JP2000352710A - Substrate for liquid crystal device, its production, liquid crystal device using the same, and electronic appliance - Google Patents

Abstract

PROBLEM TO BE SOLVED: To ensure good reproducibility of ruggedness and to enable the industrial mass production to be carried out without requiring a film forming apparatus with an expensive vacuum system and enormous mechanical investment even to the enlargement of substrate size by etching a constituent component of a substrate every minute part to form ruggedness with only the constituent components of the substrate. SOLUTION: Parts 3 containing an alkali metal, an alkaline earth metal or the like as a network-modifier are present in the network structure 2 of a glass substrate 1 of silica as a network-former (a). The surface of the substrate 1 is washed and uniformly etched to expose the washed surface (b). The exposed surface is treated, e.g. with an aqueous solution containing 30 wt.% hydrofluoric acid and 45 wt.% ammonium hydride difluoride (c). Since the parts 3 dissolve at a higher rate than the network structure 2, a rugged part 11 is obtained (d). An aluminum-base metallic layer 12 is formed on the substrate 1 with the formed rugged part 11 to obtain a light reflector (e).

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a substrate for a liquid crystal device and a method for manufacturing the same, and more particularly to a method for manufacturing a substrate for a liquid crystal device having irregularities on the substrate surface. Further, the present invention relates to a liquid crystal device using the same, and an electronic apparatus including the liquid crystal device.

[0002]

2. Description of the Related Art With the expansion of the portable information equipment market, a liquid crystal device has become the mainstream as a display device which satisfies the condition of low power consumption. The use of reflection type liquid crystal devices that utilize incident light from a light source as a light source is progressing. 2. Description of the Related Art Conventionally, a commercially available reflector or a reflector integrated with a polarizing plate has been attached to the outer surface of a liquid crystal cell on the side opposite to the observation side to manufacture a reflective liquid crystal device. Examples of commercially available reflectors include M-type and S-type manufactured by Nitto Denko, and a polarizing plate-integrated reflector using these is also on the market.

In recent years, such a reflective liquid crystal device has been required to be brighter and, in some cases, to be colored. As an example of realizing a brighter and higher quality display, a method of providing a reflector on the substrate surface is introduced (Tohru Koizumi and Tatsuo Uchida Proceedi
ngs of the SID, Vol.29, p157, 1988). In this document,
In order to obtain a bright display, by controlling the formation of irregularities on the reflection plate and producing a reflection plate having optimal reflection characteristics, after polishing the surface of the glass substrate with an abrasive, hydrogen fluoride is used. It describes a reflector in which the shape of the uneven portion is controlled by changing the etching time with an acid, and an Ag metal thin film is formed thereon.

Japanese Patent No. 210698 discloses that an oxide film is formed on a glass substrate by a sputtering method, and is etched with a hydrofluoric acid-based etchant to form irregularities. A reflector formed with a thin film is described.

Further, Japanese Patent Application Laid-Open No. 6-75238 discloses that a photosensitive resin is exposed and developed through a light-shielding mask having irregularly arranged through-holes, and is then subjected to heat treatment. Discloses a reflector having an aluminum metal thin film formed thereon.

These documents describe a method of forming a reflecting plate by forming a thin film having a light reflecting function on irregularities formed on a substrate, and particularly devising a method of forming irregularities on a substrate. By doing so, the objective was to obtain a reflector having desired characteristics.

[0007]

However, in the method described in the above document (Proceedings of the SID, Vol. 29, p. 157, 1988), the reproducibility of the unevenness is poor because the etching process is performed based on the unevenness due to the abrasive. When the size of the substrate to be processed is increased, the size of the polishing apparatus is also increased, which is disadvantageous in industrial mass production.

In the method described in Japanese Patent No. 210698, a film forming apparatus such as sputtering or CVD having a vacuum system for forming an oxide film on a substrate is required, and the size of the substrate to be processed is large. If this is the case, the size of the device will be large, which is disadvantageous for industrial mass production. in addition,
Since it is difficult to ensure the uniformity of the oxide film thickness in the substrate and the uniformity between the substrates by the sputtering method, the reproducibility of the uneven shape formed by etching the oxide film with a chemical solution is poor. In addition, since the oxide film thickness is not uniform within the substrate or between the substrates, the chemical treatment tends to vary, and it is difficult to form unevenness with good reproducibility.

Further, the method described in Japanese Patent Application Laid-Open No. 6-75238 includes a step of patterning a photosensitive resin by a photolithography method, which complicates the process and increases the cost for forming a fine convex shape. An exposure apparatus and a photomask are required. In addition, since the height of the convex surface is uniform, there is an optical path difference between the light reflected on the convex surface and the other area, so that the display quality is remarkably reduced due to interference colors having a wavelength corresponding to the height of the convex surface. Becomes

SUMMARY OF THE INVENTION The present invention has been made to solve the above problems, and has as its object the problem that the reproducibility of the unevenness is good, the film forming apparatus having an expensive vacuum system is not required, and expensive exposure apparatuses and photomasks are used. And a liquid crystal device substrate having unevenness on the substrate surface, which does not require a complicated process and does not require a large mechanical investment for the enlargement of the substrate size, which is advantageous for industrial mass production, and It is to provide a manufacturing method thereof. Another object of the present invention is to provide a liquid crystal device having good reflection characteristics without coloring of reflected light.

[0011]

Means taken by the present invention to solve the above problems are as follows.

In the substrate for a liquid crystal device according to the present invention, in a substrate for a liquid crystal device in which predetermined irregularities are formed on the surface of the substrate, the constituent components of the substrate are etched in minute portions, and only the constituent components of the substrate are used. It is characterized in that irregularities are formed.

According to the present invention, since the unevenness is formed only by the constituent components of the substrate, it is possible to directly carry out the manufacturing process of the liquid crystal device substrate that can flow with the raw material substrate. For example, it has good resistance to heat treatment exposed to a high temperature of 200 ° C. or higher, treatment with a highly soluble organic solvent, and the like, similarly to the raw glass.

According to a method of manufacturing a substrate for a liquid crystal device of the present invention, a liquid chemical for a substrate for a liquid crystal device having predetermined irregularities formed on the surface of a substrate is provided with a chemical solution for removing constituent components of the substrate at different rates for each minute portion. Forming irregularities by performing the treatment described above.

