JP2000343269A - Laser beam machine - Google Patents

Abstract

PROBLEM TO BE SOLVED: To decrease variation of load on a moving means of a machining table given by a dust collecting means at the time of receipt and delivery and machining of a work, and to perform efficient machining at high machining accuracy. SOLUTION: The machine is equipped with a machining table 2 to be mounted with a work W, a moving means 3 to move the machining table 2 in a horizontal plane, a laser beam emitting means 4 to emit laser beam from upper direction of the work W placed on the machining table 2 to pierce a through hole on the work W, and a dust collecting means 5 to collet machining dust generated in company with processing of the work W. Further, the machining table 2 is equipped with a hopper 23 to accomodate the machining dust into its interior, the dust collecting means 5 is equipped with a source of negative pressure and a suction pipe line 50 arranged between the source of negative pressure and the hopper 23, the suction pipe line 50 is equipped with a bending means 55 to bend pipe bodies 51, 52, and 53 and pipe bodies 51, 52, and 53 with one another nearly in a horizontal plane.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a laser beam machine for making a hole in a work, and more particularly, to a laser beam machine for an IC or LSI.
The present invention relates to a laser processing machine for providing through holes in an unfired flexible printed board (hereinafter, also simply referred to as a printed board) used for a wiring board on which electronic circuit components such as the above are mounted.

[0002]

2. Description of the Related Art Conventionally, when a through-hole is formed in an unfired printed board used for a wiring board on which electronic circuit components such as ICs and LSIs are mounted, a die and a punch pin which constitute a press die are printed. Positioning is performed at a predetermined processing position with the substrate interposed therebetween, and after punching the punch pin into the printed circuit board, the punch pin is pulled out. The processing waste generated after the processing is housed in a hopper arranged below the die, and is discarded when the processing waste reaches a certain amount.

[0003] In recent years, as the electronic circuit components mounted on a wiring board have become highly integrated, the hole diameter required for a printed board has also increased.
0.1mm-0.05mm is very small,
Also, the gap between the holes tends to be narrowed. Therefore, in the drilling process using a conventional press die, it is becoming difficult to perform the drilling itself corresponding to such high integration, and instead of using a press die, a drilling process using a laser processing machine is performed. Processing tends to be performed.

When a very small diameter through hole is formed, fine processing dust scatters above the substrate before penetrating the through hole and drifts in the hopper after penetrating. Dust collecting means for forcibly collecting fine processing dust was required.

[0005] As a device provided with such dust collecting means, there is known a punching machine 100 as shown in FIG. In the perforating machine 100, those that fly above the substrate are collected by a dust collection duct 102 fixed near a processing table 101, and those that float in a hopper 103 are:
The hopper 103 is provided with a suction line 104 communicating with a negative pressure source (not shown), and the negative pressure source is activated to forcibly suction. Suction line 10 attached to hopper 103
4 uses a flexible dust collection duct, wraps the dust collection duct from above in the horizontal part of the gate-shaped main body frame 105, and gives the hopper 103 a slack necessary for moving the processing table 101. Connected.

[0006]

However, since such a drilling process is one of the steps in an automatic processing line, an automatic supply apparatus for supplying a workpiece after the previous processing step and a next step. It is indispensable to cooperate with an automatic collection device that collects workpieces. Therefore, the worktable 101 on which the workpiece is placed needs to move at high speed and in a wide range in accordance with this cooperation. However, the conventional drilling machine 100 is designed to cope with a wide range of movement in accordance with this cooperation. When sufficient slack is given, the slack portion collides with the leg 105a of the main body frame 105 of the processing machine 100, or vibrates due to inertia accompanying the movement of the processing table 101, and these collisions and vibrations This was transmitted to the moving means 106 of the processing table, and had an adverse effect on the positioning of the boring process.

[0007] In laser processing, since the laser irradiation area is small and the processing area is limited, when processing a single printed circuit board, the processing table 101 is moved at a pitch of several mm for each single irradiation area. The processing table 101 is also moved when the processing table 101 is moved.
It is necessary to be able to follow 6 without imposing a load.

