such as an electric heater.
It is configured so as to be held by the hot plates 64, 64 provided with the two. Depending on the configuration, the heating means 62 may be provided on the upper mold 60a and the lower mold 60b constituting the mold 60.
May be provided.

【0021】前述の製造方法を詳細に述べれば、図5に
示す如く、前記下金型60b内に基材層16となるコン
クリート等の板状の剛性体40を載置する(図5(a)参
照)。そしてこの板状の剛性体40の表面全面に亘っ
て、該板状の剛性体40上に接着手段50としての加硫
接着剤を塗布等の方法で充分に付与する(図5(b)参
照)。通常のポリウレタン等の接着剤を接着手段50と
して用いることも可能であるが、その際は未加硫ゴム3
0と剛性体40とを好適に接着し得る種類の接着剤を用
いることが必要であり、また予め前記未加硫ゴム30お
よび弾性体20を層状に結合した中間成形体11を作成
し、該中間成形体11と剛性体40とを接着する等の配
慮が必要となる(詳細は後述)。
The above-mentioned manufacturing method will be described in detail. As shown in FIG. 5, a plate-like rigid body 40 such as concrete serving as the base material layer 16 is placed in the lower mold 60b (FIG. 5 (a)). )reference). Then, a vulcanizing adhesive as the bonding means 50 is sufficiently applied to the plate-shaped rigid body 40 by a method such as coating over the entire surface of the plate-shaped rigid body 40 (see FIG. 5B). ). It is also possible to use an ordinary adhesive such as polyurethane as the bonding means 50. In this case, the unvulcanized rubber 3
It is necessary to use an adhesive of a type that can suitably bond the rigid body 40 to the non-vulcanized rubber 30 and the intermediate molded body 11 in which the unvulcanized rubber 30 and the elastic body 20 are previously bonded in layers. Consideration such as bonding the intermediate molded body 11 and the rigid body 40 is required (details will be described later).

【0022】次いで接着手段50としての加硫接着剤上
に、図6に示す如く、前記未加硫状態のゴムシート32
を敷設する。この未加硫状態のゴムシート32は、加硫
・硬化前の状態であるので柔軟性を有しており、チップ
複合成形体10成形時の圧縮により容易に変形し得る。
また加熱により速やかに硬化し始め、完全硬化に至るも
のである。
Next, as shown in FIG. 6, the unvulcanized rubber sheet 32 is placed on the vulcanized adhesive as the bonding means 50.
Laying. The unvulcanized rubber sheet 32 has flexibility before being vulcanized and cured, and can be easily deformed by compression during molding of the chip composite molded body 10.
In addition, the composition starts to be cured promptly by heating and reaches complete curing.

【0023】最後に表面弾性体層12を形成する弾性チ
ップ24とバインダ26との混合物を、図7に示す如
く、前記未加硫状態のゴムシート32上に所定量投入す
る。前記混合物は、チップ複合成形体10の成形と同時
にバインダ26が硬化して弾性体20として成形される
と共に、構成要素である前記弾性チップ24が前記未加
硫状態のゴムシート32に食込むことになる。すなわち
チップ複合成形体10に成形された際には、前記表面弾
性体層12となる弾性体20を構成する多数の弾性チッ
プ24が、成形時の圧縮によりゴム層14となる前記未
加硫状態のゴムシート32に食込んだままでチップ複合
成形体10の成形が完了することになる。すなわち、所
謂アンカー効果が発揮され、該表面弾性体層12および
ゴム層14が非常に強固に接合されることになる。この
例では、弾性体20を混合物の状態で金型60内に投
入、チップ複合成形体10の成形と同時に表面弾性体層
12を形成し得るようにしているが、所定形状・厚さの
弾性体20を予め前記混合物から成形しておき、前記未
加硫状態のゴムシート32上に敷設するようにしてもよ
い。
Finally, a predetermined amount of a mixture of the elastic chip 24 and the binder 26 forming the surface elastic layer 12 is put on the unvulcanized rubber sheet 32 as shown in FIG. The mixture is formed such that the binder 26 is cured and molded as the elastic body 20 simultaneously with the molding of the chip composite molded body 10, and the elastic chip 24, which is a component, bites into the unvulcanized rubber sheet 32. become. That is, when molded into the chip composite molded body 10, the large number of elastic chips 24 constituting the elastic body 20 which becomes the surface elastic body layer 12 become the rubber layer 14 by compression during molding. The molding of the chip composite molded body 10 is completed while the rubber sheet 32 is cut into the rubber sheet 32. That is, a so-called anchor effect is exerted, and the surface elastic layer 12 and the rubber layer 14 are bonded very firmly. In this example, the elastic body 20 is put into the mold 60 in the form of a mixture so that the surface elastic body layer 12 can be formed simultaneously with the molding of the chip composite molded body 10. The body 20 may be formed in advance from the mixture and laid on the unvulcanized rubber sheet 32.

