JP2000503756A - 2-axis navigation grade micro-machined rotation sensor system - Google Patents

Abstract

(57) [Summary] A two-axis closed loop angular velocity sensor that provides a digital delta theta output signal. The drive member is formed from a single silicon wafer with a pair of opposing flat surfaces. The drive member includes a frame and a drive member center portion connected to the frame such that the drive member center portion provides rotational compliance between the frame and the center portion with respect to an axis perpendicular to the flat surface of the silicon wafer. Be placed. A drive signal is applied to the plurality of electrodes in the central portion, causing rotational vibration of the central portion of the drive member with respect to a drive axis perpendicular to the flat surface of the silicon wafer. A silicon detection member is connected to the drive member. The detection member includes a central support member connected to the drive member central portion, and rotational vibration of the drive member central portion is transmitted to the detection member central portion. The sensing portion is connected to the sensing member central support member and oscillates about the drive shaft, and the input rotational speed about an axis perpendicular to the drive shaft causes out-of-plane oscillation of the sensing portion. A signal processor is connected to the sensing portion for generating a signal indicative of the input rotational speed as a function of the amplitude of the out-of-plane vibration of the sensing portion.

Description

DETAILED DESCRIPTION OF THE INVENTION Two-Axis Navigation Grade Micro-Machined Rotation Sensor System BACKGROUND OF THE INVENTION The present invention relates generally to rotation sensors for use in applications such as navigation. More specifically, the present invention relates to a highly accurate rotation sensor system even when operating in an environment where acceleration and vibration are large, such as a re-entry flying object. The invention more particularly relates to a silicon chip based rotation sensor system including a Coriolis acceleration sensor for measuring the rotation speed about two orthogonal detection axes. Bias repeatability of known micromachined Coriolis rotation sensor systems ranges from 10 ° to 1000 ° / hour. Analysis of this concept has shown that the performance of this system can be improved by three to five orders of magnitude and produce a very accurate navigation grade device, while the low cost and reliability set for the rotation sensor system of the present invention. There seems to be no certainty that achieving the goal of high SUMMARY OF THE INVENTION The design of a rotation sensor according to the present invention incorporates many of the performance advantages of a resonant rotor gyro, while taking advantage of the low cost and reliability advantages of micromachining. In fact, a rotation sensor can be viewed as a two-axis tuned rotor gyroscope, except that the "rotor" does not rotate constantly about the "spin axis" but oscillates angularly about the spin axis. The angular momentum vector does not remain constant but oscillates sinusoidally. The rotor is an inertial tuning sensing element that is tuned to resonate about its output shaft at an oscillating frequency rather than a spin rate. The rotation sensor is a two-axis closed loop angular velocity sensor that provides a digital delta theta output signal. A micro inertial rotation sensor in accordance with the present invention supports a 1 nm / hour navigation system while operating in high acceleration and vibration environments associated with high reentry vehicles and supersonic auxiliary munitions. It is designed to be. The rotation sensor according to the invention comprises at least one solid, micro-machined sensing element. The present invention is also small, lightweight, low cost, low power, reliable, and designed for use in both commercial and military applications. A rotation sensor according to the present invention includes a base and a driving member mounted on the base and formed of a single silicon wafer having a pair of opposed flat surfaces. The drive member includes a frame and a drive member center portion connected to the frame, wherein the drive member center portion is arranged to have rotational compliance between the frame and the center portion with respect to an axis perpendicular to the flat surface of the silicon wafer. Is done. The driving member further includes a plurality of electrodes formed on at least one side of the central portion, and a driving device for applying a driving signal to the plurality of electrodes. The electrodes are arranged such that the drive signal causes rotational vibration of the central portion of the drive member with respect to the drive axis perpendicular to the flat surface of the silicon wafer. The rotation sensor according to the present invention further includes a silicon detection member, the silicon detection member includes a detection member central support member, and the detection member central support member is driven such that rotational vibration of the drive member central portion is transmitted to the detection member central portion. It is connected to the central part of the member. The sensing portion is connected to the sensing member central support member such that the sensing portion oscillates about the drive shaft and the input rotational speed about an axis perpendicular to the drive shaft allows out-of-plane vibration of the sensing portion to occur. A signal processor is connected to the detection portion for generating a signal indicative of the input rotational speed as a function of the frequency of the out-of-plane vibration of the detection portion. Preferably, the rotation sensor according to the invention further comprises a plurality of flexure beams connected between the frame and the drive member central part. Preferably, the rotation sensor according to the invention further comprises a plurality of generally flat leaf springs, the leaf springs detecting with the detection member central support member such that out-of-plane vibrations in the detection portion are perpendicular to the plane of the leaf spring member. Connected between the parts. Preferably, a capacitive pickoff is formed in the sensing portion such that out-of-plane vibration of the sensing portion results in a change in capacitance at the capacitive pickoff. Preferably, the rotation sensor according to the invention further comprises a plurality of base mounts connected between the base and the frame of the drive member. Each base mount is preferably formed to include a single mechanical resonance frequency generation in the rotation sensor and an attenuation compliant element for external vibration input attenuation. The signal processing device may include a first summing circuit connected to the capacitive pickoff and arranged to receive a signal indicative of the input rotational speed. A first modulation circuit may be connected to the first adder and arranged to modulate the input rotational speed signal with a signal indicative of a cosine of the drive signal frequency. A second modulation circuit may be arranged to modulate the quadrant dynamic error with a signal indicating the sine of the drive signal frequency. A second addition circuit may be connected to add the signal outputs from the first and second modulation circuits and provide a feedback signal to the driving member. A first demodulator circuit may be connected to the capacitive pickoff to demodulate the sensor element response signal at the cosine of the drive frequency. A first compensation circuit is connected to receive the signal output from the first demodulator circuit, and a second demodulator circuit is connected to the capacitive pickoff to demodulate the sensor element response signal at the sine of the drive frequency. You may. A second compensation circuit may be connected to receive a signal output from the second demodulator circuit. The first torquer modulator circuit may be connected to the first compensation circuit, and the second torquer modulator circuit may be connected to the second compensation circuit. The signal processing device may further include a third summing circuit for summing the signals output from the first and second torquer modulator circuits, wherein the third summing circuit inputs the plurality of electrodes of the driving member. Generate a feedback signal. A two-axis rotation sensor according to the present invention may also include a pair of identical drive member / detection portion combinations mounted together in a facing relationship. Each drive member and detection portion is formed in the manner described above. The detection portion vibrates in the opposite direction due to the drive signal. Preferably, the signal processing device includes a first capacitive pick-off, wherein the first capacitive pick-off is such that out-of-plane vibration of the first sensing portion causes a change in capacitance at the first capacitive pick-off. And the signal processing device further includes a second capacitive pick-off, wherein the second capacitive pick-off is such that out-of-plane vibration of the second sensing portion causes a change in capacitance at the second capacitive pick-off. Formed on the detection part. The signal processing device is further connected to the first detection portion and amplifies the rotation response signal output therefrom, and amplifies the rotation response signal connected to the second detection portion and output therefrom. A second amplifier. A first summing circuit is connected to the first and second amplifiers and is arranged to generate a sum signal indicating a sum of the amplified rotation signals. A second summing circuit is connected to the first and second amplifiers and is arranged to generate a difference signal indicative of a difference between the amplified rotation signals. A modulation circuit is connected to the first and second summing circuits for in-phase and quadrature modulation of the sum and difference signals. A servo compensation circuit is connected to the modulation circuit and receives therefrom the in-phase and quadrature-modulated sum and difference signals and generates a measured speed signal for the input rotation about the first axis. In-phase and quadrature torque modulation and summing circuits are connected to and receive signals from the servo compensation circuit. An oscillator servo is connected to the in-phase and quadrature torque modulation and summing circuits and the in-phase and quadrature demodulation circuits to provide automatic gain control. A third summing circuit is connected to the in-phase and quadrature torque modulation and summing circuits for receiving the modulated signal therefrom. A more complete understanding of the objects of the present invention, as well as a more complete understanding of its structure and method of operation, will be had by studying the following description of a preferred embodiment and by referring to the accompanying drawings. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1A is an exploded perspective view of a solid-state two-axis rotation sensor according to the present invention. FIG. 1B is a perspective view of a speed detecting element that can be included in the rotation sensor of FIG. 1A. FIG. 2 is a perspective view of a portion of a drive member that may be included in the device of FIG. FIG. 3 is a cross-sectional view of a flexure beam that can be included in the apparatus of FIG. FIG. 4 is a bottom plan view of a drive member, sensor pickoff, and torque electrode that may be included in the apparatus of FIG. FIG. 5 is a top plan view of the drive member of FIGS. FIG. 6 is a cross-sectional view of the rotation sensor assembly including a capacitive signal pickoff that may be included in the apparatus of FIG. 1, taken along line 6-6 of FIG. FIG. 7 schematically illustrates the bias and electrical signal pickoff for the device of FIG. FIG. 8 shows a circuit for processing a signal output from a Coriolis rotation sensor having each detection element captured independently for each axis. FIG. 9 is a block diagram illustrating further features of the circuit of FIG. FIG. 10 is a generalized block diagram of a circuit for processing signals output from a Coriolis rotation sensor, where both sensing elements are combined in one capture loop for each axis. DESCRIPTION OF THE PREFERRED EMBODIMENTS Referring to FIG. 1A, a rotation sensor 20 according to the present invention includes a base 22 having a lower cover 23 and an upper cover (not shown) that is preferably substantially identical to the lower cover 23. . The cross section of the base 22 is generally rectangular. The base 22 includes base mounts 24-27 mounted inside the base 22 at corners 28-31, respectively. The rotation sensor 20 includes a pair of speed sensing members 34 and 36 that are preferably identical. Each of the speed sensing members 34 and 36 is preferably formed from a single silicon crystal by a micromachining process. Rotation sensor 20 further includes a pair of drive members 38 and 40 that are identical and each are formed from a single silicon crystal. FIG. 1A shows opposing surfaces 42 and 44 of the speed detecting members 34 and 36, respectively. As shown in FIG. 1, when assembling the rotation sensor 20, the surface 42 of the speed detecting member 34 is coupled to the lower surface of the driving member 38. Similarly, the lower surface of the speed detecting member 36 is connected to the driving member 40. The drive member 38 includes a peripheral frame 50, which is generally shown as a rectangle for convenience of illustration. Frame 50 may have other shapes. Referring to FIG. 2, central portion 52 of upper surface 54 of drive member 38 is thinner than frame 50. Referring to FIGS. 1 and 2, central portion 52 has side edges 55-58 connected to frame 50 by flexure beams 60-63. Flexure beams 60-63 preferably extend from the center of side edges 55-58 to frame 50. 2, a portion of the drive member 38 has been omitted, and the central portion 52 and flexure beams 60-63 are more clearly shown. FIG. 3 shows a cross section of a flexure beam 60 formed by etching a silicon crystal. Preferably, the flexure beams 60-63 are identical and have greater resistance to bending in vertical planes, as shown in FIGS. 1-3 and 6. Because flexure beams 60-63 have low resistance to bending in horizontal planes, central portion 52 may oscillate with small amplitude rotational motion about a vertical axis through its geometric center. With reference to FIGS. 1A and 5, four groups of electrode assemblies 70-73 are formed on the drive member 38 by appropriate doping of a portion of the crystal forming the drive member 38. The electrode assembly is connected to central portion 52 between flexure beams 60-63. Referring to FIG. 5, for example, the shaded portion of the electrode assembly 70 indicates separate electrodes 80-88. Electrodes 80-88 are positioned with respect to corner 90 of electrode assembly 70 such that within the same drive member 40, the corresponding electrodes are angularly displaced from one another. The corresponding displacement between the electrodes occurs when the same drive member 40 is turned over and the electrode assemblies are placed face-to-face. Due to the angular displacement of the electrodes in the two drive members 38 and 40, the electrodes repel each other in an oscillating manner at twice the applied frequency, so that opposing rotational vibrations of the electrodes and the corresponding central portions of the drive members are generated. Occurs. An electrical signal source is connected to the two drive members to provide drive signals to the electrodes. Preferably, the drive signal drives each drive member at a resonance frequency. Preferably, the resonance frequencies of drive members 38 and 40 are the same and are generally about 5 kHz. The two central drive members 38 and 40 together form a counter-rotating torsional resonant mechanical oscillator. The two outer speed sensing members 34 and 36 together form a two-axis tuned inertial speed sensing element. Referring to FIGS. 1A, 1B and 6, the thickness of central portion 52 of drive member 38 is smaller than the thickness of frame 50. The central portion 150 of the drive member 40 is also thinner than its frame 100. Due to the difference in thickness between the central portion and the frame, a small gap is created between the central portions when the frame 50 of the driving member 38 and the frame 100 of the driving member 40 are connected. Referring to FIGS. 1A, 1B and 6, the speed detecting members 34 and 36 include detecting elements 110 and 112, respectively. The speed detection member 34 includes a central portion 120 and a plurality of compliant leaf springs 122-125 extending from the central portion 120 to the sensing element 110. Similarly, the speed detecting member 36 includes a leaf spring 130-133 extending from the central portion 121 to the detecting element 112. Sensing element 112 is preferably formed as a generally thin rectangular structure having a generally rectangular central void 113. As shown in FIGS. 1B and 6, the central portion 121 is thicker than the sensing element 112, and the sensing element 112 is thicker than the leaf springs 130-133. FIG. 6 shows the structure resulting from the coupling of the drive members 38 and 40 and then the speed sensing members 34 and 36 to the central portion of the rear surface of the drive members 38 and 40, respectively. Only the thickest central portions 120 and 121 of the speed detecting members 34 and 36 are coupled to the corresponding driving members 38 and 40, respectively. In this way, leaf springs 121-125 and 130-133 are free to oscillate with small amplitude along the Z axis as shown in FIGS. 1A and 1B and on this page as shown in FIG. Referring to FIGS. 1 and 6, the drive members 38 and 40 and the speed detection members 34 and 36 are disposed on the base 22 after being coupled, and the corners of the drive members 38 and 40 contact the base mounts 24-27. Preferably, the base mounts 24-27 are each formed to include a damping compliant element between the mechanical oscillator support base 22 and the frame 50 of the drive member 38. This compliant element is necessary to ensure that the counter-rotating mechanical oscillator has one resonance frequency. Compliant elements also provide the additional advantage of attenuating external vibration input. When the rotation sensor 20 is fully assembled and a drive voltage is applied to the electrode assemblies of both drive members 38 and 40, the rotation sensor 20 will detect rotation about an axis in the plane indicated by X and Y in FIG. 1A. Can be used. An out-of-plane vibration is generated in the speed detecting elements 110 and 112 by the rotation input about the X or Y axis. This out-of-plane vibration is caused by an out-of-plane Coriolis force generated by an object vibrating in the plane due to rotation of the object about an axis in the plane. Leaf springs 122-125 and 130-133 produce an appropriate amount of out-of-plane vibration about an in-plane axis in response to input rotation. Preferably, the two speed sensing members 34 and 36 have substantially equal X-axis resonance frequencies. Similarly, preferably, the Y axis resonance frequencies of the speed detecting members 34 and 36 are the same. These resonance frequencies are preferably equal to the vibration frequency of the drive member. Out-of-plane vibrations caused by input rotational speeds in either the X or Y axis change the relative displacement between drive members 38 and 40 and corresponding speed sensing members 34 and 36. This changing displacement can be thought of as a change in capacitance, resulting in a capacitive pickoff described below. 1A and 6, the central portion of drive member 40 is designated by reference numeral 150. Drive member 40 is also shown as having flexure beams 152 and 154 corresponding to flexure beams 61 and 63 of drive member 38, respectively. FIG. 7 schematically illustrates a capacitive signal pick-off. The oscillator 160 provides a reference excitation signal to the speed detecting members 34 and 36. The reference excitation voltage is about 10 volts and the frequency is about 250 kHz. Capacitors 162 and 164 are formed between drive member 38 and speed detection member 34. The capacitors 166 and 168 are formed between the driving member 40 and the speed detecting member 36. A drive voltage of approximately +10 volts is provided to capacitors 162 and 166. A drive voltage of approximately -10 volts is provided to capacitors 164 and 168. Electrical leads 170-173 carry oscillatory signals indicative of rotational speed to a signal processing circuit described below. Referring to FIG. 8, the signal processing receives in its basic form a sensor input consisting of a signal indicating the rotational speed of both the speed detecting members 34 and 36 about the X and Y axes. The sensor inputs are provided to first and second X-axis sensor capture loop circuits 200 and 202, respectively, and to first and second Y-axis sensor capture loop circuits 204 and 206, respectively. Outputs of the first and second X-axis sensor capture loop circuits 200 and 202 are input to an adder 208, respectively. Similarly, the outputs of the first and second Y-axis sensor capture loop circuits 204 and 206 are input to the adder 210, respectively. Adders 208 and 210 provide X and Y rotation signals to quantizer 212. The sensor circuits 200-206 may be the same. The structure for each of the four sensor circuits 200-206 is shown in FIG. The angular velocity input signal and the signal indicating the in-phase dynamic error are combined in summer 220. The output of the adder 220 is the frequency ω _D Represents an input dynamically modulated by Coriolis generation force from reverse rotation driving vibration. This in-phase signal can optionally be represented as a cosine function of the drive signal. The signal indicating the quadrant dynamic error can be characterized as a sine function of the drive signal. Blocks 222 and 224 represent the dynamic modulation of the input speed signal at the vibration frequency. The sum of the signals from blocks 222 and 224 is indicated by adder 226. The output of adder 226 is input