Accordingly, an object of the present invention is to reduce the load fluctuation applied to the moving means of the worktable by the dust collecting means at the time of delivery and processing of the work, thereby enabling efficient processing with high processing accuracy. An object of the present invention is to provide a laser beam machine.

[0009]

In order to achieve the above object, the present invention provides a processing table on which a work is placed, moving means for moving the processing table in a horizontal plane, and a work table mounted on the processing table. Laser light irradiation means for irradiating a laser beam from above the work to open a through hole in the work, and dust collecting means for collecting processing dust generated during processing of the work are provided. A laser processing machine comprising a hopper for taking in processing dust, wherein the dust collecting means includes a negative pressure source, and a suction line disposed between the negative pressure source and the hopper. The first feature is that a plurality of pipes and a bending means for bending the plurality of pipes in a substantially horizontal plane are provided.

Further, the present invention provides a processing table on which a work is placed, moving means for moving the processing table in a horizontal plane, and irradiating a laser beam from above the work placed on the processing table. Laser light irradiation means for opening a through hole in the work, and dust collecting means for collecting processing dust generated during the processing of the work, the processing table includes a hopper for taking the processing dust into the inside, In a laser processing machine in which a dust collecting means includes a negative pressure source and a suction pipe made of a flexible pipe disposed between the negative pressure source and the hopper, the suction pipe has a pipe body. A second feature is that a guide link mechanism is provided to follow the processing table and to bend freely in a substantially horizontal plane.

[0011]

Embodiments of the present invention will be described below with reference to the accompanying drawings. Note that the present invention is not limited to this embodiment.

FIG. 1 shows a first embodiment of a laser beam machine according to the present invention. In FIG.
Indicates a laser beam machine, and a dashed line indicates a printed circuit board W.

As shown in FIG.
A processing table 2 for mounting a printed circuit board (work) W on a main body 12 having a gate-shaped frame 11 fixed on a base 10, a moving unit 3 for moving the processing table 2 in a horizontal plane; A laser beam irradiating means 4 for irradiating a laser beam from above the printed circuit board W placed on the processing table 2 to open a through hole P in the printed circuit board W;
And dust collecting means 5 for collecting the processing dust generated by the processing of (1). Although not shown in the figure, the laser processing machine 1 also has a fixed dust collection duct (FIG. 10) for collecting processing dust scattered upward during processing near the processing table 2 as in the conventional example. Reference).

As shown in FIG. 2, the processing table 2 has an array corresponding to the through holes provided in the printed circuit board W and has a plurality of holes 20 having a diameter larger than that of the through holes.
1 and a support column 22 for supporting the base plate 21, and a hopper 23 for taking in processing dust through the hole 20 is provided therein. Hopper 23
A dust collection port 24 is provided at the bottom of the device, and an L-shaped tube 25 is attached to the dust collection port 24. The pipe 25 can be connected to a pipe 51 of a suction pipe 50 described later. An intake port 26 is provided on each of the inclined side surfaces of the hopper 23. When suction is performed by a negative pressure source, air is sucked through the intake port 26, and thereby the base plate 2 is sucked.
1 and a printed circuit board W mounted thereon for processing.
Are not bent by the suction pressure.

The moving means 3 is, as shown in FIG.
This is a well-known XY table provided movably in both X and Y directions in a horizontal plane, and is installed on the base 10.
The moving means 3 includes an X table 31 that moves on a rail 30 arranged in the X direction by rotating a feed screw (not shown) by a motor, and rotates a feed screw (not shown) by a motor. And a Y table 33 that moves on a rail 32 provided along the Y direction by moving the work table 2 from a laser head 41 described later by appropriately moving these two tables. Can be moved in accordance with the irradiation area of the laser beam to be performed, and furthermore, an automatic supply device (not shown) for supplying the printed circuit board after the previous processing step and collecting the printed circuit board after processing for the next step It can be moved in cooperation with each of the automatic collection devices (not shown).

