JP2000293656A - Non-contact ic chip - Google Patents

Abstract

PROBLEM TO BE SOLVED: To prevent information recorded inside an IC chip from being read without using a reader/writer by providing a groove-shaped thin part at the opposite side of a surface on which the circuit of a semiconductor base is formed, applying force to a semiconductor from the outside and destroying the semiconductor base at the groove-shaped thin part. SOLUTION: A semiconductor base 1-1 constituting an IC chip is a plate like semiconductor such as a silicon wafer. The base 1-1 is also a minute matter that can be subjected to watermarking or insertion into a thin and flexible raw material such as paper. A CPU part 1-2 is connected to a memory part 103 and an antenna/power circuit part 1-4 through a bus 1-5 and controls each part. A groove-shaped structure provided on the opposite side of a surface on which the circuit of the base 101 is formed is thinner than the other parts. The base 1-1 can be destroyed at a groove 2 and the circuit of a memory circuit 103 formed in the neighborhood of the groove 2 can be also destroyed by applying force from the outside.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a non-contact IC chip capable of supplying power to an IC chip and reading / writing information in a non-contact manner, and in particular, without using a reader / writer device for the IC chip. The present invention relates to a non-contact IC chip capable of discarding information recorded inside an IC chip.

[0002]

2. Description of the Related Art As an IC card using a non-contact IC chip, there is, for example, a non-contact IC card described in Japanese Patent Application Laid-Open No. 5-298502. This IC card is shown in FIG.
The antenna coil shown in (1) is replaced with a seal type.

[0003] The IC card described in Japanese Patent Application Laid-Open No. 10-166679 is characterized by protecting the IC chip shown in FIG. 13 from stress.

[0004] These IC cards realize a structure for protecting the IC chip from stress and repair of the antenna by replacing the antenna.

[0005]

However, in the above-mentioned conventional IC card, the information recorded inside is erased and the IC card is erased.
When the card is discarded, it is necessary to delete the information recorded inside by the reader / writer device of the IC card or to stop the reading function by a flag operation.

Further, the IC card is mechanically destroyed to
It was necessary to be unable to read / write the card.

In particular, when an IC card is destroyed, the information recorded inside the IC card due to the destruction can be made unreadable by a reader / writer device, but it is difficult to confirm whether the information in the memory has been completely erased or unreadable. Was. For this reason, there is a danger that the information recorded inside is read from the discarded IC card and the information is stolen.

According to the present invention, in order to solve the above problems, it is possible to make it impossible to read information recorded inside an IC chip without using a reader / writer device of a non-contact IC chip. It is an object of the present invention to provide a non-contact IC chip and a paper containing the non-contact IC chip that can switch between the non-contact IC chip and the non-contact IC chip.

[0009]

SUMMARY OF THE INVENTION A non-contact IC chip to which the present invention is applied includes a microwave detection, modulation / demodulation, and IC.
An IC chip unit including an antenna / power supply circuit unit that supplies power to the chip, a memory unit that records programs and data, and a CPU unit that executes processing in accordance with the programs in the memory unit. And an antenna as a means for receiving and transmitting microwaves, and provide a service similar to an IC card that reads / writes information in a non-contact manner using microwaves.

In order to achieve the object of the present invention, a non-contact IC chip according to the present invention has the above-mentioned non-contact IC chip provided with the following means.

The non-contact IC chip of the present invention has a thin groove-shaped portion on the side opposite to the surface forming the semiconductor-based circuit constituting the IC chip, and forms a circuit on the opposite side of the thin groove-shaped portion. A memory section is formed near the surface to be used, and when the IC chip is physically destroyed for the purpose of invalidating use, the semiconductor base is destroyed at the thin groove-like portion, and the nearby memory section is also destroyed. Means.

Furthermore, the non-contact IC chip of the present invention
A groove-shaped thin portion is provided on a side opposite to a surface forming a semiconductor-based circuit forming C, and only a switch line is formed near a surface forming a circuit on the opposite side of the groove-shaped thin portion;
When the IC chip is destroyed for the purpose of invalidating the use, the semiconductor chip is destroyed at the thin groove-like portion, and a means for destroying the nearby switch line is provided.

As described above, since the circuit constituting the memory section together with the semiconductor base can be destroyed, it is possible to prevent the information recorded inside the IC chip from being read without using a reader / writer device for the non-contact IC chip. Will be possible.

Further, since the circuit constituting the switch line can be destroyed together with the semiconductor base, the IC chip can be turned on / off without using a reader / writer device for the non-contact IC chip, so that the IC chip can be operated by a flag. Function can be switched.

