JP2000349584A - Piezoelectric component and its manufacture - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a small-sized piezoelectric component with enhanced reliability by placing a connection electrode that realizes continuity between a vibration electrode of a piezoelectric element and a terminal electrode for external connection at an area not affected by the solder applied to the terminal electrode for the external connection. SOLUTION: Ends of front and rear lead electrodes 14, 15 of a piezoelectric element 1 are led out to both side edges of a piezoelectric substrate 11. Ends of a 1st terminal electrode 41 of a base 4 are led to side edges opposite to the side edges to which the front lead terminal 14 is led out. Ends of a 2nd terminal electrode 42 are led to side edges opposite to the side edges to which the rear lead terminal 15 is led out. By connection electrodes 51, 52 attached to the side face of the substrate 11, continuity between the end of the 1st terminal electrode 41 and the end of the front lead electrode 14 and continuity between the end of the 2nd terminal electrode 42 and the end of the rear lead electrode 15 are realized.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

The present invention relates to a filter, for example,
The present invention relates to a piezoelectric component used as a resonator or an oscillator and a method for manufacturing the same.

[0002]

2. Description of the Related Art Piezoelectric components of this type include, for example, PHS,
It is used for portable information communication devices such as mobile phones, and its small size has a significant effect on its usefulness as a product. Various attempts have been made in the past to reduce the size, and it seems that the limit has been almost reached.

For example, Japanese Patent Application Laid-Open No. 5-167381 discloses a method in which a sealing layer and a base substrate are arranged on the front and back sides of a piezoelectric element, and an adhesive is applied between the piezoelectric element and the sealing layer and the base substrate. A piezoelectric component having a sandwich structure bonded via a resin layer containing the same is disclosed.

[0004] Of the surface electrode and the back electrode of the piezoelectric element, the electrode formed on the surface facing the mounting surface of the base substrate, for example, the front electrode, leads its lead electrode to the edge of the piezoelectric substrate and conducts the conductive electrode. Conductive connection is made to an external connection terminal electrode provided on the base substrate using a paste or the like.

[0005] A back electrode formed on the surface opposite to the front electrode is led out to the surface on which the front electrode is formed through a through conductor provided on the piezoelectric substrate, and a land formed on the surface is formed. Conductive pattern). The edge of the land is led out to the edge of the piezoelectric substrate, and is connected to an external connection terminal electrode provided on the base substrate using a conductive paste or the like. With this structure, a small and highly reliable piezoelectric component is obtained.

In this structure, one means for further downsizing is a through conductor for leading the back electrode to the surface of the piezoelectric substrate, and a land (conductor pattern) for connecting the through conductor on the surface of the piezoelectric substrate. Is omitted. However, it is not easy to design such a structure in consideration of the above-mentioned basic electrode structure of the piezoelectric element in a case where the size is already reduced to the limit.

Next, the external connection terminal electrodes provided on the base substrate usually have a multi-layered plating film structure in consideration of the adhesion to the base substrate and the soldering characteristics. If a plating process for forming an external connection terminal electrode is performed in a state where the assembly of the piezoelectric element and the sealing layer is mounted on the base substrate, the assembly of the piezoelectric element and the sealing layer is
It is immersed in a plating bath together with the base substrate. In this plating process, the piezoelectric element and the sealing layer are adversely affected by the plating bath. In addition, the plating bath intrudes into the cavity from the interface between the piezoelectric element and the sealing layer, causing the deterioration of the vibrating electrode, the residual plating bath, and the like, which adversely affects the vibration characteristics essential for this type of piezoelectric component. Will be given.

[0008]

SUMMARY OF THE INVENTION An object of the present invention is to eliminate the need for a through conductor penetrating a piezoelectric substrate in the front and back directions and a land (conductor pattern) for connecting the through conductor, and to a piezoelectric device suitable for miniaturization. To provide parts.

Another object of the present invention is to provide a connection electrode for conducting between a vibration electrode of a piezoelectric element and an external connection terminal electrode, which is outside the influence of the solder attached to the external connection terminal electrode, thereby achieving reliability. An object of the present invention is to provide a piezoelectric component capable of improving the performance.

Still another object of the present invention is to provide a piezoelectric component having a structure that does not require immersing an assembly including a piezoelectric element and a sealing structure in a plating bath, and a method of manufacturing the same. It is.

[0011]

In order to solve the above-mentioned problems, a piezoelectric component according to the present invention comprises a piezoelectric element, a first sealing structure, a second sealing structure, a base substrate, And a plurality of connection electrodes.

The piezoelectric element includes a piezoelectric substrate, a front electrode,
And a back electrode. The front electrode has at least one front lead electrode, and is provided on a surface of the piezoelectric substrate. An end of the front lead electrode is led out to a side edge of the piezoelectric substrate. The back electrode has at least one back lead electrode, is provided on a back surface of the piezoelectric substrate, and faces the front electrode. An end of the back lead electrode is led out to a side edge of the piezoelectric substrate.

The first sealing structure is attached to the surface of the piezoelectric substrate, forms a first cavity for vibration around the front electrode, and seals the first cavity. I do.

The second sealing structure is attached to a back surface of the piezoelectric substrate, and a second sealing structure for vibrating around the back electrode.
And the second cavity is sealed.

[0015] The base substrate includes an insulating substrate, a first terminal electrode, and a second terminal electrode. The base substrate supports an assembly of the piezoelectric element, the first sealing structure, and the second sealing structure on one surface side of the insulating substrate. The first terminal electrode is formed on the insulating substrate, and has an end led out to a side edge of the front lead electrode opposite to the led-out side edge. The second terminal electrode includes:
An end portion is formed on the insulating substrate, and an end portion is led out to a side edge facing the side edge from which the back lead electrode is led out.

