JP2000306663A - Light emitting device - Google Patents
Light emitting deviceInfo
- Publication number
- JP2000306663A JP2000306663A JP11111831A JP11183199A JP2000306663A JP 2000306663 A JP2000306663 A JP 2000306663A JP 11111831 A JP11111831 A JP 11111831A JP 11183199 A JP11183199 A JP 11183199A JP 2000306663 A JP2000306663 A JP 2000306663A
- Authority
- JP
- Japan
- Prior art keywords
- light
- light emitting
- substrate
- emitting element
- sealing plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 claims abstract description 46
- 238000007789 sealing Methods 0.000 claims abstract description 42
- 150000002894 organic compounds Chemical class 0.000 claims abstract description 15
- 239000010410 layer Substances 0.000 description 31
- 239000000853 adhesive Substances 0.000 description 13
- 230000001070 adhesive effect Effects 0.000 description 13
- 239000000463 material Substances 0.000 description 9
- 230000005525 hole transport Effects 0.000 description 5
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 2
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 239000011368 organic material Substances 0.000 description 2
- 230000035699 permeability Effects 0.000 description 2
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 2
- 238000005215 recombination Methods 0.000 description 2
- 230000006798 recombination Effects 0.000 description 2
- 239000002356 single layer Substances 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- OGGKVJMNFFSDEV-UHFFFAOYSA-N 3-methyl-n-[4-[4-(n-(3-methylphenyl)anilino)phenyl]phenyl]-n-phenylaniline Chemical compound CC1=CC=CC(N(C=2C=CC=CC=2)C=2C=CC(=CC=2)C=2C=CC(=CC=2)N(C=2C=CC=CC=2)C=2C=C(C)C=CC=2)=C1 OGGKVJMNFFSDEV-UHFFFAOYSA-N 0.000 description 1
- BUGBHKTXTAQXES-UHFFFAOYSA-N Selenium Chemical compound [Se] BUGBHKTXTAQXES-UHFFFAOYSA-N 0.000 description 1
- 229910004298 SiO 2 Inorganic materials 0.000 description 1
- -1 Tris (8 -Quinolinol) aluminum Chemical compound 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- GBRBMTNGQBKBQE-UHFFFAOYSA-L copper;diiodide Chemical compound I[Cu]I GBRBMTNGQBKBQE-UHFFFAOYSA-L 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 239000002019 doping agent Substances 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 230000005283 ground state Effects 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 229910052741 iridium Inorganic materials 0.000 description 1
- GKOZUEZYRPOHIO-UHFFFAOYSA-N iridium atom Chemical compound [Ir] GKOZUEZYRPOHIO-UHFFFAOYSA-N 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 229910052749 magnesium Inorganic materials 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 229910052763 palladium Inorganic materials 0.000 description 1
- 238000000059 patterning Methods 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229910052711 selenium Inorganic materials 0.000 description 1
- 239000011669 selenium Substances 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000005361 soda-lime glass Substances 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- XOLBLPGZBRYERU-UHFFFAOYSA-N tin dioxide Chemical compound O=[Sn]=O XOLBLPGZBRYERU-UHFFFAOYSA-N 0.000 description 1
- 229910001887 tin oxide Inorganic materials 0.000 description 1
- 238000002834 transmittance Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/841—Self-supporting sealing arrangements
Landscapes
- Electroluminescent Light Sources (AREA)
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は発光装置に関し、特
に少なくとも一方が透光性である陽極及び陰極と、これ
らの間に狭持された一層又は複数層の有機化合物により
構成されている発光部を有する有機ＬＥＤデバイス等の
発光素子において、発光素子の封止方法に関するもので
ある。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a light-emitting device, and more particularly to a light-emitting device comprising at least one of a light-transmitting anode and a cathode, and one or more organic compounds sandwiched therebetween. The present invention relates to a method for sealing a light emitting element in a light emitting element such as an organic LED device having the above.
