JP2001001288A - Work holding mechanism - Google Patents

Abstract

PROBLEM TO BE SOLVED: To prevent a work or a surface of a surface plate from being damaged in opening/closing a chuck, and to reduce generation of defective products attributable to generation of damages. SOLUTION: In a work holding mechanism 1 having a chuck 2 which is inserted in a hole 11 in a work 10 to hold the work 10 from the inside diameter side during the holding work, a hole 6 which is larger in diameter than the hole 11 in the work 10 and deep so that the chuck 2 inserted in the hole 11 in the work 10 can be smoothly opened/closed without being brought into contact with other portions of a lower surface plate 5, is provided in a part corresponding to the hole 11 in the work 10 on the lower surface plate 5 on which the work 10 is placed. When the work 10 is carried to a specified position on the lower surface plate 5, or carried out from a specified position on the lower surface plate 5, a tip part of the chuck 2 inserted in the hole 11 in the work 10 is located in the hole 6 of the lower surface plate 5, the chuck 2 is opened in this condition, and a back side of the chuck 2 is abutted on an inner circumferential surface of the hole 11 in the work 10 to hold the work 10.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a work holding mechanism, and more particularly to a work holding mechanism used in a work transfer device such as a grinder for grinding an aluminum substrate for a magnetic disk or the like.

[0002]

2. Description of the Related Art There are various types of grinders for polishing the surface of a work such as an aluminum substrate for a magnetic disk, for example, a lower platen 2 rotatably provided.
5, an upper stool (not shown) rotatably provided above the lower stool 25 and movable vertically, and a driver (not shown) rotatably provided at the center of the lower stool 25
A sun gear (not shown) rotatably provided on the outer peripheral side of the driver, an internal gear (not shown) rotatably provided on the outer peripheral side of the lower stool 25, and mesh with the sun gear and the internal gear. A grinder equipped with a carrier (not shown) that rotates and revolves on the lower platen 25 and has holes for holding the workpiece 10 at a plurality of locations is provided on the market (see FIGS. 3 and 4). .

A work transfer device (not shown) is connected to such a grinding machine. The work transfer device is provided between the transfer station and the grinding machine and between the unloading station and the grinder, and includes a horizontal movement mechanism (not shown) for moving and positioning the work 10 in the horizontal direction. , A vertical moving mechanism (not shown) for moving and positioning in the vertical direction, and a work gripping mechanism 21 as shown in FIGS. 3 and 4 is attached to each work transfer device. I have.

The work gripping mechanism 21 includes a pair of bar-shaped chucks 22, 22 provided to be freely openable and closable in a horizontal direction, and an opening and closing member 2 such as a cylinder for opening and closing the chucks 22, 22.
The work 10 can be gripped or not gripped by operating the opening / closing member 24 to open and close the chucks 22 and 22.

In order to transfer the work 10 to a predetermined position (in the hole of the carrier) on the lower platen 25 by the work transfer device provided with the work holding mechanism 21 having the above-described structure, a horizontal moving mechanism is used. The work gripping mechanism 21 is moved in the horizontal direction to be positioned above the base of the loading station, and the work gripping mechanism 21 is lowered by the up-and-down movement mechanism, so that the unprocessed work 10 positioned on the base is moved. The chucks 22 and 22 are inserted into the hole 11 at the center of the work, and in this state, the opening and closing member 24 is operated to open the chucks 22 and 22 so that the back side of the chucks 22 and 22
And grip the work 10.

Then, the work gripping mechanism 21 is raised by the vertical movement mechanism, and the work gripping mechanism 21 is horizontally moved by the horizontal movement mechanism to be positioned at a predetermined position above the lower platen 25 of the grinding machine. The workpiece 10 is supplied to a predetermined position (in the hole of the carrier) on the lower stool 25 by operating the opening / closing member 24 to close the chucks 22 and 22 to lower the chucks 22. , 22 are separated from the inner peripheral surface of the hole 11 of the work 10 to separate the work 10, and the work gripping mechanism 21 is raised by the up-down movement mechanism, and the chucks 22, 2 are moved.
2 is pulled out of the hole 11 of the work 10, the work gripping mechanism 21 is moved in the horizontal direction by the horizontal movement mechanism and is positioned at the loading station, and stands by at that position in order to grip the work 10 before the next processing. Let it.

