JP2001019836A - Thermoplastic resin composition and molding prepared therefrom - Google Patents

Abstract

PROBLEM TO BE SOLVED: To obtain a resin composition being excellent in flowability and dispersedness and developing excellent impact resistance after being molded by mixing a noncrystalline polyester resin with an epoxidized diene block copolymer and other thermoplastic resins. SOLUTION: This composition comprises 60-70 wt.% (A) noncrystalline polyester resin, 1-15 wt.% (B) epoxidized diene block copolymer, and 30-40 wt.% (C) thermoplastic resin other than components A and B, such as an aromatic polycarbonate resin. Component A is obtained by the copolymerization of a diol such as 1,4-cyclohexane dimethanol with e.g. polyethylene terephthalate. Component B is produced by reacting a block copolymer containing a vinylaromatic compound such as styrene and a diene compound such as butadiene in a ratio of 5/95 to 85/15 by weight and having a number-average molecular weight of 10,000-800,000 with an epoxidizing agent such a peroxy acid (e.g. peracetic acid) or a hydroperoxide.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a thin molded article such as an IC card, a playing card, a floppy disk, etc.
The present invention relates to a resin composition suitable for a device such as an A device, a communication device such as a mobile phone, a member of a home electric appliance, and a vehicle member. More specifically, the present invention relates to an impact-resistant resin composition containing an amorphous polyester resin and another thermoplastic resin as main components, and further having an impact strength improved by an epoxidized diene-based block copolymer.

[0002]

2. Description of the Related Art Research on e-commerce cards (IC cards), which are expected to become full-scale in the future, has been rapidly progressing in recent years. As the raw material, a PVC-based resin was mainly studied, but from the viewpoint of environmental issues, it is expected that the conversion from the PVC-based resin to a PVC-substituted resin will be advanced in the future.

[0003] On the other hand, high flowability and impact resistance are required for the raw material resin of an IC card having a thickness of 1 mm or less. However, ABS resin, polycarbonate resin, polybutylene terephthalate resin, which is generally used as a substitute for PVC, is required. Furthermore, none of the non-crystalline polyester resins which are easy to process and have excellent mechanical, physical and chemical properties have both fluidity and impact strength.

Several compositions have been proposed in the past to solve this problem. For example, registered patent No. 26765
No. 25 discloses a polycarbonate resin or a thermoplastic resin comprising a polycarbonate resin and a polyester resin, and an aliphatic double bond based on a conjugated diene compound of a block copolymer comprising a conjugated diene compound and a vinyl group-containing aromatic hydrocarbon. Is disclosed in which a modified hydrogenated block copolymer obtained by grafting an unsaturated compound having a glycidyl group to a hydrogenated block copolymer obtained by partially hydrogenating is dispersed. However, the glycidyl group-modified hydrogenated block copolymer used here has a problem that it is easily gelled by heat during production of a composition or processing of a molded article.

Japanese Patent Application Laid-Open No. Hei 9-157504 discloses a non-hydrogenated or hydrogenated block copolymer modified with an ethylenically unsaturated group-containing carboxylic acid (for example, maleic anhydride) or a derivative thereof. I have. Similarly, Japanese Patent Application Laid-Open No. 8-48861 discloses that hydroxyl-containing α, β-
A hydrogenated block copolymer modified with an unsaturated carboxylic acid and an aromatic vinyl compound is disclosed. However, these block copolymers, particularly in thin-walled molded products, have not been able to meet the demands for higher impact resistance and higher moldability.

On the other hand, as a method of improving the impact strength,
Although attempts have been made to blend elastomers,
There is a problem that the resin lacks affinity and dispersibility.

[0007]

An object of the present invention is to provide a resin composition having excellent fluidity and dispersibility, and particularly exhibiting excellent impact resistance when processed into a thin molded article. It is to provide a molded article and a sheet.

