JP2000332497A - Mounting tool of component mounting apparatus - Google Patents

Abstract

PROBLEM TO BE SOLVED: To obtain a mounting tool capable of shortening the time required for the replacement of an adaptor by a method, wherein the adaptors are reduced in the number of kinds. SOLUTION: A mounting tool functions in a manner, where an adaptor 20 is brought into contact with the under surface of a base 12, adaptor suction grooves 14 and 15 are exhausted to enable the under surface of the base 12 to suck up and hold the adaptor 20, a part suction hole 21 provided to the adaptor 20 is evacuated via a communicating part 22 and the part suction hole 13 of the base 12 to enable the under surface of the adaptor 20 to suck up a part, where the adaptor 20 is provided with part suction holes 21 bored in its under surface at different positions, and at least one of the part suction holes 21 is connected to the part suction hole 13 which is bored in the under surface of the base 21 at a different position through the communicating part 22.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a mounting tool used in a component mounting apparatus for mounting electronic and electric components on a mounting board such as a printed board.

[0002]

2. Description of the Related Art Conventionally, when mounting electronic components on a mounting board such as a printed board, a component mounting apparatus has been used. Such a component mounting apparatus includes a support table on which a mounting board is supported, a component supply unit for sequentially supplying electronic components, and a mounting for transporting the electronic components from the component supply unit to a predetermined position of the mounting board on the support table. And a head. Here, the mounting head includes a so-called mounting tool that sucks and holds the electronic component from the component supply unit.

[0003] Such a mounting tool is configured, for example, as shown in FIG. In FIG. 12, a mounting tool 1 includes a tool shaft 2 to be mounted on a mounting head.
And a base portion 3 provided at a lower end of the tool shaft 2 and an adapter portion 4 fixed and held to the base portion 3.

The tool shaft 2 is hollow and fixedly held to a mounting head of a component mounting device (not shown). The tool shaft 2 is provided on the mounting head side through the hollow portion (not shown). It is connected to a vacuum source such as a vacuum pump provided.

The base portion 3 has a flat and substantially square shape in the drawing, and has an opening (not shown) in the center of the lower surface thereof, in which the hollow portion opens. In the periphery, an adapter suction groove (not shown) is provided.

The adapter part 4 has a flat and substantially square shape in the drawing, corresponding to the shape of the base part 3, and penetrates up and down in alignment with the hollow part of the base part 3. A through hole (not shown) is formed. Further, the adapter part 4 has a convex part 4 protruding from the lower surface at the center thereof.
a. As shown in FIG. 13, the protrusion 4a has a size corresponding to the shape of the electronic component to be mounted on the mounting board.

According to the mounting tool 1 having such a configuration,
When the base portion 3 relatively approaches or comes into contact with the adapter portion 4, the adapter portion 4 is suction-held on the lower surface of the base portion 3 by evacuation of the adapter suction groove. From this state, the mounting head of the component mounting apparatus is moved to the component supply unit, and the mounting tool 1 mounted on the mounting head is moved onto the electronic component to be mounted. When the convex portion 4a of the adapter portion 4 of the mounting tool 1 approaches or comes into contact with the electronic component, the through hole 4a is formed.
Comes into contact with the surface of the electronic component, and the electronic component is sucked and held by the mounting tool 1.

Next, after the mounting head is moved onto the mounting board and then moved downward, as shown in FIG. 12, the electronic component 5 sucked and held by the mounting tool 1 is
The electronic component 5 is positioned at a predetermined position on the mounting board 7 placed on the support table 6 of the component mounting apparatus, is placed, and, if necessary, is further lowered, so that the electronic component 5 is mounted on the mounting board 7. Pressed against.

By repeating the above operation, a plurality of electronic components are successively mounted on the mounting board 7 at predetermined positions.

According to the mounting tool 1 having such a configuration,
For example, as shown in FIG. 14, a protrusion 4a having a size corresponding to the size of various electronic components 5a, 5b, 5c to be mounted.
Plural types of adapter parts 4 provided with 1, 4a2, 4a3
By preparing A, 4B, and 4C, electronic components having various dimensions can be handled.