The laser light irradiation means 4 includes a laser oscillator (not shown) and an optical path device 40 for guiding laser light oscillated from the laser oscillator to the printed circuit board W. The above laser oscillator is a normal one used in this type of laser processing machine. Optical path device 40
Is fixedly installed on a horizontal portion of the gate-shaped frame 11, and a laser head 41 is disposed on the lower surface side of the distal end portion. In this fixed position, the printed circuit board W can be irradiated with laser light from above the printed circuit board W.

As shown in FIG. 3, the dust collecting means 5 comprises:
It includes a negative pressure source (not shown) and a suction line 50 disposed between the negative pressure source and the hopper 24.

As the negative pressure source, for example, a source having a suction force capable of collecting processing dust generated at the time of punching a printed board through a suction pipe 50 is used.

The suction pipe 50 has at least four pipes 5.
1, 52, 53, 54 and these four pipes 51, 5
Bending 2, 53, 54 in a substantially horizontal plane 3
And two bending means 55.

The tube 54 has a frame 11 whose axis is at the same height as the tube 25 of the processing table 2.
Is fixed to the leg portion 11a of the base member by a pipe band 56, and an end thereof communicates with the negative pressure source.

The length of each tube is appropriately selected according to the range of movement of the worktable 2 and the distance between the legs 11a of the frame 11. In addition, each of the pipes has a sufficient rigidity and a light weight which does not bend due to its weight when configured as the suction pipe 50, for example, a lightweight plastic pipe reinforced with carbon fiber or the like. Use

The bending means 55 includes a bellows pipe 57 for connecting the pipes to each other, and a hinge bracket 58 connected to an end of each pipe for rotating each pipe about a vertical axis in a substantially horizontal plane. It is composed of

As shown in FIG. 4, the hinge bracket 58 includes a pair of brackets 58a and 58b for fastening the ends of the tubes (in the figure, tubes 52 and 53) with screws from the outside.
And a hinge pin 58c for connecting the brackets 58a and 58b rotatably about a vertical axis.
Then, as each hinge bracket 58 rotates around the axis of the hinge pin 58c, the bellows 57 also opens and closes, and the tubes 51, 52, 53, 54 can be bent at a desired angle in a substantially horizontal plane. .

Although not shown in the figure, the laser beam machine 1 includes a control unit (not shown) equipped with a sequencer, and performs processing in accordance with an operation procedure described later.

Next, the operation of the laser beam machine 1 will be described.

First, a negative pressure source (not shown) is activated to start suction, and air is sucked into the hopper 24 and the suction pipe 50 through the suction port 26.

Next, the X and Y tables 31 and 33 move in accordance with an instruction from the control unit, and the worktable 2 moves to the position of an automatic supply device (not shown) for a printed circuit board to be processed. Then, at this position, the printed board W is received on the processing table 2 from the automatic supply device. During this move,
Each of the hinge brackets 5 according to the moving position of the processing table 2
8 bends around the hinge pin 58c at a predetermined angle, and each bellows tube 57 opens and closes accordingly, and each tube body bends in a series in a substantially horizontal plane. Smooth follow-up is possible.

Next, the control unit moves the processing table 2 to the first irradiation area below the laser head 41,
A laser beam of a predetermined intensity is irradiated from the laser head 41 to form a plurality of through holes at once in the area of the printed circuit board W. During this time, the hopper 24 and the suction line 50
Since the air is sucked from the air inlet 26 into the inside, the processing dust generated by the processing is surely sucked and removed together with the air suction.

When the processing of the first area is completed, the control unit moves the processing table 2 to the next irradiation area. During this movement, the hinge brackets 58 are bent at a predetermined angle in accordance with the movement position of the processing table 2 and the bellows tubes 57 are opened and closed in response to this, and the respective tubes are bent in series in a substantially horizontal plane. Therefore, no load is applied to the movement of the processing table 2,
Smooth follow-up becomes possible. Then, a laser beam is again irradiated from the laser head 41 to open a through hole in the area of the printed circuit board W.

