JP2000321188A - Testing device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To efficiently perform the diversified bending tests and pressurization tests of a card-type substrate. SOLUTION: A plurality of bending test mechanism units 71-74 different in the bending direction of a card-type substrate 1 are composed by each combination of projection-type tools 111-114 and recessed-type tools 121-124 and are arranged in a perpendicular direction, at the same time retention tools 81-84 for stopping the card-type substrate 1 are provided at each of the bending test mechanism units 71-74, and the card-type substrate 1 is inserted or extracted from one bending test mechanism unit to another test unit by successively and freely dropping by the operation of the retention tools 81-84, thus continuously performing a bending test under four conditions of the combination of the two directions of the long and short sides of the card-type substrate 1 and the directions of both the surfaces of the card-type substrate 1.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

[0001] The present invention relates to a test technique,
In particular, the present invention relates to a technique which is effective when applied to a step of evaluating the mechanical strength of a card-type substrate.

[0002]

2. Description of the Related Art A conventional credit card or cash card has a structure in which a magnetic tape is affixed to a card base material. There was no significant loss.

On the other hand, a card-type electronic circuit board having a built-in semiconductor IC chip has a circuit board made of an organic polymer material and a semiconductor IC chip having a function for wireless communication mounted on a memory, a microcomputer and the like. , Its memory capacity is much larger than that of magnetic tape, and it can be used as a credit card or cash card,
It is becoming widespread as a portable recording medium capable of recording or exchanging various information.

However, in the case of a card of a card type electronic circuit board with a built-in semiconductor IC chip having a thickness smaller than that of a conventional magnetic tape affixed card, the semiconductor is deformed by mechanical deformation such as bending or twisting in handling or carrying. There has been a technical problem that the IC chip is broken or the like is broken, and the function of the card is easily deteriorated.

Therefore, a bending test of a card-type substrate is performed as an evaluation device as a card-type substrate that can withstand the mechanical strength in actual use described above.
0373, JISX6303, and JISX6321.

Particularly, in a card-type electronic circuit board having a built-in semiconductor IC chip, destruction of the semiconductor IC chip causes fatal damage to the card function. The bending strength is greatly affected by the position of the semiconductor IC chip in the direction of the long side and the short side thereof, and the position of the semiconductor IC chip in the thickness direction inside the card.

FIG. 8 shows a bending test apparatus according to a reference technique which is frequently used. The card-type substrate 1 is sandwiched between a convex jig 11 having a predetermined curvature and a corresponding concave jig 12, and is embossed manually or automatically by a jig driving mechanism 17. In actual use, the card-type board may be bent without distinguishing between the long side and the short side or the front and back of the board. In the bending test, four conditions consisting of the combination of the front and back of long side bending and the front and back of short side bending are used. Bending mode is required. For this reason, in the bending test of one card-type substrate, it is necessary to perform four insertions / removals to the uneven jig.

FIG. 9 shows a push-load test apparatus according to a reference technique that is frequently used. A convex indenter 211 having a predetermined tip shape is attached to a card-type substrate 1 placed on a holding back plate 13.
Of the semiconductor IC chip 4 with a predetermined strength. The pressing operation of the convex indenter 211 is performed manually or automatically by the indenter driving mechanism 215. In actual use, there is a possibility that a pressing load is applied to the card-type substrate without distinction between the front and back surfaces of the substrate, and in the pressing load test, it is necessary to apply pressure with an indenter under two conditions of the front and back surfaces. For this reason, in the pressing load test of one card-type substrate, the insertion and removal of the card-type substrate to and from the pressing load jig must be performed twice.

[0009]

As described above, in the conventional bending test apparatus, in particular, in the bending test of a card-type electronic circuit board containing a semiconductor IC chip, the bending test of one card is performed. Bending tests in two directions of the front and back, and in four directions in which the long side / short side and the front and back are combined are required. For this reason, even if the bending deformation of the card-type substrate is automatically performed by the bending jig, the insertion and removal of the card-type substrate to and from the jig must be performed manually or complicatedly in order to change the bending direction of the card-type substrate. There was a technical problem that it was necessary to use a mechanism.

[0010] As described above, in the conventional pressing load test apparatus, particularly when the mechanical strength of one card is evaluated in the pressing load test of a card-type electronic circuit board containing a semiconductor IC chip. In addition, it is necessary to perform a load test in two directions on the front and back of the card type substrate. For this reason,
Even in the case of automatically applying pressure with an indenter, it is necessary to insert or remove the card-type substrate from the jig by hand or by providing a complicated mechanism when changing the pushing direction. There were technical challenges.