【０００２】[0002]
【従来の技術】有機ＬＥＤデバイス等の発光素子は、有
機発光材料を少なくとも一方が透光性である一対の対向
電極に狭持された構造をしており、一方の電極からは電
子が、もう一方の電極からは正孔が注入されることによ
り有機発光材料中で再結合が起り、再結合により励起さ
れた分子が再び基底状態に戻る時に発光が生じる。この
有機ＬＥＤデバイスは、自己発光であることによる視認
性の良さと、有機材料の選択により任意の発光色が容易
に得られ、又、低電圧駆動、高効率、高輝度が可能であ
るという特徴から、ディスプレイやファクシミリやスキ
ャナ等のコンタクトセンサヘの応用が考えられている。2. Description of the Related Art A light emitting element such as an organic LED device has a structure in which an organic light emitting material is sandwiched between a pair of opposing electrodes at least one of which is translucent, and electrons are emitted from one of the electrodes. Injection of holes from one of the electrodes causes recombination in the organic light emitting material, and light emission occurs when molecules excited by the recombination return to the ground state again. This organic LED device is characterized by good visibility due to self-emission, easy emission of any color by selecting an organic material, and low voltage drive, high efficiency and high brightness. Therefore, application to a contact sensor such as a display, a facsimile, and a scanner has been considered.
【０００３】有機ＬＥＤデバイスをコンタクトセンサに
応用した例を図４に示す。図４において、１１は原稿、
Ｐは原稿面上の読み取り位置、１２は有機ＬＥＤデバイ
ス、１３は透光性基板、１４は有機ＬＥＤデバイスの発
光部、１５は封止板、１６は屈折率分布型レンズアレ
イ、１７は受光素子、ａは有機ＬＥＤデバイスの発光部
１４と屈折率分布型レンズアレイ１６の原稿面上の読み
取り位置Ｐとの距離を示す。FIG. 4 shows an example in which an organic LED device is applied to a contact sensor. In FIG. 4, 11 is a manuscript,
P is a reading position on a document surface, 12 is an organic LED device, 13 is a translucent substrate, 14 is a light emitting portion of the organic LED device, 15 is a sealing plate, 16 is a gradient index lens array, and 17 is a light receiving element. And a indicate the distance between the light emitting unit 14 of the organic LED device and the reading position P on the document surface of the gradient index lens array 16.
【０００４】図４に示すように有機ＬＥＤデバイス１２
から出た光は原稿面で反射され、該原稿１１からの反射
光が屈折率分布型レンズアレイ１６を介して受光素子１
７に結像される。[0004] As shown in FIG.
Is reflected by the document surface, and the reflected light from the document 11 is transmitted through the gradient index lens array 16 to the light receiving element 1.
7 is formed.
【０００５】[0005]
【発明が解決しようとする課題】しかしながら、コンタ
クトセンサの光源への応用を考えた場合、有機ＬＥＤ素
子と原稿面の水平距離（図４中有機ＬＥＤデバイスの発
光部１４と原稿面上の読み取り位置Ｐとの距離）があま
りに大きいと有機ＬＥＤデバイスの発光部１４から発し
た光束が有効に原稿面上の読み取り位置Ｐを照明する事
ができない。従って、有機ＬＥＤデバイスの発光部１４
と原稿面上の読み取り位置Ｐの水平距離ａはなるべく短
いことが望ましいが、この水平距離ａを縮めたい場合
に、従来の封止方法では封止板１５の接着領域が有機Ｌ
ＥＤデバイスの発光部１４の周辺にある為、有機ＬＥＤ
デバイスの発光部１４を基板端部で作成するには、接着
領域を減らす等の方法をとらなければならなかった。However, considering the application of the contact sensor to the light source, the horizontal distance between the organic LED element and the document surface (the light emitting portion 14 of the organic LED device and the reading position on the document surface in FIG. 4) is considered. If the distance (from P) is too large, the light beam emitted from the light emitting unit 14 of the organic LED device cannot effectively illuminate the reading position P on the document surface. Therefore, the light emitting portion 14 of the organic LED device
It is desirable that the horizontal distance a between the reading position P on the document surface and the reading position P be as short as possible.
Because it is near the light emitting part 14 of the ED device, the organic LED
In order to form the light emitting portion 14 of the device at the edge of the substrate, it was necessary to take a method such as reducing the bonding area.
【０００６】この様な問題は、コンタクトセンサの光源
への応用の場合、具体的に顕著に生じるが、ディスプレ
イ等、他の応用の場合においても、例えば極限までの小
型化を狙った場合、なるべく基板の端部まで有効発光領
域が存在することが望ましく、封止板の接着領域の大き
さが問題となることがあった。[0006] Such a problem specifically occurs particularly in the application of a contact sensor to a light source. However, in the case of other applications such as a display, for example, when miniaturization to the utmost is aimed at, as much as possible. It is desirable that an effective light emitting region exists up to the end of the substrate, and the size of the bonding region of the sealing plate may become a problem.
