JP2000333050A - Image pickup element mount device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To increase an adjustable range by decreasing a heated fixing time of a joint. SOLUTION: A shutter unit 12 is fixed to the rear face of a body 10 of a mount device by machine screws 14. A 1st metallic fixture 18 is fixed to a mount section 10b of the body 10 by machine screws 20 so as to clamp a low pass filter support frame 22. The support frame 22 is fixed to the metallic fixture 18 by machine screws 26. An image pickup element 16 is adhered and fixed to a front face of a 2nd metallic fixture 30. The metallic fixture 18 is provided with 4 legs 18b that are projected in a direction of the metallic fixture 30 and whose tips are folded in parallel with an image pickup face of the image pickup element 16. The metallic fixture 30 is provided with 4 legs 30a extended horizontally corresponding to the folded faces at the tip of the legs 18b. After the adjustment of the position, the folded faces at the tip of the legs 18b is fixed to the legs 18b with a molten metal. A hole 18c is made in the vicinity of the root of each leg 18b A flowing-down prevention shelf 30b that is folded as a shelf is formed to a lower end of each leg 30a in a way that the shelf enters the lower side of the legs 18b. A bole 30c is made around the root of the legs 30a.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an image pickup device mounting device, and more particularly, to an electronic image pickup device using a solid-state image pickup device such as a CCD or a CMOS so that the solid-state image pickup device can be positioned well. The present invention relates to an image pickup device mounting device.

[0002]

2. Description of the Related Art In an electronic image pickup apparatus using a solid-state image pickup device, it is necessary to accurately adjust the relative positions between a plurality of optical elements. For example, it is necessary to correctly adjust the relative positional relationship between the image sensor and the optical finder and the mutual positional relationship between the three image sensors in the three-chip camera. In order to fully demonstrate the performance of the solid-state imaging device, Z-axis adjustment in the focus direction, tilt adjustment (two-axis) for one-sided blur adjustment, and
It is necessary to adjust a total of six axes, that is, X and Y axes for adjusting the angle of view and rotation θ axis (rotation).

It is not appropriate in terms of cost, accuracy and space to incorporate a mechanism capable of performing such adjustment in units of μm into an imaging device. Therefore, holding the adjustment mechanism on the jig side,
A method of fixing these elements in the imaging device after the adjustment is considered. For example, a method of fixing an image sensor or the like with molten metal such as solder after adjustment is known. The fixation with the molten metal is superior in terms of fixing strength and reliability as compared with the method using an adhesive.

[0004] As a technique for fixing a solid-state imaging device with a molten metal, the following configuration has been conventionally known. That is, Japanese Utility Model Application Laid-Open No. 59-39580 describes a technique for soldering a color separation prism and a fixed image pickup device in a television camera. Shokai 59-395
No. 80 describes a method in which a support provided on a prism is inserted into a mounting hole provided on a solid-state imaging device, and a gap between the support and the mounting hole is filled with solder and joined.

Japanese Patent No. 2598219 discloses that a first metal fitting having a leg is fixed to a color separation prism, and a second metal fitting also having a leg is fixed to a solid-state image pickup device. A configuration in which the gap between the legs of the second metal fitting is filled with solder and joined is described.

[0006] Japanese Patent No. 2601029 discloses a first metal fitting having a plurality of first legs projecting so as to be parallel to the imaging surface of a solid-state imaging device fixed earlier and to the left and right. And fixed to the light exit surface of the color separation prism,
A second fitting having a second leg parallel to the light exit surface and formed to abut the plurality of first legs of the first fitting, respectively, is provided. After the solder resist layer is formed except for the surface facing the second leg, the first and second fittings are aligned, and then the first leg and the second leg are aligned.
Is described in which the opposing surfaces of the legs are fixed by a molten metal.

[0007]

In the conventional example, there are the following problems when fixing with a molten metal. That is, in the configuration described in Japanese Utility Model Laid-Open Publication No. 59-30580, it is necessary to locally heat the column and the mounting hole at the time of heating for fixing the solder, and the workability is poor. In the conventional example described in Japanese Patent No. 2598219, the opposed portions of the legs are dispersed in three directions, so that the molten metal easily flows down during soldering. In the conventional example described in Japanese Patent No. 2601029, the soldering region can be limited by forming a solder resist layer. However, when the imaging device is vertically arranged and the facing portion is heated,
The molten metal must be held by surface tension.
However, since the opposing portions are parallel to each other, there is a problem that if the interval between the opposing portions is widened to secure a sufficient adjustment range, the molten metal tends to flow down by its own weight.

An object of the present invention is to provide an image pickup device mounting apparatus which solves such a problem.

[0009] That is, an object of the present invention is to provide an image pickup device mounting apparatus in which the time for heating and fixing the joint is reduced.

Another object of the present invention is to provide an image pickup device mounting apparatus having a larger adjustable range.

[0011]

An image pickup device mounting apparatus according to the present invention comprises: a first metal fitting fixed to an electronic image pickup apparatus;
An image pickup device mounting device comprising: a second metal fitting fixedly holding a solid-state imaging device between the first metal fitting and the first metal fitting, wherein the first metal fitting and the second metal fitting are arranged in a direction of an optical axis. And a plurality of legs that face each other within a predetermined distance range, and each of the first and second metal fittings has a heat conduction isolation structure at the base side. With such a structure, the heating efficiency at the time of melting is improved.

Further, the leg of one of the first and second metal fittings enters under the other of the other leg of the first and second metal fittings, and is inserted between the facing legs. Equipped with a shelf for preventing metal from falling off. Preferably, the second
The legs of the bracket have the shelf. The shelves can effectively prevent the molten metal from flowing down. As a result, the first
The adjustable distance between the first and second fittings can be increased.

