JP2001003547A - Unslippery resin molded board - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an unslippery resin molded board, for which laying of a rug and the formation of a large number of recessed sections in a board surface are not necessary even when the surface is flat and has easy to clean. SOLUTION: Fibers 2 are superposed on the pattern surface of a film in which a pattern 3 is executed on one surface, an uncured thermosetting resin obtained by reacting polyester polyol with an isocyanate resin is placed on the fibers, and drawn, and held until polymerization progresses by approximately 80%, and cut in proper size, and the film is peeled and removed. The polymerized resin and the fibers are placed on a mold 7 for a surface, directing the pattern surface to an upper section, an SMC 8 is superposed, a mold 9 for a rear is clamped, and the whole is pressed, heated and molded. The resin molded board with one-surface pattern is obtained by mold release after cooling.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a non-slip resin molded plate (a resin molded plate with a non-slip surface) which is suitably used for a washing floor such as a bathroom or a shower unit.

[0002]

2. Description of the Related Art As a method for preventing the floor of a washing room such as a bathroom or a shower unit from slipping, for example, a non-slip sheet coated with a soft acrylic resin foam layer is attached to the lower surface of a floor portion of a flooring material body and integrated. (Japanese Patent Laid-Open Publication No. HEI 8-117125), a method of laying a non-slip pattern (a large number of recesses) on the floor of a washing place, and making each recess in an arc shape to give a sucker effect. A method (Japanese Patent Application Laid-Open No. 9-203227) and the like are known.

[0003]

However, Japanese Patent Application Laid-open No.
In the method of laying the laying material disclosed in Japanese Patent Publication No. -117125, there is a problem that the laying material becomes dirty during use for a long time and becomes slippery. In addition, Japanese Patent Application Laid-Open No.
In the method disclosed in Japanese Patent Publication No. 7-131, in which a non-slip pattern is scattered on the floor of a washing place, dirt is similarly adhered to a concave gap during use for a long time to make it slippery and slippery, and a pattern having a large number of concave parts. So there is a problem of cleanability. An object of the present invention is to provide a resin molded plate which does not need to lay a laying material or form a large number of concave portions on the plate surface, does not slip even on a flat surface, and is easy to clean. And

[0004]

Means for Solving the Problems The present inventors have found that the above object can be achieved by using a specific resin as the resin constituting the surface layer of the resin molded plate, and completed the present invention. That is, the present invention relates to the following non-slip resin molded plate (1) to (3). (1) A resin molded plate comprising a surface resin layer and a reinforced resin plate, wherein the floor resin layer has a floor slip resistance coefficient of 3.8 or more. (2) The above (1), wherein the surface resin layer contains fibers.
Non-slip resin molded plate. (3) The non-slip resin molded plate according to the above (2) or (3), wherein a pattern layer is further formed between the surface resin layer and the reinforced resin plate. (4) The above (1) to (3), wherein the surface resin is a thermosetting resin obtained by reacting a polyester polyol with an isocyanate-based resin or a thermosetting resin obtained by reacting a vinyl ester resin with an unsaturated polyester resin. ) Any of the non-slip resin molded plates.

[0005] Here, the floor slip resistance coefficient of the non-slip resin molded plate is a method specified in JIS-A 1407, "Method of testing the floor slip (pendulum type)" (the sliding piece is made of stainless steel SUS3).
04). The higher the coefficient of floor slip resistance is, the more difficult it is to slip.
A non-slip resin molded plate in the range of about 8 to 10 is obtained.

A preferable surface resin used in the present invention is a resin (thermosetting resin) obtained by adding an appropriate amount of a polyester polyol dissolved in an organic solvent such as toluene to an isocyanate resin having rubber-like flexibility and reacting. )
A resin (thermosetting resin) obtained by adding a rubber-based additive such as a vinyl ester resin to an unsaturated polyester resin and reacting the same.