【０００７】本発明は、この様な従来技術の問題点を解
決するためになされたものであり、有機ＬＥＤデバイス
等の発光素子の封止板の接着に基板の端面を使用して封
止することにより、発光素子の発光部を基板端部に近づ
ける事が出来き、原稿面上の読み取りが良好な発光装置
を提供するものである。SUMMARY OF THE INVENTION The present invention has been made to solve such problems of the prior art, and uses an end face of a substrate for bonding a sealing plate of a light emitting element such as an organic LED device. This makes it possible to bring the light emitting portion of the light emitting element closer to the edge of the substrate, and to provide a light emitting device with good reading on the document surface.
【０００８】[0008]
【課題を解決するための手段】即ち、本発明は、基板
と、該基板上に少なくとも陽極及び陰極と、これらの間
に挟持された一層又は複数層の有機化合物層により構成
される発光部を有する発光素子と、該発光素子を封止す
る封止板を有する発光装置において、該発光素子を封止
する封止板の少なくとも一面が発光素子の基板の端面で
接着され封止板の近傍に発光部が配置されていることを
特徴とする発光装置である。That is, the present invention provides a light emitting unit comprising a substrate, at least an anode and a cathode on the substrate, and one or more organic compound layers sandwiched therebetween. In a light-emitting device having a light-emitting element and a sealing plate for sealing the light-emitting element, at least one surface of the sealing plate for sealing the light-emitting element is bonded to an end surface of a substrate of the light-emitting element and is in the vicinity of the sealing plate. A light-emitting device, wherein a light-emitting unit is provided.
【０００９】前記封止板が接着された発光素子の基板の
端面の近傍に発光部が設けられているのが好ましい。Preferably, a light emitting portion is provided near an end face of the substrate of the light emitting element to which the sealing plate is adhered.
【００１０】[0010]
【発明の実施の形態】本発明の発光装置は、基板と、該
基板上に少なくとも陽極及び陰極と、これらの間に挟持
された一層又は複数層の有機化合物層により構成される
発光部を有する発光素子を具備し、該発光素子を封止す
る封止板を有する装置であり、該発光素子を封止する封
止板の少なくとも一面を発光素子の基板の端面で接着す
ることにより、封止板の近傍に発光部を配置することが
でき、発光部と原稿面上の読み取り位置Ｐの水平距離ａ
を短くすることができ、原稿面上の読み取りが良好にな
ったことを特徴とする。BEST MODE FOR CARRYING OUT THE INVENTION A light emitting device according to the present invention has a substrate, a light emitting portion composed of at least an anode and a cathode, and one or more organic compound layers sandwiched between the substrate and the substrate. A device including a light-emitting element and having a sealing plate for sealing the light-emitting element, wherein at least one surface of the sealing plate for sealing the light-emitting element is bonded to an end surface of a substrate of the light-emitting element, whereby sealing is performed. A light emitting unit can be arranged near the plate, and the horizontal distance a between the light emitting unit and the reading position P on the document surface
Is shortened, and reading on the document surface is improved.
【００１１】[0011]
【実施例】以下に実施例を挙げて本発明を具体的に説明
する。図１は本発明の発光装置の第１の実施例を示す模
式的斜視図、図２は図１におけるＡＡ′線断面図、図３
は本発明の発光装置の有機ＬＥＤデバイスをコンタクト
センサに取り付けた状態を示す説明図である。EXAMPLES The present invention will be specifically described below with reference to examples. FIG. 1 is a schematic perspective view showing a first embodiment of the light emitting device of the present invention, FIG. 2 is a sectional view taken along the line AA 'in FIG.
FIG. 3 is an explanatory view showing a state where the organic LED device of the light emitting device of the present invention is attached to a contact sensor.
【００１２】図１において、１は透光性基板、２は外部
電極（陽極）、３は外部電極（陰極）、７は封止板を示
す。図２は図１におけるＡＡ′の断面図で、透光性基板
１の上に透明電極よりなる陽極２、陰極の外部取り出し
用電極（外部電極）３、有機化合物層４、陰極５、接着
剤６、封止板７を設けて構成されている。In FIG. 1, 1 is a translucent substrate, 2 is an external electrode (anode), 3 is an external electrode (cathode), and 7 is a sealing plate. FIG. 2 is a cross-sectional view taken along the line AA 'in FIG. 1. An anode 2 made of a transparent electrode, an external electrode (external electrode) 3 for a cathode, an organic compound layer 4, a cathode 5, an adhesive 6, a sealing plate 7 is provided.