According to this means, predetermined irregularities can be formed by the step of treating the liquid crystal device substrate with a chemical solution, so that an expensive vacuum system or exposure apparatus is not required. The chemical solution used here is based on hydrofluoric acid, and is appropriately selected from nitric acid, sulfuric acid, hydrochloric acid, hydrogen peroxide, ammonium hydrogen difluoride, and fluorine fluoride depending on the raw material glass of the substrate for the liquid crystal device to be processed. Any one of ammonium, ammonium nitrate, ammonium sulfate, ammonium hydrochloride, or a combination of a plurality thereof at a predetermined ratio can be added and used. As the raw material glass for the liquid crystal device substrate, for example, soda lime glass, borosilicate glass, barium borosilicate glass, barium aluminosilicate glass, aluminosilicate glass and the like are generally used. The composition ratios are different. Generally, when a raw glass for a liquid crystal device substrate is treated with only a hydrofluoric acid aqueous solution, it is difficult to form irregularities because the glass surface is uniformly etched. However, constituent components contained in the raw glass By appropriately adding an auxiliary chemical that selectively elutes, the etching rate differs for each minute part, so that a substrate having a predetermined uneven shape can be obtained by preparing a chemical solution, processing temperature and processing time. I can do it. The auxiliary chemicals to be added are not limited to those described above, and use an optimal blend for each raw glass used.

Further, according to the method for manufacturing a substrate for a liquid crystal device of the present invention, in a substrate for a liquid crystal device having predetermined irregularities formed on the surface of the substrate, an oxide film formed on the substrate by a sol-gel method or on a substrate. The unevenness is formed by treating one or both of them with a chemical solution that varies the removal rate for each minute portion.

According to this means, since the oxide film is formed by the sol-gel method, the sol-gel film can use a general coating method such as spin coating, roll coating, flexographic printing or the like, and has a huge and expensive vacuum system. There is no need for such a film forming apparatus. Further, even when the raw material glass of each liquid crystal device substrate is different, it is sufficient to prepare a processing chemical corresponding to the component contained in the oxide film formed on the substrate, so that the type of the chemical is reduced. be able to. Of course, it is also effective to prepare the composition of the sol-gel film in accordance with the treatment liquid.

Further, in the method of manufacturing a substrate for a liquid crystal device according to the present invention, the oxide film formed by the sol-gel method may be a silicon oxide film or a silicon oxide containing Ti, Al (aluminum), Zr or a plurality thereof. It is characterized by being the main component.

According to this means, since the state of the silicon oxide film itself formed by the sol-gel method is different for each minute portion, a synergistic effect with the etching rate which is different for each minute portion by the chemical solution makes it more random. An abundant and favorable uneven shape can be formed. In addition, by using Ti, Al (aluminum) and Zr as the metal of the metal alkoxide, and using a sol solution obtained by hydrolyzing and dehydrating and condensing tetraalkoxysilane to which the metal alkoxide stabilized with acetylacetone is added, Since an excellent oxide film can be formed, the difference in the etching rate of each minute portion due to the chemical solution can be adjusted by the preparation. The sol solution using Ti, Al (aluminum), and Zr is relatively inexpensive and easily available, and an existing commercial solution can be used.

In the method of manufacturing a substrate for a liquid crystal device according to the present invention, the treatment with a chemical solution that varies the removal rate of the constituents of the substrate for each minute portion may be performed using a mixed aqueous solution of hydrofluoric acid and ammonium hydrogen difluoride. Alternatively, it is characterized by being immersed in a mixed aqueous solution of hydrofluoric acid, ammonium hydrogen difluoride and nitric acid.

According to this means, the elution rate of metal ions contained in the raw material glass of the liquid crystal device substrate exceeds the uniform etching rate of hydrofluoric acid due to the action of ammonium hydrogen difluoride in the processing chemical. In addition, predetermined corrugations can be formed by the appearance of a highly corrosive region in each minute portion having a high metal ion content. Further, depending on the components of the substrate for a liquid crystal device, a treatment liquid mixed with nitric acid may provide good results. This means utilizes the fact that silicate glass is a network polymer, and selectively removes alkali metals or alkaline earth metals partially penetrating as a network modifier in a network former formed of silicon oxide. , It is possible to form fine irregularities. A similar method can be used for a glass in which an oxide such as boron, arsenic, or aluminum and silicon oxide are copolymerized as the network former.

Further, in the method of manufacturing a substrate for a liquid crystal device according to the present invention, the treatment with a chemical solution that varies the removal rate of the constituents of the substrate for each minute portion may be performed by fluorinating the substrate surface with fine particles dispersed and suspended. Hydrofluoric acid aqueous solution, or a mixed aqueous solution of hydrofluoric acid and nitric acid, or a mixed aqueous solution of hydrofluoric acid and ammonium fluoride, or a mixed aqueous solution of hydrofluoric acid, ammonium fluoride, and nitric acid, or hydrofluoric acid and hydrogen The method is characterized by being brought into contact with the surface of a mixed aqueous solution of ammonium difluoride or a mixed aqueous solution of hydrofluoric acid, ammonium hydrogen difluoride and nitric acid.

According to this means, by appropriately adjusting the size and distribution of the fine particles dispersed and suspended on the surface of the processing liquid, the fine particles adsorbed on the surface of the substrate for the liquid crystal device to be processed can reduce the etching rate for each minute portion. Because of the difference, predetermined irregularities can be formed. As the fine particles to be used, commercially available granular resin-based spacers or latex spheres can be used. Resin spacers are available in steps of approximately 0.1 μm if the diameter is in the range of 1 to 15 μm, and the size and distribution of fine particles to be dispersed and suspended can be adjusted relatively freely.

Further, in the method of manufacturing a substrate for a liquid crystal device according to the present invention, the treatment with a chemical solution that varies the removal rate of the constituents of the substrate for each minute portion may be performed by using an aqueous hydrofluoric acid solution in which fine particles are colloidally dispersed. Alternatively, a mixed aqueous solution of hydrofluoric acid and nitric acid, or a mixed aqueous solution of hydrofluoric acid and ammonium fluoride, or a mixed aqueous solution of hydrofluoric acid, ammonium fluoride, and nitric acid, or hydrofluoric acid and ammonium hydrogen difluoride Or a mixed aqueous solution of hydrofluoric acid, ammonium hydrogen difluoride and nitric acid.