The surface resin layer may contain fibers for increasing the surface strength. In that case, the fibers include glass fibers, alumina fibers, inorganic fibers such as silica fibers,
Alternatively, organic fibers such as polyester fibers and nylon fibers are used, and these may be woven or non-woven fabrics. Among them, a glass fiber nonwoven fabric is preferable from the viewpoint of not impairing the beauty of the pattern and the economic efficiency. Here, the basis weight of the fiber used is preferably about 20 to 50 g / m 2, more preferably about 30 to 40 g / m 2.

As a reinforced resin plate to be used, a typical one is a fiber reinforced resin plate (FRP), and as a fiber, inorganic fibers such as glass fiber, alumina fiber, silica fiber, etc., or polyester fiber, nylon fiber, etc. Organic fibers are used, which may be woven or non-woven. Examples of the resin used for the reinforced resin plate include a thermosetting resin such as an unsaturated polyester resin and a dicyclopentadiene resin. A reinforced resin plate can also be manufactured using a thermosetting fiber reinforced material such as a sheet molding compound (SMC) or a bulk molding compound (BMC).

As the pattern used for the pattern layer, ink is preferably used and is selected from those soluble in the surface resin. As such an ink, there is an ink obtained by mixing a pigment or a dye with an unsaturated polyester resin, an acrylic resin, a nitrified cotton (nitrocellulose) resin, or the like. In addition to the ink, a pulverized product of a natural mineral such as mica (mica) or a pulverized product of an inorganic substance such as a metal can also be used as the pattern.
Here, the pattern may be various patterns such as a floral pattern and a geometric pattern, but may be a non-pattern or a monochromatic pattern.

[0010]

The surface side of the reinforced resin plate is a rubber-like resin such as a thermosetting resin obtained by reacting a polyester polyol with an isocyanate resin or a thermosetting resin obtained by reacting a vinyl ester resin with an unsaturated polyester resin. Since it is a surface resin having properties or a fiber-containing surface resin, it has a higher floor slip resistance coefficient than a conventional resin plate.

[0011]

Embodiments of the present invention will be described below more specifically with reference to the accompanying drawings. FIG. 1 is a non-slip resin molded plate according to one embodiment of the present invention. This is a hard-slip resin molded plate in which the fibers 2 are impregnated with the surface resin 1, cured, adhered to a reinforced resin plate (fiber reinforced resin plate) 5 and integrated.

FIG. 2 shows a non-slip resin molded plate according to another embodiment of the present invention. Pattern layers (3 and 4) are further formed between the fiber layer containing the surface resin 1 and the reinforced resin plate 5. In FIGS. 1 and 2, the surface of the non-slip resin molded plate is a flat example, but the surface may have an uneven shape.

[0013] In the case of a resin molded plate with a pattern, the method of manufacturing the resin molded plate having low slipperiness according to the present invention can be carried out, for example, by the following method (see FIG. 3). A film having a pattern 3 on one side is prepared, and a fiber (glass fiber nonwoven fabric or the like) 2 is overlaid on the pattern side, and an uncured thermosetting obtained by reacting a polyester polyol with an isocyanate-based resin thereon. A rubber-based additive such as vinyl ester resin is added to a reactive resin or unsaturated polyester resin, and the reacted uncured thermosetting resin is placed, stretched to a uniform thickness, and cured. Hold in the furnace until polymerization progresses about 80%. Here, the reason why the polymerization is maintained until the polymerization proceeds about 80% is that the film can be peeled off, and a surface resin-containing fiber layer in which the pattern 3 is transferred to one surface of the fiber layer impregnated with the surface resin is obtained. is there. When the polymerization proceeds about 80%, it is cut into a suitable size, the film is peeled off and removed.

Next, this is placed on the surface mold 7 with the pattern surface facing up.
, And a thermosetting fiber reinforced material such as a sheet molding compound (SMC) is stacked thereon, and the back mold 9 is tightened, pressed, heated, and molded. When the mold is released after cooling, a resin molded plate with a single-sided pattern is obtained.