【００１３】本発明の発光装置は、透光性基板１と、該
透光性基板１上に少なくとも陽極２及び陰極３と、これ
らの間に挟持された一層又は複数層の有機化合物層４に
より構成される発光部１４を有する発光素子と、該発光
素子を封止する封止板７を有する発光装置において、該
発光素子を封止する封止板７の少なくとも一面が発光素
子の透光性基板の端面１ｂで接着され封止板７の近傍に
発光部１４が配置されていることを特徴とする。The light-emitting device of the present invention comprises a light-transmitting substrate 1, at least an anode 2 and a cathode 3 on the light-transmitting substrate 1, and one or more organic compound layers 4 sandwiched therebetween. In a light emitting device having a light emitting element having the light emitting portion 14 and a sealing plate 7 for sealing the light emitting element, at least one surface of the sealing plate 7 for sealing the light emitting element has a light transmitting property of the light emitting element. The light emitting unit 14 is provided near the sealing plate 7 and is adhered to the end face 1b of the substrate.
【００１４】図３は、本発明における発光装置として有
機ＬＥＤデバイスをコンタクトセンサに取り付けた場合
を示し、同図３中１１は原稿、Ｐは原稿面上の読み取り
位置、１２は有機ＬＥＤデバイス、１は透光性基板、１
４は有機ＬＥＤデバイスの発光部、７は封止板、１６は
屈折率分布型レンズアレイ、１７は受光素子、ａは有機
ＬＥＤデバイスの発光部４と原稿面上の読み取り位置Ｐ
との距離を示す。FIG. 3 shows a case where an organic LED device is attached to a contact sensor as a light emitting device in the present invention. In FIG. 3, reference numeral 11 denotes a document, P denotes a reading position on the document surface, 12 denotes an organic LED device, Is a translucent substrate, 1
Reference numeral 4 denotes a light emitting portion of the organic LED device, 7 denotes a sealing plate, 16 denotes a gradient index lens array, 17 denotes a light receiving element, and a denotes a light emitting portion 4 of the organic LED device and a reading position P on a document surface.
Indicates the distance to
【００１５】図３において、有機ＬＥＤデバイス１２か
ら出た光は原稿面で反射され、該原稿１１上の読み取り
位置Ｐからの反射光が屈折率分布型レンズアレイ１６を
介して受光素子１７に結像される。In FIG. 3, the light emitted from the organic LED device 12 is reflected by the original surface, and the reflected light from the reading position P on the original 11 is coupled to the light receiving element 17 via the gradient index lens array 16. Imaged.
【００１６】有機ＬＥＤデバイスの製造は、図２に示す
ように、まず、所定長さの透光性基板１の上に陽極２及
び外部電極３を所望の形状にパターニングして形成す
る。そして、陽極２上に有機化合物層４を積層し、更に
陰極５を有機化合物層４及び外部電極３上に積層する。
これにより、有機化合物層４は陽極２及び陰極５とに挟
まれて膜層の上下で接続され、発光素子として機能す
る。In manufacturing an organic LED device, as shown in FIG. 2, first, an anode 2 and an external electrode 3 are formed in a desired shape on a light-transmitting substrate 1 having a predetermined length. Then, the organic compound layer 4 is laminated on the anode 2, and the cathode 5 is further laminated on the organic compound layer 4 and the external electrode 3.
As a result, the organic compound layer 4 is sandwiched between the anode 2 and the cathode 5 and connected above and below the film layer, and functions as a light emitting element.
【００１７】又、この様に、陽極２及び材料によっては
外部電極３を所望のパターニングをしておくことによ
り、水、溶剤、熱に比較的弱い有機化合物層４の形成が
容易になる。又、陰極５を外部電極３と接続し電極を取
り出すことで陰極５と接着剤６が接触することがなく、
接着剤−陰極間の接着性や剥離の問題等がなくなる。
又、陽極２は、図１に示すように外部電極も兼ねてお
り、外部電極３と同様の材料を選択することにより工程
の削減も可能となる。In this way, by forming the desired patterning of the anode 2 and the external electrode 3 depending on the material, it becomes easy to form the organic compound layer 4 which is relatively weak to water, solvent and heat. Also, by connecting the cathode 5 to the external electrode 3 and taking out the electrode, the cathode 5 and the adhesive 6 do not come into contact,
Problems such as adhesiveness between the adhesive and the cathode and peeling are eliminated.