The connection electrode is attached to a side surface of the assembly and the base substrate, and connects the end of the first terminal electrode to the end of the front lead electrode;
The end of the terminal electrode is electrically connected to the end of the back lead electrode.

As described above, in the piezoelectric component according to the present invention, the piezoelectric element includes the piezoelectric substrate, the front electrode, and the back electrode. The front electrode includes at least one front lead electrode and is provided on the surface of the piezoelectric substrate. The back electrode includes at least one back lead electrode and is provided on the back surface of the piezoelectric substrate. The back electrode faces the front electrode. Therefore, piezoelectric vibration characteristics by the front and back electrodes can be obtained.

The first sealing structure is attached to the surface of the piezoelectric substrate, forms a first cavity for vibration around the front electrode, and seals the first cavity. The second sealing structure is attached to the back surface of the piezoelectric substrate, forms a cavity for vibration around the back electrode, and seals the second cavity. Therefore, the piezoelectric vibration is performed in the first cavity and the second cavity sealed by the first sealing structure and the second sealing structure.

The base substrate includes an insulating substrate. One surface of the insulating substrate supports an assembly of the piezoelectric element, the first sealing structure, and the second sealing structure. Thereby, the reinforcing effect by the base substrate is obtained, and a piezoelectric component having high mechanical strength is obtained.

The front electrode has at least one front lead electrode. The front lead electrode is electrically connected to the front electrode, and the end is led out to the side edge of the piezoelectric substrate. At least one back electrode
It has one back lead electrode, and the back lead electrode is electrically connected to the back electrode, and an end is led out to a side edge of the piezoelectric substrate.

[0021] The base substrate includes a first terminal electrode and a second terminal electrode. The first terminal electrode is formed on the insulating substrate, and has an end led out to a side edge facing the led-out side edge of the front lead electrode. The second terminal electrode is formed on the insulating substrate, and has an end led out to a side edge facing the led side edge of the back lead electrode.

The connection electrode is attached to the side surface of the assembly and the base substrate, and connects the end of the first terminal electrode to the end of the front lead electrode, and connects the end of the second terminal electrode to the back lead electrode. To the end of

According to this structure, it is clear that a through conductor penetrating through the piezoelectric substrate in the front and back directions and a land (conductor pattern) for connecting the through conductor are unnecessary, and therefore, it is suitable for miniaturization. A piezoelectric component can be obtained.

In addition, by adopting a design in which the connection electrode is provided at a position different from the external soldering area of the first terminal electrode and the second terminal electrode, the connection electrode is attached to the external connection terminal electrode. The reliability can be improved outside the influence of the solder.

Further, since the connection electrode can be kept out of the influence of the solder attached to the external connection terminal electrode, the connection electrode uses a conductive material and a forming process different from those of the first and second terminal electrodes. Can be adopted. For example, the first
And the second terminal electrode has a multi-layered plating film structure in consideration of adhesion to the base substrate and soldering characteristics, and the connection electrode is formed as a thin film by using a thin film forming process such as sputtering or vapor deposition. can do.

Preferably, the thickness of each of the front lead electrode and the back lead electrode is greater at the end portion led out to the side edge of the piezoelectric substrate than at the other portions. According to such a structure, the contact area between the front and rear lead electrodes and the connection electrode can be increased, and the reliability of the electrical connection and the mechanical connection can be improved.

The manufacturing method according to the present invention for manufacturing the above-described piezoelectric component includes a step of manufacturing an assembly including a piezoelectric element, a first sealing structure, and a second sealing structure. Further, the method includes a step of manufacturing a base substrate separately from the step of manufacturing the assembly.

Then, the assembly obtained through the above steps is mounted on one surface of an insulating substrate constituting a base substrate obtained through another step, and connection electrodes are attached to the side surfaces of the assembly and the base substrate. Then, the end of the first terminal electrode is made conductive to the end of the front lead electrode, and the end of the second terminal electrode is made conductive to the end of the back lead electrode.

According to this manufacturing method, it is not necessary to immerse the assembly composed of the piezoelectric element and the sealing layer in the plating bath. Therefore, the piezoelectric element and the sealing layer are not adversely affected by the plating bath. In addition, since the plating bath does not enter the cavity from the interface between the piezoelectric element and the sealing layer, deterioration of the vibrating electrode due to the penetration of the plating bath, residual plating bath, and the like can be avoided. It is possible to obtain a stable piezoelectric component.

The present invention further discloses a specific application example to a piezoelectric component used as, for example, a filter, a resonator or an oscillator. Other objects, configurations and advantages of the present invention will be described in more detail with reference to the accompanying drawings. The accompanying drawings are merely illustrative.

[0031]

FIG. 1 is an exploded perspective view of a piezoelectric component according to the present invention, FIG. 2 is a perspective view showing an assembled state of the piezoelectric component shown in FIG. 1, and FIG. It is sectional drawing along. The illustrated embodiment shows an example of a piezoelectric component suitable for use as a resonator or an oscillator.

The illustrated piezoelectric component includes a piezoelectric element 1, a first sealing structure 2, a second sealing structure 3, a base substrate 4, and two connection electrodes 51 and 52. .

