JP2000353713A - Resin-molded electronic component - Google Patents
Resin-molded electronic componentInfo
- Publication number
- JP2000353713A JP2000353713A JP11166216A JP16621699A JP2000353713A JP 2000353713 A JP2000353713 A JP 2000353713A JP 11166216 A JP11166216 A JP 11166216A JP 16621699 A JP16621699 A JP 16621699A JP 2000353713 A JP2000353713 A JP 2000353713A
- Authority
- JP
- Japan
- Prior art keywords
- resin
- electronic component
- substrate
- edge
- molded
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、基板に電子部品素
子を搭載し、それら全体を樹脂モールド（トランスファ
モールド等）成形した樹脂モールド成形電子部品に関す
る。特に基板縁辺とモールド樹脂外面との間の寸法が小
さい（肉厚が薄い）樹脂モールド成形電子部品に用いて
好適である。適用対象の部品としてはＬＡＮ用ＬＣモジ
ュール、パルストランス、ＨＩＣ等があげられる。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a resin-molded electronic component in which electronic components are mounted on a substrate and the whole is molded with a resin mold (such as a transfer mold). Particularly, it is suitable for use in a resin molded electronic component in which the dimension between the edge of the substrate and the outer surface of the molded resin is small (thin wall thickness). The parts to be applied include an LC module for LAN, a pulse transformer, an HIC, and the like.
【０００２】[0002]
【従来の技術】この種の樹脂モールド成形電子部品は、
プリント基板上に電子部品素子を実装するとともにリー
ド端子を取り付けた後、それらのプリント基板及び電子
部品素子を覆う外装体（パッケージ）を金型を用いて樹
脂成形（例えばトランスファモールド成形）していた。2. Description of the Related Art This type of resin molded electronic component is
After mounting the electronic component elements on the printed circuit board and attaching the lead terminals, the exterior body (package) covering the printed circuit board and the electronic component elements was resin-molded (for example, transfer molding) using a mold. .
【０００３】また、公知技術として特開昭５８−２２３
３０６号公報に示すリードレス型固定インダクタの製造
方法は、コイルとコアとを樹脂モールドするものであ
る。この公報に記載されたインダクタは、プリント基板
を用いるものではなく、矩形板状のつばを有するコアに
巻線を施すとともに端子形成後、コア上側のコイルをモ
ールドしたものであり、コア底部の板状のつば部に切欠
を有している。しかし、このインダクタの構造は裏面に
モールド樹脂が存在せず、切欠はコイルのリード引き出
しのために設けられており、樹脂モールドには関係して
いない。Further, as a known technique, Japanese Patent Application Laid-Open No. 58-223
The method of manufacturing a leadless fixed inductor disclosed in Japanese Patent Publication No. 306 discloses resin molding of a coil and a core. The inductor described in this publication does not use a printed circuit board, but is formed by applying a winding to a core having a rectangular plate-shaped flange and forming a terminal, and then molding the coil on the upper side of the core. It has a notch in its flange. However, in this inductor structure, no mold resin is present on the back surface, and the notch is provided for leading out the coil lead, and is not related to the resin mold.
【０００４】さらに、別の公知技術として特開平８−１
８６９７８号公報に示す複合フェライトモールドＤＣ／
ＤＣコンバータは、プリント基板上に搭載した各種部品
を複合フェライトでモールドした構造である。この場
合、プリント基板の上側のみをモールドする構造であ
り、プリント基板に形成された穴はプリント基板に対す
る複合フェライトの付着力を増大させる目的である。Further, another known technique is disclosed in Japanese Unexamined Patent Publication No.
No. 86978 discloses a composite ferrite mold DC /
The DC converter has a structure in which various components mounted on a printed circuit board are molded with composite ferrite. In this case, only the upper side of the printed board is molded, and the holes formed in the printed board are intended to increase the adhesive force of the composite ferrite to the printed board.
