JP2000349544A - Antenna feeder circuit and antenna system using it - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide the antenna feeder circuit that realizes miniaturization, high density and a low cost and whose configuration is made in common with the antennas of different specifications and to provide an antenna system using it. SOLUTION: The antenna freeder circuit is provided with a Si group substrate 1, high frequency semiconductor integrated circuits 2, 3 and a digital integrated circuit 4 that are formed integrally inside or on the surface of the Si group substrate 1, a system processing integrated circuit 11 and a dielectric multi-layer board 24. The system processing integrated circuit 11 is provided with, at least, an antenna radiation element connection terminal 6, a base band signal terminal 7, a control signal terminal 9, and a power supply terminal 10. The dielectric multi-layer board 24 incorporates, at least, a base band signal line 14, a control signal line 17 and a power supply line 18, and is provided with base band signal terminals 20a, 20b, control signal terminals 22a, 22b and power supply terminals 23a, 23b. In the case of layering and laying out the system processing integrated circuit 11 and the dielectric multi-layer board 24, terminals corresponding to each other are opposed and are connected by a bump conductor 25.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention
TECHNICAL FIELD The present invention relates to a feed circuit for an active phased array antenna used in a band, a UHF band, a microwave band, and a millimeter wave band, and an antenna device that can achieve miniaturization, high density, and low cost using the same.

[0002]

2. Description of the Related Art FIG. 15 shows, for example, Japanese Patent Application Laid-Open No. 5-299906.
FIG. 1 is a configuration diagram showing a conventional antenna feed circuit shown in FIG. 1, in which 12 is a dielectric substrate, 13 a to 13 c are ground conductors, 17 is a control signal line pattern, 18 is a power supply line pattern, 19 is a power supply or control. Via hole for signal connection, 3
2a and 32b are strip conductor patterns, 33 is a via hole for interlayer connection, 37 is a cavity-shaped hole formed in the dielectric substrate 12, 38 is a control signal circuit element, 39 is a power supply circuit element, and 40 is a high-frequency circuit element. is there. The strip conductor patterns 32a and 32b are supported between the ground conductors 13a and 13b and between the ground conductors 13b and 13c via the dielectric substrate 12, respectively, to constitute a two-layer triplate line type high frequency circuit. The high-frequency circuits of the two layers are connected by via holes 33 for interlayer connection.
The high frequency circuit element 4 is provided on the bottom of the cavity 37.
0 is mounted and connected to a high-frequency circuit composed of the strip conductor pattern 32b. Further, the control signal line pattern 17, the power supply line pattern 18, the control signal circuit element 38, and the power supply circuit element 39 provided on the dielectric substrate 12 are a power supply / control circuit for supplying power and a control signal to the high frequency circuit. And the high-frequency circuit element 40 is
They are connected by power supply or control signal connection via holes 19.

In the antenna feed circuit having the structure shown in FIG. 15, since the lines constituting the high-frequency circuit have a triplate line structure in which the upper and lower lines are sandwiched between ground conductors, unnecessary coupling between the high-frequency circuits and unnecessary radiation of high-frequency signals are performed. But for this,
The mounting density of the high-frequency circuit can be increased, and a small high-frequency circuit can be realized. Further, since the strip conductor pattern 32b constituting the high-frequency circuit is exposed near the high-frequency circuit element 40 by the cavity-shaped hole 37, it can be easily connected to the high-frequency circuit element 40 by a bonding wire or the like. In addition,
The multilayer high-frequency circuit board having such a structure can be realized by a multilayer ceramic substrate manufacturing technique in which a ceramic green sheet is patterned and laminated with a conductor pattern and then fired simultaneously.

[0004]

Since the conventional antenna feed circuit is configured as described above, the high-frequency circuit element 40, the control signal circuit element 38, and the power supply circuit element 39 are separately scattered, and Are connected to each other via strip conductor patterns 32a and 32b as high-frequency signal line patterns, control signal line patterns 17, power supply line patterns 18, interlayer connection via holes 33, and power supply or control signal connection via holes 19. . Therefore, in the conventional antenna feed circuit, since the high-frequency circuit element 40, the control signal circuit element 38, and the power supply circuit element 39 need to be individually mounted, the structure and the manufacturing process become complicated, and the circuit becomes large. There was a problem that the manufacturing cost was high. Further, since strip conductor patterns 32a and 32b as high-frequency signal line patterns, control signal line patterns 17, power supply line patterns 18, interlayer connection via holes 33, and power supply or control signal connection via holes 19 are formed in a complicated manner, the control signal Unnecessary coupling between the high-frequency circuit elements via the line patterns 17 and the power supply line patterns 18 and the power supply or control signal connection via holes 19, and high-frequency generation in the power supply or control signal line layers via the interlayer connection via holes 33. There was also a problem that unnecessary resonance easily occurred. Further, there is a problem that it is difficult to share the configuration of the antenna feed circuit for antennas having different specifications.

SUMMARY OF THE INVENTION The present invention has been made to solve the above-mentioned problems, and can achieve downsizing, high density, and low price, and can easily share a common configuration for antennas having different specifications. An object of the present invention is to obtain an antenna feeding circuit that can be achieved.