The anode 2 also serves as an external electrode as shown in FIG. 1, and the number of steps can be reduced by selecting the same material as the external electrode 3.
【００１８】そして、素子の劣化を防ぐために封止板７
を接着剤６を介して接着する。封止板の接着は、透光性
基板の素子作成面１ａと透光性基板の端面１ｂをＬ字型
で覆う形状で接着する。また、有機ＬＥＤデバイスの発
光部１４は透光性基板の端面１ｂの近傍に設けることが
好ましい。In order to prevent the deterioration of the device, the sealing plate 7
Are bonded via an adhesive 6. The sealing plate is bonded so as to cover the element forming surface 1a of the light-transmitting substrate and the end surface 1b of the light-transmitting substrate with an L-shape. Further, the light emitting section 14 of the organic LED device is preferably provided near the end face 1b of the translucent substrate.
【００１９】この様に封止板７を透光性基板の端面１ｂ
で接着を行うことにより、有機ＬＥＤデバイスの発光部
１４を透光性基板の端面１ｂの近傍に設けることがで
き、発光部１４と封止板７の外面の距離ａ′を短縮する
ことができる。すなわち、図３中、有機ＬＥＤデバイス
の発光部１４の端部から原稿面上の読み取り位置Ｐとの
距離ａを短縮することができる。有機ＬＥＤデバイスの
発光部１４の端部から原稿面上の読み取り位置Ｐとの距
離ａについては、有機ＬＥＤデバイスの発光の指向性
や、コンタクトセンサの各部の寸法によっても異なる
が、一般的に言って、有機ＬＥＤデバイスの発光部の読
み取り位置Ｐに近い側における読み取り位置Ｐ′と発光
部１４の垂直距離ｂより小さいことが望ましい。As described above, the sealing plate 7 is connected to the end face 1b of the transparent substrate.
By bonding, the light emitting portion 14 of the organic LED device can be provided in the vicinity of the end face 1b of the translucent substrate, and the distance a 'between the light emitting portion 14 and the outer surface of the sealing plate 7 can be reduced. . That is, in FIG. 3, the distance a from the end of the light emitting section 14 of the organic LED device to the reading position P on the document surface can be reduced. The distance a from the end of the light emitting section 14 of the organic LED device to the reading position P on the document surface varies depending on the directivity of light emission of the organic LED device and the dimensions of each part of the contact sensor. Therefore, it is desirable that the vertical distance b between the reading position P ′ on the side closer to the reading position P of the light emitting section of the organic LED device and the light emitting section 14 be smaller.
【００２０】また、有機ＬＥＤデバイスやコンタクトセ
ンサにより異なるが、具体例として、上記の発光部１４
と封止板７の外面の距離ａ′は０．５〜３．０ｍｍ、発
光部１４の端部から原稿面上の読み取り位置Ｐとの距離
ａは０．５〜５．０ｍｍが挙げられる。Further, although it differs depending on the organic LED device and the contact sensor, as a specific example, the light emitting section 14 described above is used.
The distance a 'between the light emitting unit 14 and the outer surface of the sealing plate 7 is 0.5 to 3.0 mm, and the distance a from the end of the light emitting unit 14 to the reading position P on the document surface is 0.5 to 5.0 mm.
【００２１】次に、本発明における発光装置の各構成に
ついて説明する。透光性基板１としては、発光部１４を
表面に構成できるものであればよく、例えばソーダライ
ムガラス等のガラス、樹脂フィルム等の透明絶縁性基板
を用いるのが好ましい。Next, each configuration of the light emitting device according to the present invention will be described. The light-transmitting substrate 1 may be any as long as the light-emitting portion 14 can be formed on the surface, and for example, a transparent insulating substrate such as glass such as soda lime glass or a resin film is preferably used.
【００２２】陽極２の材料としては仕事関数が大きなも
のが望ましく、例えばＩＴＯ、酸化錫、金、白金、パラ
ジウム、セレン、イリジウム、ョウ化銅などを用いるこ
とができる。一方、陰極５の材料としては仕事関数が小
さなものが望ましく、例えばＭｇ／Ａｇ、Ｍｇ、Ａｌ、
Ｉｎあるいはこれらの合金等を用いることができる。As the material of the anode 2, a material having a large work function is desirable. For example, ITO, tin oxide, gold, platinum, palladium, selenium, iridium, copper iodide and the like can be used. On the other hand, it is desirable that the material of the cathode 5 has a small work function, for example, Mg / Ag, Mg, Al,
In or an alloy thereof can be used.
