JP2000299603A - High frequency circuit device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a high frequency circuit device which can fix a high frequency device without using a gasket, enables miniaturization and reduction of weight and surely conducts an element container and a device container. SOLUTION: This device has an element container 91 made of a conductor, a high frequency device 90 having a connecting terminal protruded from that container 91 and a strip line 20. This device has a device container 50 for housing the device in the state of connecting the high frequency device 90 and the strip line 20 and a conductor piece 10 arranged between the device container 50 and the element container 91. The device container 50 has recessed parts 52 and 54 for housing a part of the element container 91. The conductor piece 10 has plural deformable projecting parts 110, is arranged from the base of the recessed parts 52 and 54 to the side face and tightly contacts to them while being pressed between the element container 91 and the recessed parts 52 and 54 in the case of housing the element container 91.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

The present invention relates to a high-frequency circuit device in which a high-frequency device and a strip line are accommodated in a container, and more particularly to a high-frequency circuit device having a structure in which a coaxial terminal of the device and the strip line are connected. .

[0002]

2. Description of the Related Art Some high-frequency circuit devices have a structure in which a plurality of high-frequency devices are connected by strip lines.
High-frequency devices usually have coaxial terminals for input and output.
Therefore, in such a high-frequency circuit, it is necessary to connect the high-frequency device and the strip line.

A high-frequency circuit device having a structure for connecting a high-frequency device and a strip line has a structure in which a high-frequency device and a strip line are connected and housed in a metal device container. High frequency devices
It has a structure in which an element main body is provided inside, the outside is surrounded by a metal element container, and connection terminals drawn out in a state insulated from the element container protrude from both ends. On the other hand, the strip line is composed of a center conductor, two dielectrics sandwiching the center conductor, and a ground conductor sandwiching the dielectric outside the center conductor. The connection terminal is connected to the center conductor. The device container includes an upper container portion and a lower container portion, and has a structure in which a strip line and a high-frequency device are sandwiched between the two.

A high frequency device and a strip line are
The high-frequency device and the connection portion between the connection terminal and the strip conductor are accommodated in the device container with at least one surface thereof covered with a metal foil. By doing so, continuity of grounding, which has a significant effect on characteristics, is achieved.

[0005]

However, in the conventional apparatus, the length of the gap formed between the element container and the apparatus container is not uniform due to the machining accuracy of the element container and the apparatus container. For this reason, the contact between the metal foil and the element container or the device container may be insufficient in relation to the thickness of the metal foil located in the gap. In such a case, there arises a problem that desired characteristics of the high-frequency circuit device cannot be obtained. For this reason, it has been considered to press the metal foil using a gasket or the like made of an elastic material in order to ensure reliable contact.

However, the gasket is required to have an extremely large thickness compared to the thickness of the metal foil in consideration of the deformation stroke. Therefore, it is necessary to make the gap between the device container and the element container large in consideration of the gasket loading. However, when the gap is made large, there is a problem that when mounting the high-frequency device in the apparatus container, the play becomes large, and the positioning accuracy of the high-frequency device deteriorates. In addition, it is necessary to increase the size of the device container by the amount of mounting the gasket, which hinders miniaturization.

According to the present invention, without using a gasket,
It is an object of the present invention to provide a high-frequency circuit device that can accurately fix a high-frequency device, reliably connect an element container to an apparatus container, and can be reduced in size and weight.

[0008]

According to the present invention, there is provided, according to the present invention, at least one high-frequency device having a conductor-made element container, and a connection terminal projecting outside the element container. In a high-frequency circuit device having a strip line to which a device is connected and an apparatus container for accommodating the same, a conductor piece having a plurality of deformable convex portions is formed, and the conductor piece is disposed inside the apparatus container. A high-frequency circuit device is provided, which is arranged at a position in contact with a surface of the element container of the high-frequency device parallel to the substrate.

The conductor piece may be arranged at a position covering at least the connection terminal projecting end base and the connection terminal. Further, the conductor piece is used on each of two surfaces parallel to the substrate of the element container, and at least one of the conductor pieces is arranged at a position at least covering the element container base and the connection terminal. It can be.

[0010] The conductor piece covering the element container base and the connection terminal may be extended to cover the connection terminal front position. Further, the conductor piece may have a width wider than a width of the strip conductor of the strip line and a width equal to or less than a width of the element container.