[0011]

By the way, in the mounting tool 1 described above, in order to actually reduce the number of types of the adapter part 4, electronic components are grouped in terms of dimensions, and one type of adapter is provided for each group. Part 4 is prepared. However, with the diversification of electronic components and the increasing density of component mounting, if the gap between adjacent electronic components on the mounting board becomes narrower, there will be a slight dimensional difference between the types of electronic components. However, a dedicated adapter unit 4 must be prepared for each, and the types of the adapter units 4 increase, and the cost of the adapter unit 4 increases. When mounting components, it is necessary to use the mounting tools 1 corresponding to the individual electronic components to be mounted, but the adapter unit 4 occupies a time required for the mounting process.
However, there is a problem that the tact time for mounting is increased and the production cost is increased due to an increase in the replacement time of the device. In addition, in the case of such a mounting tool 1, particularly when mounting a bare chip or the like, it is necessary to mount the mounting tool 1 while applying pressure from above. In this case, it is necessary to make the mounting tool 1 larger than the target chip component in order to uniformly press the target chip component from above. A mounting tool that has such a function and is compatible with a wide variety of chips is not known.

SUMMARY OF THE INVENTION In view of the above, it is an object of the present invention to provide a mounting tool in which the number of types of adapters is reduced to shorten the time required for replacing the adapters.

[0013]

According to the first aspect of the present invention, there is provided an adapter suction groove and a component suction hole which are horizontally supported by a mounting head of a component mounting apparatus and open on a lower surface thereof. A flat base portion provided with an adapter portion fixedly held on the lower surface of the base portion and having a component suction hole vertically penetrated on the upper surface so as to match the component suction hole of the base portion. The adapter portion comes into contact with the lower surface of the base portion, and the adapter suction groove is evacuated and evacuated to be sucked and held on the lower surface of the base portion. A mounting tool for sucking and holding a component on the lower surface of the adapter portion by being evacuated through the component suction holes of the portion and the base portion, wherein the adapter portion has a plurality of component suction holes opened on the lower surface thereof. The adapter portion is selectively connected by the communication portion at a position where a part of the plurality of component suction holes is different from a component suction hole opened on the lower surface of the base portion. This is achieved by a mounting tool of a component mounting apparatus having such a configuration.

According to the fifth aspect of the present invention, there is provided a flat mounting device which is horizontally supported by a mounting head of a component mounting apparatus and has an adapter suction groove and a component suction hole which are opened on the lower surface thereof. A base portion, and an adapter portion fixedly held on the lower surface of the base portion and having a component suction hole vertically penetrated so as to match the component suction hole of the base portion on the upper surface, The adapter portion comes into contact with the lower surface of the base portion, and the adapter suction groove is evacuated and evacuated to be sucked and held on the lower surface of the base portion. A mounting tool that sucks and holds components on the lower surface of the adapter by being evacuated through the holes. The component suction holes are arranged at positions off the center on the upper surface of the adapter. The adapter part is translated in the horizontal direction, so that one component suction hole of the adapter part is aligned with the component suction hole of the base part, and is suction-held at a position shifted from the base part. This is achieved by a mounting tool of a component mounting apparatus having such a configuration.

According to the first or second aspect of the present invention, since a plurality of component suction holes are provided in the adapter, the adapter is rotated with respect to the base (in the case of the first aspect) or translated. By moving (in the case of claim 2), one of the plurality of component suction holes is aligned with the component suction hole of the base portion. Thus, the electronic component or the like to be mounted on the lower surface of the adapter is sucked and held through the component suction hole of the adapter. At this time, the electronic component and the like are suction-held at an eccentric position on the lower surface of the adapter portion corresponding to the position of the component suction hole. Electronic components of a plurality of sizes corresponding to the component suction holes can be suction-held.

At this time, the adapter part sucks and holds an electronic component or the like at an eccentric position on the lower surface, so that the
Even when the distance between adjacent electronic components and the like already mounted on the mounting board is small, the electronic components and the like sucked and held in the component suction holes can be reliably inserted without interfering with the adjacent electronic components and the like. It can be implemented.

