JP2001003158A - Film forming device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To prevent adherence of deposits, and deposition of a large volume of deposits by providing at least a substantially thin-walled upper end portion of a cylindrical upper part to store an evaporating material which is projected above a base part to be cooled of a hearth with the evaporating material stored therein in a vacuum chamber. SOLUTION: A hearth 41 comprises a box-shaped base part 41b of container shape in which a refrigerant is circulated, and an upper part 41a to stored columnar pellet-like evaporating material to be fed on a batch basis. Preferably, the wall thickness (t) of at least an upper end portion 41c of the upper part 41a is >=1 mm to <=5 mm, the angle θ1 of an outer wall surface 41e is >=0 deg. to <=20 deg., and the angle θ2 of an inner surface 41d of the upper end portion 41c is >=0 deg. to <=45 deg.. Since most of the upper part 41a is constantly located within the irradiation range of a plasma beam 300, deposits 200' to adversely affect the beam irradiation are re-evaporated and hardly deposited.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a film forming apparatus for depositing a film on an object to be processed by irradiating an evaporation material contained in a hearth in a vacuum chamber with a plasma beam or an electron beam to evaporate the material. About.

[0002]

2. Description of the Related Art An ion plating apparatus, a plasma CVD apparatus and the like are examples of a plasma film forming apparatus which is one of such film forming apparatuses. As an ion plating apparatus, a plasma film forming apparatus using a pressure gradient type plasma source or an HCD plasma source, which is a plasma source utilizing arc discharge, is known.

A plasma film forming apparatus generates a plasma beam between a hearth disposed in a vacuum vessel and electrically serving as an anode, and a plasma source, and heats an evaporating material contained in the hearth by Joule heating. And evaporate. Then, the particles of the evaporated evaporation material are ionized, and the ionized particles adhere to the surface of the object to which the negative voltage is applied, and a film is formed on the surface of the object to be processed. The evaporating material is stored in the hearth in batches, or is continuously supplied and stored in the hearth by a continuous supply mechanism.

Referring to FIG. 3, the conventional plasma film forming apparatus has an airtight vacuum vessel 10. Vacuum container 10
, A plasma source (for example, a pressure gradient plasma gun) 20 is attached via a guide portion 12. A steering coil 31 for guiding the plasma beam 300 is provided outside the guide section 12. In the plasma source 20, first and second intermediate electrodes 27 and 28 for converging the plasma beam 300 are concentrically arranged. The first intermediate electrode 27 has a built-in permanent magnet 27a so that the magnetic pole axis is parallel to the central axis of the plasma generation source 20, and the second intermediate electrode 28 has a built-in coil 28a.

[0005] The plasma source 20 is provided with an insulating tube (for example, a glass tube) 21 connected to a passage defined by the first and second intermediate electrodes 27 and 28. Insulation tube 2
The Mo cylinder 22 is arranged in the inside of the unit 1. A Ta pipe 23 is arranged in the Mo cylinder 22. Space defined by the Mo tube 22 and Ta pipe 23 are separated by an annular plate 24 made of LaB _6. Insulating tube 21, Mo cylinder 22,
The conductor plate 25 is attached to one end of the Ta pipe 23. Carrier gas (inert gas such as Ar) from a carrier gas inlet 26 formed in the conductor plate portion 25
Is introduced, and the carrier gas passes through the Ta pipe 23.

In the vacuum vessel 10, a substrate 100 as an object to be processed is arranged by being supported by a transfer device 61. A DC power supply for negative bias is connected to the substrate 100. A substrate 100 is provided on the bottom surface of the vacuum vessel 10.
A hearth 241 electrically functioning as an anode is arranged so as to oppose to. On the outer periphery of the hearth 241,
An annular auxiliary anode 42 is provided.

