JP2001024004A - Led chip mounting structure - Google Patents
Led chip mounting structureInfo
- Publication number
- JP2001024004A JP2001024004A JP18995899A JP18995899A JP2001024004A JP 2001024004 A JP2001024004 A JP 2001024004A JP 18995899 A JP18995899 A JP 18995899A JP 18995899 A JP18995899 A JP 18995899A JP 2001024004 A JP2001024004 A JP 2001024004A
- Authority
- JP
- Japan
- Prior art keywords
- chip
- silver paste
- led
- led chip
- paste
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/27—Manufacturing methods
- H01L2224/27011—Involving a permanent auxiliary member, i.e. a member which is left at least partly in the finished device, e.g. coating, dummy feature
- H01L2224/27013—Involving a permanent auxiliary member, i.e. a member which is left at least partly in the finished device, e.g. coating, dummy feature for holding or confining the layer connector, e.g. solder flow barrier
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
- H01L2224/3205—Shape
- H01L2224/32057—Shape in side view
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
- H01L2224/83009—Pre-treatment of the layer connector or the bonding area
- H01L2224/83051—Forming additional members, e.g. dam structures
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
- H01L2224/8338—Bonding interfaces outside the semiconductor or solid-state body
- H01L2224/83385—Shape, e.g. interlocking features
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/12—Passive devices, e.g. 2 terminal devices
- H01L2924/1204—Optical Diode
- H01L2924/12041—LED
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、チップ型発光ダイ
オード（以下、ＬＥＤという。）におけるＬＥＤチップ
と電極パターンとの接合に寄与しない余分な銀ペースト
等の導電性ペーストを接合区域外に排出し、チップ表面
への銀ペーストの這い上がりを防止したチップＬＥＤに
関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention discharges extra conductive paste, such as silver paste, which does not contribute to bonding between an LED chip and an electrode pattern in a chip type light emitting diode (hereinafter, referred to as LED) to the outside of the bonding area. The present invention relates to a chip LED that prevents the silver paste from creeping up on the chip surface.
【０００２】[0002]
【従来の技術】ＬＥＤは、動作電圧が低く、応答速度が
速くかつ動作寿命が長い等の利点があるので、各種電気
機器の表示ランプとして使用されている。特に近年では
電気機器の小型化の要求に応じるため表面実装用のチッ
プＬＥＤが多用されている。2. Description of the Related Art LEDs are used as display lamps for various electric appliances because of their advantages such as low operating voltage, fast response speed and long operating life. Particularly in recent years, chip LEDs for surface mounting have been frequently used in order to meet the demand for miniaturization of electric equipment.
【０００３】一般に、チップ（型）ＬＥＤは、絶縁基板
表面から裏面に回り込むように形成された一組の電極
と、この一組の電極の一方に搭載された発光素子と、こ
の発光素子と他方の電極とを接続する金属ワイヤとを透
明または半透明の樹脂で封止した樹脂封止部とから構成
されている。このような構成のチップ型ＬＥＤがプリン
ト基板に実装され、その点滅により各種電気機器のスイ
ッチ０Ｎ／ＯＦＦや、各種インジケータの表示を行って
いる。In general, a chip (type) LED is composed of a set of electrodes formed so as to extend from the front surface to the back surface of an insulating substrate, a light emitting element mounted on one of the electrodes, and a light emitting element on the other side. And a resin sealing portion in which a metal wire connecting the electrodes is sealed with a transparent or translucent resin. A chip-type LED having such a configuration is mounted on a printed circuit board, and the blinking of the chip-type LED indicates a switch 0N / OFF of various electric devices and various indicators are displayed.
【０００４】[0004]
【発明が解決しようとする課題】プリント基板とＬＥＤ
チップとの接合は、銀ペーストを例えばピン転写にて基
板等に付着し、その上からＬＥＤチップを載せて硬化す
ることによって行っている。ところが、ＬＥＤチップそ
のものは小さいため、基板等に銀ペーストを一定量正確
に付着することは容易でなく、そのため、銀ペーストの
付着量（転写量）にばらつき（粘度のバラツキ、及びＰ
ＩＮ転写による付着の違い等）が発生することは避けら
れない。また、付着する銀ペーストが不足すれば接合不
足が生じるため、多少多めに付着することがあるが、そ
の量が多すぎるとＬＥＤによっては以下に示すような問
題が生じる。SUMMARY OF THE INVENTION Printed circuit board and LED
The bonding with the chip is performed by attaching a silver paste to a substrate or the like by, for example, pin transfer, and placing an LED chip thereon and curing the paste. However, since the LED chip itself is small, it is not easy to accurately apply a certain amount of silver paste to a substrate or the like, and therefore, the amount of silver paste attached (transfer amount) varies (variation in viscosity, P
It is unavoidable that a difference in adhesion due to IN transfer occurs. In addition, if the amount of the silver paste to be attached is insufficient, the bonding may be insufficient. Therefore, the amount of the silver paste may be slightly large. However, if the amount is too large, the following problems may occur depending on the LED.