【0024】所定時間・温度による圧縮加熱によって、
チップ複合成形体10を構成する前記基材層16とゴム
層14とは、接着手段50としての加硫接着剤により、
また該ゴム層14と表面弾性体層12とは、該表面弾性
体層12中のバインダ26の化学的な接着力および弾性
チップ24が食込む物理的なアンカー効果により、夫々
強固に結合される。そして前記金型60を開放して、成
形済のチップ複合成形体10を内部より取出し、冷却、
各種加工等の処理を施すことで完成する。
By compression heating for a predetermined time and temperature,
The base layer 16 and the rubber layer 14 constituting the chip composite molded body 10 are bonded by a vulcanized adhesive as the bonding means 50.
The rubber layer 14 and the surface elastic layer 12 are firmly bonded to each other due to the chemical adhesive force of the binder 26 in the surface elastic layer 12 and the physical anchor effect that the elastic chip 24 cuts into. . Then, the mold 60 is opened, the molded chip composite molded body 10 is taken out from the inside, cooled,
It is completed by performing various processes such as processing.

【0025】[0025]

【別の製造方法】以上のように、本発明の好適な実施例
に係るチップ複合成形体の製造方法は、金型60内へ剛
性体40の載置、加硫接着剤の付与、未加硫のゴムシー
ト32の敷設および弾性チップ24とバインダ26との
混合物の投入により層状物を形成し、圧縮加熱を行なう
ことでチップ複合成形体10を得るが(図4参照)、他の
製造方法として、前記混合物に代えて予め成形を施した
弾性体20を敷設するようにした製造方法(図8(a)参
照)や、前述の如く、未加硫のゴムシート32に代えて
未加硫ゴム生液と加硫剤との混合液34を用いてチップ
複合成形体10を製造するようにしてもよい(図8(b)
参照)。
As described above, the method for manufacturing a chip composite molded article according to the preferred embodiment of the present invention comprises placing the rigid body 40 in the mold 60, applying the vulcanized adhesive, A layered material is formed by laying a sulfuric rubber sheet 32 and charging a mixture of the elastic chip 24 and the binder 26, and the chip composite molded body 10 is obtained by performing compression heating (see FIG. 4). As an example, a manufacturing method in which an elastic body 20 previously molded is laid instead of the mixture (see FIG. 8A), or an unvulcanized rubber sheet 32 is used instead of the unvulcanized rubber sheet 32 as described above. The chip composite molded body 10 may be manufactured using a mixed liquid 34 of a rubber raw liquid and a vulcanizing agent (FIG. 8B).
reference).

【0026】更に別の製造方法として、図9および図1
0に示す如く、前述の何れかの製造方法に準じて、弾性
体20および未加硫ゴム30からなる層状の中間成形体
11を予め成形しておき、該中間成形体11および剛性
体40を接着手段50を用いて接着してチップ複合成形
体10を形成する方法がある。この製造方法で使用され
る接着手段50としては、基材層16となる金属板また
はコンクリートと、ゴム層14となる各種ゴムとを確実
に接着し得る各種類の接着剤が適宜選択的に使用され
る。すなわち前記基材層16、ゴム層14の材質によっ
て変化するものである。前記基材層16とゴム層14と
の接着工程では接着だけが行なわれるので、使用される
接着剤に最も好適な条件を採用することが可能である。
例えば硬化時間だけで充分に強固な接着力を発揮する接
着剤を接着手段50として採用すれば、成形に係る成形
型や制御装置が不要となり、またコンクリート地や、厚
さ4mm程度の鋼板で形成される階段等の上に接着手段
50を付与して、前記中間成形体11を敷設するといっ
た現場での施工によっても、チップ複合成形体を得るこ
とが可能となる。
FIGS. 9 and 1 show still another manufacturing method.
As shown in FIG. 0, a layered intermediate molded body 11 made of the elastic body 20 and the unvulcanized rubber 30 is molded in advance according to any of the above-described manufacturing methods, and the intermediate molded body 11 and the rigid body 40 are formed. There is a method of forming the chip composite molded body 10 by bonding using the bonding means 50. As the adhesive means 50 used in this manufacturing method, various kinds of adhesives capable of securely adhering a metal plate or concrete serving as the base material layer 16 and various rubbers serving as the rubber layer 14 are selectively used as appropriate. Is done. That is, it changes depending on the material of the base layer 16 and the rubber layer 14. Since only the bonding is performed in the bonding step between the base material layer 16 and the rubber layer 14, it is possible to employ the most suitable conditions for the adhesive used.
For example, if an adhesive exhibiting a sufficiently strong adhesive force only in the curing time is adopted as the bonding means 50, a forming die and a control device related to the forming become unnecessary, and a concrete ground or a steel plate having a thickness of about 4 mm is formed. It is also possible to obtain a chip composite molded body by performing on-site construction such as providing the bonding means 50 on a step or the like to be performed and laying the intermediate molded body 11.

【0027】[0027]

【変更例】前述の好適な実施例では、基材層16、ゴム
層14および表面弾性体層12からなるチップ複合成形
体10について述べたが、圧縮加熱による成形前の弾性
体20(混合物)の上に離型紙等の離型手段52を介し
て、その更に上側に、弾性体20(混合物)、未加硫状態
のゴムシート32、板状の剛性体40の順序で積層させ
て、圧縮加熱して成形してもよい。この場合、図10に
示す如く、2つのチップ複合成形体10,10が同時に
得られるので、製造コストの低減が期待できる。
Modification In the preferred embodiment described above, the chip composite molded body 10 including the base material layer 16, the rubber layer 14, and the surface elastic body layer 12 has been described, but the elastic body 20 (mixture) before molding by compression heating is described. The elastic body 20 (mixture), the unvulcanized rubber sheet 32, and the plate-like rigid body 40 are stacked in this order on the upper side through a release means 52 such as release paper, and compressed. You may shape | mold by heating. In this case, as shown in FIG. 10, two chip composite molded bodies 10, 10 can be obtained at the same time, so that a reduction in manufacturing cost can be expected.