[0007] The negative end of the variable power supply 90 is connected to the conductor plate 25. The positive end of the variable power supply 90 is connected to the first and second terminals via resistors R1 and R2, respectively.
Are connected to the intermediate electrodes 27 and. On the other hand, hearth 241 is connected to variable power supply 90 and resistors R1 and R2. A gas inlet 10a for introducing a carrier gas (an inert gas such as Ar or He) and an exhaust port 10b for exhausting the inside of the vacuum vessel 10 are formed on the side wall of the vacuum vessel 10. I have.

In this ion plating apparatus, when a carrier gas is introduced from the carrier gas inlet 26,
Discharge starts between the first intermediate electrode 27 and the Mo cylinder 22. As a result, a plasma beam 300 is generated.
The plasma beam 300 is guided by the magnets of the steering coil 31 and the auxiliary anode 42, and reaches the hearth 241 and the auxiliary anode 42 that electrically function as an anode.

The plasma beam 3 guided to the hearth 241
00 discharges to the hearth 241 and / or the evaporating material. The discharge causes a current to flow through the evaporation material. The evaporation material is ohmic-heated due to its internal resistance. Then, the evaporation material subjected to the ohmic heating evaporates.

[0010]

By the way, Haas:
If the temperature becomes excessively high, the material will not function properly due to melting or the like. Therefore, it is usually made of a material that can withstand the high temperature and is cooled. In a general deposition apparatus having such a hearth, during heating of the evaporation material, the hearth is
The temperature is much lower than the evaporating material. For this reason, the evaporation material evaporated by the irradiation of the beam is re-solidified by contacting the hearth, and adheres to the hearth surface as a deposit. The deposits accumulate over the operating time of the apparatus. The hearth on which the deposits are deposited does not function normally, and as a result, the operation of the film forming apparatus also becomes abnormal.

This phenomenon will be described with reference to FIGS. 4 and 5 showing a hearth of a conventional plasma film forming apparatus.

In FIG. 4, a hearth 241 is a hearth which has a container shape and in which a refrigerant is circulated and cooled therein, and accommodates a cylindrical pellet-shaped evaporation material 200 supplied in batches. Hearth 241 is sufficiently cooled to handle a high current density plasma beam.
Irradiation of the plasma beam 300 causes the evaporation material 200
Evaporates, but a part thereof contacts the hearth 241, is quenched, re-solidifies, and deposits 200 ′ on the surface of the hearth 241.
Adhere as. The deposit 200 ′ has an adverse effect on the evaporating action of the evaporating material 200. Further, since the attached matter 200 ′ is firmly attached on the surface of the hearth 241, a large amount of labor is required for the removing operation.

[0013] With the elapse of the irradiation time of the plasma beam 300 accompanying the operation of the apparatus, the attached matter 200 '
It is deposited as shown in FIG. For this reason, the beam diameter of the plasma beam 300 is originally φa, but the diameter of the plasma beam 300 actually reaching the evaporation material is reduced to φb. That is, the irradiation area on the evaporation material is reduced.

Also, due to its characteristics, the energy density of the beam decreases as the distance from the center of the cross section increases. Therefore, φa
The adhering matter 200 ′ adhering to the vicinity is the plasma beam 3
The irradiation of 00 makes re-evaporation difficult. Therefore, the once adhered matter has to be removed separately with a great deal of labor as described above.

As described above, since the irradiation area of the plasma beam 300 decreases with time, the evaporation material 20
The amount of evaporation of 0 also changed, and it was difficult to control the film formation.

FIG. 6 is a diagram showing another example of a hearth of a conventional plasma film forming apparatus.

In FIG. 6, a hearth 341 is a doughnut-shaped container-shaped hearth in which a refrigerant is circulated and cooled therein. Contains the material 200.
Hearth 341 is sufficiently cooled to handle a high current density plasma beam. Plasma beam 30
The irradiation material 0 evaporates the evaporating material 200, but a part of the evaporating material 200 comes into contact with the hearth 341, is rapidly cooled, solidifies again, and adheres to the surface of the hearth 341 as a deposit 200 ′.