Therefore, an object of the present invention is to automatically insert and remove a card-type substrate from one bending test mechanism unit to another bending test mechanism unit by a simple method, and to continuously perform a bending test on the card-type substrate. It is an object of the present invention to provide a card-type substrate bending test technique which can be performed by using the same.

Another object of the present invention is to automatically insert and remove a card type substrate from a test mechanism unit for applying pressure in one direction to a test mechanism unit for applying pressure in another direction by a simple method. It is an object of the present invention to provide a card-type substrate pressing load test technique capable of continuously performing a card-type substrate pressing load test.

[0013]

That is, the present invention relates to a test apparatus for sandwiching a card-type substrate between a convex jig and a concave jig having a curved surface with an arbitrary curvature to apply bending deformation to the card-type substrate. A plurality of test units that are arranged in a substantially vertical direction and apply bending deformation in different directions to the card-type substrate, and a moving mechanism that sequentially moves between the plurality of test units by the weight of the card-type substrate. It is a configuration that includes.

More specifically, as an example, the present invention provides:
(1) a bending test mechanism unit for placing a card-type substrate vertically and bending the card-type substrate so that a long side of the card-type substrate follows a curved surface of a convex jig having a predetermined curvature; and (2) a card-type substrate. And a bending test mechanism unit for bending the card-type substrate so that the long side of the card-type substrate is along a convex curved surface having a predetermined curvature in the opposite direction of (1), and (3) the card-type substrate is vertically set. And a bending test mechanism unit that bends the card-type substrate so that the short side of the card-type substrate follows the curved surface of the convex jig having a predetermined curvature; and (4) the card-type substrate is installed vertically. A bending test mechanism unit that bends the card-type substrate so that the short side of the substrate is along the curved surface of the convex jig having a predetermined curvature in the opposite direction of (3), wherein the plurality of bending test mechanism units are arranged in the vertical direction. In the order from the upper bending test mechanism unit. The de-type substrate by free fall until reaching the lower bending test mechanisms within the unit, in which a structure for performing a bending test at individual bending test mechanism unit.

Furthermore, a plurality of partial columnar bodies having mutually different curvatures are combined as a convex jig.
Then, a plurality of pressing dies that divide the curved surface of the concave jig facing the convex jig have the curvature of the convex jig so that the bending deformation of the card type substrate follows the curvature of each convex jig. A band-shaped curved surface forming member may be provided so as to follow the surface of the plurality of pressing dies so as to follow the convex jig side.

Further, the present invention provides a card type substrate, wherein the card type substrate is sandwiched between a flat member supporting the back surface of the card type substrate and a convex indenter opposed to the flat member via the card type substrate. In a test apparatus that performs a pressing test that presses a part, each arranges a plurality of test units each having a flat member and an indenter in a substantially vertical direction, and sequentially moves between the plurality of test units by the weight of the card-type substrate. , A pressing test is performed in each test unit.

More specifically, in a pressing load test apparatus in which an indenter having a predetermined tip shape is pressed against a semiconductor IC chip portion built in a card-type substrate, (1) the card-type substrate is installed vertically, Semiconductor IC built into the substrate
A test mechanism unit for pressing an indenter having a predetermined tip shape against one main surface of the chip; and (2) a card-type substrate which is installed vertically and which is the reverse of (1) of the semiconductor IC chip incorporated in the card-type substrate. In this configuration, a test mechanism unit for pressing an indenter having a predetermined tip shape against a main surface is arranged in a vertical direction.

[0018]

Embodiment 1 Hereinafter, an embodiment of the present invention will be described in detail with reference to the drawings.

First, an example of a card-type substrate to be subjected to a test in the test apparatus of each embodiment of the present invention will be generally described with reference to FIG.

In the first embodiment, the outer shape of the card type substrate 1 subjected to the test is about 85 mm on the long side and about 55 mm on the short side, like a commonly used credit card or the like.
However, the thickness of the substrate is 0.5 mm. An antenna coil portion 3a, a connection terminal 3b for a semiconductor IC chip, and a wiring portion 3c are formed on the surface of the circuit board material 2 by the conductive film 3, and a semiconductor IC chip 4 having a thickness of 100 μm is formed on the semiconductor IC chip connection portion. These are arranged so that they are sandwiched between the surface film 5 and the adhesive layer 6.