[0008]

Means for Solving the Problems The present inventor has conducted intensive studies in view of the present situation, and as a result, has found that an amorphous polyester resin, an epoxidized diene-based block copolymer, an amorphous polyester resin, and an epoxidized polyester resin. The inventors have found that a thermoplastic elastomer composition that can solve the above problems can be obtained by mixing a thermoplastic resin other than a diene-based block copolymer, and have completed the present invention.

That is, the present invention is characterized by comprising a non-crystalline polyester resin (A), an epoxidized diene-based block copolymer (B), and a thermoplastic resin (C) other than (A) and (B). It is intended to provide a thermoplastic resin composition. Further, the present invention provides a thermoplastic resin composition, wherein the non-crystalline polyester resin (A) is a copolymerized polyester. The present invention also provides a thermoplastic resin composition, wherein the non-crystalline polyester resin (A) is a copolymerized polyester of 1,4-cyclohexanedimethanol and polyethylene terephthalate. The epoxidized diene-based block copolymer (B) is obtained by epoxidizing a block copolymer composed of a block composed of a vinyl aromatic compound and a block composed of a conjugated diene compound, or a partially hydrogenated product thereof. It is intended to provide a thermoplastic resin composition characterized by the following. The epoxidized diene-based block copolymer (B) is obtained by epoxidizing a block copolymer composed of a block composed of a vinyl aromatic compound and a block composed of a conjugated diene compound or a partially hydrogenated product thereof. 60% by weight of a block composed of a vinyl aromatic compound
The present invention provides a thermoplastic resin composition characterized by the above. Further, the present invention provides a thermoplastic resin composition, wherein the thermoplastic resin (C) other than the non-crystalline polyester resin and the epoxidized diene-based block copolymer is an aromatic polycarbonate resin. The terminal hydroxyl group concentration of the aromatic polycarbonate resin is 1
４０40 mol% is provided. Further, the present invention provides a molded article using the above-mentioned thermoplastic resin composition. The present invention also provides a sheet using the above thermoplastic resin composition. Another object of the present invention is to provide an IC card using the above thermoplastic resin composition.

[0010]

BEST MODE FOR CARRYING OUT THE INVENTION Hereinafter, the present invention will be described in detail.

(Amorphous Polyester Resin (A)) The preferred non-crystalline polyester resin (A) used in the present invention is one produced by a condensation reaction of a dicarboxylic acid or a dicarboxylic acid derivative with a diol. is there. More preferred is a copolymerized polyester of 1,4-cyclohexanedimethanol and polyethylene terephthalate, which is disclosed in JP-A-9-509449. The dicarboxylic acid component of this copolymerized polyester contains aromatic or isophthalic acid, naphthalenedicarboxylic acid, cyclohexanedicarboxylic acid, succinic acid, sebacic acid, adipic acid, glutaric acid, azelaic acid, or the like in a ratio of 10 mol% or less, or Alicyclic dicarboxylic acids may be included. The glycol component mixture of ethylene glycol and 1,4-cyclohexanedimethanol also contains diethylene glycol, triethylene glycol, propanediol, butanediol, pentanediol, hexanediol, tetramethylcyclobutanediol, etc. in a proportion of 10 mol% or less. It may be.

(Epoxidized diene-based block copolymer (B)) The epoxidized diene-based block copolymer (B) used in the present invention is obtained by epoxidizing a diene-based block copolymer or a partially hydrogenated product thereof. It is.

The term "diene block copolymer" as used herein means a block copolymer composed of a polymer block mainly composed of a vinyl aromatic compound and a polymer block mainly composed of a conjugated diene compound. Weight ratio of aromatic compound and conjugated diene compound (weight ratio of block copolymer)
Is 5/95 to 85/15, preferably 60/40
８５85/15. The number average molecular weight of the block copolymer used in the present invention is 5,000 to 1,000,000.
0, preferably in the range of 10,000 to 800,000, and the molecular weight distribution [weight average molecular weight (Mw) and number average molecular weight
(Mw / Mn)] is 10 or less. The molecular structure of the block copolymer may be linear, branched, radial, or any combination thereof. For example, XYX, YXYX, (XY-)
Vinyl aromatic compound (X) having a structure such as 4Si, XYXYX, etc. Block-conjugated diene compound (Y)
It is a block copolymer. Further, the unsaturated bond of the conjugated diene compound of the diene-based block copolymer may be partially hydrogenated.

