JP2000289979A - Vertical conveyance device and vertical conveyance method and manufacturing device for substrate with thin film and manufacture thereof - Google Patents

Vertical conveyance device and vertical conveyance method and manufacturing device for substrate with thin film and manufacture thereof

Info

Publication number
JP2000289979A
JP2000289979A JP9765299A JP9765299A JP2000289979A JP 2000289979 A JP2000289979 A JP 2000289979A JP 9765299 A JP9765299 A JP 9765299A JP 9765299 A JP9765299 A JP 9765299A JP 2000289979 A JP2000289979 A JP 2000289979A
Authority
JP
Japan
Prior art keywords
substrate
band
suspension
suspension band
chamber
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP9765299A
Other languages
Japanese (ja)
Inventor
Yoshihiko Osawa
芳彦 大澤
Tatsuya Miyagawa
辰哉 宮川
Fumiyasu Nomura
文保 野村
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toray Industries Inc
Original Assignee
Toray Industries Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toray Industries Inc filed Critical Toray Industries Inc
Priority to JP9765299A priority Critical patent/JP2000289979A/en
Publication of JP2000289979A publication Critical patent/JP2000289979A/en
Pending legal-status Critical Current

Links

Abstract

PROBLEM TO BE SOLVED: To securely detect an abnormality irrespective of the number of suspension bands to be cut and loosened and a section to be cut and loosened, to detect an abnormality when a conveyance means overruns, to provide a detection means in a narrow installation space, and to improve maintenance property when cutting and loosening of the suspension bands and overrun of the conveyance means are detected automatically. SOLUTION: In a vertical conveyance device having a substrate holding unit 12 holding a substrate in a chamber and a conveyance means lifting and lowering the substrate holding unit to an arbitrary position in a suspension condition by a suspension band 19, a detector for detecting cutting and loosening of the suspension band is arranged in the vicinity of a suspension band winding part, and a detection means for detecting cutting and loosening of the suspension band capable of detecting cutting and loosening of the suspension band due to the deformation of the suspension band in the suspension band winding part and its contact with the detector when the suspension band is cut and loosened is provided.

Description

【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION

【0001】[0001]

【発明の属する技術分野】本発明は、ガラス板、樹脂
板、シリコンウェハ等の平面基板上に、反射防止、光学
フィルタリング等の機能を付加する各種薄膜を真空蒸
着、スパッタ等の手段により形成して、機能薄膜付き基
板を製造する技術分野に関する。より詳しくは、基板へ
の薄膜形成前後で多数の基板を昇降自在に搬送する搬送
装置において、搬送手段である吊下帯が切断および弛緩
したことを自動的に検出し、さらに搬送手段のオーバー
ランを検出する吊下帯切断検出装置を備えた垂直搬送装
置および垂直搬送装置並びに薄膜付き基板の製造装置お
よび製造方法に関する。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method of forming various thin films having functions such as anti-reflection and optical filtering on a flat substrate such as a glass plate, a resin plate and a silicon wafer by means of vacuum deposition, sputtering and the like. The technical field of manufacturing substrates with functional thin films. More specifically, in a transfer device that transports a large number of substrates up and down before and after thin film formation on a substrate, it is automatically detected that a suspension band, which is a transfer means, has been cut and loosened, and furthermore, the overrun of the transfer means is performed. TECHNICAL FIELD The present invention relates to a vertical transport device and a vertical transport device provided with a hanging band cut detection device for detecting a stagnation, and a device and a method for manufacturing a substrate with a thin film.

【0002】[0002]

【従来の技術】基板上にある種の機能を持つ薄膜を成形
する装置としては、たとえば、特開平10−25083
9号公報等に示されている真空蒸着装置がある。本蒸着
装置は、ガラス板、樹脂板等の平面基板上に、反射防止
膜を真空中において連続的に形成、製造するものであ
り、真空および高温雰囲気にされたチャンバー内部に予
熱室、加熱室、第1ストッカー室、蒸着室、第2ストッ
カー室、および出口バッファー室が区画形成され、区画
された前記各室間を基板を載置するカセットが水平搬送
手段により搬送される。予熱室、加熱室、第1ストッカ
ー室、第2ストッカー室、出口バッファー室では、基板
を載置するカセットが上下方向に多数棚状に収納し得る
ように多段構成のカセット収納棚を有しており、より小
さな床面積でより多くの基板を収納、処理できるよう、
工夫がなされている。また垂直搬送装置が前記カセット
収納棚の一段分に相当するピッチずつ間歇的に上昇ある
いは下降して、カセットを前記水平搬送手段から受けと
ったり、水平搬送手段に送り込むような構成が採用され
ている。さらに前記垂直搬送装置は昇降搬送手段から発
塵物の飛散による基板の汚れを防止することが可能な前
記搬送手段として、カセットを保持する基板保持ユニッ
トを吊下帯により懸下状態で昇降させる構成が採用され
ている。
2. Description of the Related Art An apparatus for forming a thin film having a certain function on a substrate is disclosed, for example, in Japanese Patent Application Laid-Open No. 10-25083.
For example, there is a vacuum deposition apparatus disclosed in Japanese Patent Application Laid-Open No. 9-No. The present vapor deposition apparatus is for continuously forming and manufacturing an antireflection film on a flat substrate such as a glass plate or a resin plate in a vacuum, and includes a preheating chamber, a heating chamber inside a vacuum and high temperature atmosphere chamber. , A first stocker chamber, a vapor deposition chamber, a second stocker chamber, and an exit buffer chamber are defined, and a cassette for mounting a substrate between the partitioned chambers is transported by horizontal transport means. Each of the preheating chamber, the heating chamber, the first stocker chamber, the second stocker chamber, and the outlet buffer chamber has a multi-stage cassette storage shelf so that a plurality of cassettes for mounting substrates can be stored in a vertical shelf. So that more substrates can be stored and processed in a smaller floor space,
Something has been devised. Further, a configuration is adopted in which the vertical transport device is intermittently raised or lowered by a pitch corresponding to one stage of the cassette storage shelf to receive the cassette from the horizontal transport unit or to send the cassette to the horizontal transport unit. Further, the vertical transport device is configured to raise and lower a substrate holding unit holding a cassette in a suspended state by a hanging band, as the transport unit capable of preventing contamination of the substrate due to scattering of dust from the lifting / lowering transport unit. Has been adopted.