The test apparatus according to the present embodiment performs a test in which the card type substrate 1 is bent at a radius of curvature of 45 mm. The curvature is set based on the strength level required from the actual use state of the card type substrate 1 and the ease of bending related to the rigidity of the card type substrate 1. In the bending test, the bending is performed in four directions of a combination of two directions of the long side and the short side from the two directions of the front and back surfaces of the card type substrate 1.

Next, the overall configuration of the card-type substrate bending test apparatus according to the first embodiment of the present invention will be described with reference to the block diagram shown in FIG.

The bending test apparatus according to the first embodiment includes four bending test mechanism units 71, 72,
73, 74, and the insertion unit 9 of the card type substrate 1 provided above the uppermost bending test mechanism unit 71 and the recovery unit of the tested card type substrate 1 provided below the lowermost bending test mechanism unit 74 Consists of ten. The card type substrate 1 to be tested is dropped one by one from the insertion unit 9 into each of the bending test mechanism units 71 to 74, and the bending test is performed.

Here, the configuration of the bending test mechanism units 71 to 74 will be described with reference to FIGS.

First, an outline of each bending test mechanism unit will be described with reference to FIG. 2A, taking the first-stage bending test mechanism unit 71 as a representative example.

The first-stage bending test mechanism unit 71 includes:
A semi-cylindrical convex jig 111 having a radius of curvature of 45 mm and a radius of 45.5 mm in consideration of a 0.5 mm thickness of the card type substrate 1 for aligning the card type substrate 1 on the surface of the convex jig.
Below the concave jig 121 and the concave / convex jig, for holding the card type substrate 1 and transferring the card type substrate 1 to the next test mechanism unit disposed below the test mechanism unit. It consists of a holding plate 81 that slides in the direction. On the opening side of the concave jig 121, a guide groove 121a for guiding the card type substrate 1 moving in the vertical direction is formed.

Then, the convex jig 111 is moved in the horizontal direction (left direction in this figure) (the moving mechanism is omitted), and the card-type substrate 1 is sandwiched between the convex jig 111 and the concave jig 121, and A is bent concavely.

FIG. 2B shows the arrangement of the concave and convex jigs of the second-stage bending test mechanism unit 72 provided below. Here, the convex jig 112 and the concave jig 122 are arranged so that the long side of the card-type substrate 1 is bent convexly on the surface A. On the opening side of the concave jig 122, a guide groove 122a for guiding the card type substrate 1 moving in the vertical direction is formed.

FIG. 2C shows the arrangement of the concave and convex jigs of the lower third bending test mechanism unit 73. Here, the convex jig 113 and the concave jig 123 are arranged such that the short side of the card type substrate 1 is bent concavely on the surface A. On the opening side of the concave jig 123, a guide groove 123a for guiding the card type substrate 1 moving in the vertical direction is formed.

The fourth lowermost bending test mechanism unit 7
FIG. 2D shows the arrangement of the uneven jig of No. 4. Here, the convex jig 114 and the concave jig 124 are arranged such that the short side of the card type substrate 1 is bent in a convex manner on the surface A. On the opening side of the concave jig 124, a guide groove 124a for guiding the card type substrate 1 moving in the vertical direction is formed.

Therefore, in this test apparatus, the upper two test mechanism units in the first and second stages, and the lower two test mechanism units in the third and fourth stages have a convex jig. And the combination of the concave jig,
The first and third test mechanism units are rotated by 180 degrees, and the second and fourth test mechanism units are rotated by 180 degrees.
In the two test mechanism units in the second row, the combination of the convex jig and the concave jig is 9
The concavo-convex type jig is arranged in the vertical direction in each test mechanism unit so as to be rotated by 0 degrees.

That is, each of the structures shown in FIGS. 2A to 2D is formed by a concave jig 121 to 12 with a support structure (not shown).
Guide grooves 121a to 121 formed in the respective openings of FIG.
4a are integrally arranged so as to be aligned linearly in the vertical direction, and the card-type substrate 1 that moves by its own weight in the vertical direction is smoothly guided, and the concave jigs 121 to 124 are provided.
By moving the holding plates 81 to 84 arranged at the lower part of each of the card type substrates 1 into and out of the movement path of the card type substrate 1, the card type substrates 1 are sequentially stopped at the positions of the individual test mechanism units, and the bending test is performed. Is performed.

Next, the flow of the bending test of the card type substrate 1 will be described.