to a circuit indicated by block 228 which indicates the sensor element response to the angular velocity input. The output of block 228 is amplified by amplifier 230. Amplifier 230 converts the signal to cos ω _D t and sin ω _D t provides an output to a pair of demodulators 232 and 236 that demodulate respectively. Outputs of the demodulators 232 and 233 are input to corresponding servo compensation circuits 234 and 233, respectively. The signal output of the servo compensation circuit 234 is an angular velocity signal sent to the appropriate adder 208 or 210 of FIG. The signal outputs from the servo compensation circuits 234 and 236 also output the input signals cosω _D t and sin ω _D It is input to torquer modulator circuits 238 and 240 that modulate at t. The signals output from the torque modulator circuits 238 and 240 are input to the adder 242. The output of the adder 242 is supplied to the detecting element torque electrodes 227a to 227d, and gives feedback torque to the detecting element through the adder 226. FIG. 10 shows a signal processing circuit in which signals from both detection elements are combined in one capture loop. The X speed input signal to the X block 252 has a drive frequency ω _D Is modulated by the Coriolis force. The output of block 252 is shown as an input to torquer adder 250. The pickoff circuits 254 and 256 have a frequency ω _D Generates the amplitude response of the first and second speed detecting members 34 and 36. Amplifiers 260 and 262 amplify the signals output from circuits 254 and 256, respectively. Adder 264 generates a signal indicating the sum of the signals output from circuits 254 and 256, and adder 266 generates a signal indicating the difference between the signals output from circuits 254 and 256. The sum and difference signals are then input to a demodulator 270 that performs in-phase and quadrature demodulation. The output of demodulator 270 is input to servo compensation circuit 272, which provides a measured rotational speed about the X axis. The signal from the drive member servo oscillator 274 is connected to a demodulator 270 and a modulation and summing circuit 276 that provides in-phase and quadrature torque modulation and summing. Modulation and addition circuit 276 receives the signal from servo compensation circuit 272 and provides a feedback torque signal to adder 250. The circuit of FIG. 10 includes a second portion 280 for the Y axis having the same components as described above for the X axis. In FIG. 10, the signals from both members are summed and differenced before the feedback torque is applied. This measure improves the output shaft tuning Q. If each sensing member is captured independently, Q will decay by not phase synchronizing the feedback torque in a reverse vibration mode where the reaction torques for each member are balanced with each other. Energy would be wasted on the base mount if each member was captured independently. In order to completely capture the deflection of the sensor, both the in-phase and quadrature signals, as well as the sum and difference signals, must be zero. The signal representing velocity is the in-phase component of the differenced signal. Other feedback torques correct in-phase and quadrature torques from unwanted cross-coupled and angular acceleration inputs. Detailed performance and environmental requirements for the rotation sensor 20 include a bias reproducibility of 0.01 ゜ / hr, a scale factor error of 20 PPM, an angular random walk of 0.001 ゜ / √hr, and 0.01 ゜. / Time / G. The rotation sensor 20 according to the present invention has several important and unique features that reduce vibration rectification errors and improve bias reproducibility. First, in-phase rejection of linear oscillations on both axes is made possible by aligning the center of gravity of the sensing element with its center of suspension. There is no worry about phase and gain matching and tracking of the independent acceleration sensor as used in other mechanizations of vibration velocity sensors. Second, the inertial velocity sensing element is mechanically isolated from out-of-plane driving forces that cause bias errors. Third, since each drive member and associated sensing element move together as a single unit, there is no relative movement between the inertial velocity sensing element and its pickoff. Fourth, because the torsional mechanical oscillator assembly is balanced, it is less sensitive to changes in external mechanical impedance that can lead to bias errors. The mechanical oscillator provides the vibration velocity excitation required for biaxial Coriolis angular velocity detection. The spring constant of the four flexure elements 60-63, the inertia of the oscillating elements 52 and 34 coupled to the other four flexure elements of the drive member 40, and the inertia of the oscillating elements 36 and 150 establish the resonance frequency of the oscillator, while The peak velocity amplitude is detected by the oscillator pick-off and is controlled by the drive electronics that provide a signal to the drive electrodes on the opposite side of the oscillating plate. On the opposing surface of the vibrating plate are pick-off / forced electrodes used to rebalance each axis of the inertial velocity sensing element. Note that all drives, pickoff / force electrodes and electrical contacts are limited to mechanical oscillators. The natural frequency of the mechanical oscillator is on the order of 5 kilohertz, and the resonant frequency of the full rotation sensor chip and the compliant element of the base mount is on the order of 1 kilohertz. Therefore, the desired bandwidth of 500 Hertz can be easily achieved. In operation, the upper speed detecting member 36 and the lower speed detecting member 34 are driven by the mechanical oscillator elements 38 and 40 so that the phases are different by 180 °. The upper and lower speed sensing members of the speed sensing element respond to an input of angular velocity about an axis perpendicular to the mechanical oscillator axis by vibration about an axis perpendicular to both the input axis and the mechanical oscillator. The component of this Coriolis-induced vibration of the speed detection element is detected by the X and Y axis capacitive pickoff. This pick-off signal is provided to the X and Y channels of the rotation sensor servo electronics which feed back a voltage to electrostatically force the speed sensing element to zero. The magnitude of the voltage feedback for each axis is linearly proportional to the X and Y components of the input angular velocity. The signal processing circuit provides a DC signal proportional to the angular velocity while the loop is driven by the mechanical oscillator frequency ω _D Servo both in-phase and quadrature signals in a manner that allows to have an integral gain at. Referring to the quantizer 212 of FIG. 8, a dual range conversion method with high speed oversampling is used. A fourth order delta-sigma modulator with a high dynamic range converts the analog rate signal into a serial bit stream, each bit representing a delta theta. This delta theta is then summed and sampled by the processor at 5 kHz, which is more than a factor of 10 bandwidth, and fast averaging is performed. Since the signal is noisy, the resolution of the process is increased as a result. A fine range of 180 ° / sec with a resolution of 1.5 arc-sec after oversampling is achieved. The inexact range is increased by a factor of 4 to 720 ° / sec, and the resolution is 6.0 arc-sec. The evaluation of this rotation sensor uses basically the same theory and has the same transfer function as a tuned rotor gyro (TRG). The Q of the sensing element oscillation is similar to the TRG dynamic time constant, and the difference between the drive frequency and the sensor output natural frequency is equal to the spin rate of the tuned and different TRG. Some important features of the present invention are described below. The sensor 20 operates in a closed loop mode to tune the sensing axis and can reduce random walks by many orders for an open loop device. For example, the random walk of an open-loop tuning fork gyro degrades in proportion to its bandwidth, because the pick-off sensitivity continues to decrease as more bandwidth is tuned away from the tuning fork oscillation frequency and larger bandwidths are obtained. is there. The driving force does not act directly on the sensitive element. Driving the sensitive element directly is the same as mounting the TRG motor directly on the rotor element instead of driving through the shaft and gimbal structure. When the sensitive element itself is driven, a direct source of bias error will occur if the driving force for vibration is misaligned by a small amount in the direction of the Coriolis sensing axis. The phase of the cross-coupled forces is equal to that generated by the speed input and therefore cannot be distinguished from the actual speed input. This force will change with time and temperature if the pressure, alignment, or hysteresis loss changes. Even in designs where the sensor is driven through a suspension, normal forces are transmitted to the sensing element if the stiffness in the sense axis direction is not high. This may be the case for designs that apply the "surface" micromachining method, since suspension does not provide "depth" and increases stiffness in the direction of the cross plane. Vibration driven motion, or the resulting stress, does not appear at the pickoff. By having the base of the displacement pickoff move with the sensing element, one of the most damaging sources of error can be completely eliminated. Overall, this feature eliminates coherent coupling of imperfections in the oscillating surface of the sensitive element as it oscillates over the pickoff. Even micromachined silicon surface finishes on the order of 0.02 microinches are many orders of magnitude greater than the amplitude of motion required to resolve for a performance of 0.01 degrees / hour. This moving pickoff technique also eliminates the effects of any nominal tilt of the sensitive element during micromachining. The signal from such a tilt will couple to an output that is proportional to the product of the tilt and the angular oscillation amplitude. Many other Coriolis detectors use a piezoresistor or piezoelectric stress detection transducer to detect Coriolis force. Unfortunately, such pick-offs must decouple the total stress of the driving vibration several billion times greater than the stress required for 0.01 degrees / hour of resolution. The present invention provides an inherent in-phase rejection of linear oscillations. Each sensing element is inherently balanced so that the center of gravity is at the center of suspension. It is not of the cantilever type like most other designs. Therefore, no output is generated for a linear vibration input. For a cantilevered, highly resistant mass, the difference between the signals from the two outputs is taken to eliminate sensitivity to vibration. This indicates that it is important to have good gain and phase matching for such cancellation. For a resonance frequency of 5000 Hz and a peak speed of 0.5 meters / second, the peak Coriolis acceleration is 0.005 microG for an input speed of 0.01 ° / hour. The peak output shaft offset shaft displacement for this acceleration at 5000 Hz is 5. 