JP2001024374A - Heat sink for electrical heating element generating heat in high density - Google Patents

Abstract

PROBLEM TO BE SOLVED: To efficiently cool the semiconductor element of miniaturized electric equipment by integrally fixing a vapor chamber and a high-strength heat radiation member for improving the strength to an electrical heating element. SOLUTION: A plate-type heat pipe 1 for composing a vapor chamber is made of a container with a cavity that is sealed, for example, by upper and lower plate materials made of copper, a hole 8 for such fixing member as a screw is formed also at a container, and for example, water is sealed into the sealed cavity member of the container as working fluid. A plate-type heat pipe 1 and a heat sink are overlapped onto electrical heating part placement member 4 where electrical heating parts 5 are placed and are fixed integrally by such fixing member as a screw through the holes 7, 8 and 9, thus strongly pressing the plate-type heat pipe 1 to the electrical heating parts 5 without any deformation by a base with the sufficient bending strength of the heat sink and obtaining high heat performance.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to the heat radiation of high heat density components such as electronic components used in electronic equipment such as servers.
The present invention relates to a heat sink for a high-heat-density heating element for cooling, and more particularly to a heat-sink for a high-heat-density heat generating element that presses a heat element having a high heat density with a predetermined force to cool the heat element.

[0002]

2. Description of the Related Art Semiconductor devices and the like of electronic devices, which are increasing year by year, have been miniaturized, the degree of integration has been increased, the processing speed has been dramatically increased, and the heat generation density has been extremely increased accordingly. Means for efficiently dissipating heat generated by semiconductor elements include a heat sink composed of a base and fins, and a heat pipe having a closed cavity. Among heat pipes, a heat receiving surface is secured to the semiconductor element surface and heat is diffused. Therefore, a plate-type heat pipe is used.

In a heat sink composed of a base and fins, the heat of the heating element is conducted to the base and is radiated to the atmosphere by the fins. The heat pipe is formed of a container (container) having a hollow inside, the inside of the container is decompressed and in a vacuum state, and an appropriate amount of liquid is sealed in the container as a working fluid. When heat is received at a predetermined location outside the container, the liquid in the container existing in the portion where the heat is received evaporates, and the latent heat of evaporation is absorbed in that portion.

[0004] The vapor fills the vessel due to the pressure difference, condenses on the inner surface of the vessel at a predetermined location other than the heat receiving section, and releases latent heat of evaporation at that location. The condensed liquid returns to the evaporating section by a liquid recirculation mechanism called a wick made of mesh, wire, and the like provided in advance on the tube wall inside the container, and evaporates again in the heat receiving section. By repeating the above-described circulation, heat is diffused throughout the container.

When radiating and cooling a high heat generation component using a heat sink or a heat pipe, the degree of contact between the heat sink or heat pipe surface and the high heat generation component surface greatly affects heat radiation. It has been known.

FIG. 2 is a view showing a conventional heat sink for a high heat density heating element. In the case where heat of a heat-generating component is radiated and cooled using a heat sink including a base and a fin as conventionally performed, a screw hole 16 is formed in the fin 12 and the base 11 as shown in FIG. Then, the heat-generating component 14 is sandwiched between the base 11 and the predetermined member 13 and tightened by the screw 15, thereby thermally increasing the contact between the base and the heat-generating component. FIG.
FIG. 2A is a cross-sectional view, and FIG.

As shown in FIG. 2 (b), a hole 17 for fastening with a screw is formed in the member 13 on which the heat generating component 14 is placed. Heat sink is base 1
1 and the fins 12, and the heat sink also has holes 16 corresponding to the holes 17 described above for fastening with screws. The above-described heat sink and the member 13 on which the heat-generating component 14 is mounted are overlapped, and the screw 1
5, the base 11 of the heat sink is
Pressed to.

The size of the heat-generating component, especially the semiconductor element, is, for example, about 45 mm × 45 mm. When the contact between the base and the heat-generating component is thermally increased by tightening with a screw as described above, the size is usually 30 mm. A total load of ４０40 kg was required.

However, the size of the semiconductor device is, for example, approximately 20 mm × 20 m
m to maintain the same level of thermal contact between the miniaturized semiconductor device and the base as described above.
A total load of 0-80 kg is required.

[0010] Therefore, there is a problem that the heat sink composed of the base and the fin cannot withstand the above-mentioned load and is plastically deformed, lowering the thermal efficiency. FIG. 3 is a view showing another conventional heat sink for a high heat generation density heating element.