【００２３】有機化合物層４は、一層構成であっても良
いし、複数層構成であっても良く、例えば、陽極２から
正孔が注入される正孔輸送層、及び陰極５から電子が注
入される電子輸送層からなり、正孔輸送層と電子輸送層
のいずれかが発光層となる。また、蛍光体を含有する蛍
光体層を正孔輸送層と電子輸送層との間に設けても良
い。また、混合一層構成で正孔輸送層，電子輸送層，蛍
光層を兼ねた構成も可能である。The organic compound layer 4 may have a single-layer structure or a multi-layer structure. For example, a hole transport layer in which holes are injected from the anode 2 and electrons are injected from the cathode 5. The hole transport layer or the electron transport layer is a light emitting layer. Further, a phosphor layer containing a phosphor may be provided between the hole transport layer and the electron transport layer. Further, it is also possible to adopt a configuration in which a hole transporting layer, an electron transporting layer, and a fluorescent layer are also used in a mixed single layer configuration.
【００２４】以下、有機化合物層４を形成する材料とし
て使用される有機物質の例を具体的に示す。しかし、本
発明の有機化合物層に使用される有機物質は必ずしもこ
れらに限定されるものではない。Hereinafter, examples of the organic substance used as a material for forming the organic compound layer 4 will be specifically described. However, the organic substance used in the organic compound layer of the present invention is not necessarily limited to these.
【００２５】正孔輸送層としては、例えば、Ｎ，Ｎ′−
ビス（３−メチルフェニル）―Ｎ，Ｎ′−ジフェニル−
（１，１′−ビフェニル）−４，４′−ジアミン（以下
ＴＰＤ）を用いることができ、その他にも下記の有機材
料を用いることができる。As the hole transport layer, for example, N, N'-
Bis (3-methylphenyl) -N, N'-diphenyl-
(1,1′-biphenyl) -4,4′-diamine (hereinafter, TPD) can be used, and the following organic materials can also be used.
【００２６】[0026]
【化１】 Embedded image
【００２７】[0027]
【化２】 Embedded image
【００２８】[0028]
【化３】 Embedded image
【００２９】[0029]
【化４】 Embedded image
【００３０】[0030]
【化５】 Embedded image
【００３１】電子輸送層としては、例えば、トリス（８
−キノリノール）アルミニウム（以下Ａｌｑ3 ）を用い
ることができ、その他にも下記の材料を用いることがで
きる。As the electron transporting layer, for example, Tris (8
-Quinolinol) aluminum (hereinafter Alq 3 ), and the following materials can also be used.
【００３２】[0032]
【化６】 Embedded image
【００３３】[0033]
【化７】 Embedded image
【００３４】[0034]
【化８】 Embedded image
【００３５】[0035]
【化９】 Embedded image
【００３６】また、以下に示すようなドーパンド色素を
電子輸送層、あるいは正孔輸送層にドーピングすること
もできる。The electron transport layer or the hole transport layer may be doped with a dopant as described below.
【００３７】[0037]
【化１０】 Embedded image
【００３８】また、陽極２と基板１との間に誘電層を設
けることが好ましい。誘電層は、ＳｉＯ2 ，ＳｉＯ等の
屈折率の異なる層の積層により特定の波長の反射透過率
を高く（低く）することができる。あるいは単にハーフ
ミラーを使用することも可能である。It is preferable to provide a dielectric layer between the anode 2 and the substrate 1. The dielectric layer can increase (lower) the reflection transmittance at a specific wavelength by laminating layers having different refractive indexes such as SiO 2 and SiO. Alternatively, it is also possible to simply use a half mirror.
【００３９】接着剤６は、なるべく透湿度の低いものが
好ましい。接着剤の具体例としては、エポキシ樹脂接着
剤、光硬化形接着剤等が挙げられる。The adhesive 6 preferably has a low moisture permeability as much as possible. Specific examples of the adhesive include an epoxy resin adhesive, a photocurable adhesive, and the like.
【００４０】封止板７としては、透湿度の低いものであ
れば良く、又、成形加工が容易なものが好ましく、例え
ばガラスやＡｌ板等が挙げられる。The sealing plate 7 only needs to have a low moisture permeability, and is preferably one that can be easily formed, for example, a glass or Al plate.