Then, the grinding machine is operated to rotate and revolve the carrier between the lower platen 25 and the upper platen to grind the surface of the work 10 held on the carrier. Is moved in the horizontal direction by the horizontal moving mechanism to be positioned at a predetermined position above the lower platen 25 of the grinding machine, and the work gripping mechanism 21 is lowered by the vertical moving mechanism. The chucks 22, 22 are inserted into the holes 11 of the work 10 located in the holes of the carrier, and the opening and closing members 24 are operated to open the chucks 22, 22 so that the back sides of the chucks 22, 22 are placed in the holes of the work 10. 11 is brought into contact with the inner peripheral surface of
Grab it.

The work gripping mechanism 21 is raised by the vertical movement mechanism, and the work gripping mechanism 21 is moved horizontally by the horizontal movement mechanism to be positioned above the base of the unloading station. The work gripping mechanism 21 is lowered to place the work 10 on the base, and the opening / closing member 24 is operated to operate the chucks 22, 22.
Is closed, the back side of the chucks 22, 22 is separated from the inner peripheral surface of the hole 11 of the work 10, the work 10 is separated, and the work gripping mechanism 21 is raised by the up-down movement mechanism to move the chucks 22, 22 to the work 10. It is pulled out from the hole 11 and is held at that position to grasp the next processed work 10.

In this manner, the workpiece 10 before processing can be continuously supplied to a predetermined position (in the hole of the carrier) on the lower platen 25, and the processed workpiece 10
Can be continuously taken out from a predetermined position on the lower platen 25 (in the hole of the carrier).

However, in the conventional work gripping mechanism 21 having the above structure, the chucks 22, 22 are inserted into the holes 11 of the work 10, and the opening / closing member 24 is operated to move the chucks 22, 22. When opening, the chuck 22,
Since the lower end on the rear side of the base 22 is formed at an acute angle, the inner peripheral surface of the hole 11 of the work 10 may be damaged at that part, or the surface of the lower platen 25 may be damaged. Defective products may be generated due to the scratches.

The chuck 2 of the workpiece gripping mechanism 21 is located at the position of the hole of the carrier at the start of the processing of the work 10 or at the position of the hole of the carrier at the end of the processing of the work.
Settings to match 2, 22 (chuck 22, 2,
2, centering of the chucks 22, adjustment of the inclination of the chucks 22, 22, adjustment of the distance between the chucks 22, 22 and the lower platen 25, etc.), the operation of opening and closing the chucks 22, 22 on the surface of the lower platen 25. During the opening / closing operation, the lower platen 25 is sharpened by the sharp portions of the chucks 22, 22.
May be scratched on the surface, and defective products may be generated due to the scratches.

The present invention solves the above-mentioned problems of the prior art, and there is no fear that the surface of the surface plate will be damaged even if the chuck is opened and closed on the surface plate at the time of setting the chuck. In addition, when the work is supplied into the hole of the carrier on the surface plate or taken out from the hole of the carrier on the surface plate, the inner peripheral surface of the work and the surface of the surface plate can be opened and closed by opening and closing the chuck on the surface plate. It is an object of the present invention to provide a workpiece gripping mechanism that can improve the yield without causing any fear of scratching the surface and without causing defective products due to the occurrence of scratches.

