JP2000314441A - Tuning mass type dynamic absorber - Google Patents

Abstract

PROBLEM TO BE SOLVED: To eliminate the need for measurement of natural vibration of an object to be damped before installation of a tuning mass type dynamic absorber constituted, such that it is mounted on the object to be damped and vibrated at a period corresponding to natural vibration of the object to be damped. SOLUTION: An arm 3, oscillated along the vibration direction of an object 5 to be damped, is mounted on the object 5 to be damped and mass 8 is mounted on its tip part, and the one end of a leaf spring 6 is fixed in parallel to the arm 3 with a given distance therebetween. A coupling member 7 to couple together the leaf spring and the arm is located between the leaf spring 6, and the arm 3 and after the coupling position of the coupling member 7 is set to a position, where the mass 8 is vibrated at a vibration period corresponding to natural vibration of the object 5 to be damped, the arm 3 and the leaf spring 6 are coupled together by the coupling member 7.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a tunable dynamic absorber having a spring and a mass body for absorbing vibration of an object to be damped, and more particularly to a tunable dynamic absorber using a leaf spring as the spring. The present invention relates to a type dynamic absorber.

[0002]

2. Description of the Related Art As a technique for damping the vibration of an object to be damped, a mass (mass body) is arranged at the antinode of the vibration of the object to be damped, and the vibration is applied by the mass. Stopper, increase the rigidity of the vibration surface of the object to be damped with reinforcing materials such as ribs and stiffeners, shift the resonance point from the normal frequency band, and use a dynamic absorber consisting of a spring and a mass body for the object to be damped. Attempts have been made to mount and control the vibration by vibration of the mass body. However, any of the techniques requires measurement of the natural frequency of an object to be damped in advance for good damping, and is not suitable as a large-structure damping device. Also, various dynamic absorbers in which vibration is attenuated by an oil damper are known. However, special use is required for use in a clean environment such as a clean room.

[0003] Therefore, in a mass dynamic absorber in which a mass body is vibrated in synchronization with the natural frequency of the object to be damped, there is a technical problem to be solved in order to eliminate the need to measure the natural frequency of the object to be damped. A problem arises, and a first object of the present invention is to solve this problem. Another object is to enable damping regardless of the oil damper.

[0004]

SUMMARY OF THE INVENTION The present invention has been proposed to achieve the above object, and is mounted on a vibration damping object and vibrates at a period corresponding to the natural frequency of the vibration damping object. In the tuned mass type dynamic absorber configured as
An arm that swings along the vibration direction of the object to be damped is provided on the object to be damped, a mass body is attached to the tip thereof, and a leaf spring is fixed at one end in parallel with the arm at a predetermined interval. A coupling member is provided between the leaf spring and the arm for coupling the two to each other, and the mass body vibrates at a frequency of vibration corresponding to the natural frequency of the vibration damping object. A tuned mass dynamic absorber configured to couple the arm and the leaf spring by a joining member is provided, and the vibration is attached to a vibration damping object at a period corresponding to a natural frequency of the vibration damping object. In the tuned mass-type dynamic absorber configured to perform, the arm vibrating along the vibration direction of the vibration damping object is fixed to the vibration damping object at one end, and a mass body is attached to the tip thereof, A leaf spring is fixed at one end in parallel with the arm at a predetermined distance, and further, A coupling member for coupling the two is provided between the arm and the arm by the joining member at a position where the mass body vibrates at a period of vibration corresponding to the natural frequency of the object to be damped. Provided is a tuned mass dynamic absorber configured to couple with a leaf spring, and further configured to be attached to an object to be damped and to vibrate at a period corresponding to a natural frequency of the object to be damped. In the tuned mass-type dynamic absorber, a pair of arms is provided on the left and right sides of the vibration damping object, which is constituted by a leaf spring and oscillates in the vibration direction of the vibration damping object, and a mass body is provided at each of the arms. Attachment, further, a leaf spring is fixed at one end in parallel with each arm at a predetermined interval, and a coupling member for coupling the both is interposed between each leaf spring and each arm. Is a position where the object vibrates at a period of vibration corresponding to the natural frequency of the vibration damping object. And it provides a tuned mass type dynamic absorber that is configured to couple the respective arms and the plate springs by the joining member.