Examples of the vinyl aromatic compound constituting the diene block copolymer include styrene, α-methylstyrene, vinyltoluene, p-tertiary butylstyrene, divinylbenzene, p-methylstyrene, 1,1-
One or more of diphenylstyrene and the like can be selected, and among them, styrene is preferable. As the conjugated diene compound, for example, butadiene, isoprene,
One of 1,3-pentadiene, 2,3-dimethyl-1,3-butadiene, piperylene, 3-butyl-1,3-octadiene, phenyl-1,3-butadiene and the like.
Species or two or more species are selected, and among them, butadiene, isoprene and a combination thereof are preferred.

As a method for producing the block copolymer used in the present invention, any production method having the above-mentioned structure can be adopted. For example,
23798, JP-B-47-3252, JP-B-48-
No. 2423, Japanese Patent Application No. 49-105970, Japanese Patent Application No. 50
-27094, JP-B-46-32415, JP-A-5
According to the methods described in JP-A Nos. 9-166518, JP-B-49-36957, JP-B-43-17979, JP-B-46-32415, and JP-B-56-28925, a lithium catalyst or the like is used. A vinyl aromatic compound-conjugated diene compound block copolymer can be synthesized in an active solvent. Further, Japanese Patent Publication No. 42-8704, Japanese Patent Publication No. 43-6636, or
According to the method described in JP-A-133203, the partially hydrogenated block copolymer to be used in the present invention can be synthesized by hydrogenation in an inert solvent in the presence of a hydrogenation catalyst.

The epoxidized diene-based copolymer used in the present invention can be obtained by epoxidizing the above-mentioned diene-based block copolymer.

The epoxidized diene block copolymer in the present invention can be obtained by reacting the above block copolymer with an epoxidizing agent such as hydroperoxides and peracids in an inert solvent. Examples of peracids include formic acid, peracetic acid, and perbenzoic acid. In the case of hydroperoxides, a catalytic effect can be obtained by using a mixture of tungstic acid and caustic soda with hydrogen peroxide, an organic acid with hydrogen peroxide, or molybdenum hexacarbonyl with tertiary butyl hydroperoxide. .

There is no strict limit on the amount of epoxidizing agent,
The optimal amount in each case will depend on variables such as the particular epoxidizing agent used, the degree of epoxidation desired, the particular block copolymer used, and the like.

The obtained epoxidized diene block copolymer can be isolated by a suitable method, for example, a method of precipitating with a poor solvent, a method of throwing the polymer into hot water with stirring and distilling off the solvent, It can be performed by a direct desolvation method or the like.

The epoxy equivalent of the obtained epoxidized (hydrogenated) diene block copolymer is preferably from 320 to 80.
00 range.