The conductor piece may be one in which the plurality of protrusions are distributed so as to protrude on at least one surface, or one in which the plurality of protrusions are respectively distributed on both surfaces.

Further, the projecting portion of the conductor piece may be configured to have a shape in which the outer periphery is smaller on the tip side than on the base side.

[0013]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Embodiments of the high-frequency circuit device according to the present invention will be described below with reference to the drawings.

FIG. 1 is a sectional view showing a first embodiment of a high-frequency circuit device according to the present invention, and FIG. 2 is a plan view showing a lower portion thereof.

The high-frequency circuit device of the present embodiment includes a high-frequency device 90 and a strip line 2 connected thereto.
0, a device container 50 for accommodating them, and a conductor piece 10.

The structure of the high-frequency device 90 includes a metal element container 91 having a high-frequency circuit built therein, and connection terminals 92 and 93 drawn out insulated from the element container 91.

The strip line 20 includes a center conductor 21
And dielectrics 22 and 23 sandwiching this. Dielectric 2
Ground conductors are provided on the outer side of 2 and 23 with these interposed therebetween. The connection terminals 92 and 93 and the center conductor 21 are connected.

The apparatus container 50 is composed of a container upper part 51 and a container lower part 53 each functioning as a ground conductor.
Sandwich. In the upper part 51 of the container, a concave portion 52 is provided in a region for accommodating the high-frequency device 90. The upper portion of the element container 91 of the high-frequency device 90 is accommodated in the concave portion 52. On the other hand, the high frequency device 9
A recess 54 is provided in a region for accommodating 0. And
The lower part of the element container 91 of the high-frequency device 90 is accommodated in the recess 54. The recesses 52 and 54 are each formed in a shape and a size that allow the element container 91 to be easily mounted.

The recess 52 is formed between the outer periphery of the element container 91 and the recess 5.
It is provided in such a size that a slight gap is formed between the inner circumference of the second and the inner circumference. The size of the gap is slightly smaller than the height of the conductor piece 10 including the protrusion, that is, the conductor piece 10
Is large enough to be pressed. For example, lower 0.1
mm, the upper side is about 0.2 mm. It is more preferable that the concavities and convexities of the conductor piece be reduced to reduce the gap.

On the other hand, in the present embodiment, the concave portion 54 is formed such that its inner peripheral dimension is substantially equal to or slightly larger than the outer peripheral dimension of the element container 91. That is, it is provided smaller than the above-described concave portion 52. Thereby, when the element container 91 is accommodated, the play between the element container 91 and the concave portion 54 can be reduced, and accurate positioning can be performed.

In the present embodiment, as shown in FIG. 1, three conductor pieces 11, 12, and 13 are prepared to be disposed on both sides of the high-frequency device 90 in this embodiment.
Here, the conductor pieces 11 and 12 are arranged at positions where at least the base of the element container 91 and the connection terminals 92 and 93 can be covered. Also, the conductor piece 1
1 and 12 are arranged so as to extend and cover to positions near the front of the connection terminals 92 and 93, respectively. Of course, the conductor pieces 11 and 12 have a planar shape and size that can be so covered. Here, the length of the extension is determined by the protrusions provided on the conductor pieces 11 and 12 (for example, FIG.
It is sufficient that one row of the protruding portions 111 or 112) is present in the extended portion. However, it is preferable to take allowances into account when considering a shift at the time of mounting. Specifically, the length is, for example, about 3 to 10 mm.

As described above, the conductor pieces 11 and 12 have a length that can cover the base of the element container 91 and the connection terminals 92 and 93 or a position near the front thereof. Also, the conductor pieces 11 and 12
Has a width wider than the width of the strip conductor 21 of the strip line 20 and less than or equal to the width of the element container 91, as shown in FIG. The conductor pieces 11 and 12 may be integrated.

In the present embodiment, as shown in FIG. 1, the conductor piece 13 is disposed in a concave portion 54 provided in the lower portion 53 of the container. Therefore, the conductor piece 13 has a shape and a size that can be accommodated in the bottom surface of the concave portion 54. Of course, it is not limited to this.