【0028】[0028]

【実験例】以下複数の実験例を挙げるが、本発明はこれ
ら実験例に開示された内容に限定されるものではない。
また以下の実験例で使用される表面弾性体層を形成する
弾性体として、弾性チップとバインダとの混合物を使用
する。前記弾性チップとしては2mmメッシュ程度に粉
砕されたゴムチップを、バインダとしてはウレタンバイ
ンダ(ウレタンプレポリマー)を採用した。また前記混合
物を得る際の混合割合は、弾性チップ:バインダ=10
0:3(重量比)であり、これらを充分に混合して使用し
た。
[Experimental Examples] The following are some experimental examples, but the present invention is not limited to the contents disclosed in these experimental examples.
In addition, a mixture of an elastic chip and a binder is used as an elastic body for forming a surface elastic body layer used in the following experimental examples. A rubber chip pulverized to about 2 mm mesh was used as the elastic chip, and a urethane binder (urethane prepolymer) was used as a binder. The mixing ratio for obtaining the mixture is as follows: elastic chip: binder = 10
0: 3 (weight ratio), and these were sufficiently mixed and used.

【0029】(実験1)合計で5個の実験体を用意した。
その内の実験例1〜3は、本発明に係るチップ複合成形
体の実験体である。その構成は板状の剛性体として厚さ
10mmの鋼板を、未加硫ゴムとして所定厚さの未加硫
状態のゴムシート(EPDM製)を、そして弾性体として
見かけ比重1.0となるようにした前記混合物を夫々用
いた。また前記鋼板(剛性体)と未加硫ゴム間に塗布され
る接着剤は、前述の説明の通り加硫接着剤である。そし
て従来の成形物として、比較例4および5の2つを用意
し、剛性体、弾性体については実験例1〜3と同様のも
のを用い、未加硫ゴムを配設しない構成とした。また前
記鋼板(剛性体)表面に付与される接着剤として、比較例
4では実験例1〜3と同様の加硫接着剤を用い、比較例
5ではエラストマー薄膜を作るようにしたウレタンバイ
ンダを用いた。前記各実験例および比較例に未加硫状態
のゴムシートの厚さおよびチップ複合成形体成形時の表
面弾性体層の厚さは、以下に示す表1の通りである。な
お、この実験で用いられる剛性体としての鋼板はその厚
さが、例えば階段等に通常使用される鋼板に比較して厚
い10mmのものが採用されているが、これは後述する
引張り試験の結果を明確にするための手段であって、あ
えて10mmの鋼板を採用するようにた。
(Experiment 1) A total of five experimental bodies were prepared.
Experimental examples 1 to 3 are experimental examples of the chip composite molded article according to the present invention. The configuration is such that a 10 mm thick steel plate is used as a plate-like rigid body, an unvulcanized rubber sheet (made of EPDM) of a predetermined thickness is used as an unvulcanized rubber, and an apparent specific gravity is 1.0 as an elastic body. Each of the above mixtures was used. The adhesive applied between the steel plate (rigid body) and the unvulcanized rubber is a vulcanized adhesive as described above. Then, two comparative examples 4 and 5 were prepared as conventional molded articles, and the same rigid and elastic bodies as those in Experimental Examples 1 to 3 were used, and no unvulcanized rubber was provided. Further, as an adhesive applied to the surface of the steel plate (rigid body), the same vulcanizing adhesive as used in Experimental Examples 1 to 3 was used in Comparative Example 4, and a urethane binder used to form an elastomer thin film was used in Comparative Example 5. Was. The thickness of the rubber sheet in the unvulcanized state and the thickness of the surface elastic layer at the time of molding the chip composite molded body in each of the experimental examples and comparative examples are as shown in Table 1 below. The steel plate used as a rigid body used in this experiment has a thickness of 10 mm, which is thicker than a steel plate normally used for, for example, stairs. This is the result of a tensile test described later. In order to clarify the above, a steel plate of 10 mm was dared to be adopted.

【0030】実験例1、実験例2および実験例3では、
図12に示す如く表1に記した各厚さの構成物を、下か
ら剛性体、(接着剤)、未加硫ゴム、弾性体、未加硫ゴ
ム、(接着剤)および剛性体の順序で積層して層状物とし
(図12(a)参照)、また比較例4および比較例5では、
前述した各厚さの構成物を、下から剛性体、(接着剤)、
弾性体、(接着剤)および剛性体の順序で積層して層状物
とし(図12(b)参照)、所定の金型にて160℃、10
minの加熱条件で、成形を施してチップ複合成形体と
した。そして成形完了後、両外側に配置されている基材
層としての2枚の鋼板を、前記チップ複合成形体が破壊
されるまで互いに離間する方向に引張り、該チップ複合
成形体が破壊された時点での破壊強度および破壊位置を
測定および目視にて夫々確認した。その結果を以下の表
2に示す。
In Experimental Example 1, Experimental Example 2 and Experimental Example 3,
As shown in FIG. 12, the components of each thickness described in Table 1 were arranged in the order of rigid body, (adhesive), unvulcanized rubber, elastic body, unvulcanized rubber, (adhesive) and rigid body from below. To form a layered material
(See FIG. 12A), and in Comparative Examples 4 and 5,
The components of each thickness described above, rigid body from below, (adhesive),
The elastic body, the (adhesive) and the rigid body are laminated in this order to form a layered product (see FIG. 12 (b)).
Molding was performed under a heating condition of min to obtain a chip composite molded body. After the completion of the molding, the two steel plates serving as the base material layers disposed on both outer sides are pulled in a direction away from each other until the chip composite molded body is destroyed, and the chip composite molded body is destroyed. The breaking strength and the breaking position were measured and visually confirmed. The results are shown in Table 2 below.