【０００５】[0005]
【発明が解決しようとする課題】ところで、近年、電子
部品分野において、部品の小型化の要求が強く、樹脂モ
ールド成形電子部品に内蔵される電子部品素子及びこれ
らを搭載するプリント基板の小型化が進められている。
しかし、内部のプリント基板縁辺から外装体外面に至る
樹脂モールド厚みを薄くして、小型化を計ろうとする
と、ユーザが各種装置のプリント基板へ樹脂モールド成
形電子部品を実装する際のはんだリフローによる熱応力
によって、図７のように電子部品素子（図示省略）及び
プリント基板６１を覆う外装体（パッケージ）６２をト
ランスファモールドしてなる樹脂モールド成形電子部品
の内部基板縁辺部にパッケージクラック６５が発生する
という問題があった（とくにリード端子６３の付け根の
近傍部分に発生しやすい）。このため、プリント基板縁
辺から外装体外面に至るまでのモールド樹脂の厚みを所
定寸法確保する必要があり、これが樹脂モールド成形電
子部品の小型化の障害の一つとなっていた。In recent years, in the field of electronic components, there has been a strong demand for miniaturization of components, and electronic component elements incorporated in resin-molded electronic components and printed circuit boards on which these are mounted have been reduced in size. Is underway.
However, in order to reduce the size of the resin mold from the inner edge of the printed circuit board to the outer surface of the outer package to reduce the size, the heat generated by solder reflow when the user mounts the resin molded electronic component on the printed circuit board of various devices Due to the stress, as shown in FIG. 7, a package crack 65 is generated on the edge of the internal substrate of the resin-molded electronic component obtained by transfer-molding the exterior component (package) 62 covering the electronic component element (not shown) and the printed board 61. (Especially, it is likely to occur near the base of the lead terminal 63). For this reason, it is necessary to ensure a predetermined thickness of the mold resin from the edge of the printed board to the outer surface of the exterior body, which has been one of the obstacles to downsizing the resin molded electronic component.
【０００６】本発明は、上記の点に鑑み、内蔵基板縁辺
から外装体外面に至るモールド樹脂の厚みを薄くした場
合であってもパッケージクラックの発生を防止し、小型
で、信頼性の高い樹脂モールド成形電子部品を提供する
ことを目的とする。In view of the above, the present invention prevents the occurrence of package cracks even when the thickness of the mold resin from the edge of the built-in substrate to the outer surface of the exterior body is reduced, and provides a small, highly reliable resin. An object of the present invention is to provide a molded electronic component.
【０００７】本発明のその他の目的や新規な特徴は後述
の実施の形態において明らかにする。[0007] Other objects and novel features of the present invention will be clarified in embodiments described later.
【０００８】[0008]
【課題を解決するための手段】上記目的を達成するため
に、本発明は、基板に電子部品素子を搭載し、前記基板
及び前記電子部品素子を覆う外装体を樹脂モールド成形
した樹脂モールド成形電子部品において、前記基板は縁
辺乃至縁辺近傍に切欠部又は穴部を有し、該切欠部又は
穴部に前記外装体を構成する樹脂が入り込んで、前記基
板に対し上側の樹脂部分と下側の樹脂部分とが前記切欠
部又は穴部を介して連続していることを特徴としてい
る。SUMMARY OF THE INVENTION In order to achieve the above object, the present invention provides a resin molded electronic device in which an electronic component element is mounted on a substrate and an exterior body covering the substrate and the electronic component element is resin molded. In the component, the substrate has a notch or a hole near the edge or the edge, and the resin forming the exterior body enters the notch or the hole, and the upper resin portion and the lower portion of the substrate with respect to the substrate. It is characterized in that a resin portion is continuous through the notch or the hole.
