JP2000340920A - Circuit board and integrated circuit device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To improve mounting density of a circuit board and an integrated circuit device. SOLUTION: An electric double layer capacitor is formed on the cover member 4 of a circuit board 1 provided with an insulating board 2, where the electronic parts of a semiconductor element 3 and the like are loaded on a surface and the cover member 4 fixed to the insulating board 2, so that a part of or all electronic components of the semiconductor element 3 and the like, which are loaded on the surface of the insulating board 2, are concealed. The mounting area of the electronic parts of the board and a device is increased, mounting density can be improved and the circuit board, and the integrated circuit device can be miniaturized by providing the electric double layer capacitor in a cover body and a case substrate.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a circuit board for mounting electronic components and an integrated circuit device in which a circuit board is housed in a case base.

[0002]

2. Description of the Related Art Conventionally, a structure of a semiconductor package for accommodating a semiconductor element, which is a typical example of a circuit board, includes a semiconductor element 72 mounted on a surface of an insulating substrate 71 as shown in FIG. Are the insulating substrate 71 and the lid 73
And hermetically sealed. The semiconductor element 72 is electrically connected to a wiring layer 75 formed in the insulating substrate 71 via a bonding wire 74 or an electrode on the lower surface of the semiconductor element 72, and furthermore, a ball attached to the back surface of the insulating substrate 71. It is connected to the wiring layer 77 in the external circuit board 76 via connection terminals 78 such as terminals.

A conventional electric double-layer capacitor used as a backup power supply for a memory has a lead terminal mounted on the surface of the circuit board by soldering or the like. 2. Description of the Related Art There is known a method of arranging on a portion other than a board and electrically connecting the circuit board.

[0004]

However, the electric double-layer capacitor mounted on the surface of the circuit board is large in size and requires a large space for forming the electric double-layer capacitor. The space for mounting components is reduced, the mounting density of wiring cannot be increased, and the method of arranging an electric double layer capacitor in a portion other than the above wiring circuit requires wiring layout. There is a problem that a space for accommodating the multilayer capacitor must be provided separately. Further, in either case, the mounting density of the circuit board cannot be increased, and the device itself becomes large.

[0005]

As a result of studying the above problems, the present inventors have found that an electric double layer capacitor can be mounted on a cover member of a circuit board, a cover for hermetic sealing, or a case for housing the circuit board. It has been found that space saving can be achieved by forming.

That is, the circuit board of the present invention is fixed to the insulating substrate so as to cover an insulating substrate having electronic components mounted on the surface and a part or all of the electronic component mounted on the insulating substrate surface, And a lid member having an electric double layer capacitor.

Here, the electronic component can be hermetically sealed by the lid member, and the thickness of the electric double layer capacitor is desirably 20 mm or less.

The integrated circuit device of the present invention has a case base having an opening, a circuit board housed in the case base, and a case base fixed to the case base so as to seal the opening of the case base. And a lid, wherein the case base and / or the lid comprise an electric double layer capacitor.

[0009]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS A package for accommodating a semiconductor element as an example of a circuit board of the present invention will be described with reference to FIG. 1 which is a schematic sectional view thereof.

According to the semiconductor element housing package 1 of FIG. 1, a concave portion is formed on the surface of an insulating substrate 2 containing at least one of ceramics, glass, and organic resin, and a semiconductor element is formed in the concave portion. 3 is mounted, and the semiconductor element 3 is hermetically sealed by a lid member 4 joined to the surface of the insulating substrate 2 using metallization or glass. Further, a wiring circuit layer 5 is formed on the surface and inside of the insulating substrate 2 and is electrically connected to the semiconductor element 3 by wire bonding, ribbons, bumps and the like.

A plurality of connection pads 6 are provided on the bottom surface of the insulating substrate 2, and are electrically connected to the semiconductor element 3 via a wiring circuit layer 5 formed inside the insulating substrate 2. ing.

The connection pad 6 is formed of a conductor containing at least one of tungsten, molybdenum, silver, copper, platinum and palladium, and is externally connected via a ball terminal 7 attached to the connection pad 6. It is mounted on the surface of the circuit board 8.

According to the present invention, a major feature is that an electric double layer capacitor is formed on the lid member 4. According to FIG. 1, the lid member 4 is provided between the two-layer polarizable electrodes 9, 9. A separator 10 is provided, an insulating gasket 11 is formed on the outer periphery thereof, and current collectors 12, 1
2 is an electric double layer capacitor. Further, according to FIG. 1, insulating members 13 are provided on the upper and lower surfaces of the current collectors 12, 12, respectively.

The polarizable electrode 9 has, for example, a specific surface area of 100.
A mixture of activated carbon of 0 to 3000 m ² / g and an organic binder, formed into a plate, and heat-treated to impregnate a solid activated carbonaceous structure obtained by carbonizing the organic binder with an aqueous or organic solvent-based electrolyte. Is preferably used.

The separator 10 is made of pulp, an organic film such as polyethylene or polypropylene, glass fiber, ceramics, or the like.
It is formed to insulate between the electrodes, and is made of a porous material through which ions in the electrolytic solution impregnated in the polarizable electrode 9 can pass.