When all the boring processes are completed, the control unit moves the processing table 2 to a position of an automatic collection device (not shown) to allow the transfer of the printed circuit board W. During this movement, the hinge brackets 58 are bent at a predetermined angle in accordance with the movement position of the processing table 2 and the bellows tubes 57 are opened and closed in response to this, and the respective tubes are bent in series in a substantially horizontal plane. Therefore, a load is not applied to the motor when the processing table 2 is moved, and smooth follow-up becomes possible.

As described above, according to the laser processing machine 1 of the present embodiment, the dust collecting means 5 can flexibly follow the movement of the processing table 2 at the time of high-speed delivery and processing of a wide range of work. The load fluctuation that the dust means 5 gives to the moving means 3 can be reduced. Therefore, processing can be performed efficiently with high processing accuracy.

FIG. 5 shows a second embodiment of the laser beam machine according to the present invention. In the figure, the same reference numerals are given to parts common to the first embodiment, and description thereof will be omitted. Although not shown in the figure, the laser processing machine 1 also has a dust collection duct (see FIG. 10) near the processing table, which collects processing dust scattered upward during processing, as in the conventional example. Have.

The laser beam machine 1 has basically the same configuration as that of the laser beam machine of the above embodiment, except that the dust collecting means is different.

As shown in FIG. 6, the dust collecting means 5 according to the present embodiment comprises a negative pressure source (not shown), a flexible dust collecting duct (tube) 6, and a processing of the dust collecting duct 6. Stand 2
And a guide link mechanism 7 that bendably supports in a substantially horizontal plane following the above.

The dust collection duct 6 is a flexible pipe made of plastics which is provided to bend freely. One end of the dust collection duct 6 is connected to a pipe 25 (see FIG. 2) attached to the hopper 24, and the other end is negative. Connected to pressure source. A part of the dust collection duct 6 is fixed to the leg 11 a of the frame 11 by a pipe band 56 at substantially the same height as the axis of the tube 25.

As shown in FIGS. 6 and 7, the guide link mechanism 7 is mainly composed of two support arms 71, 72 linked via a link pin 70. One end of the support arm 71 is connected to the leg 1 of the frame 11.
It is linked to a bracket 73 fixed to 1a via a link pin 74. As shown in FIG. 8, one end of the support arm 72 is connected to the horizontal portion 75a of the gate-shaped stand 75 fixed to the X table 31 by the link pin 7.
6 are linked.

As shown in FIG. 7, a bracket 77 for supporting the dust collecting duct 6 is fixed to the lower end of the link pin 70, and this bracket 77 can be rotated according to the rotation of the link pin 70. Is configured. Also,
A dust collecting duct 6 is provided at an intermediate portion in the length direction of the support arm 72.
Is mounted. The width of the guide 78 has a play more than the outer diameter of the dust collection duct 6, so that the dust collection duct 6 can flexibly correspond to a bent shape when bent in a substantially horizontal plane. The number of such guides may be increased according to the length and weight of the dust collection duct 6, and may be attached to the support arm 71 side.

Also in the laser beam machine 1 of the present embodiment, the control unit moves the X and Y tables 31 and 33,
The processing table 2 is moved to a position of an automatic supply device (not shown) of a printed circuit board to be processed. When receiving the printed circuit board W from the automatic supply device onto the processing table 2, the support arms 71, 72 are horizontally rotated around the respective link pins according to the moving position of the processing table 2 to rotate at a predetermined angle. Accordingly, the dust collection duct 6 also bends in a substantially horizontal plane.