The piezoelectric element 1 includes a piezoelectric substrate 11 and a front electrode 1
2 and a back electrode 13. The front electrode 12 has a front lead electrode 14 and is provided on the surface of the piezoelectric substrate 11. The front lead electrode 14 is electrically connected to the front electrode 12, and the end is led out to the side edge of the piezoelectric substrate 11. The back electrode 13 is a piezoelectric substrate 1
1 and is opposed to the front electrode 12. The back lead electrode 15 is electrically connected to the back electrode 13, and the end of the back lead electrode 15 is
To the side edge. As a constituent material of the piezoelectric substrate 11, a conventionally well-known material can be used.
Back electrode 13, front lead electrode 14, and back lead electrode 15
Can be formed by applying a thin film technique such as sputtering or a thick film technique.

The first sealing structure 2 is attached to the surface of the piezoelectric substrate 11, forms a first cavity 6 around the front electrode 12 for vibration, and seals the first cavity 6. I do.
The second sealing structure 3 is attached to the back surface of the piezoelectric substrate 11, forms a second cavity 7 for vibration around the back electrode 13, and seals the second cavity 7.

The base substrate 4 includes an insulating substrate 40, a first terminal electrode 41, and a second terminal electrode 42. In the embodiment, the third terminal electrode 43 is also illustrated. The base substrate 4 includes the piezoelectric element 1 and the first
An assembly constituted by the sealing structure 2 and the second sealing structure 3 is supported. The first terminal electrode 41 is
An upper end is formed on the side edge of the front lead electrode 14 opposite to the side edge of the front lead electrode 14. The second terminal electrode 42 is formed on the insulating substrate 40, and its end is led out to a side edge facing the drawn out side edge of the end of the back lead electrode 15. The insulating substrate 40 forming the base substrate 4 can be formed of ceramic. The first terminal electrode 41 and the second terminal electrode 42 are used for external solder connection when mounted on a circuit board or the like. Therefore,
It is desirable to have characteristics excellent in solderability. Specifically, the lowermost layer in contact with the insulating substrate 40 is a silver layer formed by baking, and a nickel plating layer is provided thereon to serve as a solder erosion prevention layer for the silver layer. A composite plating film structure in which a plating layer is provided to improve solderability can be given.

In the embodiment, the first terminal electrodes 41 to the third
Terminal electrodes 43 are spaced apart from each other by the insulating substrate 40.
Is formed in a band around. First terminal electrode 41
Are arranged so that the edge thereof is along the side edge of the piezoelectric substrate 11. The second terminal electrode 42 has a side edge opposite to the first terminal electrode 41. 11 are arranged along the side edge.

Of the connection electrodes 51 and 52, the connection electrode 51
Is attached to a side surface of the base substrate 4 and an end portion of the first terminal electrode 41, and an assembly including the piezoelectric element 1, the first sealing structure 2 and the second sealing structure 3. To the end of the front lead electrode 14. The connection electrode 52 is a connection electrode 5
The second terminal electrode 42 is attached to the side surface opposite to the first terminal electrode 1 and makes the end of the second terminal electrode 42 conductive to the end of the back lead electrode 15. The connection electrodes 51 and 52 can be formed as thin films, for example, by employing a thin film forming process such as sputtering or vapor deposition.

As described above, in the piezoelectric component according to the present invention, the piezoelectric element 1 includes the piezoelectric substrate 11 and the front electrode 12.
And a back electrode 13. The front electrode 12 includes at least one front lead electrode 14 and is provided on the surface of the piezoelectric substrate 11. The back electrode 13 includes at least one back lead electrode 15 and is provided on the back surface of the piezoelectric substrate 11. The back electrode 13 faces the front electrode 12. Therefore, the front electrode 1
2 and the back electrode 13 provide piezoelectric vibration characteristics.

The first sealing structure 2 is attached to the surface of the piezoelectric substrate 11, forms the first cavity 6 around the front electrode 12, and seals the first cavity 6. The second sealing structure 3 is attached to the back surface of the piezoelectric substrate 11 and has a back electrode 13.
, A second cavity 7 is formed, and the second cavity 7 is sealed. Therefore, the front electrode 12 and the back electrode 13 of the piezoelectric element 1 are in the first cavity 6 and the second cavity 7 sealed by the first sealing structure 2 and the second sealing structure 3. Piezoelectric vibration will be performed.

The base substrate 4 includes an insulating substrate 40. Piezoelectric element 1 and first sealing structure 2 on one side of insulating substrate 40
And the assembly of the second sealing structure 3. Thereby, the reinforcing effect by the base substrate 4 is obtained, and a piezoelectric component having high mechanical strength is obtained.

The front electrode 12 includes a front lead electrode 14,
The front lead electrode 14 is electrically connected to the front electrode 12, and the end is led out to the side edge of the piezoelectric substrate 11. The back electrode 13 includes a back lead electrode 15, and the back lead electrode 15 is
And the end is led out to the side edge of the piezoelectric substrate 11.

The base substrate 4 includes an insulating substrate 40, a first terminal electrode 41, and a second terminal electrode 42. The first terminal electrode 41 is formed on the insulating substrate 40, and has an end led out to a side edge facing the led-out side edge of the end of the front lead electrode 14. The second terminal electrode 42 is connected to the insulating substrate 4
0, and the end is led out to a side edge facing the drawn-out side edge of the end of the back lead electrode 15.

The connection electrodes 51 and 52 are attached to the side surfaces of the assembly and the base substrate 4, and the end of the first terminal electrode 41 is electrically connected to the end of the front lead electrode 14.
The second end is electrically connected to the end of the back lead electrode 15. In the case of the embodiment, the connection electrodes 51 and 52 are attached to opposing side surfaces of the assembly and the base substrate 4.

According to this structure, it is apparent that a through conductor penetrating the piezoelectric substrate 11 in the front and back directions and a land (conductor pattern) for connecting the through conductor are not required, and therefore, miniaturization is possible. Suitable piezoelectric components can be obtained.