【0003】上記の従来技術においては、吊下帯の切断
および弛緩検出装置について記載されていないが、この
ような垂直搬送装置における吊下帯の切断検出方法とし
ては、吊下帯の有無を検知する方法と、吊下帯巻付け軸
の回転トルクで吊下帯にかかる負荷変動を測定し、吊下
帯の切断を検出する方法が一般的に採用されている。
[0003] In the above prior art, there is no description about a device for detecting the cutting and loosening of the hanging band. However, as a method for detecting the cutting of the hanging band in such a vertical transport device, the presence or absence of the hanging band is detected. And a method of measuring the load fluctuation applied to the suspension band with the rotational torque of the suspension band winding shaft and detecting cutting of the suspension band.

【0004】前者は、例えば図10に示すように、チャ
ンバー内側面に光電検出器29を設け、吊下帯の有無を
検知する方法である。この方法は簡便であるが、光電セ
ンサーの位置によっては吊下帯が切断しても、切断した
吊下帯が光電検出器の検知範囲に有る場合は検出されな
い。従って切断位置に係わらず確実に検出するには複数
の光電検出器を配置する必要がある、上記の垂直搬送装
置のように、基板保持ユニットが昇降するチャンバー内
に支障なく配置するのは困難である。たとえ、配置した
としても、装置が複雑化すると共に、メンテナンス性を
著しく悪化させる。また、この方法で弛緩およびオーバ
ーランを検出しようとすると、吊下帯の振動による誤動
作が発生し易い。また、オーバーランを検出しなかった
場合、図11に示すように、搬送手段のプーリ21が下
降方向に回転しているにも係わらず、吊下帯19によ
り、基板保持ユニット12は上昇する方向に巻き上げら
れ、搬送装置を破損するという大きな問題が発生した。
一方、前記光電検出器の替わりに接触式検出器を吊下帯
に常時接触させるように配置し、切断および弛緩を検知
することは可能だが、吊下帯に検出器を接触させること
による弊害として、結束帯が摩耗して寿命を短くするば
かりではなく、摩耗粉が発生し基板に付着し、基板を汚
すという問題があった。
In the former method, as shown in FIG. 10, for example, a photoelectric detector 29 is provided on the inner surface of a chamber to detect the presence or absence of a suspension band. Although this method is simple, even if the suspension band is cut depending on the position of the photoelectric sensor, it is not detected if the cut suspension band is within the detection range of the photoelectric detector. Therefore, it is necessary to dispose a plurality of photoelectric detectors for reliable detection regardless of the cutting position. It is difficult to dispose them without any trouble in the chamber in which the substrate holding unit moves up and down, as in the above-described vertical transfer device. is there. Even if they are arranged, the apparatus becomes complicated and the maintainability is remarkably deteriorated. Further, when trying to detect relaxation and overrun by this method, a malfunction due to the vibration of the suspension band is likely to occur. In addition, when the overrun is not detected, as shown in FIG. 11, the substrate holding unit 12 moves in the ascending direction by the suspension band 19, although the pulley 21 of the transporting means is rotating in the downward direction. And the transport device is damaged.
On the other hand, it is possible to arrange the contact type detector so as to always contact the suspension band instead of the photoelectric detector, and to detect cutting and relaxation, but as a harmful effect of contacting the detector with the suspension band, In addition to the wear of the binding band, not only the life is shortened, but also there is a problem that abrasion powder is generated, adheres to the substrate, and stains the substrate.

【0005】後者は、個々の吊下帯巻取り軸に回転トル
ク検出器を取り付け、吊下帯にかかる負荷変動を測定す
ることにより、吊下帯の切断および弛緩を検知する方法
である。この回転トルク検出方法は検出器をチャンバー
外に配置できるため装置が簡便である。さらに搬送手段
のオーバーラン検知が容易にできる利点が有る。しか
し、該垂直搬送装置は、基板保持ユニットが昇降する
際、カセットの積載枚数が変わる。つまり、吊下帯巻付
軸の回転トルクが変動するので、複数の吊下帯で基板保
持ユニットを保持している場合、1本の吊下帯の切断お
よび弛緩を検出するには誤動作が多く、信頼性に欠ける
という問題があった。
[0005] The latter is a method in which a rotational torque detector is attached to each suspension band winding shaft, and a change in load applied to the suspension band is measured to detect cutting and loosening of the suspension band. In this method for detecting rotational torque, the detector can be arranged outside the chamber, so that the apparatus is simple. Further, there is an advantage that overrun detection of the transport means can be easily performed. However, in the vertical transport device, when the substrate holding unit moves up and down, the number of cassettes loaded changes. In other words, since the rotational torque of the suspension band winding shaft fluctuates, when the substrate holding unit is held by a plurality of suspension bands, there are many erroneous operations to detect cutting and loosening of one suspension band. However, there was a problem of lack of reliability.

【0006】[0006]

【発明が解決しようとする課題】本発明の目的は、真空
および加熱雰囲気で構成されるチャンバー内で、基板保
持ユニットを吊下帯により懸下状態で任意の位置に昇降
する搬送手段を有する垂直搬送装置において、吊下帯の
切断および弛緩並びに搬送手段のオーバーランを自動検
出するにあたって、吊下帯の切断および弛緩本数また
は、切断および弛緩箇所に係わらず確実に異常を検出
し、かつ、搬送手段がオーバーランしたとき検出可能で
あると共に、検出手段の設置スペースが狭く、メンテナ
ンス性が良い吊下帯切断および弛緩検出器付き垂直搬送
装置および垂直搬送方法並びに薄膜付き基板の製造装置
および製造方法を提供することにある。
SUMMARY OF THE INVENTION It is an object of the present invention to provide a vertical apparatus having a transfer means for raising and lowering a substrate holding unit to an arbitrary position under a suspension band in a chamber constituted by a vacuum and a heating atmosphere. In the transfer device, in automatically detecting the cutting and loosening of the suspension band and the overrun of the transfer means, the abnormality is reliably detected regardless of the number of cuts and loosening of the hanging band or the cutting and loosening position, and the transfer is performed. A vertical transport apparatus and a vertical transport method with a hanging band cutting and relaxation detector, which is capable of detecting when the means overruns, has a small installation space for the detection means, and has good maintainability, and a manufacturing apparatus and a manufacturing method of a substrate with a thin film Is to provide.