Further, even if the antenna / power supply circuit section other than the memory section of the IC chip, the CPU section, the bus and the antenna connecting them are destroyed, the information recorded inside by the reader / writer device of the non-contact IC chip is erased. If not,
Destruction of the circuit constituting the memory unit makes it possible to prevent recorded information from being read.

[0016]

DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, an embodiment of a non-contact IC chip of the present invention and a paper containing a non-contact IC chip in which the non-contact IC chip of the present invention is cut or sandwiched in a thin and flexible material such as paper. I do.

FIG. 1 is a structural diagram showing the shape of the non-contact IC chip of the present invention.

FIG. 1A is a block diagram showing the structure of the IC chip as viewed from the circuit side, and in the following description, it is referred to as the front side (circuit side). FIG. 1B is a block diagram showing the structure of the IC chip as viewed from the side, and in the following description, it is assumed to be a horizontal surface. FIG. 1C is a structural view of the IC chip as viewed from the side opposite to the circuit surface, and is hereinafter referred to as a back surface.

Reference numeral 1-1 denotes a semiconductor base constituting an IC chip, and denotes a plate-like semiconductor such as a silicon wafer.

The semiconductor base 1-1 is a fine one that can be cut or sandwiched in a thin and flexible material such as paper.

Reference numeral 1-2 denotes a CPU which executes processing in accordance with a program stored in the memory unit 1-3.
-5, the memory section 1-3 and the antenna / power supply circuit section 1
-4, a logic circuit for controlling each unit and executing a program.

Reference numeral 1-3 denotes a memory section for recording programs and data, and indicates a memory circuit such as an EEPROM or FRAM for recording programs and data.

Reference numeral 1-4 denotes an antenna / power supply circuit for detecting, modulating and demodulating microwaves and supplying power to the IC chip.
1 shows a circuit that supplies information by reading / writing information in a non-contact manner with an external reader / writer device shown in FIG.

1-5 is a CPU 1-2, a memory 1-
3, a bus for connecting the antenna / power supply circuit section 1-4, a signal line for passing data and control information, and a power supply line for supplying power.

Reference numeral 1-6 denotes an antenna for transmitting and receiving microwaves. The received microwave is supplied to the antenna / power supply circuit section 1-4, and the antenna / power supply circuit section 1-4 is provided.
1 shows a coil-shaped antenna for transmitting microwaves supplied from the antenna.

The antenna 1-6 is an extremely thin antenna that can be cut or sandwiched in a thin and flexible material such as paper.

Reference numeral 2 denotes a groove-like structure provided on the opposite side of the circuit constituting the semiconductor base 1-1.
-1 is thinner than other parts. Hereinafter, it is referred to as a groove.

The sizes of the semiconductor base 1-1 and the antenna 1-6 are 1-a << 1-c, 1-b << 1-d,
The chip is finer than the antenna.

Next, the detailed structure of the groove 2 will be described with reference to FIG.

FIG. 2 is an enlarged view of the groove 2 when the semiconductor base 1-1 is viewed from the side.

The size of the groove 2 is as follows: 2-e>2-a> 2-
b, 2-c> 2-d, and 2-
a> 2-b is smaller than 2-e of the memory unit 1-3, and is provided inside a circuit configuring the memory unit 1-3.

The depth 2-d of the groove 2 corresponds to the thickness 2-c of the semiconductor base 1-1 and the thickness of the semiconductor base 1-1.
And the sizes 1-b and 1-a of the semiconductor base 1-1.

Next, referring to FIG. 3 and FIG.
1 schematically shows that -1 can be broken by the groove 2.

FIG. 3 shows the structure of an apparatus for breaking a semiconductor base 1-1 in a groove 2 in a paper containing a non-contact IC chip in which the non-contact IC chip of the present invention is cut or sandwiched in a thin and flexible material such as paper. Is shown.

FIG. 3 (a) is a structural view of the paper containing the non-contact IC chip as viewed from the side. FIG. 3B shows the structure of a destruction device for breaking the semiconductor base 1-1 of the paper containing the non-contact IC chip in the groove 2 and the semiconductor base 1-1 broken in the groove 2. And

Reference numeral 3 denotes paper on which the non-contact IC chip of the present invention has been cut or sandwiched.

Reference numerals 3-1 and 3-2 denote rollers for externally applying a force for breaking the semiconductor base 1-1 in the groove 2, and a force of 4
-1, 4-2.

