JP2000351896A - Flame retardant polyamide resin composition - Google Patents

Flame retardant polyamide resin composition

Info

Publication number
JP2000351896A
JP2000351896A JP11164673A JP16467399A JP2000351896A JP 2000351896 A JP2000351896 A JP 2000351896A JP 11164673 A JP11164673 A JP 11164673A JP 16467399 A JP16467399 A JP 16467399A JP 2000351896 A JP2000351896 A JP 2000351896A
Authority
JP
Japan
Prior art keywords
tetrazole
polyamide resin
polyamide
flame
compound
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP11164673A
Other languages
Japanese (ja)
Inventor
Toshihiro Arai
敏弘 新井
Tadashi Takeda
正 武田
Osamu Hamazoe
修 浜添
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Resonac Holdings Corp
Original Assignee
Showa Denko KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Showa Denko KK filed Critical Showa Denko KK
Priority to JP11164673A priority Critical patent/JP2000351896A/en
Publication of JP2000351896A publication Critical patent/JP2000351896A/en
Pending legal-status Critical Current

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  • Compositions Of Macromolecular Compounds (AREA)

Abstract

PROBLEM TO BE SOLVED: To obtain a composition which, when burned, does not pollute the environment and does not emit a toxic gas by blending a polyamide resin and a tetrazole compound having a decomposition temperature not lower than a molding temperature of the polyamide resin. SOLUTION: A polyamide resin is preferably polyamide 6, polyamide 66 or a copolymer of polyamide 6/polyamide 66 and further preferably polyamide 66. A tetrazole compound is preferably 1H-tetrazole, 5,5'-bis-1H-tetrazole, 5- methyl-1H-tetrazole, 5-phenyl-1H-tetrazole, 5-amino-1H-tetrazole, or their derivatives and further preferably 5,5'-bis-1H-tetrazole, 5-amino-1H-tetrazole, or their derivatives. Normally, 0.1-50 pts.wt. of a tetrazole compound is blended with 100 pts.wt. of a polyamide resin.

Description

【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION

【0001】[0001]

【発明の属する技術分野】本発明は、電子・電気分野の
コネクター等の部品、自動車分野の電装部品、その他に
用いられる難燃性ポリアミド樹脂組成物に関する。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a flame-retardant polyamide resin composition used for parts such as connectors in the electronic and electric fields, electric parts in the automobile field, and others.

【0002】[0002]

【従来の技術】ポリアミド樹脂は優れた耐熱性、機械的
特性、成形加工性を有するので種々の工業部品に利用さ
れている。これらの用途に利用する場合、ポリアミド樹
脂の難燃化を要求されることは少なくない。そこでポリ
アミド樹脂を難燃化するために難燃剤としてハロゲン化
合物を添加したポリアミド樹脂が、これまで使用されて
きた。
2. Description of the Related Art Polyamide resins are used for various industrial parts because of their excellent heat resistance, mechanical properties and moldability. When used for these purposes, it is not uncommon for polyamide resins to be required to be flame-retardant. Therefore, a polyamide resin to which a halogen compound is added as a flame retardant to make the polyamide resin flame retardant has been used.

【0003】[0003]

【発明が解決しようとする課題】しかしながら、上記方
法による難燃性ポリアミド樹脂は、燃焼時に発生するダ
イオキシンなどによる環境汚染、燃焼ガスの毒性などに
問題がある。本発明はかかる状況に鑑みてなされたもの
であり、燃焼時にダイオキシンなどによる環境汚染がな
く、燃焼ガスに毒性が無い難燃性ポリアミド樹脂組成物
を提供することを目的とする。
However, the flame-retardant polyamide resin obtained by the above method has problems in environmental pollution due to dioxin and the like generated during combustion, toxicity of combustion gas, and the like. The present invention has been made in view of such circumstances, and an object of the present invention is to provide a flame-retardant polyamide resin composition that is free from environmental pollution due to dioxin or the like during combustion and has no toxicity in combustion gas.

【0004】[0004]

【課題を解決するための手段】上記課題を解決するため
に、鋭意研究を重ねた結果、特定のテトラゾール系化合
物を、ポリアミド樹脂と組み合わせることにより、上記
目的を達成しうることを見出し、本発明を完成するに至
った。すなわち、本発明は、(A)ポリアミド樹脂及び
(B)該ポリアミド樹脂の成形温度以上の分解温度を有
するテトラゾール系化合物を含有する難燃性ポリアミド
樹脂組成物を提供する。
As a result of intensive studies to solve the above problems, the present inventors have found that the above object can be achieved by combining a specific tetrazole compound with a polyamide resin. Was completed. That is, the present invention provides a flame-retardant polyamide resin composition containing (A) a polyamide resin and (B) a tetrazole compound having a decomposition temperature not lower than the molding temperature of the polyamide resin.