【0007】[0007]

【課題を解決するための手段】上記の目的を達成するた
め、本発明は以下の構成を採用する。
In order to achieve the above object, the present invention employs the following constitution.

【0008】すなわち請求項1の垂直搬送装置は、チャ
ンバー内で基板を保持する基板保持ユニットと、該基板
保持ユニットを吊下帯により懸下状態で任意の位置に昇
降する搬送手段を有する垂直搬送装置において、前記吊
下帯が切断および弛緩した際に生じる、前記吊下帯の巻
付部における変形を、該吊下帯と接触することによって
前記吊下帯の切断および弛緩を検知する検出手段を設け
たことを特徴とするものである。
That is, a vertical transfer apparatus according to a first aspect of the present invention has a substrate holding unit for holding a substrate in a chamber and a transfer means for lifting the substrate holding unit to an arbitrary position in a suspended state by a hanging band. In the apparatus, detecting means for detecting deformation and breakage of the hanging band by contacting the hanging band with a deformation of a winding portion of the hanging band caused when the hanging band is cut and relaxed. Is provided.

【0009】請求項2の垂直搬送方法は、チャンバー内
で基板を保持する基板保持ユニットと、該基板保持ユニ
ットを吊下帯により懸下状態で任意の位置に昇降する垂
直搬送方法において、前記吊下帯が切断および弛緩した
際に生じる、前記吊下帯の巻付部における変形を、該吊
下帯と接触することによって検出することにより、前記
吊下帯の切断および弛緩を検出することを特徴とするも
のである。
The vertical transfer method according to claim 2, wherein the substrate transfer unit holds a substrate in a chamber, and the vertical transfer method moves the substrate hold unit up and down to an arbitrary position in a suspended state by a suspension band. When the lower band is cut and relaxed, the deformation in the winding portion of the suspension band is detected by contacting the suspension band to detect the cutting and relaxation of the suspension band. It is a feature.

【0010】請求項3の垂直搬送方法は、基板保持ユニ
ットを下降方向に搬送する際における前記搬送手段のオ
ーバーランによって生じる、前記吊下帯の巻付部におけ
る変形を、該吊下帯と接触することによって検出するこ
とにより、前記吊上帯のオーバーランを検知することを
特徴とするものである。
According to a third aspect of the present invention, in the vertical transfer method, when the substrate holding unit is transferred in the descending direction, the deformation of the winding portion of the hanging band caused by the overrun of the transferring means is brought into contact with the hanging band. In this case, the overrun of the lifting band is detected.

【0011】請求項4の薄膜付き基板の製造装置はその
基板の搬送装置として、上記いずれかの垂直搬送装置を
有するものである。
According to a fourth aspect of the present invention, there is provided an apparatus for manufacturing a substrate with a thin film, comprising any one of the above-described vertical transport devices as a transport device for the substrate.

【0012】請求項5の薄膜付き基板の製造方法は、そ
の製造工程中の基板の搬送方法において、上記いずれか
の垂直搬送方法を用いるものである。
According to a fifth aspect of the present invention, in the method of manufacturing a substrate with a thin film, any one of the above-described vertical transfer methods is used in the method of transferring a substrate during the manufacturing process.

【0013】請求項1および2の垂直搬送装置および方
法によれば、真空および加熱雰囲気で構成されるチャン
バー内で、吊下帯の切断および弛緩本数または、切断お
よび弛緩箇所に係わらない異常検出と搬送手段がオーバ
ーランしたときも検出可能となるので、垂直搬送装置へ
のダメージが極めて少なくでき、メンテナンス性並びに
生産性の向上を図ることができる。
[0013] According to the vertical transfer apparatus and method according to the first and second aspects, it is possible to detect an abnormality irrespective of the number of cuts and loosening of the suspension band or the location of the cutting and loosening in the chamber constituted by the vacuum and the heating atmosphere. Since it is possible to detect even when the transporting means overruns, damage to the vertical transporting device can be extremely reduced, and maintenance and productivity can be improved.

【0014】請求項4および5の薄膜付き基板の製造装
置および製造方法によれば薄膜付き基板の生産性が飛躍
的に向上させることができる。
According to the apparatus and method for manufacturing a substrate with a thin film according to the fourth and fifth aspects, the productivity of the substrate with a thin film can be drastically improved.

【0015】[0015]

【発明の実施の形態】以下、本発明の垂直搬送装置の一
態様につき、図を用いながら説明する。
DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS One embodiment of the vertical transport device of the present invention will be described below with reference to the drawings.

【0016】図1は本発明の垂直搬送装置が適用できる
薄膜つき基板の製造装置の一実施態様を示す正面図であ
り、図2は図1の上面図である。また、図3は本発明に
かかる垂直搬送装置の一例を示す正面図であり、図4は
本発明にかかる垂直搬送装置の一例を示す斜視図であ
る。図5および図6は本発明にかかる垂直搬送装置を構
成する吊下帯切断および弛緩検出装置の一例を詳細に示
す正面図および側面図である。図7は本発明にかかる垂
直搬送装置を構成する吊下帯の切断状態示す正面図であ
り、図8は本発明にかかる垂直搬送装置を構成する搬送
手段がオーバーランし吊下帯が弛緩した状態を示す正面
図である。また、図9本発明にかかる垂直搬送装置を構
成する吊下帯の切断および弛緩時、吊下帯が検出装置に
接触した状態を示す正面図である。
FIG. 1 is a front view showing an embodiment of an apparatus for manufacturing a substrate with a thin film to which the vertical transfer apparatus of the present invention can be applied, and FIG. 2 is a top view of FIG. FIG. 3 is a front view showing an example of the vertical transport device according to the present invention, and FIG. 4 is a perspective view showing an example of the vertical transport device according to the present invention. FIGS. 5 and 6 are a front view and a side view showing in detail an example of a suspension band cutting and relaxation detecting device constituting the vertical transport device according to the present invention. FIG. 7 is a front view showing a cut-off state of a hanging band constituting the vertical conveying device according to the present invention, and FIG. 8 is a state in which the conveying means constituting the vertical conveying device according to the present invention overruns and the hanging band is relaxed. It is a front view showing a state. FIG. 9 is a front view showing a state in which the suspension band contacts the detection device when the suspension band constituting the vertical transport device according to the present invention is cut and relaxed.