The deposit 200 'has an adverse effect on the evaporating action of the evaporating material 200. In addition, the attachment 200 '
Since it is firmly attached to the surface of the surface 41, the removal operation requires a great deal of labor. Furthermore, the beam irradiation area on the evaporation material 200 decreases with the increase of the deposits 200 ′ deposited with the elapse of the beam irradiation time.
The amount of evaporation of 00 also changed, and it was difficult to control the film formation.

Further, due to a decrease in the beam irradiation area on the evaporating material 200 due to the increase in the attached matter 200 ', the evaporating material 200 evaporates more at the center of the cross section, and less evaporates at the periphery of the cross section. It becomes such a local evaporation state. As shown in the figure, the remaining amount of the center of the cross section of the evaporating material 200 is reduced, so that the deposit 200 ′ is formed on the evaporating material 200 despite the fact that the evaporating material 200 should be moved upward by the evaporating material supply mechanism 70. It cannot be moved because it interferes with the periphery of the cross section. If the evaporating material 200 is forcibly moved without noticing the interference, an excessive load is applied to the evaporating material supply mechanism 70, which may cause a failure.

SUMMARY OF THE INVENTION An object of the present invention is to provide a film forming apparatus capable of preventing the attachment of a deposit to a hearth, in particular, the deposit which adversely affects the beam irradiation and a large amount of deposition.

[0021]

According to the present invention, an evaporation material contained in a hearth is heated and evaporated in a vacuum chamber.
A film forming apparatus for forming a film on the object to be processed by adhering the evaporated substance on the surface of the object to be processed, wherein the hearth is a film forming apparatus to be cooled. The hearth has a base to be cooled, and a cylindrical shape projecting upward from above the base, and having an upper portion for containing the evaporative material, wherein the upper portion has at least a substantially upper end portion. A film forming apparatus characterized by having a small thickness is obtained.

According to the present invention, a film is formed on the object to be processed by heating and evaporating the evaporating material contained in the hearth in the vacuum chamber and attaching the evaporated substance to the surface of the object to be processed. A hearth, in which the hearth is cooled, wherein the hearth has a base to be cooled and a cylindrical shape projecting upward from above the base. And a top for accommodating the evaporation material, wherein the top has an outer surface having a substantially steep angle.

According to the present invention, further, a film is formed on the object to be processed by heating and evaporating the evaporating material contained in the hearth in the vacuum chamber and attaching the evaporated substance to the surface of the object to be processed. A hearth, wherein the hearth is subjected to cooling,
The hearth has a base to be cooled, and has a cylindrical shape protruding upward from above the base, and has an upper portion for containing the evaporative material, and the upper portion has an inner surface substantially at an upper end portion. A film forming apparatus characterized by a steep angle is obtained.

According to the present invention, a film is formed on the object to be processed by heating and evaporating the evaporating material contained in the hearth in the vacuum chamber and attaching the evaporated substance to the surface of the object to be processed. A hearth, in which the hearth is cooled, wherein the hearth has a base to be cooled and a cylindrical shape projecting upward from above the base. And an upper portion for containing the evaporative material, wherein the upper portion has a substantially thin wall thickness at least at an upper end portion, an outer surface having a substantially steep angle, and A film forming apparatus characterized in that the inner surface has a substantially steep angle.

According to the present invention, at least the upper end portion has a thickness of 1 mm or more and 5 mm or less, and the outer surface has an angle of 0 degree or more and 20 degrees or less. The film forming apparatus in which the inner surface has an angle of 0 degree or more and 45 degrees or less is obtained.

According to the present invention, there is also provided the film forming apparatus, wherein the hearth is combined with an evaporation material supply mechanism for continuously supplying pellet-shaped evaporation material into the hearth.

According to the present invention, further, the evaporation material contained in the hearth is heated and evaporated in the vacuum chamber, and the evaporated substance is deposited on the surface of the object to form a film on the object. A hearth, wherein the hearth is subjected to cooling,
The hearth is maintained at a temperature equal to or higher than the evaporation temperature of the evaporation material and lower than the melting point of the hearth during the beam irradiation.

According to the present invention, further, the evaporation material contained in the hearth is heated and evaporated in the vacuum chamber, and the evaporated substance is adhered to the surface of the object to be processed, thereby forming a film on the object to be processed. A film forming apparatus for forming, wherein the hearth is provided with a cooling, wherein the hearth is provided with a base to be cooled and a cylindrical shape protruding upward from above the base. And an upper portion for accommodating the evaporative material, wherein the upper portion is joined to the base with a thermal conductivity of a predetermined value or less.

[0029]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, a film forming apparatus according to an embodiment of the present invention will be described with reference to the drawings.

According to the present invention, there is provided a film forming apparatus for attaching a film to an object to be processed by irradiating a vaporized material contained in a hearth in a vacuum chamber with a beam such as a plasma beam or an electron beam. The hearth can be applied to all film forming apparatuses to which cooling is applied.

This embodiment is an example in which the present invention is applied to a plasma film forming apparatus as the above film forming apparatus. In the present embodiment, since the basic configuration of the plasma film forming apparatus other than the hearth structure is the same as that of the conventional apparatus shown in FIG. 3, only different points will be described below.

[Embodiment 1] Referring to FIG. 1, in a film forming apparatus according to Embodiment 1 of the present invention,
Is a hearth that has a container shape, in which a refrigerant is circulated and cooled inside, and accommodates the cylindrical pellet-shaped evaporation material 200 supplied in batches. The hearth 41 has a box-shaped base 41b to be cooled by circulation of the refrigerant, and a box-shaped base 41.
b. It has a cylindrical shape projecting upward from above, and has an upper portion 41a for accommodating the evaporation material 200.

In the upper portion 41a, at least the upper end portion 41c has a substantially thin thickness t (specifically, preferably 1 mm or more and 5 mm or less), and the outer surface 41e has a substantially steep angle θ ₁ (specifically, Specifically, the angle is preferably 0 to 20 degrees), and the inner surface 41d of the upper end portion 41c is formed at a substantially steep angle θ ₂ (specifically, preferably 0 to 45 degrees). is there.

The box-shaped base portion 41b and the upper portion 41a may be of an integral type as shown in FIG. 1, or may be of a type in which they are combined separately.

Regarding the angles θ ₁ and θ ₂ , the angles of the outer side surface and the inner side surface referred to in the present invention indicate the angles of the maximum gradient portions on those surfaces. In the present invention, each cross-sectional profile of the outer surface and the inner surface is not limited to a straight line, and may be a curve of a quadratic or higher order. In this case, the maximum gradient of the tangent at the inflection point of the curve The angle of the portion is the angle of the outer surface and the inner surface.

The upper portion 41a has at least an upper end portion 41c having a substantially thin wall thickness t, and an outer surface 41e having a substantially steep angle θ _1. Most of this upper part 41a is always located within the plasma beam 30 because it is located within the diameter D).
0, the hearth 41 receives the plasma beam 300
During the irradiation, most of the deposits 200 'are re-evaporated and hardly deposited.

Further, the thermal conductivity between the upper portion 41a and the box-shaped base 41b is less than a predetermined value, and the cooling effect of the upper portion 41a is lower than that of the conventional example shown in FIGS. 41a is maintained at a temperature equal to or higher than the evaporating temperature of the evaporating material 200 and lower than the melting point of the hearth 41 material, and the attached matter 200 'evaporates again.

Further, since the inner surface 41d of the upper end portion 41c has a substantially steep angle θ ₂ ,
Even if the deposit 200 ′ is deposited on d, it is unlikely that the deposit 200 ′ covers the evaporating material 200, so that the irradiation of the evaporating material 200 with the plasma beam 300 is not hindered.

[Second Embodiment] Referring to FIG. 2, in a film forming apparatus according to a second embodiment of the present invention,
1 is different from Embodiment 1 shown in FIG. 1 in that an evaporation material supply mechanism 70 is combined.

The hearth 141 is a hearth which has a container shape, in which a refrigerant is circulated and cooled therein, and accommodates the cylindrical pellet-shaped evaporation material 200 continuously supplied by the evaporation material supply mechanism 70. The hearth 141 has a donut-shaped container base 141b to be cooled by circulation of the refrigerant.
And an upper part 1 for accommodating the evaporation material 200, having a cylindrical shape protruding upward from above the donut-shaped container-shaped base 141b.
41a.

Incidentally, the box-shaped base 141b and the upper part 141a may be of an integral type as shown in FIG. 2, or may be of a type in which they are combined separately.

The upper part 141a has at least an upper end part 141.
c is substantially thin wall thickness t (specifically, 1 mm or more and 5 m
m or less), the outer surface 141e has a substantially steep angle θ ₁ (specifically, preferably 0 ° or more and 20 ° or less), and the inner surface 1 of the upper end portion 141c.
41d is a substantially steep angle θ ₂ (specifically, preferably 0 ° or more and 45 ° or less).

The upper part 141a has at least an upper end part 141.
Since c is a substantially thin wall thickness t and the outer surface 141e has a substantially steep angle θ ₁ , the upper portion 141a is located within the irradiation range (diameter D) of the plasma beam 300. Most of the upper portion 141a is constantly irradiated with the plasma beam 300, and the hearth 141 hardly re-evaporates and deposits most of the deposits 200 'during the irradiation of the plasma beam 300.

The thermal conductivity between the upper portion 141a and the donut-shaped container base 141b is less than a predetermined value, and the cooling effect of the upper portion 141a is lower than that of the conventional example shown in FIG. Is maintained at a temperature equal to or higher than the evaporating temperature of the evaporating material 200 and lower than the melting point of the material of the hearth 141, and the attached matter 200 'evaporates again.

Further, the inner side surface 141 of the upper end portion 141c
Since d is a substantially steep angle θ ₂ , even if the deposit 200 ′ is deposited on the inner side surface 141 d,
It is unlikely that it will cover the evaporating material 200, and therefore, irradiation of the evaporating material 200 with the plasma beam 300 will not be hindered.

Further, the evaporating material 200 does not enter the local evaporating state shown in FIG. 6, and the attached matter 200 'does not interfere with the peripheral portion of the cross section of the evaporating material 200. Therefore, there is no danger that the evaporative material 200 will not be able to move or that the evaporative material supply mechanism 70 will be overloaded with a failure.

[0047]

According to the film forming apparatus of the present invention, the hearth has a base to be cooled, a cylindrical shape projecting upward from above the base, and an upper part for containing the evaporation material. Since at least the upper end portion has a substantially thin wall thickness, it is possible to prevent the attachment of the attachment to the hearth, in particular, the attachment that adversely affects the beam irradiation and a large amount of deposition.

[Brief description of the drawings]

FIG. 1 is a diagram showing a main part of a film forming apparatus according to a first embodiment of the present invention.

FIG. 2 is a diagram showing a main part of a film forming apparatus according to a second embodiment of the present invention.

FIG. 3 is a diagram showing a film forming apparatus according to a conventional example.

FIG. 4 is a diagram showing a main part of a film forming apparatus according to a conventional example.

FIG. 5 is a diagram showing a main part of a film forming apparatus according to a conventional example.

FIG. 6 is a diagram showing a main part of a film forming apparatus according to another conventional example.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 10 Vacuum container 20 Plasma source 41, 141, 241, 341 Hearth 41a, 141a Upper part 41b Box-shaped base 41c, 141c Upper end part 41d, 141d Front inner surface 41e, 141e Outer surface 42 Auxiliary anode 70 Evaporation material supply mechanism 90 Variable power supply 100 Substrate 141b Donut-shaped container base 200 Evaporation material 200 'Attachment 300 Plasma beam

 ────────────────────────────────────────────────── ─── Continued on the front page (72) Inventor Akihiko Yoshii 5-2 Sokai-cho, Niihama-shi, Ehime F-term in the Niihama Works of Sumitomo Heavy Industries, Ltd. (Reference) 4K029 DB08 DB12 DB15 DB21 DB24

Claims (8)

[Claims] 1. A film forming method for forming a film on an object to be processed by heating and evaporating an evaporating material contained in a hearth in a vacuum chamber and attaching the evaporated substance to the surface of the object to be processed. An apparatus, wherein the hearth is a film forming apparatus to be cooled, wherein the hearth has a base to be cooled and a cylindrical shape projecting upward from above the base, and And an upper portion for accommodating the upper portion, wherein at least an upper end portion of the upper portion has a substantially thin wall thickness. 2. A film forming method for forming a film on an object to be processed by heating and evaporating an evaporating material contained in a hearth in a vacuum chamber and attaching the evaporated substance to the surface of the object to be processed. An apparatus, wherein the hearth is a film forming apparatus to be cooled, wherein the hearth has a base to be cooled and a cylindrical shape projecting upward from above the base, and And an upper portion for accommodating the upper surface, wherein an upper surface of the upper portion has a substantially steep angle. 3. A film forming method for forming a film on an object to be processed by heating and evaporating an evaporating material contained in a hearth in a vacuum chamber and attaching the evaporated substance to the surface of the object to be processed. An apparatus, wherein the hearth is a film forming apparatus to be cooled, wherein the hearth has a base to be cooled and a cylindrical shape projecting upward from above the base, and And an upper portion for accommodating the upper portion, wherein the inner surface of the upper end portion has a substantially steep angle. 4. A film forming method for forming a film on an object to be processed by heating and evaporating an evaporating material contained in a hearth in a vacuum chamber and attaching the evaporated substance to the surface of the object to be processed. An apparatus, wherein the hearth is a film forming apparatus to be cooled, wherein the hearth has a base to be cooled and a cylindrical shape projecting upward from above the base, and An upper surface for accommodating at least a substantially thin wall at an upper end portion, a substantially steep angle at an outer surface, and a substantially inner surface at an upper end portion. A film forming apparatus characterized by a steep angle. 5. At least the upper end portion is at least 1 mm
The inner surface of the upper end portion has an angle of 0 degree or more and 45 degrees or less, wherein the outer surface has an angle of 0 degree or more and 20 degrees or less. Film forming equipment. 6. The film forming apparatus according to claim 4, wherein the hearth is combined with an evaporation material supply mechanism for continuously supplying a pellet-shaped evaporation material into the hearth. 7. A film forming method for forming a film on an object to be processed by heating and evaporating an evaporating material contained in a hearth in a vacuum chamber and attaching the evaporated substance to the surface of the object to be processed. An apparatus, wherein the hearth is a film forming apparatus to which cooling is performed, wherein the hearth is maintained at a temperature equal to or higher than the evaporation temperature of the evaporation material and lower than the melting point of the hearth during beam irradiation. Characteristic film forming apparatus. 8. A film for forming a film on an object to be processed by heating and evaporating an evaporating material contained in a hearth in a vacuum chamber, and adhering the evaporated substance on the surface of the object to be processed. An apparatus, wherein the hearth is a film forming apparatus to be cooled, wherein the hearth has a base to be cooled and a cylindrical shape projecting upward from above the base, and And an upper portion for accommodating the substrate, wherein the upper portion is joined to the base at a thermal conductivity of a predetermined value or less.