1 × 10 ^-11 Micron. For a modest Q value of 500 with respect to the output shaft, this motion is amplified by 2.5 × 10 ^-8 Micron. Pickoffs with a nominal gap of 10 microns will produce 1.2 nV for a 5 volt bridge source, and an estimated stray and backplane capacitance of 5 times the gap capacitance. This results in a scale factor of 120 nV / ゜ / hour. In current instrumentation amplifiers with better than 4 nV / √Hz noise, the white noise of the rotation sensor will be better than 0.05 ゜ / hour / 、 Hz, allowing conversion to RMS and full-wave demodulation. . This noise translates into a random walk better than 0.001０．００ / √hour. If Q were made higher, this number would be proportionally smaller. In operation, when velocity is applied about an axis perpendicular to the axis of vibration, a Coriolis force is generated which causes the sensitive element to angularly vibrate out of plane. The signal from the pick-off provided on the plate in proximity to the detector that measures this movement is amplified and used to generate feedback torque to negate the effect of Coriolis forces. The torque required to keep the sensing element at zero is a measure of the input speed. If the base is mounted to follow the system and it is desired to isolate the sensor from external vibrations, by capturing the two sensitive elements together in a phase-locked loop, a high Q with respect to the output shaft is achieved. It is important to maintain. To that end, the sum and difference are taken of the pickoff signals from both sensing elements before the feedback torque is applied. If each sensing element was captured independently, Q would be attenuated by ensuring that the feedback torque phase-locked in a balanced mode where the reaction torques for each element were balanced. This technique is equivalent to a drive mechanism in which two sensing elements are driven through one compliant vibration frequency by being coupled through a compliant frame mount. The structures and methods disclosed herein illustrate the principles of the present invention. The present invention may be embodied in other specific forms without departing from its spirit or essential characteristics. The embodiments described herein are to be considered in all respects as illustrative and not restrictive. Therefore, the appended claims rather than the foregoing description define the scope of the invention. All variations of the embodiments described herein that come within the meaning and range of equivalents of the claims are embraced within the scope of the invention.

[Procedural amendment] [Submission date] January 28, 1997 (1997.1.28) [Content of amendment] Claims 1. A rotation sensor, comprising: a base; and a driving device, wherein the driving device includes a first driving member having a first frame mounted on the base, wherein the first driving member has a first pair of driving members. Formed from a single silicon wafer with opposing flat surfaces, the first drive member further has a first drive member central portion connected to the frame, and an axis perpendicular to the flat surface of the silicon wafer. Wherein there is a rotational compliance between the frame and the central portion with respect to the first driving member further comprising a first plurality of electrodes formed on at least one side of the first driving member central portion. The drive further includes a second drive member having a second frame mounted on the first frame, the second drive member comprising a single piece of silicon comprising a second pair of opposing flat surfaces. Formed by wafer , The second drive member further has a second drive member central portion connected to the frame, wherein there is rotational compliance between the frame and the central portion with respect to an axis perpendicular to the flat surface of the silicon wafer. Wherein the second drive member further has a second plurality of electrodes formed on at least one side of the second drive member central portion, and the rotation sensor further comprises a plurality of drive signals having a drive signal frequency. A drive signal device for applying to the electrodes, wherein the plurality of electrodes are arranged such that the drive signals cause rotational vibration of the drive member center portion with respect to a drive axis perpendicular to the flat surface of the silicon wafer, and the rotation sensor further comprises: A silicon detection member, the silicon detection member having a detection member central support member connected to the second drive member central portion, whereby the second drive member central portion is provided. Minute rotational vibration is transmitted to the central portion of the detection member, the silicon detection member further has a detection portion connected to the central support member of the detection member, wherein the detection portion oscillates about the drive shaft and is perpendicular to the drive shaft. An input rotational speed for generating an out-of-plane vibration of the detection portion, and the rotation sensor is further connected to the detection portion for generating a signal indicative of the input rotational speed as a function of the amplitude of the out-of-plane vibration of the detection portion. A rotation sensor. 2. The first drive member further includes a first flexure beam connected between the first frame and the first drive member center portion, and the second drive member further includes a second frame and a second flexure beam. The rotation sensor according to claim 1, further comprising a second plurality of flexure beams connected between the drive member and the central portion. 3. 2. The leaf spring member of claim 1, further comprising a plurality of generally flat leaf spring members connected between the sensing member central support member and the sensing portion, wherein out-of-plane vibrations in the sensing portion are perpendicular to the plane of the leaf spring member. A rotation sensor as described. 4. 4. The sensor of claim 3, further comprising a capacitive pickoff formed between the second drive member and the sensing portion, wherein out-of-plane vibration of the sensing portion causes a change in the capacitance of the capacitive pickoff to form a sensor element response signal. 2. The rotation sensor according to 1. 5. 9. The plate member further comprising a plurality of generally flat plate spring members connected between the sensing member central support member and the sensing portion, wherein the out-of-plane vibration at the sensing portion is perpendicular to the plane of the plate spring member. 3. The rotation sensor according to 2. 6. 6. The sensor of claim 5, further comprising a capacitive pickoff formed between the second drive member and the sensing portion, wherein out-of-plane vibration of the sensing portion causes a change in the capacitance of the capacitive pickoff to form a sensor element response signal. 2. The rotation sensor according to 1. 7. A damping compliant device for providing a single mechanical resonance frequency in the rotation sensor and for damping external vibration input, further comprising a plurality of base mounts connected between the base and the frame of the drive member; The rotation sensor according to claim 5, wherein the rotation sensor is formed to include an element. 8. The signal processing device includes a first summing circuit connected to the capacitive pickoff and arranged to receive a signal indicative of the input rotational speed, and an input rotation signal coupled to the first summing device and indicating a cosine of the drive signal frequency. A first modulation circuit arranged to modulate the speed signal; a second modulation circuit arranged to modulate the quadrant dynamic error with a signal indicating the sine of the drive signal frequency; A second addition circuit connected to add the signals output from the second modulation circuit and to provide a feedback signal to the electrode of the detection member; and a sensor element response signal connected to a capacitive pick-off by a cosine of the driving frequency. A first demodulator circuit for demodulating, a first compensating circuit connected to receive a signal output from the first demodulator circuit, and a sensor connected to a capacitive pick-off and having a sine of a driving frequency. A second demodulator circuit for demodulating the element response signal; a second compensation circuit connected to receive the signal output from the second demodulator circuit; and a second compensation circuit connected to the first compensation circuit A first torquer modulator circuit, a second torquer modulator circuit connected to a second compensation circuit, and a third torquer circuit for adding signals output from the first and second torquer modulator circuits. The rotation sensor according to claim 6, further comprising an addition circuit, wherein the third addition circuit generates a feedback signal input to the plurality of electrodes of the detection member. 9. The signal processing device includes a first summing circuit arranged to receive a signal indicative of the input rotational speed, and a signal coupled to the first summing device for modulating the input rotational speed signal with a signal indicative of a cosine of the drive signal frequency. A second modulation circuit arranged to modulate the quadrant dynamic error with a signal indicating the sine of the drive signal frequency; and a first and second modulation circuit. A second addition circuit connected to add the output signals and provide a feedback signal to the detection member; a first demodulator connected to the detection portion for demodulating the sensor element response signal with a cosine of the drive frequency A first compensation circuit connected to receive the signal output from the first demodulator circuit; and a second compensation circuit connected to the detection portion for demodulating the sensor element response signal at a sine of the drive frequency. A demodulator circuit; A second compensation circuit connected to receive a signal output from the second demodulator circuit; a first torquer modulator circuit connected to the first compensation circuit; and a second compensation circuit connected to the second compensation circuit. And a third adder circuit for adding signals output from the first and second torquer modulator circuits, wherein the third adder circuit includes a plurality of detection members. The rotation sensor according to claim 1, wherein the rotation sensor generates a feedback signal input to the electrodes. 