【０００５】つまり、ＬＥＤを電気機器、例えば携帯電
話のボタン表示等に用いる場合、ＬＥＤから出る光をで
きるだけ横方向に発散した方が表示が見やすい場合があ
る。そのような場合には、ＬＥＤチップ側面での光の全
反射を抑制するように、ＬＥＤ表面に例えばエッチング
による微細な凹凸を付すことが行われている。このよう
なＬＥＤチップにおいて、基板等に付着した銀ペースト
の量が多すぎると、銀ペーストを硬化する際に加える熱
により銀ペースト中のエポキシ樹脂が液状化し、液状化
に伴って銀ペーストが毛管現象によりチップ側面の前記
微小な凹凸を這い上がり、ＬＥＤチップ表面でショート
を起こすという問題が生じる。図５はこの状態を説明す
るものであって、ＬＥＤチップ１を基板上２の電極パタ
ーン３に接合するための工程を示している。まず、図５
Ａに示すように、基板上に電極パターンを形成し、その
上に転写ピン５により銀ペースト４を付着し（図５Ｂ、
Ｃ）、その上にＬＥＤチップ１を載置する（図５Ｄ）。
その状態で加熱すると、銀ペースト中のエポキシ樹脂が
液状となり銀ペーストは毛細管現象により、ＬＥＤの側
面の微細な凹凸を伝ってＬＥＤ上面に這い上がりＬＥＤ
チップ表面でショートを起こす（図５Ｅ）。That is, when the LED is used for displaying a button of an electric device, for example, a mobile phone, it may be easier to view the display by diverging the light emitted from the LED in the horizontal direction as much as possible. In such a case, fine irregularities are formed on the LED surface by, for example, etching so as to suppress the total reflection of light on the side surface of the LED chip. In such an LED chip, if the amount of the silver paste attached to the substrate or the like is too large, the heat applied when the silver paste is cured causes the epoxy resin in the silver paste to liquefy, and the liquefaction causes the silver paste to become capillary. Due to this phenomenon, there is a problem that the microscopic unevenness on the side surface of the chip is crawled up to cause a short circuit on the LED chip surface. FIG. 5 explains this state, and shows a process for joining the LED chip 1 to the electrode pattern 3 on the substrate 2. First, FIG.
As shown in FIG. 5A, an electrode pattern is formed on a substrate, and a silver paste 4 is adhered thereon by a transfer pin 5 (FIG. 5B,
C) Then, the LED chip 1 is mounted thereon (FIG. 5D).
When heated in that state, the epoxy resin in the silver paste becomes liquid, and the silver paste creeps up on the top surface of the LED through fine irregularities on the side surface of the LED due to the capillary phenomenon.
A short circuit occurs on the chip surface (FIG. 5E).
【０００６】[0006]
【課題を解決するための手段】本発明は、以上の問題に
鑑みてなされたものであって、基板上の電極パターンに
毛管現象の発生しやすい形状の溝を作成し、余分なペー
ストを逃がし、チップ裏側のみ必要なペーストを残し、
チップ表面への銀ペーストの這い上がりを防止できよう
にしたものである。具体的には、請求項１の発明は、基
板上の電極パターンとＬＥＤチップを導電性ペーストに
より接合するチップ型ＬＥＤにおいて、前記パターン電
極の前記ＬＥＤチップの接合区域に、前記接合に余分な
銀ペーストを前記接合区域外へ導く溝を形成したことを
特徴とするチップＬＥＤである。SUMMARY OF THE INVENTION The present invention has been made in view of the above problems, and has an electrode pattern formed on a substrate, in which a groove having a shape that easily causes a capillary phenomenon is formed, and excess paste is released. , Leaving the necessary paste only on the back side of the chip,
This is to prevent the silver paste from creeping up on the chip surface. Specifically, according to the first aspect of the present invention, in a chip-type LED in which an electrode pattern on a substrate and an LED chip are bonded by a conductive paste, extra silver for the bonding is provided in a bonding area of the LED chip of the pattern electrode. A chip LED in which a groove for guiding a paste to the outside of the bonding area is formed.
