DE10222211B4 - Method for testing the brittle fracture behavior of smart cards - Google Patents

Method for testing the brittle fracture behavior of smart cards Download PDF

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Publication number
DE10222211B4
DE10222211B4 DE2002122211 DE10222211A DE10222211B4 DE 10222211 B4 DE10222211 B4 DE 10222211B4 DE 2002122211 DE2002122211 DE 2002122211 DE 10222211 A DE10222211 A DE 10222211A DE 10222211 B4 DE10222211 B4 DE 10222211B4
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Prior art keywords
chip card
brittle fracture
testing
fracture behavior
chip
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Expired - Fee Related
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DE2002122211
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German (de)
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DE10222211A1 (en
Inventor
Thies Janczek
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Idemia Germany GmbH
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Morpho Cards GmbH
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Priority to DE2002122211 priority Critical patent/DE10222211B4/en
Priority to PCT/EP2003/005025 priority patent/WO2003098193A1/en
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    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N3/00Investigating strength properties of solid materials by application of mechanical stress
    • G01N3/32Investigating strength properties of solid materials by application of mechanical stress by applying repeated or pulsating forces
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N2203/00Investigating strength properties of solid materials by application of mechanical stress
    • G01N2203/0014Type of force applied
    • G01N2203/0023Bending
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N2203/00Investigating strength properties of solid materials by application of mechanical stress
    • G01N2203/0058Kind of property studied
    • G01N2203/006Crack, flaws, fracture or rupture
    • G01N2203/0067Fracture or rupture
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N2203/00Investigating strength properties of solid materials by application of mechanical stress
    • G01N2203/02Details not specific for a particular testing method
    • G01N2203/026Specifications of the specimen
    • G01N2203/0262Shape of the specimen
    • G01N2203/0278Thin specimens
    • G01N2203/0282Two dimensional, e.g. tapes, webs, sheets, strips, disks or membranes
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N2203/00Investigating strength properties of solid materials by application of mechanical stress
    • G01N2203/02Details not specific for a particular testing method
    • G01N2203/06Indicating or recording means; Sensing means
    • G01N2203/067Parameter measured for estimating the property
    • G01N2203/0682Spatial dimension, e.g. length, area, angle

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  • Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Biochemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Investigating Strength Of Materials By Application Of Mechanical Stress (AREA)

Abstract

Verfahren zum Testen des Sprödbruchverhaltens von Chipkarten, dadurch gekennzeichnet, daß die zu testende Chipkarte (7) auf Aufnahmeschuhe (6) aufgelegt und mittels eines mittig unter der zu testenden Chipkarte (7) angeordneten Elementes (8) vorgespannt wird und daß die Chipkarte (7) stoßartig in einem Zeitfenster von 200–1000 ms mit einer Biegebelastung beaufschlagt wird, wobei eine Biegung der Chipkarte (7) in einem Winkelbereich von 150° bis 180° erfolgt.Method for testing the brittle fracture behavior of chip cards, characterized in that the chip card (7) to be tested is placed on receiving shoes (6) and biased by means of an element (8) arranged centrally under the chip card (7) to be tested, and in that the chip card (7 ) is applied in a jerky manner in a time window of 200-1000 ms with a bending load, wherein a bend of the chip card (7) takes place in an angular range of 150 ° to 180 °.

Description

Testverfahren und TestmaschineTest procedure and test machine

Die Erfindung betrifft ein Verfahren zum Testen des Sprödbruchverhaltens. Die Hersteller von Chipkarten sind bemüht, ihren Kunden ein höchstmögliches Maß an Sicherheit bei der Benutzung von Chipkarten zu bieten. Absolut ausgeschlossen werden muß ein sogenannter Sprödbruch der Chipkarten, da entstehende Splitter der Chipkarte den Benutzer verletzen können. Zwar gibt es bereits Maschinen, die Chipkarten auf Dauerbelastung z. B. Biegung prüfen, jedoch fehlt es an einem Verfahren das Aussagen über das Sprödbruchverhalten von Chipkarten liefert. Auch eine Vorrichtung zur Ausführung eines solchen Verfahrens ist dem Stand der Technik nicht entnehmbar. Das Ganze wird noch dadurch erschwert, dass das Sprödbruchverhalten bei Chipkarten nicht nur eine Materialeigenschaft ist, sondern durch weitere Sachverhalte verändert wird: Eine Chipkarte mit implantiertem Chipmodul hat z. B. ein anderes Sprödbruchverhalten als eine Karte ohne Chipmodul. Der Chipkartenhersteller benötigt reproduzierbare Aussagen zum Sprödbruchverhalten der Chipkarten.The invention relates to a method for testing brittle fracture behavior. Chip card manufacturers strive to provide their customers with the highest possible level of security when using smart cards. Absolutely excluded must be a so-called brittle fracture of the smart cards, as resulting fragments of the chip card can hurt the user. Although there are already machines that chip cards on continuous load z. B. Bend check, but lacks a method that provides information about the brittle fracture behavior of smart cards. A device for carrying out such a method can not be removed from the prior art. The whole thing is made even more difficult by the fact that the brittle fracture behavior in smart cards is not just a material property, but is changed by other circumstances: A chip card with implanted chip module has z. B. another brittle fracture behavior than a card without chip module. The chip card manufacturer needs reproducible statements on the brittle fracture behavior of the chip cards.