【0005】[0005]

【発明の実施の形態】本発明におけるポリアミド樹脂
は、一般に酸アミド結合(−CONH−)を繰り返し単
位に持つ高分子化合物であり、特に限定されるものでは
ないが、具体的な例をあげれば、ポリアミド6、ポリア
ミド11、ポリアミド12、ポリアミド4・6、ポリア
ミド6・6、ポリアミド6・10、ポリアミド6・1
2、ポリアミド6・6T、ポリアミドMXD6などが挙
げられる。ポリアミド系共重合体(例えば、ポリアミド
6/6・6共重合体、ポリアミド6/6・10共重合体
など)でも良く、また2種以上を併用することもでき
る。これらの中でポリアミド6、ポリアミド6・6、ポ
リアミド6/6・6共重合体が好ましく、特に、ポリア
ミド6・6が高い難燃性が得られるという理由で好まし
い。
BEST MODE FOR CARRYING OUT THE INVENTION The polyamide resin of the present invention is generally a polymer compound having an acid amide bond (-CONH-) as a repeating unit, and is not particularly limited. , Polyamide 6, polyamide 11, polyamide 12, polyamide 4.6, polyamide 6.6, polyamide 610, polyamide 6.1
2, polyamide 6.6T, polyamide MXD6 and the like. Polyamide-based copolymer (for example, polyamide 6 / 6.6 copolymer, polyamide 6 / 6.10 copolymer, etc.) may be used, or two or more kinds may be used in combination. Among these, polyamide 6, polyamide 6.6, and polyamide 6 / 6,6 copolymer are preferable, and polyamide 6.6 is particularly preferable because high flame retardancy can be obtained.

【0006】本発明で難燃剤として利用されるテトラゾ
ール系化合物は、窒素4原子及び炭素1原子で構成され
ている5員環を有する化合物であり、燃焼時に発生する
ダイオキシンなどの環境汚染がなく、加熱分解させた場
合に、窒素、炭酸ガス、水蒸気などのガスしか発生しな
い。テトラゾール系化合物の中で好ましいのは、高度な
難燃性が得られるという点で、該化合物が熱分解した時
の該化合物1g当たりのガス発生量が多い化合物であ
る。そのようなテトラゾール系化合物としては、1H−
テトラゾールあるいはその金属塩、アミン塩などの1H
−テトラゾール誘導体もしくは、5,5’−ビス−1H
−テトラゾールあるいはその金属塩、アミン塩などの
5,5’−ビス−1H−テトラゾール誘導体もしくは、
5−メチル−1H−テトラゾールあるいはその金属塩、
アミン塩などの5−メチル−1H−テトラゾール誘導体
もしくは、5−フェニル−1H−テトラゾールあるいは
その金属塩、アミン塩などの5−フェニル−1H−テト
ラゾール誘導体もしくは、5−アミノ−1H−テトラゾ
ールあるいはその金属塩、アミン塩などの5−アミノ−
1H−テトラゾール誘導体などが挙げられる。テトラゾ
ール系化合物には1H−テトラゾール誘導体の互変異性
体である2H−テトラゾール誘導体があるが、本発明で
は2H−テトラゾール誘導体であっても良い。これらの
中でも5,5’−ビス−1H−テトラゾール及びその誘
導体、もしくは5−アミノ−1H−テトラゾール及びそ
の誘導体が特に好ましい。本発明におけるテトラゾール
系化合物は単独で添加しても良いし、2種類以上を併用
しても良い。
[0006] The tetrazole compound used as a flame retardant in the present invention is a compound having a five-membered ring composed of 4 atoms of nitrogen and 1 atom of carbon, and has no environmental pollution such as dioxin generated during combustion. When thermally decomposed, only gases such as nitrogen, carbon dioxide and water vapor are generated. Among the tetrazole compounds, those compounds that generate a large amount of gas per gram of the compound when the compound is thermally decomposed are preferable in that high flame retardancy is obtained. As such a tetrazole compound, 1H-
1H of tetrazole or its metal salt, amine salt, etc.
-Tetrazole derivative or 5,5'-bis-1H
5,5′-bis-1H-tetrazole derivative such as tetrazole or its metal salt, amine salt or
5-methyl-1H-tetrazole or a metal salt thereof,
5-methyl-1H-tetrazole derivatives such as amine salts or 5-phenyl-1H-tetrazole or metal salts thereof, 5-phenyl-1H-tetrazole derivatives such as amine salts or 5-amino-1H-tetrazole or metals thereof 5-amino- such as salts and amine salts
And a 1H-tetrazole derivative. The tetrazole-based compound includes a 2H-tetrazole derivative which is a tautomer of a 1H-tetrazole derivative, but may be a 2H-tetrazole derivative in the present invention. Among these, 5,5′-bis-1H-tetrazole and its derivatives, or 5-amino-1H-tetrazole and its derivatives are particularly preferred. The tetrazole compound in the present invention may be added alone or in combination of two or more.