The conductor pieces 11 and 12 and the conductor piece 1
In the present embodiment, the conductor pieces 11 and 12 are arranged above the element container 91 and the conductor pieces 13 and
Are arranged below the element container 91. The present invention is not limited to this. The upper limit positional relationship between the conductor pieces 11 and 12 and the conductor piece 13 can be reversed. The vertical arrangement of these conductor pieces also changes depending on the manner in which the high-frequency device 90 is mounted on the apparatus container. That is, the area where the conductor pieces can be arranged may be restricted by the position of the fixing member such as a bolt.

As will be described later, a plurality of projections are distributed on the conductor piece 10, and the conductor piece 10 has elasticity in its thickness direction as a whole. Therefore, the conductor piece 10 is
2 and 54, and are pressed between the container upper part 51 and the container lower part 53 of the device container 50 and the element container 91. For this reason, the protrusion of the conductor piece 10 is elastically deformed, so that the conductor piece 10 is in close contact with the device container 50 and also in close contact with the element container 91. As a result, the conductor piece 10 is
0 and the outer wall of the element container 91, respectively, so as to ensure electrical continuity and secure stable and good continuity between the device container 50 and the element container 91. Thus, the continuity of the ground at the connection between the connection terminals 92 and 93 and the strip conductor 21 is ensured.

The conductor piece 10 has a structure in which a large number of convex portions projecting from at least one surface are distributed. Figures 1 and 2
, The convex portion is shown in a wavy line. Conductor piece 10
Has a shape in which the outer periphery is smaller on the tip side than on the base side. Specifically, for example, FIGS.
As shown in FIG. The protrusions are
The sharper the tip is, the more preferable, but not limited thereto.

FIGS. 3A to 3C show an example in which convex portions 110 having a substantially conical shape are arranged in a matrix. The convex portion 110 includes a convex portion 111 protruding from one surface,
Protrusions 112 (shown by broken lines for convenience of distinction) protruding from the other surface are alternately arranged. The pitch of the projections is, for example,
Both the length and width can be 0.5 mm. The height from the peak 111a to the peak 112a of the convex portion is
For example, it is 0.2 mm. In this example, since there are peaks 111a and 112a on both surfaces of the conductor piece 10, the contact pressure can be increased on both surfaces.

FIGS. 4A to 4C show an example in which the substantially conical convex portions 110 are arranged on one surface of the conductor piece 10 in a staggered lattice pattern. In this example, the pitch between the nearest adjacent convex portion 110 is (√2) / 2 mm. In other words, they are arranged in a matrix at a pitch of (ピ ッ チ 2) / 2 mm. The height of each projection 110 up to the peak 110a is, for example, 0.2 mm.

FIGS. 5A to 5C show an example in which substantially truncated-cone-shaped protrusions 120 are arranged in a staggered pattern on one surface of the conductor piece 10. In this example, the pitch between the nearest adjacent protrusion 120 is (√2) / 2 mm. In other words, they are arranged in a matrix at a pitch of (ピ ッ チ 2) / 2 mm. The height of each projection 120 up to the upper portion 120a is, for example, 0.2 mm.

FIGS. 6A to 6C show an example in which substantially hemispherical convex portions 130 are arranged in a staggered pattern on one surface of the conductor piece 10. In this example, the pitch between the nearest adjacent convex portion 130 is (√2) / 2 mm. In other words, they are arranged in a matrix at a pitch of (ピ ッ チ 2) / 2 mm. The height of each projection 130 up to the peak is, for example, 0.2 mm.

Next, a second embodiment according to the present invention will be described with reference to the drawings. FIG. 7 shows an example of the present embodiment. In the present embodiment, two sets of conductor pieces 11 and 12 are used as conductor pieces 10 and these are used as element containers 91.
It is an example of disposing on both the upper and lower surfaces of the image. The structure of the conductor pieces 11 and 12 to be used may be the same as in the first embodiment.

As shown in FIG. 7, in the case of this embodiment,
The conductor pieces 11 and 12 are arranged so as to extend from the bottom and side surfaces of the concave portions 52 and 54 to the outside thereof. That is, they are arranged so as to be located above and below the connection terminals 92 and 93, respectively. In the case of the present embodiment, similarly to the concave portion 52, the concave portion 54 has an inner peripheral dimension that forms a gap that allows a conductor piece to be sandwiched.

With such a configuration, the element container 9
The continuity of grounding is ensured above and below 1, and a more favorable result in performance is obtained than in the first embodiment. In addition,
The conductor pieces 11 and 12 may have an integral structure like the conductor piece 13.