In the tuned mass dynamic absorber, a leaf spring is further extended toward the mass body, and an extended end of the leaf spring and a facing surface of the mass body are joined via a viscoelastic body. Providing a tuned mass-type dynamic absorber, and providing a tuned mass-type dynamic absorber in which a spring constant on an extension end side of the leaf spring is set lower than a spring constant on the vibration suppression target side, The coupling member is formed of a magnet, and one of the magnetic poles is fixed to one of the leaf spring or the arm, and is coupled to the other of the leaf spring or the arm by the magnetic force of the other magnetic pole. A tuned mass dynamic vibration absorber is provided.

[0006]

FIG. 1 is a block diagram showing an embodiment of the present invention.
This will be described in detail with reference to FIGS.

In FIG. 1, reference numeral 1 denotes a tunable dynamic absorber,
The fulcrum 4 of the arm 3 of the pendulum 2 is pivotally supported along the vibration direction of the vibration damping object 5, and a leaf spring is attached to the vibration damping object 5 to adjust the vibration period of the pendulum 2. 6, and is connected between the leaf spring 6 and the arm 3 of the pendulum 2 with a connecting member 7 interposed therebetween. Of course, in this case, the spring constant determined by the length, the second moment of area and the Young's modulus of the leaf spring 6 and the mass of the mass body 8 attached to the tip of the arm 3 are set in advance in a predetermined vibration band. It is determined correspondingly.

The leaf spring 6 is separated from the arm 3 by a predetermined distance. When the leaf spring 6 is coupled to the arm 3 by the coupling member 7, the vibration damping object is parallel to the arm 3. 5 is fixed at one end. For this reason, if the connecting point of the connecting member 7 is moved between one end and the other end of the leaf spring 6,
The cycle of the vibration of the mass body 2 can be changed, and the coupling point of the coupling member 7 can be set so that the cycle of the vibration of the pendulum 2 is synchronized with the natural frequency of the vibration damping target.
Therefore, the measurement of the natural frequency of the vibration damping object 5 before attaching the dynamic absorber to the vibration damping object 5 can be eliminated.

In this case, in the dynamic absorber 1, the arm 3 of the pendulum 2 is constituted by a leaf spring, and as shown in FIG. 2, the arm 3 is fixed to one end of the vibration damping object 5, and The arm 3 and the leaf spring 6 may be rigidly connected by the connecting member 7.

In this case, the spring constant for the mass body 8 increases, and it becomes possible to force the arm 3 and the leaf spring 6 from bending deformation to translational deformation while absorbing a difference in bending trajectory between each other.

When the arm 3 is formed of a leaf spring, the leaf spring 6 is extended toward the mass body 8 as shown in FIG. And the plate spring 6 and the mass body 8 may be connected by the viscoelastic body 9. In such a case, when the mass body 8 vibrates, a shearing deformation force corresponding to a difference between the trajectory of the elastic bending deformation of the arm 3 and the leaf spring 6 acts on the viscoelastic body 9, and the viscoelastic body 9 is deformed. Sliding frictional deformation and shearing deformation occur according to the force. For this reason, the energy accompanying the deformation is absorbed, and the vibration is attenuated. The viscoelastic body may be a gel material or a low resilience rubber having a high energy absorption effect, or a viscoelastic body formed by sequentially laminating rubber and a steel plate.

FIG. 4 shows the natural frequency versus the amplitude characteristic of the vibration damping object when a gel material is used as the viscoelastic body. As shown in the figure, when the leaf spring and the mass body are directly connected without using the viscoelastic body (A), the amplitude of the vibration damping object increases with a specific frequency region interposed therebetween. In the case of (B), the amplitude is greatly reduced, and the variation width of the amplitude with respect to the natural frequency is reduced as a whole.

In order to obtain a remarkable damping effect of the viscoelastic body 9 even with respect to vibrations, especially microvibrations, as shown in FIG. The bending rigidity is reduced, and the vibration period of the mass body 8 is adjusted on the fixed end side of the leaf spring 6, or the width on the tip side is reduced, or the width and thickness on the tip side are adjusted. May be reduced to increase the rigidity in the shearing direction and decrease the rigidity in the bending direction. Of course, the damping effect of the viscoelastic body 9 against minute vibrations may be remarkable by setting the bending rigidity of one of the arm 3 and the leaf spring 6 low.