10. A rotation sensor, comprising: a base; a first drive member mounted to the base and formed from a first single silicon wafer having a first pair of opposing flat surfaces; Comprises a first frame and a first driving member central portion connected to the first frame, the first driving member central portion being perpendicular to a flat surface of the first silicon wafer. The first drive member is arranged to have a rotational compliance between the first frame and the first drive member center portion with respect to the first shaft, and the first drive member is further formed on at least one side of the first center portion. A plurality of electrodes, wherein the rotation sensor further includes a first drive signal device for providing a drive signal having a drive signal frequency to the first plurality of electrodes, wherein the first plurality of electrodes comprises a silicon wafer. Perpendicular to a flat surface The rotation sensor is further arranged to generate a rotational vibration of a central portion of the first driving member according to the driving signal with respect to the moving shaft, and the rotation sensor further includes a first silicon detecting member, wherein the first silicon detecting member includes a first driving member. A first detecting member central support member connected to the central portion, whereby the rotational vibration of the first driving member central portion is transmitted to the first detecting member central portion, and the first silicon detecting member further comprises: A first sensing portion connected to the first sensing member central support member, wherein the first sensing portion oscillates about a drive axis and an input rotational speed about an axis perpendicular to the drive axis is a surface of the first sensing portion. A second drive member formed of a second single silicon wafer having a second pair of opposing flat surfaces mounted on the first drive member for causing external vibrations; Including the The driving member includes a second frame, and a second driving member central portion connected to the second frame, wherein the second driving member central portion is perpendicular to the flat surface of the second silicon wafer. A second drive member central portion is disposed to have rotational compliance between the second frame and the second drive member central portion with respect to the axis, the first and second drive member central portions are connected in opposing relation, and the second drive member The member further includes a second plurality of electrodes formed on at least one side of the second central portion, and the rotation sensor further includes a second plurality of electrodes for providing a drive signal having a drive signal frequency to the second plurality of electrodes. A second drive signal device, wherein the second plurality of electrodes are arranged such that the drive signal causes rotational vibration of the second drive member center portion with respect to the drive axis perpendicular to the flat surface of the silicon wafer, and the rotation sensor is Further , A second silicon detection member, the second silicon detection member comprising a second detection member central support member connected to the second drive member central portion, whereby the second drive member central portion is The rotational vibration is transmitted to the second detection member central portion, and the second silicon detection member further includes a second detection portion connected to the second detection member central support member, wherein the second detection portion is driven. An input rotational speed about an axis that is oscillating about the axis and perpendicular to the drive axis causes out-of-plane vibration of the second sensing portion, and the rotation sensor is further connected to the first and second sensing portions and out-of-plane oscillation of the sensing portion. A rotation sensor including a signal processor for generating a signal indicative of an input rotation speed as a function of the amplitude of the rotation. 11. The rotation sensor according to claim 10, wherein the first and second detection portions are arranged to oscillate in opposite directions in response to an input rotation speed. 12. The rotation sensor of claim 10, wherein each of the first and second drive members includes a plurality of flexure beams connected between the frame and the drive member center portion. 13. Each of the first and second sensing portions includes a plurality of generally flat leaf spring members connected between the sensing member central support member and the sensing portion, wherein out-of-plane vibration of the sensing portion is applied to the face of the leaf spring member. 13. The rotation sensor according to claim 12, wherein the rotation sensor is made vertical. 14． A first capacitive pickoff formed in the sensing portion, wherein the out-of-plane vibration of the first sensing portion causes a change in the capacitance of the first capacitive pickoff, and further comprising a second capacitive pickoff formed in the sensing portion. 14. The rotation sensor according to claim 13, including a capacitive pickoff, wherein out-of-plane vibration of the second sensing portion causes a change in capacitance at the second capacitive pickoff. 15. A first plurality of generally flat leaf spring members connected between the first sensing member central support member and the first sensing portion, wherein the out-of-plane vibration in the first sensing portion is the first plate; A second plurality of generally flat leaf spring members adapted to be perpendicular to the plane of the spring member and connected between the second sensing member central support member and the second sensing portion; The rotation sensor according to claim 10, wherein an out-of-plane vibration at the detection portion is perpendicular to a plane of the second leaf spring member. 16. A first capacitive pickoff formed between the first sensing portion and the first drive member, wherein the out-of-plane vibration of the first sensing portion causes a change in the capacitance of the first capacitive pickoff. And a second capacitive pickoff formed between the second sensing portion and the second drive member, wherein the out-of-plane vibration of the second sensing portion changes the capacitance of the second capacitive pickoff. The rotation sensor according to claim 15, wherein the rotation sensor causes the rotation. 17． The system further includes a plurality of base mounts connected between the base and the frame of the first drive member, each base mount providing a single mechanical resonance frequency in the rotation sensor and for damping external vibration input. 16. The rotation sensor of claim 15, wherein the rotation sensor is formed to include a damping compliant element. 18. The signal processing device is connected to the first detection unit and amplifies the rotation response signal output therefrom. The first amplifier is connected to the second detection unit and amplifies the rotation response signal output therefrom. Two amplifiers, a first adder circuit connected to the first and second amplifiers and arranged to generate a sum signal indicating a sum of the amplified rotation signals, and a first and second amplifier. A second summing circuit connected and arranged to generate a difference signal indicative of the difference between the amplified rotation signals; and an in-phase and quadrature modulation of the sum and difference signals connected to the first and second summing circuits. A modulation circuit for receiving the in-phase and quadrature-modulated sum and difference signals therefrom and for generating a measured velocity signal for the input rotation about the first axis. Servo compensation And an in-phase and quadrature torque modulation and addition circuit connected to the servo compensation circuit for receiving signals therefrom; and an in-phase and quadrature torque modulation and addition circuit and connected to the in-phase and quadrature demodulation circuit to provide automatic gain control. 11. The rotation sensor of claim 10 including an oscillator servo for and a third summing circuit connected to the in-phase and quadrature torque modulation and summing circuit for receiving the modulated signal therefrom. 19. A method for operating a rotation sensor, comprising the steps of providing a base and forming a drive, wherein the method of forming a drive comprises forming a first frame mounted on the base. A first drive member formed from a single silicon wafer having a first pair of opposing flat surfaces and further including a first drive member central portion connected to the frame; Forming a first plurality of electrodes on at least one side of the first driving member center portion, such that there is rotational compliance between the frame and the center portion with respect to an axis perpendicular to the flat surface of the silicon wafer. Forming a second frame mounted on the base to form a second drive from a single silicon wafer having a second pair of opposing flat surfaces. Forming a moving member and forming a second driving member to further include a second driving member central portion connected to the frame, wherein the second driving member is formed between the frame and the central portion with respect to an axis perpendicular to the flat surface of the silicon wafer; Forming a second plurality of electrodes on at least one side of a central portion of the second driving member, so that the frame of the second driving member is formed on the frame of the first driving member. Mounting, wherein the method for operating the rotation sensor further comprises: rotating the first and second drive member central portions with respect to a drive axis perpendicular to the flat surface of the first and second silicon wafers. Arranging the electrodes of the first and second driving members so as to generate a driving signal; applying a driving signal having a driving signal frequency to the plurality of electrodes; Providing a silicon detection member, wherein the process of providing the silicon detection member comprises connecting the detection member central support member to the drive member central portion so that rotational vibration of the drive member central portion is transmitted to the detection member central portion. Connecting the sensing portion to the sensing member central support member to oscillate about the sensing portion or the drive shaft to cause an input rotational speed or out-of-plane oscillation of the sensing portion about an axis perpendicular to the drive shaft. And a method for operating the rotation sensor further comprising: processing the signal output from the detection portion to generate a signal indicative of the input rotation speed as a function of the amplitude of the out-of-plane vibration of the detection portion. A method for operating a rotation sensor, comprising connecting a device to a detection part. 20. 20. The method of claim 19, further comprising connecting a plurality of flexure beams between the frame and the drive member center portion. 21. The method further comprising connecting a plurality of generally flat leaf spring members between the sensing member central support member and the sensing portion so that out-of-plane vibrations at the sensing portion are perpendicular to the plane of the leaf spring member. 20. The method according to 19. 22. 