【０００７】請求項２の発明は、請求項１に記載された
チップＬＥＤにおいて、導電性ペーストを前記接合区域
外に導く溝は、液状化した銀ペーストを毛細管現象によ
り前記載置区域外に導くものであることを特徴とするチ
ップＬＥＤである。According to a second aspect of the present invention, in the chip LED according to the first aspect, the groove for guiding the conductive paste out of the bonding area guides the liquefied silver paste out of the mounting area by capillary action. It is a chip LED characterized by the above.
【０００８】[0008]
【発明の実施の形態】図１を参照して本発明の１実施形
態について説明する。本発明は、上述の問題引き起こす
毛管現象を逆に利用して、電極パターンに毛細管現象が
発生し易い溝を形成することによって、基板等に付着さ
れた余分な銀ペーストなどの導電性ペーストを外部に逃
がし、チップ表面へのペーストの這い上がりを防止する
ものである。即ち、図１Ａ、Ｂは比較のためそれぞれＬ
ＥＤチップを載置する基板２の電極パターン３を示した
ものであって、図１Ａに示す従来の基板の電極パターン
には何等の溝も形成されていない。一方、図１Ｂに示す
本発明の電極パターンには、余分な銀ペーストを接合区
域から外部に逃がすための、エッチングまたはプレス加
工等により形成されここでは十字形の溝３Ａが記載され
ている。溝３Ａの形状は、ＬＥＤチップ載置部から外部
に向かう溝形状であれば、図示のような十字形に限らず
放射状等任意の形状を採ることができる。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS One embodiment of the present invention will be described with reference to FIG. The present invention utilizes the above-described problem of capillary phenomenon to form a groove on the electrode pattern where the capillary phenomenon is likely to occur, so that the conductive paste such as extra silver paste adhered to the substrate or the like can be externally formed. To prevent the paste from creeping up on the chip surface. That is, FIGS. 1A and 1B each show L for comparison.
1A shows an electrode pattern 3 of a substrate 2 on which an ED chip is mounted, and no groove is formed in the electrode pattern of the conventional substrate shown in FIG. 1A. On the other hand, in the electrode pattern of the present invention shown in FIG. 1B, a cross-shaped groove 3A which is formed by etching or press working or the like in order to allow excess silver paste to escape from the joining area is described. The shape of the groove 3A is not limited to the cross shape as shown in the figure, but may be any shape such as a radial shape as long as it is a groove shape extending from the LED chip mounting portion to the outside.
【０００９】次に、このように形成された基板を用いて
ＬＥＤチップを接合する場合について説明する。電極パ
ターンの溝形成区域に銀ペーストを例えばピン転写によ
って付着し、その上にＬＥＤチップを置く。図２Ａ、Ｂ
はそれぞれＬＥＤを基板上の電極パターン上に載置した
状態を示す側面図及び平面図である。図示のように、余
分な銀ペースト４はＬＥＤチップの側面にはみ出してい
る。次に、銀ペースト４を硬化するために加熱すると、
銀ペースト中のエポキシ樹脂が液状化し、余分な銀ペー
スト４は、毛管現象により硬化直前に基板に形成された
溝３Ａを通って外部に逃げる。この状態を示したのが図
２Ｃ，Ｄである。余分な銀ペーストが外部に逃げる結
果、ＬＥＤチップ１の裏側には必要最少量の銀ペースト
をしかもほぼ均一に残留させることができる。従って、
本発明によれば、仮に基板２上に銀ペースト４を余分に
置いても、余分な部分は毛管現象により前記溝３Ａを通
って外部に逃げるから、従来のもののように、ＬＥＤチ
ップ表面上に這い上がってＬＥＤチップ１ををショート
させる虞はない。Next, a case where an LED chip is bonded using the substrate formed as described above will be described. A silver paste is applied to the groove forming area of the electrode pattern by, for example, pin transfer, and an LED chip is placed thereon. 2A and 2B
3A and 3B are a side view and a plan view showing a state where an LED is mounted on an electrode pattern on a substrate, respectively. As shown, the excess silver paste 4 protrudes to the side of the LED chip. Next, when heating to cure the silver paste 4,
The epoxy resin in the silver paste is liquefied, and the excess silver paste 4 escapes to the outside through a groove 3A formed in the substrate immediately before curing due to capillary action. FIGS. 2C and 2D show this state. As a result of the extra silver paste escaping to the outside, the required minimum amount of silver paste can be left on the back side of the LED chip 1 almost uniformly. Therefore,
According to the present invention, even if the silver paste 4 is excessively placed on the substrate 2, the excess portion escapes to the outside through the groove 3A due to the capillary phenomenon. There is no possibility that the LED chip 1 will short-circuit due to crawling.