(Thermoplastic resin (C) other than the non-crystalline polyester resin and the epoxidized diene-based block copolymer) The thermoplastic resin other than the non-crystalline polyester resin and the epoxidized diene-based block copolymer used in the present invention As specific examples of the resin (C), 6-nylon, 6,6
-Nylon, 4,6-nylon, 11-nylon, 12
-Polyamide resin such as nylon, aromatic polycarbonate resin, polyester resin such as polyimide, polyethylene terephthalate, polybutylene terephthalate, liquid crystalline polyester resin, polyarylate, or crystalline thermoplastic polymer such as polyamide elastomer, polyester elastomer, ABS resin , AES resin, AAS resin, rubber modified polymer such as MBS resin, acrylonitrile-styrene copolymer, styrene-methyl methacrylate copolymer, acrylic resin such as polystyrene, polymethyl methacrylate, polysulfide resin, aromatic polyethers (Amorphous thermoplastic polymer such as polyphenylene ether resin), or other polymer grafted on a polymer unit having a main repeating structural unit of an α-monoolefin having 2 to 8 carbon atoms. Graft polymers obtained by graft polymerization of an acrylonitrile-styrene copolymer onto an ethylene-propylene copolymer, a graft polymer obtained by graft-polymerizing an acrylonitrile-styrene copolymer on an ethylene-butene copolymer, ethylene A graft polymer in which a butyl acrylate-methyl methacrylate copolymer is graft-polymerized to a butene copolymer, a graft polymer in which a methyl methacrylate copolymer is graft-polymerized to an ethylene-butene copolymer, and a styrene / butadiene rubber; Hydrogenated products, hydrogenated nitrile rubber, ethylene / propylene rubber, ethylene / propylene / diene rubber, ethylene / butene rubber, ethylene /
Butene / diene rubber, acrylic rubber, chlorinated polyethylene rubber, fluorine rubber, silicone rubber, urethane rubber,
Rubbers of essentially saturated or unsaturated degree such as epichlorohydrin rubber, polysulfide rubber, hydrogenated styrene / butadiene block copolymer, α, β-unsaturated nitrile / acrylic ester / conjugated diene copolymer rubber And the like. Also, a plurality of substances selected from these groups may be used in (C).

Among the above, preferred are aromatic polycarbonate resins. Further, among the aromatic polycarbonate resins, an aromatic polycarbonate resin having a terminal hydroxyl group concentration of 1 to 40 mol% is preferable.

The aromatic polycarbonate resin used in the present invention may be a homo or copolycarbonate. The structure of the aromatic polycarbonate resin may be a branched structure or a linear structure. further,
It may be a mixture of a branched structure and a linear structure.

The method for producing the aromatic polycarbonate resin may be any of the generally known methods such as the phosgene method and the transesterification method. Hereinafter, as an example, a method for producing an aromatic polycarbonate resin by a transesterification method will be described. The transesterification method can be produced by adding a basic catalyst to a dihydric phenol and a carbonic acid diester, and further adding an acidic substance that neutralizes the basic catalyst, and performing melt transesterification polycondensation. Representative examples of the dihydric phenol include bisphenols, and 2,2-bis (4-hydroxyphenyl) propane, that is, bisphenol A is particularly preferable. Further, part or all of bisphenol A may be replaced with another dihydric phenol. Other dihydric phenols include hydroquinone,
Bis (4-hydroxyphenyl) such as 4,4-dihydroxydiphenyl, bis (4-hydroxyphenyl) methane and 1,1-bis (4-hydroxyphenyl) ethane
Alkanes, bis (4-hydroxyphenyl) cycloalkanes such as 1,1-bis (4-hydroxyphenyl) cyclohexane, bis (4-hydroxyphenyl) sulfide, bis (4-hydroxyphenyl) sulfone, bis (4-hydroxyphenyl) ) Compounds such as sulfoxides, bis (4-hydroxyphenyl) ethers,
2,2-bis (3-methyl-4-hydroxyphenyl)
Alkylated bisphenols such as propane, 2,2-bis (3,5-dimethyl-4-hydroxyphenyl) propane, 2,2-bis (3,5-dibromo-4-hydroxyphenyl) propane, 2,2 Halogenated bisphenols such as -bis (3,5-dichloro-4-hydroxyphenyl) propane.

Representative examples of the carbonic acid diester include diphenyl carbonate, ditolyl carbonate, bis (chlorophenyl) carbonate, m-cresyl carbonate, dinaphthyl carbonate, bis (biphenyl) carbonate, diethyl carbonate, dimethyl carbonate, dibutyl carbonate, dicyclohexyl. Carbonate and the like. Of these, diphenyl carbonate is particularly preferred.

Next, an aromatic polycarbonate resin having a terminal hydroxyl group concentration of 1 to 40 mol% which can be suitably used in the present invention will be described.

