JP2000301085A - Device and method for treating substrate - Google Patents

Abstract

PROBLEM TO BE SOLVED: To sufficiently remove an org. material from a substrate by ozonic water by heating the ozonic water supplied to the substrate by a supply means by a heating means. SOLUTION: An ozonic water heating part 6 is provided at an ozonic water supply pipe L3. The ozonic water at about 20-25 deg.C for example is heated by 3-60 deg.C to about 23-85 deg.C by the heating part 6. The decomposition of the ozone is rapidly advanced in the ozonic water heated by the ozonic water heating part 6, as the result, an active oxygen concn. in the ozonic water is increased. The oxidation capacity of the ozonic water is increased since the active oxygen is higher in oxidation capacity than ozone. The org. material such as resist stuck to the substrate W is sufficiently removed by this oxidation capacity since the oxidation capacity of the ozonic water OL stored in a washing tank 2 is increased by supplying the ozonic water increased in oxidation capacity to the washing tank 2.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a flat panel display (FPD) such as a semiconductor substrate or a substrate for a liquid crystal display.
The present invention relates to a substrate processing apparatus and a substrate processing method for immersing various substrates such as an ay) substrate and a photomask substrate in ozone water for processing.

[0002]

2. Description of the Related Art In general, a method of immersing a substrate in a mixed solution of sulfuric acid and hydrogen peroxide water to remove organic substances such as resist adhered to the substrate by the oxidizing power of caloic acid generated in the mixed solution. Are known. However, according to this method, a chemical solution such as sulfuric acid or hydrogen peroxide solution is expensive, so that the production cost in producing a product such as a semiconductor element increases, or equipment for reusing the chemical solution or disposal of the chemical solution is required. A problem arises in that processing equipment is required and equipment costs and equipment costs increase. In order to solve this problem, a method has been proposed in which a substrate is immersed in ozone water in which ozone is dissolved in pure water, and organic substances are removed using the oxidizing power of ozone water.

[0003]

However, since the oxidizing power of ozone water is generally weaker than the oxidizing power of chemicals, there is a problem that organic substances attached to the substrate cannot be sufficiently removed. An object of the present invention is to provide a substrate processing apparatus and a substrate processing method capable of sufficiently performing processing such as removal of organic substances with ozone water on a substrate in view of the above points.

[0004]

According to a first aspect of the present invention, there is provided a substrate processing apparatus for processing a substrate by immersing the substrate in ozone water. Supporting means for supporting the substrate in the ozone water stored in the processing tank, supply means for supplying ozone water to the processing tank and supplying ozone water to the substrate supported by the supporting means, and supply to the substrate by the supply means. And heating means for heating the ozone water.

According to a second aspect of the present invention, there is provided a substrate processing method for processing a substrate by immersing the substrate in ozone water stored in a processing tank. It is characterized by including a supply step of supplying ozone water to the substrate introduced into the tank, and a heating step of heating the ozone water supplied to the substrate in the supply step.

[0006]

Preferred embodiments of the present invention will be described below with reference to the drawings. FIG. 1 is a schematic diagram showing one embodiment of the present invention. In FIG. 1, a substrate cleaning apparatus 1 removes organic substances from a substrate by immersing a plurality of substrates to which organic substances such as resist are attached in ozone water. The substrate cleaning apparatus 1 includes a cleaning tank 2 for storing ozone water OL, and an outer tank 3 provided around the upper part of the cleaning tank 2 for temporarily receiving the ozone water OL overflowing from the cleaning tank 2. A pair of support members 4 that support a plurality of substrates W are arranged near the bottom of the cleaning tank 2. The support member 4 extends in a direction perpendicular to the plane of the paper, and has a plurality of grooves formed in the extending direction. Then, lower edges of the plurality of substrates W are inserted into a plurality of grooves formed in the pair of support members 4, respectively, so that the plurality of substrates W are parallel to each other in the cleaning tank 2 along a direction perpendicular to the paper surface. Are arranged.

An ozone water supply pipe L3 is connected to the cleaning tank 2 in a flow path. The ozone water supply pipe L3 is connected to a submerged pipe (not shown) provided in the cleaning tank 2, and the ozone water OL is supplied into the cleaning tank 2 via the ozone water supply pipe L3 and the submerged pipe. The ozone water supply pipe L3 is provided with an ozone water generation section 5, an ozone water heating section 6, and the like.