According to the second aspect of the present invention, the adapter portion is so arranged that the two sides adjacent to each other of the electronic component or the like are aligned with the two adjacent sides of the adapter portion by the component suction holes. When holding by suction, two sides that are adjacent to each other of the electronic component and the like are not aligned with each side of the rectangular convex portion of the adapter and the side of the electronic component as in the related art. By aligning the two parts with each other, the electronic components and the like are positioned with respect to the adapter part and with respect to the mounting board. Can be positioned.

According to the second aspect of the present invention, each of the component suction holes of the adapter section is opened at a position corresponding to the dimensions of a plurality of types of electronic components to be mounted on the lower surface of the adapter section. Since the component suction holes face the vicinity of the center of an electronic component or the like having a corresponding size, the electronic component or the like can be reliably sucked and held.

According to the third aspect of the present invention, the component suction holes are eccentrically disposed on the lower surface of the base portion, and the communication portions are rotationally symmetrical at equal angular intervals on the upper surface of the adapter portion. When the adapter is rotated around its center, one of the adapter suction holes of the adapter is aligned with the component suction hole of the base and is shifted from the base. In the case where the adapter is sucked and held at the rotated position, the adapter is fixedly held in a state where the adapter is rotated by a predetermined angle with respect to the base, so that at each rotational position,
The different component suction holes of the adapter unit are aligned with the component suction holes of the base unit, so that electronic components and the like can be suction-held.

[0020]

Preferred embodiments of the present invention will be described below in detail with reference to the accompanying drawings. The embodiment described below is a preferred specific example of the present invention, and thus various technically preferable limitations are added. However, the scope of the present invention particularly limits the present invention in the following description. The embodiment is not limited to these embodiments unless otherwise stated.

FIGS. 1 to 6 show a first embodiment of a mounting tool according to the present invention. In FIG. 1, a mounting tool 10 includes a tool shaft 11 to be mounted on a mounting head, and a base 12 provided at a lower end of the tool shaft 11.
And an adapter portion 2 fixed and held to the base portion 12
0.

The tool shaft 11 is formed in a hollow shape, and is fixed and held to a mounting head of a component mounting device (not shown). It is connected to a vacuum source 11a composed of a provided vacuum pump and the like.

The base portion 12 is, for example, a flat plate having a substantially square shape. As shown in FIGS. 3 and 4, the base portion 12 has a component suction hole 13 connected to the hollow portion. , Adapter suction holes 14 near each of the four corners
And the adapter suction groove 1 for connecting each adapter suction hole 14
5 is provided. As shown in FIG. 4, the component suction hole 13 is provided on the lower surface of the base 12 so as to have an opening 13 a at a position eccentric from the vicinity of the center.
Further, the adapter suction holes 14 are disposed at rotationally symmetric positions on the lower surface of the base portion 12 at angular intervals of 90 degrees.

The adapter section 20 has substantially the same shape as that of the base section 12, for example. The adapter section 20 has a flat and almost square shape in the case of the drawing, and as shown by an arrow in FIG.
2 and is fixedly held at 90-degree angular intervals. Further, as shown in FIG. 3, the adapter section 20 includes a plurality of component suction holes 21 penetrating vertically. A plurality of component suction grooves 22 are provided on the upper surface of the adapter section 20 as communication sections. Each component suction groove 22 is provided one for each component suction hole 21, one end 22 b side of each component suction groove 22 communicates with the component suction hole 21, and the other end 22 b is connected to the base portion. By contacting the lower end of the component suction groove 13 on the 12 side, it is connected to this.