Taking an example of an aromatic polycarbonate resin produced by transesterification using bisphenol A and diphenyl carbonate as raw materials, the terminals of the obtained aromatic polycarbonate are a phenolic hydroxyl group and a phenyl group. Here, by increasing the ratio of the charged mole number of diphenyl carbonate to the charged mole number of bisphenol A as a raw material, the phenolic hydroxyl terminal ratio can be freely controlled, but the phenolic hydroxyl terminal concentration exceeds 40 mol%. , The hue and the heat resistance are deteriorated, so that the content is desirably 40 mol% or less. More preferably, it is at most 30 mol%. In the melt transesterification method, the phenolic hydroxyl terminal ratio is 3 mol%.
It is generally difficult to: Therefore, the terminal hydroxyl group ratio of the aromatic polycarbonate resin used in the present invention is desirably 3 mol% or more and 30 mol% or less.

The non-crystalline polyester resin (A), the epoxidized diene-based block copolymer (B), and the thermoplastic resin (C) other than (A) and (B) which constitute the thermoplastic resin composition of the present invention. The preferred mixing ratio is 60 to 70% by weight of the component (A), 30 to 40% by weight of the component (C), and 100 parts by weight of the total of the components (A) and (C) in the composition.
Component (B) is 1 to 15 parts by weight.

Further, the composition of the present invention includes, for example, a filler, a curing accelerator, an antioxidant, an ultraviolet absorber, a sulfur curing agent, a decomposition inhibitor, a process oil, a pigment, zinc oxide, stearic acid, Agents, tackifiers, plasticizers, antistatic agents,
Additives used for ordinary thermoplastic materials, such as a flame retardant, a lubricant, a foaming agent, a coloring agent, and a crosslinking aid, can be added alone or in combination as needed. In addition, a thermosetting polymer can be added as long as the properties of the composition of the present invention are not impaired.

In the present invention, the component (a) and the component (b)
As a method for mixing the component, the component (c), and the above-mentioned additive, a conventionally known method can be used. For example,
Melt kneading is performed by a known kneading machine such as a roll, a Brabender mixer, various extruders, a kneader, a Banbury mixer, a tumbling mixer, a Henschel mixer, a ribbon blender, a super mixer, a rolling mixer (mill mixer), and a continuous kneader. Thus, a mixture can be obtained by injection-molding a dry-blended product. In order to produce the composition of the present invention, the respective components may be mixed at once, or after pre-mixing arbitrary components in advance, the remaining components may be added and mixed. The most preferred mixing device is a single-screw or twin-screw extruder, which can continuously and efficiently knead and pelletize.

[0031]

DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention will be described below in more detail with reference to embodiments.

(Preparation of Epoxidized Diene Block Copolymer) [Preparation Example 1] A polystyrene-polybutadiene-polystyrene block copolymer [styrene / styrene] was placed in a jacketed reactor equipped with a stirrer, a reflux condenser, and a thermometer. Butadiene weight ratio = 40/60] 300 g, ethyl acetate 150
0 g was charged and dissolved. Then, 165 g of a 30% by weight solution of peracetic acid in ethyl acetate was continuously added dropwise, and the solution was stirred at 40 ° C for 3 hours.
The epoxidation reaction was performed for hours. The reaction solution was returned to room temperature, taken out of the reactor, and a large amount of methanol was added to precipitate a polymer. The polymer was separated by filtration, washed with water, and dried to obtain an epoxy-modified polymer. The obtained epoxidized diene-based block copolymer was converted to an epoxidized diene-based block copolymer B-1.
And (Polymer epoxy equivalent 490).

Preparation Example 2 In a jacketed reactor equipped with a stirrer, a reflux condenser, and a thermometer, 600 g of a polystyrene-polybutadiene block copolymer [styrene / butadiene weight ratio = 70/30], 1,800 ethyl acetate
g was charged and dissolved. Subsequently, 150 g of a 30% by weight solution of peracetic acid in ethyl acetate was continuously added dropwise, and stirred at 40 ° C.
The epoxidation reaction was performed for hours. The reaction solution was returned to room temperature, taken out of the reactor, and a large amount of methanol was added to precipitate a polymer. The polymer was separated by filtration, washed with water, and dried to obtain an epoxy-modified polymer. The obtained epoxidized diene-based block copolymer is referred to as a polymer B-2 (epoxy equivalent of the polymer is 760).