【0017】この実施態様では、図1に示すように、基
板Aが載置されたカセット2(図4参照)が、入り口部
コンベア1により真空および高温雰囲気の予熱室4に搬
送される。予熱室4は、加熱室5、第1ストッカ室6、
第2ストッカ室8、出口バッファ室9と同じ内部構成を
有しており、図3に示すように、複数の基板Aを載置し
たカセット2を多数上下方向に棚状に多段収納できる基
板保持ユニット12と、カセット2を次の工程に水平方
向に搬送する水平搬送ローラ15を有している。さらに
室内の圧力は、ゲートバルブ3で大気との遮断を行え
ば、図示していない真空ポンプ、ブロアー、コンプレッ
サー等の圧力制御手段によって自在に圧力設定できる。
In this embodiment, as shown in FIG. 1, a cassette 2 on which a substrate A is placed (see FIG. 4) is conveyed by an entrance conveyor 1 to a preheating chamber 4 in a vacuum and high-temperature atmosphere. The preheating chamber 4 includes a heating chamber 5, a first stocker chamber 6,
The substrate holding unit has the same internal configuration as the second stocker room 8 and the exit buffer room 9, and can store a large number of cassettes 2 on each of which a plurality of substrates A are mounted in a shelf in the vertical direction as shown in FIG. It has a unit 12 and a horizontal transport roller 15 for transporting the cassette 2 horizontally in the next step. Further, the pressure in the room can be freely set by a pressure control means such as a vacuum pump, a blower, or a compressor (not shown) if the gate valve 3 shuts off the atmosphere.

【0018】基板保持ユニット12内部には、カセット
2端部を支持して一定ピッチでカセット2を棚状に収納
可能とする支持棚28と、前記カセット2の枚数に対応
してカセット2に近接してヒーター13が、上下方向に
それぞれ設けられており、基板Aを収納した状態で所定
の温度に加熱することが可能である。さらに基板保持ユ
ニット12は、その上部で吊下げユニット17と係合し
て、吊下げユニット17に懸下される状態になってい
る。
Inside the substrate holding unit 12, a support shelf 28 supporting the end of the cassette 2 and accommodating the cassette 2 in a shelf at a constant pitch, and being close to the cassette 2 corresponding to the number of the cassettes 2 The heaters 13 are provided in the vertical direction, respectively, and can heat the substrate A to a predetermined temperature in a state where the substrate A is stored. Further, the substrate holding unit 12 is engaged with the suspension unit 17 at an upper portion thereof, and is in a state of being suspended by the suspension unit 17.

【0019】吊下げユニット17は基板保持ユニット1
2との係合部、荷重支持部、駆動部よりなり、本実施態
様における吊下げユニット17は、吊下げ部材18、4
本の吊下帯19、吊下げ部材18と吊下帯19の一端を
固定する吊下帯取付け金具23、プーリー20で構成さ
れている。ここで、吊下帯19のもう一端はプーリ20
と係合し、さらにこのプーリ20は、図4に示すよう
に、駆動軸21を介して、駆動モータ22に連結してい
る。従って駆動モータ22を駆動してプーリ20を回転
させれば、吊下帯19の巻取り、巻き戻しが行え、これ
によって吊下帯19に連結している基板保持ユニット1
2の昇降が可能となる。またモータ22の動作を制御し
て、基板保持ユニット12に収納されているカセット2
の上下方向ピッチに相当する長さ分だけ、基板保持ユニ
ット12を間歇的に昇降させることもできる。この一定
ピッチ分の上下方向移動と水平搬送ローラ15の動作を
組み合わせることによって、カセット2の基板保持ユニ
ット12への収納、取り出しが自在にできることにな
る。
The suspension unit 17 is the substrate holding unit 1
2, the suspension unit 17 in this embodiment comprises a suspending member 18,
It comprises a hanging band 19, a hanging member 18, a hanging band mounting bracket 23 for fixing one end of the hanging band 19, and a pulley 20. Here, the other end of the suspension band 19 is connected to a pulley 20.
, And the pulley 20 is connected to a drive motor 22 via a drive shaft 21 as shown in FIG. Accordingly, when the drive motor 22 is driven to rotate the pulley 20, the suspension band 19 can be wound up and rewinded, and thereby the substrate holding unit 1 connected to the suspension band 19
2 can be moved up and down. Further, the operation of the motor 22 is controlled so that the cassette 2 stored in the substrate holding unit 12 is controlled.
The substrate holding unit 12 can be raised and lowered intermittently by a length corresponding to the vertical pitch of the substrate holding unit. By combining the vertical movement of this fixed pitch and the operation of the horizontal transport roller 15, the cassette 2 can be freely stored in and removed from the substrate holding unit 12.

【0020】本発明にかかる吊下帯19の切断および弛
緩状態を図7と図8に示すが、その検出装置50は、図
5および図6に示すように、吊下帯19の変形を感知す
る接触板24、電気を絶縁する絶縁体25、前記絶縁体
25を支えるホルダー26と、電気導入線27で構成さ
れる。切断および弛緩検出装置50は、吊下帯19を巻
取るプーリ20の下面に接触板24を近接するように設
ける。さらにホルダー26はプーリ20の軸受け16に
固定されている。さらに電気導入線27はチャンバー1
1外部よりチャンバー11内に導入して、接触板24と
ホルダー26にそれぞれ固定されている。
FIGS. 7 and 8 show the cutting and loosening state of the hanging band 19 according to the present invention. The detecting device 50 detects the deformation of the hanging band 19 as shown in FIGS. A contact plate 24, an insulator 25 for insulating electricity, a holder 26 for supporting the insulator 25, and an electric lead 27. The cutting and relaxation detecting device 50 is provided with the contact plate 24 close to the lower surface of the pulley 20 on which the suspension band 19 is wound. Further, the holder 26 is fixed to the bearing 16 of the pulley 20. Further, the electricity introduction line 27 is connected to the chamber 1
1 is introduced into the chamber 11 from the outside, and is fixed to the contact plate 24 and the holder 26, respectively.