Further, by providing the connection electrodes 51 and 52 at positions different from the external soldering regions of the first terminal electrode 41 and the second terminal electrode 42, the connection electrodes 51 and 52 are provided.
52 can be placed outside the influence of the solder attached to the external connection terminal electrodes 41 to 42, and the reliability can be improved.
In the case of the illustrated embodiment, of the four side surfaces of the insulating substrate 40,
The connection electrodes 51 and 52 are attached to other side surfaces that are different from the side surfaces on which the first terminal electrode 41 and the second terminal electrode 42 appear by approximately 90 degrees, so that the first terminal electrode 41 and the second When the second terminal electrode 42 is soldered on the circuit board,
The solder does not flow around the connection electrodes 51 and 52.

Further, since the connection electrodes 51 and 52 can be kept out of the influence of the solder attached to the external connection terminal electrodes, the connection electrodes 51 and 52 are formed by the first and second terminal electrodes 41 and 42. It can be formed of a conductive material different from the above, for example, a thin film or the like. First and second terminal electrodes 4
Each of the reference numerals 1 and 42 can have a multi-layered plating film structure in consideration of the adhesion to the base substrate 4 and the soldering characteristics. Therefore, a piezoelectric component having excellent solderability can be obtained.

The first sealing structure 2 and the second sealing structure 3 form a first cavity 6 and a second cavity 7 for vibration around the front electrode 12 and the back electrode 13. What is necessary is just a structure which can be performed.

In the illustrated embodiment, the first sealing structure 2 is
It includes a first cavity layer 21 and a first sealing layer 22. First
The cavity layer 21 is attached to the surface of the piezoelectric substrate 11 to form a concave portion at a portion corresponding to the front electrode 12. This recess forms the first cavity 6. The first cavity 6 includes the front electrode 1
An opening 60 is provided at a position deviated from 2 and is formed so as to surround the vibrating portion constituted by the front electrode 12, and a part thereof is communicated with the opening 60 through a narrow passage. The first sealing layer 22 is provided on the first cavity layer 21 and seals the first cavity 6.

The second sealing structure 3 includes a second cavity layer 31
And a second sealing layer 32. The second cavity layer 31
A concave portion is formed on a portion corresponding to the back electrode 13, which is attached to the back surface of the piezoelectric substrate 11. This recess forms the second cavity 7. The second cavity 7 has an opening 70 at a position deviated from the back electrode 13, is formed so as to surround the vibrating portion constituted by the back electrode 13, and a part thereof is passed through a narrow passage. It is communicated with the opening 70. The second sealing layer 32 is provided on the second cavity layer 31 and seals the second cavity 7.

The first hollow layer 21, the first sealing layer 22, the second hollow layer 31, and the first sealing layer 32 can be formed by applying a synthetic resin by screen printing, for example.

The embodiment further includes a top plate 23, and the top plate 23 is adhered to the first sealing layer 22 with an adhesive. The top plate 23 can be made of a ceramic sheet or an aramid sheet.

Further, in the embodiment, the front lead electrode 14 and the back lead electrode 15 are thicker at the end portions 16 and 17 extending to the side edges of the piezoelectric substrate 11 than at the other portions. ing. According to such a structure, the front lead electrode 1
4 and the contact area between the back lead electrode 15 and the connection electrodes 51 and 52 can be increased, and the reliability of electrical connection and mechanical connection can be improved.

FIG. 4 is an exploded perspective view showing another embodiment of the piezoelectric component according to the present invention, FIG. 5 is a perspective view of the piezoelectric component shown in FIG. 4 in an assembled state, and FIG. 6 is a line 6-6 in FIG. FIG. In the figures, the same components as those shown in FIGS. 1 to 3 are denoted by the same reference numerals. The illustrated embodiment shows an example of a piezoelectric component suitable for use as a filter or the like.

The piezoelectric component includes a piezoelectric element 1, a first sealing structure 2, a second sealing structure 3, and a base substrate 4.
And a plurality of connection electrodes 51 to 54. Piezoelectric element 1
Includes a piezoelectric substrate 11, a front electrode 12, and a back electrode 13. The front electrode 12 and the back electrode 13 have an electrode structure suitable for use as a filter or the like. In the embodiment, two front electrodes 12 are provided.

FIG. 7 is a plan view of the piezoelectric element 1, and FIG. 8 is a bottom view of the piezoelectric element 1 shown in FIG. As shown, each of the front electrodes 12, 12 has two divided electrodes 121,
122. Of the two divided electrodes 121 and 122,
The split electrodes 122 are connected to each other between the front electrodes 12-12. In the embodiment, the divided electrodes 1 of the front electrodes 12 and 12 are used.
22 and 122 are connected to each other via a capacitor electrode 143 in the middle.

In the two front electrodes 12, two split electrodes 1 included in the left (in the figure) front electrode 12
Of the electrodes 21 and 122, the split electrode 121 that is not connected between the front electrodes 12-12 has the first front lead electrode 141. The end of the first front lead electrode 141 is led out to the side edge of the piezoelectric substrate 11. In the embodiment, it is led to the left corner (in FIG. 7).

The right front electrode 12 has two divided electrodes 12
Of the electrodes 1 and 122, the split electrode 121 that is not connected between the front electrodes 12 and 12 has the second front lead electrode 142. The end of the second front lead electrode 121 is led out to the side edge of the piezoelectric substrate 11. Each end of the first front lead conductor 141 and the second front lead conductor 142 is led out to the opposite side edges of the piezoelectric substrate 11. In the embodiment, it is led to the right corner (in FIG. 7).

