JP2000504154A - 複数の電子モジュールを噴霧冷却するための装置 - Google Patents

複数の電子モジュールを噴霧冷却するための装置

Info

Publication number
JP2000504154A
JP2000504154A JP9527612A JP52761297A JP2000504154A JP 2000504154 A JP2000504154 A JP 2000504154A JP 9527612 A JP9527612 A JP 9527612A JP 52761297 A JP52761297 A JP 52761297A JP 2000504154 A JP2000504154 A JP 2000504154A
Authority
JP
Japan
Prior art keywords
plate
fluid
fluid distribution
nozzle
manifold
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
JP9527612A
Other languages
English (en)
Japanese (ja)
Inventor
マクダン、ケビン・ジェイ
リンパー−ブレナー、リンダ
プレス、ミノー・ディー
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Motorola Solutions Inc
Original Assignee
Motorola Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Motorola Inc filed Critical Motorola Inc
Publication of JP2000504154A publication Critical patent/JP2000504154A/ja
Ceased legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
    • H05K7/20345—Sprayers; Atomizers

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
JP9527612A 1996-01-31 1996-11-26 複数の電子モジュールを噴霧冷却するための装置 Ceased JP2000504154A (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US08/594,212 1996-01-31
US08/594,212 US5831824A (en) 1996-01-31 1996-01-31 Apparatus for spray-cooling multiple electronic modules
PCT/US1996/019017 WO1997028674A1 (en) 1996-01-31 1996-11-26 Apparatus for spray-cooling multiple electronic modules

Publications (1)

Publication Number Publication Date
JP2000504154A true JP2000504154A (ja) 2000-04-04

Family

ID=24377988

Family Applications (1)

Application Number Title Priority Date Filing Date
JP9527612A Ceased JP2000504154A (ja) 1996-01-31 1996-11-26 複数の電子モジュールを噴霧冷却するための装置

Country Status (11)

Country Link
US (1) US5831824A (US07943777-20110517-C00090.png)
EP (1) EP0916240B1 (US07943777-20110517-C00090.png)
JP (1) JP2000504154A (US07943777-20110517-C00090.png)
KR (1) KR19980703417A (US07943777-20110517-C00090.png)
CN (1) CN1100477C (US07943777-20110517-C00090.png)
AU (1) AU1062497A (US07943777-20110517-C00090.png)
BR (1) BR9607802A (US07943777-20110517-C00090.png)
DE (1) DE69624596T2 (US07943777-20110517-C00090.png)
IL (1) IL121409A0 (US07943777-20110517-C00090.png)
MX (1) MX9707417A (US07943777-20110517-C00090.png)
WO (1) WO1997028674A1 (US07943777-20110517-C00090.png)

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US10765785B2 (en) 2004-07-19 2020-09-08 Thermotek, Inc. Wound care and infusion method and system utilizing a therapeutic agent
US10016583B2 (en) 2013-03-11 2018-07-10 Thermotek, Inc. Wound care and infusion method and system utilizing a thermally-treated therapeutic agent
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US20060034053A1 (en) 2004-08-12 2006-02-16 Thermotek, Inc. Thermal control system for rack mounting
US7283365B2 (en) * 2005-01-18 2007-10-16 Lucent Technologies Inc. Jet impingement cooling apparatus and method
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US7578337B2 (en) * 2005-04-14 2009-08-25 United States Thermoelectric Consortium Heat dissipating device
US7909861B2 (en) 2005-10-14 2011-03-22 Thermotek, Inc. Critical care thermal therapy method and system
US7992625B1 (en) 2006-08-18 2011-08-09 United States Thermoelectric Consortium Fluid-operated heat transfer device
US7814965B1 (en) 2005-10-27 2010-10-19 United States Thermoelectric Consortium Airflow heat dissipation device
US20080123297A1 (en) * 2006-05-15 2008-05-29 Isothermal Systems Research, Inc. Hybrid clamshell blade system
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US7477513B1 (en) * 2006-12-29 2009-01-13 Isothermal Systems Research, Inc. Dual sided board thermal management system
US8141620B1 (en) 2007-02-26 2012-03-27 United States Thermoelectric Consortium (USTC) Method for conditioning a cooling loop of a heat exchange system
USD662212S1 (en) 2007-04-10 2012-06-19 Thermotek, Inc. Butterfly wrap
US8758419B1 (en) 2008-01-31 2014-06-24 Thermotek, Inc. Contact cooler for skin cooling applications
US7796384B2 (en) * 2008-08-27 2010-09-14 Honeywell International Inc. Hybrid chassis cooling system
US8081478B1 (en) * 2008-12-09 2011-12-20 Lockheed Martin Corporation Fluid cooled electronics module cover
US8490419B2 (en) * 2009-08-20 2013-07-23 United States Thermoelectric Consortium Interlocked jets cooling method and apparatus
US10512587B2 (en) 2011-07-27 2019-12-24 Thermotek, Inc. Method and apparatus for scalp thermal treatment
EP2841121B1 (en) 2012-04-24 2020-12-02 Thermotek, Inc. System for therapeutic use of ultra-violet light
US8873238B2 (en) * 2012-06-11 2014-10-28 The Boeing Company Chassis system and method for holding and protecting electronic modules
US10300180B1 (en) 2013-03-11 2019-05-28 Thermotek, Inc. Wound care and infusion method and system utilizing a therapeutic agent
WO2015070144A1 (en) 2013-11-11 2015-05-14 Thermotek, Inc. Method and system for wound care
US9445531B1 (en) * 2015-05-01 2016-09-13 Baidu Usa Llc Air washing for open air cooling of data centers
CN106332531B (zh) * 2016-10-31 2018-08-31 广东合一新材料研究院有限公司 一种服务器的工质接触式冷却系统
SG10201809662QA (en) * 2018-10-31 2020-05-28 Kong Chye Gregory Ong Enclosure for providing liquid film cooling
US10746084B2 (en) * 2018-12-13 2020-08-18 General Electric Company Liquid driven thermal module and thermal management system
US11950394B2 (en) 2021-10-12 2024-04-02 Ge Aviation Systems Llc Liquid-cooled assembly and method

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Also Published As

Publication number Publication date
DE69624596T2 (de) 2003-03-20
EP0916240A4 (US07943777-20110517-C00090.png) 1999-05-19
CN1179876A (zh) 1998-04-22
BR9607802A (pt) 1998-11-17
KR19980703417A (ko) 1998-11-05
CN1100477C (zh) 2003-01-29
WO1997028674A1 (en) 1997-08-07
EP0916240B1 (en) 2002-10-30
AU1062497A (en) 1997-08-22
EP0916240A1 (en) 1999-05-19
US5831824A (en) 1998-11-03
DE69624596D1 (de) 2002-12-05
IL121409A0 (en) 1998-02-08
MX9707417A (es) 1998-02-28

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A313 Final decision of rejection without a dissenting response from the applicant

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