JP2000331766A - Ic socket - Google Patents

Abstract

PROBLEM TO BE SOLVED: To reduce the length of a contact pin by constituting each of a plurality of contact pins from a prescribed inclined part, and providing a first pitch extension part extended in a first direction and a second pitch extension part extended in a second direction. SOLUTION: A plurality of contact pins is formed of an inclined part represented by sinθ=D/P, where D is the distance between the contact pins in first and second pitch extension parts, P is the pitch of a connecting terminal, and θ is the inclination of the inclination part based on the first and second directions of the contact pins. The contact pins are arranged a single plane and formed of a plurality of lead frames having a first pitch extension part formed thereon, and each lead frame is in matching with the pitch of the connecting terminal of an external connector to be connected, by extending the other end side of a plurality of leads to the electrode pitch of a semiconductor element to which one end sides of the leads are installed by a second pitch extension part.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an IC socket for inspecting electrical characteristics of a semiconductor device such as an IC package, and more particularly to an IC socket in which contact pins need to be arranged in a matrix at a narrow pitch.

[0002]

2. Description of the Related Art As the density of semiconductor elements has increased, a ball grid array (B) has been used as a semiconductor element in which solder balls for connection are arranged in an array or matrix as electrodes.
GA: Ball Grid Array, Pin Grid Array (PGA:
Pin Grid Array (LGA) or Land Grid Array without solder balls (LGA: Land Grid Array)
Demand for IC packages is rapidly increasing. These IC packages have a pitch between electrodes of 1.0 mm → 0.8 mm → 0.5 mm → 0.5 mm as the density of semiconductor elements increases.
It tends to be as small as 4 mm.

In general, a semiconductor device is subjected to a burn-in test after manufacturing. In the burn-in test, one end is connected to an electrode of the semiconductor device (IC package), and the other end is connected to a connection terminal of an external tester.
Is mounted and heated under predetermined conditions to test the electrical characteristics. At this time, the IC socket and the semiconductor element (I
Electrical connection with the C package is made by mechanical contact between a plurality of contact pins arranged in a matrix on the IC socket side and corresponding electrodes on the semiconductor element (IC package) side.

[0004]

In the IC socket, one end of each contact pin properly contacts the corresponding electrode of the semiconductor element (IC package) and the other end of the contact pin of the external tester. Need to be done. However, as described above, the difference between the pitch at one end and the pitch at the other end of the plurality of contact pins of the IC socket increases due to the narrowing of the pitch between the electrodes accompanying the increase in the density of the semiconductor element.

Therefore, it is necessary to change the pitch of the plurality of contact pins arranged in a matrix so that the pitch of the other end is larger than the pitch of the other end, and the contact pins are bent at 90 degrees. An IC socket provided with a contact pin has been proposed (for example, see Japanese Patent Application No. 10-12901). However, from the viewpoint of miniaturization, it is required that the height of the IC socket, that is, the length of the contact pin when incorporated into the IC socket be reduced as much as possible.

SUMMARY OF THE INVENTION The present invention has been made in view of the above problems, and an object of the present invention is to provide an IC socket in which the length of a contact pin when assembled can be reduced as much as possible and the height can be further reduced. And

[0007]

According to the present invention, in order to achieve the above-mentioned object, one end has an electrode pitch of the semiconductor element to be mounted, and the other end has an electrode pitch in the first and second directions. An IC socket which has a plurality of contact pins arranged in a matrix in accordance with a pitch of connection terminals of an external connection body to be connected, which is enlarged so as to be larger, and which is inserted into a case. The plurality of contact pins each include an inclined portion defined by sinθ = D / P, and a first pitch enlarging portion for enlarging the pitch of the other end in the first direction and the second pitch.
And a second pitch enlarging portion for enlarging in the direction of.

Here, D is the distance between the plurality of contact pins in the first and second pitch enlarging portions, P is the pitch of the connection terminals, and θ is the first and second directions of the plurality of contact pins. Is the angle of inclination of the inclined portion with respect to. Preferably, the plurality of contact pins are arranged in a single plane, and are formed of a plurality of lead frames having a plurality of leads on which the first pitch enlargement portion is formed. The other end of the plurality of leads is enlarged by the second pitch enlarging portion so that one end of the lead is connected to the electrode pitch of the semiconductor element to be mounted. And a plurality of the contact pins are laminated to form the plurality of contact pins.

Preferably, in each of the lead frames, a spring portion formed in an arc shape is formed at one end of the plurality of leads, and the plurality of leads are formed of an electrically insulating synthetic resin in the vicinity of the spring portion. And a first fixing portion fixed in the arrangement direction is provided. More preferably,
Each of the lead frames is provided with a second fixing portion in which the other ends of the plurality of leads are fixed in an arrangement direction with an electrically insulating synthetic resin.

[0010] Preferably, the plurality of contact pins include a perforated plate for positioning each contact pin on one end side where the semiconductor element is mounted. In addition, the first fixed portion or the second fixed portion, the pitch of both ends of the lead when the plurality of lead frames are stacked, the electrode pitch of the semiconductor element and the pitch of the electrical connection terminal of the external connection body, Hold each.

[0011]

When the first and second pitch enlarging portions formed of the inclined portions are provided, the IC socket is provided with the same number of contact pins when the number of contact pins is the same. Is shorter and the height is lower.

[0012]

DESCRIPTION OF THE PREFERRED EMBODIMENTS One embodiment of the present invention will be described below with reference to FIG.
This will be described in detail with reference to FIGS. IC socket 1
Has a plurality of contact pins 2 arranged in a matrix as shown in FIGS. 1 to 3, is inserted and fixed in a case 10, and has an IC package (μBGA) 20 ( 2 and 3) are attached,
An external connector, for example, an external tester is arranged on the other end side.

Here, in the IC package 20, the electrodes are arranged vertically and horizontally in a matrix.
0.5 mm, the number of electrodes is 16 × 16, for a total of 256 electrodes. Moreover, the pitch between the connection terminals of the external connection body is 1.27 mm.
And the number of terminals is 16 × 16, that is, 256 in total. The plurality of contact pins 2 convert the pitch at one end, which is the same as the electrode pitch of the IC package 20, to the same pitch at the other end as the pitch between the connection terminals of the external connection body. As shown in FIG. 4, the plurality of contact pins 2 have 16 leads 3a whose both ends are arranged in parallel in a single plane.
And a plurality of lead frames 3 having the following.
In the lead frame 3, both ends of 16 leads 3a are connected by a frame 3b, and a spring portion 3c formed in an arc shape and two stoppers 3e having an insertion hole 3d are formed on one end side of the lead 3a. ing. 16 leads 3a
Is an external connection connected at one end to an electrode pitch (= 0.5 mm) of an IC package to be mounted and at the other end to a first pitch enlarging portion PE1 (see FIG. 4) composed of an inclined portion. It is formed in accordance with the pitch of the connection terminals of the body (= 1.27 mm).

The first pitch expansion portion PE1 sets the pitch of the other end of each lead 3a to the pitch of the connection terminals of the external connection body (= 1.
27 mm), as shown in FIG. 4, is enlarged in a first direction (arrow X direction in the figure) along the arrangement direction. The lead frame 3 is, as shown in FIG.
In the vicinity of c, an electrically insulating synthetic resin such as a liquid crystal polymer (LCP), polyphenylene sulfide (PPS),
Polyetherketone (PEEK), polybutylene terephthalate (PBT) or polyamideimide (PA
A first fixing portion 4 fixed in the arrangement direction of the leads 3a with a synthetic resin having heat resistance such as I) is provided, and a second fixing portion 5 fixed in the arrangement direction with the synthetic resin is provided on the other end side. ing.

As shown in FIG. 5, the first fixing portion 4 is provided on the lead frame 3 in a concave shape in which a portion of the spring portion 3c is opened, and bolt holes 4a are formed on both sides. The first fixing part 4 is formed by stacking a plurality of lead frames 3 and
The plurality of lead frames 3 are fixed by the bolts 6 (see FIGS. 1 to 3) inserted into the IC socket 1.

The second fixing portion 5 is provided on the other end of the lead 3a, and has pin holes 5a on both sides. Here, the first fixed portion 4 and the second fixed portion 5 are arranged such that the pitch between both ends of the lead 3a when a plurality of lead frames 3 are stacked is I
It is used to hold the electrode pitch of the C package 20 or the pitch of the electrical connection terminals of the external connection body.

The lead frame 3 includes a first fixed portion 4 and a second fixed portion 4.
After the 16 leads 3a are bent in the second direction (lamination direction, arrow Y direction in FIG. 3) between the fixed portion 5 and the arrangement surface at the second pitch enlargement portion PE2 composed of an inclined portion with respect to the arrangement surface, First
A total of 256 contact pins 2, 16 × 16 arranged in a matrix, are formed by laminating 16 fixed portions 4 and second fixed portions 5.

At this time, the first pitch enlarging portion PE1 and the second pitch enlarging portion PE1
The pitch enlargement portion PE2 is formed by an inclined portion inclined by an angle θ defined by the following equation. That is, as shown in FIGS. 6 and 7, the first and second pitch enlarging portions PE1 and PE2 change the distance between the plurality of contact pins 2 in this portion to D1, D2,
When the pitch of the connection terminals of the external connection body is P, the inclination angles θ (= θ1, θ2) of the plurality of contact pins 2 with respect to the first and second directions are set as in the following equation. sin θ = D / P

Here, the lead frame 3 was manufactured as follows. First, a lead frame 3 shown in FIG. 4 was manufactured by etching using a beryllium copper alloy plate having a thickness of 0.1 mm. As an etchant, for example, a ferric chloride solution or the like was used. The lead frame 3 is made of Ni plating of about 3 μm thickness on the base, and Pd of about 0.3 μm thickness thereon.
-25% Ni plating was applied. Lead frame 3 is P
Au plating or Pd plating may be applied instead of d-25% Ni plating. The lead frame 3 may be coated with an electrically insulating paint except for both ends of the lead 3a, or may be attached with an insulating tape to prevent connection between the leads 3a.

As shown in FIG. 4, the lead frame 3 is connected to a plurality of leads 3a in the direction of arrangement of the leads 3a by a frame 3b, and is formed as a thin half-etched portion 3f.
Is separated for each unit of each lead frame 3. Next, as shown in FIG. 5, the first fixing portion 4 is attached to the lead 3a near the spring portion 3c.
Were provided on the other end side, and the two frames 3b were twisted off.

Next, the plurality of leads 3 a of the lead frame 3 are moved between the first fixing portion 4 and the second
To form a second pitch enlarged portion PE2. At this time, a plurality of contact pins 2 are formed by stacking a plurality of lead frames 3. Therefore, as shown in FIG. 7, the plurality of lead frames 3 to be stacked are adjacent to each other in the second pitch enlargement portion PE2.
a, that is, the distance D between the plurality of contact pins 2
2 are bent at slightly different positions so that they are always constant between different lead frames 3.

In this way, a total of 16 lead frames 3 having slightly different bending positions were produced. These 16 lead frames 3 are connected to the first fixing portion 4 and the second
The first fixing portion 4 was fixed on the both sides of the first fixing portion 4 with bolts 6 inserted through bolt holes 4a. Next, as shown in FIGS. 1 to 3, the fixed 16 lead frames 3 are inserted into an opening 10 a formed in the center of the case 10, and are fixed to the case 10 with pins 11 and 12. I got At this time, the pin 11 penetrates the case 10 and abuts on the lower end of the first fixing portion 4, and the pin 12 penetrates the case 10 and contacts the second fixing portion 5.
Is inserted through the pin hole 5a.

In the IC socket 1 assembled in this manner, an IC to which a plurality of contact pins are mounted in advance by the first fixing portion 4 and the second fixing portion 5 is mounted.
Since the pitch is maintained at the electrode pitch of the package 20 or the pitch of the connection terminals of the external connection body, the reliability is improved. And
The IC socket 1 is connected to the spring portion 3 c of the lead frame 3,
That is, as shown in FIG. 2, a 16 × 1 through hole having a pitch equal to the pitch between the electrodes of the IC package 20 (= 0.5 mm) and an inner diameter of 0.3 mm is provided at one end of the contact pin 2.
6. A total of 256 perforated plates 13 are attached. Thereby, the plurality of contact pins 2 are attached to the perforated plate 1
3, the pitch at one end is kept equal to the pitch of the electrodes of the IC package 20. At this time, the perforated plate 13
In the center, a positioning groove 13a for positioning and arranging the IC package 20 (see FIG. 3) is formed.

Here, since FIG. 1 shows the IC socket 1 inserted into the case 10, the perforated plate 13 and the lid 14 shown in FIGS. In FIG. 3, the lid 14 is opened and closed about a hinge pin 14a, and is engaged with a projection 10b provided on a wall surface of the case 10 by a hook 14b. When inspecting the IC package 20 with the IC socket 1, as shown in FIG.
3a, and the lid 14 is closed. Along with this, Case 1
0 is placed on an external connector (not shown), and the other end of the contact pin 2 is brought into direct contact with the connection terminal of the external connector.

Then, as shown in FIG. 3, the pressure plate 15 incorporated in the lid 14 pushes down the IC package 20 together with the perforated plate 13 by the spring force from the first spring 16 arranged between the pressure plate 15 and the lid 14. At this time, the perforated plate 13 is urged toward the pressure plate 15 by the second spring 17 disposed between the perforated plate 13 and the case 10. Therefore, IC socket 1
Indicates that one end of each contact pin 2 protrudes from the hole of the perforated plate 13 and a corresponding electrode (not shown) of the IC package 20.
Contact with. As a result, the IC socket 1 is connected to the connection terminals where the respective electrodes of the IC package 20 are located outside.
Inspection of the electrical characteristics of the IC package 20, for example, a burn-in test can be performed at low cost without using an expensive multilayer printed circuit board.

At this time, in the IC socket 1, the plurality of contact pins 2 are provided with first and second pitch enlarging portions PE1 and PE2 each formed of an inclined portion. Therefore, if the number of the contact pins 2 is the same,
The length of the contact pin 2 can be reduced as compared with the case where the contact pin 2 is bent at a right angle as in the above-described conventional example.
For example, in the conventional IC socket shown in the left half of FIG. 6 using contact pins bent at right angles and the IC socket shown in the right half of FIG. Was examined. Here, FIG.
In the contact pin 2 shown in FIG.
6, a case of a total of 256 contact pins 2 is shown, but actually, an IC socket having 23 × 23, a total of 529 contact pins 2 was examined.

In the following description and the drawings used in the following description, the same components as those of the present invention, such as the above-mentioned contact pins, will be described using the same reference numerals. As shown in the right half of FIG. 6, since the distance D1 between the plurality of contact pins 2 is set to 0.5 mm, the pitch of the connection terminals of the external connection body is P = 1.27 mm. It is about 23 degrees.

At this time, in the case of the contact pin 2 bent at a right angle shown on the left half side of FIG. 6, if the distance between the plurality of contact pins 2 is also 0.5 mm, an IC socket corresponding to the pitch enlarged portion PE1 is provided. Length L1 in the height direction of 1
Is about 6 mm. On the other hand, in the case of the contact pin 2 provided with the first pitch enlarging portion PE1 shown in the right half of FIG. 6, the corresponding length L2 is about 4.45 mm, and about 1.55
(= 6-4.45) mm, and the length of the IC socket 1 in the height direction is reduced.

