JP2000350226A - Solid-state image pickup element holding device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To joint an optical member with a solid-state image pickup element tightly and to make a solid-state image pickup element holding device, which holds the solid-state image pickup element on an optical member such as a prism, small in size, light in weight and low in price by sticking a holder on two different surface parts of an optical member and soldering a solid-state image pickup element holding member which holds the solid-state image pickup element to the holder. SOLUTION: While holders 6a and 6b are adhered to both flanks of prisms 2B, 2G and 2R, solid-state image pickup elements 3B, 3G and 3R are fitted to solid-state image pickup element holders 4B, 4G and 4R provided with join parts 5B, 5G and 5R. The join parts 7Ga and 7Gb of the holders 6a and 6b and the join part 5G of the solid-state image pickup element holder 4G fitted with the solid-state image pickup element 3G are soldered and the solid-state image pickup element 3G is joined with the holders 6a and 6b. Similarly, the solid-state image pickup element holders 4B and 4R are jointed with the holders 6a and 6b. Consequently, the solid-state image pickup elements 3B, 3G and 3R are held opposite the end surfaces of the prisms 2B, 2G and 2R.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a device for holding a solid-state image sensor, and more particularly, to a device for holding a solid-state image sensor at a predetermined position facing an end surface of an optical member such as a color separation prism.

[0002]

2. Description of the Related Art Conventionally, in a television camera or the like, various devices have been proposed which hold a solid-state image pickup device on an end surface of an optical member such as a color separation prism which separates subject light from an image pickup lens into a plurality of wavelength band components. ing.

In a color separation optical system using a color separation prism, the positions of a plurality of solid-state image sensors corresponding to a plurality of prisms must be mutually accurately adjusted with respect to, for example, the center, the imaging range, and the inclination. Therefore, soldering is desired rather than screwing as a joining method that can be easily adjusted to an arbitrary position. However, since it is not possible to solder directly to a prism made of glass, a holding member made of a solderable material is attached to the prism, and this holding member is soldered to another holding member holding the solid-state imaging device. Therefore, it is common to hold a solid-state imaging device on the prism end surface.

For example, an apparatus in which a metal plate having an opening is adhered to an end surface of a prism with an adhesive, and a solid-state image sensor holding member for holding a solid-state image sensor is joined to the metal plate by soldering. Also, an apparatus using a glass plate in place of a metal plate (for example, those described in Japanese Patent Application Laid-Open Nos. H2-162881 and 2-244993) is known.

Further, the present applicant has already disclosed a solid-state image pickup device joining method and apparatus described in Japanese Patent Application Laid-Open No. 11-26739,
It discloses a ceramic plate instead of a conventional metal plate or glass plate.

The outline of these conventional solid-state imaging device holding devices will be described with reference to the drawings. FIG. 3 is a diagram showing a configuration of an optical system using a color separation prism to which the solid-state imaging device holding device is applied, and FIG. 4 is a view in the direction of arrow A in FIG. The white light incident on the color separation prism 21 from the left side of FIGS. 3 and 4 is separated into three colors of RGB,
The light is incident on the solid-state imaging devices 23B, 23G, and 23R arranged downstream of 2B, 22G, and 22R. For the sake of simplicity, only the solid-state imaging device 23G and the solid-state imaging device holder 24G attached to the rear end face of the prism 22G are shown in the figure, and the other solid-state imaging devices 23B and 23R and the solid-state imaging device holders 24B and 24R are shown. Is omitted.

At the rear end surfaces of the prisms 22B, 22G, 22R, openings 33B, 33G, 33R (openings 33B, 33R are omitted) at positions corresponding to the imaging ranges of the solid-state imaging devices 23B, 23G, 23R. The formed plates 31B, 31G, 31R are stuck by an adhesive. The plates 31B, 31G, and 31R are adhered at portions that do not interfere with the light beams emitted from the prisms 22B, 22G, and 22R, and the openings 33B, 33G,
33R is positioned.