The ozone water generator 5 is connected to a pure water supply pipe L1 connected to a pure water supply source WS provided as factory equipment such as a semiconductor device manufacturing factory, and an ozone supply source OS as factory equipment. The channel-connected ozone supply pipes L2 are connected to the respective channels. The ozone water generation unit 5 mixes pure water and ozone supplied therein and dissolves ozone in the pure water to generate ozone water. This ozone water generator 5
May be provided in the substrate cleaning apparatus 1, or may not be provided in the substrate cleaning apparatus 1 when ozone water generation equipment is provided as factory equipment. The ozone water generated by the ozone water generation unit 5 is supplied to the cleaning tank 2 via the ozone water supply pipe L3 and the ozone water heating unit 6 by the pressure of the pure water sent from the pure water supply source WS to the ozone water generation unit 5 under pressure. Pumped up to.
The drain pipe L4 is a pipe for draining the ozone water OL stored in the outer tank 3 to the outside of the outer tank 3.

The ozone water heating section 6 raises the temperature of the ozone water supplied, for example, within a range of about 20 ° C. to about 25 ° C. by, for example, 3 ° C. to 60 ° C., and increases the temperature by about 23 ° C. to about 85 ° C.
Heat to within ° C. FIG. 2 is a schematic diagram showing the ozone water heating unit 6. The ozone water heating unit 6 has a substantially box-shaped case body 61, and the case body 61 has an ozone water supply pipe L3.
Inlet 62 and outlet 63 respectively connected to the flow path
Are formed. Three cylindrical lamp heaters 64, 65, 66 are provided alternately in the case main body 61. Each of the lamp heaters 64, 65, 66 is a quartz tube G
1, G2, G3 and infrared lamps H1, H2, H3 inserted into the respective quartz tubes G1, G2, G3. Wirings 68 electrically connected to a power supply 67 are electrically connected to the respective electrode portions of the lamp heaters 64, 65, 66. The temperature of the ozone water heated by the ozone water heating unit 6 is provided in the case main body 61 of the ozone water heating unit 6 or an ozone water supply pipe L3 that connects the ozone water heating unit 6 and the cleaning tank 2 in a flow path. The temperature is detected by a temperature sensor (not shown), and the detection result is fed back to the power supply 67. The power supply 67 to which the detection result is fed back controls the power supplied to the lamp heaters 64, 65, and 66 to adjust the temperature for heating the ozone water and change the temperature of the ozone water.

Next, the operation of the above-described substrate cleaning apparatus 1 will be described. The plurality of substrates W are transferred to a pair of support members 4 arranged in the cleaning tank 2 by a transfer robot (not shown) and introduced into the cleaning tank 2. At this time, the cleaning tank 2 may be filled with ozone water OL or pure water, or may be empty without any filling. Further, in the ozone water generator 5, pure water supplied through the pure water supply pipe L1 by pressure from the pure water supply source WS and ozone supplied from the ozone supply source OS through the ozone supply pipe L2 are mixed. After mixing, ozone is dissolved in pure water to produce ozone water. The ozone water generated by the ozone water generation unit 5 is pressure-fed to the ozone water heating unit 6 via the ozone water supply pipe L3. The ozone water, for example, within the range of about 20 ° C. to about 25 ° C., which is pressure-fed to the ozone water heating unit 6 and flows in the case body 61, is heated by the lamp heaters 64, 65, 66 to, for example, about 23 ° C. to about 80 ° C. You. The heated ozone water is pumped into the cleaning tank 2 via an ozone water supply pipe L3 and a not-shown submerged pipe, and is supplied to a plurality of substrates W supported by the pair of support members 4, respectively.

In the ozone water heated in the ozone water heating section 6, the decomposition of ozone (O ₃ ) proceeds rapidly, and as a result, the active oxygen (O) concentration in the ozone water increases. Since the active oxygen (O) has a stronger oxidizing power than ozone (O ₃ ), the oxidizing power of the ozone water is increased. The oxidized ozone water is supplied to the cleaning tank 2 so that the cleaning tank 2
The active oxygen concentration in the ozone water OL stored in the tank increases, and the oxidizing power of the ozone water OL increases. The oxidized ozone water OL is supplied to the plurality of substrates W, and the oxidizing power of the ozone water sufficiently removes organic substances such as resist adhered to the plurality of substrates W. Since the active oxygen in the ozone water is unstable and has a short life, the heated ozone water is heated as quickly as possible.
It is better to supply the substrate W within seconds. In order to supply the ozone water to the substrate W as quickly as possible, the ozone water heating unit 6 is disposed close to the cleaning tank 2, and the length of the ozone water supply pipe L3 that connects the ozone water heating unit 6 and the cleaning tank 2 to each other is connected. It is preferable that the length is set as short as 3 m or less, for example.