Aus dem ISO-Standard "International Standard ISO/IEC 10373-1:1998, First Edition 1998-12-15: Identification cards – Test methods – Part1: General characteristic tests" sind ein Prüfverfahren und eine Testvorrichtung zum Prüfen der Biegefestigkeit von Ausweiskarten bekannt, bei dem die Karten zwischen zwei Backen eingespannt werden, von denen einer beweglich ausgelegt ist. Eine Vorspannung der zu prüfenden Karte wird ebenfalls mittels der Backen vorgenommen. Eine Biegung der Karten erfolgt mit einer Frequenz von 0,5 Hz.From the ISO standard "International Standard ISO / IEC 10373-1: 1998, First Edition 1998-12-15: Identification Cards - Test Methods - Part 1: General characteristic tests" a test method and a test device for checking the flexural strength of ID cards are known in which the cards are clamped between two jaws, one of which is designed to be movable. A bias of the card to be tested is also made by means of the jaws. A bending of the cards takes place with a frequency of 0.5 Hz.

Ferner ist aus US 5,178,017 A eine Testanordnung zur Messung der Steifigkeit flexibler Materialien bekannt, welche drei Rollen aufweist, zwischen die das zu testende Material eingespannt wird. Die beiden äußeren Rollen einerseits und die mittlere Rolle andererseits sind dabei gegeneinander beweglich, um den Prüfling zu biegen.Furthermore, it is off US 5,178,017 A a test arrangement for measuring the stiffness of flexible materials known, which has three roles, between which the material to be tested is clamped. The two outer rollers on the one hand and the middle roller on the other hand are movable relative to each other to bend the specimen.

Aus DE 196 20 550 C1 war ein Verfahren zum Testen der elektrischen Funktionstüchtigkeit einer kontaktbehafteten Chipkarte bekannt, bei dem eine Durchbiegung der Chipkarte über der Kartenlängsachse von maximal 10 mm und Durchbiegung über der Kartenquerachse von maximal 20 mm vorgenommen wird, um festzustellen, ob die Biegebelastung zu Bonddrahtbrüchen und/oder zu Drahtabrissen von den Kontaktflächen oder dem Halbleiterbaustein führt. Die Periodendauer eines Biegezyklus beträgt typischerweise 2 sec..Out DE 196 20 550 C1 was a method for testing the electrical performance of a contact chip card is known in which a deflection of the chip card over the card axis of maximum 10 mm and deflection over the card transverse axis of a maximum of 20 mm is made to determine whether the bending load to bond wire breaks and / or Wire breaks from the contact surfaces or the semiconductor device leads. The period of a bending cycle is typically 2 sec.

Aufgabe der Erfindung ist es daher, ein Testverfahren zu schaffen, das eine reproduzierbare Aussage zum Sprödbruchverhalten von Chipkarten ermöglicht.The object of the invention is therefore to provide a test method that allows a reproducible statement about the brittle fracture behavior of smart cards.

Erfindungsgemäß wird diese Aufgabe dadurch gelöst, dass Chipkarten mit ausreichend hoher Geschwindigkeit um eine ihrer Achsen gebogen werden. Vorzugsweise geschieht diese Biegung um die Querachse. Besonders vorteilhaft ist ein Biegewinkel zwischen 150° und 180°. According to the invention, this object is achieved in that chip cards are bent around one of their axes at a sufficiently high speed. Preferably, this bend is done around the transverse axis. Particularly advantageous is a bending angle between 150 ° and 180 °.