The 100 card-type substrates 1 to be subjected to the bending test are set in the insertion unit 9, and the one card-type substrate 1 is placed vertically on the uppermost bending test mechanism unit 71 in the first stage. It is mounted between the convex jig 111 and the concave jig 121 in the uppermost bending test mechanism unit 71 by the holding plate 81. Then, the card-type substrate 1 is moved by the reciprocating movement of the convex jig 111 in the horizontal direction.
11 is a convex jig having a long side sandwiched between the concave jig 11 and the concave jig 121.
It is bent along 11 curved surfaces. Under test conditions in which the card-type substrate 1 is bent a plurality of times in a certain direction, the convex jig 111 is reciprocated a predetermined number of times.

After the bending test in the first stage test unit is completed, the holding plate 81 is moved laterally to
Is dropped and mounted on the next second-stage bending test mechanism unit 72, and the holding plate 81 is returned to its original position. Thereafter, the next card-type substrate 1 is mounted on the first-stage bending test mechanism unit 71. In the first and second test mechanism units (71, 72), the card type substrate 1 is sandwiched between the convex jigs (111, 112) and the concave jigs (121, 122). The bending test is performed in parallel.

In the bending test mechanism unit 72 of the second stage, the arrangement of the convex jig 112 and the concave jig 122 is opposite to that of the uppermost bending test unit 71 by 180 degrees. Therefore, in the bending test mechanism unit 72 of the second stage, the bending is performed in a direction opposite to that in the case of the first stage.

Subsequently, the third-stage bending test mechanism unit 7
3, the arrangement of the convex jig 113 and the concave jig 123 is the first.
The bending test mechanism unit 71 of the stage is a card type substrate 1
Are rotated 90 degrees in the plane of. For this reason, in the bending test mechanism unit 73 of the third stage, the card type substrate 1 mounted so that the long side is vertical, and the short side here is the convex jig 1
13 is bent.

In the lowermost bending test mechanism unit 74 of the fourth stage, the arrangement of the convex jig 114 and the concave jig 124 is different from that of the third bending test mechanism unit 73 in that the card type substrate 1 is It rotates 180 degrees between them. Therefore, in the lowermost bending test mechanism unit 74, the short side is bent in a direction opposite to that of the third-stage bending test mechanism unit 73.

As described above, the card-type substrate 1 is sequentially bent at both the long side and the short side, and the card-type substrate 1 having undergone the bending test is stored in the collection unit 10.

The card-type substrate 1 thus collected is subjected to a predetermined electrical function test to determine whether there is any defect.

With the bending test apparatus of the first embodiment, the bending of the card-type substrate 1 in four directions is allowed to fall freely into each of the bending test mechanism units 71 to 74 for performing the bending test in each direction, and is sequentially loaded. By changing the bending direction,
There is an effect that the operation can be performed simply and accurately without manual operation or without providing a special transport mechanism.

(Embodiment 2) Next, another embodiment of the present invention will be described with reference to the drawings. The card-type substrate to be tested in the second embodiment is the same as that in the first embodiment.

Next, a bending test apparatus for a card type substrate according to the second embodiment will be described.

In this test apparatus, the card type substrate 1 can be subjected to a bending test with two kinds of curvatures, a curvature having a radius of 45 mm and a curvature having a radius of 30 mm.

The overall configuration of the test apparatus is similar to that of the first embodiment.
1A, 72A, 73A, 74A, the insertion unit 9 of the card type substrate 1 provided above the uppermost bending test mechanism unit 71A, and the tested card type provided below the lowermost bending test mechanism unit 74A. It comprises a collection unit 10 for the substrate 1. Card type substrate 1 to be tested
Are sequentially dropped one by one from the insertion unit 9 to each test mechanism unit, and a bending test is performed.

Here, the configuration of each of the bending test mechanism units 71A to 74A in the present embodiment will be described with reference to the longitudinal sectional view of FIG. First, the configuration of the convex jig and the concave jig according to the second embodiment of the present invention will be described in detail with reference to FIG. 3A showing a first-stage bending test mechanism unit 71A as a representative.

In the bending test mechanism unit 71A of the first stage, a convex jig 111 in which a semi-cylindrical body 115 having a radius of curvature of 45 mm and a semi-cylindrical body 116 having a radius of curvature of 30 mm are combined. The first feature is that the concave pressing portion for replacing the concave jig for causing the card-type substrate 1 to follow the surface of the convex jig 111 has a variable curved surface structure described below. There are features.

