JP2000357845A - Circuit forming structure - Google Patents

Abstract

PROBLEM TO BE SOLVED: To remarkably reduce design manday of a circuit and quickly cope with design change. SOLUTION: This circuit forming structure uses a printed circuit board 1. On one side 2b and the other side 2a of an insulating board 2 of the printed circuit board 1, copper foil patterns b-1 to b-14, and copper foil patterns a-1 to a-29 which stretch straight in the longitudinal direction and the transversal direction are formed, respectively. This board is used as a common printed circuit board. Necessary circuits are left on the surfaces 2b and 2a, and through holes a-h are formed in intersecting parts of each circuit by etching and pressing with a cutting tooth. As a result, necessary circuits are formed on the respective surfaces 2b, 2a of the insulating board 2, and the circuits on the respective surfaces 2b, 2b are electrically connected.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a circuit forming structure most suitable for a circuit housed in an electric junction box.

[0002]

2. Description of the Related Art An electrical junction box used for branch connection of an automobile wire harness or the like to various electrical components has a branch connection point concentrated in one place, and the wiring is rationally and economically branched. With the increase in the density of wire harnesses, various types have been developed according to vehicle types or applications.

[0003] As an electric junction box as described above, FIG.
As shown in FIG.
A to 7C are punched out, and each of the bus bars 7A to 7C
The tab terminals 7a and 7b are respectively cut and raised in the vertical direction from the pattern portion of C, and laminated by interposing insulating plates 8A to 8C between the bus bars 7A to 7C, respectively. 9A and a lower case 9B. In addition, 10 is a relay terminal, 11, 1
2 is a relay and a fuse.

Each of the bus bars 7A to 7C has a different pattern shape, so it is necessary to pierce each of the bus bars 7A to 7C with a dedicated press die. Therefore, the manufacturing cost is increased and the electrical connection box of the same model is graded. If they are different, there is no flexibility because the shapes of the pattern portions of the bus bars are different, and moreover, the number of parts of each of the bus bars 7A to 7C increases, so that it is difficult to reduce the size (thinness) and weight.

For this reason, instead of the bus bar, a printed circuit board (PCB) or a flexible printed circuit (FP) is used.
Attempts to adopt C) have been made.

[0006]

However, even when a printed circuit board or a flexible printed circuit is employed, the wiring of the copper foil pattern of each layer must be complicatedly bent due to the circuit configuration. There is a problem that it takes time to design a circuit, which increases the number of design steps, and that even if only one circuit is changed, it is necessary to reconsider the wiring of other circuits, so that it is not possible to quickly respond to the design change.

SUMMARY OF THE INVENTION The present invention has been made to solve the above-mentioned conventional problems, and an object of the present invention is to provide a circuit forming structure which can greatly reduce the number of circuit design steps and can quickly respond to design changes. Is what you do.

[0008]

In order to solve the above-mentioned problems, a first aspect of the present invention is to form a vertical copper foil pattern which is formed on one surface of an insulating plate and extends vertically straight at a predetermined pitch. At the same time, a lateral copper foil pattern extending straight in the horizontal direction at a predetermined pitch is formed on the other surface of the insulating plate, and a proper portion of the copper foil pattern on each surface is removed by etching or pressing with a blade die. And necessary circuits are left, and through holes are drilled at appropriate places at the intersections of the circuits on each side.
An object of the present invention is to provide a circuit formation structure of a printed circuit board, wherein circuits on both sides are electrically connected by the through holes.

According to a first aspect of the present invention, there is provided a circuit forming structure using a printed circuit board, wherein an insulating plate of the printed circuit board has a copper foil pattern extending straight in the vertical and horizontal directions on one side and the other side. Each is simply formed as a common printed circuit board, leaving the necessary circuits on each surface by etching or pressing with a blade mold, and simply drilling through holes at the intersections of each circuit, Necessary circuits can be formed on each surface, and circuits on each surface can be connected.