4. The method of claim 3, further comprising a capacitive pickoff formed in the sensing portion, wherein out-of-plane vibration of the sensing portion causes a change in capacitance at the capacitive pickoff such that a sensor element response signal is formed. 23. The method further comprising connecting a plurality of generally flat leaf spring members between the sensing member central support member and the sensing portion so that out-of-plane vibrations at the sensing portion are perpendicular to the plane of the leaf spring member. 20. The method according to 20. 24. Connecting a capacitive pick-off between the sensing portion and the plurality of electrodes, wherein out-of-plane vibrations in the sensing portion cause a change in capacitance at the capacitive pick-off to form a sensor element response signal. The method according to claim 19. 25. Connecting a plurality of base mounts between the base and the frame of the drive member; and including a damping compliant element for providing a single mechanical resonance frequency in the rotation sensor and for damping external vibration input. Forming each base mount. 26. Connecting the first summing circuit to the capacitive pick-off to receive a signal indicative of the input rotational speed; and a first signal modulating the input rotational speed signal with a signal indicative of the cosine of the drive signal frequency. Connecting a modulation circuit to the first summing circuit; providing a second modulation circuit arranged to modulate the quadrant dynamic error with a signal indicating the sine of the drive signal frequency; Providing an adder circuit to add the signals output from the first and second modulation circuits and providing a feedback signal to the detection member; and a first demodulation for demodulating a sensor element response signal with a cosine of a driving frequency. Connecting a demodulator circuit to a capacitive pickoff; providing a first compensation circuit to receive a signal output from the first demodulator circuit; Connecting a second demodulator circuit to the capacitive pickoff to demodulate the answer signal; providing a second compensation circuit to receive a signal output from the second demodulator circuit; Connecting the torquer modulator circuit to the first compensation circuit; connecting the second torquer modulator circuit to the second compensation circuit; and signals output from the first and second torquer modulator circuits. And providing a third summing circuit for generating a feedback signal that is input to the plurality of electrodes of the detection member. 27. Connecting the first summing circuit to the capacitive pick-off to receive a signal indicative of the input rotational speed; and a first signal modulating the input rotational speed signal with a signal indicative of the cosine of the drive signal frequency. Connecting a modulation circuit to the first summing circuit; providing a second modulation circuit arranged to modulate the quadrant dynamic error with a signal indicating the sine of the drive signal frequency; Providing an adder circuit to add the signals output from the first and second modulation circuits and providing a feedback signal to the detection member; and a first demodulator for demodulating the sensor element response signal at the cosine of the drive frequency. Connecting the circuit to a capacitive pickoff; providing a first compensation circuit to receive the signal output from the first demodulator circuit; and sensing the sensor element response at the sine of the drive frequency. Connecting a second demodulator circuit to a capacitive pickoff to demodulate the signal; providing a second compensation circuit to receive a signal output from the second demodulator circuit; Connecting the modulator circuit to the first compensation circuit; connecting the second torquer modulator circuit to the second compensation circuit; and outputting the signals output from the first and second torquer modulator circuits. Providing a third summing circuit for summing, wherein the third summing circuit generates a feedback signal that is input to a plurality of electrodes of the sensing member. 28. A method for operating a rotation sensor, the method comprising: providing a base; and forming a first drive member of a first single silicon wafer having a first pair of opposing flat surfaces. A method of forming a first drive member, comprising: providing a first frame; connecting a first drive member center portion to the first frame; Providing rotational compliance between the first frame and the first driving member center portion with respect to an axis perpendicular to the flat surface of the one silicon wafer; and at least one side of the first center portion. Forming a first plurality of electrodes, the method for operating a rotation sensor further comprising: mounting a first drive member to a base; and a drive having a drive signal frequency. Applying a signal to a first plurality of electrodes, the first plurality of electrodes causing the drive signal to cause a rotational oscillation of the first drive member center portion with respect to a drive axis perpendicular to the flat surface of the silicon wafer. And the method for operating the rotation sensor further comprises forming a first silicon detection member, wherein the method for forming the first silicon detection member comprises: Connecting the first detection member center portion to the first detection member center portion, wherein the rotational vibration of the first drive member center portion is transmitted to the first detection member center portion; Connecting to the support member such that the first sensing portion oscillates about the drive shaft such that the input rotational speed about an axis perpendicular to the drive shaft causes out-of-plane oscillation of the first sensing portion. The method for operating the rotation sensor further comprises: mounting a second drive member on the first drive member that is the same as the first drive member; and providing a drive signal having a signal frequency to the second drive member. Generating a vibration about a drive axis perpendicular to the flat surface of the silicon wafer; mounting a second silicon detection member identical to the first detection member on the second drive member; and out-of-plane vibration of the detection portion Processing the signals output from the first and second detection portions to generate a signal indicative of the input rotational speed as a function of the amplitude of the rotation sensor. 29. 29. The method of claim 28, comprising positioning the first and second sensing portions to vibrate in opposite directions in response to an input rotational speed. 30. 30. The method of claim 29, comprising forming the first and second drive members to include a plurality of flexure beams between the frame and the drive member center portion. FIG. FIG. FIG. 2 FIG. 3 FIG. 4 FIG. 5 FIG. 7 FIG. 6 FIG. 8 FIG. 9 FIG. 10

────────────────────────────────────────────────── ─── Continuation of front page    (81) Designated countries EP (AT, BE, CH, DE, DK, ES, FR, GB, GR, IE, IT, LU, M C, NL, PT, SE), OA (BF, BJ, CF, CG , CI, CM, GA, GN, ML, MR, NE, SN, TD, TG), AP (KE, MW, SD, SZ, UG), AM, AT, AU, BB, BG, BR, BY, CA, C H, CN, CZ, DE, DK, EE, ES, FI, GB , GE, HU, JP, KE, KG, KP, KR, KZ, LK, LR, LT, LU, LV, MD, MG, MN, M W, MX, NO, NZ, PL, PT, RO, RU, SD , SE, SI, SK, TJ, TT, UA, US, UZ, VN (72) Inventor Wise, Stanley F             91316 California, United States             Province, Encino, Alonzo Avenue,             4610 (72) Inventors Fastt, Samuel H             United States, 91604 California             State, Studio City, Buena             Park Drive, 3749

Claims (1)

[Claims] 1. A rotation sensor,   Base and   And a driving device, wherein the driving device comprises:   A first drive member having a first frame mounted on the base; The moving member is formed from a single silicon wafer having a first pair of opposing flat surfaces. Wherein the first driving member further comprises a first driving member central portion connected to the frame. The frame and the central part with respect to an axis perpendicular to the flat surface of the silicon wafer. Rotation compliance is present between the first drive member and A first plurality of electrodes formed on at least one side of a central portion of the first driving member; , The drive is further   A second drive member having a second frame mounted on the second frame, The second drive member is a single silicon wafer having a second pair of opposing flat surfaces. And a second drive member, further comprising a second drive member connected to the frame. Having a central portion, the frame and the center about an axis perpendicular to the flat surface of the silicon wafer; The rotation compliance between the parts is such that the second drive member is A second plurality of electrodes formed on at least one side of a center portion of the second driving member; And the rotation sensor further comprises:   A drive signal device for providing a drive signal having a drive signal frequency to a plurality of electrodes. And a plurality of electrodes The rotational vibration of the central part of the driving member with respect to the driving shaft perpendicular to the flat surface of the silicon wafer Movement is arranged, and the rotation sensor   Including a silicon detection member, the silicon detection member,   A detecting member central support member connected to the second driving member central portion; As a result, the rotational vibration of the central portion of the second driving member is transmitted to the central portion of the detecting member, The cone detection member further   A detection member connected to the central support member, wherein the detection portion is driven; The input rotational speed about the axis that oscillates about the axis and is perpendicular to the drive axis is External vibration, and the rotation sensor   Connected to the detector and indicates the input rotational speed as a function of the amplitude of the out-of-plane vibration of the detector A rotation sensor including a signal processing device for generating a signal. 2. Flexure beams connected between the frame and the central part of the drive member The rotation sensor according to claim 1, further comprising: 3. A plurality of generally flat surfaces connected between the sensing member central support member and the sensing portion A flat leaf spring member is further included, and out-of-plane vibration at the detection portion is perpendicular to the plane of the leaf spring member. The rotation sensor according to claim 1, wherein the rotation sensor is straight. 4. Out-of-plane vibration of the sensing portion further includes a capacitive pickoff formed in the sensing portion Changes to capacitive pick-off capacitance 4. The rotation sensor according to claim 3, wherein: 5. A plurality of generally flat surfaces connected between the sensing member central support member and the sensing portion A flat leaf spring member is further included, and out-of-plane vibration at the detection portion is perpendicular to the plane of the leaf spring member. The rotation sensor according to claim 1, wherein the rotation sensor is straight. 