【００４１】以上の構成により、本実施形態の発光装置
は、陰極５から接続された外部電極３により電極を取り
出すことにより、外部電極以外は封止板７の接着領域内
にあるため、より気密性が高く、接着性の問題の少ない
発光装置を提供する事が出来る。With the above configuration, the light emitting device of this embodiment is more airtight because the electrodes other than the external electrodes are in the bonding area of the sealing plate 7 by extracting the electrodes with the external electrodes 3 connected from the cathode 5. It is possible to provide a light-emitting device having high adhesiveness and less problem of adhesiveness.
【００４２】又、透光性基板１の端面１ｂを接着面とし
て使うことにより、封止のための接着領域は、該端面方
向において、透光性基板表面の接着領域が不要となり、
有機ＬＥＤデバイスの発光部を透光性基板端面に近づけ
ることが可能となる。Further, by using the end face 1b of the light-transmitting substrate 1 as an adhesive surface, the adhesive area for sealing does not require the adhesive area on the light-transmitting substrate surface in the direction of the end face.
It is possible to make the light emitting portion of the organic LED device closer to the end face of the translucent substrate.
【００４３】[0043]
【発明の効果】以上説明した様に、本発明によれば、透
光性基板の端面を接着面として使うことにより、封止の
ための接着領域は該端面方向において、透光性基板表面
の接着領域が不要となり、有機ＬＥＤデバイスの発光部
を透光性基板端面に近づけることが可能となり、原稿面
上の読み取りが良好な発光装置を得ることができる。As described above, according to the present invention, by using the end surface of the light-transmitting substrate as the bonding surface, the bonding region for sealing is formed on the surface of the light-transmitting substrate in the direction of the end surface. The need for an adhesive area is eliminated, and the light-emitting portion of the organic LED device can be brought closer to the end face of the light-transmitting substrate, so that a light-emitting device with good reading on the document surface can be obtained.
【図１】本発明の発光装置の第１の実施例を示す模式的
斜視図である。FIG. 1 is a schematic perspective view showing a first embodiment of the light emitting device of the present invention.
【図２】図１におけるＡＡ′線断面図である。FIG. 2 is a sectional view taken along line AA ′ in FIG.
【図３】本発明の発光装置の有機ＬＥＤデバイスをコン
タクトセンサに取り付けた状態を示す説明図である。FIG. 3 is an explanatory view showing a state where an organic LED device of the light emitting device of the present invention is attached to a contact sensor.
【図４】従来の有機ＬＥＤデバイスをコンタクトセンサ
に取り付けた状態を示す説明図である。FIG. 4 is an explanatory view showing a state in which a conventional organic LED device is attached to a contact sensor.
１ 透光性基板 １ａ 透光性基板の素子作成面 １ｂ 透光性基板の端面 ２ 外部電極（陽極） ３ 外部電極（陰極） ４ 有機化合物層 ５ 陰極 ６ 接着剤 ７ 封止板 １１ 原稿 １２ 有機ＬＥＤデバイス １３ 透光性基板 １４ 有機ＬＥＤデバイスの発光部 １５ 封止板 １６ 屈折率分布型レンズアレイ １７ 受光素子 Ｐ 原稿面上の読み取り位置 DESCRIPTION OF SYMBOLS 1 Translucent substrate 1a Element creation surface of translucent substrate 1b End surface of translucent substrate 2 External electrode (anode) 3 External electrode (cathode) 4 Organic compound layer 5 Cathode 6 Adhesive 7 Sealing plate 11 Original 12 Organic LED device 13 Translucent substrate 14 Light emitting part of organic LED device 15 Sealing plate 16 Refractive index distributed lens array 17 Light receiving element P Reading position on document surface
Claims (2)
陰極と、これらの間に挟持された一層又は複数層の有機
化合物層により構成される発光部を有する発光素子と、
該発光素子を封止する封止板を有する発光装置におい
て、該発光素子を封止する封止板の少なくとも一面が発
光素子の基板の端面で接着され封止板の近傍に発光部が
配置されていることを特徴とする発光装置。1. A light-emitting element having a substrate, a light-emitting portion including at least an anode and a cathode on the substrate, and one or more organic compound layers sandwiched therebetween,
In a light-emitting device having a sealing plate for sealing the light-emitting element, at least one surface of the sealing plate for sealing the light-emitting element is adhered to an end surface of a substrate of the light-emitting element, and a light-emitting portion is arranged near the sealing plate. A light-emitting device, comprising:
の端面の近傍に発光部が設けられている請求項１記載の
発光装置。2. The light emitting device according to claim 1, wherein a light emitting portion is provided near an end surface of the substrate of the light emitting element to which the sealing plate is adhered.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11111831A JP2000306663A (en) | 1999-04-20 | 1999-04-20 | Light emitting device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11111831A JP2000306663A (en) | 1999-04-20 | 1999-04-20 | Light emitting device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JP2000306663A true JP2000306663A (en) | 2000-11-02 |