In order to eliminate the torsional moment with respect to the object 5 to be damped, for example, the dynamic absorber 1c is connected as shown in FIG.
As shown in FIG. Of course, the dynamic absorbers 1 and 1c having the structure shown in FIGS. 1 to 3 may be arranged symmetrically to the left and right as described above to cancel the torsional moment acting on the vibration damping object 5.
As shown in FIG. 7, a pair of the leaf springs 6 are provided with the arm 3 interposed therebetween, and one end of each of the leaf springs 6 is fixed to the vibration damping object 5 at one end. The connecting member 7 may be provided between the arm 6 and the arm 3 and connected by the connecting member 7. In such a case, it is possible to further widen the adjustment range of the period.

FIGS. 8 to 10 show an embodiment of the connecting member. As shown in FIG. 8, the coupling member 7 may be formed of a magnet, and one of the magnetic poles may be fixed to the arm 3 or the leaf spring 6. In that case, slip friction occurs between the leaf spring 6 and the coupling member 7 due to the shearing deformation force during the elastic bending deformation of the leaf spring 6 at the time of absorbing vibration, and damping due to this friction is achieved. Become. Therefore, it is possible to adjust the joining force by setting the magnetic force of the coupling member 7 and adjust the damping degree. However, if the magnet has a high friction coefficient or an excessive magnetic force, the friction coefficient with the coupling member is too large, It is also assumed that a delay occurs in the response.

In such a case, as shown in FIG. 9, a sliding layer having a small friction coefficient (for example, a sliding layer (for example,
Resin sheet 9) may be applied, and the degree of attenuation may be adjusted by the slip layer. In such a case, energy can be absorbed by the deviation, and a response delay of vibration absorption can be eliminated. In order to further improve the energy absorption efficiency by the magnet, the arm 3 or the leaf spring 6 may be magnetized in advance.

In order to reduce the coefficient of friction, FIG.
As shown in FIG.
The coupling member 7 is constructed by attaching a magnet 12 to the rotating shaft 11 and changing the magnetic pole by rotating a knob 13 integrated with the rotating shaft 11.
3, the magnet 12 may be switched between the working position and the non-working position.

Of course, in each embodiment, the joining force and the joining area of the joining member 7 to the arm 3 and the leaf spring 6 and the joining force and the joining area to the leaf spring 7 and the mass body 8 are configured to be variable so that the joining condition can be changed. May be used to change the vibration frequency or the damping coefficient.

FIG. 11 shows an embodiment of a joint structure between the mass body 8 and the viscoelastic body 9. FIGS. 12 and 13 show an embodiment of a joint structure between the arm 3 and the leaf spring 6 by the joint member 7. Is shown.

As shown in FIG. 11, a pair of low-rebound rubber plates 9A and 9B having a predetermined coefficient of friction are used as viscoelastic materials, respectively.
After sequentially placing the low resilience rubber 9B, the saddle 40
Is mounted, and both ends of the saddle 40 are fixed to both ends of the upper surface of the mass body 8 with bolts. Therefore, the rubber hardness, thickness, and shape of the low rebound rubbers 9A and 9B are optimally set,
By adjusting the degree of screwing of the pair of bolts for fixing the saddle 40, the resistance of the low-rebound rubber to the leaf spring 6 is adjusted, and the frictional force and contact area between them are adjusted, the damping coefficient of the viscoelastic body 8 is increased. Can be adjusted optimally.

As shown in FIG. 12, a joining member main body 7A in which the joining member 7 is interposed between the leaf spring 6 and the arm 3 is provided.
And are disposed on the arm 3 side and the leaf spring 6 side with the leaf spring 6 interposed therebetween, and are fastened to each other by bolts (not shown).
It is composed of a leaf spring 6 and a holding body 7B for holding the arm 3. If the resistance of the arm 3 and the leaf spring 6 is adjusted by adjusting the degree of tightening of the pair of bolts, and the sliding friction force is adjusted, a damping effect due to the slip can be obtained.