6. Further comprising a capacitive pickoff formed between the sensing portion and the plurality of electrodes, 6. The method according to claim 5, wherein the capacitance of the capacitive pick-off is changed by out-of-plane vibration of the detection portion. A rotation sensor as described. 7. Multiple base mounts connected between the base and the drive member frame Each base mount provides a single mechanical resonance frequency in the rotation sensor. Includes damping compliant elements to reduce external vibration input The rotation sensor according to claim 5, wherein the rotation sensor is formed as follows. 8. The signal processing device   An input connected to the capacitive pickoff and arranged to receive a signal indicative of the input rotational speed. A first addition circuit,   The input rotation speed signal is a signal that is connected to the first addition device and that indicates the cosine of the drive signal frequency. A first modulation circuit arranged to modulate the signal;   Arranged to modulate the quadrant dynamic error with a signal indicating the sine of the drive signal frequency A second modulation circuit,   The signals output from the first and second modulation circuits are added, and a feedback Connected to give a clock signal A second adding circuit;   Connected to a capacitive pickoff to demodulate sensor element response signal at cosine of drive frequency A first demodulator circuit for   A first compensation circuit connected to receive the signal output from the first demodulator circuit; Road and   Connected to a capacitive pickoff to demodulate the sensor element response signal at the sine of the drive frequency A second demodulator circuit for   A second compensation circuit connected to receive the signal output from the second demodulator circuit; Road and   A first torquer modulator circuit connected to the first compensation circuit;   A second torquer modulator circuit connected to the second compensation circuit;   For adding the signals output from the first and second torquer modulator circuits. A third addition circuit, wherein the third addition circuit is input to the plurality of electrodes of the driving member. The rotation sensor according to claim 5, wherein the rotation sensor generates a feedback signal. 9. The signal processing device   A first summing circuit arranged to receive a signal indicative of the input rotational speed;   The input rotation speed signal is a signal that is connected to the first addition device and that indicates the cosine of the drive signal frequency. A first modulation circuit arranged to modulate the signal;   Change the quadrant dynamic error with a signal indicating the sine of the drive signal frequency. A second modulation circuit arranged for tuning;   The signals output from the first and second modulation circuits are added, and a feedback A second adder circuit connected to provide a clock signal;   For demodulating the sensor element response signal with the cosine of the drive frequency connected to the detection part A first demodulator circuit;   A first compensation circuit connected to receive a signal output from the first demodulator circuit Road and   For demodulating the sensor element response signal with the sine of the drive frequency connected to the detection part A second demodulator circuit;   A second compensation circuit connected to receive the signal output from the second demodulator circuit; Road and   A first torquer modulator circuit connected to the first compensation circuit;   A second torquer modulator circuit connected to the second compensation circuit;   For adding signals output from the first and second torquer modulator circuits. A third addition circuit, wherein the third addition circuit is input to the plurality of electrodes of the driving member. The rotation sensor according to claim 1, wherein the rotation sensor generates a feedback signal. 10. A rotation sensor,   Base and   A first single shell mounted to the base and having a first pair of opposing flat surfaces. First formed from recon wafer A driving member, the first driving member comprising:   A first frame;   A first drive member central portion connected to a first frame; The central portion of the moving member has a first flange with respect to an axis perpendicular to the flat surface of the first silicon wafer. To provide rotational compliance between the frame and the first drive member center portion. And the first driving member is further   A first plurality of electrodes formed on at least one side of the first central portion; The rotation sensor further   A first drive for providing a drive signal having a drive signal frequency to the first plurality of electrodes. A first plurality of electrodes including a driving signal perpendicular to a flat surface of the silicon wafer; The drive signal is arranged such that rotational vibration of the center portion of the first drive member is generated by the drive signal with respect to the drive shaft. And the rotation sensor is   Including a first silicon detection member, the first silicon detection member,   A first detecting member central support member connected to the first driving member central portion; Thus, the rotational vibration of the central portion of the first driving member is transmitted to the central portion of the first detecting member. Reached, the first silicon detection member further comprises   A first detection portion connected to a first detection member central support member; The detection part of 1 oscillates about the drive shaft and the input rotation speed about the axis perpendicular to the drive shaft Causes out-of-plane vibration of the first detection portion, and the rotation sensor further   A second drive mounted on the first drive member and having a second pair of opposing flat surfaces; Including a second drive member formed of a single silicon wafer, the second drive member,   A second frame;   A second driving member connected to the second frame, and a second driving unit. The central portion of the material has a second frame about an axis perpendicular to the flat surface of the second silicon wafer. And a rotationally compliant arrangement between the system and the central portion of the second drive member. And the first and second drive member central portions are connected in opposing relation to form a second The driving member further comprises:   A second plurality of electrodes formed on at least one side of the second central portion; The rotation sensor further   A second drive for providing a drive signal having a drive signal frequency to the second plurality of electrodes. A second plurality of electrodes on the flat surface of the silicon wafer by the drive signal. Arranged such that rotational vibration of the central portion of the second driving member occurs with respect to the driving shaft perpendicular to the surface. And the rotation sensor is   Including a second silicon detection member, the second silicon detection member,   A second detecting member central support member connected to the second driving member central portion; Accordingly, the rotational vibration of the central portion of the second driving member is transmitted to the central portion of the second detecting member. And the second silicon detection member is   A second detection member connected to the second detection member central support member; An exit portion, wherein the second sensing portion oscillates about a drive axis and is perpendicular to the drive axis. Out-of-plane vibration of the second detection portion due to the input rotation speed with respect to In addition,   As a function of the amplitude of the out-of-plane vibration of the detection part connected to the first and second detection parts A rotation sensor including a signal processing device for generating a signal indicating an input rotation speed. 11. The first and second sensing portions oscillate in opposite directions in response to the input rotational speed The rotation sensor according to claim 10, wherein the rotation sensor is arranged as follows. 12. Each of the first and second driving members is connected between the frame and the driving member central portion. 13. The rotation sensor according to claim 12, comprising a plurality of flexure beams that follow. 13. Each of the first and second detection portions includes a detection member central support member and a detection portion. Including a plurality of generally flat leaf spring members connected between the 13. The rotation sensor according to claim 12, wherein is set to be perpendicular to the plane of the leaf spring member. 14． A first capacitive pick-off formed in the detection portion, further comprising a first detection portion; Minute out-of-plane vibration causes a change in the capacitance of the first capacitive pickoff,   Including a second capacitive pickoff formed in the sensing portion, out of plane of the second sensing portion 14. The method of claim 13, wherein the vibration causes a change in capacitance at the second capacitive pickoff. Rotation sensor. 15. First detection member central support member and first detection portion Further comprising a first plurality of generally flat leaf spring members connected between The out-of-plane vibration at the detection portion is perpendicular to the plane of the first leaf spring member; To   A second detection member connected between the second support member and the second detection portion; A plurality of generally flat leaf spring members, wherein the out-of-plane vibration at the second sensing portion is a second The rotation sensor according to claim 10, wherein the rotation sensor is configured to be perpendicular to the plane of the leaf spring member. 16. A first capacitive pit formed between the first detection portion and the first plurality of electrodes. Further comprising a first capacitive pick-off, wherein the out-of-plane vibration of the first sensing portion is a capacitance of the first capacitive pick-off. Cause changes in   A second capacitive pick-up formed between the second sensing portion and the second plurality of electrodes; Out-of-plane vibration of the second sensing portion changes the capacitance of the second capacitive pickoff. The rotation sensor according to claim 15, wherein the rotation sensor causes the rotation. 