According to this means, by appropriately adjusting the size and distribution of the particles to be colloidally dispersed in the processing liquid, the fine particles adsorbed on the surface of the substrate for the liquid crystal device to be processed can reduce the etching rate for each minute portion. Because of the difference, predetermined irregularities can be formed. As the colloid used, gold, platinum colloid or the like can also be used. Since gold and platinum are not affected by hydrofluoric acid, they can be dispersed as colloids in a chemical solution containing hydrofluoric acid. For example, gold colloid can have a relatively large particle diameter of about 0.3 μm among spherical colloids. When synthetic polymer spheres such as polyethylene are used, commercially available particles having various particle sizes can be used. Colloidally dispersed particles are prevented from sedimentation by Brownian motion and electrostatic repulsion and solvation between the particles, so that the stability of the processing solution under gravity is easily maintained.

According to the method of manufacturing a substrate for a liquid crystal device of the present invention, in a substrate for a liquid crystal device having predetermined irregularities formed on the substrate surface, the components of the substrate are supersaturated and dissolved in an aqueous solution containing hydrofluoric acid. By immersing the substrate in the processing solution that has been, the region covered with the coating of the constituent components of the substrate, which is randomly deposited for each minute portion, is not etched,
The other portions are etched by a component containing hydrofluoric acid in the treatment liquid to form irregularities.

According to this means, the glass substrate is immersed in a supersaturated solution of the predetermined component of the substrate, whereby the predetermined component of the supersaturated molten raw material glass is precipitated in a different state for each minute portion. The region covered by this film is not dissolved because the chemical equilibrium between the processing solution and the film is advanced in the deposition direction, and the components that are not supersaturated are exposed. Since the portion is etched by a component containing hydrofluoric acid, predetermined irregularities can be obtained. In this means, since a so-called liquid phase deposition method of forming a film by immersing a substrate in a processing solution is applied, an expensive film forming apparatus having a vacuum system is not required, and an etching process using a liquid method is not required. Can be processed continuously, so that it is possible to easily cope with an increase in substrate size and industrial mass production.

Silicon oxide can be used as a component of the supersaturated substrate. Silicon oxide is used in almost all raw materials of glass substrates for liquid crystal devices in about 50 to 50%.
It is contained at a composition ratio of about 75%, and can be dealt with without greatly changing the composition of the processing liquid for each raw material.

The components of the supersaturated substrate include aluminum, boron, calcium,
One or more of magnesium, barium, strontium, zinc, arsenic, phosphorus, germanium, vanadium, sodium, potassium, and silicon can be contained as a main component. These elements are the main components of soda-lime glass or non-alkali glass, and since they are contained in oxides by weight of several percent to several tens percent,
It can be appropriately selected according to the pitch and depth of the unevenness to be formed and the composition of the glass substrate used.

Further, an aqueous solution containing hydrofluoric acid in which the constituents of the raw material substrate are supersaturated and dissolved is added to one or more of ammonium fluoride, ammonium hydrogen difluoride, nitric acid, sulfuric acid, hydrochloric acid, and hydrogen peroxide. Can be mixed. Here, in order to obtain predetermined irregularities by selectively etching portions where the non-supersaturated components are exposed, the non-supersaturated components and the pitch and depth of the irregularities to be formed are adjusted according to the pitch and depth. It can be appropriately selected.

According to a method of manufacturing a substrate for a liquid crystal device of the present invention, a surface having irregularities formed by the method of manufacturing a substrate for a liquid crystal device according to any one of the above is uniformly etched so as to have predetermined irregularities. It is characterized by including a step.

According to this means, the entire surface of the substrate is uniformly etched based on the unevenness formed by any of the manufacturing methods listed above, thereby gradually approaching the desired unevenness. Therefore, a fine uneven surface shape can be formed with good reproducibility.

A liquid crystal device according to the present invention comprises a liquid crystal layer sandwiched between a pair of insulating substrates, and one of the insulating substrates is provided with a liquid crystal device manufactured by any one of the above manufacturing methods. It is characterized by using a substrate.

According to this, it is possible to realize a liquid crystal device which is capable of performing high-contrast, light-colored display with little coloring.

An electronic apparatus according to the present invention is characterized by using the liquid crystal device.

According to this, it is possible to realize an electronic device capable of performing high-contrast, bright, and excellent reflection-type display.

[0037]

Embodiments of the present invention will be described below with reference to the accompanying drawings.

(First Embodiment) FIG. 1 is a view showing a process of manufacturing a substrate for a liquid crystal device according to the present invention. Here, the processing was performed using a soda lime glass substrate. FIG. 1 (a)
FIG. 1 is a schematic cross-sectional view of a network structure of a glass substrate 1, and a network structure 2 made of silicic acid, which is a network former, includes a portion 3 containing an alkali metal, an alkaline earth metal, or the like, which is a network modifier. Existing.

First, a 5 wt% aqueous hydrofluoric acid solution was added at 25 ° C.
The glass substrate 1 was washed for 5 seconds, and the surface of the substrate 1 was uniformly etched to expose a clean surface as shown in FIG.

Next, a treatment was performed at 25 ° C. for 15 seconds with an aqueous solution containing 30% by weight of hydrofluoric acid and 45% by weight of ammonium hydrogen difluoride. In this treatment, as shown in FIG. 1 (c), the dissolution rate of the portion 3 containing an alkali metal, an alkaline earth metal or the like is higher than that of the portion of the network structure 2 made of silicic acid. As a result, FIG. 1 (d)
As a result, the uneven portion 11 was obtained. Uneven step is ~ 1.5
It was formed randomly at μm, and randomly formed at a pitch of up to 30 μm. Although soda lime glass is used here, other glasses, such as borosilicate glass and aluminosilicate glass, can be used by changing the mixing ratio of the chemical.

Subsequently, as shown in FIG. 1E, a metal layer 12 containing aluminum as a main component was formed to a thickness of 200 nm on the substrate 1 on which the uneven portions 11 were formed, thereby forming a reflector. The reflector is not limited to a metal layer mainly containing aluminum, and a metal layer mainly containing silver, chromium, nickel, or the like can be used.

The reflection characteristics of the obtained reflector were measured by the measuring system shown in FIG. The metal layer 12 on the substrate 1 on which the concave and convex portions 11 are formed is used as a reflection surface.
The measurement was performed in a state where the thick substrate 1 and the glass substrate 14 of the same material were laminated. Incident light 15 irradiated at an angle of 25 degrees from the normal direction of the substrate is reflected by the metal layer 12 as a reflector. Angle θ from the normal direction of photomultimeter 16
By measuring the intensity of the scattered light while changing
As shown in FIG. The reflectivity is higher in the range of about ± 25 degrees than the S-type characteristic 17 of the commercially available externally-applied reflector used for comparison, and is characteristically the same as the M-type characteristic 18 of the commercially available externally-applied reflector. Equal or better characteristics were obtained.