[0010] The second flexible printed circuit in which a vertical copper foil pattern extending straight in the vertical direction at a predetermined pitch is formed on the insulating film, and the first flexible printed circuit is formed on the insulating film in the horizontal direction at a predetermined pitch. And a second flexible printed circuit on which a lateral copper foil pattern extending in the direction is formed is provided in a laminated state, and an appropriate portion of each copper foil pattern is removed by etching or pressing with a blade mold, so that a necessary circuit is left. At the same time, at an appropriate place at the intersection of the circuits of each flexible printed circuit, a through hole is formed in at least one of the flexible printed circuit circuits and the insulating film, and the through holes are filled with solder,
An object of the present invention is to provide a circuit formation structure of a flexible printed circuit, wherein the circuits of each flexible printed circuit are electrically connected.

A second aspect of the present invention is a circuit formation structure using a flexible printed circuit, wherein a copper foil pattern extending straight in the vertical and horizontal directions is provided on each of the insulating films of the first flexible printed circuit and the second flexible printed circuit. Each is simply formed as a common flexible printed circuit, leaving necessary circuits by etching or pressing with a blade type on the copper foil pattern of each flexible printed circuit, and making a through hole at the intersection of each circuit. By simply filling the through holes with solder, the circuits required for each flexible printed circuit can be formed, and the circuits of each flexible printed circuit can be connected.

According to a third aspect of the present invention, a vertical copper foil pattern is formed on one surface of the insulating plate so as to extend straight in the vertical direction at a predetermined pitch, and on the other surface of the insulating plate, a straight copper pattern is formed on the other surface in the horizontal direction at a predetermined pitch. A horizontal copper foil pattern extending in the direction is formed, a proper portion of the copper foil pattern on each surface is removed by etching or pressing with a blade mold, and a necessary circuit is left. Through holes are drilled in place,
The printed circuit board on which the circuits on both sides are electrically connected by the through holes is provided, and the one copper foil pattern is formed on the insulating film at a predetermined pitch on at least one copper foil pattern side of the printed circuit board. A flexible printed circuit on which a copper foil pattern extending straight in a direction perpendicular to the direction is formed is provided in a laminated state, a proper portion of the copper foil pattern is removed by etching, and a necessary circuit is left. A through hole is formed between the circuit and the insulating film at the intersection of the circuit and the circuit of the printed circuit board, and the through hole and the through hole are filled with solder to form a printed circuit board. Printed circuit board, characterized in that said circuit and the circuit of the flexible printed circuit are electrically connected. There is provided a circuit structure formed of a combination of a flexible printed circuit with.

According to a third aspect of the present invention, there is provided a circuit forming structure formed by a combination of a printed circuit board and a flexible printed circuit, wherein an insulating plate of the printed circuit board is formed on one side and the other side in a vertical and horizontal direction. It is only necessary to form a copper foil pattern extending in the same way, and use this as a common printed circuit board, leaving necessary circuits on each side by etching or pressing with a blade type, and through holes at the intersection of each circuit By simply opening, the necessary circuits can be formed on each surface of the insulating plate, and the circuits on each surface can be connected.

Further, a copper foil pattern which extends straight in a direction orthogonal to one copper foil pattern of the insulating plate of the printed circuit board is simply formed on the insulating film of the flexible printed circuit, and this is formed as a common flexible film. As a printed circuit, it is laminated on a printed circuit board, and the required circuit is left on the copper foil pattern of this flexible printed circuit by etching or pressing with a blade, and the through hole at the intersection of this circuit and the circuit of the printed circuit board is A circuit of a printed circuit board and a circuit of a flexible printed circuit can be connected only by forming a through hole at a location and filling the through hole and the through hole with solder.

As described in claim 4, a terminal is inserted into the through hole and / or the through hole, and solder is filled between the terminal and the through hole and / or the through hole. It can be configured to be electrically connected.

[0016]

Embodiments of the present invention will be described below in detail with reference to the drawings.

FIGS. 1 to 5 show a circuit formation structure using the printed circuit board 1 of the first embodiment.

As shown in FIG. 5, the insulating plate 2 has a solder surface 2
a and the mounting surface 2b are set, the solder surface 2a is a surface on which soldering is performed by flow soldering, and the mounting surface 2b is a surface on which the connector tab terminals 3 and the electronic component terminals are mounted. .

On the solder surface 2a shown in FIGS.
Horizontal copper foil patterns a-1 to a-29 extending straight in the horizontal direction at a predetermined pitch are formed. In addition,
Horizontal copper foil patterns a-1 to a-17 and a-26 to a-
28, the horizontal copper foil patterns a-18 to a-25, and the horizontal copper foil patterns a-29 have different pitches and widths.

