JP2000331861A - Electronic component - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an electronic component which is surface-mounted on a printed board, etc., with the opening part of a resin case sealed with an insulating plate. SOLUTION: A component element 15 comprising a lead wire 16, a case 17 in which the element is housed, and a rectangular insulating plate 1 of a size larger than the case which is provided at the opening part of the case and comprises a hole 2 or a groove 11 where the lead wire 16 is inserted, are provided. Here, a through window 3 is provided almost central part of the insulating plate, through which a resin 18 is injected, and an external connection terminal is insert-molded on the insulating plate as one body, for connection to the lead wire.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic component, and more particularly, to a leadless electronic component surface-mounted on a printed circuit board or the like.
Hereinafter, the dry metallized film capacitor will be described in detail. However, the present invention is not limited to the dry metallized film capacitor, and can be applied to other electronic components in the same manner.

[0002]

2. Description of the Related Art Conventionally, an electronic component of this kind, for example, a metallized film capacitor is configured as shown in FIG. That is, a pair of metallized films are overlapped and wound, and a lead wire 16 is joined by welding or soldering to a component element 15 formed by spraying metallicon metal on both end surfaces to form an electrode lead portion. It is housed in a resin case 17, and is formed by injecting and filling a resin 18 made of a thermosetting resin or the like into the resin case, followed by curing.

[0003]

When the above lead-type metallized film capacitor is mounted on a printed circuit board, a lead wire is passed through a through hole provided in the printed circuit board and soldering is performed. However, as electronic parts are automatically inserted into printed circuit boards and efficiency has increased,
There is a strong demand from users for surface mount type metallized film capacitors.

However, in the above-described lead-wire type metallized film capacitor, since the lead wire is drawn out in the vertical direction, the lead wire is folded at 90 degrees near the opening of the resin case for surface mounting. It is necessary to bend, and cracks occur in the resin near the above-mentioned bending, and when used for a long time,
There is a problem of absorbing moisture from cracks and deteriorating capacitor characteristics. Also, since a lead wire with a circular cross section is used, if it is installed on a printed circuit board and soldered, the soldering strength varies and the quality becomes unstable There was such a problem.

[0005]

SUMMARY OF THE INVENTION The present invention has been made to solve the above-mentioned problems, and has as its object to provide a leadless electronic component which can be mounted on a substrate without deterioration in characteristics.

That is, the component element 1 having the lead 16
5, a case 17 for accommodating the element, and a rectangular insulating plate 1 having a hole 2 or a groove 11 provided in an opening of the case and through which a lead 16 is inserted, and having a size larger than that of the case.
A through window 3 is provided at a substantially central portion of the insulating plate, and a resin 18 is injected from the window. The external connection terminal 12 is integrated with the insulating plate 1 by insert molding, and a lead wire is provided. 16 is connected.

[0007] Further, the present invention is characterized in that the through window 3 of the insulating plate 1 is expanded in a funnel shape or a step shape 4 toward the outer surface 7.

Further, the insulating plate 1 is provided with a groove portion 8 which fits into the opening of the resin case 17.

Further, a positioning projection 9 is formed on the outer surface 7 of the insulating plate 1.

[0010]

DESCRIPTION OF THE PREFERRED EMBODIMENTS A component element having a lead wire is housed in a resin case and has a hole or a groove through which the lead wire is inserted.
The opening of the case is sealed with a rectangular insulating plate having a size larger than the case, the lead wire is drawn out to the surface of the rectangular insulating plate, and a resin is injected from a through window provided at a substantially central portion of the insulating plate. Is done. Further, the insulating plate is previously
The external connection terminal is provided by insert molding, and the terminal and the lead wire are connected.

With the above arrangement, when the electronic component is mounted on the printed circuit board, the leading end of the lead wire is connected to the external connection terminal provided on the rectangular insulating plate, and the bent portion of the lead wire is eliminated. There is no projection on the surface of the board that comes into contact with the printed circuit board, and there is no tilt or rattling of the electronic components, stable board mounting is possible, and mounting work can be performed easily and quickly. Characteristics are also stabilized.

[0012]

[Embodiment 1] FIG. 1 is a drawing of a dry metallized film capacitor according to an embodiment of the present invention, wherein (a) is a plan view, (b) is a front sectional view, and (c) is a perspective view. FIG. 2 is a drawing of a rectangular insulating plate provided with an L-shaped external connection terminal according to one embodiment of the present invention, where (a) is a plan view, (b) is a front sectional view, and (c) is a bottom view. FIG.

An embodiment of the present invention will be described below with reference to the drawings. In the drawing, the same parts as those in FIG. 6 are denoted by the same reference numerals. The rectangular insulating plate 1 provided with the L-shaped external connection terminals shown in FIG.
Larger dimensions, polybutylene terephthalate resin,
It is made of a material having excellent electrical insulation and mechanical strength, such as polyphenylene sulfide resin, polyester resin, and polycarbonate resin. A through window 3 is provided at a substantially central portion of the material, and an external connection terminal is provided on an outer surface 7 of the rectangular insulating plate 1. 12 has a stepped recess 5 extending through the through-hole 3 so that the outer surfaces of the recesses 12 are substantially the same and extending to the edge, and a hole 10 for leading a lead 16 in the recess. The terminal 12 is made of an electrically and mechanically excellent material such as brass and copper, and is subjected to electric solder plating, tin plating, and the like. One end of the terminal 12 is bent into an L-shaped bent portion 14 and is squarely insulated. A step that fits into the stepped recess 5 when disposed on the plate 1, and has a lead wire 1 at the other end.
6 has an extrusion hole 13 for leading out. The through-hole 2 is formed by matching the hole 10 of the insulating plate itself with the extrusion hole 13 of the external connection terminal, and the bent portion 1 of the external connection terminal 12 is formed.
4 are disposed so as to contact the side edges of the rectangular insulating plate 1 and are integrated by insert molding. At this time, the square insulating plate 1
A protrusion may be provided on a side edge or a part of a corner of the external connection terminal 12 in order to increase the holding force on the external connection terminal 12.

Next, a method of manufacturing a dry metallized film capacitor by closing the opening of the resin case 17 with the rectangular insulating plate 1 provided with the L-shaped external connection terminals will be described. As shown in FIG. 1, a pair of metallized films are superposed and wound, and a metallicon metal such as zinc or solder is sprayed on both end surfaces to form an electrode lead portion, and a solder-plated soft CP wire is formed on the electrode lead portion. A component element 15 is formed by joining a lead 16 made of a solder-plated soft copper wire or the like by welding or soldering, and the element is placed in a resin case 17 made of a polybutylene terephthalate resin, a polyphenylene sulfide resin, a polyester resin, a polycarbonate resin, or the like. To be stored. Then, the L-shaped external connection terminal 12
The lead wire 16 of the component element housed in the resin case is passed through the through-hole 2 of the rectangular insulating plate 1 provided therein, and is led out from the surface. The opening of the resin case 17 is shielded by the insulating plate. A resin 18 made of a thermosetting resin such as urethane resin or epoxy resin is injected from a through window 3 provided in the insulating plate 1, filled and cured, and then the external connection terminal 12 and the lead 16 are welded by laser welding or the like. Joining and cutting the above-mentioned lead wire to obtain a dry metallized film capacitor.

According to the above configuration, after injecting and filling the resin,
Due to the curing, the resin case and the rectangular insulating plate provided with the L-shaped external connection terminals are tightly fixed and integrated by the capillary action of the resin, and thus have vibration resistance. In addition, a lead wire is led out from a through hole of a rectangular insulating plate provided with an L-shaped external connection terminal, and the lead wire and the external connection terminal are joined, but the rectangular insulating plate and the resin case are integrally fixed. By fixing the square insulating plate, the joining part is stabilized, and the joining work with stable quality can be performed.Furthermore, the lead wire is cut after joining with the external connection terminal. The external connection terminal is provided with a step that fits the stepped concave part of the board, so the lead wire does not protrude from the outer surface of the square insulating plate, and the external connection terminal and the printed circuit board can be easily soldered. To stabilize the quality.

Embodiment 2 FIGS. 3A and 3B are drawings of a dry metallized film capacitor according to another embodiment of the present invention, wherein FIG. 3A is a plan view, FIG. 3B is a front sectional view, and FIG. 4 is a drawing of a rectangular insulating plate provided with L-shaped external connection terminals according to another embodiment of the present invention, wherein FIG. 4A is a plan view, FIG. 4B is a front sectional view, and FIG. It is a figure, and what attached the same number in the figure is the same part, and the explanation is omitted.
The difference from the previous embodiment is the structure of the rectangular insulating plate itself. The rectangular insulating plate 1 shown in FIG. 4 is provided with a hole 10, a stepped concave portion 5, and a through window 3 as in the first embodiment. And
The through-window 3 provided at the approximate center is expanded in a stepwise manner 4, and a groove 8 is formed to fit into the opening of the resin case 17, and the external connection terminal 12 is bent into an L-shape. A protrusion 6 is provided on the side edge so as to make contact with 14, and a projection 9 for positioning that fits into an insertion hole provided in the printed circuit board is formed on the outer surface 7 that contacts the printed circuit board. .

According to the above construction, since the through window of the rectangular insulating plate is expanded stepwise, the resin is injected and filled, and then adheres to the outer surface of the rectangular insulating plate which contacts the printed circuit board or the like by curing. Since there is no outflow and the outer surface in contact with the printed circuit board or the like is smooth, stable board mounting can be performed, soldering with the printed circuit board or the like is easy, and quality can be stabilized. In addition, by providing the rectangular insulating plate with a groove portion to be fitted in the opening of the resin case, the rectangular insulating plate and the resin case are tightly fixed with the resin and integrated, so that it has vibration resistance,
Further, even if the resin flows out from the end face of the opening of the resin case, the resin can be received by the groove of the rectangular insulating plate and the appearance can be kept clean. The stable mounting of the board can be achieved by fitting the projections provided on the outer surface of the rectangular insulating plate with the insertion holes provided on the printed circuit board and the like. Can be stabilized.
In addition, since the protruding portion is provided on the side edge of the rectangular insulating plate and the bent portion of the L-shaped external connection terminal is provided so as to abut the protruding portion, the state of soldering to a printed circuit board or the like can be reduced. It can be visually inspected.