Since the uneven structure obtained here was random in both depth and pitch, a reflector having good reflection characteristics without coloring due to the optical path difference of the reflected light was obtained.

(Second Embodiment) FIG. 4 is a view showing a process of manufacturing a liquid crystal device substrate according to the present invention. Here, the processing was performed using a soda lime glass substrate. First, FIG.
Cleaning is performed as shown in (a), and as shown in FIG.
A sol-gel film 5 was formed on a glass substrate 1. The sol-gel film 5 has fine pits 4 made of ZrO ₂ , TiO ₂ , and SiO ₂ . Pit 4 is 10-60n in height
m, the pitch is 300 to 800 nm and irregular, and the composition is non-uniform in the plane.

Next, a treatment was carried out at 25 ° C. for 2 minutes with an aqueous solution containing 20% by weight of hydrofluoric acid and 10% by weight of nitric acid. In this process, as shown in FIG. 4 (c), since ZrO ₂ and TiO ₂ having excellent chemical resistance are localized in the pits 4, the etching rate in other regions becomes relatively high. As shown in FIG. 4D, the uneven portion 11 was obtained. The steps of the unevenness are random at ~ 0.3 μm, and the pitch of the unevenness is ~ 10
It was formed randomly at μm.

Subsequently, as shown in FIG. 4E, a metal layer 12 containing aluminum as a main component was formed to a thickness of 200 nm on the substrate 1 on which the uneven portions 11 were formed, to form a reflector. The reflector is not limited to a metal layer mainly containing aluminum, and a metal layer mainly containing silver, chromium, nickel, or the like can be used.

When the reflection characteristics of the obtained reflector were measured by the same method as in the first embodiment using the measurement system shown in FIG. 2, the reflection characteristics were within ± 10 degrees as shown in the reflection characteristics 23 of FIG. Was a highly directional reflector plate capable of increasing the reflectance of the light. Since the uneven structure obtained here was random in both depth and pitch, a reflector having good reflection characteristics without coloring due to the optical path difference of the reflected light was obtained.

(Third Embodiment) FIG. 5 is a view showing a process of manufacturing a liquid crystal device substrate according to the present invention. Here, the processing was performed using a soda lime glass substrate. FIG. 5 (a)
Is hydrofluoric acid (50wt%) and ammonium fluoride aqueous solution (40wt%
%) On a chemical solution 6 mixed at a weight ratio of 1: 6.
FIG. 2 is a schematic view of a processing tank 21 in which two types of polyethylene spheres 7 having a particle size distribution centered on m and a particle size of 4 μm are dispersed and suspended.

First, a 5 wt% aqueous hydrofluoric acid solution was added at 25 ° C.
The glass substrate 1 was washed for 5 seconds, and the surface of the substrate 1 was uniformly etched to expose a clean surface.

Next, as shown in FIG. 5B, the glass substrate 1 was brought into contact with the liquid surface of the chemical solution 6 in which the polyethylene spheres 7 in the processing tank 21 were dispersed and floated, and the processing was performed at 25 ° C. for 4 minutes.
In this process, as shown in FIG. 5 (c), the portion where the polyethylene sphere 7 is adsorbed on the substrate 1 is masked so that the etching is delayed, and the uneven portion 11 shown in FIG. was gotten. The unevenness was randomly formed with a height of 0.6 μm, and the pitch of the unevenness was randomly formed with 30 μm. Although soda lime glass is used here, other glasses, such as borosilicate glass and aluminosilicate glass, can be used by changing the mixing ratio of the chemical.

Subsequently, as shown in FIG. 5E, a metal layer 12 containing aluminum as a main component was formed to a thickness of 200 nm on the substrate 1 on which the uneven portions 11 were formed, thereby forming a reflector. Since the uneven structure obtained here was random in both depth and pitch, a reflector having good reflection characteristics without coloring due to the optical path difference of the reflected light was obtained. The reflector is not limited to a metal layer mainly containing aluminum, and a metal layer mainly containing silver, chromium, nickel, or the like can be used.

(Fourth Embodiment) FIG. 6 is a view showing a process for manufacturing a substrate for a liquid crystal device according to the present invention. Here, the processing was performed using a soda lime glass substrate. FIG. 6 (a)
Is hydrofluoric acid (50wt%) and ammonium fluoride aqueous solution (40wt%
%) In a chemical solution 8 mixed with a weight ratio of 1: 6.
FIG. 2 is a schematic diagram of a processing tank 22 in which μm gold colloids 9 are dispersed.

First, the back surface of the substrate 1 is masked with a resin film 24, washed with a 5 wt% aqueous hydrofluoric acid solution at 25 ° C. for 5 seconds, and the surface of the substrate 1 is uniformly etched to expose a clean surface. Was.

Next, as shown in FIG. 6B, the glass substrate 1 was immersed in the chemical solution 8 in which the gold colloid 9 was dispersed in the treatment tank 22, and the treatment was performed at 25 ° C. for 4 minutes. In this process, as shown in FIG. 6C, the portion where the gold colloid 9 is adsorbed on the substrate 1 is masked so that the etching is delayed, and the uneven portion 11 shown in FIG. was gotten.
The unevenness was randomly formed with a step of 0.5 μm, and the pitch of the unevenness was randomly formed with a pitch of 15 μm. Although soda lime glass is used here, other glasses, such as borosilicate glass and aluminosilicate glass, can be used by changing the mixing ratio of the chemical.

Subsequently, the resin film 24 is removed and washed, and as shown in FIG.
A metal layer 12 mainly composed of aluminum is formed on the
m was formed as a reflector. The uneven structure obtained here is
Since both the depth and the pitch were random, a reflector having good reflection characteristics without coloring due to the optical path difference of the reflected light was obtained. The reflector is not limited to a metal layer mainly containing aluminum, and a metal layer mainly containing silver, chromium, nickel, or the like can be used.

(Fifth Embodiment) FIG. 7 is a view showing a process of manufacturing a liquid crystal device substrate according to the present invention. Here, the treatment was performed using an aluminosilicate glass substrate. FIG. 7 (a)
FIG. 1 is a schematic sectional view of a network structure of a glass substrate 1. In the aluminosilicate glass, a copolymer of silicic acid and aluminum oxide forms a network forming body, and forms the network structure 2.

First, a 5 wt% aqueous hydrofluoric acid solution was added at 25 ° C.
Then, the glass substrate 1 was washed for 5 seconds, and as shown in FIG. 7B, the surface of the substrate 1 was uniformly etched to expose a clean surface.