【００１０】図３は本発明の第２の実施形態を示すもの
であって、第１の実施形態における基板に接合する代わ
りに、ＬＥＤランプにおけるフレーム１０とＬＥＤチッ
プ１との接合に適用した例を示すものである。ＬＥＤチ
ップ１をフレーム１０に対して銀ペースト４で接合する
際、銀ペーストを固化する際の加熱により銀ペースト中
のエポキシ樹脂は液状となり、銀ペーストはＬＥＤチッ
プの表面の微細な凹凸による毛管現象によってＬＥＤチ
ップ上面にはい上がってショートを引き起こす。本実施
形態では、図４に示すように、フレーム上に半径方向に
接合区域外に延びた溝３Ａが形成されているため、銀ペ
ースト４が硬化直前に液状となったときには、余分な銀
ペーストは毛細管現象によって前記溝を伝って接合区域
外に逃げ、その結果、ＬＥＤチップ１裏面には安定した
最少量の銀ペースト４のみを残すことができる。従っ
て、銀ペースト量が多く、或いはその量に多少のバラツ
キがあってもＬＥＤチップ裏面に残るペースト量を最小
のほぼ一定量に安定化することができる。FIG. 3 shows a second embodiment of the present invention, in which the present invention is applied to bonding of a frame 10 and an LED chip 1 in an LED lamp, instead of bonding to a substrate in the first embodiment. It shows. When the LED chip 1 is joined to the frame 10 with the silver paste 4, the epoxy resin in the silver paste becomes liquid by heating when the silver paste is solidified, and the silver paste becomes a capillary phenomenon due to minute irregularities on the surface of the LED chip. As a result, the LED chip rises to the upper surface and causes a short circuit. In the present embodiment, as shown in FIG. 4, since the groove 3A is formed on the frame so as to extend outside the joining area in the radial direction, when the silver paste 4 becomes liquid immediately before curing, the excess silver paste is used. Escapes from the bonding area along the groove by capillary action, and as a result, only a minimum amount of the stable silver paste 4 can be left on the back surface of the LED chip 1. Therefore, even if the amount of the silver paste is large or the amount of the paste slightly varies, the amount of the paste remaining on the back surface of the LED chip can be stabilized to a minimum substantially constant amount.
【００１１】[0011]
【発明の効果】請求項１、２に対応する効果：ＬＥＤチ
ップの接合時における余分な銀ペースト等の導電性ペー
ストを接合区域外に逃がすことにより、加熱により余分
な導電性ペーストが液化したときに、毛細管現象により
ＬＥＤチップ側面を這い上がり、ＬＥＤチップ上面をシ
ョートさせる虞はない。また、余分なペーストが排出さ
れる結果、ＬＥＤチップ裏面の接合区域には最小量のペ
ーストを残すことができ、接合のためのペースト量をほ
ぼ一定に安定化することができる。According to the first and second aspects of the present invention, when excess conductive paste such as silver paste is released to the outside of the bonding area during bonding of the LED chip, the excess conductive paste is liquefied by heating. In addition, there is no danger of the LED chip crawling up due to the capillary phenomenon and shorting the LED chip upper surface. In addition, as a result of discharging excess paste, a minimum amount of paste can be left in the bonding area on the back surface of the LED chip, and the amount of paste for bonding can be stabilized at a substantially constant level.
【図１】 チップＬＥＤの電極パターンを示す図であ
る。FIG. 1 is a diagram showing an electrode pattern of a chip LED.
【図２】 銀ペーストが接合区域外に逃げる過程を説明
する図である。FIG. 2 is a diagram illustrating a process in which a silver paste escapes outside a bonding area.
【図３】 図２と同様の過程を説明する図である。FIG. 3 is a diagram illustrating a process similar to FIG. 2;
【図４】 ＬＥＤランプにおけるフレームの電極パター
ンを示す図である。FIG. 4 is a view showing an electrode pattern of a frame in the LED lamp.
【図５】 従来のチップＬＥＤにおける銀ペーストの這
い上がりを説明するための図である。FIG. 5 is a diagram for explaining the creeping-up of silver paste in a conventional chip LED.