The back electrode 13 is provided on the back surface of the piezoelectric substrate 11 and faces the front electrodes 12 and 12. In the case of the embodiment, the back electrode 13 also overlaps with the capacitor electrode 143 on the front side, and also functions as a capacitor electrode.

The back electrode 13 has a back lead electrode 15. The back lead electrode 15 is electrically connected to the back electrode 13, and an end is led out to a side edge of the piezoelectric substrate 11. In the case of the embodiment, the back lead electrode 15 is guided to a substantially intermediate portion between both side edges of the piezoelectric substrate 11.

The description will be continued with reference to FIGS. The first sealing structure 2 is attached to the surface of the piezoelectric substrate 11,
First cavity 6 for vibration around front electrodes 12, 12
1 and 62 are formed, and the first cavities 61 and 62 are sealed.

The second sealing structure 3 is attached to the back surface of the piezoelectric substrate 11 to form second cavities 71 and 72 around the back electrode 13 for vibration.
72 is sealed.

The base substrate 4 includes an insulating substrate 40, a first terminal electrode 41, a second terminal electrode 42, and a third terminal electrode 43. The first terminal electrode 41 and the second terminal electrode 42 are arranged on opposite sides of the insulating substrate 40, and their respective ends are opposed to the led-out side edges of the front lead electrodes 141 and 142. Derived to the edge. The first terminal electrode 41 and the second terminal electrode 42 are connected to the piezoelectric element 1,
It is cut off on the side where the assembly including the first sealing structure 2 and the second sealing structure 3 is mounted.

The third terminal electrode 43 is formed on the insulating substrate 40, and its end is led out to a side edge opposite to the side edge from which the back lead electrode 15 is led out. In the embodiment, a cross-shaped pattern is formed on one surface of the insulating substrate 40 on which the assembly is mounted, and both ends are led out to both side ends of the insulating substrate 40.

Of the connection electrodes 51 to 54, the connection electrode 51
Is attached to the side surface of the assembly and the base substrate 4, and connects the end of the first terminal electrode 41 to the end of the first front lead electrode 141. The connection electrode 52 is attached to the side surface of the assembly and the base substrate 4, and connects the end of the second terminal electrode 42 to the end of the second front lead electrode 142. The connection electrodes 53 and 54 conduct both ends of the third terminal electrode 43 to both ends of the back lead electrode 15.

It is apparent that the piezoelectric components shown in FIGS. 4 to 6 also do not require a through conductor penetrating the piezoelectric substrate 11 in the front and back directions, and a land (conductor pattern) for connecting the through conductor. Yes, and therefore, a piezoelectric component suitable for miniaturization can be obtained.

Further, by providing the connection electrodes 51 to 54 at positions different from the external soldering regions of the first terminal electrode 41 to the third terminal electrode 43, the connection electrodes 51 to 5
4 can be placed outside the influence of the solder attached to the external connection terminal electrodes 41 to 43, and the reliability can be improved. In the case of the illustrated embodiment, of the four side surfaces of the insulating substrate 40, the connection electrodes 51 to 54 are different from the side surfaces on which the surfaces of the first terminal electrode 41 to the third terminal electrode 43 appear by approximately 90 degrees. When the first terminal electrode 41 to the third terminal electrode 43 are soldered on the circuit board, they are not attached to the connection electrodes 51 and 52 because they are attached to the side surfaces.

Further, since the connection electrodes 51 to 54 can be kept out of the influence of the solder attached to the external connection terminal electrodes, the connection electrodes 51 to 54 are connected to the first terminal electrodes 41 to the third terminal electrodes. It can be formed of a conductive material different from the electrode 43, for example, a thin film or the like. First terminal electrodes 41 to 41
The third terminal electrode 43 can have a multi-layered plating film structure in consideration of the adhesion to the base substrate 4 and the soldering characteristics, and therefore, a piezoelectric component having excellent solderability can be obtained.

Next, a method for manufacturing a piezoelectric component according to the present invention will be described with reference to the drawings. The manufacturing method according to the present invention includes a step of manufacturing an assembly including the piezoelectric element 1, the first sealing structure 2, and the second sealing structure 3. FIG.
22 show this step.

First, as shown in FIG. 9, a large number of front electrodes 12 are formed on a piezoelectric substrate 11 in a predetermined pattern. The front electrode 12 can be formed by a high-precision pattern forming technique using photolithography, or can also be formed by screen printing or the like. The front electrode 12 is formed as a pattern having the front lead electrode 14.

Next, as shown in FIG. 10, an end electrode 16 made of the same electrode material as the front electrode 12 is laminated on the end of the front lead electrode 14.

The same steps are performed on the back side of the piezoelectric substrate 11. FIGS. 11 and 12 show the wafer-shaped piezoelectric substrate 11 thus obtained. The front electrode 12 and the front lead electrode 14 are formed on the surface of the piezoelectric substrate 11, and the back electrode 13 and the back lead electrode 15 are formed on the back surface. .

Next, as shown in FIGS. 13 and 14, resists 8 and 9 that cover the front electrode 12 and the back electrode 13 in a range larger than the outer diameter are applied and dried. Resist 8,
As 9, one that can be easily dissolved and removed with water, an alkali or an organic solvent is used.

Next, as shown in FIGS. 15 and 16, resins 21 and 31 are applied on the front and back surfaces of the wafer-shaped piezoelectric substrate 11 so as to fill the areas without the resists 8 and 9, dried and fixed. Let it. The resins 21 and 31 constitute the first and second hollow layers 21 and 31 (see FIGS. 1 to 3). First
The second cavity layers 21 and 31 have a pattern in which openings 60 and 70 are formed at positions deviated from the front electrode 12 and the back electrode 13.