The mounting surface 2b shown in FIGS.
Vertical copper foil patterns b-1 to b-14 extending straight in the vertical direction at a predetermined pitch are formed. In addition,
Vertical copper foil patterns b-1, b-2 and b-4 to b-11
And b-13, b-14, vertical copper foil pattern b-3, b
-12 is different in pitch and width.

Then, the printed circuit board 1 as shown in FIG. 1 is used as a common printed circuit board, and as shown in FIG.
a-29 was removed by etching or pressing with a blade die to leave necessary circuits, and as shown in FIG.
Appropriate portions of the vertical copper foil patterns b-1 to b-14 on the mounting surface 2b are removed by etching or pressing with a blade die to leave necessary circuits.

Next, as shown in FIGS. 3A and 3B,
Through holes a to h,... Are formed at appropriate positions at intersections of the respective circuits of the solder surface 2a and the mounting surface 2b, and screw mounting holes 2d are formed at appropriate positions of the insulating plate 2. And the solder surface 2a
Each of the circuits on the mounting surface 2b is copper-plated together with the through-holes a to h,..., As shown in FIG. Each circuit of FIG. 2b is electrically connected.

Thereafter, as shown in FIGS. 4A and 4B,
The insulating layer 2f is coated on the entire surface while forming a land while leaving a circuit around each of the through holes a to h,... Of the solder surface 2a and the mounting surface 2b in a circular shape (see FIG. 5).

In this manner, circuits necessary for the solder surface 2a and the mounting surface 2b of the insulating plate 2 can be formed, and each circuit of the solder surface 2a and the mounting surface 2b can be formed by copper plating of the through holes a to h,. The portion 2e allows electrical connection. The through-holes a to h,..., Into which the connector tab terminals 3 are not inserted as shown in FIG.
In the through holes a to h,... Into which the tab terminals 3 are inserted as shown in (b), the solder m is filled in the through holes a to h,. Therefore, electrical connection is ensured not only by the copper plated portion 2e but also by the solder m.

Then, for example, the mounting surface 2b shown in FIG.
4a is connected to the through hole b by a circuit at the solder surface 2a of FIG. 4A, and the through hole b of the solder surface 2a is connected to the through hole c by the circuit at the mounting surface 2b.
d.

The through hole c of the mounting surface 2b is connected to the through hole e by a circuit on the solder surface 2a, and the through hole d of the mounting surface 2b is connected to the through holes f, g, h by the circuit on the solder surface 2a. Will be done.

According to the first embodiment, the insulating plate 2 of the printed circuit board 1 has the copper foil pattern a extending straight in the horizontal and vertical directions on the solder surface 2a and the mounting surface 2b.
-1 to a-29 and b-1 to b-14 are simply formed, and these are used as a common printed circuit board, and the necessary circuits are left on the respective surfaces 2a and 2b by etching or pressing with a blade die. , Through holes a to h at the intersections of the circuits.
The required circuit can be formed on each surface of the insulating plate 2 and the circuit on each surface 2a, 2b can be connected only by opening the circuit.

Therefore, the copper foil patterns a-1 to a-29 and b-1 to b-14 on the respective surfaces 2a and 2b of the insulating plate 2 of the printed circuit board 1 need to be bent in a complicated manner as in the prior art. The straight lines in the vertical and horizontal directions are no longer required, and only through holes a to h,... Are required at the intersections of the circuits, leaving the necessary circuits by etching or pressing with a blade die. Design man-hours can be greatly reduced, and slight circuit changes can be made simply by etching or pressing with a blade die and changing the positions of the through holes a to h. become.

Further, since various circuits can be arbitrarily designed using the common printed circuit board 1, the manufacturing cost of the printed circuit board 1 can be reduced.

FIGS. 6 to 13 show a circuit formation structure using the flexible printed circuits 5A and 5B of the second embodiment.

As shown in FIG. 13 (a), a flexible printed circuit 5A on the solder surface side and a flexible printed circuit 5B on the mounting surface side are provided. This is a surface on which soldering is performed by soldering, and the flexible printed circuit 5B on the mounting surface side is a surface on which the connector tab terminals 3 and electronic component terminals are mounted.