The concave pressing portion 131 is an assembly in which a plurality of 9 mm-thick flat plate-like pressing plates 14 are stacked at an interval of 1 mm, and a spring 15 is disposed on the back surface of each pressing plate 14. , And the card-shaped substrate 1 of the pressing plate 14
The convex jigs 11 of the stacked push plates 14 are
A band-shaped flexible rubber sheet is provided as the concave curved surface forming member 16 so as to cover the entire surface on the side facing the surface 1.

The card type substrate 1 is supported by the holding plate 81 of the bending test mechanism unit 71A and is dropped and inserted between the curvature surface of the convex jig 111 and the concave pressing portion 131. Then, the convex jig 111 is moved in the lateral direction (to the left in this figure), and the individual push plates 14 are pushed by the springs 15 so as to follow the convex surface, and are passed through the concave curved surface forming member 16 such as a rubber sheet. Then, the card type substrate 1 is bent so as to follow the surface of the semi-cylindrical body 115. FIG. 4 shows a state of a bending test of the card type substrate 1 in the first-stage bending test mechanism unit 71A.

When a bending test is performed with the semi-cylindrical body 116 having the other curvature, the test is performed by rotating the entire convex jig 111.

The bending test mechanism units 71A to 74
In each of A, the convex jigs 111 to 114 and the concave pressing portions 131 to 13 are arranged in the same positional relationship as in the first embodiment.
4 and the bending test of the card type substrate 1 is performed in the same manner as in the first embodiment. FIG. 3B shows the arrangement of the convex jig 112 and the concave pressing portion 132 in the second-stage bending test mechanism unit 72A, and FIG. 3C shows the arrangement of the third-stage bending test mechanism unit 73A. The arrangement of the convex jig 113 and the concave pressing section 133 is shown, and FIG. 3D shows the arrangement of the convex jig 114 and the concave pressing section 134 in the fourth-stage bending test mechanism unit 74A.

As described above, according to the second embodiment, the same effects as those of the first embodiment can be obtained, and further, in each of the bending test mechanism units 71A to 74A, a plurality of push plates 14 are assembled. The concave pressing portions 131 to 134 having a variable curved surface shape are formed of curved surfaces of arbitrary shapes following the curvatures of the semi-cylindrical bodies 115 and the semi-cylindrical bodies 116 of the convex jigs 111 to 114 having different curvatures. Can be formed, and it is also possible to cope with bending tests of various card-type substrates 1 having different thicknesses.

In each of the above embodiments, the mechanism in which the convex jig moves to bend the card-type substrate 1 has been described. However, the bending test is performed by moving the concave jig. It is also possible.

(Embodiment 3) An overall configuration of a card-type substrate pressing load test apparatus according to Embodiment 3 of the present invention will be described with reference to the block diagram of FIG. The card-type substrate to be tested in the third embodiment is the same as that in the first embodiment.

The overall configuration of the test apparatus is as follows. Two push load test mechanism units 271 and 272 arranged in the vertical direction, and an insertion unit 208 of the card type substrate 1 provided above the upper push load test mechanism unit 271. And a recovery unit 209 for the tested card-type substrate 1 provided below the lower push-load test mechanism unit 272. The card-type substrate 1 to be subjected to the test includes individual push load test mechanism units 2 one by one from the insertion unit 208.
The test pieces are sequentially dropped on the test pieces 71 and 272, and a push load test is performed. The size of the semiconductor IC chip 4 is usually 5 mm.
In order to apply a pressing load to the semiconductor IC chip 4, the individual pressing load test mechanism units 27
1 and 272, the card-type substrate 1 needs to be installed at an appropriate position, and the insertion unit 208, the first-stage push load test mechanism unit 271 and the second-stage push load test mechanism unit 272 are required. Between the card type substrate 1
A drop guide plate 210 (shown in FIG. 6) that regulates the displacement of the drop is provided.

Here, the pushing load test mechanism unit 271,
The configuration of 272 will be described with reference to FIG.

This test apparatus performs a load test in which the mounting portion of the semiconductor IC chip 4 of the card type substrate 1 is pressed with a load of 1 kg with a convex indenter having a tip having a radius of 10 mm. The shape of the tip of the convex indenter is appropriately set based on the strength level required from the actual use state of the card type substrate 1.

In this pressing load test, a pressing load is applied from each of the two directions on the front and back surfaces of the card type substrate 1.