On the other hand, the solid-state imaging devices 23B, 23G, 23
R (solid-state imaging devices 23B and 23R are not shown) is attached to solid-state imaging device holders 24B, 24G and 24R (solid-state imaging device holders 24B and 24R are not shown). 24G, 24
R is joined to the plates 31B, 31G, and 31R by soldering. For example, in FIG. 4, the solid-state imaging device holder 24G is formed with a joining portion 25G projecting in the vertical direction. Solder is filled between the joining portion 25G and the joining portion 32G of the plate 31G, and the solid-state imaging device holder is formed. 24G is joined to plate 31G. Note that the other solid-state imaging devices 23B and 23R also have a solid-state imaging device 23G.
The prisms 22B and 22R are held on the rear end surfaces in the same manner as in the above.

In the solid-state imaging device bonding apparatus described in Japanese Patent Application Laid-Open No. 11-26739, the plates 31B, 31G,
A ceramic plate is used as 31R. Therefore, there is no danger that the performance of the optical member will be degraded due to heat during soldering as in the case of a metal plate, and high precision is required for the work process when manufacturing glass or bonding to an optical member like a glass plate. Without preventing the deterioration of the optical member or the image picked up by the solid-state image sensor,
Further, the solid-state imaging device can be joined to the optical member without lowering the manufacturing efficiency.

[0010]

According to the apparatus using the ceramic plate as described above, the solid-state image pickup device can be held on the terminal surface of the optical member efficiently and without fear of performance degradation. However, for example, when the solid-state imaging device thus joined is mounted on a television camera and put to practical use, the impact may cause the soldered optical member and ceramic plate to peel off.

In order to address this problem in the above-described apparatus, it is possible to increase the bonding area for soldering. However, in this case, it is necessary to reduce the opening corresponding to the imaging range of the solid-state imaging device. In this case, it is necessary to enlarge the optical element and the ceramic plate to increase the bonding area. However, this measure is not desirable because it increases the size and weight of the apparatus and increases the cost.

Further, as described above, since the positions of the plurality of solid-state imaging devices need to be accurately adjusted with respect to each other, many precise manufacturing steps are required, which is disadvantageous in terms of cost. .

SUMMARY OF THE INVENTION The present invention has been made in view of such circumstances, and aims at strengthening the joining between an optical member and a solid-state imaging device, reducing the size and weight of the device, and reducing the price of the device. It is an object of the present invention to provide a solid-state imaging device holding device that can perform the above-described operations.

[0014]

According to the present invention, there is provided a solid-state image pickup device holding device having a solderable joint, and first and second holding members attached to two different surfaces of an optical member. A member, a joining portion joined by soldering to a joining portion of the first and second holding members, and an element holding portion for holding a solid-state imaging device; And a solid-state image sensor holding member that holds the solid-state image sensor in a positioned state.

[0015] The optical member may be a color separation prism, and the first and second holding members may be respectively attached to two opposite side surfaces of the color separation prism.

Preferably, the material of the first and second holding members is permalloy.

[0017]

Embodiments of the present invention will be described below with reference to the drawings.

FIGS. 1 and 2 are views showing the configuration of an optical system using a color separation prism provided with a solid-state image sensor holding device according to an embodiment of the present invention. Here, FIG. 1 is a front view, and FIG. 2 is a view in the direction of arrow A in FIG.

As shown in FIG. 1, the color separation prism 1 used in the optical system having the solid-state image pickup device holding device according to the present embodiment comprises three prisms 2B, 2G and 2R joined together. The solid-state imaging devices 3B, 3B to be described later are opposed to the rear end surfaces of the prisms 2B, 2G, 2R.
G and 3R are held. In FIG. 1, for simplicity, the solid-state image sensor 3G and the solid-state image sensor holder 4G attached to the rear end face of the prism 2G
Only the solid-state imaging devices 3B and 3R and the solid-state imaging device holders 4B and 4R are not shown in the figure.

In this optical system, a filter member 8 composed of a near-infrared cut filter, an ND / color temperature conversion filter, a low-pass filter, etc.
White light incident on the color separation prism 1 through the RGB
, And each prism 2B, 2G, 2R
Through the trimming filters 9B, 9G, and 9R that adjust the spectral characteristics of B, R, and G that are joined to the rear end surface, the light is incident on the solid-state imaging devices 3B, 3G, and 3R that are disposed at the subsequent stage. . In FIG. 2, the trimming filters 9B, 9G, and 9R are omitted.