Further, as shown in FIG. 13, a through-hole 41 passing through the axis is provided in the joining member main body 7A, and a coil spring 42 for resiliently projecting the arm 3 and the leaf spring 6 is inserted into the through-hole 41 so as to be elastic. If it is released, a wide range of sliding friction can be adjusted. Further, if a viscoelastic body (not shown) made of low-rebound rubber or the like is inserted instead of the coil spring 42, the sliding friction and the damping due to the shear deformation can be obtained. Becomes possible. Of course, as shown in FIG. 12 and FIG. 13, the damping degree may be adjusted by sandwiching the leaf spring 6 and the arm 3 between the pair of low-rebound rubbers 9A and 9B.

(Embodiment) An embodiment of the present invention applied to a clean room for manufacturing a semiconductor and a vibration damping device of a semiconductor manufacturing apparatus will be described below in detail with reference to FIGS.

FIG. 14 shows a clean room 14, in which a joist 16 is laid at predetermined intervals on a floor beam 15 of the clean room 14, and a floor material 17 made of punched metal is laid on the joist 16 to ensure air permeability. I have. And
Ventilation duct (not shown) communicating with ceiling 18 and underfloor 19
Are formed, and a filter 20 for purifying the atmosphere is installed in the duct.
Clean the atmosphere sucked from 9 and clean room 1
Returned to 4.

As shown in FIG. 15, a platen 21 is fixed to the joist 16 in the clean room 14, and a semiconductor manufacturing apparatus 22 is fixedly supported on the platen 21, and the lower surface of the platen 21 or the platen is fixed. One or two or more dynamic absorbers 24 are attached to the joist 16 supporting the board 21 to control the vibration.

FIGS. 16 to 18 show the structure of the dynamic absorber 24. The dynamic absorber 24 has a mounting base 25 which is fixed to the lower surface of the base 21 from below by bolts. The first dynamic absorber 40 and the second dynamic absorber 41 for damping lateral vibration are supported.

As shown in FIGS. 16 and 17, the first dynamic absorber 40 has a pair of first leaf springs 27A, 27A extending from the mounting base 25 to the underfloor 19 side as first arms 27, 27, respectively. A pair of first arms 27, 27, each of which is provided with an integral first mass body 28 between the distal ends thereof.
Bolts 29, 29, 29, penetrating the tips of 7, 27
29 are screwed into the first mass body 28 from opposite sides and fastened.

Also, from the lower surface of the mounting base 25, under the floor 1
The first leaf springs 30, 30 extending a predetermined length toward the side 9 and having a large spring constant are provided vertically outside the first arms 27, 27, and the second leaf springs 30, 30 each have a low spring constant. Leaf spring 3
One end of each of the first and second leaf springs 31 and 31 is screwed.
The other end of 31 is connected to second mass bodies 33, 33 via viscoelastic bodies 32, 32, respectively. The first arm 27, 2
First coupling members 34, 34 magnetized for coupling between 7
Are provided at intervals in the vertical direction, and coupling members 35, 35 are provided between the first leaf springs 30, 30 and the first arms 27, 27, respectively. This corresponds to the vibration of the base 21 in the horizontal direction (front-back or left-right direction).

On the other hand, as shown in FIG. 17 and FIG. 18, the second dynamic absorber 41 has a third leaf spring 34 having a large section second order mounted on the upper surface of the first mass body 28,
A fourth leaf spring 3 having a small spring constant is provided at both ends of the leaf spring 34.
5 are screwed together. For this reason, the first mass body 28
Is shared as the mass body of the two dynamic absorbers, achieving compactness.

Then, an arm 36 composed of a leaf spring having substantially the same length as the fourth leaf spring 35 is attached to the lower surface of the first mass body 28 from below, and is opposed to the fourth leaf spring 35 from below. The second mass bodies 33, 33 are provided on the upper surfaces of both ends of the
Are mounted and fixed, and the second viscoelastic bodies 37, 37 are attached to the upper surfaces of the second mass bodies 33, 33, respectively, and the fourth plate spring 35 is attached to the second viscoelastic bodies 37, 37. Both ends are connected to each other, and the fourth leaf spring 35 and the second arm 3 are provided at both outer positions of the first mass body 28.
6 are joined by a magnetized second joining member 38, and by changing the joining point by the second joining member 38,
1 corresponds to vertical vibration.