[0013]

SUMMARY OF THE INVENTION In order to solve the above-mentioned problems, the present invention provides a method for transferring a work having a hole in the center to a predetermined position on a surface plate, This is a workpiece gripping mechanism that grips when unloading from a position, and is inserted into the hole of the workpiece at the time of gripping, and the tip protrudes from the lower surface of the workpiece. The chuck has a chuck in contact with the inner peripheral surface of the work, and a hole having a larger diameter than the work hole is provided in a portion corresponding to the work hole on the work surface on which the work is mounted. When transporting to the position, or when unloading from a predetermined position on the surface plate, the tip of the chuck inserted into the hole of the work is located in the hole of the surface plate, and by opening the chuck in this state A hand configured so that the back side of the chuck is in contact with the inner peripheral surface of the hole in the work. One in which was adopted. Further, a means is provided in which a step portion which is one step lower than other portions is provided in a portion which is in contact with the inner peripheral surface of the hole of the work on the back side of the chuck.

[0014]

According to the present invention, when the chuck is inserted into the hole of the work and the chuck is opened, the back side of the chuck contacts the inner peripheral surface of the hole of the work and the work is grasped. Be held. Then, in this state, the work is moved to a predetermined position on the surface plate integrally with the chuck, and the work is lowered integrally with the chuck to place the work on the surface plate. Is inserted into the hole. Then, by closing the chuck in this state, the back side of the chuck is separated from the inner peripheral surface of the hole of the work, and the gripping state of the work is released. Then, remove the chuck from the hole in the work, process the work on the surface plate, and after finishing the work, insert the chuck again into the hole in the work and insert the tip into the hole in the surface plate. When the chuck is inserted and the chuck is opened in this state, the back side of the chuck contacts the inner peripheral surface of the hole of the work, and the work is gripped. Then, by moving the work from the surface plate integrally with the chuck, the processed work is carried out from the surface plate.

[0015]

Embodiments of the present invention shown in the drawings will be described below. 1 and 2 show an embodiment of a work gripping mechanism according to the present invention.
The work holding mechanism 1 shown in this embodiment is attached to a work transfer device connected to a grinding machine for polishing the surface of a disk-shaped work such as an aluminum substrate for a magnetic disk, and is mounted in a horizontal direction. And a pair of bar-shaped chucks 2 and 2 provided to be freely openable and closable, and an opening and closing member 4 such as a cylinder for opening and closing the chucks 2 and 2.

There are various types of grinding machines. In this embodiment, a lower platen 5 is provided rotatably, and a lower platen 5 is provided above the lower platen 5 so as to be rotatable and vertically movable. A surface plate (not shown), a driver (not shown) rotatably provided at the center of the lower surface plate 5, a sun gear (not shown) rotatably provided on the outer peripheral side of the driver, and a lower surface plate An internal gear (not shown) rotatably provided on the outer peripheral side of 5, and meshes with a sun gear and an internal gear to rotate and revolve on a lower platen,
A grinder equipped with a carrier (not shown) having holes for holding a work at a plurality of locations is used.

The work transfer device (not shown) is provided between the transfer station and the grinding machine and between the unloading station and the grinder.
A horizontal moving mechanism (not shown) for moving and positioning the object in the horizontal direction, and a vertical moving mechanism (not shown) for moving and positioning the object in the vertical direction. The work gripping mechanism 1 is attached.

On the back side of the chuck 2 of the work gripping mechanism 1, there is provided a stepped portion 3 which is one step lower than other portions. When the chuck 2 is opened, the bottom surface of the stepped portion 3 is located at the center of the work 10. By contacting the inner peripheral surface of the hole 11 provided, the work 10
Is to be grasped.

The portion corresponding to the hole 11 of the work 10 on the lower stool 5 on which the work 10 is placed, that is, the hole of the carrier at the start of processing (or the hole of the carrier at the end of processing).
In the portion corresponding to the hole 11 of the work 10 on the lower surface plate 5 corresponding to the above, the chucks 2 and 2 having a larger diameter than the hole 11 of the work 10 and inserted into the hole 11 of the work 10 have lower ends. Holes 6 are provided with a depth such that they can be smoothly opened and closed without touching other parts of the lower platen in a state where they protrude from the lower surface of the work 10.