【0031】この表2から分るように、本発明に係る構
成で積層・成形された各チップ複合成形体は、比較例4
および5の従来の成形体とは異なり、その破壊強度が大
きく破壊位置がチップ間に限定されている。すなわち表
面弾性体層と基材層との結合強度が充分に強固であるこ
とが確認された。またゴム層の厚みは、前記弾性チップ
の大きさに大きな影響を受けないことも類推される。し
かし、前記弾性チップの大きさが許容範囲を超えて大き
かったり、前記ゴム層が著しく薄い場合には、該弾性チ
ップの食込みによる、所謂アンカー効果が期待できない
ので、前述したように弾性チップの大きさの0.5〜1.
5程度が妥当であると考えられる。
As can be seen from Table 2, each of the chip composite compacts laminated and molded in the configuration according to the present invention was obtained in Comparative Example 4.
Unlike the conventional compacts of (5) and (5), the breaking strength is large and the breaking position is limited between the chips. That is, it was confirmed that the bonding strength between the surface elastic body layer and the base material layer was sufficiently strong. It is also presumed that the thickness of the rubber layer is not greatly affected by the size of the elastic tip. However, when the size of the elastic tip is larger than the allowable range or when the rubber layer is extremely thin, a so-called anchor effect due to the biting of the elastic tip cannot be expected. 0.5 to 1.
About 5 is considered to be appropriate.

【0032】(実験2)基本的には、前述の実験例1〜3
に準ずる条件で、板状の剛性体として厚さ10mmの鋼
板を、未加硫ゴムとして所定厚さの未加硫状態のゴムシ
ート(EPDM製)を、そして弾性体として見かけ比重
1.0となるようにした前記混合物を用い、夫々を積層
して層状物として比較例6および7とし、所定の金型に
て160℃、10minの条件で成形を施してチップ複
合成形体とした。但し比較例6の場合には、剛性体の表
面には加硫接着剤を付与せず、未加硫ゴムの硬化だけを
利用して該剛性体および未加硫ゴムを接着させた。そし
て比較例7の場合には、剛性体上に敷設された未加硫ゴ
ム上に混合物を投入するのに先立ち、この未加硫ゴムの
表面に弾性チップを結合するのに用いられているウレタ
ンバインダを別途塗布する処理を施した。
(Experiment 2) Basically, the above-mentioned experimental examples 1 to 3
Under the same conditions, a 10 mm-thick steel plate as a plate-like rigid body, an unvulcanized rubber sheet (made of EPDM) having a predetermined thickness as an unvulcanized rubber, and an apparent specific gravity of 1.0 as an elastic body. Using the above mixture, each was laminated to form a layered product as Comparative Examples 6 and 7, and molded in a predetermined mold at 160 ° C. for 10 minutes to obtain a chip composite molded product. However, in the case of Comparative Example 6, no vulcanizing adhesive was applied to the surface of the rigid body, and the rigid body and the unvulcanized rubber were bonded using only the curing of the unvulcanized rubber. In the case of Comparative Example 7, the urethane used for bonding the elastic chip to the surface of the unvulcanized rubber is used before the mixture is poured onto the unvulcanized rubber laid on the rigid body. A process for separately applying a binder was performed.

【0033】前記実験1と同様にチップ複合成形体とし
た後に、両外側に配置されている基材層としての2枚の
鋼板を、前記チップ複合成形体が破壊されるまで互いに
離間する方向に引張り、該チップ複合成形体が破壊され
た時点の破壊強度および破壊位置を測定および目視にて
夫々確認した。この結果を以下の表3に実験例1と共に
示す。比較例6に係るチップ複合弾性体は、その破壊強
度が9.9kgf/cm2、と非常に弱く、破壊が基材層−ゴム
層の位置に発生しており、加硫接着剤が大きな役割を果
していることが確認された。また比較例7については非
常に良い結果が得られ、本発明に係るチップ複合成形体
に、従来の方法に係る接着方法が加味し得ると共に、更
に接合を強固にし得ることが確認された。
After forming the chip composite molded body in the same manner as in Experiment 1, the two steel sheets serving as the base layers disposed on both outer sides are separated from each other until the chip composite molded body is broken. Tensile strength and breaking position at the time when the chip composite was broken were measured and visually confirmed. The results are shown in Table 3 below together with Experimental Example 1. The chip composite elastic body according to Comparative Example 6 had a very weak breaking strength of 9.9 kgf / cm 2 , and the breaking occurred at the position between the base material layer and the rubber layer, and the vulcanized adhesive played a major role. Was confirmed. In addition, with respect to Comparative Example 7, a very good result was obtained, and it was confirmed that the bonding method according to the conventional method can be added to the chip composite molded article according to the present invention, and the bonding can be further strengthened.