Accordingly, the position of the second coupling members 38, 38 of the second dynamic absorber 41 is set to a position in synchronization with the period of the vertical vibration of the surface plate 21. The installation position of the first coupling members 39 of the vessel 40 is
If it is set at a position where the natural frequency and the cycle of 1 are synchronized, the first mass 28 and the second mass 33 and 33 vibrate at a cycle synchronized with the natural frequency of the base 21.

Therefore, the vibration of the semiconductor manufacturing apparatus 22 is relatively damped. Also, a pair of first viscoelastic bodies 32,
Since the vibration energy can be absorbed by the slip deformation and the slip deformation of the pair of second viscoelastic bodies 37, efficient vibration suppression can be achieved.

The present invention can be variously modified without departing from the spirit of the present invention, and it goes without saying that the present invention extends to the modified ones.

[0034]

According to the first aspect of the present invention, the mass object is joined at a position where the mass vibrates at a cycle of vibration corresponding to the natural frequency of the vibration damping object with the joining member interposed therebetween. The measurement of the natural frequency of the measurement can be eliminated. In addition, since the vibration period of the mass body is adjusted by the leaf spring, the response of vibration absorption can be greatly improved.

According to the second aspect of the present invention, since the arm is formed of a leaf spring, the range of adjustment of the vibration period can be expanded.

According to the third aspect of the present invention, since the dynamic vibration absorbers are provided on both sides of the object to be damped, the torsional moment can be eliminated and the torsional motion of the object to be damped can be suppressed.

According to a fourth aspect of the present invention, furthermore, the leaf spring is extended on the mass body, and the extending end of the leaf spring and the upper surface of the mass body are joined via the viscoelastic body to shift the viscoelastic body. Since the vibration energy is absorbed by the deformation, the vibration can be favorably attenuated without polluting the outside.

According to the fifth aspect of the present invention, the spring constant on the extension end side of the leaf spring is set lower than the spring constant on the vibration damping object side, so that the damping due to the shear deformation of the viscoelastic body. Can be improved as much as possible.

According to a sixth aspect of the present invention, the coupling member is formed of a magnet, one of the magnetic poles is fixed to one of the leaf spring or the arm, and the magnetic force of the other magnetic pole causes the other of the leaf spring or the arm. Because it can be easily attached and detached,
Vibration can be damped due to sliding friction.

[Brief description of the drawings]

FIG. 1 shows an embodiment of the present invention, and is a front view of a tuned mass dynamic absorber configured to adjust a period of a vibration of a pendulum by a leaf spring.

FIG. 2 shows an embodiment of the present invention, and is a front view of a tuned mass dynamic absorber having a pendulum fixed thereto.

FIG. 3 shows one embodiment of the present invention, and is a front view of a tuned mass dynamic absorber in which an arm and a leaf spring are joined via a viscoelastic body.

FIG. 4 is a graph showing a natural frequency versus an amplitude characteristic of an object to be damped when a dynamic absorber using a gel material as a viscoelastic body and a leaf spring and a mass body are directly connected without using a viscoelastic body. FIG.

FIG. 5 is a front view of a tuned mass dynamic absorber configured to increase the response to a viscoelastic body by changing the spring constant of the leaf spring on the side of the vibration constant damping target and on the mass body side.

FIG. 6 is a front view of a tuned mass-type dynamic absorber in which a dynamic absorber is attached to the dynamic absorber in a symmetrical manner so as to restrict torsion.

FIG. 7 is a front view of a tuned mass dynamic absorber configured to expand the adjustment range of the period by adding a leaf spring.

FIG. 8 is a partially cutaway front view showing an embodiment of a joining member constituted by a magnet as the joining member.

FIG. 9 is a partially cutaway front view showing a sliding layer for improving sliding friction.

FIG. 10 is a partially cutaway front view showing another embodiment of a joining member formed of a magnet as the joining member.

FIG. 11 is a partially cutaway cross-sectional view showing one embodiment of a coupling structure of a mass body, a viscoelastic body, and a leaf spring.