As the ozone water is supplied from the ozone water supply pipe L3 into the cleaning tank 2, the ozone water OL overflows from the upper end of the cleaning tank 2. At this time, an upward flow is generated in the ozone water OL stored in the cleaning tank 2, and the upward flow can efficiently remove organic substances and the like attached to the substrate W. The ozone water overflowing from the washing tank 2 is once received by the outer tank 3 and then drained by a drain pipe L4. The ozone water drained by the drain pipe L4 may be drained out of the substrate cleaning apparatus 1, or may be supplied to the ozone water supply pipe L3 or the like to circulate and supply the ozone water to the cleaning tank 2. good. The plurality of substrates W that have been immersed in the ozone water OL stored in the cleaning tank 2 and have been subjected to the cleaning process after a lapse of a predetermined time and have finished the cleaning processing are carried out of the cleaning tank 2 by a transfer robot (not shown).

In the above embodiment, the ozone water before being supplied to the cleaning tank 12 is heated, but instead of this configuration, the ozone water OL stored in the cleaning tank 12 may be heated. good. Specifically, a heating means such as a heater is provided around the cleaning tank 12, and the heating means heats the cleaning tank 12 to heat the ozone water OL stored in the cleaning tank 12. When the ozone water OL is heated, the active oxygen concentration increases and the oxidizing power of the ozone water OL increases. Here, the ozone water OL stored in the cleaning tank 12 is a mixed liquid of ozone water that has contributed to the removal of organic substances and has been fatigued and fresh ozone water supplied from the ozone water supply pipe L3. Its ozone concentration is lower than that of water. In the configuration in which the ozone water OL having a low ozone concentration is heated as described above, generation of active oxygen in the ozone water is smaller than that in the above-described embodiment (see FIG. 1) in which only the fresh ozone water having a high ozone concentration is heated. Progress slowly. Therefore, the embodiment shown in FIG. 1 is preferable in that a sufficient active oxygen concentration can be obtained in a short time.

In the above embodiment, the ozone water heating unit 6
Has a configuration in which a plurality of lamp heaters 64, 65, and 66 are used as a heating source as shown in FIG. 2, but a configuration in which an electromagnetic heating source, a nichrome wire, or the like is used as a heating source instead of the lamp heater may be used. Also, a pump for pumping ozone water toward the cleaning tank 2 to the ozone water supply pipe L3 shown in FIG. 1, a filter for purifying ozone water supplied to the cleaning tank 2, and an ozone water supply pipe L3 for opening and closing the ozone water supply pipe L3. Water washing tank 2
An on-off valve or the like for controlling the timing of supply to the power supply may be provided. Further, in the above embodiment, the substrate is cleaned, but the present invention is not limited to the cleaning process. For example, the oxidizing power of ozone water such as a process of forming a natural oxide film on the surface of the substrate is reduced. The present invention can be applied as long as the substrate is processed by using the method.

[0015]

As described in detail above, according to the first or second aspect of the present invention, the ozone water supplied to the substrate is heated by heating the ozone water supplied to the substrate in the processing tank. The concentration of active oxygen in the water increases and the oxidizing power of the ozone water increases. Substrate processing such as removal of organic substances attached to the substrate with the oxidized ozone water can be sufficiently performed.

[Brief description of the drawings]

FIG. 1 is a schematic diagram showing one embodiment of the present invention.

FIG. 2 is a schematic diagram showing an ozone water heating unit of the embodiment shown in FIG.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Substrate cleaning apparatus 2 Cleaning tank 4 Support member 6 Ozone water heating part L3 Ozone water supply pipe 64, 65, 66 Lamp heater

──────────────────────────────────────────────────続 き Continued on the front page (51) Int.Cl. ⁷ Identification symbol FI Theme coat ゛ (Reference) H01L 21/304 642 H01L 21/304 647Z 647 648K 648 21/30 572B

Claims (2)

[Claims] 1. A substrate processing apparatus for processing a substrate by immersing the substrate in ozone water, comprising: a processing tank for storing ozone water; support means for supporting the substrate in the ozone water stored in the processing tank; Substrate processing, comprising: supply means for supplying ozone water to the substrate and supplying ozone water to the substrate supported by the support means; and heating means for heating the ozone water supplied to the substrate by the supply means. apparatus. 2. A substrate processing method for processing a substrate by immersing the substrate in ozone water stored in a processing bath, comprising: introducing an substrate into the processing bath; A substrate processing method comprising: a supply step of supplying ozone water; and a heating step of heating ozone water supplied to the substrate in the supply step.