In the above embodiment, the component elements formed by joining the lead wires are housed in a resin case, the lead wires are led out from the through holes of the rectangular insulating plate, and the L-shaped components are provided on the rectangular insulating plate. Although the embodiment connected to the external connection terminal is shown, as shown in FIG. 5, a groove 11 is provided in the through hole 2 of the rectangular insulating plate from the edge, and the lead wire 16 is inserted and connected to the external connection terminal. You may. In addition, the resin is injected from the through window and cured after filling, but the through window may be expanded in a funnel shape.Furthermore, after the injection and filling, other than the through window to the square insulating plate as an air vent at the time of curing. May be provided with an air vent hole.

[0019]

As described above, according to the electronic component of the present invention, the resin case and the rectangular insulating plate provided with the L-shaped external connection terminals are tightly fixed and integrated by the capillary action of the resin. Has the property. Further, by providing the insulating plate with a groove in which the opening of the resin case is fitted, the rectangular insulating plate and the resin case are tightly fixed with the resin. Further, a lead wire is led out from a through hole of a rectangular insulating plate provided with an L-shaped external connection terminal, and the lead wire and the external connection terminal are joined.
Since the square insulating plate and the resin case are integrally fixed, the joining part is stabilized by fixing the square insulating plate,
It is possible to perform stable bonding work of quality and cut the lead wire after joining with the external connection terminal, but since the external connection terminal has a step that fits the stepped recess of the square insulating plate, The lead wires do not protrude from the outer surface of the rectangular insulating plate, the external connection terminals and the printed circuit board can be easily soldered, and the quality is stabilized. Then, the through-holes of the rectangular insulating plate are expanded in a funnel shape or a step shape, so that the resin does not adhere to or flow out of the outer surface of the rectangular insulating plate that contacts the printed circuit board, etc., and the outer surface that contacts the printed circuit board, etc. Is smooth, so that stable board mounting can be performed, soldering to a printed board or the like is easy, and quality can be stabilized. In addition, by providing a groove in the rectangular insulating plate that fits into the opening of the resin case, even if the resin flows out from the end face of the opening of the resin case, the resin is received by the groove of the rectangular insulating plate, and the appearance is beautiful. Can be kept. further,
Stable board mounting is possible by fitting the convex part provided on the outer surface of the square insulating plate with the insertion hole provided on the printed circuit board, etc. In addition, the mounting position accuracy can be secured, and the quality is stabilized by stable soldering Can be achieved. A projection is provided on the side edge of the rectangular insulating plate, and the bent portion of the L-shaped external connection terminal is provided so as to abut the projection, so that the state of soldering to a printed board or the like can be reduced. It can be visually inspected and is of great value industrially and practically.

[Brief description of the drawings]

FIG. 1 is a drawing of a dry metallized film capacitor according to one embodiment of the present invention, wherein (a) is a plan view, (b) is a front sectional view, and (c) is a perspective view.

2A and 2B are drawings of a rectangular insulating plate provided with L-shaped external connection terminals according to an embodiment of the present invention, wherein FIG. 2A is a plan view, FIG. 2B is a front sectional view, and FIG. Is a bottom view.

3 is another drawing of the dry metallized film capacitor according to one embodiment of the present invention, (a) is a plan view, (b)
Is a front sectional view, and (c) is a perspective view.

FIGS. 4A and 4B are drawings of a rectangular insulating plate provided with an L-shaped external connection terminal according to another embodiment of the present invention, wherein FIG. 4A is a plan view, FIG. c) is a bottom view.

5A and 5B are drawings of a rectangular insulating plate provided with L-shaped external connection terminals according to another embodiment of the present invention, wherein FIG. 5A is a plan view, FIG. c) is a bottom view.

FIG. 6 is a partial sectional view of a conventional metallized film capacitor.

[Explanation of symbols]

 REFERENCE SIGNS LIST 1 square insulating plate 2 through hole 3 through window 4 stepped 5 stepped recess 6 protrusion 7 outer surface 8 groove 9 protrusion 10 hole 11 groove 12 external connection terminal 13 extrusion hole 14 bent portion 15 component element 16 lead wire 17 Resin case 18 Resin

Claims (4)

[Claims] 1. A component element having a lead wire, a case for accommodating the element, and a hole or a groove provided in an opening of the case and through which the lead wire passes, and having a size larger than the case. It consists of a rectangular insulating plate, a through-window is provided at a substantially central portion of the insulating plate, a resin is injected from the window, an external connection terminal is integrated with the insulating plate by insert molding, and a lead wire is provided. An electronic component characterized by being connected. 2. The electronic component according to claim 1, wherein the through window of the insulating plate is expanded in a funnel shape or a step shape toward an outer surface. 3. The electronic component according to claim 1, wherein the insulating plate is provided with a groove that fits into the opening of the resin case. 4. The electronic component according to claim 1, wherein a projection for positioning is formed on an outer surface of said insulating plate.