Next, the substrate 1 was immersed in a supersaturated solution of a 30 wt% aqueous hydrofluoric acid solution of aluminum oxide and magnesium oxide, and treated at 25 ° C. for 30 seconds. In this treatment, as shown in FIG. 7 (c), a portion where the aluminum oxide of the network structure 2 made of a copolymer of silicic acid and aluminum oxide is localized, and magnesium oxide is localized as a network modifier. At the same time, the same component is precipitated from the supersaturated solution to form a fine network structure 10 and, at the same time, a region on the surface of the glass substrate 1 where the component not supersaturated and dissolved in the processing liquid is exposed, Irregularities 11 were formed along the fine network structure 10 by being attacked by hydrofluoric acid. Unevenness is ~ 0.8μ
m, and the pitch of the irregularities was 10 μm at random. Although aluminosilicate glass is used here, other glasses, such as borosilicate glass and soda lime glass, can be used by changing the mixing ratio of the chemical.

Subsequently, as shown in FIG. 7D, a metal layer 12 containing aluminum as a main component was formed to a thickness of 200 nm on the substrate 1 on which the uneven portions 11 were formed, thereby forming a reflector. Since the uneven structure obtained here was random in both depth and pitch, a reflector having good reflection characteristics without coloring due to the optical path difference of the reflected light was obtained. The reflector is not limited to a metal layer mainly containing aluminum, and a metal layer mainly containing silver, chromium, nickel, or the like can be used.

(Sixth Embodiment) FIG. 8 is a view showing a process for manufacturing a substrate for a liquid crystal device according to the present invention. Here is the fifth
The processing was performed using the aluminosilicate glass substrate having the shape shown in FIG. FIG.
(A) is an aluminosilicate glass substrate glass processed to the shape of FIG. 7 (c).

This was treated at 25 ° C. for 20 seconds with a chemical solution obtained by mixing hydrofluoric acid (50 wt%) and an aqueous solution of ammonium fluoride (40 wt%) at a weight ratio of 1: 3, and FIG. As shown in the figure, the uneven portion 11 on the surface of the substrate 1 is uniformly etched to remove the fine network structure 10. Further, as shown in FIG. An uneven surface was formed.

FIG. 9A is an optical microscope photograph in a state in which the concave and convex portions 11 are formed along the fine network structure 10 of FIG. 8A, and FIG.
It is an optical microscope photograph in the state where processing was performed to the state of (c) and the smooth uneven surface was formed. FIG. 10 is a photograph of the same substrate as in FIG. 9B taken by an electron microscope. 9B and FIG. 10, it can be clearly seen that parabolic concave surfaces having various depths and sizes are arranged.

The unevenness was randomly formed with a step of about 0.5 μm, and the pitch of the unevenness was formed with a random of up to 15 μm.
Although aluminosilicate glass is used here, other glasses, such as borosilicate glass and soda lime glass, can be used by changing the mixing ratio of the chemical.

Subsequently, as shown in FIG. 8D, a metal layer 12 containing aluminum as a main component was formed to a thickness of 200 nm on the substrate 1 on which the uneven portions 11 were formed, thereby forming a reflector. The reflector is not limited to a metal layer mainly containing aluminum, and a metal layer mainly containing silver, chromium, nickel, or the like can be used.

When the reflection characteristics of the obtained reflection plate were measured by the same method as in the first embodiment using the measurement system shown in FIG. 2, the characteristics shown in the reflection characteristics 20 in FIG. 3 were obtained. . The reflectivity is higher in the range of ± 25 degrees than the characteristic 18 of M type of the commercially available externally attached reflector used for comparison,
A bright and favorable reflector was obtained.

Since the uneven structure obtained here was random in depth and pitch, a reflector having good reflection characteristics without coloring due to the optical path difference of the reflected light was obtained.

(Seventh Embodiment) FIG. 11 is a schematic sectional view of a liquid crystal device using the substrate for a liquid crystal device having the uneven shape of FIG. 8C according to the present invention.

In this embodiment, two transparent substrates 110
1 and 1103, the liquid crystal layer 1108 is a frame-shaped sealing material 1
A liquid crystal cell sealed by 109 is formed.
The liquid crystal layer 1108 is composed of a nematic liquid crystal having a predetermined twist angle. On the inner surface of the upper transparent substrate 1103, a light shielding layer 1113, a coloring layer 1104, and a protective layer 1106 also serving as a flattening film are sequentially formed.
In 04, for example, three colored layers of R (red), G (green), and B (blue) are arranged in a predetermined pattern. A plurality of stripe-shaped transparent electrodes 1110 are formed of ITO or the like via an adhesion improving layer 1105 on a protective layer 1106 also serving as a flattening film, and an alignment film 1112 is formed on the surface of the transparent electrode 1110. A rubbing process is performed in a predetermined direction.

On the other hand, the unevenness 11 of the lower transparent substrate 1101
A plurality of metal layers 1102 serving as reflectors made of, for example, Al (aluminum) are arranged as stripe electrodes on the inner surface on which the transparent electrodes 1110 are formed so as to intersect the transparent electrodes 1110. When a passive black normally black mode is used for the liquid crystal mode, black areas are always displayed outside the pixel region where the liquid crystal is not driven. Therefore, the light shielding layer 1113 is used to reduce the cost or substantially improve the aperture ratio. Can be omitted. In the case of an active matrix type device including a TFD element and a TFT element, the metal layer 1102 is formed in, for example, a rectangular shape, and is connected to wiring via the active element. However, in the case of an apparatus having a TFT element, the transparent electrode 111
No patterning of 0 is required. The metal layer 1102 is a reflection surface that reflects light incident from the transparent substrate 1103 side.

On the outer surface of the upper transparent substrate 1103, in order from the transparent substrate 1103 side, the phase difference plate 1114 and the polarizing plate 1
115 are arranged.

The reflection type display will be described. Fig. 1
1, after passing through the polarizing plate 1115 and the retardation plate 1114, respectively, and passing through the coloring layer 1104 and the liquid crystal layer 1108,
The light is reflected by the reflecting plate 1102 and is again reflected by the polarizing plate 1115.
Is emitted from. At this time, the bright state, the dark state, and the intermediate brightness can be controlled by the voltage applied to the liquid crystal layer 1108.

According to the configuration of the present embodiment as described above, a bright and high-contrast reflective color liquid crystal device without double reflection and display bleeding can be realized.