Another object of the present invention is to obtain an antenna device using the above-described antenna feed circuit.

[0007]

An antenna feed circuit according to the present invention comprises a Si-based substrate, a high-frequency semiconductor integrated circuit formed inside or on the surface of the Si-based substrate, and a high-frequency semiconductor integrated circuit formed inside or on the surface of the Si-based substrate. Digital integrated circuit, at least the high-frequency semiconductor integrated circuit and the digital integrated circuit are integrally formed on the same Si-based substrate, and at least an antenna radiating element connection terminal, a baseband signal terminal, a control signal terminal, and a power supply terminal A built-in integrated circuit having at least a baseband signal line, a control signal line, and a power supply line, and a baseband signal terminal, a control signal terminal, and a power supply terminal. A dielectric multi-layer substrate that is stacked and arranged on the systemized integrated circuit so as to face the corresponding terminal, Is obtained and a connection means for connecting the corresponding terminals to each other to each other in the dielectric multi-layer substrate and the system integrated circuit.

[0008] The antenna power supply circuit according to the present invention comprises a Si
-Based substrate, high-frequency semiconductor integrated circuit formed inside or on the Si-based substrate, high-frequency filter formed inside or on the Si-based substrate, and digital integrated circuit formed inside or on the Si-based substrate And at least the high-frequency semiconductor integrated circuit, the high-frequency filter, and the digital integrated circuit are integrally formed on the same Si-based substrate, and at least an antenna radiating element connection terminal, a baseband signal terminal, a control signal terminal, and a power supply terminal are provided. A built-in integrated circuit having at least a baseband signal line, a control signal line, and a power supply line, and a baseband signal terminal, a control signal terminal, and a power supply terminal, and these terminals correspond to the systemized integrated circuit. Dielectrics stacked on the systematized integrated circuit so as to face the terminals And the multilayer substrate, in which a connection means for connecting the terminals to each other mutually corresponding in dielectric multilayer substrate and the system integrated circuit.

[0009] An antenna feed circuit according to the present invention uses the bulk ultrasonic filter as the high frequency filter in the second invention.

The antenna feed circuit according to the present invention uses the suspended strip line type filter or the waveguide type filter having a hollow cavity by a micromachine technology as the high frequency filter in the second aspect of the present invention.

[0011] The antenna power supply circuit according to the present invention is characterized in that:
System substrate, a high-frequency semiconductor integrated circuit formed inside or on the surface of the Si-based substrate, a digital integrated circuit formed inside or on the surface of the Si-based substrate, and at least the high-frequency semiconductor integrated circuit and the digital integrated circuit are the same. A systematized integrated circuit formed integrally with the Si-based substrate and having at least an antenna radiating element connection terminal, a high frequency filter connection terminal, a baseband signal terminal, a control signal terminal, and a power supply terminal; Built-in high-frequency signal line, baseband signal line, control signal line and power supply line, and high-frequency filter connection terminal,
A dielectric multilayer substrate provided with a baseband signal terminal, a control signal terminal, and a power supply terminal, the terminals being stacked on the systemized integrated circuit so that these terminals face corresponding terminals of the systemized integrated circuit; Connection means for connecting the dielectric multilayer substrate and the corresponding terminals of the systemized integrated circuit to each other.

An antenna feed circuit according to the present invention is a
System substrate, a high-frequency semiconductor integrated circuit formed inside or on the surface of the Si-based substrate, a digital integrated circuit formed inside or on the surface of the Si-based substrate, and at least the high-frequency semiconductor integrated circuit and the digital integrated circuit are the same. A systematized integrated circuit integrally formed on the Si-based substrate and having at least an antenna radiating element connection terminal, a high frequency filter connection terminal, a baseband signal terminal, a control signal terminal, and a power supply terminal; and at least a baseband signal Line, a control signal line and a power supply line, and a baseband signal terminal, a control signal terminal and a power supply terminal, and the systemized integrated circuit so that these terminals face corresponding terminals of the systematized integrated circuit. Dielectric multilayer substrate stacked and disposed thereon, dielectric multilayer substrate and systematized integration First connection means for connecting mutually corresponding terminals in a path, and a high-frequency filter disposed on the opposite surface of the systemized integrated circuit from the side on which the dielectric multilayer substrate is disposed, Second connection means for connecting the high-frequency filter and the systematized integrated circuit via the high-frequency filter connection terminal is provided.

[0013] An antenna device according to the present invention provides a dielectric substrate, one or more radiating elements formed by closely attaching a conductive film to one surface of the dielectric substrate, and: An antenna feed circuit according to any one of the first to sixth aspects of the present invention is provided integrally for each element or for each sub-array, and the antenna feed circuit is required on the other surface of the dielectric substrate. A number of them are connected via antenna radiating element connection terminals and surface-mounted.

An antenna device according to the present invention comprises: a dielectric substrate; one or a plurality of radiating elements formed by closely attaching a conductive film to one surface of the dielectric substrate; An antenna power supply circuit according to any one of the inventions is provided, and a systematized integrated circuit corresponding to the entire radiating element in the antenna power supply circuit is integrally formed on the same Si-based substrate wafer, and the other surface of the dielectric substrate is provided. Are stacked and surface-mounted, and a systematized integrated circuit included in the Si-based substrate wafer is connected to the radiating element via an antenna radiating element connection terminal.