As shown in FIGS. 6A and 6B, the insulating film 5a of the flexible printed circuit 5A on the solder side has lateral copper foil patterns a-1 to a-a which extend straight in the horizontal direction at a predetermined pitch. -29 is formed. The pitch and width of the lateral copper foil patterns a-1 to a-29 are the first.
The settings are the same as in the embodiment.

The insulating film 5b of the flexible printed circuit 5B on the mounting surface side shown in FIGS. 7A and 7B has longitudinal copper foil patterns b-1 to b extending straight at a predetermined pitch in the vertical direction. -14 is formed. The pitch and width of the vertical copper foil patterns b-1 to b-14 are the first.
The settings are the same as in the embodiment.

The flexible printed circuits 5A and 5B as shown in FIGS. 6 and 7 are used as a common flexible printed circuit, and as shown in FIG. a-2
9 is removed by etching or pressing with a blade die to leave necessary circuits, and as shown in FIG. 9, the vertical copper foil patterns b-1 to b-1 of the flexible printed circuit 5B.
Etch or press with a blade die to remove the appropriate part of 4 to leave necessary circuits.

Then, as shown in FIG. 10, the circuit of the flexible printed circuit 5A on the solder surface side and the circuit of the flexible printed circuit 5A on the solder surface side are properly placed at the intersection of the respective circuits of the flexible printed circuit 5A on the solder surface side and the flexible printed circuit 5B on the mounting surface side. Drill through holes p to w with the insulating film 5a (FIG. 1).
3 (a)).

Further, through holes p to which the tab terminals 3 are inserted are provided.
w, ... are the flexible printed circuit 5B on the mounting surface side
Also, small through holes p ′ to w ′,.
(C)).

Each flexible printed circuit 5A,
A hole 5d for screw attachment is made in an appropriate place of 5B.

Then, as shown in FIGS. 11 and 12,
The circuit around the portion of each of the through holes p to w,... On the circuit surface of the flexible printed circuit on the solder side and the circuit surface of the flexible printed circuit 5B on the mounting surface is left in a circular shape to form a land. Is coated with an insulating layer 5f (see FIG. 13A).

Thereafter, as shown in FIG. 13A, the flexible printed circuit 5A on the solder surface side is laminated on the upper side and the flexible printed circuit 5B on the mounting surface side is laminated on the lower side. In addition, as shown in FIG. 13B, in the flexible printed circuit 5B on the lower mounting surface side, the insulating film 5a of the flexible printed circuit 5A on the solder surface side has the vertical copper foil patterns b-1 to b-14. Overlap, the insulating layer 5
f can be omitted. This eliminates the need for man-hours for coating the insulating layer 5f and eliminates the thickness of the insulating layer 5f, so that the solder m can be smoothly filled by the capillary phenomenon.

In the through holes p to w,... Into which the tab terminals 3 are not inserted as shown in FIG. 13A, the solder m is formed by the capillary phenomenon due to the capillary phenomenon due to the flow soldering from the solder surface side. .., W,..., So that each circuit of the flexible printed circuit 5A on the solder surface side and the flexible printed circuit 5B on the mounting surface side has through holes p to w,.
Electrically connected by the solder m.

Similarly, in the through holes p to w,... In which the tab terminals 3 are inserted as shown in FIG. .. Are filled, the respective circuits of the flexible printed circuit 5A on the solder side and the flexible printed circuit 5B on the mounting side are electrically connected together with the tab terminals 3 by the solder m in the through holes p to w,. Will be done.

For example, the through hole p of the flexible printed circuit 5B on the mounting surface side in FIG. 12 is connected to the through hole q by the circuit of the flexible printed circuit 5A on the solder surface side in FIG. The through hole q of the flexible printed circuit 5A is connected to the through holes r and s by the circuit of the flexible printed circuit 5B on the mounting surface side.

The through hole r of the flexible printed circuit on the mounting surface is connected to the flexible printed circuit 5A on the solder surface.
And the through hole s of the flexible printed circuit 5B on the mounting surface side is connected to the through hole t by the circuit of the flexible printed circuit 5A on the solder surface side.
v, w are connected.