１…ＬＥＤチップ、２…基板、３…電極パターン、３Ａ
…溝、４…銀ペースト、５…転写ピン、１０…フレームDESCRIPTION OF SYMBOLS 1 ... LED chip, 2 ... board, 3 ... electrode pattern, 3A
... grooves, 4 ... silver paste, 5 ... transfer pins, 10 ... frame
─────────────────────────────────────────────────────
────────────────────────────────────────────────── ───
【手続補正書】[Procedure amendment]
【提出日】平成１１年９月２４日（１９９９．９．２
４）[Submission date] September 24, 1999 (1999.9.2)
4)
【手続補正１】[Procedure amendment 1]
【補正対象書類名】明細書[Document name to be amended] Statement
【補正対象項目名】発明の名称[Correction target item name] Name of invention
【補正方法】変更[Correction method] Change
【補正内容】[Correction contents]
【発明の名称】 ＬＥＤチップの取付構造 [Title of the Invention] LED chip mounting structure
【手続補正２】[Procedure amendment 2]
【補正対象書類名】明細書[Document name to be amended] Statement
【補正対象項目名】特許請求の範囲[Correction target item name] Claims
【補正方法】変更[Correction method] Change
【補正内容】[Correction contents]
【特許請求の範囲】[Claims]
【手続補正３】[Procedure amendment 3]
【補正対象書類名】明細書[Document name to be amended] Statement
【補正対象項目名】０００１[Correction target item name] 0001
【補正方法】変更[Correction method] Change
【補正内容】[Correction contents]
【０００１】[0001]
【発明の属する技術分野】本発明は、チップ型発光ダイ
オード（以下、ＬＥＤという。）におけるＬＥＤチップ
と電極パターンとの接合に寄与しない余分な銀ペースト
等の導電性ペーストを接合区域外に排出し、チップ表面
への銀ペースト等の導電性ペーストの這い上がりを防止
したＬＥＤチップの取付構造に関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention discharges extra conductive paste, such as silver paste, which does not contribute to bonding between an LED chip and an electrode pattern in a chip type light emitting diode (hereinafter, referred to as LED) to the outside of the bonding area. The present invention relates to an LED chip mounting structure that prevents a conductive paste such as a silver paste from creeping up on a chip surface.
【手続補正４】[Procedure amendment 4]
【補正対象書類名】明細書[Document name to be amended] Statement
【補正対象項目名】０００６[Correction target item name] 0006
【補正方法】変更[Correction method] Change
【補正内容】[Correction contents]
【０００６】[0006]
【課題を解決するための手段】本発明は、以上の問題に
鑑みてなされたものであって、基板またはリードフレー
ム上の電極パターンに毛管現象の発生しやすい形状の溝
を作成し、余分なペーストを逃がし、チップ裏側のみ必
要なペーストを残し、チップ表面への銀ペーストの這い
上がりを防止できるようにしたものである。具体的に
は、請求項１の発明は、基板またはリードフレーム上の
電極パターンとＬＥＤチップを導電性ペーストにより接
合するＬＥＤチップの取付構造において、前記パターン
電極の前記ＬＥＤチップの接合区域に、前記接合に余分
な導電性ペーストを前記接合区域外へ導く溝を形成した
ことを特徴とするＬＥＤチップの取付構造である。Means for Solving the Problems The present invention was made in consideration of the aforementioned problems, a substrate or a lead frame
Create a groove prone shape of capillarity electrode pattern on the beam, escape the excess paste, leaving only the required paste-chip back side, and as Ru prevents creeping of the silver paste on the chip surface Things. Specifically, the invention according to claim 1 is a mounting structure of an LED chip for bonding an LED pattern and an electrode pattern on a substrate or a lead frame by a conductive paste, wherein the bonding area of the LED chip of the pattern electrode is A mounting structure for an LED chip, wherein a groove for guiding an extra conductive paste to the outside of the bonding area for bonding is formed.
【手続補正５】[Procedure amendment 5]
【補正対象書類名】明細書[Document name to be amended] Statement
【補正対象項目名】０００７[Correction target item name] 0007
【補正方法】変更[Correction method] Change
【補正内容】[Correction contents]
【０００７】請求項２の発明は、請求項１に記載された
ＬＥＤチップの取付構造において、導電性ペーストを前
記接合区域外に導く溝は、液状化した導電性ペーストを
毛細管現象により前記載置区域外に導くものであること
を特徴とするＬＥＤチップの取付構造である。[0007] The invention of claim 2 is described in claim 1.