The antenna device according to the present invention is characterized in that the first
And a system integrated circuit corresponding to the entire radiating element in the antenna feed circuit is integrally formed on the same Si-based substrate wafer. A radiating element is formed by closely attaching a conductive film to a surface of the opposite surfaces opposite to the surface on which the dielectric multilayer substrate is arranged.

The antenna device according to the present invention has the first
An antenna feed circuit according to any one of the fifth to fifth aspects, at least a baseband signal line, a control signal line,
And a power supply line, a motherboard including a baseband signal terminal, a control signal terminal, and a power supply terminal. A dielectric multilayer substrate is disposed on both sides of a Si-based substrate constituting a systematized integrated circuit in the antenna feed circuit. A radiating element is formed by closely adhering a conductive film to a surface opposite to the surface on which the systemized integrated circuit is arranged in the dielectric multilayer substrate, and the surface opposite to the side on which the systematized integrated circuit is disposed is closely opposed to the motherboard. ,
The antenna power supply circuit is surface-mounted on the motherboard by connecting the baseband signal terminal, the control signal terminal, and the power supply terminal to each other.

An antenna device according to the present invention comprises: a dielectric substrate; one or a plurality of radiating elements formed by closely attaching a conductive film to one surface of the dielectric substrate; An antenna feed circuit according to any one of the inventions of the invention is provided, and a systematized integrated circuit corresponding to the entire radiating element in the antenna feed circuit is integrally formed on the same Si-based substrate wafer, and the other surface of the dielectric substrate is provided. The Si-based substrate wafer is stacked and surface-mounted, and a systematized integrated circuit included in the Si-based substrate wafer is connected to a radiating element via an antenna radiating element connection terminal to form an integrated systematized integrated circuit. A dielectric multilayer substrate corresponding to substantially the entire circuit is integrally formed, and the integrated dielectric multilayer substrate is formed on the opposite surface of the both surfaces of the Si-based substrate wafer from the side on which the dielectric substrate is disposed. product It is those provided by.

The antenna device according to the present invention has the first
And a system integrated circuit corresponding to almost all radiating elements in the antenna feed circuit is integrally formed on the same Si-based substrate wafer, Substantially all of the radiating elements are formed on one surface of the substrate wafer by closely adhering a conductive film, and a dielectric multilayer substrate corresponding to substantially the entire integrated circuit is integrally formed. On the other surface of the wafer, the integrally formed dielectric multilayer substrate is laminated.

[0019]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS One embodiment of the present invention will be described below. Embodiment 1 FIG. In FIGS. 1 and 2, 1
Is a Si-based substrate, 2 is a SiGe high frequency semiconductor integrated circuit, 3
Is a BiCMOS high-frequency semiconductor integrated circuit, 4 is a digital integrated circuit, 5 is a high-frequency filter, 6 is a terminal for connecting an antenna radiating element, 7 is a baseband signal terminal, 8 is a local reference signal terminal, 9 is a control signal terminal, and 10 is a power supply. Terminal, 11
Is a systemized integrated circuit. In this systematized integrated circuit 11, a SiGe high-frequency semiconductor integrated circuit 2, a BiCMOS high-frequency semiconductor integrated circuit 3, a digital integrated circuit 4, and a high-frequency filter 5 are integrally formed on the surface or inside of a Si-based substrate 1, and antenna radiating element connection terminals. 6, a baseband signal terminal 7, a local reference signal terminal 8, a control signal terminal 9, and a power supply terminal 10. 12 is a ceramic dielectric substrate, 13a to 13h are ground conductors, 14
Is a baseband signal line, 16 is a local reference signal line, 1
7 is a control signal line, 18 is a power supply line, 19 is a power supply or control signal connection via hole, 20a and 20b are baseband signal terminals, 21a and 21b are local reference signal terminals, 22a and 22b are control signal terminals, 23a and 23b. Is a power supply terminal, and 24 is a dielectric multilayer substrate.
This dielectric multilayer substrate 24 is a ceramic dielectric substrate 1
2, ground conductors 13a to 13h, baseband signal line 14,
Local reference signal line 16, control signal line 17, power supply line 18
And via holes 19 for connecting power supply or control signals are integrally formed, and baseband signal terminals 20a and 20
0b, local reference signal terminals 21a and 21b, control signal terminals 22a and 22b, power supply terminals 23a and 2
3b. Numeral 25 denotes a bump conductor as a connecting means, which comprises a system integrated circuit 11 and a dielectric multilayer substrate 24.
, A local signal terminal, a control signal terminal, or a power supply terminal.

As shown in FIG. 3, the high-frequency filter 5 has a configuration in which a gap 29 is formed as a hollow cavity by a micromachining technique to reduce the loss, and is provided inside the Si-based substrate 1. I have. In FIG. 3, 26
a and 26b are strip conductors in a high impedance line section, 27a and 27b are strip conductors in a low impedance line section, and 28 is an input / output line strip conductor. That is, the high-frequency filter 5 includes the ceramic dielectric substrate 12, the ground conductors 13g and 13h, the strip conductors 26a and 26b in the high impedance line section, the strip conductors 27a and 27b in the low impedance line section,
It is composed of a strip conductor 28 of an input / output line and a gap 29. This is a low-pass filter whose filter section is a suspended strip line and whose input / output section is a strip line.