FIG. 3A is a cross-sectional view of FIG.
(B) shows an assembly drawing. As shown in FIG.
A hole 19 for fastening with a screw is formed in the member 23 on which the heat generating component 24 is placed. The plate-shaped heat pipe 20 also has a hole 18 corresponding to the hole 19 described above for fastening with a screw. The above-described plate-type heat pipe 20 and the member 23 on which the heat-generating component 24 is placed are combined, overlapped, and the plate-type heat pipe 20 is pressed against the heat-generating component 24 by the screw 25.

As shown in FIG. 3, even when a plate-type heat pipe is used, in order to increase the thermal efficiency, the heat contact between the surface of the heat pipe and the surface of the high heat-density component is made in the same manner as the heat sink. It is important to increase. Therefore, even when a heat pipe is used, a total load of about 60 to 80 kg is required between the miniaturized semiconductor element and the heat pipe in order to maintain the same level of thermal contact as described above. Has become.

Therefore, there is a problem that the heat pipe cannot withstand the above-mentioned load and is plastically deformed to lower the thermal efficiency.

In order to solve the above-mentioned problems, it is considered that a heat sink composed of a base and fins is made thicker. However, the cost of parts is increased, the weight is further increased, and the size is reduced. There is a problem that it is not suitable for installation in electronic devices. Further, in the heat pipe, it is necessary to increase the strength of the structure of the heat pipe body. As one method for increasing the strength, for example, many blocks are provided in a container to increase the strength of the heat pipe body. However, if a large number of blocks are provided in the container more than necessary, there is a problem that the volume of the steam flow path is reduced and the thermal performance of the heat pipe is reduced.

[0015]

The conventional heat sink for high heat density heating elements has the following problems. That is, in the technical field of cooling semiconductor devices and the like of electronic devices, there is a tendency to make the entire device compact and increase the packaging density. The density is becoming extremely high. When radiating and cooling such semiconductor elements,
In addition to simply bringing the heat sink into contact, the required density of heat-generating components and the heat sink are brought into close mechanical contact,
Thermal performance needs to be improved.

However, as described above, in the heat sink composed of the base and the fins, it is considered that the base is made thicker. However, the cost of parts increases, the weight increases, and the size of the electronic equipment becomes smaller. Not suitable for installation. Furthermore, in the heat pipe, in order to increase the strength of the structure of the heat pipe main body, when many blocks are provided in the container and the strength of the heat pipe main body is increased, the volume of the steam flow path is reduced, and the heat pipe This causes a problem of deteriorating thermal performance.

Accordingly, an object of the present invention is to increase the heat generation density dramatically, and furthermore, a high heat generation that can be efficiently cooled by pressing against a semiconductor element or the like of an electronic device to be downsized with a predetermined force. An object of the present invention is to provide a heat sink for a density heating element.

[0018]

Means for Solving the Problems In order to solve the above-mentioned conventional problems, the inventors have made intensive studies. As a result, the following findings were obtained. That is, by disposing a plate-type heat pipe between a heat radiating member (heat sink) composed of a base portion and a fin portion and a heating element having a high heat generation density, and making the bending strength of the base portion equal to or more than a predetermined value, It has been found that the strength can be increased as a whole without changing the structural design of the heat pipe.

That is, a base having a predetermined bending strength is
When the vapor chamber is pressed against the heat-generating component with a predetermined force, the peripheral portion of the vapor chamber has sufficient bending strength to prevent bending and deformation toward the heat-generating component. And a heat sink for a high heat generation density heating element that can be efficiently cooled by pressing with the force of the above.

The present invention has been made based on the above findings and the like. A first aspect of the heat sink for a high heat generation density heating element according to the present invention is a heat sink for a high heat generation density heating element comprising the following members. It is. (1) a vapor chamber having a closed cavity in which a heat transfer block is accommodated, wherein one surface is pressed against a heat generating component with a predetermined force to move heat of the heat generating component to a predetermined position; A) a high-strength heat dissipating member comprising a base portion having a predetermined bending strength and a fin portion disposed on the base portion, the high-strength heat dissipating member being arranged on the other surface of the vapor chamber; ,
(3) A fixing member for integrally fixing the vapor chamber and the high-strength heat radiation member to the heat generating component.

Further, a second aspect of the heat sink for a high heat generation density heating element of the present invention is characterized in that the vapor chamber is formed of a plate-type heat pipe.

Further, in a third aspect of the heat sink for a high heat generation density heating element of the present invention, the base portion of the high-strength heat radiating member is configured such that when the vapor chamber is pressed against a heat-generating component by the predetermined force. It is characterized in that the peripheral portion of the vapor chamber has sufficient bending strength to prevent bending and deformation toward the heat-generating component.