Next, as shown in FIGS. 17 and 18, the resists 8 and 9 are removed through the openings 60 and 70. The resists 8 and 9 can be easily dissolved and removed with water, an alkali or an organic solvent as described above. Resist 8, 9
Are removed, spaces 6 and 7 serving as the first cavity and the second cavity are generated.

Next, as shown in FIGS. 19 and 20, the sealing layers 22 and 32 are laminated by means such as adhesion. Thereby, an assembly including the wafer-shaped piezoelectric substrate 11, the first sealing layer 22, and the second sealing layer 32 is obtained.

Next, as shown in FIG. 21, the wafer-shaped piezoelectric substrate 11, the first cavity layer 21, the first sealing layer 22, the second cavity layer 31, and the second sealing layer 32 are included. Assembly
X1-X1 line, X2-X2 line and (Y1-Y1 line)
(Y3-Y3 line) and cut in a grid. Before this cutting step, the top plate 23 (see FIGS. 1 to 3) may be attached.

The steps described above, that is, the piezoelectric element 1 and the first
In addition to the step of manufacturing an assembly including the sealing structure 2 and the second sealing structure 3, a base substrate is manufactured.

Then, as shown in FIG. 22, an assembly including the piezoelectric element 1, the first sealing structure 2, and the second sealing structure 3 obtained through the above steps is separated. Is mounted on one surface of the base substrate 4 obtained through the above process. In this process,
The top plate 23 may be attached.

Next, connection electrodes 51 and 52 are attached to the side surfaces of the assembly and the base substrate 4. Thereby, the end of the first terminal electrode 41 is conducted to the end of the front lead electrode 14, and the end of the second terminal electrode 42 is conducted to the end of the back lead electrode 15 (FIGS. 1 to 3). reference).

According to this manufacturing method, it is not necessary to immerse the assembly composed of the piezoelectric element 1 and the sealing structures 2 and 3 in the plating bath. Therefore, the piezoelectric element 1 and the sealing structures 2 and 3 are not adversely affected by the plating bath. In addition, since the plating bath does not enter the cavity from the interface between the piezoelectric element 1 and the sealing structures 2 and 3, deterioration of the vibrating electrode due to the penetration of the plating bath, remaining plating bath, and the like are also avoided. And a piezoelectric component having stable characteristics can be obtained.

Although not shown, the piezoelectric components shown in FIGS. 4 to 6 can be manufactured by the same process. Of course, FIG.
When manufacturing the piezoelectric component of FIG. 6, the pattern of the front and back electrodes, the number of connection electrodes, the pattern of the terminal electrodes, and the like must be changed.

[0082]

As described above, according to the present invention, the following effects can be obtained. (A) a through conductor that penetrates the piezoelectric substrate in the front and back directions, and
A land (conductor pattern) for connecting the through conductor is unnecessary, and a piezoelectric component suitable for miniaturization can be provided. (B) Provide a piezoelectric component that can improve reliability by setting a connection electrode for conducting between a vibration electrode of a piezoelectric element and a terminal electrode for external connection outside the influence of solder attached to the terminal electrode for external connection. can do. (C) It is possible to provide a piezoelectric component having a structure that does not require immersing an assembly including a piezoelectric element and a sealing structure in a plating bath, and a method of manufacturing the same.

[Brief description of the drawings]

FIG. 1 is an exploded perspective view of a piezoelectric component according to the present invention.

FIG. 2 is a perspective view showing an assembled state of the piezoelectric component shown in FIG.

FIG. 3 is a sectional view taken along line 3-3 in FIG. 2;

FIG. 4 is an exploded perspective view showing another embodiment of the piezoelectric component according to the present invention.

5 is a perspective view of the piezoelectric component shown in FIG. 4 in an assembled state.

6 is a sectional view taken along the line 6-6 in FIG. 5;

FIG. 7 is a plan view of a piezoelectric element included in the piezoelectric component shown in FIGS.

8 is a bottom view of the piezoelectric element shown in FIG.

FIG. 9 is a perspective view showing steps included in a method of manufacturing the piezoelectric component shown in FIGS.

FIG. 10 is a perspective view showing a step after the step shown in FIG. 9;

FIG. 11 is a perspective view showing a step after the step shown in FIG. 10.

FIG. 12 is an enlarged sectional view showing a part of the wafer-shaped piezoelectric substrate obtained by the process of FIG.

FIG. 13 is a perspective view showing a step after the step shown in FIGS.

FIG. 14 is an enlarged cross-sectional view showing a part of the wafer-shaped piezoelectric substrate obtained by the process of FIG.

FIG. 15 is a perspective view showing a step after the step shown in FIGS.

FIG. 16 is an enlarged sectional view showing a part of the wafer-shaped piezoelectric substrate obtained by the process of FIG.

FIG. 17 is a perspective view showing a step after the step shown in FIGS.

FIG. 18 is an enlarged sectional view showing a part of the wafer-shaped piezoelectric substrate obtained by the process of FIG.

FIG. 19 is a perspective view showing a step after the step shown in FIGS.

FIG. 20 is an enlarged sectional view showing a part of the wafer-shaped piezoelectric substrate obtained by the step of FIG. 19;

21 is a perspective view showing a step that follows the step shown in FIGS. 19 and 20. FIG.