【０００９】前記樹脂モールド成形電子部品において、
前記基板の縁辺から前記外装体を構成する樹脂の外面迄
の寸法が０.５〜１mmであって、前記切欠部が前記縁辺
に開口し深さが０.５〜１mmの半円状であるとよい。あ
るいは、前記基板の縁辺から前記外装体を構成する樹脂
の外面迄の寸法が０.５〜１mmであって、前記穴部が前
記縁辺近傍に位置し穴部開口面積が０.４〜１mm２であ
る構成としてもよい。In the above resin molded electronic component,
The dimension from the edge of the substrate to the outer surface of the resin constituting the exterior body is 0.5 to 1 mm, and the cutout is a semicircle having an opening at the edge and a depth of 0.5 to 1 mm. Good. Alternatively, the dimension from the edge of the substrate to the outer surface of the resin constituting the exterior body is 0.5 to 1 mm, the hole is located near the edge, and the opening area of the hole is 0.4 to 1 mm 2. May be adopted.
【００１０】[0010]
【発明の実施の形態】以下、本発明に係る樹脂モールド
成形電子部品の実施の形態を図面に従って説明する。DESCRIPTION OF THE PREFERRED EMBODIMENTS Embodiments of a resin molded electronic component according to the present invention will be described below with reference to the drawings.
【００１１】図１乃至図４は本発明の第１の実施の形態
であって４素子のパルストランスの例を示す。これらの
図において、１はプリント基板で、例えば縦、横、厚み
がそれぞれ８.８mm、２４.７mm、０.５mmであってガラ
ス−エポキシ製であり、その縁辺乃至縁辺近傍には当該
プリント基板縁辺に開口した半円状切欠部２が複数箇所
(図示の場合各長辺に３箇所づつ均等に)形成されてい
る。切欠部２の開口寸法Ｌは１〜２mm、深さ寸法ｄは
０.５〜１mmである。例えば、切欠部２の配置はリード
端子配列位置の中間又は端子近傍が好ましい。FIGS. 1 to 4 show a first embodiment of the present invention and show an example of a four-element pulse transformer. In these figures, reference numeral 1 denotes a printed circuit board, for example, which is 8.8 mm, 24.7 mm, and 0.5 mm in thickness, respectively, and is made of glass-epoxy. A plurality of semicircular cutouts 2 opened on the edge
(Each of the long sides in the case of FIG. 3 is equally formed). The opening dimension L of the notch 2 is 1-2 mm, and the depth dimension d is 0.5-1 mm. For example, the arrangement of the notch 2 is preferably in the middle of the lead terminal arrangement position or near the terminal.
【００１２】このプリント基板１上には電子部品素子と
してのパルストランス本体１０が４個搭載、固定されて
いる。各パルストランス本体１０はトロイダルコア１１
に必要個数の巻線１２を設けたものである。プリント基
板１の両側には必要個数のガルウィングタイプのリード
端子２０がそれぞれ固着されており、さらにリード端子
２０と各巻線１２の端末とを接続する導体パターン（図
示省略）が当該プリント基板１に形成されている。な
お、プリント基板１上の各トロイダルコア１１は周囲が
シリコン樹脂でポッティングされている。On the printed board 1, four pulse transformer bodies 10 as electronic component elements are mounted and fixed. Each pulse transformer body 10 has a toroidal core 11
Provided with a required number of windings 12. A required number of gull-wing type lead terminals 20 are respectively fixed to both sides of the printed board 1, and a conductor pattern (not shown) for connecting the lead terminals 20 and the terminals of the respective windings 12 is formed on the printed board 1. Have been. The periphery of each toroidal core 11 on the printed circuit board 1 is potted with silicone resin.