Further, as shown in the top view of FIG. 5, in the case of the present embodiment, the plurality of component suction holes 21 of the adapter section 20 are component suction holes 21-1, 21-2, 21-3, 2-3.
Four are provided as 1-4. In this case, the component suction holes 21-1, 21-2, 21-3, and 21-4 are positioned at different distances from the closest four corners of the adapter 20 or the outer edge of the adapter 20. The electronic component is set at a position corresponding to the size of electronic components having different sizes as described later. Also, each component suction hole 21-1, 21-
The other end 22b of each component suction groove 22 as a communication part connected to 2, 21-3, 21-4 is located at a rotationally symmetric position at an angular interval of 90 degrees with respect to the center O shown in FIG. By being provided, they are provided so as to be aligned with the component suction holes 13 of the base portion 12 respectively.

As a result, as shown in FIG. 6, each of the component suction holes 21 sucks the electronic component 30 having a predetermined size range by aligning with the adjacent two sides or four sides at the four corners on the lower surface of the adapter section 20. When the electronic component 30 is held, the electronic component 30 is disposed so as to face and open in the vicinity of the center of the electronic component 30. On the upper surface of the adapter section 20, as shown in FIG. Are provided with suction grooves 22 extending to positions corresponding to the openings 13a of the component suction holes 13 of the base portion 12, respectively. Note that one of the component suction holes 21 is opened at the center of the lower surface of the adapter portion 20 so that the electronic component 30 having a size corresponding to the entire lower surface of the adapter portion 20 is sucked and held.

The mounting tool 10 according to the present embodiment is configured as described above, and a case where the adapter section 20 is first fixedly held to the base section 12 in the state shown in FIGS. 4 to 6 will be described. . In this case, the adapter unit 20
The upper surface thereof is brought into contact with the lower surface of the base portion 12 so that the adapter suction holes 14 and the adapter suction grooves 15 of the base portion 12 are evacuated by the vacuum source 11a of FIG. Will be sucked and held on the lower surface.

Here, the adapter part 20 has a component suction groove 22 communicating with the component suction hole 21-1 shown in FIG.
3 will be matched. Thereby, the adapter section 20
The component suction groove 22 a and the component suction hole 21-1 are evacuated through the component suction hole 13 of the base 13, and the electronic component 30 a shown in FIG. Will be retained. In this case, the component suction holes 21-
1 is open at the lower surface of the adapter part 20 so as to face the vicinity of the center of the electronic component 30a.
The two sides thereof are aligned with the two sides on the lower surface of the adapter section 20 and are stably sucked and held.

As described above, the adapter portion 20 is rotated by 90 degrees with respect to the center 0 in FIG. 5 by 90 degrees with respect to the base portion 12 to communicate with each component suction hole 21 of the adapter portion 20 at each rotational position. Other end 22 of the component suction groove 22
b always matches the component suction holes 13 of the base portion 12, and the electronic component 30 has two sides or four sides corresponding to each of the component suction holes 21 of the adapter portion 20. Or, with the adapter part 2 aligned with the four sides
0 is held by suction.

Therefore, when the base portion 12 relatively approaches or comes into contact with the adapter portion 20, the adapter portion 20 is moved to each rotational position by evacuating the adapter suction hole 14 and the adapter suction groove 15 of the base portion 12. And is sucked and held on the lower surface of the base portion 12. From this state, the mounting head of the component mounting device (not shown) is moved to the component supply unit, and the mounting tool 10 mounted on the mounting head is moved.
Is moved onto the electronic component 30 to be mounted. And
When the adapter section 20 of the mounting tool 10 approaches or comes into contact with the electronic component 30, one or more component suction holes 21 abut on the surface of the electronic component 30, and the electronic component 30 is sucked by the mounting tool 10. Will be retained.

Next, after the mounting head is moved onto the mounting board 32 and then downward, as shown in FIG. 1, the electronic head held by suction on the lower surface of the adapter section 20 of the mounting tool 10 is held. The electronic component 30 is mounted by positioning the component 30 at a predetermined position on the mounting board 32 mounted on the support table 31 of the component mounting apparatus, and further lowering the mounting head if necessary. Substrate 32
Is pressed against.