FIG. 22 is a perspective view showing a step after the step shown in FIG. 21.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Piezoelectric element 2 1st sealing structure 3 2nd sealing structure 4 Base substrate 51-54 Connection electrode

 ──────────────────────────────────────────────────続 き Continuing on the front page (72) Inventor Masahiro Kitajima 1-13-1 Nihonbashi, Chuo-ku, Tokyo FTD term in TDK Corporation (reference) 5J108 AA07 CC04 EE03 EE04 FF07 FF11 FF13 GG03 GG08 GG16 JJ02 KK02 KK04 MM02

Claims (6)

[Claims] 1. A piezoelectric element, a first sealing structure, and a second sealing structure.
A sealing component, a base substrate, and a plurality of connection electrodes, a piezoelectric component, wherein the piezoelectric element includes a piezoelectric substrate, a front electrode, and a back electrode, the front electrode, The piezoelectric device has a front electrode provided on a front surface of the piezoelectric substrate, the front electrode having at least one front lead electrode, and an end of the front lead electrode extending to a side edge of the piezoelectric substrate. And has at least one back lead electrode facing the front electrode,
An end of the back lead electrode is led to a side edge of the piezoelectric substrate. The first sealing structure is attached to the surface of the piezoelectric substrate, and a first sealing structure is formed around the front electrode. A first cavity, and seals the first cavity. The second sealing structure is attached to a back surface of the piezoelectric substrate, and forms a second cavity around the back electrode. The base substrate includes an insulating substrate, a first terminal electrode, and a second terminal electrode. The base substrate includes an insulating substrate, a first terminal electrode, and a second terminal electrode. An element, an assembly including the first sealing structure and the second sealing structure are supported, the first terminal electrode is formed on the insulating substrate, and an end portion is formed on the front lead. The second terminal electrode is led to a side edge facing the side edge from which the electrode is led, and the second terminal electrode is An edge portion is formed on an edge substrate, and an end portion is led to a side edge facing the side edge from which the back lead electrode is led, and the connection electrode is provided on a side surface of the assembly and the base substrate. A piezoelectric component that is attached and that conducts the end of the first terminal electrode to the end of the front lead electrode and conducts the end of the second terminal electrode to the end of the back lead electrode. 2. A piezoelectric element, a first sealing structure, and a second sealing structure.
A sealing component, a base substrate, and a plurality of connection electrodes, a piezoelectric component, wherein the piezoelectric element includes a piezoelectric substrate, a front electrode, and a back electrode, the front electrode, One, having one front lead electrode, provided on the surface of the piezoelectric substrate, the front lead electrode has an end led out to one side edge of the piezoelectric substrate, and the back electrode One, having one back lead electrode, provided on the back surface of the piezoelectric substrate and facing the front electrode, wherein the back lead electrode has an end on the other side of the piezoelectric substrate The first sealing structure is attached to a surface of the piezoelectric substrate, forms a first cavity around the front electrode, and seals the first cavity. The second sealing structure is attached to a back surface of the piezoelectric substrate, and a second sealing structure is formed around the back electrode. And the second substrate is sealed, and the base substrate includes an insulating substrate, a first terminal electrode, and a second terminal electrode, and one surface side of the insulating substrate. Supports an assembly including the piezoelectric element, the first sealing structure, and the second sealing structure, wherein the first terminal electrode is formed on the insulating substrate, and an end is The second terminal electrode is formed on the insulating substrate, and the second terminal electrode is formed on the insulating substrate, and the end portion is formed on the back lead electrode. The connection electrode is attached to a side edge of the assembly and the base substrate, and the edge of the first terminal electrode is connected to the front lead electrode. And the edge of the second terminal electrode is electrically connected to the edge of the back lead electrode. Piezoelectric parts to. 3. A piezoelectric element, a first sealing structure, and a second sealing structure.
A sealing component, a base substrate, and a plurality of connection electrodes, a piezoelectric component, wherein the piezoelectric element includes a piezoelectric substrate, a front electrode, and a back electrode, the front electrode, A plurality thereof, provided on the surface of the piezoelectric substrate, each of the front electrodes includes two split electrodes, and one of the two split electrodes is connected to each other between the front electrodes; Of the two divided electrodes included in one of the front electrodes, the divided electrode that is not connected between the front electrodes has a first front lead electrode, and the first front lead electrode has an end portion that is The split electrode that is led to the side edge of the piezoelectric substrate and that is not connected between the front electrodes among the two split electrodes included in the other of the front electrodes has a second front lead electrode; The front lead electrode of No. 2 has
The back electrode is provided at a side edge of the piezoelectric substrate, and the back electrode is provided on a back surface of the piezoelectric substrate, faces the plurality of front electrodes in common, and has at least one back lead electrode. The lead electrode is electrically connected to the back electrode, and an end is led out to a side edge of the piezoelectric substrate. The first sealing structure is attached to a surface of the piezoelectric substrate, and the front electrode is Forming a first cavity around and sealing the first cavity, the second sealing structure is attached to a back surface of the piezoelectric substrate, and a second sealing structure is formed around the back electrode. And forming a second cavity, and sealing the second cavity. The base substrate includes an insulating substrate, a first terminal electrode, a second terminal electrode, and a third terminal electrode. The piezoelectric element, the first sealing structure, and the second sealing on one surface side of the insulating substrate Supporting an assembly including a structure, the first terminal electrode, the second terminal electrode, and the third terminal electrode;
Are formed on the insulating substrate, and each end is led to a side edge facing the side edge from which the front lead electrode and the back lead electrode are led, and the connection is performed. An electrode is attached to a side surface of the assembly and the base substrate, and connects the end of the first terminal electrode to the first terminal electrode.