【００１３】そして、上述のパルストランス本体１０、
プリント基板１の全体をエポキシ樹脂でモールド成形
（トランスファモールド成形）することで外装体（パッ
ケージ）３０が形成され、この外装体３０の側面より前
記ガルウィングタイプのリード端子２０がそれぞれ突出
している。この外装体３０の成形の際、プリント基板１
の縁辺乃至縁辺近傍の切欠部２に外装体３０を構成する
モールド樹脂３１が入り込んで、プリント基板１に対し
上側の樹脂部分と下側の樹脂部分とが切欠部２を介して
連続することになり、プリント基板上下間（特にクラッ
クの発生しやすかった基板縁辺付近）の樹脂の結合強度
が高まり、プリント基板縁辺と外装体外面（モールド樹
脂外面）間の寸法（肉厚）Ｔを薄くしてもクラックが発
生しにくい構造となる。このため、プリント基板１の縁
辺部から外装体外面（モールド樹脂外面）迄の寸法（肉
厚）は１mm以下、とくに０.５mm程度にまで縮小でき、
外形寸法の小型化を図ることができる。例えば、内蔵す
るプリント基板１の縦、横、厚みを前記したようにそれ
ぞれ８.８mm、２４.７mm、０.５mmとしたとき、外装体
３０の縦、横、厚みを９.８mm、２５.７mm、５.７５mm
とすることができる。また、外装体３０のクラックの発
生を防止できることから、信頼性向上（特に初期不良の
低減）、歩留まり向上、コスト低減を図ることが可能と
なる。The above-mentioned pulse transformer body 10,
An exterior body (package) 30 is formed by molding (transfer molding) the entire printed circuit board 1 with epoxy resin, and the gull-wing type lead terminals 20 protrude from side surfaces of the exterior body 30, respectively. When forming the exterior body 30, the printed circuit board 1
The mold resin 31 forming the exterior body 30 enters the notch 2 at or near the edge of the printed circuit board 1, and the upper resin portion and the lower resin portion are continuous with the printed board 1 via the notch 2. The bonding strength of the resin between the top and bottom of the printed circuit board (particularly near the edge of the board where cracks are likely to occur) is increased, and the dimension (thickness) T between the edge of the printed circuit board and the outer surface of the exterior body (mold resin outer surface) is reduced. This also has a structure in which cracks are unlikely to occur. For this reason, the dimension (thickness) from the edge of the printed circuit board 1 to the outer surface of the outer package (outer surface of the mold resin) can be reduced to 1 mm or less, particularly to about 0.5 mm.
External dimensions can be reduced in size. For example, when the length, width, and thickness of the built-in printed circuit board 1 are 8.8 mm, 24.7 mm, and 0.5 mm, respectively, as described above, the length, width, and thickness of the exterior body 30 are 9.8 mm and 25. 7mm, 5.75mm
It can be. In addition, since the occurrence of cracks in the exterior body 30 can be prevented, it is possible to improve reliability (especially, reduce initial defects), improve yield, and reduce costs.
【００１４】なお、半円状の切欠部２の開口寸法Ｌは１
〜２mm、深さ寸法ｄは０.５〜１mmの範囲内が望まし
く、切欠部２の開口寸法Ｌが１mm未満、深さ寸法ｄが
０.５mmであると、プリント基板１を成形用金型内に配
置して樹脂モールドする際に切欠部２内に樹脂が侵入し
にくくなるため好ましくない。また、開口寸法Ｌが２mm
を超え、深さ寸法ｄが１mmを超えると、寸法が過大とな
ってプリント基板への端子配置や電子部品素子配置に不
都合が発生して小型化への支障となる。The semicircular notch 2 has an opening dimension L of 1
When the opening dimension L of the notch 2 is less than 1 mm and the depth dimension d is 0.5 mm, the printed circuit board 1 is formed into a molding die. It is not preferable because the resin hardly penetrates into the cutout portion 2 when the resin is molded by being arranged in the inside. Also, the opening dimension L is 2 mm
When the depth dimension d exceeds 1 mm, the dimension becomes excessively large, causing inconvenience in the arrangement of terminals on a printed circuit board and the arrangement of electronic component elements, which hinders miniaturization.