Next, the operation principle will be described. here,
When a radio wave incident from the antenna radiating element is input to the systematized integrated circuit 11 via the antenna radiating element connection terminal 6, first, a radio wave of an unnecessary frequency is cut off by the high frequency filter 5, and only a radio wave of a desired frequency is extracted. It is.
Next, this radio wave is amplified by an amplifier in the SiGe high-frequency semiconductor integrated circuit 2, and subsequently the frequency is reduced to the baseband band by a mixer or a quadrature modulator included in the BiCMOS high-frequency semiconductor integrated circuit 3. Further, after being subjected to A / D conversion and phase control by the digital integrated circuit 4, it is taken out to the baseband signal terminal 7. In addition,
The BiCMOS high-frequency semiconductor integrated circuit 3 includes a local oscillator, and the local oscillator transmits a local signal necessary for a mixer or a quadrature modulator based on a local reference signal supplied via a local reference signal terminal 8. Is occurring.

The baseband signal extracted to the baseband signal terminal 7 is input to the dielectric multilayer board 24 via the bump conductor 25 and the baseband signal terminal 20b. In the dielectric multilayer substrate 24, the baseband signal line 14, the local reference signal line 16, and the power supply line 18 of radio waves incident from other antenna radiating elements are combined without unnecessary coupling by utilizing the advantage of the multilayer structure. And the control signal lines 17 are also wired without contacting or coupling with them, and each line is connected to the baseband signal terminal 2.
0a, local reference signal terminal 21a, control signal terminal 22
a, connected to the power supply terminal 23a. Therefore, the baseband signal, the local reference signal, the control signal, and the power supply are combined as necessary in the dielectric multilayer substrate 24, and the baseband signal terminal 20a, the local reference signal terminal 21
a, taken out from the control signal terminal 22a and the power supply terminal 23a.

As described above, the antenna feed circuits shown in FIGS. 1 and 2 have a function as an antenna feed circuit including a frequency conversion from a high frequency to a baseband, an A / D conversion, and a phase control function.

As described above, the antenna feed circuit shown in FIG. 1 and FIG.
Since the iGe high-frequency semiconductor integrated circuit 2, the BiCMOS high-frequency semiconductor integrated circuit 3, the digital integrated circuit 4, and the high-frequency filter 5 are integrally formed, there is no need to individually mount a plurality of semiconductor elements having individual functions. In addition, there is an advantage that the manufacturing process is simplified, the circuit size is reduced, and the manufacturing cost is reduced. In addition, since only radio waves having a frequency equal to or lower than the baseband are input to and propagated into the dielectric multilayer substrate 24, unnecessary coupling between high-frequency circuit elements and unnecessary high-frequency resonance in the power supply or control signal line layer do not occur. It also has advantages. Further, there is obtained an advantage that it is easy to make the configuration of the antenna feed circuit common to antennas of different specifications.

As described above, in the first embodiment, the suspended strip line filter having the air gap 29 formed by the micromachining technique is used as the high frequency filter. Instead, the waveguide filter or the bulk ultrasonic wave filter is used. A filter may be used.

Embodiment 2 FIG. Components of the second embodiment that are common to those of the first embodiment are given the same reference numerals, and descriptions of those components are omitted. In FIG. 4, reference numeral 30 denotes a high-frequency filter formed inside the dielectric multilayer substrate 24. The high frequency filter 30 propagates a high frequency, but is provided in an inner layer closest to the systematized integrated circuit 11 in the dielectric multilayer substrate 24, so that the baseband signal layer, the control signal layer, or the power supply The possibility of causing unnecessary bonding to the layer can be reduced.

The antenna feed circuit shown in FIG. 4 has the same operating principle, function, and advantages as those shown in FIGS. 1 and 2, and also has the high frequency filter 30 formed inside the dielectric multilayer substrate 24. By using a ceramic substrate having a relatively high Q value as the dielectric substrate 12, there is obtained an advantage that the loss of the high-frequency filter can be reduced.

Embodiment 3 Among the components in the third embodiment, the same components as those in the first embodiment are denoted by the same reference numerals, and the description of those portions is omitted. In FIG. 5, reference numeral 31 denotes a high-frequency filter connected to the surface of the Si-based substrate 1 on the side opposite to the dielectric multilayer substrate 24 via a bump conductor 25; 32, a strip line pattern inside the dielectric multilayer substrate 24; Is a via hole for interlayer connection inside the dielectric multilayer substrate 24. The strip line pattern 32 is provided between the ground conductors 13g and 13h, and constitutes a triplate line for transmitting a high frequency together with the ground conductors 13g and 13h and the dielectric substrate 12. The via hole 33 for interlayer connection and the strip line pattern 32 propagate high frequency, but are provided in the inner layer closest to the systematized integrated circuit 11 in the dielectric multilayer substrate 24, so that the baseband signal layer in the dielectric multilayer substrate 24 is provided. , The possibility of causing unnecessary coupling to the control signal layer or the power supply layer can be reduced.