【0034】(実験3)前述の実験1にて、好適な結果を
収めた実験例1と同様の製造方法で成形されたチップ複
合成形体を、所定の寸法に加工して階段のステップに利
用した。そしてこの時の使用状況を実際の使用および目
視により確認した。本発明に係るチップ複合成形体の利
用した場合、通常階段の一部にしか採用されていないゴ
ム等の弾性物質が階段のステップ全体に使用されるた
め、該階段の昇降に伴う足音等が大きく低減され、また
表面弾性体層を構成する弾性チップ間に存在する気孔に
より透水性が発揮され、更に強固な結合力により剥がれ
にくいため、安全かつ快適であり静粛性の高い階段ステ
ップを得ることができた。
(Experiment 3) The chip composite molded body molded by the same production method as in Experimental Example 1 having favorable results obtained in Experiment 1 described above is processed into a predetermined size and used for the steps of the steps. did. The use condition at this time was confirmed by actual use and visual observation. When the chip composite molded body according to the present invention is used, since elastic materials such as rubber, which are usually adopted only for a part of the stairs, are used for the entire steps of the stairs, footsteps and the like accompanying the ascending and descending of the stairs are large. It is possible to obtain a safe, comfortable and quiet quiet stair step because water permeability is exhibited by the pores existing between the elastic chips constituting the surface elastic body layer, and it is hard to peel off due to the strong bonding force. did it.

【0035】[0035]

【発明の効果】以上に説明した如く、本発明に係るチッ
プ複合成形体とその製造方法によれば、基材層と表面弾
性体層との間に未加硫ゴムを加熱・硬化させて得られる
ゴム層を介在させたことにより、表面状態の違いでこれ
まで強固な結合が望めなかった該基材層と表面弾性体層
とを強固に結合し得るチップ複合成形体を得ることがで
きる。
As described above, according to the chip composite molded article and the method for producing the same according to the present invention, the unvulcanized rubber is heated and cured between the base material layer and the surface elastic material layer. With the rubber layer interposed therebetween, it is possible to obtain a chip composite molded body capable of firmly bonding the base material layer and the surface elastic material layer, for which strong bonding has not been expected due to a difference in surface state.

【図面の簡単な説明】[Brief description of the drawings]

【図1】本発明の好適な実施例に係るチップ複合成形体
の概略断面図である。
FIG. 1 is a schematic sectional view of a chip composite molded body according to a preferred embodiment of the present invention.

【図2】本願の別の発明に係るチップ複合成形体の概略
断面図である。
FIG. 2 is a schematic sectional view of a chip composite molded body according to another invention of the present application.

【図3】本発明の実施例に係るチップ複合成形体の製造
工程図である。
FIG. 3 is a manufacturing process diagram of a chip composite molded body according to an example of the present invention.

【図4】本発明の好適な実施例の製造方法によるチップ
複合成形体の製造工程のフローチャート図である。
FIG. 4 is a flowchart of a manufacturing process of a chip composite molded body according to a manufacturing method of a preferred embodiment of the present invention.

【図5】図3に示したチップ複合成形体の製造工程の一
部を更に説明するための概略図である。
FIG. 5 is a schematic diagram for further explaining a part of the manufacturing process of the chip composite molded body shown in FIG. 3;

【図6】図3に示したチップ複合成形体の製造工程の一
部を更に説明するための概略図である。
FIG. 6 is a schematic view for further explaining a part of the manufacturing process of the chip composite molded body shown in FIG. 3;

【図7】図3に示したチップ複合成形体の製造工程の一
部を更に説明するための概略図である。
FIG. 7 is a schematic view for further explaining a part of the manufacturing process of the chip composite molded body shown in FIG. 3;

【図8】本発明の好適な実施例の製造方法とは別の製造
方法によるチップ複合成形体の製造工程のフローチャー
ト図である。
FIG. 8 is a flowchart of a manufacturing process of a chip composite molded body by a manufacturing method different from the manufacturing method of the preferred embodiment of the present invention.

【図9】本発明の好適な実施例の製造方法とは別の製造
方法によるチップ複合成形体の製造工程のフローチャー
ト図である。
FIG. 9 is a flowchart of a manufacturing process of a chip composite formed body by a manufacturing method different from the manufacturing method of the preferred embodiment of the present invention.

【図10】本発明の好適な実施例の製造方法とは別の製
造方法によるチップ複合成形体の製造工程のフローチャ
ート図である。
FIG. 10 is a flowchart of a manufacturing process of a chip composite molded body by a manufacturing method different from the manufacturing method of the preferred embodiment of the present invention.

【図11】本発明の実施例に係るチップ複合成形体の別
の変更例を示す概略断面図である。
FIG. 11 is a schematic sectional view showing another modified example of the chip composite molded body according to the embodiment of the present invention.

【図12】本発明に係るチップ複合成形体の実験時に採
用された各構成物の積層状態を示す概略断面図である。
FIG. 12 is a schematic cross-sectional view showing a layered state of each component adopted during an experiment of the chip composite molded body according to the present invention.