The gasket 11 serves to prevent the electrolyte impregnated in the polarizable electrode 9 from leaking outside and to fix and protect the polarizable electrode 9 and the separator 10. , For example, plastics such as polypropylene and acrylic, glass, and ceramics. Further, the current collector 12
It is made of a conductive butyl rubber, an aluminum plate, or a metal such as aluminum plasma sprayed, and can exchange electric charges with the polarizable electrode 9.

According to FIG. 1, one of the current collectors 12 is formed via via holes or castellations 15 formed in the insulating substrate 2, and the other of the current collectors 12 is formed on the gasket 11 and the insulating substrate 2. The semiconductor element 3 is electrically connected to the semiconductor element 3 via a via-hole conductor or a castellation 16 formed in the semiconductor element 2, and functions as a backup power supply for the semiconductor element 3. The via hole or castellation 16 penetrates a current collector other than the current collector connected via the insulating layer 17. With this configuration, the packaging density of the package 1 is improved, and the size of the package can be reduced.

Although the electric double layer capacitor formed on the cover member 4 can be used to remove high frequency signal noise as a bypass capacitor or a decoupling capacitor, at least one surface of the cover member 4 has a ceramic capacitor or the like. It is also possible to provide a bypass capacitor, a decoupling capacitor or the like (not shown) made of a semiconductor device 3 and electrically connect it to the semiconductor element 3 via wiring. As a result, the length of the wiring can be shortened, so that the inductance component generated in the wiring can be reduced, and high-frequency noise can be effectively removed. Further, other electronic components can be provided on the surface of the electric double layer capacitor, so that the packaging density of the package is improved.

Further, from the viewpoint of miniaturization of the wiring board, it is desirable that the thickness of the electric double layer capacitor be 20 mm or less. Further, three or more polarizable electrodes 9 may be provided.

In FIG. 1, the lid member hermetically seals the semiconductor element. However, the present invention is not limited to this, and the electronic component mounted on the surface of the insulating substrate can be removed from the outside. It may have a function as a protective cover provided to protect against mechanical shock.
Therefore, a schematic cross-sectional view of another example of the circuit board of the present invention is shown in FIG. According to FIG. 2, the circuit board 20
A plurality of electronic components 22 and 23 such as, for example, a surface-mount type semiconductor element, a capacitor, a diode, a resistor, and a resonator are formed on a surface of an insulating substrate 21 containing at least one of ceramics, glass, and organic resin. Electronic components (not shown) such as capacitors and resonators formed by conductor patterns and the like are also provided inside the insulating substrate 21. Then, the electronic components 22 and 23
Are electrically connected to the conductor wiring layer 24 formed on the surface or inside of the insulating substrate 21 to form a circuit.

According to FIG. 2, the lid member 25 is
The electronic component 22 is fixed to the surface of the insulating substrate 21 so as to cover some of the electronic components 22 of the components 2 and 23, and the electronic component 22 is protected from external shocks and the like by the cover member 25. A major feature is that an electric double layer capacitor is formed on the lid member 25.

Referring to FIG. 2, the lid member 25 is formed of an electric double layer capacitor having a U-shaped cross section, and is fixed to the surface of the insulating substrate 21. In addition, the vertical section and the horizontal section are U-shaped, and the
5 and an insulating substrate 21 or a U-shaped one only in vertical or horizontal section.

The specific structure of the electric double layer capacitor is as follows:
As shown in FIG. 3 which is an enlarged view of the main part, a separator 31 having a U-shaped cross section is disposed between two polarizable electrodes 30 having a U-shaped cross section. Current collectors 32, 32 each having a U-shaped cross-section
Are formed.

The method for manufacturing the polarizable electrode 30 having a U-shaped cross section is, for example, mixing activated carbon and an organic binder, forming the mixture into a desired shape by casting, or forming a sheet by roll forming. After obtaining a molded body of a desired shape by bending in a U-shape, it can be produced by heat treatment and further impregnation with an electrolytic solution.

An insulating gasket 33 is formed between the laminate and the insulating substrate 21 to prevent the electrolyte in the capacitor from leaking to the outside. Note that insulating members 34, 34 may be provided on the surfaces of the current collectors 32, 32.

Further, the current collectors 32, 32 are electrically connected to the electronic component 22 and the like via the gasket 33 and 35, 36 formed inside or on the surface of the insulating substrate 21, so that a backup power supply for the electronic component 22 is provided. Can function as

In FIGS. 1 to 3, the electric double-layer capacitor is formed on the cover member formed on the surface of the circuit board. However, the present invention is not limited to this, and the circuit board may be internally mounted. An electric double-layer capacitor may be formed on the case base and / or the lid of the integrated circuit device housed in the device.

FIG. 4 is a schematic sectional view showing an example of the integrated circuit device of the present invention. According to the integrated circuit device 40 of FIG. 4, a circuit board 43 on which an integrated circuit having an electronic component 42 or the like is mounted on the surface or inside the case base 41 having an opening is fixed and accommodated.