The antenna feed circuit shown in FIG. 5 has the same operating principle, functions and advantages as those shown in FIGS. 1 and 2. Since the individual components are formed on the surface opposite to the side on which the components are arranged, the degree of freedom in selecting a filter is increased, and an advantage is obtained in that the size and the loss of the high-frequency filter can be reduced.

Embodiment 4 Among the components in the fourth embodiment, the same components as those in the first embodiment are denoted by the same reference numerals, and the description of those portions will be omitted. 6 and 7, reference numeral 34 denotes a dielectric substrate; 35, a circular patch as a radiating element for an array antenna formed by closely attaching a conductive film to one surface of the dielectric substrate 34; 100, a systematic integrated circuit 11; This is an antenna feed circuit configured by connecting a dielectric multilayer substrate 24 by bump conductors 25. The antenna feed circuit 100 is provided for each sub-array, and is flip-chip mounted on the opposite surface of the dielectric substrate 34 from the surface on which the circular patch 35 is formed.

Since the antenna device shown in FIGS. 6 and 7 is configured as described above, the antenna feed circuit 10
0 has the same advantages as those shown in FIGS. 1 and 2, and also has the advantage that the active phased array antenna can be reduced in size, density, and cost.

Embodiment 5 In the fifth embodiment, as shown in FIG. 8, the systemized integrated circuit 11 corresponding to all the circular patches 35 is integrally formed on one Si-based wafer in addition to the configuration of the fourth embodiment. ing. As shown in FIGS. 8 and 9, the systematized integrated circuit 11 is flip-chip mounted on the opposite side (rear side) of the dielectric substrate 34 from the side on which the circular patch 35 is disposed.
It is electrically connected to the dielectric substrate 34 by bump conductors (not shown) and antenna radiating element connection terminals (not shown). Note that among the components in the fifth embodiment, those that are common to the components in the first embodiment are given the same reference numerals, and descriptions of those portions are omitted.

Since the antenna device shown in FIGS. 8 and 9 is configured as described above, the antenna feed circuit 10
0 has the same advantages as those shown in FIGS. 1 and 2, and also has the advantage that the active phased array antenna can be reduced in size, increased in density, and reduced in cost.

Embodiment 6 FIG. In the sixth embodiment, as shown in FIG. 10, a conductor film is formed on the surface of a system integrated circuit 11 in which all the circular patches 35 are integrally formed on a Si-based wafer, in addition to the configuration of the fifth embodiment. It is formed in close contact. As shown in FIGS. 10 and 11, the dielectric multilayer substrate 24 is flip-chip mounted on the opposite surface of the systemized integrated circuit 11 from the surface on which the circular patch 35 is disposed, and both of them are bump conductors. (Not shown),
They are electrically connected by a baseband signal terminal (not shown), a local reference signal terminal (not shown), a control signal terminal (not shown), and a power supply terminal (not shown). Note that among the components in the sixth embodiment, those that are common to the components in the first embodiment are given the same reference numerals, and descriptions of those portions are omitted.

Since the antenna devices shown in FIGS. 10 and 11 are configured as described above, they have the same advantages in the power supply circuit as in FIG. 1, and also reduce the size and the density of the active phased array antenna. And an advantage that the cost can be reduced.

Embodiment 7 The feature of the seventh embodiment is that, as shown in FIG. 12, of the two surfaces of the systematized integrated circuit 11 in the first and second embodiments, the surface opposite to the surface on which the dielectric multilayer substrate 24 is arranged is provided. A circular patch 35 is formed by closely adhering a conductor film to a sub-antenna device 200 corresponding to one element or a sub-array, and a required number of sub-antenna devices 200 are flip-chip mounted on the surface of a motherboard 36. It is in. Note that, of the components in the seventh embodiment, the same components as those in the first embodiment are denoted by the same reference numerals, and the description of those portions will be omitted.

Since the antenna device shown in FIG. 12 is configured as described above, it has the same advantages in the feeder circuit as those in the first or second embodiment, and further reduces the size of the active phased array antenna. An effect is obtained that has the advantage of achieving higher density and lower cost.

Embodiment 8 FIG. The feature of the eighth embodiment is that, as shown in FIG. 13, the dielectric multilayer substrate 24 corresponding to all the circular patches 35 in the fifth embodiment is integrally formed. The integrally formed dielectric multi-layer substrate 24 is similarly integrated with the systematized integrated circuit 1.
1 are flip-chip mounted on the surface opposite to the surface on which the dielectric substrate 34 is disposed, and both of them are bump conductors (not shown), baseband signal terminals (not shown), and local reference signals. Terminals (not shown), control signal terminals (not shown), and power supply terminals (not shown) are electrically connected.

Embodiment 9 The feature of the ninth embodiment is that, as shown in FIG. 14, the dielectric multi-layer substrate 2 corresponding to all the circular patches 35 in the configuration of the sixth embodiment.
4 is integrally formed. The integrally formed dielectric multilayer substrate 24 is flip-chip mounted on the opposite surface of the similarly integrated systemized integrated circuit 11 from the surface on which the circular patch 35 is disposed. Electrically connected by conductors (not shown), baseband signal terminals (not shown), local reference signal terminals (not shown), control signal terminals (not shown), and power supply terminals (not shown) I have.