[0015]

EXAMPLE 1 FIG. 3 shows the procedure for producing a non-slip resin molded plate. On one surface of the film, a printing film 6 (base film is a polyester film 6a) having a thickness of 50 μm, on which a pattern 3 is applied with an ink soluble in the surface resin 1, is prepared, and as shown in FIG. A glass fiber nonwoven fabric 2 having an amount of 35 g / m 2 is overlaid, and a transparent uncured polyester resin (manufactured by Hitachi Chemical Co., Ltd., trade name: EUPOL 6039T) and an isocyanate resin (Sumitomo Bayer Urethane Co., Ltd.) A mixture (trade name: SUMIDUR N75) (mixing ratio: 81:29 by weight) was placed, and the resin was uniformly stretched to a thickness of 0.3 mm by a bar coater method and defoamed.

The polymerization is reduced to about 80% in a 40 ° C. curing oven.
Hold until advanced (about 30 minutes). Thereafter, the base film 6a was cut into an appropriate size, and the base film 6a was removed by peeling.

Next, as shown in FIG. 3B, the pattern 3 is placed on the front mold 7 with the surface on which the pattern 3 is present, and a sheet molding compound (SMC) 8 is stacked thereon, and the back mold 9 is placed. Tighten and pressurize (100 kg / square centimeter), heat (front type: 150 ° C, back type: 145)
C) and molded. The mold was released, and a resin molded plate with a single-sided pattern as shown in FIG. 3D was obtained. The floor slip resistance coefficient of the obtained resin molded plate was 4.0 as measured by the method specified in JIS-A1407.

[0018]

According to the present invention, the non-slip resin molded plate of the present invention does not need to form a large number of recesses on the plate surface, and does not require a laying material.
Not slippery. Easy to clean. If the surface resin layer contains fibers, the board surface is also reinforced,
Irregularities can also be provided on the plate surface. One in which a pattern layer is further formed between the surface resin layer and the reinforced resin plate has a beautiful appearance and high design. The non-slip resin molded plate of the present invention is suitable as a floor material in a slippery environment such as a bathroom floor.

[Brief description of the drawings]

FIG. 1 is a schematic sectional view of a non-slip resin molded plate according to the present invention.

FIG. 2 is a schematic cross-sectional view of a patterned hard-to-slip resin molded plate according to the present invention.

FIG. 3 is an explanatory diagram of a procedure for manufacturing a patterned hard-to-slip resin molded plate according to the present invention.

[Explanation of symbols]

1: Surface resin 2: Glass fiber non-woven fabric 3: Pattern 4: Adhesive resin 5: Reinforced resin plate (fiber reinforced resin plate) 6: Printing film 6a: Base film (polyester film) 7: Surface type 8: Sheet molding compound ( SMC) 9: Back type

 ──────────────────────────────────────────────────続 き Continued on the front page (72) Inventor Kenji Takada 1010 Ippongi, Toyama City, Toyama Prefecture Hitachi Chemical Unit Co., Ltd. F-term (reference) 2D032 GA00 2E025 BA01 BC02

Claims (4)

[Claims] 1. A resin molded plate comprising a surface resin layer and a reinforced resin plate, wherein the surface resin layer has a floor slip resistance coefficient of 3.
Non-slip resin molded plate of 8 or more. 2. The non-slip resin molded plate according to claim 1, wherein the surface resin layer contains fibers. 3. The non-slip resin molded plate according to claim 2, wherein a pattern layer is further formed between the surface resin layer and the reinforced resin plate. 4. A thermosetting resin obtained by reacting a polyester polyol with an isocyanate-based resin or a thermosetting resin obtained by reacting a vinyl ester resin with an unsaturated polyester resin. Non-slip resin molded plate of any of the above.