The pressing load test mechanism unit 271 includes a convex indenter 311 having a tip shape with a radius of curvature of 10 mm and a holding back plate 32 for holding the card type substrate 1 from the back.
1. A holding lower plate 331 for holding the card-type substrate 1 upright in the test mechanism unit, and a card for positioning the semiconductor IC chip 4 built in the card-type substrate 1 to accurately apply an indenter. Mold substrate holding side plate 314,
It comprises a drive mechanism 315.

Then, the convex indenter 311 is moved in the lateral direction until a predetermined load is applied, and a load is applied to the semiconductor IC chip 4 built in the card type substrate 1. Thereafter, the convex indenter 311 is returned in the opposite direction, the holding lower plate 331 is slid in the lateral direction, and the card type substrate 1 is dropped and inserted from this push load test mechanism unit 271 to the next push load test mechanism unit 272.

The first stage pressing load test mechanism unit 27
1, a semiconductor IC chip 4 built in the card type substrate 1
So that the convex indenter 311 is pressed against the
1 and a holding back plate 321 of the card type substrate 1 are arranged. In the lower second stage load test mechanism unit 272, the indenter and the card are pressed so that the convex indenter 312 is pressed from the surface opposite to the first surface of the semiconductor IC chip 4 incorporated in the card type substrate 1. The holding back plate 322 of the mold substrate 1 is arranged. Therefore, in the two push load test mechanism units 271 and 272 of this push load test device, the convex indenters 311 and
The combination of 312 and the holding back plates 321 and 322 of the card-type substrate 1 is rotated by 180 degrees with the card-type substrate 1 interposed therebetween.

The flow of the test for pushing the card-type substrate 1 in the test apparatus will be described.

A predetermined number of test cards are set in the insertion unit 208 in the upper part of the apparatus, and the card-type substrate 1 is dropped from the opening of the insertion unit 208 by an automatic conveyance mechanism (not shown) for the sheet. It is installed in the push load test mechanism unit 271 of the step.

The first stage pressing load test mechanism unit 27
In 1, the convex indenter 311 moves laterally and the pushing load is 1 kg.
Is set to stop when it reaches, and then reverse. The indenter is reciprocated a predetermined number of times as necessary, and a pressing load is applied to the mounting portion of the semiconductor IC chip 4 in a fixed direction.

After the pressing load in the pressing load testing mechanism unit 271 is completed, the holding lower plate 331 is slid, and the card-type substrate 1 is moved to the second pressing load testing mechanism unit 2.
Insert and attach to 72. Next, after the holding lower plate 331 is closed, the card type substrate 1 for the next test is inserted into the insertion unit 208.
Is mounted on the first-stage push-load test mechanism unit 271.

The second stage pressing load test mechanism unit 27
2, the arrangement of the convex indenter 312 and the holding back plate 322 is reversed, and the convex indenter 31 operated by the drive mechanism 315.
Due to the lateral movement of 2, the semiconductor IC chip 4 built in the card type substrate 1 is subjected to a pressing load from the direction opposite to the first stage.

After the first-stage and second-stage push load tests are completed,
The card-type substrate 1 is dropped onto the collection unit 209 by sliding the second lower holding plate 332.

Next, after the lower holding plate 332 of the second stage is returned to its original position and closed, the lower holding plate 331 of the first stage is opened, and the card-type substrate 1 tested in the first stage is removed. It is dropped and inserted into the second-stage push load test mechanism unit 272. After the holding lower plate 331 is closed, the card type substrate 1 for the next test is dropped and inserted from the insertion unit 208 into the first-stage pressing load test mechanism unit 271.

By repeating the above series of operations,
A pressing load test is automatically performed on the front and back surfaces of the semiconductor IC chip 4 incorporated in the card type substrate 1.

Thereafter, it is determined whether the card-type substrate 1 which has been subjected to the pressing load test is defective by a predetermined electrical measurement.

The pushing load test mechanism unit 271,
The semiconductor IC chip 4 of the holding back plates 321 and 322 of 272
A hole is punched in a portion corresponding to the mounting position of the semiconductor IC chip 4 to cause a larger bending deformation in the semiconductor IC chip 4, or a flexible plate such as rubber is provided between the card type substrate 1 and the holding back plates 321 and 322. The same pressing load test can be performed in the pressing load test in which the is arranged.

Further, a plurality of semiconductor ICs
When the chip 4 is built-in, the individual push load test mechanism units 27 are adjusted according to the position of the semiconductor IC chip 4.
1 and 272, a plurality of convex indenters 311 and 312 are arranged, or the pushing load test mechanism unit is vertically arranged so that a pushing load can be applied from both the front and back sides of each semiconductor IC chip 4. It may be configured to be arranged.