17． A plurality of base mice connected between the base and the frame of the first drive member; And each base mount has a single mechanical resonance Damping compliant element for providing wavenumber and damping external vibration input The rotation sensor according to claim 15, wherein the rotation sensor is formed to include: 18. The signal processing device   Rotational response connected to and output from the first detection part A first amplifier for amplifying the signal;   A second detecting portion connected to the second detecting portion for amplifying the rotation response signal output therefrom; An amplifier,   Sum signal connected to the first and second amplifiers and indicating the sum of the amplified rotation signals A first adder circuit arranged to generate   A difference signal that is connected to the first and second amplifiers and that indicates a difference between the amplified rotation signals; A second adder circuit arranged to occur;   In-phase and quadrature phase change of the sum and difference signals connected to the first and second adder circuits A modulation circuit for giving a tone;   In-phase and quadrature-modulated sum and difference signals connected to and from a modulation circuit And a measured speed signal for input rotation about the first axis. A servo compensation circuit for   In-phase and quadrature torque connected to and receiving signals from a servo compensation circuit A modulation and addition circuit;   In-phase and quadrature torque modulation and summing circuits and in-phase and quadrature phase recovery An oscillator servo connected to the tuning circuit for providing automatic gain control;   Connected to in-phase and quadrature torque modulation and summing circuits A third summing circuit for receiving the output signal. . 19. A method for forming a rotation sensor, comprising:   Giving a base;   Forming a drive, wherein the method of forming the drive comprises:   Forming a first pair of opposed frames by forming a first frame mounted on the base; Forming a first drive member from a single silicon wafer having a flat surface The first drive member to further include a first drive member center portion connected to the arm. Forming and aligning the frame with the central portion with respect to an axis perpendicular to the flat surface of the silicon wafer. Between the first drive member and the center of the first drive member. Forming a first plurality of electrodes on at least one side;   Forming a second pair of opposed frames by forming a second frame attached to the base; Forming a second drive member from a single silicon wafer having a flat surface The second drive member to further include a second drive member center portion connected to the arm. Forming and aligning the frame with the central portion with respect to an axis perpendicular to the flat surface of the silicon wafer. Between the second drive member and the center of the second drive member. Forming a second plurality of electrodes on at least one side;   Mounting the frame of the second drive member on the frame of the first drive member; And the method for forming a rotation sensor further comprises:   Applying a drive signal having a drive signal frequency to the plurality of electrodes;   A first and a second drive shaft perpendicular to the flat surfaces of the first and second silicon wafers; And the first and second driving members are arranged such that the driving signal causes rotational vibration of the central portion thereof. Arranging electrodes of the second driving member and   Providing a silicon detection member. Seth is   Connect the detection member center support member to the drive member center portion, and Causing the rotational vibration to be transmitted to the central portion of the detection member;   The detection part is connected to the detection member central support member and the detection part vibrates about the drive shaft. And the input rotational speed about the axis perpendicular to the drive axis causes out-of-plane vibration of the detection part And the method for forming a rotation sensor further comprises:   Generates a signal indicating the input rotational speed as a function of the amplitude of the out-of-plane vibration of the detector Forming a rotation sensor, including connecting a signal processing device to a detection portion for Way for. 20. Connecting multiple flexure beams between the frame and the drive member center 20. The method of claim 19, further comprising a step. 21. A plurality of generally flat leaf springs between the sensing member central support member and the sensing portion Connect the members so that the out-of-plane vibration at the detection part is perpendicular to the plane of the leaf spring member. 20. The method of claim 19, further comprising the step of: 22. The method further includes a capacitive pick-off formed in the detection portion, wherein an out-of-plane vibration of the detection portion is included. Wherein the actuation causes a change in capacitance at the capacitive pickoff. The described method. 23. A plurality of generally flat leaf springs between the sensing member central support member and the sensing portion Connect the members so that the out-of-plane vibration at the detection part is perpendicular to the plane of the leaf spring member. 20. The method of claim 19, further comprising the step of: 24. Connect a capacitive pick-off between the sensing part and multiple electrodes, and Out-of-plane vibrations can cause capacitance changes at the capacitive pickoff. 20. The method of claim 19, further comprising a step. 25. Connect multiple base mounts between the base and the drive member frame. Tep,   To provide a single mechanical resonance frequency in a rotation sensor and an external vibration input Each base mount to include an attenuation compliant element to attenuate 20. The method of claim 19, further comprising the step of: 26. The signal processing step is   A first summing circuit is connected to the capacitive pickoff to receive a signal indicating the input rotational speed Steps   A first method for modulating the input rotational speed signal with a signal indicating the cosine of the drive signal frequency Connecting the modulation circuit to the first summing circuit;   Change the quadrant dynamic error with a signal indicating the sine of the drive signal frequency. Providing a second modulation circuit arranged to modulate;   A second adding circuit is provided to add signals output from the first and second modulation circuits. Providing a feedback signal to the drive member;   A first demodulator circuit for demodulating the sensor element response signal at the cosine of the drive frequency. Connecting to a capacitive pickoff;   A step of providing a first compensation circuit and receiving a signal output from the first demodulator circuit; And   A second demodulator circuit to demodulate the sensor element response signal at the sine of the drive frequency. Connecting to a capacitive pickoff;   A step of providing a second compensation circuit and receiving a signal output from the second demodulator circuit; And   Connecting the first torquer modulator circuit to a first compensation circuit;   Connecting the second torquer modulator circuit to a second compensation circuit;   Adding the signals output from the first and second torquer modulator circuits, Third summing circuit for generating feedback signals input to a plurality of electrodes of the material Providing a path. 27. The signal processing step is   A first summing circuit is connected to the capacitive pickoff to receive a signal indicating the input rotational speed Steps   A first method for modulating the input rotational speed signal with a signal indicating the cosine of the drive signal frequency Connecting the modulation circuit to the first summing circuit;   Arranged to modulate the quadrant dynamic error with a signal indicating the sine of the drive signal frequency Providing a second modulator circuit,   A second addition circuit is provided to add signals output from the first and second modulation circuits. Providing a feedback signal to the drive member;   A first demodulator circuit for demodulating the sensor element response signal at the cosine of the drive frequency. Connecting to a capacitive pickoff;   A step of providing a first compensation circuit and receiving a signal output from the first demodulator circuit; And   A second demodulator circuit to demodulate the sensor element response signal at the sine of the drive frequency. Connecting to a capacitive pickoff;   A step of providing a second compensation circuit and receiving a signal output from the second demodulator circuit; And   Connecting the first torquer modulator circuit to a first compensation circuit;   Connecting a second torquer modulator circuit to a second compensation circuit; Steps   For adding signals output from the first and second torquer modulator circuits. Providing a third summing circuit, the third summing circuit comprising a plurality of driving members. 20. The method of claim 19, wherein generating a feedback signal input to the electrode. 28. A method for forming a rotation sensor, comprising:   Giving a base;   A first single silicon wafer having a first pair of opposing flat surfaces; Forming a first driving member, wherein a method of forming a first driving member comprises:   Providing a first frame;   Connecting the first drive member center portion to the first frame;   Disposing a first drive member with respect to an axis perpendicular to the flat surface of the first silicon wafer; Rotational compliance is generated between the first frame and the center portion of the first driving member. Steps to make   Forming a first plurality of electrodes on at least one side of the first central portion; And the method for forming a rotation sensor further comprises:   Attaching the first drive member to the base;   Applying a drive signal having a drive signal frequency to the first plurality of electrodes. Only, the first plurality of electrodes First drive member center with respect to drive axis more perpendicular to flat surface of silicon wafer And a method for forming a rotation sensor is further provided. To   Forming a first silicon detection member, the first silicon detection member The method of forming   A first detecting member central support member connected to the first driving member central portion; Rotational vibration of the driving member central portion is transmitted to the first detecting member central portion. Steps and   A first detection portion connected to the first detection member central support member to provide a first detection portion; Oscillates about the drive shaft, and the input rotational speed about the axis perpendicular to the drive shaft is first detected. Causing the part to generate out-of-plane vibration. The method for   Mounting the same second drive member as the first drive member on the first drive member; ,   A driving signal having a signal frequency is given to the second driving member to flatten the silicon wafer. Generating a vibration about a drive axis perpendicular to the surface.   The second drive member is mounted with the same second silicon detection member as the first detection member. Tep,   Generates a signal indicating the input rotational speed as a function of the amplitude of the out-of-plane vibration of the detector Processing the signals output from the first and second detection portions for , A method for forming a rotation sensor. 29. The first and second detection portions are arranged to swing in opposite directions in response to the input rotational speed. 29. The method of claim 28, including the step of moving. 30. Including multiple flexure beams between the frame and the drive member center 30. The method of claim 29, further comprising the step of forming first and second drive members. Law.