【0021】ここで接触板24の材質および厚みは、導
電性、弾力性、耐屈曲性があり、プーリ20に巻付けら
れた吊下帯19の変形により撓み、ホルダー26に接す
る材質および厚みものならいかなるもでも良いが、耐高
温、耐真空、クリーン性が必要な本実施態様例では金属
製特にステンレスバネ鋼の接触板が好ましい。なお、吊
下帯19が導電性の材質であれば、吊下帯19が接触板
24に接触しただけで通電するので、接触板の厚みは限
定されない。さらに絶縁体25は絶縁性、耐久性がある
ものであればいかなるもでも良いが、本実施態様例では
陶磁器製の絶縁体が好ましい。さらにホルダー26およ
び軸受け16の材質は、導電性、耐久性があればいかな
るもでも良いが、本実施態様例では金属製特にステンレ
スの部材が好ましい。
Here, the material and thickness of the contact plate 24 are conductive, elastic and flexible, and are bent by the deformation of the suspension band 19 wound around the pulley 20 to be in contact with the holder 26. Any contact may be used, but in the present embodiment requiring high temperature resistance, vacuum resistance, and cleanness, a contact plate made of metal, particularly stainless steel, is preferred. In addition, if the suspension band 19 is made of a conductive material, current flows only when the suspension band 19 contacts the contact plate 24, and thus the thickness of the contact plate is not limited. Further, the insulator 25 may be any insulator as long as it has insulating properties and durability. In the present embodiment, a ceramic insulator is preferable. Further, the material of the holder 26 and the bearing 16 may be any material as long as it has conductivity and durability. In this embodiment, a metal member, particularly a stainless steel member, is preferable.

【0022】また、接触板24とプーリ20の隙間S1
と接触板24とホルダー26の隙間S2は吊下帯の変形
を確実に検知するために、出来る限り狭い方が良いが、
チャンバー内を加熱雰囲気で吊下げユニット17を上限
まで上昇させた状態で隙間S1は1〜3mmになるよう
に接触板の配置を調整するのが好ましい。隙間S2は2
〜5mmになるように絶縁体の厚さを調整するのが好ま
しいが、吊下帯19が導電性の材質であれば隙間を広く
することに制限はない。
The gap S1 between the contact plate 24 and the pulley 20
The gap S2 between the contact plate 24 and the holder 26 should be as narrow as possible in order to reliably detect the deformation of the suspension band,
It is preferable to adjust the arrangement of the contact plates so that the gap S1 is 1 to 3 mm in a state where the suspension unit 17 is raised to the upper limit in a heating atmosphere in the chamber. The gap S2 is 2
It is preferable to adjust the thickness of the insulator so as to be about 5 mm, but there is no limitation on widening the gap as long as the suspension band 19 is made of a conductive material.

【0023】さらに切断および弛緩検出装置50の配置
は、プーリ20近傍であれば制約はなく、プーリ20の
上面または側面でも良いが、吊下帯19の切断による変
形を確実に検出するためには、検出装置50をプーリ2
0の下面に設け、プーリ20とチャンバー11内部の上
面の隙間Hはできる限り狭くするのが好ましい。
Further, the arrangement of the cutting and loosening detecting device 50 is not limited as long as it is near the pulley 20, and may be on the upper surface or the side surface of the pulley 20, but in order to reliably detect the deformation of the hanging band 19 due to the cutting. , Detecting device 50 with pulley 2
It is preferable that the gap H between the pulley 20 and the upper surface inside the chamber 11 be as narrow as possible.

【0024】また、吊下帯19の極くわずかの弛緩によ
る変形を確実に検出するためには、接触板24とプーリ
20の隙間をできる限り狭くするとともに、吊下帯19
の材質は導電性がある金属製、特に耐高温、耐高真、ク
リーン性に優れているステンレス製スチールベルトが好
ましく、吊下帯19が接触板24に接触(図9参照)し
ただけで弛緩を確実に検出することが可能になり、図8
に示すように、基板保持ユニット12が下降方向に搬送
される際、搬送手段がオーバーランした場合の検出が可
能になる。さらに吊下帯19の長さは、基板保持ユニッ
ト12が最下降位置にある時、プーリ20に2〜3周巻
き取られている長さにしておけば、切断個所に係わらず
吊下帯19の切断を検出することが可能になる。
Further, in order to reliably detect the deformation of the suspension band 19 due to very slight relaxation, the gap between the contact plate 24 and the pulley 20 is made as small as possible, and
Is preferably made of a conductive metal, in particular, a stainless steel belt which is excellent in high temperature resistance, high resistance and cleanliness, and relaxes only when the suspension band 19 contacts the contact plate 24 (see FIG. 9). Can be reliably detected, and FIG.
As shown in (1), when the substrate holding unit 12 is transported in the descending direction, it is possible to detect a case where the transport unit overruns. Furthermore, if the length of the suspension band 19 is set to a length that is wound around the pulley 20 two or three times when the substrate holding unit 12 is at the lowest position, the suspension band 19 is independent of the cutting position. Disconnection can be detected.

【0025】前記吊下帯の切断および弛緩検出装置の実
施態様によれば、吊下帯の切断および弛緩本数または、
切断および弛緩箇所に係わらない異常検出と信頼性が高
く、さらに装置が簡便で設置スペースも小さいため、チ
ャンバーをコンパクトにすることが可能となり、高真空
室の場合特に有利である。さらに昇降中、吊下帯に検出
装置を接触させることなく異常を検出させることで、吊
下帯および検出装置からの発塵物の飛散による基板の汚
染とという問題も生じない。
According to the embodiment of the apparatus for detecting the cutting and loosening of the hanging band, the number of cutting and relaxing of the hanging band, or
Since abnormality detection and reliability are high irrespective of the cutting and loosening points, the apparatus is simple and the installation space is small, the chamber can be made compact, which is particularly advantageous in a high vacuum chamber. Further, by detecting an abnormality without bringing the detecting device into contact with the hanging band during the ascent / descent, the problem of contamination of the substrate due to scattering of dust from the hanging band and the detecting device does not occur.

【0026】次に本発明の垂直搬送装置を適用した図1
の薄膜付き基板の製造装置による薄膜基板製造方法につ
いて説明する。
Next, FIG. 1 to which the vertical transport device of the present invention is applied.
A method of manufacturing a thin film substrate by the apparatus for manufacturing a substrate with a thin film described above will be described.