【符号の説明】[Explanation of symbols]

12 表面弾性体層 11 中間成形体 14 ゴム層 16 基材層 20 弾性体 24 弾性チップ 26 バインダ 30 未加硫ゴム 32 未加硫状態のゴムシート 34 混合液 40 剛性体 50 加硫接着剤(接着手段) 60 金型 REFERENCE SIGNS LIST 12 surface elastic body layer 11 intermediate molded body 14 rubber layer 16 base layer 20 elastic body 24 elastic chip 26 binder 30 unvulcanized rubber 32 unvulcanized rubber sheet 34 mixed solution 40 rigid body 50 vulcanized adhesive (adhesive Means) 60 mold

─────────────────────────────────────────────────────
────────────────────────────────────────────────── ───

【手続補正書】[Procedure amendment]

【提出日】平成11年7月22日(1999.7.2
2)
[Submission date] July 22, 1999 (July 7, 1999
2)

【手続補正1】[Procedure amendment 1]

【補正対象書類名】図面[Document name to be amended] Drawing

【補正対象項目名】図8[Correction target item name] Fig. 8

【補正方法】変更[Correction method] Change

【補正内容】[Correction contents]

【図8】 FIG. 8

【手続補正2】[Procedure amendment 2]

【補正対象書類名】図面[Document name to be amended] Drawing

【補正対象項目名】図10[Correction target item name] FIG.

【補正方法】変更[Correction method] Change

【補正内容】[Correction contents]

【図10】 FIG. 10

───────────────────────────────────────────────────── フロントページの続き (51)Int.Cl.7 識別記号 FI テーマコート゛(参考) B29K 105:20 105:24 B29L 9:00 Fターム(参考) 4F100 AB03 AK51 AK75 AN00C AS00A AT00B BA03 BA07 BA10A BA10B CA03 DE05A EC18 EC182 EJ06 EJ062 EJ08 EJ08C EJ082 EJ17 EJ42 GB07 JB15C JK01B JK07A JL16 4F203 AA31 AA45 AC01 AD03 AD08 AD18 DA11 DB02 DB11 DC01 DD04 DE06 DF01 DF05 DJ01 DW06 4F204 AA31 AA45 AC01 AD03 AD08 AD18 FA01 FB01 FB11 FB13 FB24 FE06 FE17 FF01 FG01 FG02 FH06 FN07 FN17 FQ01 FQ15 FQ19 FW06 ──────────────────────────────────────────────────続 き Continued on the front page (51) Int.Cl. 7 Identification code FI Theme coat ゛ (Reference) B29K 105: 20 105: 24 B29L 9:00 F term (Reference) 4F100 AB03 AK51 AK75 AN00C AS00A AT00B BA03 BA07 BA10A BA10B CA03 DE05A EC18 EC182 EJ06 EJ062 EJ08 EJ08C EJ082 EJ17 EJ42 GB07 JB15C JK01B JK07A JL16 4F203 AA31 AA45 AC01 AD03 AD08 AD18 DA11 DB02 DB11 DC01 DD04 DE06 DF01 DF05 DJ01 DW06 4F204 AA01 FB01 AD13 FB03 FH06 FN07 FN17 FQ01 FQ15 FQ19 FW06

Claims (9)