(Eighth Embodiment) FIG. 12 is a schematic sectional view of a liquid crystal device using the substrate for a liquid crystal device having the uneven shape of FIG. 8C according to the present invention.

In this embodiment, two transparent substrates 120
1 and 1203, the liquid crystal layer 1208 is a frame-shaped sealing material 1
A liquid crystal cell sealed by 209 is formed.
The liquid crystal layer 1208 is composed of a nematic liquid crystal having a predetermined twist angle. On the inner surface of the upper transparent substrate 1203, a plurality of stripe-shaped transparent electrodes 1210 are formed by IT.
An alignment film 1212 is formed on the surface of the transparent electrode 1210 and rubbed in a predetermined direction.

On the other hand, the irregularities 12 on the lower transparent substrate 1201
A metal layer 1202 serving as a reflector made of, for example, Al, a light-shielding layer 1213, a coloring layer 1204, and a protective layer 1206 also serving as a flattening film are sequentially formed on the inner surface on which the coloring layer 120 is formed. For example, R (red), G
Three colored layers (green) and B (blue) are arranged in a predetermined pattern. A plurality of stripe-shaped transparent electrodes 1207 formed on a protective layer 1206 also serving as a flattening film via an adhesion improving layer 1205 are arranged so as to intersect the transparent electrodes 1210. In this case, the light-blocking layer 1213 may be formed by stacking the colored layers 1204 in three colors of R, G, and B. When a passive matrix normally black mode is used for the liquid crystal mode, the light-blocking layer 1213 can be omitted. Also, TFD elements and TFTs
In the case of an active matrix type device including an element, the transparent electrode 1210 is formed in, for example, a rectangular shape, and is connected to a wiring via the active element. Where TF
In the case of an apparatus provided with a T element, patterning of the transparent electrode 1207 is unnecessary. The metal layer 1202 is formed on the transparent substrate 1
The reflecting surface reflects light incident from the side 203.

On the outer surface of the upper transparent substrate 1203, in order from the transparent substrate 1203 side, the phase difference plate 1214 and the polarizing plate 1
215 are arranged.

The reflection type display will be described. Fig. 1
2, after passing through the polarizing plate 1215 and the retardation plate 1214, and passing through the liquid crystal layer 1208 and the coloring layer 1204, respectively.
The light is reflected by the reflection plate 1202 and is again reflected by the polarizing plate 1215.
Is emitted from. At this time, a bright state, a dark state, and intermediate brightness can be controlled by a voltage applied to the liquid crystal layer 1208.

According to the configuration of the present embodiment as described above, a bright and high-contrast reflective color liquid crystal device without double reflection or display bleeding can be realized.

(Ninth Embodiment) FIG. 13 is a schematic sectional view of a liquid crystal device using the substrate for a liquid crystal device having the uneven shape of FIG. 8C according to the present invention.

The reflection type liquid crystal device can display a very bright image in a place where sufficient external light exists, but has a drawback that if the external light is insufficient, the display becomes difficult to see.

In this embodiment, by providing an opening for each pixel electrode, a semi-transmissive reflector having a reflectance and a transmittance defined by the ratio of the opening to the pixel area is formed. Where light exists, reflective display is used, and where external light is insufficient, an auxiliary light source is used to perform transmissive display. The shape of the opening is arbitrary.

In this embodiment, two transparent substrates 130
1 and 1303, the liquid crystal layer 1308 is a frame-shaped sealing material 1
A liquid crystal cell sealed by 309 is formed.
The liquid crystal layer 1308 is made of a nematic liquid crystal having a predetermined twist angle. A plurality of stripe-shaped transparent electrodes 1310 are formed on the inner surface of the upper transparent substrate 1303 by IT.
An alignment film 1312 is formed on the surface of the transparent electrode 1310 and is rubbed in a predetermined direction.

On the other hand, the unevenness 13 of the lower transparent substrate 1301
A metal layer 1302 serving as a reflector made of, for example, Al (aluminum), a coloring layer 1304, and a protective layer 1306 also serving as a flattening film are sequentially formed on the inner surface on which the coloring layer 1304 is formed. Is, for example, R (red), G
The three colored layers of (green) and B (blue) are arranged in a predetermined pattern, and the region where the three colored layers of R, G, and B are stacked is a light shielding layer 1313. The light-blocking layer 1313 may be formed by resin black or multi-layer chromium, instead of using the coloring layer. A transparent electrode 1307 having a stripe shape formed on a protective layer 1306 also serving as a flattening film via an adhesion improving layer 1305 is formed on the transparent electrode 13.
A plurality are arranged so as to intersect with 10. In the case of an active matrix type device including a TFD element and a TFT element, each transparent electrode 1310 is formed in, for example, a rectangular shape, and is connected to a wiring via the active element. However, in the case of an apparatus having a TFT element, the transparent electrode 13
07 patterning is not required. The reflection plate 1302 is
It is a reflection surface that reflects light incident from the transparent substrate 1303 side.

On the outer surface of the upper transparent substrate 1303, in order from the transparent substrate 1303 side, the retardation plate 1314 and the polarizing plate 1
315 are arranged. Also, under the liquid crystal cell,
A retardation plate 1316 is arranged behind the transparent substrate 1301, and a polarizing plate 1317 is arranged behind the retardation plate 1316. A backlight having a fluorescent tube 1318 that emits white light and a light guide plate 1319 having an incident end face along the fluorescent tube 1318 is disposed below the polarizing plate 1317. The light guide plate 1319 is a transparent body such as an acrylic resin plate on which a scattering rough surface is formed on the entire back surface or a scattering printing layer is formed, and receives light from a fluorescent tube 1318 as a light source at an end face. , And emits substantially uniform light from the upper surface of FIG. Other backlights include LEDs (light emitting diodes) and EL
(Electroluminescence) or the like can be used.

The reflection type display will be described. Fig. 1
3, after passing through the polarizing plate 1315 and the retardation plate 1314, and passing through the liquid crystal layer 1308 and the coloring layer 1304, respectively.
The light is reflected by the metal layer 1302 serving as a reflecting plate, and is emitted again from the polarizing plate 1315. At this time, the liquid crystal layer 130
The bright state, the dark state, and the intermediate brightness can be controlled by the voltage applied to 8.