In the mounting structure of the LED chip, a groove for guiding a conductive paste to the outside of the bonding zone, the mounting structure of the LED chip, characterized in that the liquefied conductive paste and guides before described置区outside by capillary action It is.
【手続補正６】[Procedure amendment 6]
【補正対象書類名】明細書[Document name to be amended] Statement
【補正対象項目名】００１０[Correction target item name] 0010
【補正方法】変更[Correction method] Change
【補正内容】[Correction contents]
【００１０】図３は本発明の第２の実施形態を示すもの
であって、第１の実施形態における基板に接合する代わ
りに、ＬＥＤランプにおけるフレーム１０とＬＥＤチッ
プ１との接合に適用した例を示すものである。ＬＥＤチ
ップ１をフレーム１０の電極パターンに対して銀ペース
ト４で接合する際、銀ペーストを固化する際の加熱によ
り銀ペースト中のエポキシ樹脂は液状となり、銀ペース
トはＬＥＤチップの表面の微細な凹凸による毛管現象に
よってＬＥＤチップ上面にはい上がってショートを引き
起こす。本実施形態では、図４に示すように、フレーム
上に半径方向に接合区域外に延びた溝３Ａが形成されて
いるため、銀ペースト４が硬化直前に液状となったとき
には、余分な銀ペーストは毛細管現象によって前記溝を
伝って接合区域外に逃げ、その結果、ＬＥＤチップ１裏
面には安定した最少量の銀ペースト４のみを残すことが
できる。従って、銀ペースト量が多く、或いはその量に
多少のバラツキがあってもＬＥＤチップ裏面に残るペー
スト量を最小のほぼ一定量に安定化することができる。FIG. 3 shows a second embodiment of the present invention, in which the present invention is applied to bonding of a frame 10 and an LED chip 1 in an LED lamp, instead of bonding to a substrate in the first embodiment. It shows. When the LED chip 1 is bonded to the electrode pattern of the frame 10 with the silver paste 4, the epoxy resin in the silver paste becomes liquid by heating when the silver paste is solidified, and the silver paste becomes fine irregularities on the surface of the LED chip. As a result, capillary action causes the LED chip to go up and cause a short circuit. In the present embodiment, as shown in FIG. 4, since the groove 3A is formed on the frame so as to extend outside the joining area in the radial direction, when the silver paste 4 becomes liquid immediately before curing, the excess silver paste is used. Escapes from the bonding area along the groove by capillary action, and as a result, only a minimum amount of the stable silver paste 4 can be left on the back surface of the LED chip 1. Therefore, even if the amount of the silver paste is large or the amount of the paste slightly varies, the amount of the paste remaining on the back surface of the LED chip can be stabilized to a minimum substantially constant amount.
Claims (2)
導電性ペーストにより接合するチップ型ＬＥＤにおい
て、前記パターン電極の前記ＬＥＤチップの接合区域
に、前記接合に余分な銀ペーストを前記接合区域外へ導
く溝を形成したことを特徴とするチップＬＥＤ。1. In a chip type LED in which an electrode pattern on a substrate and an LED chip are joined by a conductive paste, an extra silver paste for the joining is put out of the joining area in a joining area of the LED chip of the pattern electrode. A chip LED in which a guide groove is formed.
いて、銀ペーストを前記接合区域外に導く溝は、液状化
した導電性ペーストを毛細管現象により前記載置区域外
に導くものであることを特徴とするチップＬＥＤ。2. The chip LED according to claim 1, wherein the groove for guiding the silver paste out of the bonding area guides the liquefied conductive paste out of the mounting area by capillary action. Characterized chip LED.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18995899A JP2001024004A (en) | 1999-07-05 | 1999-07-05 | Led chip mounting structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18995899A JP2001024004A (en) | 1999-07-05 | 1999-07-05 | Led chip mounting structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JP2001024004A true JP2001024004A (en) | 2001-01-26 |
Family
ID=16250049
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP18995899A Pending JP2001024004A (en) | 1999-07-05 | 1999-07-05 | Led chip mounting structure |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2001024004A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7012332B2 (en) | 2002-10-11 | 2006-03-14 | Mitsubishi Denki Kabushiki Kaisha | Semiconductor device having sealing structure for wide gap type semiconductor chip |
-
1999
- 1999-07-05 JP JP18995899A patent/JP2001024004A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7012332B2 (en) | 2002-10-11 | 2006-03-14 | Mitsubishi Denki Kabushiki Kaisha | Semiconductor device having sealing structure for wide gap type semiconductor chip |
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