【0007】本発明の難燃性ポリアミド樹脂組成物は、
ポリアミド樹脂にテトラゾール系化合物を周知の方法に
より添加して得られる。添加方法に特に限定はなく、合
成樹脂の分野で一般的に行われている方法を採用すれば
よい。具体的には、ポリアミド樹脂とテトラゾール系化
合物をヘンシェルミキサー、タンブラー及びリボンブレ
ンダーのごとき混合機を用いてドライブレンドした後、
押出機等により溶融混練する方法、もしくは重合反応に
支障がなければポリアミド樹脂を重合する前にテトラゾ
ール系化合物を添加する、あるいは重合途中に添加する
などの方法が挙げられる。
The flame-retardant polyamide resin composition of the present invention comprises:
It is obtained by adding a tetrazole compound to a polyamide resin by a known method. The method of addition is not particularly limited, and a method generally used in the field of synthetic resins may be employed. Specifically, after the polyamide resin and the tetrazole compound are dry-blended using a mixer such as a Henschel mixer, a tumbler and a ribbon blender,
A method of melt-kneading with an extruder or the like, or a method of adding a tetrazole-based compound before polymerization of the polyamide resin or during the polymerization if there is no hindrance to the polymerization reaction.

【0008】本発明中の難燃性ポリアミド樹脂組成物中
のテトラゾール系化合物の添加量は、ポリアミド樹脂1
00重量部に対して0.1〜50重量部、好ましくは、
0.3〜25重量部、より好ましくは0.5〜10重量
部の範囲である。テトラゾール系化合物の含有量が0.
1重量部未満では十分な難燃性が得られない可能性があ
る。また、50重量部を超えると、機械的特性が損なわ
れたり、成形加工時のシルバーが発生するなどの問題が
生ずる場合がある。
The addition amount of the tetrazole compound in the flame-retardant polyamide resin composition of the present invention is as follows.
0.1 to 50 parts by weight, preferably 100 parts by weight,
It is in the range of 0.3 to 25 parts by weight, more preferably 0.5 to 10 parts by weight. When the content of the tetrazole compound is 0.
If the amount is less than 1 part by weight, sufficient flame retardancy may not be obtained. If the amount exceeds 50 parts by weight, problems such as impairment of mechanical properties and generation of silver during molding may occur.

【0009】上記の様にして得られた難燃性ポリアミド
樹脂の成形加工もまた周知の方法により実施される。例
えば押出成形、射出成形、圧縮成形あるいはブロー成形
などを採用することができる。しかし、上記の成形加工
を実施する時、難燃性ポリアミド樹脂組成物中に含まれ
るテトラゾール系化合物の分解温度より低い成形温度で
行うことが肝要である。なぜなら、分解温度より高い温
度で成形すると成形中にテトラゾール系化合物が分解
し、成形品とした場合の難燃効果が得られないからであ
る。すなわち、本発明では成形加工後もテトラゾール系
化合物が分解せずに成形品中に存在することが必要であ
る。
The molding of the flame-retardant polyamide resin obtained as described above is also carried out by a known method. For example, extrusion molding, injection molding, compression molding or blow molding can be employed. However, when performing the above-mentioned molding, it is important to carry out the molding at a molding temperature lower than the decomposition temperature of the tetrazole compound contained in the flame-retardant polyamide resin composition. This is because, when molding is performed at a temperature higher than the decomposition temperature, the tetrazole compound is decomposed during molding, and the flame retardant effect of a molded article cannot be obtained. That is, in the present invention, it is necessary that the tetrazole compound is present in the molded product without being decomposed even after the molding process.