【００１５】この第１の実施の形態に示したパルストラ
ンス（プリント基板の縦、横、厚み：８.８mm、２４.７
mm、０.５mm、外装体の縦、横、厚み：９.８mm、２５.
７mm、５.７５m）を５０個作製し、下記条件で加湿した
直後、別の基板に２回リフロー実装を行った。結果は下
記の表１の通りである。比較のためプリント基板に切欠
部を形成しない点を除き前述のパルストランスと同様の
従来品に対し、同様の加湿、リフローを行った結果も併
記した（パッケージクラックはリフロー前に部品が湿っ
ていると発生し易いため加湿を行った。）。The pulse transformer shown in the first embodiment (length, width, and thickness of the printed board: 8.8 mm, 24.7
mm, 0.5 mm, length, width, and thickness of the exterior body: 9.8 mm, 25.
(7 mm, 5.75 m) were produced, and immediately after humidification under the following conditions, reflow mounting was performed twice on another substrate. The results are as shown in Table 1 below. For comparison, the results of the same humidification and reflow performed on the same conventional product as the above-described pulse transformer except that no cutout portion is not formed on the printed circuit board are also shown (in the case of a package crack, the component is wet before reflow). And humidification was performed because it easily occurs.)
【００１６】 表１ 本発明の第１の実施の形態 ５０個全てにクラック発生無し 従来品 ５０個中４５個にクラック発生 （但し、０.７mm未満のクラックはカウントせず） 加湿条件：気温８５℃、湿度８５％雰囲気中に４８時間放置 リフロー条件： １回目：ピーク温度１２５℃、２０秒 ２回目：ピーク温度２１５℃、２０秒Table 1 First embodiment of the present invention No cracks occurred in all 50 cracks Conventional cracks occurred in 45 out of 50 cracks (however, cracks less than 0.7 mm were not counted) Humidification conditions: temperature 85 ° C, humidity 85% Left in an atmosphere for 48 hours. Reflow conditions: First time: peak temperature 125 ° C, 20 seconds Second time: peak temperature 215 ° C, 20 seconds
【００１７】この第１の実施の形態によれば、プリント
基板に切欠部の無い従来品ではリフロー後のクラック発
生が多発したような条件であっても、クラック発生を皆
無にすることができ、プリント基板縁辺と外装体外面間
の肉厚Ｔが薄い場合の信頼性及び歩留まりを大きく向上
させ得ることが判る。According to the first embodiment, in the conventional product having no cutout in the printed circuit board, cracks can be completely eliminated even under the condition that cracks frequently occur after reflow. It can be seen that the reliability and yield can be greatly improved when the thickness T between the edge of the printed circuit board and the outer surface of the exterior body is small.
【００１８】図５は本発明の第２の実施の形態であっ
て、外装体３０に内蔵されるプリント基板１の縁辺乃至
縁辺近傍に三角形状切欠部４２を複数箇所均等に形成し
たものである。三角形状切欠部４２の開口寸法Ｌは１〜
２mm、深さ寸法ｄは０.５〜１mmであることが望まし
い。その他の構成は前述の第１の実施の形態と同様であ
る。FIG. 5 shows a second embodiment of the present invention, in which a plurality of triangular cutouts 42 are uniformly formed at the edge or near the edge of the printed circuit board 1 incorporated in the exterior body 30. . The opening dimension L of the triangular notch 42 is 1 to
It is desirable that the depth d be 2 mm and the depth d be 0.5 to 1 mm. Other configurations are the same as those of the first embodiment.