Further, a fourth aspect of the heat sink for a high heat generation density heating element of the present invention is characterized in that the base is made of an iron member.

Furthermore, a fifth aspect of the heat sink for a high heat generation density heating element of the present invention is characterized in that a cross-sectional area of the heat transfer block is equal to or larger than a cross-sectional area of the heat generating component.

[0025]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS A heat sink for a high heat generation density heating element according to the present invention will be described. The heat sink for a high heat density heating element according to the present invention has a closed cavity in which a heat transfer block is housed, wherein one surface is pressed against a heat generating component with a predetermined force to move heat of the heat generating component to a predetermined position. And a fin disposed on the other side of the vapor chamber, the base having a predetermined bending strength, and a fin disposed on the base, thereby increasing the strength of the vapor chamber. A member and a fixing member for integrally fixing the vapor chamber and the high-strength heat radiation member to the heat-generating component via the heat-generating component fixing member are provided.

In the heat sink for a high-heat-density heating element of the present invention, the above-described vapor chamber may be formed of a plate-type heat pipe. That is, the vapor chamber may be made of a plate-like material having a heat diffusion function, and may be a plate-type heat pipe using a heat pipe principle as a heat diffusion plate.

In the present invention, it is important that one surface of the plate-type heat pipe is pressed against the heat-generating component with a predetermined force, that is, a total load in the range of 60 to 80 kg. The plate-type heat pipe is formed of a container having a closed cavity, and a predetermined heat transfer block may be provided in the cavity. A working fluid is sealed in the cavity, and a wick is provided.

The working fluid used in the present invention is:
Any working fluid that is normally used in a heat pipe may be used. The wick used in the present invention can be appropriately selected according to the shape and heat characteristics of the heat pipe, such as a metal mesh usually used in the heat pipe. Further, in order to increase the strength of the plate-type heat pipe, a predetermined embossing process may be applied to the heat pipe container.

Further, in the heat sink for a high heat generation density heating element according to the present invention, when the vapor chamber is pressed against the heat generating component by a predetermined force, the base portion of the high strength heat radiating member is formed so that the peripheral portion of the vapor chamber is the heat generating component. It is important to have a sufficient bending strength to prevent bending deformation to the side of.

Further, in the heat sink for a high heat generation density heating element of the present invention, the base is made of a member having higher strength than the container. For example, when the container is made of copper, a base made of an iron member is suitable in terms of low cost and workability.

Further, in the heat sink for a high heat generation density heating element of the present invention, it is preferable that the cross-sectional area of the heat transfer block is equal to or larger than the cross-sectional area of the heat-generating component. A screw or the like can be used as a fixing member that integrally fixes the plate-type heat pipe and the high-strength heat radiation member to the heat generating component via the heat generating component fixing member.

Hereinafter, the heat sink for a high heat generation density heating element of the present invention will be described in more detail with reference to the drawings.
FIG. 1 is a view showing a heat sink for a high-heat-density heating element of the present invention. FIG. 1A is a schematic sectional view. FIG.
(B) shows a schematic assembly diagram of the heat sink for the high heat density heating element. As shown in FIG. 1B, the heat-generating component mounting member 4
The heat-generating component 5 is mounted thereon. The heat generating component mounting member 4 has a hole 9 for a fixing member such as a screw.

The plate-type heat pipe 1 is composed of a container having a cavity closed by, for example, a copper upper plate and a lower plate, and the container also has a fixing member such as a screw corresponding to the above-mentioned hole. A hole 8 is formed. For example, as a working fluid in the closed cavity of the container,
Water is enclosed. Although not shown, by arranging the heat transfer block in the hollow portion, heat can be uniformed and heat can be transferred more efficiently.

Further, the heat sink comprises a base 2 and fins 3 mounted on the base, and the heat sink also has holes 7 for fixing members such as screws corresponding to the above-mentioned holes. The base has sufficient bending strength, for example, is made of an iron member, and when the plate-type heat pipe is pressed against the heat-generating component with a predetermined force, the peripheral portion of the plate-type heat pipe is located on the side of the heat-generating component. Prevent bending deformation.

The plate-shaped heat pipe 1 and the heat sink are superimposed on the heat-generating component mounting member 4 on which the above-described heat-generating component 5 is mounted, and are passed through the holes 7, 8, and 9 and are fixed by screws or other fixing members. It is fixed integrally. As a result, FIG.
As shown in (1), the plate-shaped heat pipe 1 is strongly pressed against the heat-generating component 5 without deformation by the base having sufficient bending strength of the heat sink, and high thermal performance is obtained.

[0036]

The present invention will be further described below with reference to examples. According to one of the present invention, as shown in FIG.
A flat bottom plate is made of a 1.0 mm thick copper thin plate, and a top plate is made of a 1.0 mm thick copper thin plate formed by pressing into a convex lid shape. A net-like wick was placed between them, and a top plate and a bottom plate were brazed to produce a plate-type heat pipe container, vacuum was drawn, water was used as a working fluid, and the net-like wick was housed therein. A housing was made. The plate-type heat pipe manufactured in this way had a thickness of 5 mm × 80 mm × 80 mm.

A heat transfer block made of copper having a length of 20 mm, a width of 20 mm, and a height of 3 mm is provided in the center of the above-mentioned plate-type heat pipe container, and is further embossed. Further, screw holes are formed at the four corners of the plate-shaped heat pipe manufactured as described above.

Next, a nickel-plated iron plate having a thickness of 3 mm for a base was prepared, and aluminum corrugated fins were prepared as fins. The base and the fin thus prepared were joined by soldering. Then, a high-strength heat radiation member having a bottom surface substantially the same as the plate-type heat pipe was produced. In addition, holes corresponding to the holes of the plate-type heat pipe were also provided at the four corners of the high-strength heat radiation member.

Next, the above-described plate-type heat pipe and the high-strength heat dissipating member were combined and joined using an epoxy adhesive. Next, the plate-shaped heat bonded as described above on the heat-generating component mounting member 4 on which the heat-generating component 5 having a shape of FIG. The pipe and the high-strength heat dissipating member were overlapped and combined, and were integrally fixed with screws through the holes. At this time, the heat sink for the high heat density heating element of the present invention pressed the heat generating member with a total load of 80 kg. As a result, the heating element could be efficiently cooled without any significant deformation of the plate heat pipe.

[0040]

According to the present invention, the heat generation density is dramatically increased, and furthermore, a semiconductor device of an electronic device which is downsized can be used.
A heat sink for a high-heat-density heating element that can be efficiently cooled by pressing with a predetermined force can be provided. Further, according to the present invention, the strength of the entire heat sink is increased without excessively thickening the base portion, without changing the structural design of the plate-type heat pipe, and the efficiency is improved by pressing the heat sink against a semiconductor element or the like with a predetermined force. It is possible to provide a heat sink for a high-heat-density heating element that can be cooled in an efficient manner.

[Brief description of the drawings]

FIG. 1 is a diagram showing a heat sink for a high heat generation density heating element of the present invention.

FIG. 2 is a view showing a conventional heat sink for a high heat generation density heating element.

FIG. 3 is a diagram showing another conventional heat sink for a high-heat-density heating element.

[Explanation of symbols]

 1 plate type heat pipe 2 base 3 fins 4 heat generating component mounting member 5 heat generating component 6 fixing member 7 hole 8 hole 9 hole 11 base 12 fin 13 heat generating component mounting member 14 heat generating component 15 fixing member 16 hole 17 hole 18 hole 19 Hole 20 Plate heat pipe 23 Heating component mounting member 24 Heating component 25 Fixing member

 ────────────────────────────────────────────────── ─── Continued on the front page (72) Inventor Jun Sakaigawa 2-6-1 Marunouchi, Chiyoda-ku, Tokyo Furukawa Electric Co., Ltd. F-term (reference) 5E322 AA01 AA11 AB01 AB07 AB11 DB10 FA01

Claims (5)

[Claims] 1. A heat sink for a high-heat-density heating element comprising the following members: (1) one surface is pressed against a heat-generating component by a predetermined force to move heat of the heat-generating component to a predetermined position; A vapor chamber having a closed cavity in which a heat block is accommodated; and (2) disposed integrally with the vapor chamber on the other surface of the vapor chamber.
A high-strength heat dissipating member comprising a base portion having a predetermined bending strength and a fin portion disposed on the base portion for increasing the strength of the vapor chamber; and (3) the vapor chamber and the high-strength heat dissipating member. A fixing member integrally fixed to the heat generating component. 2. The heat sink according to claim 1, wherein the vapor chamber comprises a plate-type heat pipe. 3. The base part of the high-strength heat dissipating member is configured such that when the vapor chamber is pressed against the heat-generating component by the predetermined force, a peripheral portion of the vapor chamber bends toward the heat-generating component. 3. The heat sink for a high heat generation density heating element according to claim 1, wherein the heat sink has a sufficient bending strength to prevent the heat generation. 4. The heat sink for a high-heat-density heating element according to claim 1, wherein said base portion is made of an iron member. 5. A cross sectional area of the heat transfer block is equal to or larger than a cross sectional area of the heat generating component.
The heat sink for a high-heat-density heating element according to claim 1.