【0010】以上の理由からテトラゾール系化合物の選
択にあたっては、難燃性ポリアミド樹脂組成物の成形温
度以上、好ましくはその温度より10℃以上、さらに好
ましくは20℃以上高い分解温度を有するテトラゾール
系化合物を選択する必要がある。例えば、成形温度22
0〜230℃のポリアミド6樹脂の場合には、分解温度
が240度以上の5,5’−ビス−1H−テトラゾー
ル、5−メチル−1H−テトラゾール、5−フェニル−
1H−テトラゾールなどが使用可能で、特に5,5’−
ビス−1H−テトラゾール、5−フェニル−1H−テト
ラゾールが好適である。
For the above reasons, in selecting a tetrazole compound, a tetrazole compound having a decomposition temperature higher than the molding temperature of the flame-retardant polyamide resin composition, preferably higher than the molding temperature by 10 ° C., more preferably higher than 20 ° C. You need to choose. For example, the molding temperature 22
In the case of polyamide 6 resin at 0 to 230 ° C., the decomposition temperature is 240 ° C. or higher such as 5,5′-bis-1H-tetrazole, 5-methyl-1H-tetrazole, 5-phenyl-
1H-tetrazole and the like can be used, and in particular, 5,5′-
Bis-1H-tetrazole and 5-phenyl-1H-tetrazole are preferred.

【0011】もちろん、本発明の難燃性ポリアミド樹脂
組成物には、当業界で慣用の種々の添加剤もしくは充填
剤を本発明の効果を損ねない範囲で添加しても良い。例
えば添加剤としては、他の非ハロゲン系、非リン系難燃
剤、抗酸化剤、紫外線吸収剤、発泡剤、帯電防止剤、着
色剤、核剤、滑剤などが挙げられ、充填剤としてはガラ
ス繊維、タルク、クレーなどが挙げられる。
Of course, various additives or fillers commonly used in the art may be added to the flame-retardant polyamide resin composition of the present invention as long as the effects of the present invention are not impaired. For example, additives include other non-halogen-based, non-phosphorus-based flame retardants, antioxidants, ultraviolet absorbers, foaming agents, antistatic agents, coloring agents, nucleating agents, lubricants, and the like. Fiber, talc, clay and the like can be mentioned.

【0012】[0012]

【実施例】以下、本発明を実施例により具体的に説明す
るが、本発明はこれら実施例になんら限定されるもので
はない。
EXAMPLES Hereinafter, the present invention will be described specifically with reference to Examples, but the present invention is not limited to these Examples.

【0013】難燃性の評価方法を以下に示す。 ・難燃性 長さ100mm、幅6mm、厚み1mmの試験片を用い
て、JIS K7201に準拠し、酸素濃度25容量%
の条件下で測定を行い、次の基準で評価した。
The method for evaluating flame retardancy is described below. -Flame retardancy Using a test piece with a length of 100 mm, a width of 6 mm, and a thickness of 1 mm, in accordance with JIS K7201, oxygen concentration 25% by volume
Was measured under the following conditions, and evaluated according to the following criteria.

【0014】 ○・・・試験片が4秒以内に消火 ×・・・試験片が4秒を超えて燃焼し続けた また、ポリアミド樹脂として次の3種類を用いた。 PA−1:相対粘度(JIS K6810に準じて測
定)が2.37であるポリアミド6 PA−2:相対粘度が2.61であるポリアミド6・6 PA−3:相対粘度が2.34であるポリアミド6・6
・ ・ ・: Fire extinguished within 4 seconds of test piece ×: Test piece continued to burn for more than 4 seconds Further, the following three types of polyamide resins were used. PA-1: Polyamide 6 having a relative viscosity (measured according to JIS K6810) of 2.37 PA-2: Polyamide 6.6 PA-3 having a relative viscosity of 2.61 PA-3: Relative viscosity of 2.34 Polyamide 6.6

【0015】実施例1〜4、比較例1〜3 表1に示す種類および配合量で、ポリアミド樹脂とテト
ラゾール系化合物を予めタンブラーを用いて混合した後
に、30mm同方向二軸混練機(池貝鉄工社製PCM3
0)に供給し、溶融混練して組成物を得た。得られた組
成物を射出成形機(住友重機社製)を用いて成形し、各
試験片を作成した。各試験片について、難燃性の結果を
表1に示す。
Examples 1 to 4 and Comparative Examples 1 to 3 After the polyamide resin and the tetrazole compound were mixed in advance by using a tumbler in the types and amounts shown in Table 1, a 30 mm coaxial biaxial kneader (Ikekai Iron Works) PCM3
0) and melt-kneaded to obtain a composition. The obtained composition was molded using an injection molding machine (manufactured by Sumitomo Heavy Industries, Ltd.) to prepare each test piece. Table 1 shows the results of the flame retardancy of each test piece.