According to the second embodiment, the copper foil pattern extending straight in the vertical and horizontal directions is formed on each of the insulating films 5a of the flexible printed circuit 5A on the solder side and the flexible printed circuit 5B on the mounting side. a-1 to a-
29 and b-1 to b-14, respectively, and these are used as a common flexible printed circuit, and the copper foil patterns a of the flexible printed circuits 5A and 5B are used.
-1 to a-29 and b-1 to b-14, leaving necessary circuits by etching or pressing with a blade die, and making through holes p to w,... ~ W,... Are filled with solder m, and each flexible printed circuit 5
A circuit required for A and 5B can be formed, and a circuit of each flexible printed circuit 5A and 5B can be connected.

Therefore, the flexible printed circuit 5
Copper foil patterns a-1 to a-29 and b-1 to A-5B
As for b-14, it is not necessary to bend complicatedly as in the past, it is good in the vertical and horizontal straight, and it penetrates through the intersection of each circuit leaving the necessary circuit by etching or pressing with a blade type Since it is only necessary to open the holes p to w and fill the solder m, the circuit design man-hour can be greatly reduced, and slight circuit changes can be made by etching and pressing with a blade and through holes p to w, Since it is possible only by changing the position of..., It is possible to quickly respond to a design change.

Further, a common flexible printed circuit 5
Since various circuits can be arbitrarily designed using A and 5B,
The manufacturing cost of the flexible printed circuits 5A and 5B can be reduced.

The flexible printed circuits 5A, 5
B is not limited to two sheets (two layers).

FIG. 14 shows a circuit formation structure by combining the printed circuit board 1 of the third embodiment and the flexible printed circuits 5A and 5B.

The printed circuit board 1 is the same as in the first embodiment, and the flexible printed circuits 5A and 5B are the same as in the second embodiment.

Then, the solder surface 2a of the printed circuit board 1
On the circuit of the lateral copper foil patterns a-1 to a-29 of
The insulating films 5b of the vertical copper foil patterns b-1 to b-14 of the flexible printed circuit 5B on the mounting surface side are laminated. Note that the insulating layer 2f on the solder surface 2a side is unnecessary.

The flexible printed circuits 5A, 5B
, Through holes a to h,... At the intersections of the circuit left by the etching and the press with the blade die and the circuit left by the etching of the printed circuit board 1 and the press with the blade die. , And through holes p to w, and through holes a to h,... Are filled with solder m, and the circuit of the printed circuit board 1 and the flexible printed circuits 5A, 5A
B can be connected to the circuit.

Accordingly, the copper foil patterns a-1 of the printed circuit board 1 and the flexible printed circuits 5A and 5B
~ A-29 and b-1 ~ b-14 do not need to be bent intricately.
It is only necessary to form through-holes ah,... And through holes pw,. As well as making slight circuit changes, etching and pressing with a blade die and through holes a to h, and through holes p to
Since it is possible only by changing the positions of w,..., it is possible to quickly respond to a design change.

Since various circuits can be arbitrarily designed using the common printed circuit board 1 and the flexible printed circuits 5A and 5B, the manufacturing cost of the printed circuit board 1 and the flexible printed circuits 5A and 5B can be reduced. Become.

[0054]

As is apparent from the above description, the first aspect of the present invention is a circuit forming structure using a printed circuit board, and the insulating plate of the printed circuit board has one side and the other side. It is only necessary to form copper foil patterns extending straight in the vertical and horizontal directions, respectively, and use this as a common printed circuit board, leaving the necessary circuits by etching or pressing with a blade die on each surface, By simply forming a through hole at the intersection of the circuits, necessary circuits can be formed on each surface of the insulating plate, and the circuits on each surface can be connected.

Therefore, the copper foil pattern on each side of the printed circuit board does not need to be bent intricately, and can be straight and long in the vertical direction and the horizontal direction. Since it is only necessary to open through holes at the intersections of each circuit, circuit design man-hours can be greatly reduced, and slight circuit changes can be made by simply changing the position of the through holes and pressing with an etching or blade type. As a result, it is possible to respond quickly to design changes. Further, since various circuits can be arbitrarily designed using a common printed circuit board, the manufacturing cost of the printed circuit board can be reduced.