Next, the transmission type display will be described. Light from the backlight is applied to a polarizing plate 1317 and a retardation plate 131.
6, and is introduced into the coloring layer 1304 and the liquid crystal layer 1308 through an opening 1322 provided in the metal layer 1302 serving as a semi-transmissive reflection plate.
After passing through No. 8, the light passes through the phase difference plate 1314. At this time,
In accordance with the voltage applied to the liquid crystal layer 1308, the polarizing plate 1315
Transmitting (bright state) and absorbing (dark state)
And an intermediate state (brightness) can be controlled.

In the present embodiment, the light-shielding layer 13 is provided independently of the coloring layer, or a coloring layer optimal for color purity at the time of transmissive display is partially provided.
It is also possible to use a substrate or the like having a color filter structure with improved values.

In this embodiment, the metal layer 1302 serving as a semi-transmissive reflector is provided with an opening 132 for each pixel electrode.
2, the transmission type display is enabled. However, by reducing the thickness of the metal layer 1302 to 15 to 20 nm, the reflectance is about 85% and the transmittance is 10%.
The same effect can be obtained by forming the front and rear transflective plates. In this case, the opening 132 of the metal layer 1302
2 becomes unnecessary. The ratio between the reflectance and the transmittance can be set to an arbitrary film thickness. In either case, since the liquid crystal layer is driven by the transparent electrodes provided on the upper and lower substrates, the reflectivity and the transmittance are determined by the metal layer serving as the transflective plate.

According to the configuration of the present embodiment as described above, it is possible to realize a color liquid crystal device capable of switching and displaying between a reflective display and a transmissive display without double reflection or blurring of display.

(Tenth Embodiment) Three examples of the electronic apparatus of the present invention will be described.

The liquid crystal device of the present invention is suitable for portable equipment used under various environments and requiring low power consumption.

FIG. 14A shows a portable information device, in which a display section 141 is provided on the upper side of the main body and an input section 143 is provided on the lower side. In addition, a touch panel is often provided on the front surface of the display unit. A normal touch panel has a lot of surface reflections, making it difficult to see the display. Therefore, conventionally, a transmissive liquid crystal device has often been used even though it is portable. However, since the transmissive liquid crystal device always uses a backlight, the power consumption is large and the battery life is short. Even in such a case, the liquid crystal device of the present invention can be used for a portable information device because the display is bright and vivid both in a reflective type and a transflective type.

FIG. 14B shows a portable telephone, which has a display unit 144 at the upper front part of the main body. Mobile phones are used in all environments, both indoors and outdoors. Especially, it is often used in cars, but the inside of cars at night is very dark.
Therefore, it is desirable that the display device used in the mobile phone is a transflective liquid crystal device capable of performing transmissive display using auxiliary light as needed, mainly reflective display with low power consumption. The liquid crystal device of the ninth embodiment of the present invention is brighter and has a higher contrast ratio than the conventional liquid crystal device in both the reflective display and the transmissive display.

FIG. 14C shows a watch having a display unit 146 at the center of the main body. An important aspect in watch applications is luxury. The liquid crystal device of the present invention is not only bright and has a high contrast, but also has a small coloring due to a small characteristic change due to the wavelength of light. Therefore, a very high-quality display can be obtained as compared with the conventional liquid crystal device.

[0095]

As described above, according to the present invention, the reproducibility of unevenness is good, no expensive film forming apparatus having a vacuum system is required, and an expensive exposure apparatus, photomask, and complicated steps are required. Provided is a liquid crystal device substrate having unevenness on the substrate surface, which is advantageous in mass production industrially and does not require a large mechanical investment even when the substrate size is increased, and a method of manufacturing the same. can do. Also,
A bright reflective color liquid crystal device without coloring of reflected light and without occurrence of double reflection or blurring of display can be constituted.

[Brief description of the drawings]

FIGS. 1A to 1E are schematic cross-sectional views showing a liquid crystal device substrate according to a first embodiment of the present invention and a method for manufacturing the same.

FIG. 2 is a schematic view showing a measuring method of a reflection plate.

FIG. 3 is a view showing the reflection characteristics of a reflector manufactured by the manufacturing methods of the first, second, and sixth embodiments according to the present invention.

FIGS. 4A to 4E are schematic views illustrating a method for manufacturing a liquid crystal device substrate according to a second embodiment of the present invention.

FIGS. 5A to 5E are schematic views illustrating a method for manufacturing a liquid crystal device substrate according to a third embodiment of the present invention.

FIGS. 6A to 6E are schematic views illustrating a method for manufacturing a liquid crystal device substrate according to a fourth embodiment of the present invention.

FIGS. 7A to 7D are schematic views illustrating a method for manufacturing a liquid crystal device substrate according to a fifth embodiment of the present invention.

FIGS. 8A to 8D are schematic views illustrating a method of manufacturing a liquid crystal device substrate according to a sixth embodiment of the present invention.

9 (a) and (b) are FIGS. 8 (a) and 8 (b), respectively, of a liquid crystal device substrate according to a sixth embodiment of the present invention.
It is an optical microscope photograph of the substrate for liquid crystal devices in the state of (c).

FIG. 10 is an electron micrograph of the liquid crystal device substrate in the state of FIG. 8B of the sixth embodiment of the liquid crystal device substrate according to the present invention.

FIG. 11 is a sectional view showing a schematic structure of a liquid crystal device according to a seventh embodiment of the present invention.

FIG. 12 is a sectional view showing a schematic structure of a liquid crystal device according to an eighth embodiment of the present invention.

FIG. 13 is a sectional view showing a schematic structure of a liquid crystal device according to a ninth embodiment of the present invention.

14A and 14B are schematic diagrams of an electronic device equipped with a liquid crystal device according to the present invention, wherein FIG. 14A shows a portable information device, FIG. 14B shows a mobile phone, and FIG.