【００１９】この第２の実施の形態においても、外装体
３０のモールド成形の際に、プリント基板１に対し上側
の樹脂部分と下側の樹脂部分とが三角形状切欠部４２を
介して連続することになり、プリント基板上下間の樹脂
の結合強度が高まり、プリント基板縁辺と外装体外面
（モールド樹脂外面）間の寸法（肉厚）を薄くしてもク
ラックが発生しにくい構造となり、第１の実施の形態と
同様の作用効果が得られる。Also in the second embodiment, the upper resin portion and the lower resin portion of the printed circuit board 1 are connected to each other via the triangular cutout 42 when the exterior body 30 is molded. As a result, the resin bonding strength between the upper and lower sides of the printed circuit board is increased, and even if the dimension (thickness) between the edge of the printed circuit board and the outer surface of the outer package (outer surface of the mold resin) is reduced, cracks are hardly generated. The same operation and effect as those of the embodiment can be obtained.
【００２０】図６は本発明の第３の実施の形態であっ
て、外装体３０に内蔵されるプリント基板１の縁辺近傍
に丸穴部５２を複数箇所均等に形成したものである。丸
穴部５２の開口面積は０.４〜１mm２であることが望ま
しい。その他の構成は前述の第１の実施の形態と同様で
ある。なお、丸穴部５２の開口面積が０.４mm２未満で
あるとモールド樹脂が穴部に侵入しにくく、基板上下の
樹脂間を確実に連続させることができなくなる危険性が
でてくる。また、丸穴部５２の開口面積が１mm２を超え
ると穴部径が過大となって、小型化の支障となる。その
他の構成は前述の第１の実施の形態と同様である。FIG. 6 shows a third embodiment of the present invention, in which a plurality of round holes 52 are uniformly formed in the vicinity of the edge of the printed circuit board 1 built in the exterior body 30. The opening area of the round hole 52 is desirably 0.4 to 1 mm 2 . Other configurations are the same as those of the first embodiment. If the opening area of the round hole portion 52 is less than 0.4 mm 2 , the mold resin is difficult to enter the hole portion, and there is a risk that the resin between the upper and lower substrates cannot be reliably connected. On the other hand, if the opening area of the round hole 52 exceeds 1 mm 2 , the diameter of the hole becomes excessively large, which hinders downsizing. Other configurations are the same as those of the first embodiment.
【００２１】この第３の実施の形態においても、外装体
３０のモールド成形の際に、プリント基板１に対し上側
の樹脂部分と下側の樹脂部分とが丸穴部５２を介して連
続することになり、プリント基板上下間の樹脂の結合強
度が高まり、プリント基板縁辺と外装体外面（モールド
樹脂外面）間の寸法（肉厚）を薄くしてもクラックが発
生しにくい構造となり、第１の実施の形態と同様の作用
効果が得られる。Also in the third embodiment, the upper resin portion and the lower resin portion are continuous with the printed circuit board 1 via the round hole 52 when the exterior body 30 is molded. , The bonding strength of the resin between the upper and lower sides of the printed circuit board is increased, and even if the dimension (thickness) between the edge of the printed circuit board and the outer surface of the exterior body (outer surface of the mold resin) is reduced, a structure in which cracks hardly occur is obtained. The same operation and effect as the embodiment can be obtained.
【００２２】本発明は基板を内蔵した樹脂モールド成形
電子部品であれば適用でき、ＬＣモジュール、ＨＩＣそ
の他種々の部品に応用可能である。The present invention can be applied to any resin-molded electronic component having a built-in substrate, and can be applied to LC modules, HICs, and other various components.
【００２３】端子の形状はＳＩＰ，ＤＩＰ型、面実装
型、基板挿入型いずれでも良い。The shape of the terminal may be any of SIP, DIP type, surface mounting type, and substrate insertion type.
【００２４】外装体に内蔵される基板はガラス−エポキ
シ樹脂の他、他の樹脂基板、アルミナその他のセラミッ
ク基板、金属基板でも良い。The substrate incorporated in the exterior body may be a glass-epoxy resin, other resin substrate, alumina or other ceramic substrate, or a metal substrate.
【００２５】本発明で使用可能なモールド材料は特に問
わないが、エポキシ系、ポリエステル系等の加湿するこ
とによりリフローの熱ストレスによりクラックが生じや
すいものに適用することで特に良好な結果が得られる。The mold material usable in the present invention is not particularly limited, but particularly good results can be obtained by applying it to an epoxy-based or polyester-based material which is susceptible to cracks due to thermal stress of reflow by humidification. .
【００２６】切欠部又は穴部は基板縁辺に近い程望まし
く、縁辺に開口していれば、みかけ上樹脂肉厚を大きく
できるので望ましい。切欠部は第１、第２の実施の形態
での半円形状、三角形状の他に、多角形状であってもよ
い。また、穴部は第３の実施の形態での丸穴部の他に角
穴部としてもよい。切欠部、穴部の大きさはモールド樹
脂が侵入できる大きさであればよい。The notch or hole is preferably as close as possible to the edge of the substrate, and it is desirable to open the edge so that the apparent resin thickness can be increased. The cutout may have a polygonal shape in addition to the semicircular shape and the triangular shape in the first and second embodiments. The hole may be a square hole in addition to the round hole in the third embodiment. The size of the notch and the hole may be any size as long as the mold resin can enter.
【００２７】以上本発明の実施の形態について説明して
きたが、本発明はこれに限定されることなく請求項の記
載の範囲内において各種の変形、変更が可能なことは当
業者には自明であろう。Although the embodiments of the present invention have been described above, it is obvious to those skilled in the art that the present invention is not limited to the embodiments and various modifications and changes can be made within the scope of the claims. There will be.
【００２８】[0028]
【発明の効果】以上説明したように、本発明に係る樹脂
モールド成形電子部品によれば、樹脂モールドで形成さ
れた外装体に内蔵される基板の縁辺乃至縁辺近傍に切欠
部又は穴部を形成したので、該切欠部又は穴部に前記外
装体を構成する樹脂が入り込んで、前記基板に対し上側
の樹脂部分と下側の樹脂部分とが前記切欠部又は穴部を
介して連続することになり、クラックの発生しやすかっ
た基板縁辺近くの基板上下間の樹脂の結合強度を高め
て、クラックの発生しにくい構造とすることができる。
このため、信頼性、歩留まり向上を図るとともに、基板
縁辺と外装体外面（モールド樹脂外面）間の寸法（肉
厚）を薄くして小型化を図りあわせてコスト低減を図り
得る。As described above, according to the resin-molded electronic component of the present invention, the notch or the hole is formed at the edge or near the edge of the substrate built in the outer package formed by the resin mold. Therefore, the resin constituting the exterior body enters the notch or the hole, and the upper resin portion and the lower resin portion with respect to the substrate continue through the notch or the hole. Thus, it is possible to increase the bonding strength of the resin between the upper and lower portions of the substrate near the edge of the substrate where cracks are easily generated, and to achieve a structure in which cracks are unlikely to be generated.
Therefore, the reliability and the yield can be improved, and the size (thickness) between the edge of the substrate and the outer surface of the outer package (outer surface of the mold resin) can be reduced to reduce the size and reduce the cost.
【図１】本発明に係る樹脂モールド成形電子部品の第１
の実施の形態であって要部構成を示す平面図である。FIG. 1 is a first view of a resin molded electronic component according to the present invention.
FIG. 2 is a plan view showing a configuration of a main part of the embodiment.
【図２】第１の実施の形態における一部を断面とした平
面図である。FIG. 2 is a plan view showing a part of the first embodiment in cross section.
【図３】同正面図である。FIG. 3 is a front view of the same.
【図４】同じく一部を断面とした側面図である。FIG. 4 is a side view showing a part of the cross section.
【図５】本発明の第２の実施の形態であって要部構成を
示す平面図である。FIG. 5 is a plan view showing a configuration of a main part according to a second embodiment of the present invention.
【図６】本発明の第３の実施の形態であって要部構成を
示す平面図である。FIG. 6 is a plan view showing a configuration of a main part according to a third embodiment of the present invention.