Reference numerals 4-1 and 4-2 denote stresses applied to the semiconductor base from outside by the rollers 3-1 and 3-2. These stresses schematically indicate that the semiconductor base 1-1 can be broken in the groove 2. In particular, these stresses are larger than the stress applied to the semiconductor base 1-1 when only the paper 3 is bent, and a stress proportional to the size 1-b of the semiconductor base 1-1 is applied.

As a result, when only the paper 3 is bent, the bending is dispersed in the paper portion other than the semiconductor base 1-1, so that stress is particularly applied to the semiconductor base 1-1 as shown in FIG. Without it, the semiconductor base 1-1 cannot be broken even if only the paper 3 is bent.

Next, referring to FIG.
An example of destruction will be described in detail.

FIG. 4A is a lateral view showing the IC chip before destruction. 4 (b) and 4 (c) are side views showing the IC chip after destruction. In the following description, FIG. 4 (b) will be referred to as destruction direction 1 and FIG. Let it be the breaking direction 2.

Reference numerals 4-1 and 4-2 denote externally applied stresses in the case of breaking in the direction indicated by the breaking direction 1, which indicates that the breaking occurs in the direction shown in the example of the breaking method in FIG.

Reference numerals 4-3 and 4-4 denote externally applied stresses when breaking in the direction indicated by breaking direction 2.

As described above, in the non-contact IC chip of the present invention and the paper containing the non-contact IC chip in which the non-contact IC chip of the present invention is laid or sandwiched in a thin and flexible material such as paper, a force 4-1 from the outside, By adding 4-2 or 4-3, 4-4, the semiconductor base 1
When -1 is destroyed by the groove 2, the circuit of the memory section 1-3 formed near the groove 2 is also destroyed.

Next, another embodiment of the groove 2 in the non-contact IC chip of the present invention will be described with reference to FIGS. 5, 6, and 7. FIG.

FIGS. 5A, 5B and 5C show another embodiment characterized by having at least two grooves 5-1 and 5-2.

FIG. 5A is a side view, FIG. 5B is a rear view, and FIG. 5C is a configuration diagram of the IC chip viewed from a different direction from that of FIG. 5B. A vertical view.

Reference numerals 5-1 and 5-2 denote a groove-like structure provided on the side opposite to the surface constituting the circuit of the semiconductor base 1-1. It is thinner.

As described above, in the non-contact IC chip of the present invention and the paper containing the non-contact IC chip in which the non-contact IC chip of the present invention is cut or sandwiched in a thin and flexible material such as paper, at least two grooves 5-1 are provided. ,
According to 5-2, the semiconductor base 1-1 is destroyed from at least two directions, and at the same time, the circuit of the memory section 1-3 formed near the grooves 5-1 and 5-2 is destroyed.

FIGS. 6A and 6B show a semiconductor base 1-1.
Another embodiment is characterized in that it has a notch-shaped groove 6.

FIG. 6A is a surface (circuit surface) diagram, and FIG.
(B) shows a lateral view.

Reference numeral 6 denotes a notched groove-like structure provided in the semiconductor base 1-1.

As described above, in the non-contact IC chip of the present invention and the paper containing the non-contact IC chip in which the non-contact IC chip of the present invention is cut or sandwiched in a thin and flexible material such as paper, the semiconductor base 1 is formed by the groove 6. 1 is destroyed, and at the same time, the memory section 1
Destroy the circuit of -3.

FIG. 7 shows a non-contact IC chip-containing paper in which the non-contact IC chip of the present invention is cut or sandwiched in a thin and flexible material such as paper.
Another embodiment is characterized in that the molding No. 1 is molded with a molding material 7.

FIG. 7 is a structural view of the paper containing the non-contact IC chip viewed from the side, and is a lateral view of the paper. Reference numeral 7 denotes a molding material obtained by molding the semiconductor base 1-1, and a molding material such as a resin. Reference numeral 7-1 denotes a groove-like structure provided in the molding material 7, which is thinner than other portions of the molding material 7.
Even if the groove-shaped structure is not provided in the semiconductor base 1-1, the groove-shaped structure is provided in the molding material formed by molding the semiconductor base 1-1, so that the semiconductor base 1-1 is destroyed and the groove 6 is formed. Can be destroyed.

As described above, in the non-contact IC chip of the present invention and the paper containing the non-contact IC chip in which the non-contact IC chip of the present invention is cut or sandwiched in a thin and flexible material such as paper, the groove 7-1 of the molding material is formed. At the same time, the semiconductor base 1-1 is destroyed, and at the same time, the circuit of the memory section 1-3 of the semiconductor base 1-1 formed near the groove 7-1 is destroyed.