Preparation Example 3 300 g of a block copolymer of polystyrene-polyisoprene-polystyrene [styrene / isoprene weight ratio = 30/70] was placed in a jacketed reactor equipped with a stirrer, a reflux condenser, and a thermometer. 2500 g of hexane was charged and dissolved, a nickel catalyst was added as a hydrogenation catalyst, and the mixture was reacted at a hydrogen partial pressure of 15 kg / cm 2 and a temperature of 150 ° C. for 3 hours. The solvent was removed from the obtained partially hydrogenated polymer solution by drying under reduced pressure (the degree of hydrogenation of the entire isoprene part was 85%). This partially hydrogenated polymer 300
g and cyclohexane 1500 g were charged and dissolved. Subsequently, 150 g of a 30% by weight solution of peracetic acid in ethyl acetate was continuously dropped, and an epoxidation reaction was carried out at 40 ° C. for 3 hours with stirring. The reaction solution was returned to room temperature, taken out of the reactor, and a large amount of methanol was added to precipitate a polymer. The polymer was separated by filtration, washed with water, and dried to obtain an epoxy-modified polymer. The obtained epoxidized diene-based block copolymer is referred to as polymer B-3 (epoxy equivalent of the polymer is 750).

(Examples 1 to 4) Amorphous polyester resin (PET-G, manufactured by Eastman Chemical Company) and aromatic polycarbonate resin (manufactured by Idemitsu Petrochemical Co., Ltd.)
Teflon A2200) Further, the epoxidized diene-based block copolymers (B-1 to B-3) obtained in Preparation Examples 1 to 3 were mixed in a tumbler in the composition shown in Table 1. Thereafter, the mixture was kneaded and pelletized at 240 ° C. using a TEM35B twin screw extruder manufactured by Toshiba. Further, pellets obtained by using a Toshiba IS100P injection molding machine were molded into test pieces under the condition of 240 ° C., and each physical property such as Izod impact strength, melt index, and flexural modulus was measured. Table 1 shows the results.

(Comparative Examples 1-2) Amorphous polyester resin (manufactured by Eastman Chemical Company, PET-G) and aromatic polycarbonate resin (manufactured by Idemitsu Petrochemical Co., Ltd.)
Toughlon A2200) was mixed in a tumbler in the composition shown in Table 1. Thereafter, the mixture was kneaded and pelletized at 240 ° C. using a TEM35B twin screw extruder manufactured by Toshiba. Further, the pellets obtained by the Toshiba IS100P injection molding machine were used for 24 hours.
A test piece was molded at 0 ° C., and the physical properties of Izod impact strength, melt index, and flexural modulus were measured. Table 1 shows the results. As can be seen from Table 1, the comparative example is inferior to the example in impact resistance and fluidity.

(Comparative Example 3) Amorphous polyester resin (PET-G, manufactured by Eastman Chemical Company) 700
Parts by weight, 300 parts by weight of an aromatic polycarbonate resin (manufactured by Idemitsu Petrochemicals Co., Ltd., Teflon A2200) and 100 parts by weight of an ethylene-glycidyl methacrylate copolymer (manufactured by Sumitomo Chemical Co., Ltd., Bond First E) by tumbler Mixed. Thereafter, the mixture was kneaded and pelletized at 240 ° C. using a TEM35B twin screw extruder manufactured by Toshiba. However, the obtained pellets had a bad appearance and had burnt portions scattered.

[0038]

[Table 1]

Examples 5 to 8 The pellets of the thermoplastic resin composition obtained in Examples 1 to 4 were extruded to obtain sheets having a thickness of 0.1 mm and 0.2 mm. The ball impact strength of the sheet thus obtained was measured. Table 2 shows the results.