Since the antenna device shown in FIG. 14 is configured as described above, it has the same advantages in the power supply circuit as in FIG. 1, and the active phased array antenna can be reduced in size, increased in density, and reduced in power. There is an advantage that the price can be increased.

In the connection method between the substrate and the circuit in each of the first to ninth embodiments, a conductive paste such as solder, silver paste, etc. Etc. can be suitably used. Further, in places where conduction is not required after connection, a dielectric material such as bismuth-niobium oxide or a mixture with the above-mentioned conductor paste can be used.

[0042]

As described above, according to the present invention, Si
High-frequency integrated circuits and digital integrated circuits are integrally formed on a system substrate, and a dielectric multilayer substrate is laminated on a systematized integrated circuit.Therefore, it is necessary to individually mount a plurality of semiconductor elements having individual functions. The structure and manufacturing process are simplified, and the antenna feed circuit can be reduced in size, density, and price. There is an effect that the configuration can be shared.

According to the present invention, since the Si-based substrate, the high-frequency integrated circuit, the digital integrated circuit, the dielectric multilayer substrate, and the systematized integrated circuit are connected by the connecting means in a multilayer structure, other antenna radiating elements are provided. Thus, there is an effect that it is possible to reliably prevent unnecessary coupling of signal lines, power supply lines, and the like of radio waves incident from above.

According to the present invention, since the high frequency filter for blocking unnecessary frequency radio waves is mounted on the surface of the Si-based substrate, the dielectric multilayer substrate disposed on the back surface of the Si-based substrate has a base. Since only radio waves having a frequency equal to or lower than the band are input and propagated, there is an effect that unnecessary coupling between high-frequency circuit elements and occurrence of unnecessary high-frequency resonance in a power supply or a control signal line layer can be prevented. is there.

According to the present invention, a bulk ultrasonic filter is used as the high frequency filter, and a suspended strip line type filter or a waveguide type filter having a hollow cavity is formed by a micro-machine technology, so that the loss can be further reduced. There is an effect that can be achieved.

According to the present invention, since the high frequency filter is formed inside the dielectric multilayer substrate, there is an effect that the loss of the high frequency filter can be reduced.

According to the present invention, the high frequency filter is made of Si
Since individual components are formed on the surface of the system substrate opposite to the side on which the dielectric multilayer substrate is arranged, the degree of freedom in selecting a filter increases, and the effect of reducing the size and reducing loss of the high-frequency filter can be achieved. There is.

According to the present invention, since the above-described antenna feed circuit is mounted on the back surface of the dielectric substrate for each sub-array by flip-chip mounting, the antenna device can be downsized.
This has the effect of achieving higher density and lower cost.

According to the present invention, a radiating element and the above-described antenna feed circuit are provided on one surface of a dielectric substrate, and a systematized integrated circuit corresponding to the radiating element is integrally formed on a Si-based substrate wafer. Since the system substrate wafer is stacked so as to be stacked on the other surface of the dielectric substrate, and the systematized integrated circuit is connected to the radiating element, the antenna device can be reduced in size, density, and cost. There is an effect that can be achieved.

According to the present invention, a system integrated circuit corresponding to the entire radiating element in the above-described antenna feed circuit is integrally formed on the same Si-based substrate wafer, and the dielectric substrate is disposed on both surfaces of the Si-based substrate wafer. Since the radiating element is formed on the surface opposite to the surface that has been formed, there is an effect that the antenna device can be reduced in size, increased in density, and reduced in cost.

According to the present invention, the dielectric multilayer substrate is disposed on the Si-based substrate, and the radiating element is formed on the opposite surface of the both surfaces of the Si-based substrate from the surface on which the dielectric multilayer substrate is disposed. Bring each signal line and the motherboard including each terminal close to the surface,
Since the above-described antenna feed circuit is configured to be surface-mounted on the motherboard, there is an effect that the antenna device can be reduced in size, increased in density, and reduced in cost.

According to the present invention, a radiating element and the above-described antenna feed circuit are provided on one surface of a dielectric substrate, and a systematized integrated circuit corresponding to the radiating element is integrally formed on a Si-based substrate wafer. The system substrate wafer is stacked on the other surface of the dielectric substrate and surface-mounted, the systematized integrated circuit is connected to the radiating element, and the opposite side of the both surfaces of the Si substrate wafer from the side on which the dielectric substrate is disposed Since the dielectric substrate is stacked on the surface, the antenna device can be reduced in size, increased in density, and reduced in cost.

According to the present invention, a system integrated circuit corresponding to almost all radiating elements in the above-described antenna feed circuit is integrally formed on the same Si-based substrate wafer,
A radiating element is formed on one surface of a
Since the dielectric multi-layer substrate corresponding to substantially the entire systemized integrated circuit is laminated on the other surface of the system substrate wafer, the antenna device can be reduced in size, density, and cost. effective.

[Brief description of the drawings]

FIG. 1 is a schematic perspective view showing a configuration of an antenna feed circuit according to a first embodiment of the present invention.

FIG. 2 is a schematic sectional view taken along a line II-II in FIG.