FIG. 8 shows a print 8 at a position where the semiconductor base 1-1 is embedded in the paper 3 on a paper containing the non-contact IC chip, in which the non-contact IC chip of the present invention is cut or sandwiched in a thin and flexible material such as paper. Another embodiment is characterized in that the following is performed.

FIG. 8A is an external view of the paper containing the non-contact IC chip as viewed obliquely from above, and FIG.
FIG. 3 is an enlarged cross-sectional view of a part of the paper viewed from the side.

Reference numeral 8 denotes a line printed on the paper 3 and indicates that printing is performed near the groove 2 of the semiconductor base 1-1.

As described above, in the non-contact IC chip of the present invention and the paper containing the non-contact IC chip in which the non-contact IC chip of the present invention is laid or sandwiched in a thin and flexible material such as paper, the semiconductor base 1- The first groove 2 is destroyed.

Hereinafter, another embodiment of the non-contact IC chip of the present invention will be described with reference to FIGS.

FIG. 9 is a structural view showing the shape of another embodiment of the non-contact IC chip of the present invention, which will be described below.

FIG. 9A is a block diagram showing the structure of the IC chip as viewed from the circuit surface. In the following description, the structure is referred to as the surface (circuit surface). FIG. 9B is a block diagram showing the structure of the IC chip as viewed from the side, and in the following description, it is assumed to be a horizontal surface. FIG. 9C is a structural view of the IC chip as viewed from the side opposite to the circuit surface, and is hereinafter referred to as a back surface. FIG. 9D is a lateral view showing the IC chip after the destruction, and in the following description, a destruction example will be described.

Reference numeral 9 denotes a groove-like structure provided on the side opposite to the surface constituting the circuit of the semiconductor base 1-1.
-1 is thinner than other parts. Hereinafter, it is referred to as a groove. Reference numeral 1-7 denotes a switch line formed near the surface forming the circuit on the opposite side of the groove 9. Reference numerals 4-1 and 4-2 denote externally applied stresses when the semiconductor base 1-1 is broken. As shown in FIG. 9D, in the present embodiment, by applying an external stress, the switch line 1-7 is disconnected, and the operation of the CPU unit 1-2 is changed.

FIG. 10 is a flow chart showing a modification of the providing function in another embodiment of the non-contact IC chip of the present invention.

Reference numeral 10-1 denotes a state where the groove 9 is not broken and the switch line 1-7 is connected. 10-2
Indicates processing A provided by the non-contact IC chip when the switch line 1-7 is connected, the CPU unit 1-2 detects that the switch line 1-7 is connected, and accordingly, the memory unit 1- 3 according to the program read from
The process A is executed in the U section 1-2. On the other hand, 10-3 indicates a state where the groove 9 is broken and the switch line 1-7 is cut. Reference numeral 10-4 denotes processing B provided by the non-contact IC chip when the switch line 1-7 is cut off, and the CPU unit 1-2 detects that the switch line 1-7 is cut off, The process B is executed by the CPU 1-2 by the program read from the unit 1-3.

As described above, the non-contact IC chip according to the present invention has the switch line 1-
In addition to disconnecting 7, the provided function can be switched by switching the processing to be executed. As a result, the reader / writer of the non-contact IC chip 11-1 in FIG.
The function to be provided can be switched in accordance with a change in the purpose of use without using.

FIG. 11 shows a non-contact IC chip and a non-contact IC chip-containing paper in which the non-contact IC chip is laid or sandwiched in a thin and flexible material such as paper. An outline of an apparatus for reading / writing information will be described.

Reference numeral 11 denotes paper containing a non-contact IC chip;
Reference numeral -1 denotes an external antenna, 11-2 denotes an IC chip reader / writer, and 11-3 denotes a computer device for controlling these devices.

The present invention described above can be applied to an IC card in which an IC chip is embedded in a card. In that case, the IC chip may be either a contact type or a non-contact type.

The present invention described above is applicable to the contact type I
Also applicable to C chips.

[0072]

According to the present invention, the information recorded in the memory 1-3 can be destroyed without using the reader / writer 12-1 of the non-contact IC chip. It is possible to switch the provided function without using 1.

Further, according to the present invention, the information recorded inside the non-contact IC chip is read out by erasing the recorded information in the non-contact IC chip and switching the function by physical destruction. A non-contact IC card without the need can be provided.