Family
ID=14571270
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11111831A Pending JP2000306663A (en) | 1999-04-20 | 1999-04-20 | Light emitting device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2000306663A (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20030080619A (en) * | 2002-04-09 | 2003-10-17 | 김시환 | Organic Electro Luminescent Display |
| KR20030083529A (en) * | 2002-04-23 | 2003-10-30 | 주식회사 대한전광 | Organic electroluminescence device of side encapsulation |
| KR20030083528A (en) * | 2002-04-23 | 2003-10-30 | 주식회사 대한전광 | Modulated Organic electroluminescence device with vertical electric supply line |
| JP2006196197A (en) * | 2005-01-11 | 2006-07-27 | Seiko Epson Corp | Light emitting device, its manufacturing method, image forming device, and image reading device |
| JP2007005277A (en) * | 2005-05-27 | 2007-01-11 | Toyota Industries Corp | Surface light source device, optical member, and manuscript reader and surface light source device using the same |
-
1999
- 1999-04-20 JP JP11111831A patent/JP2000306663A/en active Pending
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20030080619A (en) * | 2002-04-09 | 2003-10-17 | 김시환 | Organic Electro Luminescent Display |
| KR20030083529A (en) * | 2002-04-23 | 2003-10-30 | 주식회사 대한전광 | Organic electroluminescence device of side encapsulation |
| KR20030083528A (en) * | 2002-04-23 | 2003-10-30 | 주식회사 대한전광 | Modulated Organic electroluminescence device with vertical electric supply line |
| JP2006196197A (en) * | 2005-01-11 | 2006-07-27 | Seiko Epson Corp | Light emitting device, its manufacturing method, image forming device, and image reading device |
| JP2007005277A (en) * | 2005-05-27 | 2007-01-11 | Toyota Industries Corp | Surface light source device, optical member, and manuscript reader and surface light source device using the same |
| JP4631662B2 (en) * | 2005-05-27 | 2011-02-16 | 株式会社豊田自動織機 | Surface light source device, optical member, original reading device using the optical member, and surface light source device |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| EP0871320B1 (en) | Electroluminescent device and fabrication method for a light detection system | |
| KR102287424B1 (en) | Light-emitting device | |
| JP4262902B2 (en) | Electroluminescence display device | |
| JP4747626B2 (en) | Light emitting device | |
| US7325943B2 (en) | Electroluminescent panel which is equipped with light extraction elements | |
| KR102524438B1 (en) | Light-emitting device and surface-emitting light source | |
| JP2001135479A (en) | Light-emitting element and image-reading device using it, information-processing device and display device | |
| KR20190006101A (en) | Light-emitting device and electronic device | |
| CN1933689A (en) | Area light emitting device | |
| US7034452B2 (en) | Dual-type organic electroluminescence display and manufacturing method thereof | |
| KR20150039487A (en) | Display device | |
| WO2011027754A1 (en) | Organic luminescent element | |
| JP2003077649A (en) | Display device | |
| KR20050056875A (en) | Electroluminescent device | |
| JP2002043054A (en) | Light-emitting element and method of manufacturing the same | |
| KR100850156B1 (en) | Illuminator with reflecting layer and liquid crystal display | |
| JP2000277266A (en) | Organic electroluminescent element | |
| EP1513205A2 (en) | Light emitting device | |
| JP2000306663A (en) | Light emitting device | |
| KR20050050572A (en) | Electroluminescent element and lighting unit | |
| JP2022088567A (en) | Light-emitting module | |
| JP5297072B2 (en) | Organic light emitting device and method for manufacturing organic light emitting device | |
| JP4373581B2 (en) | Exposure equipment | |
| KR100778039B1 (en) | Light emitting apparatus, method of manufacturing light emitting apparatus, and electronic apparatus | |
| JP2004087439A (en) | Lighting system and liquid crystal display device |