On the other hand, as shown on the right half side of FIG. 7, the plurality of contact pins 2 are bent between the first fixing portion 4 and the second fixing portion 5 with reference to the second direction to form a second contact pin. When forming the pitch enlargement portion PE2, for example, in the present embodiment,
Since the distance D2 between the plurality of contact pins 2 was set to 0.4 mm, the pitch of the connection terminals of the external connection body was P = 1.27 mm.
Therefore, the inclination angle θ2 is about 18 degrees.

At this time, as shown in the left half of FIG. 7, in the case of the contact pin 2 bent at a right angle, if the distance between the plurality of contact pins 2 is also 0.4 mm, the second
The length L3 in the height direction of the IC socket 1 corresponding to the pitch expansion portion PE2 is about 5.71 mm. On the other hand, in the case of the contact pin 2 provided with the second pitch enlarged portion PE2 shown on the left half side of FIG. 7, the corresponding length L4 is about 4.51 mm, and further about 1.2 (= 5. 71-4.51) mm, and the length of the IC socket 1 in the height direction is reduced.

Accordingly, when the shortened lengths in the two cases shown in FIGS. 6 and 7 are added, a total of about 2.75 (=
1.55 + 1.2) mm The length of the contact pins 2 in the height direction of the IC socket 1 can be reduced. At this time, the height of the IC socket 1 is a standard of 25 mm. Therefore, the height of the IC socket 1 is the contact pin 2
However, if the number of contact pins 2 can be reduced by about 2.75 mm, the height of the IC socket 1 can be reduced by 10% or more if the number of contact pins 2 is the same.

At this time, under the above conditions, regarding the plurality of contact pins of the present embodiment to be incorporated in the IC socket and the plurality of contact pins of the conventional example bent at a right angle, the longest contact pin length Lmax and the longest (Lmax)
And the difference ΔL (Lmax-L
min) and the measurement results are summarized in Table 1.

[0033]

[Table 1]

As is clear from the results shown in Table 1, the longest contact pin of the present invention is longer than that of the conventional example.
7.89 (= 28.53-20.64) mm shorter, and the difference ΔL between the contact pins is 5.14 (= 16.
82-11.68) mm shorter. Therefore, the IC socket is
Since the length Lmax of the longest contact pin and the difference ΔL between the contact pins are shorter in the present invention than in the conventional example,
It can be seen that the conductor resistance of the present invention is smaller and the difference in conductor resistance between contact pins is smaller. When the conductor resistance of a plurality of contact pins in the IC socket was actually measured, it was 50 to 65 mΩ in the conventional example, but was 50 to 55 mΩ in the present invention.

On the other hand, in the IC socket 1, a spring portion 3 c formed in an arc shape is formed on a lead 3 a of each lead frame 3 serving as a contact pin 2. Therefore, IC
In the socket 1, the contact pins 2 are always in contact with the electrodes of the IC package 20 at a constant contact pressure. In addition, the lowering position of the porous plate 13 is regulated by the stopper 3e of the lead frame 3, so that the maximum contact pressure is also constant. Determined by the value.

[0036]

According to the first and second aspects of the present invention, the length of the contact pin when assembled can be reduced as much as possible, and the height can be further reduced. Sockets can be provided. At this time, I
The C socket can reduce the difference between the conductor resistance value of the contact pin and the conductor resistance value between the contact pins by reducing the length of the contact pin.

According to the third aspect of the present invention,
In the plurality of contact pins in each lead frame, the vicinity of the spring portion is fixed with synthetic resin, so that each contact pin applies a constant spring pressure to the electrode of the semiconductor element regardless of the arrangement position. Can be. According to the fourth aspect of the present invention, in the plurality of contact pins in each lead frame, the other end, which is the side of the external connection body, is fixed with the synthetic resin. Can be kept constant.

According to the fifth aspect of the present invention,
The pitch of the plurality of contact pins on the semiconductor element side can be kept constant by the blind plate. Claim 6
According to the sixth aspect described above, since both ends of the plurality of contact pins are held at the preset pitch, the reliability of the assembled IC socket is improved.