The individual push load test mechanism units 2
At 71, 272, a mechanism may be provided to make the positions of the convex indenters 311, 312 movable within the dimensional range of the card type substrate 1. This is an effective function to cope with a test of the card type substrate 1 in which the position of the built-in semiconductor IC chip 4 is different.

As described above, even when the pressing direction of the indenter is changed by the pressing load test apparatus of the third embodiment, the insertion and removal of the card type substrate 1 from the jig by a manual operation or a complicated transport mechanism can be performed. , And the insertion and removal of the card type substrate 1 from one push load test mechanism unit 271 to another push load test mechanism unit 272 is reliably performed by a simple method of dropping by its own weight.
It is possible to realize a high-throughput pressing load test apparatus for the card-type substrate 1 that can continuously perform the pressing load test on the card-type substrate 1.

Although the invention made by the present inventor has been specifically described based on the embodiment, the present invention is not limited to the above embodiment, and various modifications can be made without departing from the gist of the invention. Needless to say, there is.

[0076]

According to the test apparatus of the present invention, the insertion and removal of a card type substrate from one bending test mechanism unit to another bending test element unit are automatically performed by a simple method.
The effect that the bending test of the card type substrate can be continuously performed is obtained.

Further, according to the test apparatus of the present invention, the insertion and removal of the card-type substrate from the test mechanism unit for applying pressure in one direction to the test mechanism unit for applying pressure in the other direction can be performed by a simple method. The effect is obtained that the test can be automatically performed and the pressing load test of the card type substrate can be continuously performed.

[Brief description of the drawings]

FIG. 1 is a block diagram showing an example of the overall configuration of a card-type substrate bending test apparatus as an embodiment of the test apparatus of the present invention.

FIGS. 2A to 2D are perspective views illustrating in more detail an example of the configuration of a card-type substrate bending test apparatus as an embodiment of the test apparatus of the present invention.

FIGS. 3A to 3D are longitudinal sectional views illustrating in more detail a modified example of a card-type substrate bending test apparatus as an embodiment of the test apparatus of the present invention.

FIG. 4 is a side view showing an example of an operation state of a modified example of the card-type substrate bending test apparatus as one embodiment of the test apparatus of the present invention.

FIG. 5 is a block diagram showing an example of an overall configuration of a card-type substrate pressing load testing device as another embodiment of the testing device of the present invention.

FIG. 6 is a side view illustrating in more detail an example of the overall configuration of a card-type substrate pressing load test apparatus as another embodiment of the test apparatus of the present invention.

FIG. 7 is a cross-sectional view showing an example of a configuration of a card-type substrate provided for the test apparatus of the present invention.

FIG. 8 is a side view showing an example of a configuration of a card-type substrate bending test apparatus according to a reference technique of the present invention.

FIG. 9 is a side view showing an example of a configuration of a card-type substrate pressing load test apparatus according to a reference technique of the present invention.

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 1 ... Card type board, 2 ... Circuit board material, 3 ... Conductor film, 3a
... Antenna coil part, 3b ... Connection terminal, 3c ... Wiring part, 4 ... Semiconductor IC chip, 5 ... Surface film, 6 ...
Adhesive layer, 9 insertion unit, 10 recovery unit, 11
... convex jig, 12 ... concave jig, 13 ... holding back plate, 14 ...
Push plate, 15: spring, 16: concave curved surface forming member,
17: drive mechanism, 71-74: bending test mechanism unit,
71A to 74A: bending test mechanism unit, 81 to 84:
Holding plate, 111-114: convex jig, 115: semi-cylindrical body, 116: semi-cylindrical body, 121-124: concave jig,
121a to 124a: guide groove, 131 to 134: concave pressing portion, 208: insertion unit, 209: recovery unit, 210: drop guide plate, 211: convex indenter, 21
4: Card-type substrate holding side plate, 215: Drive mechanism, 271
... Push load test mechanism unit, 272 ... Push load test mechanism unit, 311 ... Convex indenter, 312 ... Convex indenter, 3
15: drive mechanism, 321: holding back plate, 322: holding back plate, 331: holding lower plate, 332: holding lower plate.