FIG. 3 is a schematic sectional view showing a configuration of a high-frequency filter in the antenna feed circuit according to the first embodiment of the present invention.

FIG. 4 is a schematic sectional view illustrating a configuration of an antenna feed circuit according to a second embodiment of the present invention.

FIG. 5 is a schematic sectional view showing a configuration of a multilayer high-frequency circuit according to a third embodiment of the present invention.

FIG. 6 is a schematic perspective view showing a configuration of a front side of an antenna device according to a fourth embodiment of the present invention.

FIG. 7 is a schematic perspective view showing a configuration on the back side of the antenna device shown in FIG. 6;

FIG. 8 is a schematic perspective view showing a configuration of a front side of an antenna device according to a fifth embodiment of the present invention.

FIG. 9 is a schematic perspective view showing a configuration on the back side of the antenna device shown in FIG. 8;

FIG. 10 is a configuration diagram illustrating an antenna device according to a sixth embodiment of the present invention.

11 is a schematic perspective view showing a configuration on the back side of the antenna device shown in FIG.

FIG. 12 is a schematic perspective view showing a configuration of an antenna device according to a seventh embodiment of the present invention.

FIG. 13 is a schematic perspective view showing a configuration of an antenna device according to an eighth embodiment of the present invention.

FIG. 14 is a schematic perspective view showing a configuration of an antenna device according to a ninth embodiment of the present invention.

FIG. 15 is a schematic sectional view showing a configuration of a conventional antenna feed circuit.

[Explanation of symbols]

1 Si-based substrate, 2 SiGe high-frequency semiconductor integrated circuit,
3 BiCMOS high frequency semiconductor integrated circuit, 4 digital integrated circuit, 5, 30, 31 high frequency filter, 6 antenna radiating element connection terminal, 7, 20a, 20b baseband signal terminal, 9, 22a, 22b control signal terminal,
10, 23a, 23b power supply terminal, 11 systematized integrated circuit, 12 ceramic dielectric substrate, 14 baseband signal line, 17 control signal line, 18 power supply line, 24
Dielectric multilayer substrate, 25 bump conductors (connection means), 2
9 air gap (hollow cavity), 34 dielectric substrate, 100 antenna feed circuit.

 ──────────────────────────────────────────────────続 き Continuing on the front page (72) Inventor Nao Takagi 2-3-2 Marunouchi, Chiyoda-ku, Tokyo Inside Mitsubishi Electric Corporation (72) Inventor Yasuyuki Ito 2-3-2 Marunouchi, Chiyoda-ku, Tokyo Inside Rishi Electric Co., Ltd. (72) Inventor Koichiro Misu 2-3-2 Marunouchi, Chiyoda-ku, Tokyo F-term (reference) 5J021 AA09 AB06 CA02 FA23 FA26 FA29 JA08 JA09

Claims (12)