[Brief description of the drawings]

FIG. 1 is a plan view of an IC socket according to an embodiment of the present invention, which is inserted into a case.

FIG. 2 is a sectional front view of the IC socket of FIG. 1;

FIG. 3 is a sectional side view of the IC socket of FIG. 1;

FIG. 4 is a front view showing a configuration of a lead frame used in the IC socket of FIG. 1;

FIG. 5 is a front view in which first and second fixing portions are provided on the lead frame of FIG. 4;

FIG. 6 is a front view showing a first enlarged portion of the lead frame in comparison with a lead frame having a conventional structure.

FIG. 7 is a side view showing a second enlarged portion of the lead frame in comparison with a lead frame having a conventional structure.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 IC socket 2 Contact pin 3 Lead frame 3a Lead 3c Spring part 4 First fixing part 5 Second fixing part 6 Bolt 7,8 Tightening plate 10 Case 11,12 pin 13 Perforated plate 14 Cover 15 Pressure plate 16 First spring 17 Second spring 20 IC package (semiconductor element) PE1 First pitch expansion part PE2 Second pitch expansion part

 ──────────────────────────────────────────────────続 き Continued on front page (72) Inventor Masato Sakata 2-6-1 Marunouchi, Chiyoda-ku, Tokyo Inside Furukawa Electric Co., Ltd. (72) Inventor Nobuo Kawamura 3-28-7 Nakamagome, Ota-ku, Tokyo No. Yamaichi Electric Co., Ltd. (72) Inventor Shunji Abe 3-28-7 Nakamagome, Ota-ku, Tokyo F-term in Yamaichi Electric Co., Ltd. (reference) 5E024 CA01 CB01

Claims (6)

[Claims] 1. A connection in an external connection body in which one end is enlarged so as to be larger than the electrode pitch of the semiconductor element to be mounted and the other end is larger than the electrode pitch in first and second directions. An IC socket having a plurality of contact pins arranged in a matrix in accordance with the pitch of the terminals and being inserted into a case, wherein each of the plurality of contact pins has an inclined portion defined by the following formula: And a first pitch enlarging portion for enlarging the pitch of the other end in the first direction and a second pitch enlarging portion for enlarging in the second direction. IC socket. sin θ = D / P where D is the distance between the plurality of contact pins in the first and second pitch enlarging portions, P is the pitch of the connection terminals, and θ is the first and second of the plurality of contact pins. 2
Is the angle of inclination of the inclined portion with respect to the direction of. 2. The method according to claim 1, wherein the plurality of contact pins are arranged in a single plane, and include a plurality of lead frames having a plurality of leads on which the first pitch enlarged portion is formed. One end of the plurality of leads is connected to the electrode pitch of the semiconductor element to be mounted, and the other end of the plurality of leads is enlarged by the second pitch enlarging portion to be connected to the connection terminal of the external connector. The IC socket according to claim 1, wherein the plurality of contact pins are formed by stacking a plurality of contact pins, respectively, at the same pitch. 3. Each of the lead frames has a spring portion formed in an arc shape on one end side of the plurality of leads,
3. The IC socket according to claim 2, wherein the plurality of leads are provided with a first fixing portion in which the vicinity of the spring portion is fixed in an arrangement direction with an electrically insulating synthetic resin. 4. The IC socket according to claim 3, wherein each of the lead frames is provided with a second fixing portion in which the other ends of the plurality of leads are fixed with an electrically insulating synthetic resin in the arrangement direction. 5. The IC socket according to claim 2, wherein a perforated plate for positioning each contact pin is disposed at one end of the plurality of contact pins where the semiconductor element is mounted. 6. A pitch between both ends of a lead when a plurality of the lead frames are stacked by the first fixing portion or the second fixing portion, the electrode pitch of the semiconductor element and the electrical connection terminal of the external connection body. The IC socket according to any one of claims 3 to 5, wherein said IC socket is held at said pitch.