Um eine in einer Richtung kontrollierte Biegung erzeugen zu können wird die Chipkarte durch ein unter der Karte angebrachtes Element in einer Richtung vorgebogen, so dass die Chipkarte unter Belastung nicht zur anderen Seite ausbrechen kann.In order to be able to produce a bend controlled in one direction, the chip card is pre-bent in one direction by an element placed under the card, so that the chip card can not break out to the other side under load.

Anhand der Zeichnungen soll die Erfindung näher erläutert werden. Zum besseren Verständnis wurden Gehäuseteile, die die beweglichen Teile der erfindungsgemäßen Vorrichtung in der jeweiligen Ansicht überdecken, weggelassen.With reference to the drawings, the invention will be explained in more detail. For a better understanding, housing parts which cover the moving parts of the device according to the invention in the respective view have been omitted.

Es zeigen:Show it:

1 die Vorderansicht einer bevorzugten Ausführung einer erfindungsgemäßen Testmaschine bei Versuchsbeginn, 1 the front view of a preferred embodiment of a test machine according to the invention at the start of the experiment,

2 die Draufsicht einer erfindungsgemäßen Testmaschine bei Versuchsbeginn, 2 the top view of a test machine according to the invention at the beginning of the test,

3 die Vorderansicht einer erfindungsgemäßen Testmaschine bei Versuchsausführung, 3 the front view of a test machine according to the invention in trial execution,

4 die Draufsicht einer erfindungsgemäßen Testmaschine bei Versuchsausführung. 4 the top view of a test machine according to the invention in trial execution.

Um Verletzungen zu vermeiden ist in einer bevorzugten Ausführungsform die gesamte Prüfvorrichtung von einem Gehäuse (3) umgeben. Zu Beginn des Versuches (1, 2) wird der Verschlußdeckel (2) geöffnet und die zu testende Chipkarte (7) auf die Aufnahmeschuhe (6) der Pneumatik-(1) oder der Hydraulikzylinder oder der elektromagnetisch betriebenen Zylinder aufgelegt. Ein mittig unter der Karte positioniertes Element (8) sorgt dafür, daß die Karte (7) schon in der Ruhelage in der vorgesehenen Richtung verbogen bzw. vorgespannt wird. Das Verschließen des Verschlußdeckels (2) löst das stoßartige Ausfahren der Pneumatikzylinder aus; d. h. die Kolben (4), Schubstangen (5) und Aufnahmeschuhe (6) der Pneumatikzylinder (1) werden um einen festgelegten Weg verfahren, wodurch die zu testende Chipkarte (7) um einen festgelegten Winkel verbogen wird (3, 4). Das nachfolgende Wiederöffnen des Verschlußdeckels (2) bewirkt das Wiedereinfahren der Zylinder. Das Testergebnis liegt in einer qualitativen Aussage der Form gut und Ausschuß vor. Zerbirst die Karte, so ist sie Ausschuß; verformt sie sich plastisch so ist sie gut. Die Verfahrensparameter (Verfahrgeschwindigkeit, Aufnahmegeometrie der Aufnahmeschuhe, Biegewinkel ...) sind konstant zu halten, um eine Vergleichbarkeit der Tests zu erhalten. Die Tests finden vorzugsweise sowohl vor der Produktion als auch produktionsbegleitend statt. In order to avoid injuries, in a preferred embodiment the entire testing device is surrounded by a housing ( 3 ) surround. At the beginning of the experiment ( 1 . 2 ) the closure lid ( 2 ) and the chip card to be tested ( 7 ) on the shoes ( 6 ) of pneumatic ( 1 ) or the hydraulic cylinder or the electromagnetically operated cylinder. An element positioned centrally under the map ( 8th ) ensures that the card ( 7 ) is bent or biased already in the rest position in the intended direction. Closing the cap ( 2 ) triggers the jerky extension of the pneumatic cylinder; ie the pistons ( 4 ), Push rods ( 5 ) and take-up shoes ( 6 ) the pneumatic cylinder ( 1 ) are traversed by a predetermined path, whereby the chip card to be tested ( 7 ) is bent by a fixed angle ( 3 . 4 ). The subsequent reopening of the closure lid ( 2 ) causes the re-entry of the cylinder. The test result is in a qualitative statement of form good and scrap. Break the card, so it's committee; she deforms plastically so she is good. The process parameters (travel speed, pick-up geometry of the pick-up shoes, bending angle ...) must be kept constant to ensure comparability of the tests. The tests preferably take place both before production and during production.