[Claims] An Si-based substrate; a high-frequency semiconductor integrated circuit formed inside or on the surface of the Si-based substrate;
A digital integrated circuit formed inside or on a system substrate, at least the high-frequency semiconductor integrated circuit and the digital integrated circuit are integrally formed on the same Si-based substrate, and at least an antenna radiating element connection terminal and a baseband signal. Terminals, a systematized integrated circuit having a control signal terminal and a power supply terminal, and at least a baseband signal line, a control signal line and a power supply line, and a baseband signal terminal, a control signal terminal and a power supply terminal. A dielectric multilayer substrate, which is stacked on the systemized integrated circuit so that the terminal faces a corresponding terminal of the systematized integrated circuit, and corresponds to each other in the dielectric multilayer substrate and the systematized integrated circuit. An antenna power supply circuit, comprising: connection means for connecting terminals. 2. An Si-based substrate; a high-frequency semiconductor integrated circuit formed inside or on the surface of the Si-based substrate;
A high-frequency filter formed inside or on the surface of the system substrate, a digital integrated circuit formed inside or on the surface of the Si-based substrate, and at least the high-frequency semiconductor integrated circuit, high-frequency filter, and digital integrated circuit on the same Si-based substrate. A systematized integrated circuit formed integrally and having at least an antenna radiating element connection terminal, a baseband signal terminal, a control signal terminal, and a power supply terminal, and at least a baseband signal line, a control signal line, and a power supply line. And a dielectric multi-layer disposed on the systemized integrated circuit so as to include a baseband signal terminal, a control signal terminal, and a power supply terminal, and the terminals facing the corresponding terminals of the systemized integrated circuit. Substrate and corresponding ends of the dielectric multilayer substrate and the systemized integrated circuit Antenna feeding circuit, characterized in that a connection means for connecting to each other. 3. The antenna feed circuit according to claim 2, wherein a bulk ultrasonic filter is used as the high frequency filter. 4. The antenna feed circuit according to claim 2, wherein a suspended stripline type filter or a waveguide type filter having a hollow cavity formed by a micromachine technology is used as the high frequency filter. 5. A Si-based substrate, a high-frequency semiconductor integrated circuit formed inside or on the surface of the Si-based substrate,
A digital integrated circuit formed inside or on a system substrate, at least the high-frequency semiconductor integrated circuit and the digital integrated circuit integrally formed on the same Si-based substrate, and at least an antenna radiating element connection terminal and a high-frequency filter connection Systemized integrated circuit having terminals for control, baseband signal terminals, control signal terminals and power supply terminals, and at least a high-frequency filter, a high-frequency signal line, a baseband signal line, a control signal line and a power supply line, and a high-frequency filter connection And a baseband signal terminal, a control signal terminal, and a power supply terminal. The dielectric is stacked on the systematized integrated circuit so that these terminals face the corresponding terminals of the systematized integrated circuit. A multilayer substrate,
An antenna feed circuit comprising: a connection means for connecting the dielectric multilayer substrate and terminals corresponding to each other in the system integrated circuit. 6. A Si-based substrate; a high-frequency semiconductor integrated circuit formed inside or on the surface of the Si-based substrate;
A digital integrated circuit formed inside or on a system substrate, at least the high-frequency semiconductor integrated circuit and the digital integrated circuit integrally formed on the same Si-based substrate, and at least an antenna radiating element connection terminal and a high-frequency filter connection Systemized integrated circuit having a terminal for use, a baseband signal terminal, a control signal terminal and a power supply terminal, and at least a baseband signal line, a control signal line and a power supply line, and a baseband signal terminal, a control signal terminal and a power supply A dielectric multilayer substrate disposed on the system integrated circuit so that these terminals face corresponding terminals of the system integrated circuit; and the dielectric multilayer substrate and the system multilayer integrated circuit. First connecting means for connecting mutually corresponding terminals of the integrated circuit; And a high-frequency filter laminated on the surface opposite to the surface on which the dielectric multilayer substrate is provided, and the high-frequency filter and the systematized integrated circuit are connected via the high-frequency filter connection terminal. An antenna feed circuit comprising: a second connection unit. 7. A dielectric substrate, one or more radiating elements formed by closely attaching a conductive film to one surface of the dielectric substrate, and one of the radiating elements, or The antenna feed circuit according to any one of claims 1 to 6, wherein the antenna feed circuit is integrally formed for each sub-array,
An antenna device, wherein a required number of the antenna feed circuits are connected to the other surface of the dielectric substrate via antenna radiating element connection terminals, and are surface-mounted. 8. A dielectric substrate, and one or more radiating elements formed by closely attaching a conductive film to one surface of the dielectric substrate, and any one of claims 1 to 5. A system integrated circuit corresponding to the entire radiating element in the antenna feed circuit is integrally formed on the same Si-based substrate wafer, and the Si-based substrate is provided on the other surface of the dielectric substrate. An antenna device, comprising: stacking and surface mounting a wafer; and connecting a systematized integrated circuit included in the Si-based substrate wafer to the radiating element via an antenna radiating element connection terminal. 9. The method according to claim 1, wherein
The system integrated circuit corresponding to the entire radiating element in the antenna feed circuit is integrally formed on the same Si-based substrate wafer, and the dielectric multilayer substrate is disposed on both surfaces of the Si-based substrate wafer. An antenna device, wherein a radiating element is formed by closely attaching a conductive film to a surface opposite to a surface on which the radiating element is formed. 10. A baseband signal terminal and a control signal terminal, wherein the antenna feed circuit according to claim 1 and at least a baseband signal line, a control signal line, and a power supply line are built-in. And a mother board including a power supply terminal, and a conductor film is adhered to a surface of the Si-based substrate constituting the systemized integrated circuit in the antenna feed circuit, which is opposite to the surface on which the dielectric multilayer substrate is disposed. A radiating element is formed, and a surface of the dielectric multilayer substrate opposite to the side on which the systematized integrated circuit is disposed is closely opposed to the motherboard, and the baseband signal terminal, the control signal terminal, and the power terminal are connected to each other. An antenna device, wherein the antenna feeding circuit is connected and surface-mounted on the motherboard. 11. A dielectric substrate, and one or more radiating elements formed by closely attaching a conductive film to one surface of the dielectric substrate, and any one of claim 1 to claim 5. A system integrated circuit corresponding to the entire radiating element in the antenna feed circuit is integrally formed on the same Si-based substrate wafer, and the Si-based substrate wafer is provided on the other surface of the dielectric substrate. Are stacked and surface-mounted,
A system integrated circuit included in the Si-based substrate wafer is connected to a radiating element via an antenna radiating element connection terminal, and a dielectric multilayer substrate corresponding to substantially the entire integrated system circuit integrated circuit is integrated. An antenna device, wherein the integrally formed dielectric multilayer substrate is provided on a surface of the Si-based substrate wafer opposite to a surface on which the dielectric substrate is disposed, on both surfaces of the Si-based substrate wafer. 12. An Si-based substrate wafer comprising the antenna feed circuit according to any one of claims 1 to 5, wherein systematized integrated circuits corresponding to almost all radiating elements in the antenna feed circuit are provided on the same Si-based substrate wafer. Formed integrally with the Si
On one surface of a system substrate wafer, substantially all radiating elements are formed by closely adhering a conductor film, and a dielectric multilayer substrate corresponding to substantially the whole of the integrally formed systematized integrated circuit is integrally formed. An antenna device, wherein the dielectric multilayer substrate integrally formed is laminated on the other surface of a substrate wafer.