【0027】まず、基板Aが載置されたカセット2(図
3参照)が、入り口部コンベア1から水平搬送ローラ1
5に受け渡されて、真空および加熱雰囲気で構成される
予熱室4内に搬送される。予熱室4は、次の加熱室5に
おいて基板Aに付着した水分を蒸発させるためにあらか
じめ基板を予熱するゾーンであり、ゲートバルブ3で室
内と大気と遮断して真空圧に設定できるようになってい
る。一方、水平搬送ローラ15上のカセット2は予熱室
4内の中央付近で停止する。ついで基板保持ユニット1
2が上下方向のカセット収納ピッチ(カセット収納ピッ
チ)に相当する長さだけ上昇し、基板保持ユニット12
内にカセット収納ピッチに対応して設けられた支持棚2
8でカセット2をすくい上げ、収納動作が完了する。続
いて次のカセット2が入口コンベア1から供給されるの
で、同じ動作を次々と繰り返して、多数個のカセット2
を基板保持ユニット12内に棚状に多段収納する。収納
枚数は、例えば1成膜単位が16枚なら、通常は16個
のカセットが収納可能となるよう構成する。
First, the cassette 2 on which the substrate A is placed (see FIG. 3) is moved from the entrance conveyor 1 to the horizontal transport roller 1.
5 and transferred into a preheating chamber 4 composed of a vacuum and a heating atmosphere. The preheating chamber 4 is a zone in which the substrate is preheated in advance to evaporate the moisture attached to the substrate A in the next heating chamber 5, and can be set at a vacuum pressure by shutting off the room and the atmosphere by the gate valve 3. ing. On the other hand, the cassette 2 on the horizontal transport roller 15 stops near the center in the preheating chamber 4. Next, the substrate holding unit 1
2 rises by a length corresponding to the cassette storage pitch in the vertical direction (cassette storage pitch), and the substrate holding unit 12
Support shelves 2 corresponding to the cassette storage pitch
At 8, the cassette 2 is picked up and the storing operation is completed. Subsequently, since the next cassette 2 is supplied from the entrance conveyor 1, the same operation is repeated one after another, and a large number of cassettes 2
Are stored in a shelf in the substrate holding unit 12 in multiple stages. For example, if the number of stored sheets is 16 in one film-forming unit, normally, 16 cassettes can be stored.

【0028】基板保持ユニット12からのカセット取り
出しは次の手順にて行われる。まず搬送ローラ15を停
止させ、次いで基板保持ユニット12をカセット収納ピ
ッチ分だけ下降させる。この動作によって支持棚28に
支持されていたカセット2は水平搬送ローラ15に載せ
替えられ、水平搬送ローラ15を駆動してカセット2を
次の工程に送り出す。以下この動作を繰り返せば次々に
カセットの取り出し、送り出しができるようになる。
The removal of the cassette from the substrate holding unit 12 is performed in the following procedure. First, the transport roller 15 is stopped, and then the substrate holding unit 12 is lowered by the cassette storage pitch. By this operation, the cassette 2 supported on the support shelf 28 is replaced by the horizontal transport roller 15, and the horizontal transport roller 15 is driven to send the cassette 2 to the next step. Hereinafter, if this operation is repeated, the cassette can be successively taken out and sent out.

【0029】さて、予熱室4で一定時間予熱された基板
Aはカセット2に載置された状態で、上記の動作によっ
て加熱室5へ移動、棚状に収納される。加熱室5内で基
板Aに付着した水分の蒸発が完了したら、同様の方法で
基板Aはカセット2に載置された状態で第1ストッカー
室6に搬送、棚状にストックされる。
The substrate A, which has been preheated in the preheating chamber 4 for a predetermined time, is moved to the heating chamber 5 by the above-described operation while being placed in the cassette 2, and is stored in a shelf shape. After the evaporation of the moisture attached to the substrate A in the heating chamber 5 is completed, the substrate A is transported to the first stocker chamber 6 while being placed on the cassette 2 and stocked in a shelf shape by the same method.

【0030】次に、第1ストッカー室6に収納されたカ
セット2を上記の方法で1個ずつ水平搬送ローラ15に
載せ替え、水平搬送ローラ15によりカセット2を蒸着
室7まで移動させて、成膜粒子束Bに基板Aを暴露させ
ることにより基板Aの表面に薄膜を形成させる。さらに
必要に応じてカセット2を次々に第2ストッカー室8、
出口バッファ室9に搬入、棚状に収納して、最終的に出
口部コンベア11で基板Aを載置したカセット2を取出
す。
Next, the cassettes 2 stored in the first stocker chamber 6 are replaced one by one on the horizontal transport roller 15 by the above-mentioned method, and the cassette 2 is moved to the vapor deposition chamber 7 by the horizontal transport roller 15 to form the cassette. By exposing the substrate A to the film particle bundle B, a thin film is formed on the surface of the substrate A. Further, if necessary, the cassettes 2 are sequentially stored in the second stocker room 8,
The cassette 2 on which the substrate A is placed is loaded into the outlet buffer chamber 9 and stored in a shelf shape, and is finally taken out by the outlet conveyor 11.

【0031】さらに層数の多い多層膜を成形するとき
は、前記の工程で表面に薄膜形成を完了した基板Aを載
置したカセット2を第2ストッカー室8へ移動、棚状に
収納した後に、カセットを再び取り出して、水平搬送ロ
ーラ15により蒸着室室の方に逆向きに移動させて、再
度基板上に成膜を実行させる。再成膜を完了した基板A
を載置したカセット2は第1ストッカー室6へ搬送、棚
状に収納される。この再成膜プロセスは、所望の回数繰
返すことも可能である。蒸着室の通過回数が偶数でよい
時は、所定回数の薄膜成形が完了した基板Aを載置した
カセットを水平搬送ローラ15により逆向きに移動さ
せ、各蒸着室内で成膜粒子束に基板を暴露しないように
すれば、薄膜成形回数に関係なく出口部コンベア10で
薄膜形成基板を取り出せることになる。
When a multilayer film having a larger number of layers is to be formed, the cassette 2 on which the substrate A on which the thin film has been formed on the surface in the above-described process is moved to the second stocker chamber 8 and stored in a shelf shape. Then, the cassette is taken out again, and is moved in the opposite direction toward the vapor deposition chamber by the horizontal transport roller 15, and the film is again formed on the substrate. Substrate A after completion of re-deposition
Is transported to the first stocker chamber 6 and stored in a shelf shape. This re-deposition process can be repeated a desired number of times. When the number of times of passage through the vapor deposition chamber may be an even number, the cassette on which the substrate A on which the thin film formation has been completed a predetermined number of times is placed is moved in the opposite direction by the horizontal transport roller 15, and the substrate is deposited on the film-forming particle bundle in each vapor deposition chamber. If the exposure is not performed, the thin film forming substrate can be taken out by the outlet conveyor 10 regardless of the number of times of forming the thin film.