By repeating the above operation, a plurality of electronic components 30 are successively mounted on the mounting substrate 32 at predetermined positions. At this time, by changing the rotational position, the adapter unit 20 can suck and hold electronic components having three dimensions shown by the chain line in FIG. 6 or electronic components having dimensions corresponding to the entire lower surface of the adapter unit 20. Since the electronic parts 30 having a plurality of dimensions can be continuously mounted, the number of types of the adapter unit 20 required is small. Therefore, the cost of the adapter unit 20 itself is reduced, and
The time for replacing the adapter unit 20 is reduced, and the cost for mounting is greatly reduced. Further, since the adapter 20 is formed larger than the target electronic component 30, a uniform pressing force can be applied from above during the mounting operation.

7 to 11 show a second embodiment of the mounting tool according to the present invention. 7 to 11, a mounting tool 40 includes a tool shaft 41 to be mounted on a mounting head and a base 42 provided at a lower end of the tool shaft 41, similarly to the mounting tool 10 illustrated in FIGS. And an adapter unit 50 fixedly held to the base unit 42.

The tool shaft 41 is formed in a hollow shape, and is fixed and held to a mounting head of a component mounting device (not shown). It is connected to a vacuum source 41a composed of a provided vacuum pump and the like.

The base portion 42 has a plate-like flat and substantially square shape. As shown in FIGS.
A component suction hole 43 connected to the hollow portion is provided. Four adapter suction holes 44 are provided around the component suction hole 43, and an adapter suction groove 45 for connecting the adapter suction holes 44 is provided. As shown in FIG. 9, the component suction hole 43 has an opening 4 in the center on the lower surface of the base 42.
3a. Further, the adapter suction hole 44 and the adapter suction groove 45 can suck and hold the upper surface of the adapter portion 50 at any eccentric position when the adapter portion 50 is translated with respect to the base portion 42 as described later. In addition, it is arranged.

The adapter section 50 has a flat, substantially square shape in the drawing, corresponding to the shape of the base section 42. As shown by an arrow in FIG.
10 and 11, the component suction holes of the base portion 42 are provided at eccentric positions in a predetermined direction and a predetermined distance from the center, respectively, as shown in FIGS. A plurality (four in the illustrated case) of component suction holes 51 penetrating vertically so as to be aligned with 43.
Are formed. As shown in FIG. 11, each of the component suction holes 51 is formed on the lower surface of the adapter section 20 so that the electronic component 30 having a predetermined size range is aligned with two or four sides adjacent to each other at four corners.
When the electronic component 30 is sucked and held, the electronic component 30 is provided so as to face and open near the center thereof. Note that one of the component suction holes 21 is opened at the center of the lower surface of the adapter portion 20 so that the electronic component 30 having a size corresponding to the entire lower surface of the adapter portion 20 is sucked and held.

A description will be given of a case where the adapter 50 is fixedly held in the state shown in FIG. In this case, the adapter part 50 is evacuated by the vacuum source 41a by the upper surface being in contact with the lower surface of the base part 42, so that the adapter suction holes 44 and the adapter suction grooves 45 of the base part 42 are evacuated by the vacuum source 41a. The lower surface of the base portion 42 is sucked and held.

Here, the adapter part 50 has a component suction hole 51a shown in FIG.
It will be aligned with the component suction hole 43 of the base part 42.
As a result, the component suction holes 51a of the adapter section 50 are evacuated through the component suction holes 43 of the base section 43, and the electronic component 30a shown in FIG. Is done. In this case, since the component suction hole 51a is opened on the lower surface of the adapter part 50 so as to face near the center of the electronic component 30a, the electronic component 5
Oa has its two sides aligned with the two sides on the lower surface of the adapter section 50 and is stably held by suction.

As described above, the adapter portion 50 is translated in the predetermined direction with respect to the base portion 42 by a predetermined distance, so that each component suction hole 51 of the adapter portion 50 is moved at each eccentric position. 42, the two or four sides of the electronic component 30 are aligned with the two or four corners of the four corners of the adapter part 50, corresponding to each of the component suction holes 51 of the adapter part 50. Thus, the lower surface of the adapter section 20 is sucked and held.