A second aspect of the present invention is a circuit forming structure using a flexible printed circuit, wherein a copper foil pattern extending straight in the vertical and horizontal directions is provided on each of the insulating films of the first flexible printed circuit and the second flexible printed circuit. Each is simply formed as a common flexible printed circuit, leaving necessary circuits by etching or pressing with a blade type on the copper foil pattern of each flexible printed circuit, and making a through hole at the intersection of each circuit. By simply filling the through holes with solder, the circuits required for each flexible printed circuit can be formed, and the circuits of each flexible printed circuit can be connected.

Therefore, each copper foil pattern of the flexible printed circuit does not need to be bent intricately, and can be straight and long in the vertical and horizontal directions. It is only necessary to open a through hole at the intersection of the solder and fill it with solder, so the circuit design man-hour can be greatly reduced, and a slight circuit change can be done simply by changing the position of the through hole and pressing with an etching or blade type Therefore, it is possible to quickly respond to a design change. Further, since various circuits can be arbitrarily designed using a common flexible printed circuit, the manufacturing cost of the flexible printed circuit can be reduced.

According to a third aspect of the present invention, there is provided a circuit forming structure comprising a combination of a printed circuit board and a flexible printed circuit, wherein an insulating plate of the printed circuit board is formed on one side and the other side in a vertical and horizontal direction. It is only necessary to form a copper foil pattern extending in the same way, and use this as a common printed circuit board, leaving necessary circuits on each side by etching or pressing with a blade type, and through holes at the intersection of each circuit By simply opening, the necessary circuits can be formed on each surface of the insulating plate, and the circuits on each surface can be connected.

Further, a copper foil pattern extending straight in a direction perpendicular to one of the copper foil patterns of the insulating plate of the printed circuit board is simply formed on the insulating film of the flexible printed circuit. As a printed circuit, it is laminated on a printed circuit board, and the required circuit is left on the copper foil pattern of this flexible printed circuit by etching or pressing with a blade, and the through hole at the intersection of this circuit and the circuit of the printed circuit board is A circuit of a printed circuit board and a circuit of a flexible printed circuit can be connected only by forming a through hole at a location and filling the through hole and the through hole with solder.

Therefore, each of the copper foil patterns of the printed circuit board and the flexible printed circuit does not need to be bent in a complicated manner, and can be made straight in the vertical direction and the horizontal direction. It is only necessary to leave a through hole and a through hole at the intersection of each circuit and fill with solder, so that the circuit design man-hour can be greatly reduced and slight circuit changes can be made by etching and through holes and through holes. Since it is possible only by changing the position, it is possible to quickly respond to a design change. Also,
Since various circuits can be arbitrarily designed using a common printed circuit board and a flexible printed circuit, the manufacturing cost of the printed circuit board and the flexible printed circuit can be reduced.

[Brief description of the drawings]

FIG. 1 is a common printed circuit board according to a first embodiment of the present invention, wherein (a) is a front view of a solder surface, (b) is a side view, and (c) is a front view of a mounting surface.

FIG. 2 is a printed circuit board pressed by etching or a blade die, wherein (a) is a front view of a solder surface, and (b) is a front view of a mounting surface.

3A and 3B are printed circuit boards with through holes, wherein FIG. 3A is a front view of a solder surface, and FIG. 3B is a front view of a mounting surface.

FIG. 4 is a printed circuit board coated with an insulating layer, (a) is a front view of a solder surface, and (b) is a front view of a mounting surface.

FIGS. 5A and 5B are through-holes, in which FIG. 5A is a side sectional view in which solder is filled, and FIG. 5B is a side sectional view in which a terminal is inserted and solder is filled.

FIG. 6 is a common flexible printed circuit on the solder side according to the second embodiment, wherein (a) is a front view of the solder side,
(B) is a side view.

7A and 7B show a common flexible printed circuit on the mounting surface side, wherein FIG. 7A is a front view of a solder surface, and FIG. 7B is a side view.

FIG. 8 is a front view of the flexible printed circuit on the solder side pressed by etching or a blade die.

FIG. 9 is a front view of the flexible printed circuit on the mounting surface side pressed by etching or a blade die.

FIG. 10 is a front view of the flexible printed circuit on the solder surface side with a through hole.

FIG. 11 is a front view of the flexible printed circuit on the solder side coated with an insulating layer.

FIG. 12 is a front view of a flexible printed circuit on a mounting surface side coated with an insulating layer.