【0032】本発明での成膜対象基板としては、ガラス
基板やプラスチック平板あるいはプラスチックシート、
各種半導体、光ディスク、LCD、カラーフィルターな
どの枚葉物が好ましい。これらの成膜対象基板に薄膜を
形成した後に光学フィルターや表示装置の反射防止材と
して使用する場合は、成膜対象基板は透明または半透明
のものが好ましく用いられる。このような対象基板へ薄
膜形成する成膜プロセスとしては、真空蒸着、イオンア
シスト蒸着、イオンプレーティング、スパッタリングお
よびアブレーションなどが好ましく用いられる。
In the present invention, the substrate to be formed may be a glass substrate, a plastic flat plate or a plastic sheet,
Single wafers such as various semiconductors, optical disks, LCDs, and color filters are preferred. When a thin film is formed on such a substrate to be formed and then used as an antireflection material for an optical filter or a display device, a transparent or translucent substrate is preferably used. As a film forming process for forming a thin film on such a target substrate, vacuum deposition, ion-assisted deposition, ion plating, sputtering, ablation, and the like are preferably used.

【0033】また、本発明の垂直搬送装置は、基板に薄
膜を蒸着する装置に限らず、真空および高温雰囲気下で
基板を垂直搬送する装置であればいかなるものでも適用
可能である。
The vertical transfer device of the present invention is not limited to a device for depositing a thin film on a substrate, but may be any device for vertically transferring a substrate in a vacuum and high-temperature atmosphere.

【0034】[0034]

【発明の効果】本発明は、上記の構成とすることによ
り、以下の優れた効果を奏する。すなわち、請求項1お
よび2から3の垂直搬送装置および搬送方法によれば、
吊下帯の切断および弛緩を自動検出するにあたって、吊
下帯の切断および弛緩本数または、切断および弛緩箇所
に係わらない異常検出と搬送手段がオーバーランしたと
きも検出できるようにしたので、従来方式より信頼性が
高く、かつつ吊下帯が切断および不当に弛緩した場合、
垂直搬送装置へのダメージが極めて少なくでき、メンテ
ナンス性が良い。さらに装置が簡便で設置スペースも小
さいため、チャンバーをコンパクトにすることが可能と
なり、高真空室の場合特に有利である。
According to the present invention, the following excellent effects can be obtained by the above configuration. That is, according to the vertical transfer device and the transfer method of claims 1 and 2 to 3,
The conventional method is used to automatically detect the cutting and loosening of the suspension band and detect the number of cutting and loosening of the suspension band, the abnormality detection regardless of the position of the cutting and relaxation, and the overrun of the conveyance means. More reliable, while the suspension band is cut and unjustly relaxed,
The damage to the vertical transfer device can be extremely reduced, and the maintainability is good. Further, since the apparatus is simple and the installation space is small, the chamber can be made compact, which is particularly advantageous in a high vacuum chamber.

【0035】請求項4、5の薄膜付き基板の製造装置お
よび製造方法によれば、薄膜付き基板を高い生産性で製
造することが可能となる。
According to the apparatus and method for manufacturing a substrate with a thin film according to the fourth and fifth aspects, a substrate with a thin film can be manufactured with high productivity.

【図面の簡単な説明】[Brief description of the drawings]

【図1】本発明の垂直搬送装置が適用できる薄膜つき基
板の製造装置の一実施態様を示す正面図である。
FIG. 1 is a front view showing an embodiment of an apparatus for manufacturing a substrate with a thin film to which a vertical transfer apparatus according to the present invention can be applied.

【図2】図1の上面図である。FIG. 2 is a top view of FIG.

【図3】本発明にかかる垂直搬送装置の一例を示す正面
図である。
FIG. 3 is a front view showing an example of a vertical transport device according to the present invention.

【図4】本発明にかかる垂直搬送装置の一例を示す斜視
図である。
FIG. 4 is a perspective view showing an example of a vertical transport device according to the present invention.

【図5】本発明にかかる垂直搬送装置を構成する吊下帯
切断および弛緩検出装置の一例を詳細に示す正面図であ
る。
FIG. 5 is a front view showing in detail an example of a suspension band cutting and relaxation detecting device constituting the vertical transport device according to the present invention.

【図6】本発明にかかる垂直搬送装置を構成する吊下帯
切断および弛緩検出装置の一例を詳細に示す側面図であ
FIG. 6 is a side view showing in detail an example of a suspension band cutting and relaxation detecting device constituting the vertical transport device according to the present invention.

【図7】本発明にかかる垂直搬送装置を構成する吊下帯
の切断状態示す正面図である。
FIG. 7 is a front view showing a cutting state of a suspension band included in the vertical transport device according to the present invention.

【図8】本発明にかかる垂直搬送装置を構成する搬送手
段がオーバーランし、吊下帯が弛緩した状態を示す正面
図である。
FIG. 8 is a front view showing a state in which a transport unit constituting the vertical transport device according to the present invention is overrun and the suspension band is relaxed.

【図9】本発明にかかる垂直搬送装置を構成する吊下帯
の切断および弛緩時、吊下帯が検出装置に接触した状態
を示す正面図である。
FIG. 9 is a front view showing a state where the suspension band contacts the detection device when the suspension band constituting the vertical transport device according to the present invention is cut and relaxed.

【図10】従来の実施態様における吊下帯切断および弛
緩検出方式の一例を示す正面図である。
FIG. 10 is a front view showing an example of a suspension band disconnection and relaxation detection method according to a conventional embodiment.

【図11】従来の実施態様における吊下帯切断および弛
緩検出装置が下降時オーバーランを検知しない場合の状
態を示す正面図である。
FIG. 11 is a front view showing a state where the suspension band cutting and relaxation detecting device according to the conventional embodiment does not detect overrun at descent.