【図７】従来の樹脂モールド成形電子部品におけるクラ
ック発生の様子を示す側断面図である。FIG. 7 is a side sectional view showing a state of occurrence of cracks in a conventional resin molded electronic component.
１，６１ プリント基板 ２ 半円状切欠部 １０ パルストランス本体 １１ トロイダルコア １２ 巻線 ２０ リード端子 ３０，６２ 外装体 ３１ モールド樹脂 ４２ 三角形状切欠部 ５２ 丸穴部 ６５ パッケージクラック 1,61 Printed circuit board 2 Semicircular notch 10 Pulse transformer body 11 Toroidal core 12 Winding 20 Lead terminal 30,62 Outer body 31 Mold resin 42 Triangular notch 52 Round hole 65 Package crack
Claims (3)
及び前記電子部品素子を覆う外装体を樹脂モールド成形
した樹脂モールド成形電子部品において、前記基板は縁
辺乃至縁辺近傍に切欠部又は穴部を有し、該切欠部又は
穴部に前記外装体を構成する樹脂が入り込んで、前記基
板に対し上側の樹脂部分と下側の樹脂部分とが前記切欠
部又は穴部を介して連続していることを特徴とする樹脂
モールド成形電子部品。1. A resin-molded electronic component in which an electronic component element is mounted on a substrate and an exterior body covering the substrate and the electronic component element is resin-molded, wherein the substrate has a notch or a hole at or near an edge. The resin constituting the exterior body enters the notch or the hole, and the upper resin portion and the lower resin portion with respect to the substrate are continuously connected through the notch or the hole. A resin molded electronic component characterized by the following:
る樹脂の外面迄の寸法が０.５〜１mmであって、前記切
欠部は前記縁辺に開口し深さが０.５〜１mmの半円状で
ある請求項１記載の樹脂モールド成形電子部品。2. The semiconductor device according to claim 1, wherein a dimension from an edge of the substrate to an outer surface of a resin constituting the exterior body is 0.5 to 1 mm, and the cutout portion is open to the edge and has a depth of 0.5 to 1 mm. 2. The resin molded electronic component according to claim 1, wherein the electronic component has a semicircular shape.
る樹脂の外面迄の寸法が０.５〜１mmであって、前記穴
部は前記縁辺近傍に位置し穴部開口面積が０.４〜１mm
２である請求項１記載の樹脂モールド成形電子部品。3. The size from the edge of the substrate to the outer surface of the resin constituting the package is 0.5 to 1 mm, the hole is located near the edge, and the opening area of the hole is 0.4. ~ 1mm
2. The resin-molded electronic component according to claim 1, wherein
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11166216A JP2000353713A (en) | 1999-06-14 | 1999-06-14 | Resin-molded electronic component |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11166216A JP2000353713A (en) | 1999-06-14 | 1999-06-14 | Resin-molded electronic component |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JP2000353713A true JP2000353713A (en) | 2000-12-19 |
Family
ID=15827267
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11166216A Pending JP2000353713A (en) | 1999-06-14 | 1999-06-14 | Resin-molded electronic component |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2000353713A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2010199223A (en) * | 2009-02-24 | 2010-09-09 | Kyosan Electric Mfg Co Ltd | Pulse transformer and pulsed power supply device |
| CN107403679A (en) * | 2017-07-31 | 2017-11-28 | 中国航天时代电子公司 | A kind of highly reliable Ethernet transformer of wide Wen Naigao direct currents |
-
1999
- 1999-06-14 JP JP11166216A patent/JP2000353713A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2010199223A (en) * | 2009-02-24 | 2010-09-09 | Kyosan Electric Mfg Co Ltd | Pulse transformer and pulsed power supply device |
| CN107403679A (en) * | 2017-07-31 | 2017-11-28 | 中国航天时代电子公司 | A kind of highly reliable Ethernet transformer of wide Wen Naigao direct currents |
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