Then, the workpiece 10 before processing is transported to a predetermined position on the lower platen 5 (transported into the hole of the carrier) by the workpiece transporting device equipped with the workpiece gripping mechanism 1 configured as described above. The work transfer device is located above the base of the loading station, the work holding mechanism 1 is lowered by the vertical movement mechanism, the chucks 2 and 2 are inserted into the holes 11 of the work 10 on the base, and opened and closed. The member 4 is operated to open the chucks 2, 2, and the bottom surfaces of the steps 3, 3 on the back side of the chucks 2, 2 are brought into contact with the inner peripheral surface of the hole 11 of the work 10, thereby gripping the work 10.

Then, the work gripping mechanism 1 is raised by the vertical movement mechanism, and the work gripping mechanism 1 is moved in the horizontal direction by the horizontal movement mechanism to be positioned at a predetermined position above the lower platen 5 of the grinding machine. Then, the work gripping mechanism 1 is lowered by the vertical moving mechanism to supply the work 10 to a predetermined position (in the hole of the carrier) on the lower platen 5, and the opening / closing member 4 is operated to close the chucks 2 and 2 so that the chucks are closed. Two, two
The work 10 is separated by moving the back side of the work 10 away from the inner peripheral surface of the hole 11 of the work 10, the work gripping mechanism 1 is raised by a vertical movement mechanism, and the chucks 2, 2 are moved to the holes 11 of the work 10.
The workpiece is taken out from the inside, and the workpiece holding mechanism 1 is returned to the loading station by the horizontal movement mechanism, and is held at that position to hold the workpiece 10 before the next processing.

Then, the grinding machine is operated to rotate and revolve the carrier between the lower surface plate 5 and the upper surface plate to grind the surface of the work 10 held in the hole of the carrier. Then, the workpiece gripping mechanism 1 located at the unloading station is moved in the horizontal direction by the horizontal moving mechanism to be positioned at a predetermined position above the lower platen 5 of the grinding machine, and the workpiece gripping mechanism 1 is moved by the vertical moving mechanism. The chucks 2 and 2 are inserted into the holes 11 of the work 10 located in the holes of the carrier by lowering them, and the lower ends thereof are positioned in the holes 6 on the lower platen 5. When the chucks 2 and 2 are opened, the bottom surfaces of the steps 3 and 3 on the back side of the chucks 2 and 2 are brought into contact with the inner peripheral surface of the hole 11 of the work 10 to grip the work 10.

Then, the work gripping mechanism 1 is raised by the vertical movement mechanism, and the work gripping mechanism 1 is moved horizontally by the horizontal movement mechanism to be positioned at a predetermined position above the base of the unloading station. The work gripping mechanism 1 is lowered by the up-down movement mechanism, the work 10 is placed on the base, and the opening / closing member 4 is operated to operate the chucks 2, 2.
Is closed, and the back side of the chucks 2 and 2 is
The workpiece 10 is separated from the inner peripheral surface of the chuck, and the workpiece gripping mechanism 1 is raised by the up-down moving mechanism, so that the chuck 2,
2 is pulled out from the hole 11 of the work 10 and is held at that position to hold the next processed work 10.

In this manner, the work 10 before processing can be continuously supplied to a predetermined position (in the hole of the carrier) on the lower surface plate 5, and the processed work 10 can be supplied on the lower surface plate 5. It can be taken out continuously from a predetermined position (in the hole of the carrier).

In the work gripping mechanism 1 according to this embodiment configured as described above, a portion corresponding to the hole 11 of the work 10 on the lower platen 5 on which the work 10 is placed is provided.
That is, a portion of the lower platen 5 corresponding to the hole 11 of the work 10 corresponding to the hole of the carrier at the start of processing (or the hole of the carrier at the end of processing) has a larger diameter than the hole 11 of the work 10, and The chucks 2, 2 inserted into the holes 11 of the work 10 have such a depth that the lower ends thereof protrude from the lower surface of the work 10, and can be smoothly opened and closed without contacting other parts of the lower platen 5. Is provided, the workpiece 10 is conveyed to a predetermined position on the lower surface plate 5 (in the hole of the carrier), or the work 10 is unloaded from a predetermined position on the lower surface plate 5 (in the hole of the carrier). When doing, chuck 2,
Even if the chuck 2 is opened and closed, the chucks 2 and 2 do not damage the inner peripheral surface of the work 10 or damage the surface of the lower platen 5.

A predetermined position on the lower surface plate 5 (the position of the hole of the carrier) at the start of the processing of the work 10 or a predetermined position on the lower surface plate 5 at the end of the processing of the work 10 (the position of the hole of the carrier). ) To set the chucks 2 and 2 of the work holding mechanism 1 to coincide with each other (centering of the chucks 2 and 2, adjustment of the inclination of the chucks 2 and 2, adjustment of the distance between the chucks 2 and 2 and the lower platen 5, etc.) When performing the operation of opening and closing the chucks 2 and 2 on the surface of the lower surface plate 5 several times, the surface of the lower surface plate 5 may be damaged by the chucks 2 and 2 during the opening and closing operation. Disappears.

In the above description, the work gripping mechanism 1 according to this embodiment is used for a work transfer device of a grinding machine, but it is needless to say that the work holding mechanism 1 may be used for other machines (such as a polishing machine). That is.

[0028]

According to the present invention, a hole having a diameter larger than that of the work is provided in a portion corresponding to the hole of the work on the surface plate on which the work is placed. When transporting a work to a predetermined position on the surface plate or unloading the work from a predetermined position on the surface plate, the tip of the chuck inserted into the hole of the work In this state, the chuck can be opened and closed. Therefore, when the chuck is opened and closed, the work is not damaged, and the surface of the surface plate is not damaged, so that defective products due to the generation of the damage can be eliminated and the yield can be improved. You can do it. In addition, a step that is one step lower than the other parts is provided on the back side of the chuck, and the bottom surface of the step is brought into contact with the inner peripheral surface of the hole of the work. When transporting or unloading the work from the surface plate, the work can be reliably grasped, and an accident such as dropping of the work during the transfer or unloading can be prevented.

[Brief description of the drawings]

FIG. 1 is a schematic view showing an embodiment of a work gripping mechanism according to the present invention, and is an explanatory view showing a state of gripping a work.

FIG. 2 is an explanatory view showing a non-grasping state of a work shown in FIG.

FIG. 3 is a schematic diagram illustrating an example of a conventional work gripping mechanism, and is an explanatory diagram illustrating a gripping state of a work.

FIG. 4 is an explanatory view showing a non-grasping state of the work shown in FIG. 3;

[Explanation of symbols]

 1, 21 Work gripping mechanism 2, 22 Chuck 3, Step 4, 24 Opening / closing member 5, 25 Lower platen 6, 11, Hole 10 Work

Claims (2)

[Claims] 1. A workpiece gripping mechanism for gripping a workpiece having a hole in the center thereof when transporting the workpiece to a predetermined position on a surface plate or unloading the workpiece from a predetermined position on the surface plate. At the time of holding, the tip is protruded from the lower surface of the work by being inserted into the hole of the work, and by opening in this state, the back side has a chuck abutting on the inner peripheral surface of the hole of the work, and the work is placed thereon A hole with a larger diameter than the hole of the work is provided in the part corresponding to the hole of the work on the surface plate, and when transferring the work to the predetermined position on the surface plate, or when unloading from the predetermined position on the surface plate Then, the tip of the chuck to be inserted into the hole of the work is positioned in the hole of the platen, and the chuck is opened in this state so that the back side of the chuck is brought into contact with the inner peripheral surface of the hole of the work. A workpiece gripping mechanism characterized by comprising. 2. The work gripping mechanism according to claim 1, wherein a step which is lower by one step than other parts is provided at a portion of the back side of the chuck which comes into contact with an inner peripheral surface of the hole of the work.