Accordingly, the base portion 42 relatively approaches or comes into contact with the adapter portion 50, and the adapter portion 50 is evacuated from the adapter suction hole 44 and the adapter suction groove 45 of the base portion 42 at each eccentric position. The mounting head of the component mounting device (not shown) is moved to the component supply unit, and the mounting tool 40 mounted on the mounting head is similarly moved.
Is moved onto the electronic component 30 to be mounted, and the adapter part 50 of the mounting tool 40 approaches or comes into contact with the electronic component 30, so that the component suction hole 51 is moved to the electronic component 3.
0, and the electronic component 30 is attached to the mounting tool 4.
0, the electronic component 30 is positioned at a predetermined position on the mounting substrate 32, placed thereon, and if necessary, the mounting head is lowered, so that the electronic component 30 is mounted on the mounting substrate 3.
2 is pressed.

By repeating the above-described operation, a plurality of electronic components 30 are successively mounted at predetermined positions on the mounting board 32. At this time, by changing the eccentric position, the adapter unit 50 can suck and hold electronic components having three dimensions shown by the chain line in FIG. 11 or electronic components having dimensions corresponding to the entire lower surface of the adapter unit 50. So that you can
In the case where electronic components 30 having a plurality of types of dimensions are successively mounted, the number of types of the necessary adapter unit 50 is reduced. Accordingly, the cost of the adapter unit 50 itself is reduced, and
The time for replacing the adapter unit 50 is reduced, and the cost for mounting is greatly reduced. Further, in this case, since the electronic component 30 is held by suction on the center line of the base portion 12, when the electronic component 30 is pressed against the mounting board 32, it is possible to apply high pressure. When the electronic component 30 is further heated in a pressurized state, the electronic component 30 is covered on an electronic component or the like adjacent to the adapter unit 50. Therefore, the influence of heat on the adjacent electronic component or the like is considered. There is a need.

As described above, according to the mounting tools 10 and 40 of the above-described embodiment, a plurality of types of electronic components can be handled by the single adapter unit 20 and 50. 50 types can be greatly reduced, and the manufacturing cost of the adapter units 20 and 50 and the time required for replacement of the adapter units 20 and 50 during mounting can be reduced. Furthermore, the adapter part 2
Since the number of types 0, 50 is small, the capacity of the replacement unit of the adapter unit 20, 50 in the component mounting apparatus, that is, the number of mounting the adapter unit, is also small, and the entire component mounting apparatus is configured at a small size and at low cost. Will be.

In the above embodiment, the adapter 20
Is rotated with respect to the base 12 and the adapter 50
Is adapted to be translated with respect to the base portion 42. However, the present invention is not limited thereto, and it is apparent that the adapter portion may be rotated and translated with respect to the base portion. Further, in the above-described embodiment, the lower surfaces of the adapter portions 20 and 50 suck and hold the electronic components 30 of various dimensions and mount the electronic components 30 on the mounting board 32 at predetermined positions. Instead, it is also possible to hold other components by suction and mount them at predetermined positions on the mounting board 32.

[0044]

As described above, according to the present invention, the number of types of adapters is reduced, so that the time required for replacing the adapters is reduced. Is provided.

[Brief description of the drawings]

FIG. 1 is a schematic side view showing a use state of a mounting tool according to the present invention.

FIG. 2 is an enlarged sectional view showing the configuration of the first embodiment of the mounting tool according to the present invention.

FIG. 3 is a schematic side view showing a use state of the mounting tool of FIG. 2;

FIG. 4 is a bottom view showing a lower surface of a base portion in the mounting tool of FIG. 2;

FIG. 5 is a bottom view showing an upper surface of an adapter part in the mounting tool of FIG. 2;

FIG. 6 is a bottom view showing a lower surface of an adapter unit in the mounting tool of FIG. 2;

FIG. 7 is an enlarged sectional view showing the configuration of a second embodiment of the mounting tool according to the present invention.

FIG. 8 is a schematic side view showing a use state of the mounting tool of FIG. 7;

FIG. 9 is a bottom view showing the lower surface of the base part in the mounting tool of FIG. 7;

FIG. 10 is a bottom view showing an upper surface of an adapter unit in the mounting tool of FIG. 7;

FIG. 11 is a bottom view showing the lower surface of the adapter part in the mounting tool of FIG. 7;

FIG. 12 is a schematic side view showing a usage state of a conventional mounting tool.