Next, the solid-state imaging device holding device according to the present embodiment will be explained. However, in the present embodiment, only the portion that holds the solid-state imaging device 3G will be described, and holding of the other solid-state imaging devices 3B and 3R is the same as that of the solid-state imaging device 3G, so detailed description will be omitted.

Here, a holder 6a made of permalloy,
Reference numeral 6b is attached to the prisms 2B, 2G, and 2R with an adhesive so that the color separation prism 1 including the prisms 2B, 2G, and 2R is integrally sandwiched from opposite side surfaces. The holders 6a, 6b are connected to the joints 5B, 5G, 5R (solid joints 5) of the solid-state image sensor holders 4B, 4G, 4R.
B, 5R are not shown in the figure).
Bb, 7Ga, 7Gb, 7Ra, 7Rb.
That is, as shown in FIG. 1, the holders 6a correspond to the respective solid-state imaging device holders 4B, 4G, and 4R, and are joints 7Ba and 7G that are bent at right angles to the main body of the holder 6a.
a, 7Ra at two locations, respectively, and the holder 6b (not shown)
Two joints 7Bb, 7Gb, and 7Rb corresponding to B, 4G, and 4R, respectively, which are bent at right angles to the main body of the holder 6b are provided. These joints 7Ba, 7G
a, 7Ra and the joints 7Bb, 7Gb, 7Rb are arranged to extend in opposite directions when the holders 6a, 6b are adhered to both side surfaces of the color separation prism 1, respectively.

On the other hand, the solid-state imaging device 3G is attached to the device holding portion so as to straddle the device holding portion of the solid-state imaging device holder 4G. The solid-state imaging device holder 4G is formed with a joining portion 5G that is joined to the joining portions 7Ga and 7Gb of the holders 6a and 6b in a vertical direction in FIG. 2 (a depth direction in FIG. 1). The solid-state imaging device holder 4G is joined to the holders 6a and 6b by soldering joining with the joining portions 7Ga and 7Gb.

Thus, the solid-state image sensor holder 4G
Are held so that the imaging surface of the solid-state imaging device 3G is positioned and fixed so as to correspond to the imaging position x.

The other solid-state image sensors 3B and 3R also have a solid-state image sensor holder 4 like the solid-state image sensor 3G.
B and 4G are joined to the holders 6a and 6b by soldering, and are held so as to face the rear end surfaces of the prisms 2B and 2R.

As described above, in the present embodiment, instead of separately attaching a plate to the end face of each prism as in the conventional example, the three prisms 2B, 2G, and 2R are integrated and the holders 6a, 6b are attached to both sides thereof. It is stuck on the surface. As a result, the number of holder members to be manufactured is reduced from three to two, and furthermore, it is only necessary to align the two holders 6a and 6b on both side surfaces instead of separately performing the alignment of the three plates. It is simplified and the manufacturing cost can be reduced.

In the conventional example, a plate is separately adhered to the end surface of each prism. However, since this surface is a surface through which light is transmitted, care must be taken that the adhered portion does not protrude beyond a predetermined portion during manufacturing. Elaborate work is required. According to the present embodiment, since the holders 6a and 6b are bonded to the side surfaces of the prisms 2B, 2G and 2R, strictness is not required as in the conventional example, and the manufacturing process is also simplified.

Further, three prisms 2B, 2G, 2R
Can be adhered over a wider area than is adhered to a part of each prism end surface, so that the color separation prism 1 and the holders 6a and 6b are hardly peeled off, and a solid-state imaging device which is more resistant to impact than before. An element holding device can be provided.

Conventionally, in order to stably adhere a plate to a part of the end surface of each prism, the end surface needs an area in which an adhesion portion is added to an imaging range of a solid-state image sensor, and a prism correspondingly larger is used. Needed. For example,
In the conventional optical system shown in FIG.
Has a vertical length (width of the prism) of 23 mm. In this embodiment, since the adhesive portion is not required on the terminal surface, the vertical length (width of the prism) of the prism 2G in FIG. 2 using the same solid-state imaging device is 18 mm. As described above, by using a smaller prism, the size, weight, and cost of the device can be reduced.