【特許請求の範囲】[Claims] 【請求項1】 弾性物質を粉砕して得た多数の弾性チッ
プ(24)をバインダ(26)で結合させた弾性体(20)からなる
表面弾性体層(12)と、 板状の剛性体(40)からなる基材層(16)と、 前記表面弾性体層(12)および基材層(16)の間に介在し、
未加硫ゴム(30)を加熱して硬化させることでこれら表面
弾性体層(12)および基材層(16)を結合させるゴム層(14)
とからなることを特徴とするチップ複合成形体。
1. A surface elastic body layer (12) comprising an elastic body (20) in which a number of elastic chips (24) obtained by pulverizing an elastic substance are joined by a binder (26); A base layer (16) made of (40), interposed between the surface elastic body layer (12) and the base layer (16),
A rubber layer (14) that bonds the surface elastic layer (12) and the base layer (16) by heating and curing the unvulcanized rubber (30)
A chip composite molded body, comprising:
【請求項2】 弾性物質を粉砕して得た多数の弾性チッ
プ(24)からなる弾性体(20)と板状の剛性体(40)とを結合
させたチップ複合成形体の製造方法であって、 所定の金型(60)内に載置した前記板状の剛性体(40)上に
予め接着手段(50)を付与し、 この接着手段(50)上に所定厚さで未加硫状態のゴムシー
ト(32)を敷設し、 この未加硫状態のゴムシート(32)上に、前記弾性体(20)
の原料となる弾性チップ(24)とバインダ(26)との混合物
を投入して層状とし、 前記金型(60)による圧縮加熱を行なって、前記混合物か
ら弾性体(20)を成形すると共に、前記未加硫状態のゴム
シート(32)を加硫・硬化させることで該弾性体(20)と前
記板状の剛性体(40)とを結合させるようにしたことを特
徴とするチップ複合成形体の製造方法。
2. A method for producing a chip composite molded article in which an elastic body (20) comprising a large number of elastic chips (24) obtained by pulverizing an elastic substance and a plate-like rigid body (40) are combined. A bonding means (50) is previously provided on the plate-like rigid body (40) placed in a predetermined mold (60), and the unvulcanized sheet is formed on the bonding means (50) at a predetermined thickness. A rubber sheet (32) in a state is laid, and the elastic body (20) is placed on the rubber sheet (32) in an unvulcanized state.
A mixture of an elastic chip (24) and a binder (26), which are raw materials, is charged into a layer, and compression heating is performed by the mold (60) to form an elastic body (20) from the mixture, A chip composite molding, wherein the elastic body (20) and the plate-like rigid body (40) are bonded by vulcanizing and curing the unvulcanized rubber sheet (32). How to make the body.
【請求項3】 弾性物質を粉砕して得た多数の弾性チッ
プ(24)からなる弾性体(20)と板状の剛性体(40)とを結合
させたチップ複合成形体の製造方法であって、 所定の金型(60)内に載置した前記板状の剛性体(40)上に
予め接着手段(50)を付与し、 この接着手段(50)上に所定厚さで未加硫状態のゴムシー
ト(32)を敷設し、 この未加硫状態のゴムシート(32)上に、前記弾性チップ
(24)とバインダ(26)との混合物から予め成形しておいた
弾性体(20)を敷設して層状とし、 前記金型(60)による圧縮加熱を行なって、前記未加硫状
態のゴムシート(32)を加硫・硬化させることで前記弾性
体(20)と板状の剛性体(40)とを結合させるするようにし
たことを特徴とするチップ複合成形体の製造方法。
3. A method for producing a chip composite molded article in which an elastic body (20) comprising a large number of elastic chips (24) obtained by crushing an elastic substance and a plate-like rigid body (40) are combined. A bonding means (50) is previously provided on the plate-like rigid body (40) placed in a predetermined mold (60), and the unvulcanized sheet is formed on the bonding means (50) at a predetermined thickness. A rubber sheet (32) is laid, and the elastic chip is placed on the unvulcanized rubber sheet (32).
An elastic body (20) previously molded from a mixture of (24) and a binder (26) is laid and formed into a layer, and is subjected to compression heating by the mold (60), and the rubber in the unvulcanized state is formed. A method for producing a chip composite molded body, characterized in that the elastic body (20) and the plate-like rigid body (40) are bonded by vulcanizing and curing the sheet (32).
【請求項4】 前記接着手段(50)は、加硫接着剤である
請求項2または3記載のチップ複合成形体の製造方法。
4. The method according to claim 2, wherein said bonding means is a vulcanizing adhesive.
【請求項5】 弾性物質を粉砕して得た多数の弾性チッ
プ(24)からなる弾性体(20)と板状の剛性体(40)とを結合
させたチップ複合成形体の製造方法であって、 所定の金型(60)内に前記板状の剛性体(40)を載置し、 この板状の剛性体(40)上に未加硫ゴム生液と加硫剤との
混合液(34)を所定量投入し、 この混合液(34)上に、前記弾性チップ(24)とバインダ(2
6)との混合物から予め成形しておいた弾性体(20)を敷設
して層状とし、 前記金型(60)による圧縮加熱を行なって、前記未加硫ゴ
ム生液と加硫剤との混合液(34)を加硫・硬化させること
で前記弾性体(20)と板状の剛性体(40)とを結合させるよ
うにしたことを特徴とするチップ複合成形体の製造方
法。
5. A method for producing a chip composite molded article in which an elastic body (20) comprising a large number of elastic chips (24) obtained by crushing an elastic substance and a plate-like rigid body (40) are combined. Then, the plate-shaped rigid body (40) is placed in a predetermined mold (60), and a mixed liquid of an unvulcanized rubber raw liquid and a vulcanizing agent is placed on the plate-shaped rigid body (40). (34) is charged in a predetermined amount, and the elastic chip (24) and the binder (2) are placed on the mixture (34).
An elastic body (20) previously molded from the mixture with (6) is laid to form a layer, and compression heating is performed by the mold (60), and the unvulcanized rubber raw liquid and the vulcanizing agent are mixed. A method for producing a chip composite molded body, characterized in that the elastic body (20) and the plate-shaped rigid body (40) are combined by vulcanizing and curing the mixed liquid (34).
【請求項6】 弾性物質を粉砕して得た多数の弾性チッ
プ(24)からなる弾性体(20)と板状の剛性体(40)とを結合
させたチップ複合成形体の製造方法であって、 所定の金型(60)内に、前記弾性体(20)の原料となる弾性
チップ(24)およびバインダ(26)の混合物と、加硫剤を含
有し、かつ予め所定厚さに形成された未加硫状態のゴム
シート(32)とを層状になるよう設置し、 前記金型(60)で圧縮加熱を行なうことで、これにより得
られる前記弾性体(20)と未加硫状態のゴムシート(30)と
が結合した中間成形体(11)を成形し、 前記中間成形体(11)と別途用意した前記板状の剛性体(4
0)とを所要の接着手段(50)により接着させることで、前
記弾性体(20)と該剛性体(40)とを結合させるようにした
ことを特徴とするチップ複合成形体の製造方法。
6. A method for producing a chip composite molded article in which an elastic body (20) comprising a large number of elastic chips (24) obtained by crushing an elastic substance and a plate-like rigid body (40) are combined. In a predetermined mold (60), a mixture of an elastic chip (24) and a binder (26) as a raw material of the elastic body (20), a vulcanizing agent, and a predetermined thickness are formed in advance. The obtained unvulcanized rubber sheet (32) is placed in a layered state, and is subjected to compression heating with the mold (60), so that the elastic body (20) obtained thereby and the unvulcanized state are obtained. An intermediate molded body (11) combined with the rubber sheet (30) is molded, and the intermediate rigid body (11) and the plate-shaped rigid body (4
0) by means of required bonding means (50) to bond the elastic body (20) and the rigid body (40).
【請求項7】 弾性物質を粉砕して得た多数の弾性チッ
プ(24)からなる弾性体(20)と板状の剛性体(40)とを結合
させたチップ複合成形体の製造方法であって、 所定の金型(60)内に、弾性チップ(24)およびバインダ(2
6)の混合物から予め成形しておいた弾性体(20)と、未加
硫ゴム(30)とを層状になるよう設置し、 前記金型(60)で圧縮加熱を行なうことで、前記弾性体(2
0)と未加硫ゴム(30)とが結合した中間成形体(11)を成形
し、 前記中間成形体(11)と別途用意した前記板状の剛性体(4
0)とを所要の接着手段(50)により接着させることで、前
記弾性体(20)と該剛性体(40)とを結合させるようにした
ことを特徴とするチップ複合成形体の製造方法。
7. A method for producing a chip composite molded body in which an elastic body (20) comprising a large number of elastic chips (24) obtained by crushing an elastic substance and a plate-like rigid body (40) are combined. Then, the elastic tip (24) and the binder (2) are placed in a predetermined mold (60).
The elastic body (20) previously molded from the mixture of 6) and the unvulcanized rubber (30) are placed in a layered state, and the elasticity is obtained by performing compression heating with the mold (60). Body (2
(0) and the unvulcanized rubber (30) are combined to form an intermediate molded body (11), and the intermediate molded body (11) and the plate-shaped rigid body (4
0) by means of required bonding means (50) to bond the elastic body (20) and the rigid body (40).
【請求項8】 前記未加硫ゴム(30)は、加硫剤を含有
し、かつ予め所定厚さに形成された未加硫状態のゴムシ
ート(32)である請求項7記載のチップ複合成形体の製造
方法。
8. The chip composite according to claim 7, wherein the unvulcanized rubber (30) is an unvulcanized rubber sheet (32) containing a vulcanizing agent and formed to a predetermined thickness in advance. A method for producing a molded article.
【請求項9】 前記未加硫ゴム(30)は、未加硫ゴム生液
と加硫剤との混合液(34)からなる請求項7記載のチップ
複合成形体の製造方法。
9. The method according to claim 7, wherein the unvulcanized rubber (30) comprises a mixed liquid (34) of an unvulcanized rubber raw liquid and a vulcanizing agent.
JP11203689A 1999-07-16 1999-07-16 Chip composite molding and its manufacture Pending JP2001030424A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
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Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP11203689A JP2001030424A (en) 1999-07-16 1999-07-16 Chip composite molding and its manufacture