13 is a schematic side view showing a relationship between a protrusion of an adapter part and an electronic component to be mounted in the mounting tool of FIG. 12;

FIG. 14 is a schematic side view showing an adapter part having a convex part corresponding to various electronic components in the mounting tool of FIG. 12;

[Explanation of symbols]

10, 40 mounting tool, 11, 41 tool shaft, 12, 42 base part, 13, 43 component suction hole, 14, 44 adapter suction hole, 15, 45
... Adapter suction groove, 20, 50 ... Adapter part,
Reference numerals 21, 51: component suction holes, 22: component suction grooves.

Claims (6)

[Claims] 1. A flat base portion which is horizontally supported by a mounting head of a component mounting device and has an adapter suction groove and a component suction hole opened on a lower surface thereof, and is fixed and held on a lower surface of the base portion. And an adapter portion having a component suction hole vertically penetrated so as to match the component suction hole of the base portion on the upper surface thereof, wherein the adapter portion contacts the lower surface of the base portion. When the adapter suction groove is evacuated, the suction hole is held on the lower surface of the base portion, and the component suction hole of the adapter portion is evacuated through the communication portion and the component suction hole of the base portion. A mounting tool for sucking and holding components on a lower surface of the adapter portion, wherein the adapter portion has a plurality of component suction holes opened on a lower surface thereof, and the adapter portion has a plurality of component suction holes. A component mounting device, wherein a part of the component suction holes is selectively connected to the component suction hole at a position different from the component suction hole opened on the lower surface of the base portion. tool. 2. The adapter according to claim 1, wherein two or four adjacent sides of an electronic component or the like are aligned with two or four adjacent sides of the adapter by the component suction holes.
The mounting tool according to claim 1, wherein the mounting tool sucks and holds an electronic component or the like. 3. The device according to claim 1, wherein each of the component suction holes of the adapter section is opened at a position corresponding to a dimension of a plurality of types of electronic components to be mounted on the lower surface of the adapter section. The mounting tool described in. 4. A component suction hole is eccentrically arranged on the lower surface of the base portion, and the communication portions are arranged at rotationally symmetric equiangular intervals on the upper surface of the adapter portion. When the adapter section is rotated about its center, one component suction hole of the adapter section is connected to the component suction hole of the base section by the communication portion, and the adapter section is displaced with respect to the base section. The mounting tool according to claim 1, wherein the mounting tool is configured to be suction-held. 5. A flat base portion which is horizontally supported by a mounting head of a component mounting device and has an adapter suction groove and a component suction hole opened on a lower surface thereof, and is fixedly held on a lower surface of the base portion. And an adapter portion having a component suction hole vertically penetrated so as to match the component suction hole of the base portion on the upper surface thereof, wherein the adapter portion contacts the lower surface of the base portion. When the adapter suction groove is evacuated to vacuum, the suction is held on the lower surface of the base portion, and the component suction hole of the adapter portion is evacuated via the component suction hole of the base portion, so that the adapter portion is evacuated. A mounting tool for sucking and holding components on the lower surface of the adapter, wherein the component suction holes are arranged at positions offset from the center on the upper surface of the adapter portion, and the adapter portions are arranged side by side in the horizontal direction. By being moved,
A mounting tool for a component mounting apparatus, wherein one component suction hole of an adapter portion is aligned with a component suction hole of a base portion and is suction-held at a position shifted from the base portion. 6. A component suction hole is eccentrically disposed on the lower surface of the base portion, and the component suction holes are displaced from rotationally symmetric equiangular intervals on the upper surface of the adapter portion. The adapter part is rotated around its center and translated in the horizontal direction, so that one component suction hole of the adapter part is aligned with the component suction hole of the base part. The mounting tool according to claim 5, wherein the mounting tool is configured to be suction-held at a position shifted from the base portion.