JP2001015970A - Electronic equipment - Google Patents

Abstract

PROBLEM TO BE SOLVED: To obtain a personal computer for which a module, etc., mounted with a semiconductor chip, particularly, a semiconductor chip that generates heat during operation can be repaired easily and which is provided with a cooling function for the semiconductor chip and can be suitably reduced in thickness. SOLUTION: A personal computer 1 is provided with a mother board 4 having an opening (17), an MPU 5 which is faced oppositely to the opening (18) of the board 4 and has a bare chip 7 that is provided as integrated circuit parts at a position at which part of its external form is inserted into the opening (17), and a cooling fan module 12 having a cooling fan 14 which is provided at a position where the module 12 is faced oppositely to the bare chip 7 mounted on the MPU 5 for cooling the chip 7 and part of its external form is inserted into the opening (17) of the board 4. The computer 1 is also provided with stacking connectors 11 and 16 which freely detachably connect the MPU 5 to the cooling fan module 12 connected to the board 4 through the opening (17) of the board 4.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic device suitable for being carried, such as a notebook personal computer or a mobile personal computer.

[0002]

2. Description of the Related Art Today, an increase in the use ratio of LSI due to the digitization of electronic devices and an increase in the operating speed of various circuits are required.
Attention has been paid to integrated circuit units that realize high-density mounting of I and high-speed operation of circuits. This MCM is, for example, an MPU (Micro Processes) used for computer control.
sor unit), which has greatly contributed to the rapid development of personal computers and the like in recent years.

[0003] While such an MPU realizes high-speed data processing, the amount of heat generated from the MPU body tends to increase as the processing speed increases. Of course, if data processing is performed while the MPU generates heat, it may cause a malfunction. Therefore, a personal computer is generally provided with a cooling mechanism for cooling the MPU in order to suppress an increase in the temperature of the MPU main body due to heat generation.

That is, the cooling mechanism of this MPU is shown in FIG.
As shown in (1), a heat sink 53 is attached to the upper surface of an MPU 52 mounted on a motherboard 51 in a personal computer by a surface mounting technique such as a BGA (Ball GridArrey) through a silicone rubber sheet 54 or the like.
Further, a cooling fan 55 mounted on the heat sink 53
By cooling the heat sink 53, the MPU 5
2 to remove heat.

[0005]

With the remarkable development of mobile communication in recent years, among personal computers, in particular, notebook personal computers or mobile personal computers have been required to be further thinned in order to improve portability. Is growing. Therefore, how to configure the cooling mechanism of the MPU 52 while rationally using the limited space inside the personal computer is an important item in designing such a portable terminal.

However, the MPU 52 as described above
PC with a cooling mechanism of at least MPU5
2, the thickness of the heat sink 53 and the cooling fan 55, etc.
Further, it is necessary to secure a space in which the thickness of the motherboard 51 is added in the thickness direction inside the housing of the personal computer main body, and there is a limit to further reducing the thickness of the entire personal computer.

Further, for example, in consideration of the repair of the MPU 52, a detachable connection method using a connector or the like is suitable as a connection method between the motherboard 51 and the MPU 52. In this case, the MPU 52 using the above-described BGA or the like is suitable.
It requires more space in the thickness direction than surface mounting, and is not suitable for making personal computers thin.
Therefore, the connection between the motherboard 51 and the MPU 52 must be performed by surface mounting using a BGA or the like, but in this case, an expensive repair device is required, and M
There is a problem that it is difficult to remove the PU 52.

Accordingly, the present invention has been made to solve such a problem, and in particular, it is easy to repair a module or the like on which an integrated circuit component that generates heat during operation is mounted, and the integrated circuit component is easily repaired. It is an object of the present invention to provide an electronic device having a cooling function for the electronic device and suitable for a thin structure.

[0009]

According to another aspect of the present invention, there is provided an electronic apparatus according to the present invention, comprising: a wiring board having an opening; and the opening of the wiring board. An integrated circuit component provided at a position facing the integrated circuit component, and a fan provided at a position facing the integrated circuit component and at which a part of the outer shape is inserted into the opening of the wiring board, and cooling the integrated circuit component And characterized in that:

According to a second aspect of the present invention, there is provided an electronic apparatus having a wiring board having an opening, at least an integrated circuit component mounted thereon, and an outer shape in the opening of the wiring board. A first module provided at a position where the unit is inserted, and a second module provided at a position facing the integrated circuit component mounted on the first module and having a fan for cooling the integrated circuit component. And a module. Further, the electronic device according to the present invention, as described in claim 3, includes a first wiring board having an opening, and an integrated circuit component provided at a position facing the opening of the wiring board. And a fan which is provided at a position facing the integrated circuit component mounted on the first module and at which a part of the outer shape is inserted into the opening of the wiring board, and cools the integrated circuit component And a second module having:

[0011] The electronic device of the invention, such as a personal computer, has an outer shape of an integrated circuit component such as an MPU or a module having the integrated circuit component which generates heat during operation.
Alternatively, the outer shape of a module having a fan for cooling the integrated circuit component is provided at a position where it is inserted into an opening of the wiring board. Therefore, according to these inventions, in the structure in the thickness direction of the cooling mechanism for cooling the integrated circuit components, the cooling mechanism can be configured to be thinner while substantially eliminating the thickness of the wiring board. Can have a thin structure as a whole.

According to a fourth aspect of the present invention, there is provided the electronic device according to the second or third aspect, wherein the first module connects the second module to the wiring board. A member, and a second connection member for detachably connecting the first module to the second module connected to the wiring board by the first connection member through the opening. It is characterized by.

According to the electronic apparatus of the present invention, a module having an integrated circuit component is different from a module having a fan,
The detachable connection facilitates repair of the module having the integrated circuit component. Furthermore, in the electronic device of the present invention, since the module having the fan and the module having the integrated circuit component are connected through the opening of the wiring board, the thickness of the wiring board is substantially omitted as described above. As a result, a cooling mechanism is formed, and the entire apparatus has a thin structure.

[0014]

Embodiments of the present invention will be described below with reference to the drawings.

FIG. 1 is a perspective view schematically showing a personal computer according to an embodiment of the present invention.

As shown in FIG. 1, the personal computer 1 is a notebook type useful when being carried, and includes a personal computer main body 2 having a storage device such as a hard disk and an input device such as a keyboard, and a keyboard and the like. Liquid crystal display panel 3 for visually displaying information input through a user to a user
It is composed of

As shown in FIG. 2, a motherboard 4 on which various electronic components including a RAM, a ROM, and the like are mounted is incorporated in the personal computer body 2. An MPU for taking out arithmetic processing and controlling input / output of signals is mounted.

Here, the MPU provided in the personal computer 1 of this embodiment and a cooling mechanism for cooling the MPU by blowing air will be described in detail.

As shown in FIG. 3 and FIG.
The cooling mechanisms that blow air and cool the MPU 5 are each configured as one module.

That is, the MPU as a circuit module
Reference numeral 5 denotes a substrate 6, a bare chip 7 as an integrated circuit component which is surface-mounted on the substrate 6 and generates heat during operation because of performing high-speed data processing, and an SMD such as a resistor or a capacitor similarly mounted on the substrate 6. (Surface Mount Device)
A component 8, a heat sink 9 provided in close contact with the surface of the bare chip 7 via a silicone resin or the like, and a substrate 6
, And each of the leads 10 is constituted by a concave stacking connector 11 which is electrically connected to individual electrodes of the bare chip 7 and the SMD component 8 through a wiring pattern of the substrate 6.

On the other hand, a cooling fan module 12 for cooling the MPU 5 by blowing air is electrically connected to the substrate 13 formed by molding, for example, and the substrate 13, and blows air to cool the heat sink 9. By doing so, the cooling fan 14 for removing heat from the bare chip 7 and the individual contacts are provided so as to be compatible with the contacts of the concave stacking connector 11, and the leads 15 of the individual contacts are provided on the motherboard 4 in a predetermined manner. And a convex stacking connector 16 soldered to the electrodes.

The cooling fan module 12 is provided with a lead for supplying driving power to the cooling fan 14 separately from the lead 15 of the convex stacking connector 16. It is connected. Thus, power can be supplied to the cooling fan 14 without providing a dedicated harness connector or the like.

By the way, the motherboard 4 of this embodiment
An opening 17 is formed in a portion where the MPU 5 and the cooling fan module 12 are mounted, and the MPU 5 and the cooling fan module 12 are connected through the opening 17. Further, the MPU 5 and the cooling fan module 12 are arranged in such a manner that a part of the outer shape is inserted into the opening 17.