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 1, 14 ... Glass substrate 2 ... Network-like structure by the network formation body in a glass substrate 3 ... Network modification area | region in a glass substrate 4 ... Fine pits on a sol-gel film 5 ... Sol-gel film 6, 8 ... hydrofluoric acid-based treatment liquid 7 ... polyethylene sphere 9 ... gold colloid 10 ... network structure by precipitated supersaturated component 11, 1120, 1220, 1320 ... glass substrate Upper concave / convex portions 12, 1102, 1202, 1302: Reflector (metal layer) 13, 1108, 1208, 1308: Liquid crystal layer 15: Incident light 16: Photomultimeter 17: Commercially available Reflection characteristics of the externally attached reflector S type of 18 ... Reflection characteristics of the commercially available externally attached reflector M type 19 ... Reflection characteristics of the reflector manufactured by the manufacturing method of the first embodiment 20. · Reflection characteristics of reflectors manufactured by the manufacturing method of the sixth embodiment 23 ··· Reflection characteristics of reflectors manufactured by the manufacturing method of the second embodiment 21 and 22 ··· Chemical treatment tank 24 · ..Resin films 1101, 1103, 1201, 1203, 1301,
1303 ... glass substrate 1110, 1207, 1210, 1307, 1310
..Transparent electrodes 1109, 1209, 1309: sealing materials 1106, 1206, 1306 ... protective layers (flattening films) 1111, 1112, 1211, 1212, 1311,
1312: Alignment film 1114, 1214, 1314, 1316: Phase difference plate 1115, 1215, 1315, 1317: Polarizer 1104, 1204, 1304 ... Color layer 1105, 1205, 1305: Adhesion Light-imparting layers 1113, 1213, 1313 ... Light-shielding layer 1318 ... Fluorescent tube 1319 ... Light guide plate 1322 ... Transmissive openings 261, 264, 266 ... Display portion of electronic device 262: portable information device 263: input unit 265: mobile phone 267: watch

 ────────────────────────────────────────────────── ─── Continuation of the front page (72) Inventor Seki ▲ Takumi F-term (reference) in Seiko Epson Co., Ltd. 3-3-5 Yamato, Suwa-shi, Nagano 2H042 BA02 BA03 BA15 BA20 2H090 JA03 JB02 JC03 JD01 LA01 LA20 2H091 FA16Y FB07 FB08 FC26 FD06 LA12 4G059 AA08 AB03 AB11 AC01 BB14 EA01 EA05 EB07

Claims (14)

[Claims] 1. A liquid crystal device substrate having predetermined irregularities formed on the surface of a substrate, wherein components of the substrate are etched in minute portions, and irregularities are formed only by the components of the substrate. A substrate for a liquid crystal device, comprising: 2. In a liquid crystal device substrate having predetermined irregularities formed on the surface of the substrate, the irregularities are formed by treating constituent components of the substrate with a chemical solution having different removal rates for each minute portion. The method for manufacturing a substrate for a liquid crystal device according to claim 1, wherein: 3. A liquid crystal device substrate having predetermined irregularities formed on the surface of a substrate, wherein one or both of the constituent components of the substrate and / or an oxide film formed on the substrate by a sol-gel method are applied to each minute portion. 2. The method for manufacturing a substrate for a liquid crystal device according to claim 1, wherein the unevenness is formed by treating the substrate with a chemical solution having different removal rates. 4. The method according to claim 3, wherein the oxide film formed by the sol-gel method is mainly composed of a silicon oxide film or a silicon oxide containing Ti, Al, Zr or a plurality thereof. A method for manufacturing a substrate for a liquid crystal device. 5. A treatment with a chemical solution which varies the removal rate of the constituent components of the substrate for each minute portion, is performed by using a mixed aqueous solution of hydrofluoric acid and ammonium hydrogen difluoride or a mixed aqueous solution of hydrofluoric acid and ammonium hydrogen difluoride. 5. The method for manufacturing a substrate for a liquid crystal device according to claim 2, wherein the method is performed by immersing the substrate in a mixed aqueous solution of acetic acid and nitric acid. 6. A treatment with a chemical solution that varies the removal rate of the constituent components of the substrate for each minute portion, by using a hydrofluoric acid aqueous solution in which fine particles are dispersed and suspended on the substrate surface, or hydrofluoric acid and nitric acid. , Or a mixed aqueous solution of hydrofluoric acid and ammonium fluoride, or a mixed aqueous solution of hydrofluoric acid, ammonium fluoride and nitric acid, or a mixed aqueous solution of hydrofluoric acid and ammonium hydrogen difluoride, or fluoride 5. The method for manufacturing a substrate for a liquid crystal device according to claim 2, wherein the method is carried out by bringing the liquid surface into contact with a liquid surface of a mixed aqueous solution of hydrofluoric acid, ammonium hydrogen difluoride and nitric acid. 7. A treatment with a chemical solution that varies the removal rate of the constituents of the substrate for each minute portion, wherein the treatment is performed with a hydrofluoric acid aqueous solution in which fine particles are colloidally dispersed, or a mixed aqueous solution of hydrofluoric acid and nitric acid, Alternatively, a mixed aqueous solution of hydrofluoric acid and ammonium fluoride, or a mixed aqueous solution of hydrofluoric acid, ammonium fluoride, and nitric acid, or a mixed aqueous solution of hydrofluoric acid and ammonium hydrogen difluoride, or hydrofluoric acid and hydrogen 5. The method of manufacturing a substrate for a liquid crystal device according to claim 2, wherein the method is performed by immersing the substrate in a mixed aqueous solution of ammonium difluoride and nitric acid. 8. A substrate for a liquid crystal device having predetermined irregularities formed on a surface of the substrate, by immersing the substrate in a processing solution in which a component of the substrate is supersaturated and dissolved in an aqueous solution containing hydrofluoric acid. The region covered with the coating of the component of the substrate randomly deposited for each minute portion is not etched, and the other portion is etched by the component containing hydrofluoric acid in the processing solution. 2. The method for manufacturing a substrate for a liquid crystal device according to claim 1, wherein the unevenness is formed. 9. The method for manufacturing a substrate for a liquid crystal device according to claim 8, wherein a component of said substrate which is supersaturated and dissolved is silicon oxide. 10. The supersaturated dissolved component of the substrate is aluminum, boron, calcium, magnesium, barium, strontium, zinc, arsenic,
10. The method for manufacturing a substrate for a liquid crystal device according to claim 9, wherein one or more of phosphorus, germanium, vanadium, sodium, potassium, and silicon are contained as main components. 11. An aqueous solution containing hydrofluoric acid in which the constituents of the substrate are supersaturated and dissolved is added with ammonium fluoride,
11. The method for manufacturing a substrate for a liquid crystal device according to claim 8, wherein one or a plurality of ammonium hydrogen difluoride, nitric acid, sulfuric acid, hydrochloric acid, and hydrogen peroxide are mixed. 12. A method for manufacturing a substrate for a liquid crystal device according to claim 2, further comprising the step of uniformly etching the surface on which the unevenness is formed by the method for manufacturing a substrate for a liquid crystal device according to claim 2 so as to have predetermined unevenness. Substrate manufacturing method. 13. A liquid crystal device substrate manufactured by the manufacturing method according to claim 2, wherein a liquid crystal layer is sandwiched between a pair of insulating substrates. The liquid crystal device used. 14. An electronic apparatus using the liquid crystal device according to claim 15.