Claims (1)

Verfahren zum Testen des Sprödbruchverhaltens von Chipkarten, dadurch gekennzeichnet, daß die zu testende Chipkarte (7) auf Aufnahmeschuhe (6) aufgelegt und mittels eines mittig unter der zu testenden Chipkarte (7) angeordneten Elementes (8) vorgespannt wird und daß die Chipkarte (7) stoßartig in einem Zeitfenster von 200–1000 ms mit einer Biegebelastung beaufschlagt wird, wobei eine Biegung der Chipkarte (7) in einem Winkelbereich von 150° bis 180° erfolgt.Method for testing the brittle fracture behavior of chip cards, characterized in that the chip card to be tested ( 7 ) on pick-up shoes ( 6 ) and by means of a center under the chip card to be tested ( 7 ) arranged element ( 8th ) and that the chip card ( 7 ) is applied in a jerky manner in a time window of 200-1000 ms with a bending load, wherein a bending of the chip card (7) takes place in an angular range of 150 ° to 180 °.
DE2002122211 2002-05-16 2002-05-16 Method for testing the brittle fracture behavior of smart cards Expired - Fee Related DE10222211B4 (en)

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Application Number Priority Date Filing Date Title
DE2002122211 DE10222211B4 (en) 2002-05-16 2002-05-16 Method for testing the brittle fracture behavior of smart cards
PCT/EP2003/005025 WO2003098193A1 (en) 2002-05-16 2003-05-14 Testing the brittle fracture behavior of chip cards under bending load

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DE2002122211 DE10222211B4 (en) 2002-05-16 2002-05-16 Method for testing the brittle fracture behavior of smart cards

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WO2007143094A2 (en) * 2006-06-02 2007-12-13 Mts Systems Corporation Measurement of properties of thin specimens based on experimentally acquired force-displacement data
EP1980835A1 (en) * 2007-04-11 2008-10-15 ETH Zürich Appartus for measuring bending stiffness
FR3017712B1 (en) * 2014-02-14 2016-03-25 Oberthur Technologies METHOD OF MEASURING THE RESISTANCE OF THE ATTACHES CONNECTING A CARD TO ITS SUPPORT AND TOOL FOR IMPLEMENTING SAID METHOD
CN105222978B (en) * 2015-11-05 2018-07-03 哈尔滨工业大学 A kind of impact test weighted platform for applying large axial force
CN108709816B (en) * 2018-03-29 2021-04-06 北京工业大学 Ultra-thin glass flexibility test device and method
CN109142089A (en) * 2018-09-11 2019-01-04 芜湖美威包装品有限公司 Packing board bending test box
CN109060556B (en) * 2018-09-17 2020-12-08 嘉兴管通机电科技有限公司 Anti detection device that buckles of five metals panel
CN113390625B (en) * 2021-08-17 2021-12-07 中国航天空气动力技术研究院 Front edge bending test tool and method

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JP2000131207A (en) * 1998-10-27 2000-05-12 Hitachi Chem Co Ltd Card bending testing method and machine
JP2000321188A (en) * 1999-05-10 2000-11-24 Hitachi Ltd Testing device
WO2001086252A1 (en) * 2000-05-11 2001-11-15 Gemplus Reliability and fatigue control in strip-line circuits
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DE1258629B (en) * 1962-03-15 1968-01-11 Kloeckner Werke Ag Method for determining the tendency of metal samples to crack
US5178017A (en) * 1991-09-30 1993-01-12 Chicago Rawhide Manufacturing Company Test fixture for measuring stiffness in flexible materials
US5424634A (en) * 1994-02-18 1995-06-13 International Business Machines Corporation Non-destructive flex testing method and means
DE69520634T2 (en) * 1994-09-30 2001-11-29 France Telecom, Paris Method and device for mechanically checking a chip card
US5606134A (en) * 1995-06-21 1997-02-25 Green Bay Packaging, Inc. Score bend testing apparatus and method
DE19616137A1 (en) * 1996-04-11 1997-10-16 Mannesmann Ag Method and device for testing a hollow body section
DE19620550C1 (en) * 1996-05-22 1997-10-16 Orga Kartensysteme Gmbh Chip card function testing method
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JP2000321188A (en) * 1999-05-10 2000-11-24 Hitachi Ltd Testing device
WO2001086252A1 (en) * 2000-05-11 2001-11-15 Gemplus Reliability and fatigue control in strip-line circuits

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Norm ISO/IEC 10373-1 First edition 1998-12-15. Identification cards - Test methods - Part 1: General characteristics tests *

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