13A and 13B are through-holes, in which FIG. 13A is a cross-sectional side view in which solder is filled, FIG. 13B is a cross-sectional side view in which an insulating layer of a flexible printed circuit on a mounting surface side is omitted, and FIG. It is a side sectional view which filled up with solder.

14A and 14B are combinations of a printed circuit board and a flexible printed circuit according to the third embodiment, wherein FIG. 14A is a side sectional view in which solder is filled, and FIG. 14B is a side sectional view in which terminals are inserted and solder is filled. is there.

FIG. 15 is a perspective view of a conventional bus bar manufacturing process.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Printed circuit board 2 Insulating board 2a Solder surface 2b Mounting surface 3 Tab terminal 5A, 5B Flexible printed circuit 5a, 5b Insulating film a-1 to a-29 Horizontal copper foil pattern b-1 to b-14 Vertical copper foil Pattern ah through hole pw through hole

Continued on the front page (72) Inventor Ryuharu Nakanishi 1-7-10 Kikuzumi, Minami-ku, Nagoya-shi, Aichi F-term in Harness Research Institute, Inc. (Reference) 5E077 BB12 BB33 CC14 CC16 CC22 CC26 DD02 JJ05 JJ11 JJ20 JJ23 5E317 AA24 BB03 BB11 CC08 CC15 CC25 CD27 GG16 GG20 5E338 AA02 AA12 BB03 BB13 BB25 BB75 CC01 CD02 CD13 CD33 EE31 5E346 AA22 AA42 BB01 BB16 CC40 EE42 FF18 FF33 GG25 HH31 HH33

Claims (4)

[Claims] A vertical copper foil pattern is formed on one surface of an insulating plate and extends straight at a predetermined pitch in a vertical direction, and extends straight and horizontally at a predetermined pitch on the other surface of the insulating plate. A horizontal copper foil pattern is formed, and the appropriate part of the copper foil pattern on each side is removed by etching or pressing with a blade mold, leaving the necessary circuits, and through the right part at the intersection of the circuits on each side. A circuit forming structure for a printed circuit board, characterized in that holes are opened and circuits on both sides are electrically connected by the through holes. 2. A first flexible printed circuit in which a vertical copper foil pattern extending straight in a vertical direction at a predetermined pitch is formed on an insulating film, and a straight straight extending in a horizontal direction at a predetermined pitch on the insulating film. The second flexible printed circuit on which the horizontal copper foil pattern is formed is provided in a laminated state, and the appropriate circuit of each copper foil pattern is removed by etching or pressing with a blade mold to leave a necessary circuit, At an appropriate place at the intersection of the circuits of each flexible printed circuit, a through hole is formed in at least one of the flexible printed circuit circuits and the insulating film,
A circuit forming structure for a flexible printed circuit, wherein the circuits of the flexible printed circuits are electrically connected by filling the through holes with solder. 3. A vertical copper foil pattern is formed on one surface of the insulating plate so as to extend straight in the vertical direction at a predetermined pitch, and extends straight on the other surface of the insulating plate in the horizontal direction at a predetermined pitch. A horizontal copper foil pattern is formed, and the appropriate part of the copper foil pattern on each side is removed by etching or pressing with a blade mold, leaving the necessary circuits, and through the right part at the intersection of the circuits on each side. A hole is provided, and a printed circuit board on which the circuits on both sides are electrically connected by the through hole is provided, and on the copper foil pattern side of at least one of the printed circuit board, the insulating film is formed at a predetermined pitch. A flexible printed circuit in which a copper foil pattern extending straight in a direction orthogonal to one copper foil pattern is formed is provided in a laminated state. The necessary circuit is left by etching or pressing with a blade die, and a through hole is formed between this circuit and the insulating film at the through hole at the intersection of this circuit and the circuit on the printed circuit board. The printed circuit board and the flexible printed circuit are characterized in that the circuit of the printed circuit board and the circuit of the flexible printed circuit are electrically connected by filling the through hole and the through hole with solder. The circuit formation structure which combined. 4. A circuit is electrically connected by inserting a terminal into the through hole and / or the through hole and filling a solder between the terminal and the through hole and / or the through hole. The circuit forming structure according to claim 1, wherein: