JPH11103147A - Circuit module and electronic apparatus with built-in circuit module - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a circuit module whose density is high and which can realize an easy mounting operation, by a constitution wherein a plurality of stacked and arranged printed wiring boards are connected electrically by metal bumps, and electronic components are resin-sealed and mounted between the boards. SOLUTION: A desired electronic circuit is formed, via a via hole 21b and a through hole 21c, on a first printed wiring board 21, and a recessed component housing part 21d is formed on one face faced with a second printed wiring board 22. An electronic component 24 is housed in the component housing part 21d via respective metal bumps 25 so as to be connected electrically to the electronic circuit. On the other hand, a desired electronic circuit is formed, via a via hole 22b and a through hole 22c, on the second printed wiring board 22, and a recessed component housing part 21d is formed on one face faced with the first printed wiring board 21. An electronic component 24 is mounted in the component housing part 21d so as to be connected to the electronic circuit via respective metal bumps 25. Then, connecting lands 21a, 22a on both boards 21, 22 are connected via respective metal bumps 26, a resin 29 is sealed between them, and both boards are pasted and stacked.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a circuit module suitable for being provided in electronic equipment such as a personal computer (PC) and a PC card.

[0002]

2. Description of the Related Art Generally, a circuit module of this kind is mounted on a printed wiring board 1 as shown in FIG.
D), a surface mounted type (SMD), or various electronic components 2 such as semiconductor components called unpackaged bare chips, or the like, or formed on both sides of a multilayer printed wiring board 1a as shown in FIG. It is formed by mounting the electronic component 2.

[0003] In electronic equipment incorporating such a circuit module, there is a demand for miniaturization suitable for portability as well as a demand for multi-functionality. Recommended.

However, in the above circuit module,
There is a problem in that it is difficult to realize high-density mounting of electronic components while ensuring miniaturization, because there are restrictions on the shape and dimensions of the printed wiring board 1 (1a).

Therefore, as a means for realizing high-density mounting, there is a method for realizing high-density mounting by mounting chip components and semiconductor components having fine connection parts on the printed wiring board 1 (1a). However, the above-described means has a problem that the mounting work including the wiring connection becomes very troublesome because the parts themselves are small.

[0006]

As described above, in the conventional circuit module, if the mounting structure is such that it is difficult to promote the high-density mounting, or if the high-density mounting is attempted, the mounting operation becomes very troublesome. Is problematic.

[0007] The present invention has been made in view of the above circumstances, and can facilitate the high-density mounting by simplifying the configuration,
Another object of the present invention is to provide a circuit module capable of realizing an easy mounting operation. It is another object of the present invention to provide an electronic device having a circuit module with a simplified configuration and capable of promoting miniaturization.

[0008]

According to a circuit module of the present invention, a plurality of printed wiring boards are stacked and arranged, and the boards are electrically connected to each other by metal bumps, and electronic components are provided between the printed wiring boards. It was configured to be mounted with resin sealing.

According to the above construction, the electronic components are mounted in a resin-sealed manner between the printed wiring boards which are electrically connected to each other by metal bumps and are arranged in a stacked manner, so-called three-dimensional component mounting. Becomes possible. Therefore, high-density mounting can be achieved while realizing easy mounting work, and promotion of miniaturization can be achieved.

The present invention also provides a circuit module in which a plurality of printed wiring boards are stacked, electrically connected to each other by metal bumps, and electronic components are mounted between the printed wiring boards by resin sealing. And an apparatus main body in which the circuit module is housed, to constitute an electronic apparatus.

According to the above configuration, the circuit module is mounted with the electronic components being resin-sealed between the printed wiring boards that are electrically connected to each other by the metal bumps and stacked and arranged. That is, so-called three-dimensional component mounting becomes possible. Therefore, high-density mounting can be achieved while facilitating the mounting operation, and the miniaturization of the circuit module can be promoted, and the device body can be miniaturized as much as possible.

Further, the present invention provides a circuit module in which a plurality of printed wiring boards are stacked, electrically connected to each other by metal bumps, and electronic components are mounted between the printed wiring boards by resin sealing. And a card-like device main body in which the circuit module is housed and at least one end of which is provided with a data processing device connection portion, to constitute a card-like electronic device.

According to the above configuration, in the circuit module, the electronic component is mounted by being resin-sealed between the printed wiring boards which are electrically connected to each other by the metal bumps and are stacked and arranged, thereby forming the electronic component. That is, so-called three-dimensional component mounting becomes possible. Therefore, high-density mounting can be achieved while facilitating the mounting operation, and the miniaturization of the circuit module can be promoted.

[0014]

Embodiments of the present invention will be described below in detail with reference to the drawings. FIG. 1 shows an electronic device incorporating a circuit module according to an embodiment of the present invention. A device main body 10 incorporates a circuit module 20 which is a feature of the present invention.

The circuit module 20 is shown in FIGS.
As shown in the figure, the first and second multilayer printed wiring boards 21
The connection lands 21a, 2 are formed on one surface of each of the first and second printed wiring boards 21, 22.
2a is formed correspondingly. And the first and second
Electronic components 2 are provided on the other surfaces of the printed wiring boards 21 and 22 of FIG.
3 are respectively mounted.

A desired electronic circuit is formed on the first printed wiring board 21 through the via hole 21b and the through-hole 21c.
For example, a concave component accommodating portion 21d is provided on one surface opposite to the first component. An electronic component 24 is mounted on the component housing portion 21d via a metal bump 25 and is electrically connected to an electronic circuit (see FIG. 4).

On the other hand, a desired electronic circuit is formed on the second printed wiring board 22 via the via hole 22b and the through through hole 22c. Is provided. An electronic component 24 is mounted on the component housing portion 21d, and is electrically connected to an electronic circuit via a metal bump 25.

The first and second printed wiring boards 21 and
2 are connection lands 21a and 22a as shown in FIG.
Are electrically connected via the metal bumps 26,
In the meantime, the resin 29 is sealed, laminated, and stacked. Thereby, the first and second printed wiring boards 21 and
2 is mounted in a packaged state so that the electronic components 24 of the component housings 21d and 22d are sealed with resin. One surface of the second printed wiring board 22 is opposed to one surface of the first printed wiring board 21, and the connection lands 21 a and 22 a are electrically connected via metal bumps 26. Stacked.

The first and second printed wiring boards 2
As shown in FIG. 5, a heat radiating plate 27 is provided between the electronic component 24 and the heat radiating plate 27. Are combined. The radiator 11 is, for example, a heat sink 1
The amount of heat formed by the heat sink 1a and the fan 11b and transported through the heat radiating plate 27 is radiated to the outside of the device body 10. As a result, the electronic component 23 resin-sealed in the component housing portions 21d and 22d of the first and second printed wiring boards 21 and 22
Is thermally controlled to a temperature.

A keyboard 13 is provided in the device main body 10, and the keyboard 12 is electrically connected to a circuit module 20 in the device main body 10. The device body 10 includes a liquid crystal display (LCD).
13 is rotatably assembled in the direction of the arrow.

Further, between the first and second printed wiring boards 21d and 22d, for example, a reinforcing member 28 having a substantially cross-shaped cross section is interposed as shown in FIG. This reinforcing member 28
Are formed in a substantially lattice shape, for example, and are provided on one surface of the first and second printed wiring boards 21 and 22.
22e are respectively accommodated and interposed. This allows
The reinforcing member 28 includes first and second printed wiring boards 21 and
The reinforcement is set in the vicinity of the second component housings 21d and 22d to set a desired strength. As a result, in the first and second printed wiring boards 21 and 22, there is no restriction on the arrangement position of the component housing portions 21d and 22d for housing the electronic components 23, and a degree of freedom in design can be obtained.

As described above, the circuit module 20 includes:
The first and second printed wiring boards 21 and 22 are stacked and arranged, and the boards are electrically connected to each other by metal bumps 26. An electronic device is provided between the first and second printed wiring boards 21 and 22. The component 23 was configured to be mounted with resin sealing.

According to this, for example, the electronic components 23 are electrically connected by the metal bumps 25, stacked and arranged, and are mounted between the printed wiring boards 21 and 22 by resin sealing, so that a so-called electronic component 23 is mounted. Since three-dimensional component mounting is possible, and the mounting area can be substantially improved, it is possible to realize easy mounting work, achieve high-density mounting, and promote miniaturization.

According to this, since it is not necessary to package components such as semiconductor chips, the mountable area per unit area can be increased by itself.
From this point, miniaturization can be promoted.

Further, according to this, since the electronic component 23 is mounted between the substrates 21 and 22 by resin sealing, it is difficult to take out the electronic component 23 once mounted. The required security measures are implemented.

In the electronic apparatus according to the present invention, the first and second printed wiring boards 21 and 22 are stacked and electrically connected to each other by the metal bumps 26.
The circuit module 20 in which the electronic component 23 is resin-sealed and mounted is built in the device body 10.

According to the above configuration, the circuit module 20
Means that the electronic component 23 is the first and second printed wiring boards 2
The electronic component 23 can be mounted in a so-called three-dimensional manner by being mounted with the resin sealed between the components 1 and 22. Therefore, high-density mounting can be achieved by an easy operation, the miniaturization of the circuit module 20 can be promoted, and the device main body 10 can be miniaturized as much as possible.

In the above embodiment, the first and second
The printed circuit boards 21 and 22 have concave component housings 21d.
The electronic component 23 is accommodated in the component accommodating portions 21d and 22d, and the electronic component 23 is mounted with resin sealing. However, the present invention is not limited thereto. It is also possible to arrange so as to be directly interposed between the wiring boards 21 and 22 and to mount it, and to perform resin sealing.

Further, in the above-described embodiment, the case where the first and second multilayer printed wiring boards 21 and 22 are used has been described. However, the present invention is not limited to this number and two or more printed wiring boards may be stacked. It is also possible to configure. In this case,
The electronic components can be mounted between the opposing substrates. The printed wiring board is not limited to a multilayer laminated board, and can be configured.

Further, in the above embodiment, the electronic component 2
3 is mounted between the first and second printed wiring boards 21 and 22 by resin sealing.
And a case where the LCD 13 is built in the device main body 10 to which the LCD 13 is attached. However, the present invention is not limited to this. For example, as shown in FIG. 7 and FIG. It is also possible to configure so as to be built in an electronic device.

That is, a card-shaped device main body 30 called a frame is provided with a data processing device connecting portion 31 at one end, and a circuit module 32 is built therein. The circuit module 32 is formed by stacking, for example, film-shaped first and second printed wiring boards 33 and 34. The first and second printed wiring boards 33, 34
Are formed with connection lands 33a and 34a, and the connection lands 33a and 34a are electrically connected via metal bumps 35. An electronic component 36 such as a semiconductor chip is provided between the first and second printed wiring boards 33 and 34.
Are housed and electrically connected to the electronic circuit of the board, and are sealed with a resin 37 and mounted.

Then, the first and second printed wiring boards 3
A heat sink 38 is interposed between the heat sinks 3 and 34.
8, the electronic component 36 is thermally coupled. The heat radiating plate 38 is thermally coupled to a heat radiating portion 39 provided in the card-shaped device main body 30.

The first and second printed wiring boards 3
The reinforcing member 28 (see FIG. 6) is interposed between the members 3 and 34. Thereby, the first and second printed wiring boards 3
3 and 34 have a desired strength and can be mounted without being restricted by the mounting position of the electronic component 36, and the degree of freedom in design can be improved. Therefore, it is needless to say that the present invention is not limited to the above-described embodiment, and that various modifications can be made without departing from the scope of the present invention.

[0034]

As described above in detail, according to the present invention, there is provided a circuit module which has a simple structure, can promote high-density mounting, and can realize an easy mounting operation. be able to. Further, the present invention can provide an electronic device having a built-in circuit module with a simplified configuration and capable of promoting miniaturization.

[Brief description of the drawings]

FIG. 1 is an exemplary view showing a main part of an electronic device incorporating a circuit module according to an embodiment of the present invention;

FIG. 2 is a diagram showing a main part of a circuit module according to one embodiment of the present invention.

FIG. 3 is a view showing a manufacturing process of FIG. 2;

FIG. 4 is a view showing a component housing portion of the printed wiring board of FIG. 2 and a housing state of electronic components.

FIG. 5 is a view for explaining an attached state of a heat sink.

FIG. 6 is a view shown for explaining an attachment state of a reinforcing member.

FIG. 7 is a diagram showing a card-shaped electronic device incorporating a circuit module according to an embodiment of the present invention.

FIG. 8 is a cross-sectional view of a part of FIG. 7;

FIG. 9 is a diagram showing a conventional circuit module.

FIG. 10 is a diagram showing a conventional circuit module.

[Explanation of symbols]

10, 30: The device body. 11, 39: heat dissipating part. 11a: heat sink. 11b ... Fan. 12 ... keyboard. 13 ... LCD. 20 ... Circuit module. 21 and 22, 33 and 34: first and second printed wiring boards. 21a, 22a, 33a, 34a ... connection bumps. 21b, 22b ... via holes. 21c, 22c ... Through holes. 23, 24, 36: electronic components. 25, 26, 35 ... metal bumps. 27, 38 ... heat sinks. 28 ... Reinforcing member. 29, 37 ... resin. 31: Data processing device connection unit.

Claims (9)

[Claims] 1. A printed circuit board comprising: a plurality of printed wiring boards arranged in a stack, electrically connected to each other by metal bumps, and electronic components mounted between the printed wiring boards by resin sealing. Circuit module to do. 2. The circuit module according to claim 1, wherein a concave component housing portion is formed in the printed wiring board, and the electronic component is housed and mounted in the component housing portion. 3. The circuit module according to claim 1, wherein the electronic component is a semiconductor component. 4. The circuit module according to claim 1, wherein a heat radiating member is interposed between said printed wiring boards. 5. The circuit module according to claim 1, wherein a reinforcing member is interposed between the printed wiring boards. 6. A circuit module in which a plurality of printed wiring boards are stacked, electrically connected to each other by metal bumps, and an electronic component is mounted between the printed wiring boards by resin sealing. An electronic device comprising: a device main body in which a module is stored. 7. The electronic device according to claim 6, wherein a heat dissipating member is interposed between printed wiring boards of the circuit module, and the heat dissipating member is thermally coupled to a heat dissipating portion provided on the device main body. machine. 8. A circuit module in which a plurality of printed wiring boards are stacked, electrically connected to each other by metal bumps, and an electronic component is mounted between the printed wiring boards by resin sealing. A card-like electronic device comprising: a card-like device main body in which a module is housed and at least one end of which is provided with a data processing device connection portion. 9. The card-like electronic device according to claim 8, wherein a reinforcing member is interposed between said printed wiring boards.