 ──────────────────────────────────────────────────続 き Continuing on the front page (72) Inventor Masao Sekihata 1 Horiyamashita, Hadano-shi, Kanagawa Prefecture In-house Enterprise Server Division, Hitachi Corporation (72) Inventor Atsuko Shimosu 1-ori Horiyamashita, Hadano-shi, Kanagawa Hitachi Server Enterprise Server Division (72) Inventor Hiromi Tozaki 1 Horiyamashita, Hadano City, Kanagawa Prefecture Hitachi Corporation Enterprise Server Division (72) Inventor Nobuyoshi Sato 1 Horiyamashita, Hadano City, Kanagawa Prefecture Hitachi, Ltd. In the Enterprise Server Division of the Manufacturing Company (72) Inventor Hiroshi Kojima 1 Horiyamashita, Hadano-shi, Kanagawa Prefecture Within Nichi Information Technology Co., Ltd. (72) Inventor Takanao Nakamura 1st Horiyamashita, Hadano-shi, Kanagawa Prefecture, Ltd. Within the Prize Server Division (72) Inventor Tadashi Tomita 1-Horiyamashita, Hadano-shi, Kanagawa F-term (reference) 2G061 AA02 AA07 AB01 BA02 BA03 BA04 BA05 CB01 CC11 DA01 DA14 EA02 EA03 5B035 BA00 5B058 KA28

Claims (5)

[Claims] 1. A test device for sandwiching a card-type substrate between a convex jig and a concave jig having a curved surface with an arbitrary curvature and performing bending deformation on the card-type substrate, the test device being arranged in a substantially vertical direction, A plurality of test units that apply the bending deformation in different directions to the card-type substrate, and a moving mechanism that sequentially moves between the plurality of test units by the weight of the card-type substrate. And test equipment. 2. The test apparatus according to claim 1, wherein the card-type substrate is installed vertically, and the long side of the card-type substrate is along a curved surface of a convex jig having a predetermined curvature. A first bending test mechanism unit that bends the card-type substrate, and a long side of the card-type substrate is a convex jig having a predetermined curvature in a direction opposite to that of the first bending test mechanism unit. A second bending test mechanism unit that bends the card-type substrate along a curved surface, and the card-type substrate is installed vertically, and a short side of the card-type substrate is along a curved surface of a convex jig having a predetermined curvature. A third bending test mechanism unit that bends the card-type substrate, and the card-type substrate is installed vertically, and a short side of the card-type substrate has a predetermined curvature in a direction opposite to that of the third bending test mechanism unit. Along the curved surface of the convex jig A fourth bending test mechanism unit for bending the card-type substrate, which is disposed substantially vertically, and a path from the uppermost first bending test mechanism unit to the lowermost fourth bending test mechanism unit. A test wherein each of the plurality of first, second, third and fourth bending test mechanism units is successively subjected to free fall of the card-type substrate along the line. apparatus. 3. The test apparatus according to claim 1, wherein the concave jig facing the convex jig has a concave curved surface whose shape changes according to the convex curved surface of the convex jig. A curved surface mechanism, wherein the card-type substrate is sandwiched between the convex jig and the concave jig, and the concave jig is deformed so as to follow the curvature of the convex jig. 1st structure which gives the bending deformation of the curvature of a fixture to the said card type board | substrate, In the said 1st structure, the said convex-shaped jig is provided with several convex surfaces from which a curvature differs mutually, and one of several convex surfaces is provided. Selected so as to face the concave jig, sandwich the card-type substrate between the convex jig and the concave jig, so that the concave jig follows the curvature of the convex surface of the convex jig. By deforming, a bending deformation of a curvature of the convex jig is given to the card type substrate. Configuration, a test apparatus which comprises at least one of. 4. The card type substrate is sandwiched between a flat member supporting the back surface of the card type substrate and a convex indenter opposed to the flat member via the card type substrate, thereby forming one of the card type substrates. A test device for performing a pressing test for pressing a portion, each of which comprises a plurality of test units each including the flat member and the indenter arranged in a substantially vertical direction, and a plurality of the test units each having its own weight of the card-type substrate. Move sequentially between units,
A test apparatus wherein the pressing test is performed in each of the test units. 5. The test apparatus according to claim 4, wherein the plurality of test units are arranged in a substantially vertical direction with respect to the first and second main surfaces of the card-type substrate, which face each other. An operation of arranging the indenters in positions in which the positional relationship of the indenters is opposite to each other and alternately pressing the indenters against different first and second main surfaces of the card-type substrate in each of the test units is performed. A test apparatus characterized in that it is performed.