For example, as shown in FIG. 9, when the worktable 2 is moved to four positions (A1, A2, A3, A4), the positions of the links of the two support arms 71, 72 are By rotating the shafts 71 and 72 around the axis D and C of the link, D, C1, In the case of position A2 in B1,
D, C2, B2, and D, C in the case of position A3
3, B3, D, C4, B in the case of position A4
4 and the support arms 71 and 72 are bent at these link positions. At this time, the link pin 7
Since the bracket 77 fixed to 0 rotates flexibly in accordance with the bent shape of the dust collection duct 6, the dust collection duct 6 bends without difficulty and smoothly follows the moving means 3 without giving an extreme load fluctuation. It is possible to do.

As described above, according to the laser beam machine 1 of the second embodiment, like the laser beam machine of the above-described first embodiment, when the workpiece is delivered and machined over a wide range at a high speed, the machining table 2 is used. Since the dust collecting means 5 can flexibly follow the movement, the load fluctuation applied to the moving means 3 by the dust collecting means 5 can be reduced. Therefore, processing can be performed efficiently with high processing accuracy.

In each of the above embodiments, the portal frame 11
The tube 11 or the support arm 71 is supported by the leg portion 11a of the base 10 so that it can smoothly cope with the movement of the processing table 2. However, a guide is erected on the base 10, and the guide 51 is supported by the guide. , And may be configured to smoothly follow the movement of the processing table 2.

[0042]

According to the present invention, at the time of transfer and processing of a workpiece, the load variation applied to the moving means of the processing table by the dust collecting means can be reduced, and the processing can be performed efficiently with high processing accuracy.

[Brief description of the drawings]

FIG. 1 is a schematic perspective view showing a first embodiment of a laser beam machine according to the present invention.

FIG. 2 is a schematic cross-sectional view of a main part showing an internal structure of a processing table in the embodiment.

FIG. 3 is a schematic plan view showing a main part of the dust collecting means in the embodiment.

FIG. 4 is a schematic vertical sectional view showing a main part of a bending means of the dust collecting means in the embodiment.

FIG. 5 is a schematic perspective view showing a second embodiment of the laser beam machine according to the present invention.

FIG. 6 is a schematic plan view showing a main part of the dust collecting means in the embodiment.

FIG. 7 is a partial side sectional view showing a main part of the guide link mechanism in the embodiment.

FIG. 8 is a partial cross-sectional view of a part of the guide link mechanism in the same embodiment as viewed from the direction AA in FIG.

FIG. 9 is a plan view showing link positions at respective positions of the guide link mechanism in the embodiment.

FIG. 10 is a schematic perspective view showing a conventional drilling machine.

[Explanation of symbols]

1: laser processing machine, 2: processing table, 3: moving means, 4:
Laser beam irradiation means, 5: dust collection means, 6: dust collection duct (tube), 7: guide link mechanism, 24: hopper, 5
0: suction pipe, 51, 52, 53, 54: pipe, 55:
Bending means, W: printed circuit board (work).

Claims (2)

[Claims] 1. A worktable on which a work is placed, a moving means for moving the worktable in a horizontal plane, and a through-hole on the work by irradiating a laser beam from above the work placed on the worktable. Laser light irradiating means for opening the workpiece, and dust collecting means for collecting processing dust generated during processing of the work, the processing table includes a hopper for taking in processing dust therein, and the dust collecting means is provided. In a laser processing machine provided with a negative pressure source and a suction line disposed between the negative pressure source and the hopper, the suction line substantially comprises a plurality of tubes and a plurality of the tubes. A laser processing machine comprising a bending means for bending in a horizontal plane. 2. A worktable on which a work is placed, moving means for moving the worktable in a horizontal plane, and a through-hole formed on the work by irradiating a laser beam from above the work placed on the worktable. Laser light irradiating means for opening the workpiece, and dust collecting means for collecting processing dust generated during processing of the work, the processing table includes a hopper for taking in processing dust therein, and the dust collecting means is provided. In a laser processing machine provided with a negative pressure source and a suction pipe made of a flexible pipe disposed between the negative pressure source and the hopper, A laser processing machine provided with a guide link mechanism that is supported so as to bend in a substantially horizontal plane following the above.