As the heat conduction isolation structure, for example, an opening is provided at the base of the leg, or the base of the leg is made thinner.

[0014]

Embodiments of the present invention will be described below in detail with reference to the drawings.

FIG. 1 is an exploded perspective view of an embodiment of the present invention applied to a digital camera of an interchangeable lens type.
Shows a perspective view of the assembled state.

Reference numeral 10 denotes a main body (base) of the mounting device according to the present embodiment. On the front surface of the main body 10, a mount 10a on which an interchangeable lens can be mounted is formed. A shutter unit 12 is fixed to the rear surface of the main body 10 with screws 14.

A first metal fitting 18 for fixing the solid-state imaging device 16 is fixed to a mounting portion 10b of the main body 10 with a screw 20. The first metal fitting 18 has an opening 18a at a substantially center thereof for transmitting an optical image from a photographing lens and entering the image pickup device 16.

Reference numeral 22 denotes a low-pass filter holding frame for holding the optical low-pass filter 24, which is inserted between the shutter unit 12 and the first metal fitting 18. The low-pass filter holding frame 22 is fixed to the first metal fitting 18 by screws 26. A dust-proof rubber 28 is attached and fixed to a peripheral portion of the optical low-pass filter 24 and a surface of the low-pass filter holding frame 22 facing the first metal fitting 18.

The second metal fitting 30 sandwiches the solid-state imaging device 16 between the second metal fitting 30 and the first metal fitting 18. The solid-state imaging device 16
It is adhesively fixed to the second metal fitting 30.

The first metal fitting 18 also has four legs 18 b projecting in the direction of the second metal fitting 30, and having a tip bent in parallel with the imaging surface of the image sensor 16. Second
The bracket 30 has four legs 30a extending in the horizontal direction corresponding to the bent surfaces of the tips of the legs 18b. The bent surface of the tip of the leg 18b is attached to the second metal fitting 3
The distance between the first metal fitting 18 and the second metal fitting 30 can be maintained at a constant distance by approaching or making contact with the zero leg 30a. A hole 18c is formed near the root of each leg 18b.

The lower end of each leg 30a is denoted by reference numeral 30b.
As shown by, the first metal fitting 18 is bent into a shelf shape so as to enter the lower side of the leg 18b. Even when the molten metal is inserted into the gap between the legs 18b and 30a, the molten metal can be prevented from flowing down by the flow-down prevention shelf 30b. A hole 30c is also formed near the base of the leg 30a.

After adjusting the relative position between the mount 10a and the imaging section of the solid-state imaging device 16, a molten metal 32 is formed between the leg 18b of the first metal fitting 18 and the leg 30a of the second metal fitting 30. (FIG. 2). The molten metal 32 is made of, for example, a low melting point cream solder.

At the time of joining with the molten metal, the four legs 18b and 30a are locally heated to melt the molten metal 32 and then cooled. As a result, the legs 18b, 30
a can be reliably fixed to each other.

In this embodiment, holes 18c, 30c are formed at the roots of legs 18b, 30a which require local heating for melting.
Are opened to prevent heat from being transmitted from the leg portions 18b and 30a to other portions to reduce the heating efficiency.
Similar functions and effects can be obtained by making the roots of the legs 18b, 30a thinner instead of the holes 18c, 30c.

The flow-down prevention shelf 30b prevents the metal melted when heated from flowing down due to gravity. That is, the provision of the runoff prevention shelf 30b makes it easier to hold the molten metal 32 in a portion surrounded by the legs 18b and 30a and the runoff prevention shelf 30b. If the runoff prevention shelf 30b does not exist, the force holding the molten metal 32 between the legs 18b and 30a is only the surface tension of the molten metal 32 when the molten metal 32 is melted. The interval cannot be expanded sufficiently. However, in the present embodiment, the gap between the legs 18b and 30a can be made wider than before by the presence of the runoff prevention shelf 30b, and a sufficient adjustment range can be secured.

[0026]

As can be easily understood from the above description, according to the present invention, the heating efficiency of the joint can be improved and the fixing time can be shortened. Further, a larger adjustable range can be secured.

[Brief description of the drawings]

FIG. 1 is an exploded perspective view of one embodiment of the present invention.

FIG. 2 is a perspective view of an assembled state of the embodiment.

[Explanation of symbols]

 10: Main body of mounting device 10a: Mount 10b: Mounting portion 12: Shutter unit 14: Screw 16: Solid-state image sensor 18: First metal fitting 18a: Opening 18b: Leg 18c: Hole 20: Screw 22: Low-pass filter holding Frame 24: Optical low-pass filter 26: Screw 28: Dust-proof rubber 30: Second metal fitting 30a: Leg 30b: Runoff prevention shelf 30c: Hole 32: Molten metal

Claims (5)

[Claims] 1. An image pickup device mounting device comprising: a first metal member fixed to an electronic imaging device; and a second metal member fixedly holding a solid-state image sensor between the first metal member. The first metal fitting and the second metal fitting have a plurality of legs facing each other at a predetermined distance in the direction of the optical axis, and each leg of the first metal fitting and the second metal fitting is An image pickup device mounting device comprising a heat conduction isolation structure at a root side. 2. The leg of one of the first and second fittings is inserted under the other leg of the first and second fittings, and is inserted between the facing legs. 2. The image pickup device mounting device according to claim 1, further comprising a shelf for preventing the molten metal from flowing down. 3. The image pickup device mounting apparatus according to claim 2, wherein the leg of the second metal fitting includes the shelf. 4. The image pickup device mounting device according to claim 1, wherein the heat conduction isolation structure is an opening provided at a root side of the leg. 5. The image pickup device mounting apparatus according to claim 1, wherein a root side of the leg is narrowed as the heat conduction isolation structure.