The case base 41 includes a base 45 and a side frame 46.
The base 45 and the side frame 4
6 is made of a metal such as aluminum, copper, stainless steel or the like, glass, resin, or the like.

The opening of the case base 41 is covered with a lid 44.
The case base 41 and the lid 44 are adhered and fixed. Further, a resin mold 47 is filled with a thermosetting resin inside the case base 41. Furthermore, the input and output of signals of the electronic component 42 are connected to an external circuit (not shown) via a terminal layer 49 provided on a part of the wiring layer 48 and the side frame 46.

According to the present invention, the case base 41 and / or
Another feature is that an electric double layer capacitor is formed on the lid 44. In FIG. 4, the electric double layer capacitor is formed on the lid 44. Specifically, the lid 44 is 2
An insulating gasket 52 is formed on the outer periphery of the laminate in which the separator 51 is disposed between the polarizable electrodes 50 containing active carbon in the layers, and current collectors 53, 5
3 is an electric double layer capacitor. Further, according to FIG. 4, insulating members 54, 54 are disposed on the upper and lower surfaces of the current collectors 53, 53, respectively.

According to FIG. 4, one of the current collectors 53 is connected to the current collector 53 via a via hole or a castellation 55 insulated on the inside or the side wall of the side frame 46 of the case base 41. The other is electrically connected to the electronic component 42 mounted on the circuit board 43 via a via hole conductor or castellation 56 formed on the side wall of the gasket 52 and the case base, respectively.
It functions as a backup power supply for the electronic component 42. With this configuration, the mounting density of the integrated circuit device 40 is improved, and the size of the device can be reduced.

Although the electric double layer capacitor is formed on the cover 44 in FIG. 4, the present invention is not limited to this, and the electric double layer capacitor is provided in the case base 41. There may be. In this case, in order for the electric double layer capacitor to operate normally, the case base 4 is required.
It is desirable that the temperature of No. 1 is 85 ° C. or less.

From the viewpoint of miniaturization of the device, it is desirable that the thickness of the electric double layer capacitor be 20 mm or less.

The polarizable electrodes 9 and 3 in FIGS.
0 and 50 are 3 or more, and separators 10, 31, and 51 are 2
The number may be more than one. Further, in FIGS. 1 to 4, the lid member or the lid is made of an electric double layer capacitor, but the present invention is not limited to this, and the lid member or the lid is A multilayer capacitor may be attached.

[0036]

As described above in detail, according to the circuit board and the integrated circuit device of the present invention, by providing the electric double layer capacitor on the lid and the case base, the mounting area of the electronic components of the substrate and the device can be reduced. The mounting density can be increased, and the size of the circuit board and the integrated circuit device can be reduced.

[Brief description of the drawings]

FIG. 1 is a schematic sectional view of a package for housing a semiconductor element which is an example of a circuit board of the present invention.

FIG. 2 is a schematic sectional view showing another example of the circuit board of the present invention.

FIG. 3 is an enlarged view of a main part of the circuit board of FIG. 2;

FIG. 4 is a schematic sectional view showing an example of the integrated circuit device of the present invention.

FIG. 5 is a schematic sectional view of a package for housing a semiconductor element, which is an example of a conventional circuit board.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Package for housing semiconductor element 2, 21 Insulating substrate 3 Semiconductor element 4, 25 Lid member 5, 15, 16 Wiring circuit layer 6 Connection pad 7 Ball terminal 8 External circuit board 9, 30, 50 minutes Polarity electrode 10, 31, 51 Separator 11, 33, 52 Gasket 12, 32, 53 Current collector 13, 34, 54 Insulating member

Continued on the front page (72) Inventor Yuichi Hori 1-4-4 Yamashita-cho, Kokubu-shi, Kagoshima Inside Kyocera Research Institute (72) Inventor Kazuo Ikuta 1-4-4 Yamashita-cho, Kokubu-shi, Kagoshima Kyocera Corporation 5E082 AB09 BB10 BC39 DD11 HH12 HH14 PP09 5E336 AA04 AA08 AA09 AA11 BB02 BB16 BB17 BB18 BC31 BC34 CC32 CC36 CC42 CC43 CC53 DD02 EE01 GG30

Claims (5)

[Claims] An insulating substrate having electronic components mounted on a surface thereof;
A circuit board, comprising: a lid member fixed to the insulating substrate so as to cover a part or the whole of the electronic component mounted on the surface of the insulating substrate; and a lid member provided with an electric double layer capacitor. 2. The circuit board according to claim 1, wherein said electronic component is hermetically sealed by said lid member. 3. The electric double-layer capacitor has a thickness of 20 m.
3. The circuit board according to claim 1, wherein m is equal to or less than m. 4. An integrated device comprising: a case base having an opening; a circuit board housed in the case base; and a lid fixed to the case base to seal the opening of the case base. In the circuit device, the case base and / or the lid may include an electric double layer capacitor. 5. The electric double-layer capacitor has a thickness of 20 m.
5. The integrated circuit device according to claim 4, wherein m is equal to or less than m.