(Comparative Examples 4 and 5) The pellets of the thermoplastic resin compositions obtained in Comparative Examples 1 and 2 were extruded to obtain sheets having a thickness of 0.1 mm and 0.2 mm. The ball impact strength of the sheet thus obtained was measured. Table 2 shows the results.

[0041]

[Table 2]

(Method of Measuring Physical Properties) (1) Izod impact strength: Notched test piece (3.2 m)
m thickness) was prepared and measured at 23 ° C. according to ASTM D256. (2) Melt index: Measured at 250 ° C. under a load of 5 kgf according to ASTM D1238. (3) Flexural modulus: 23 according to ASTM D790
Measured in ° C. (4) Falling ball impact strength: 50 according to JIS X6301
A steel ball of 0 g was dropped on the sheet from a height of 30 cm, and the condition of the sheet was examined. The results were as follows: ○: The sheet was not broken
×: Displayed when the sheet was broken.

[0043]

As described above, the non-crystalline polyester resin (A), the epoxidized diene block copolymer (B), and the thermoplastic resin (C) other than (A) and (B) of the present invention are used. The resin composition obtained by blending has excellent fluidity and dispersibility, and can exhibit sufficient impact resistance especially in a thin molded product such as an IC card.

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[Procedure amendment]

[Submission date] September 2, 1999 (1999.9.2)

[Procedure amendment 1]

[Document name to be amended] Statement

[Correction target item name] 0038

[Correction method] Change

[Correction contents]

[0038]

[Table 1]

[Procedure amendment 2]

[Document name to be amended] Statement

[Correction target item name] 0041

[Correction method] Change

[Correction contents]

[0041]

[Table 2]

──────────────────────────────────────────────────続 き Continued on the front page (51) Int.Cl. ⁷ Identification symbol FI Theme coat ゛ (Reference) G06K 19/077 G06K 19/00 K F term (Reference) 4F071 AA02 AA43 AA45 AA50 AA75 AA78 AF23 AH07 AH12 AH14 BA01 BB06 BC01 4J002 AA01Y AC11Y BB05Y BB15Y BB24Y BC02Y BD12Y BG03Y BG09Y BN06Y BN07Y BN12Y BN15Y BN16Y BP00X BP01X BP01Y CD18X CF00W CF00Y CF05W CG00Y CH04Y CH06Y CM04G00 A00

Claims (10)

[Claims] 1. An amorphous polyester resin (A), an epoxidized diene-based block copolymer (B), (A) and (B)
A thermoplastic resin composition comprising a thermoplastic resin (C) other than the above. 2. The thermoplastic resin composition according to claim 1, wherein the non-crystalline polyester resin (A) is a copolymerized polyester. 3. The non-crystalline polyester resin (A) comprises:
The thermoplastic resin composition according to claim 2, wherein the thermoplastic resin composition is a copolymerized polyester of 1,4-cyclohexanedimethanol and polyethylene terephthalate. 4. An epoxidized diene-based block copolymer (B) obtained by epoxidizing a block copolymer composed of a block composed of a vinyl aromatic compound and a block composed of a conjugated diene compound or a partially hydrogenated product thereof. The thermoplastic resin composition according to any one of claims 1 to 3, wherein 5. An epoxidized diene-based block copolymer (B) obtained by epoxidizing a block copolymer composed of a block composed of a vinyl aromatic compound and a block composed of a conjugated diene compound or a partially hydrogenated product thereof. 60% by weight of a block composed of a vinyl aromatic compound.
The thermoplastic resin composition according to any one of claims 1 to 4, wherein: 6. A thermoplastic resin other than (A) and (B) (C)
Is an aromatic polycarbonate resin. The thermoplastic resin composition according to claim 1, wherein 7. The thermoplastic resin composition according to claim 6, wherein the terminal hydroxyl group concentration of the aromatic polycarbonate resin is 1 to 40 mol%. 8. A molded article using the thermoplastic resin composition according to claim 1. 9. A sheet using the thermoplastic resin composition according to claim 1. 10. An IC card using the thermoplastic resin composition according to claim 1.