Next, a third embodiment according to the present invention will be described with reference to FIG. The present embodiment is an example in which positioning can be performed accurately.

In this embodiment, as shown in FIG. 8, the conductor pieces 13 are arranged on the bottom surfaces of the concave portions 52 and 54, respectively. The recesses 52 and 54 are both provided in the element container 91.
Are formed to have an inner peripheral dimension that is approximately equal to or slightly larger than the outer peripheral dimension of. Therefore, the recesses 52, 54
When the element container 91 is inserted into the device container, almost no play occurs between the element container and the concave portions 52 and 54. Therefore, in the present embodiment, the element container 91 can be accurately positioned. Of course, also in the present embodiment, the continuity of grounding can be ensured by interposing the conductor piece 13 between the element container and the device container.

Although the performance is slightly inferior, the conductor piece 13
May be arranged only on one side of the element container 91, for example, only on the lower side.

[0037]

As described above, according to the present invention,
The high-frequency device can be accurately positioned and fixed without using a gasket. Further, the element container and the device container can be reliably conducted. further,
Enables downsizing and weight reduction,

[Brief description of the drawings]

FIG. 1 is a sectional view of a high-frequency circuit device according to a first embodiment of the present invention.

FIG. 2 is a plan view showing the high-frequency circuit device according to the first embodiment of the present invention in a state where an upper portion of a device container is removed.

3A and 3B show a part of a first example of a conductor piece that can be used in the present invention, wherein FIG. 3A is a plan view and FIG.
A ′ sectional view, (C) BB ′ sectional view.

FIGS. 4A and 4B show a part of a second example of a conductor piece that can be used in the present invention, wherein FIG. 4A is a plan view and FIG.
A ′ sectional view, (C) BB ′ sectional view.

5A and 5B show a part of a third example of a conductor piece that can be used in the present invention, wherein FIG. 5A is a plan view and FIG.
A ′ sectional view, (C) BB ′ sectional view.

6A and 6B show a part of a fourth example of a conductor piece that can be used in the present invention, wherein FIG. 6A is a plan view and FIG.
A ′ sectional view, (C) BB ′ sectional view.

FIG. 7 is a sectional view of a high-frequency circuit device according to a second embodiment of the present invention.

FIG. 8 is a sectional view of a high-frequency circuit device according to a third embodiment of the present invention.

[Explanation of symbols]

10, 11, 12, 13: conductor piece, 20: strip line, 21: strip conductor, 22, 23: dielectric, 5
0: apparatus container, 51: container upper part, 52, 54: concave part, 5
3 lower part of container, 90 high frequency device, 91 element container, 92, 93 connection terminal, 110, 111, 112,
120, 130 ... convex part.

Claims (8)

[Claims] 1. An element container made of a conductor, at least one high-frequency device having a connection terminal protruding outside the element container, a strip line to which the high-frequency device is connected, and an apparatus container for accommodating the strip line. A high-frequency circuit device, comprising: a conductor piece on which a plurality of deformable convex portions are formed; wherein the conductor piece contacts a surface of the element container of the high-frequency device parallel to the substrate in the device container. A high-frequency circuit device arranged at a position. 2. The high-frequency circuit device according to claim 1, wherein the conductor piece is disposed at a position at least covering the base of the connection terminal protruding end and the connection terminal. 3. The high-frequency circuit device according to claim 1, wherein the conductor piece is used on each of two surfaces of the element container parallel to the substrate, and at least one of the conductor pieces is the element container. A high-frequency circuit device is provided at a position covering at least a base and the connection terminal. 4. The high-frequency circuit device according to claim 2, wherein the conductor piece that covers the element container base and the connection terminal extends to cover the front position of the connection terminal. apparatus. 5. The high-frequency circuit device according to claim 1, wherein the conductor piece has a width larger than a width of a strip conductor of the strip line, and a width of the element container. A high-frequency circuit device having the following width. 6. The high-frequency circuit device according to claim 1, wherein the projecting portion of the conductor piece has a shape in which the outer periphery is smaller at the tip end side than at the base side. High frequency circuit device. 7. The high-frequency circuit device according to claim 1, wherein the plurality of protrusions are distributed so that the conductor pieces protrude from at least one surface. apparatus. 8. The high-frequency circuit device according to claim 1, wherein the conductor piece has a structure in which the plurality of protrusions are distributed on both surfaces.