If the information recorded inside cannot be erased even if the antenna / power supply circuit section, CPU section, bus, and antenna other than the memory section are broken, the information recorded by destroying the circuit constituting the memory section is destroyed. Can not be read out.

[Brief description of the drawings]

FIG. 1 is a structural diagram of an IC chip.

FIG. 2 is an enlarged view of a groove.

FIG. 3 is a structural view of a breaking device.

FIG. 4 is a destruction example.

FIG. 5 is another embodiment of the groove.

FIG. 6 is another embodiment of the groove.

FIG. 7 is another embodiment of the groove.

FIG. 8 is an example of printing on paper.

FIG. 9 is a structural diagram of an IC chip of another embodiment.

FIG. 10 is a flowchart of another embodiment.

FIG. 11 is a device outline of a reader / writer.

FIG. 12 is a structural view of a conventional example.

FIG. 13 is a structural view of a conventional example.

[Explanation of symbols]

1-1: semiconductor base 1-2: CPU section, 1-3
... Memory section, 1-4 ... Antenna / power supply circuit section, 1-5 ...
Bus, 1-6 ... antenna, 1-7 ... switch line, 2,5
-1, 5-2, 6, 7-1, 9 ... groove, 3 ... paper, 3-1
3-2: Roller, 4-1, 4-2, 4-3, 4-4 ...
Stress, 7: molding material, 8: printing, 11: paper,
11-1: antenna, 11-2: reader / writer, 11
-3 ... Computer device.

Claims (9)

[Claims] 1. An IC chip comprising a CPU section, a memory section, and an antenna / power supply circuit section, and an antenna.
In a writable IC chip, a groove-shaped thin portion is provided on a side opposite to a surface forming a semiconductor-based circuit constituting the IC chip portion, and a force is applied to the semiconductor base from the outside, whereby the groove is formed. A non-contact IC chip characterized by having a structure in which a semiconductor base is broken at a thin thin portion. 2. The non-contact IC chip, wherein the IC
2. A semiconductor device according to claim 1, wherein the semiconductor base of the chip portion has a cut portion, and a semiconductor base is broken at the cut portion by applying an external force to the semiconductor base. Non-contact IC described
Chips. 3. In the non-contact IC chip, a memory portion is formed in the vicinity of a surface forming a circuit on the opposite side of the groove-shaped thin portion, and a force is applied to the semiconductor base from the outside to form a groove. 2. The non-contact IC chip according to claim 1, wherein the semiconductor base is destroyed at a thin portion, and a nearby memory portion is destroyed. 4. In the non-contact IC chip, only a switch line is formed in the vicinity of a surface forming a circuit on the opposite side of the groove-shaped thin portion, and a force is applied to the semiconductor base from the outside to form the groove. When the semiconductor base is destroyed at the thin part of the shape, the nearby switch line is destroyed and the switch is turned on.
2. The non-contact IC chip according to claim 1, wherein the non-contact IC chip is turned off. 5. A paper containing a non-contact IC chip, wherein the non-contact IC chip according to claim 1 is cut or sandwiched in a thin and flexible material such as paper. 6. An IC card comprising the non-contact IC chip according to claim 1 provided on a card. 7. The non-contact IC chip, wherein only a switch line is formed in the vicinity of a surface constituting a circuit on the opposite side of the groove-shaped thin portion, and a force is applied to the semiconductor base from the outside, whereby the groove is formed. When the semiconductor base is destroyed at the thin part of the shape, the nearby switch line is destroyed and the switch is turned on.
Or turn it off and turn on or off the switch
2. The non-contact IC chip according to claim 1, wherein contents to be processed by the CPU unit are selected according to the conditions. 8. An IC chip section comprising a CPU section, a memory section, and an antenna / power supply circuit section, and an antenna.
In a writable IC chip, the IC chip portion is formed by molding with a molding material, and a groove-shaped thin portion is provided in the molding material on a side opposite to a surface of a semiconductor base circuit constituting the IC chip portion. A non-contact IC chip having a structure in which a semiconductor base is broken at a thin portion of the groove by applying an external force to the molding. 9. An IC comprising an IC chip section comprising a CPU section, a memory section, and an antenna / power supply circuit section and a connection terminal, and transmitting and receiving signals between the outside and the IC chip section via the connection terminal. In the chip, a thin groove-shaped portion is provided on a side opposite to a surface forming a semiconductor-based circuit forming the IC chip portion, and a force is applied to the semiconductor base from the outside, so that the thin groove-shaped portion is formed. An IC chip having a structure that destroys a semiconductor base.