Publications (1)

Publication Number Publication Date
JP2001030424A true JP2001030424A (en) 2001-02-06

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Country Link
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Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100636903B1 (en) * 2004-09-15 2006-10-19 (주)석광테크 Mat and method of manufacturing the same
CN102390142A (en) * 2011-07-11 2012-03-28 北京化工大学 Composite material of airtight layer of tire and preparation method thereof
CN103302929A (en) * 2013-06-21 2013-09-18 四川宏亿复合材料工程技术有限公司 Solid rubber-micropore foamed rubber composite material and preparation method thereof
JP2015161145A (en) * 2014-02-28 2015-09-07 株式会社ヒカリワールド Pseudo natural material

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JPH03147836A (en) * 1989-11-06 1991-06-24 Oiles Ind Co Ltd Manufacture of laminated rubber elastic support
JPH03162955A (en) * 1989-01-31 1991-07-12 Sekaicho Rubber Co Ltd Vulcanized rubber product and its manufacture
JPH0459832A (en) * 1990-06-29 1992-02-26 Takechi Kogyo Rubber Kk Method for bonding silicone rubber
JPH04296333A (en) * 1991-03-26 1992-10-20 Yokohama Rubber Co Ltd:The Production of water-permeable elastic cover member
JPH08100071A (en) * 1994-09-29 1996-04-16 Showa Electric Wire & Cable Co Ltd Bonding of rubber to metal
JPH11188827A (en) * 1997-12-26 1999-07-13 Niigata Koatsu Kogyo Kk Method and device for manufacture of concrete slab block with surface layer

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Publication number Priority date Publication date Assignee Title
JPH03162955A (en) * 1989-01-31 1991-07-12 Sekaicho Rubber Co Ltd Vulcanized rubber product and its manufacture
JPH03147836A (en) * 1989-11-06 1991-06-24 Oiles Ind Co Ltd Manufacture of laminated rubber elastic support
JPH0459832A (en) * 1990-06-29 1992-02-26 Takechi Kogyo Rubber Kk Method for bonding silicone rubber
JPH04296333A (en) * 1991-03-26 1992-10-20 Yokohama Rubber Co Ltd:The Production of water-permeable elastic cover member
JPH08100071A (en) * 1994-09-29 1996-04-16 Showa Electric Wire & Cable Co Ltd Bonding of rubber to metal
JPH11188827A (en) * 1997-12-26 1999-07-13 Niigata Koatsu Kogyo Kk Method and device for manufacture of concrete slab block with surface layer

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100636903B1 (en) * 2004-09-15 2006-10-19 (주)석광테크 Mat and method of manufacturing the same
CN102390142A (en) * 2011-07-11 2012-03-28 北京化工大学 Composite material of airtight layer of tire and preparation method thereof
CN102390142B (en) * 2011-07-11 2014-04-02 北京化工大学 Composite material of airtight layer of tire and preparation method thereof
CN103302929A (en) * 2013-06-21 2013-09-18 四川宏亿复合材料工程技术有限公司 Solid rubber-micropore foamed rubber composite material and preparation method thereof
JP2015161145A (en) * 2014-02-28 2015-09-07 株式会社ヒカリワールド Pseudo natural material

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