FIG. 12 is a partially cutaway sectional view showing an embodiment of a joint structure between a joining member and an arm.

FIG. 13 is a partially cutaway sectional view showing an embodiment of a joint structure between a joining member and an arm.

FIG. 14 is a vertical sectional view of a clean room.

FIG. 15 shows a detailed vertical sectional view of a main part of a clean room,
It is a figure showing attachment of a tuned mass type dynamic vibration absorber.

FIG. 16 is a side view of the vibration damping device of the semiconductor manufacturing apparatus according to one embodiment of the present invention.

FIG. 17 is a front view of a vibration damping device of the semiconductor manufacturing apparatus according to one embodiment of the present invention.

FIG. 18 is a top view of the vibration damping device of the semiconductor manufacturing apparatus according to one embodiment of the present invention.

[Explanation of symbols]

 3 Arm 5 Object to be damped 6 Leaf spring 7 Joint member 8 Mass

 ──────────────────────────────────────────────────続 き Continuing on the front page (72) Inventor Kiyomi Hasegawa 2-1 Tsukudo-cho, Shinjuku-ku, Tokyo Headquarters, Kumagaya Gumi Tokyo Co., Ltd. (72) Inventor Masashi Yasuda 10-13 Minami Hatsushima-cho, Amagasaki City, Hyogo F term (reference) in Koki Co., Ltd. 3J048 AA02 AC01 AC05 AD02 AD07 BC04 BD08 BE06 BF05 CB01 CB22

Claims (6)

[Claims] 1. A tuned mass dynamic absorber mounted on a vibration damping object and configured to vibrate at a period corresponding to a natural frequency of the vibration damping object, wherein the vibration damping object is An arm swinging along the vibration direction of the object is provided, a mass body is attached to the tip thereof, and a leaf spring is fixed at one end in parallel with the arm at a predetermined interval, and the leaf spring and the arm are fixed to each other. A coupling member for coupling the two is interposed between the arms and the leaf spring by the joining member at a position where the mass vibrates at a period of vibration corresponding to the natural frequency of the vibration damping object. A tuned mass dynamic absorber characterized in that the tunable mass dynamic absorber is configured to be coupled to the tunable mass dynamic absorber. 2. A tuned mass dynamic absorber mounted on an object to be damped and configured to vibrate at a period corresponding to a natural frequency of the object to be damped. The arm vibrating along the vibration direction of the object is fixed at one end and a mass body is attached to the tip thereof, and a leaf spring is fixed at one end in parallel with the arm at a predetermined interval, and further, the leaf spring and the A coupling member for coupling the two is provided between the arm and the arm, and the mass member is connected to the arm by the joining member at a position where the mass body vibrates at a period of vibration corresponding to the natural frequency of the vibration damping target. A tuned mass dynamic absorber characterized by being configured to be coupled to a leaf spring. 3. A tuned mass dynamic absorber attached to an object to be damped and configured to vibrate at a period corresponding to the natural frequency of the object to be damped, wherein the object to be damped is provided by a leaf spring. A pair of arms configured and oscillating along the vibration direction of the object to be damped are provided on the left and right sides, and a mass body is attached to the tip of each arm.Furthermore, a leaf spring is provided at a predetermined interval from each arm and in parallel with each arm. Each of the mass members is fixed at one end, and a coupling member for coupling the both is interposed between each leaf spring and each arm, and each of the mass bodies has a vibration cycle corresponding to a natural frequency of the vibration damping target object. A tuned mass dynamic absorber, wherein each of the arms and each of the leaf springs are connected by the connecting member at a position where the vibration is caused. 4. The tuned mass type according to claim 2, wherein the leaf spring extends toward the mass body, and an extended end of the leaf spring and a facing surface of the mass body are joined via a viscoelastic body. Dynamic absorber. 5. The tuned mass dynamic absorber according to claim 2, wherein a spring constant on an extension end side of said leaf spring is set lower than a spring constant on said vibration damping object side. 6. The coupling member is constituted by a magnet, and one magnetic pole is fixed to one of the leaf spring or the arm, and is coupled to the leaf spring or the other of the arm by the magnetic force of the other magnetic pole. The tuned mass dynamic vibration absorber according to claim 1, 2, 3, 4, or 5, wherein