In this embodiment, the holders 6a, 6b
Is formed by permalloy. Holders 6a, 6b
As a material of the prism 2, first, it is possible to join the solid-state imaging device holding member by soldering, and the prisms 2 </ b> B, 2 </ b> G, 2 </ b> R
Since it adheres to the side surface, a material having the same coefficient of thermal expansion as the coefficient of thermal expansion is desirable for preventing peeling. Here, since the prism is made of glass, it is possible to use, for example, permalloy or ceramic as a material having the same thermal expansion coefficient as glass. However, permalloy is superior to ceramic in terms of ease of molding.

Also, in order to reduce the image shift due to temperature change during use, the holders 6a and 6b are provided with a plurality of prisms 2B,
It is desirable that the entire 2G, 2R be a block and adhere to both side surfaces thereof.

In the above-described embodiment, the solid-state image pickup devices 3B, 3G,
Although the solid-state imaging device holding device according to the present invention is applied to join the 3Rs, the optical member is not limited to a device using a prism, and the solid-state imaging device holding device according to the present invention can be applied to any optical member. Needless to say, the present invention can be applied to a case where elements are joined.

Further, depending on the shape of the optical member, it is not always necessary to attach the holder to the two opposing side surfaces of the optical member, and the holder may be attached to two different surface portions of the optical member. Good.

[0034]

As described above in detail, the solid-state image pickup device holding device according to the present invention has two different optical members.
By attaching a holding member to one surface portion and joining the solid-state imaging device holding member holding the solid-state imaging device to the holding member by soldering, the joining between the optical member and the solid-state imaging device is strengthened, and the device is The size and weight of the device can be reduced, and the price of the device can be reduced by simplifying the manufacturing process.

[Brief description of the drawings]

FIG. 1 is a schematic diagram showing a configuration of an optical system using a color separation prism to which a solid-state imaging device holding device according to an embodiment of the present invention is applied.

FIG. 2 is a view in the direction of arrow A in FIG. 1;

FIG. 3 is a schematic diagram showing a configuration of an optical system using a color separation prism to which a conventional solid-state imaging device holding device is applied.

FIG. 4 is a view in the direction of arrow A in FIG. 3;

[Explanation of symbols]

1, 21 color separation prism 2B, 2G, 2R, 22B, 22G, 22R prism 3B, 3G, 3R, 23B, 23G, 23R solid-state imaging device 4B, 4G, 4R, 24B, 24G, 24R solid-state imaging device holder 5B, 5G 5R, 25B, 25G, 25R Joints of solid-state imaging device holders 6a, 6b Holders 7Ra, 7Rb, 7Ga, 7Gb, 7Ba, 7Bb
Joint part of holder 8 Filter part 9B, 9G, 9R Trimming filter 31B, 31G, 31R Plate 32B, 32G, 32R Joint part of plate 33B, 33G, 33R Opening × imaging position

Continued on the front page F term (reference) 4M118 AA10 AB01 GC08 GC11 GC20 HA23 HA24 5C022 AC42 AC55 5C024 AA01 CA31 CA33 EA06 EA08 FA01 FA13 5C065 AA01 AA03 BB42 CC01 DD01 DD19 EE01 EE14 EE16 EE17

Claims (3)

[Claims] 1. A first and a second holding member having a solderable joint and adhered to two different surface portions of an optical member, and joining the first and the second holding member. A solid-state imaging device having a joining portion joined by soldering to a portion and an element holding portion for holding the solid-state imaging device, and holding the solid-state imaging device at a predetermined position facing a terminal surface of the optical member A solid-state imaging device holding device comprising an element holding member. 2. The optical member is a color separation prism,
2. The solid-state imaging device holding device according to claim 1, wherein said first and second holding members are respectively adhered to two opposite side surfaces of said color separation prism. 3. The material of the first and second holding members is made of permalloy.
13. The solid-state imaging device holding device according to claim 1.