The end of the second terminal electrode is electrically connected to the end of the second terminal electrode, and the end of the third terminal electrode is electrically connected to the end of the second terminal electrode. A piezoelectric component that is electrically connected to the end of the back lead electrode. 4. A method for manufacturing a piezoelectric component, comprising: manufacturing an assembly including a piezoelectric element, a first sealing structure, and a second sealing structure, Includes a piezoelectric substrate, a front electrode, and a back electrode, the front electrode is provided on the surface of the piezoelectric substrate, has at least one front lead electrode, the front lead electrode,
The back electrode is provided on a back surface of the piezoelectric substrate, is opposed to the front electrode, and has at least one back lead, which is electrically connected to the front electrode and has an end led out to a side edge of the piezoelectric substrate. Having electrodes,
The back lead electrode is electrically connected to the back electrode, and an end is led out to a side edge of the piezoelectric substrate. The first sealing structure is attached to the surface of the piezoelectric substrate, A first cavity is formed around the front electrode, and the first cavity is sealed. The second sealing structure is attached to a back surface of the piezoelectric substrate, Forming a second cavity around and sealing the second cavity, further comprising a step of manufacturing a base substrate separately from the step of manufacturing the assembly; An insulating substrate, a first terminal electrode, and a second terminal electrode, wherein the first terminal electrode is formed on the insulating substrate, and an end portion of the side from which the front lead electrode is led out. The second terminal electrode is led out to a side edge facing the edge, and the second terminal electrode is provided on the insulating substrate. And the end portion is led out to a side edge opposite to the side edge from which the back lead electrode is led out. Further, the assembly is provided on one surface of the insulating substrate constituting the base substrate. And a connection electrode is attached to a side surface of the assembly and the base substrate, and the end of the first terminal electrode is electrically connected to the end of the front lead electrode. A method for manufacturing a piezoelectric component, comprising a step of conducting the end portion to the end portion of the back lead electrode. 5. A method for manufacturing a piezoelectric component, comprising: manufacturing an assembly including a piezoelectric element, a first sealing structure, and a second sealing structure, wherein the piezoelectric element Includes a piezoelectric substrate, a front electrode, and a back electrode, the front electrode being one, being provided on the surface of the piezoelectric substrate, having one front lead electrode, Is electrically connected to the front electrode, an end is led out to one side edge of the piezoelectric substrate, the back electrode is one, provided on the back surface of the piezoelectric substrate, facing the front electrode And a back lead electrode, wherein the back lead electrode is electrically connected to the back electrode, and an end of the back lead electrode is led to the other side edge of the piezoelectric substrate. Forming a first cavity around the front electrode attached to the surface of the piezoelectric substrate, and forming the first cavity The second sealing structure is attached to the back surface of the piezoelectric substrate, forms a second cavity around the back electrode, and seals the second cavity. The method further includes a step of manufacturing a base substrate separately from the step of manufacturing the assembly, wherein the base substrate includes an insulating substrate, a first terminal electrode, and a second terminal electrode, The first terminal electrode is formed on the insulating substrate, and an end is led out to a side edge of the front lead electrode opposite to the led-out side edge, and the second terminal electrode is provided. Is formed on the insulating substrate, and the end is led out to a side edge facing the side edge from which the back lead electrode is led out. Further, the assembly is mounted on one surface of the base substrate. Mounted on
A connection electrode is attached to a side surface of the assembly and the base substrate, the end of the first terminal electrode is electrically connected to the end of the front lead electrode, and the end of the second terminal electrode is A method for manufacturing a piezoelectric component, comprising a step of conducting to the end of the back lead electrode. 6. A method for manufacturing a piezoelectric component, comprising: a step of manufacturing an assembly including a piezoelectric element, a first sealing structure, and a second sealing structure, Includes a piezoelectric substrate, a front electrode, and a back electrode. The front electrode is plural, and is provided on the surface of the piezoelectric substrate. Each of the front electrodes has two divided electrodes. One of the two divided electrodes is connected to each other between the front electrodes, and among the two divided electrodes included in one of the front electrodes, the divided electrode that is not connected between the front electrodes is a second one. Wherein the first front lead electrode has one end led out to a side edge of the piezoelectric substrate, and among the two divided electrodes included in the other of the front electrodes, The split electrode not connected between the front electrodes has a second front lead electrode, The end of the second front lead electrode has
The back electrode is provided at a side edge of the piezoelectric substrate, and the back electrode is provided on a back surface of the piezoelectric substrate, commonly faces the plurality of front electrodes, and has at least one back lead electrode. The lead electrode is electrically connected to the back electrode, and an end is led out to a side edge of the piezoelectric substrate. The first sealing structure is attached to a surface of the piezoelectric substrate, and the front electrode is Forming a first cavity around and sealing the first cavity, the second sealing structure is attached to a back surface of the piezoelectric substrate, and a second sealing structure is formed around the back electrode. Forming a second cavity and sealing the second cavity. The method further includes a step of manufacturing a base substrate separately from the step of manufacturing the assembly. , A first terminal electrode, a second terminal electrode, and a third terminal electrode, One surface of the insulating substrate supports an assembly including the piezoelectric element, the first sealing structure, and the second sealing structure, and the first terminal electrode and the second terminal. Electrode and the third
Are formed on the insulating substrate, and each end is led out to a side edge facing the side edge from which the front lead electrode and the back lead electrode are led out. Mounting the assembly on one surface of the base substrate,
A connection electrode is attached to the side surface of the assembly and the base substrate, the end of the first terminal electrode is electrically connected to the end of the first front lead electrode, and the connection of the second terminal electrode is performed. A method for manufacturing a piezoelectric component, comprising: conducting an end portion to the end portion of the second front lead electrode and conducting the end portion of the third terminal electrode to the end portion of the back lead electrode.