【符号の説明】[Explanation of symbols]

1:入り口部コンベア 2:カセット 3:ゲートバルブ 4:予熱室 5:加熱室 6:第1ストッカー室 7:蒸着室 8:第2ストッカー室 9:出口バッファ室 10:出口部コンベア 11:チャンバー 12:基板保持ユニット 13:ヒーター 14:予熱室 15:水平搬送ローラ 16:軸受け 17:吊下げユニット 18:吊下げ部 19:吊下帯 20:プーリ 21:駆動軸 22:駆動モータ 23:吊下帯取付け金具 24:接触板 25:絶縁体 26:ホルダー 27:電気導入線 28:支持棚 29:光電検出器 50:切断・弛緩検出装置 1: Inlet conveyor 2: Cassette 3: Gate valve 4: Preheating chamber 5: Heating chamber 6: First stocker room 7: Vaporization room 8: Second stocker room 9: Exit buffer room 10: Outlet conveyor 11: Chamber 12 : Substrate holding unit 13: heater 14: preheating chamber 15: horizontal transport roller 16: bearing 17: hanging unit 18: hanging unit 19: hanging band 20: pulley 21: drive shaft 22: drive motor 23: hanging band Mounting bracket 24: Contact plate 25: Insulator 26: Holder 27: Electric lead wire 28: Support shelf 29: Photoelectric detector 50: Cutting / relaxation detection device

───────────────────────────────────────────────────── フロントページの続き (51)Int.Cl.7 識別記号 FI テーマコート゛(参考) B66D 1/54 B66D 1/54 C H01L 21/68 H01L 21/68 A Fターム(参考) 3F004 AG09 EA40 LA10 LB01 5F031 DA05 DA09 FA03 FA09 GA37 GA60 JA08 JA45 LA14 MA29 MA30 NA05 PA08 ──────────────────────────────────────────────────の Continued on the front page (51) Int.Cl. 7 Identification symbol FI Theme coat ゛ (Reference) B66D 1/54 B66D 1/54 C H01L 21/68 H01L 21/68 A F-term (Reference) 3F004 AG09 EA40 LA10 LB01 5F031 DA05 DA09 FA03 FA09 GA37 GA60 JA08 JA45 LA14 MA29 MA30 NA05 PA08

Claims (5)

【特許請求の範囲】[Claims] 【請求項1】チャンバー内で基板を保持する基板保持ユ
ニットと、該基板保持ユニットを吊下帯により懸下状態
で任意の位置に昇降する搬送手段を有する垂直搬送装置
において、前記吊下帯が切断および弛緩した際に生じ
る、前記吊下帯の巻付部における変形を、該吊下帯と接
触することによって前記吊下帯の切断および弛緩を検知
する検出手段を設けたことを特徴とする垂直搬送装置。
1. A vertical transfer apparatus comprising: a substrate holding unit for holding a substrate in a chamber; and transfer means for lifting and lowering the substrate holding unit to an arbitrary position in a suspended state by a hanging band. Deformation in the winding portion of the suspension band, which occurs when the suspension band is cut and relaxed, is provided with a detection unit that detects cutting and relaxation of the suspension band by contacting the suspension band. Vertical transfer device.
【請求項2】チャンバー内で基板を保持する基板保持ユ
ニットと、該基板保持ユニットを吊下帯により懸下状態
で任意の位置に昇降する垂直搬送方法において、前記吊
下帯が切断および弛緩した際に生じる、前記吊下帯の巻
付部における変形を、該吊下帯と接触することによって
検出することにより、前記吊下帯の切断または弛緩を検
出することを特徴とする垂直搬送方法。
2. A substrate holding unit for holding a substrate in a chamber and a vertical transfer method for lifting and lowering the substrate holding unit to an arbitrary position in a suspended state by a hanging band, wherein the hanging band is cut and loosened. A vertical conveyance method characterized by detecting a deformation or a deformation of a wrapping portion of the hanging band caused by contact with the hanging band, thereby detecting cutting or loosening of the hanging band.
【請求項3】基板保持ユニットを下降方向に搬送する際
における前記搬送手段のオーバーランによって生じる、
前記吊下帯の巻付部における変形を、該吊下帯と接触す
ることによって検出することにより、前記吊上帯のオー
バーランを検知することを特徴とする垂直搬送方法。
3. The method according to claim 1, wherein the transfer unit is caused to overrun when the substrate holding unit is transferred in a downward direction.
A vertical transport method, wherein an overrun of the hanging band is detected by detecting a deformation in a winding portion of the hanging band by contacting the hanging band.
【請求項4】請求項1に記載の垂直搬送装置を備えるこ
とを特徴とする薄膜付き基板の製造装置。
4. An apparatus for manufacturing a substrate with a thin film, comprising the vertical transfer device according to claim 1.
【請求項5】請求項2または3に記載の垂直搬送方法を
用いて蒸着基板を製造することを特徴とする薄膜付き基
板の製造方法。
5. A method for producing a substrate with a thin film, comprising producing a vapor-deposited substrate by using the vertical transport method according to claim 2.
JP9765299A 1999-04-05 1999-04-05 Vertical conveyance device and vertical conveyance method and manufacturing device for substrate with thin film and manufacture thereof Pending JP2000289979A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP9765299A JP2000289979A (en) 1999-04-05 1999-04-05 Vertical conveyance device and vertical conveyance method and manufacturing device for substrate with thin film and manufacture thereof

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9765299A JP2000289979A (en) 1999-04-05 1999-04-05 Vertical conveyance device and vertical conveyance method and manufacturing device for substrate with thin film and manufacture thereof

Publications (1)

Publication Number Publication Date
JP2000289979A true JP2000289979A (en) 2000-10-17

Family

ID=14198028

Family Applications (1)

Application Number Title Priority Date Filing Date
JP9765299A Pending JP2000289979A (en) 1999-04-05 1999-04-05 Vertical conveyance device and vertical conveyance method and manufacturing device for substrate with thin film and manufacture thereof

Country Status (1)

Country Link
JP (1) JP2000289979A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011124369A (en) * 2009-12-10 2011-06-23 Nitto Denko Corp Adhesive tape joining method, and apparatus using the same
KR101192751B1 (en) 2005-12-29 2012-10-18 엘지디스플레이 주식회사 manufacturing device for flat panel display and method thereof
JP7408234B2 (en) 2019-11-20 2024-01-05 株式会社ディスコ Transport vehicle and transport system

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101192751B1 (en) 2005-12-29 2012-10-18 엘지디스플레이 주식회사 manufacturing device for flat panel display and method thereof
JP2011124369A (en) * 2009-12-10 2011-06-23 Nitto Denko Corp Adhesive tape joining method, and apparatus using the same
JP7408234B2 (en) 2019-11-20 2024-01-05 株式会社ディスコ Transport vehicle and transport system

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