【0016】[0016]

【表1】 [Table 1]

【発明の効果】本発明により、燃焼時にダイオキシンな
どによる環境汚染の発生がなく、燃焼ガスに毒性が無
く、自動車部品、家電製品、航空機部品、建築材料など
多方面の分野に好適に利用できる難燃性ポリアミド樹脂
組成物を得ることができる。
Industrial Applicability According to the present invention, there is no occurrence of environmental pollution due to dioxin or the like during combustion, and there is no toxicity to combustion gas, and it is difficult to use it suitably in various fields such as automobile parts, home electric appliances, aircraft parts and building materials. A flame-retardant polyamide resin composition can be obtained.

───────────────────────────────────────────────────── フロントページの続き (72)発明者 浜添 修 神奈川県川崎市川崎区千鳥町3番2号 昭 和電工株式会社総合研究所川崎研究室内 Fターム(参考) 4H028 AA30 AA44 BA03 BA06 4J002 CL001 CL011 CL031 CL051 EU006 GL00 GN00 GQ00 ────────────────────────────────────────────────── ─── Continuation of front page (72) Inventor Osamu Hamazoe 3-2 Chidoricho, Kawasaki-ku, Kawasaki-shi, Kanagawa Prefecture Showa Denko KK Kawasaki Laboratory F-term (reference) 4H028 AA30 AA44 BA03 BA06 4J002 CL001 CL011 CL031 CL051 EU006 GL00 GN00 GQ00

Claims (4)

【特許請求の範囲】[Claims] 【請求項1】(A)ポリアミド樹脂及び(B)該ポリア
ミド樹脂の成形温度以上の分解温度を有するテトラゾー
ル系化合物を含有する難燃性ポリアミド樹脂組成物。
1. A flame-retardant polyamide resin composition comprising (A) a polyamide resin and (B) a tetrazole compound having a decomposition temperature not lower than the molding temperature of the polyamide resin.
【請求項2】(A)ポリアミド樹脂が、ポリアミド6、
ポリアミド6・6、ポリアミド6/6・6共重合体から
なる群より選ばれた少なくとも一種である請求項1に記
載の難燃性ポリアミド樹脂組成物。
2. A method according to claim 1, wherein (A) the polyamide resin comprises polyamide 6,
The flame-retardant polyamide resin composition according to claim 1, which is at least one selected from the group consisting of polyamide 6.6 and polyamide 6/6/6 copolymer.
【請求項3】(B)ポリアミド樹脂の成形温度以上の分
解温度を有するテトラゾール系化合物が、5−フェニル
−1H−テトラゾール、5−アミノ−1H−テトラゾー
ル、5,5’−ビス−1H−テトラゾール及びそれらの
塩からなる群より選ばれた少なくとも一種である請求項
1または2に記載の難燃性ポリアミド樹脂組成物。
3. The tetrazole compound having a decomposition temperature not lower than the molding temperature of the polyamide resin (B) is 5-phenyl-1H-tetrazole, 5-amino-1H-tetrazole, 5,5'-bis-1H-tetrazole. The flame-retardant polyamide resin composition according to claim 1, which is at least one selected from the group consisting of: and a salt thereof.
【請求項4】(A)ポリアミド樹脂100重量部に対し
て、(B)該ポリアミド樹脂の成形温度以上の分解温度
を有するテトラゾール系化合物が0.1〜50重量部で
ある請求項1ないし請求項3のいずれかに記載の難燃性
ポリアミド樹脂組成物。
4. The composition according to claim 1, wherein (A) 100 parts by weight of the polyamide resin is 0.1 to 50 parts by weight of the tetrazole compound having a decomposition temperature higher than the molding temperature of the polyamide resin. Item 6. The flame-retardant polyamide resin composition according to any one of Items 3 to 7.
JP11164673A 1999-06-11 1999-06-11 Flame retardant polyamide resin composition Pending JP2000351896A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP11164673A JP2000351896A (en) 1999-06-11 1999-06-11 Flame retardant polyamide resin composition

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP11164673A JP2000351896A (en) 1999-06-11 1999-06-11 Flame retardant polyamide resin composition

Publications (1)

Publication Number Publication Date
JP2000351896A true JP2000351896A (en) 2000-12-19

Family

ID=15797673

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1422261A2 (en) * 2002-11-19 2004-05-26 Mitsubishi Gas Chemical Company, Inc. Flame-retardant thermosetting resin composition

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1422261A2 (en) * 2002-11-19 2004-05-26 Mitsubishi Gas Chemical Company, Inc. Flame-retardant thermosetting resin composition
EP1422261A3 (en) * 2002-11-19 2004-09-22 Mitsubishi Gas Chemical Company, Inc. Flame-retardant thermosetting resin composition

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