Therefore, the personal computer 1 of the present embodiment
The outer shape of the MPU 5 that generates heat during operation or the outer shape of the cooling fan module 12 that cools the MPU 5 is provided at a position where it is inserted into the opening 17 of the motherboard 4. Therefore, according to the personal computer 1 of the present embodiment, in the structure in the thickness direction of the cooling mechanism for cooling the MPU 5, the cooling mechanism can be configured to be thinner while substantially eliminating the thickness of the motherboard 4. The whole can be made a thin structure.

Further, in the personal computer 1 of the present embodiment, the MPU 5 controls the stacking connectors 11, 1 through the opening 17 of the motherboard 4 with respect to the cooling fan module 12.
6 so that the MPU 5 can be easily repaired, in addition to the fact that the entire device can be made thinner as described above.

The connection between the MPU 5 and the cooling fan module 12 according to the present embodiment is made, for example, by a PGA (Pin Grid Ara) using pins 18 and sockets 19 as shown in FIG.
y) In addition to the connection, the cooling fan module 12 and the motherboard 4 are connected to the bumps 2 formed on the electrodes of the substrate 13.
0 may be connected to reduce the number of components constituting the cooling mechanism.

In the above-described embodiment, the position of the MPU 5 and the cooling fan module 12 in the vertical direction is not particularly described. However, when the personal computer 1 is installed, the MPU 5 is moved downward and the cooling fan module 12 is moved downward.
The cooling effect of the MPU 5 may be improved by disposing it above.

[0028]

As described above, the electronic device according to the first to third aspects of the present invention, such as a personal computer, has an outer shape of an integrated circuit component such as an MPU which generates heat during operation or a module having the integrated circuit component. The external shape or the external shape of the module having a fan for cooling the integrated circuit component is provided at a position where the external shape is inserted into the opening of the wiring board. Therefore, according to these inventions, in the structure in the thickness direction of the cooling mechanism for cooling the integrated circuit components, the cooling mechanism can be configured to be thinner while substantially eliminating the thickness of the wiring board. Can have a thin structure as a whole.

Also, in the electronic device according to the present invention, since the module having the integrated circuit component is detachably connected to the module having the fan, the module having the integrated circuit component can be easily repaired. Become. Furthermore, in the electronic device according to the fourth aspect, since the module having the fan and the module having the integrated circuit component are connected through the opening of the wiring board, the thickness of the wiring board is substantially the same as described above. Thus, the cooling mechanism is configured and the entire apparatus has a thin structure.

[Brief description of the drawings]

FIG. 1 is an exemplary perspective view schematically showing a personal computer according to an embodiment of the present invention;

FIG. 2 is an exemplary sectional view showing the internal structure of the personal computer in FIG. 1;

FIG. 3 is an exemplary sectional view showing an MPU provided inside the personal computer of FIG. 1 and a cooling mechanism thereof;

FIG. 4 is a sectional view schematically showing a joining relationship between the MPU and the cooling mechanism of FIG. 3;

FIG. 5 is a sectional view showing another MPU different from FIG. 3 and a cooling mechanism thereof.

FIG. 6 is a sectional view showing an MPU provided in a conventional personal computer and its cooling mechanism.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 ... Personal computer 4 ... Motherboard 5 ... MPU 7 ... Bare chip 9 ... Heat sink 10, 15 ... Lead 11 ... Recessed stacking connector 12 ... Cooling fan module 14 ... Cooling fan 16 ... Convex stacking connector 17: Motherboard opening 18: Pin 19: Socket 20: Bump

Claims (4)

[Claims] A wiring board having an opening; an integrated circuit component provided at a position facing the opening of the wiring board; and an outer shape at the opening of the wiring board facing the integrated circuit component. And a fan that is provided at a position where a part of the integrated circuit component is inserted and cools the integrated circuit component. 2. A wiring board having an opening, a first module on which at least an integrated circuit component is mounted, and a first module provided at a position where a part of an outer shape is inserted into the opening of the wiring board; An electronic device, comprising: a second module provided at a position facing the integrated circuit component mounted on one module and having a fan for cooling the integrated circuit component. 3. A wiring board having an opening, a first module having an integrated circuit component provided at a position facing the opening of the wiring board, and the integration mounted on the first module. A second module which is provided at a position facing the circuit component and at which a part of the outer shape is inserted into the opening of the wiring board, and which has a fan for cooling the integrated circuit component. Electronics. 4. The electronic device according to claim 2, wherein the first connection member connects the second module to the wiring board, and the first connection member is connected to the wiring board by the first connection member. An electronic device, further comprising a second connection member that detachably connects the first module to the second module through the opening.