JP2000288761A - Method and device for machining of ceramic green sheet - Google Patents

Abstract

PROBLEM TO BE SOLVED: To efficiently form plural fine holes having a hole diameter of <=50 μm to a prescribed position of a ceramic green sheet. SOLUTION: A laser beam 2 emitted from a laser beam source 1 is passed through a diffraction grating 3 and separated to plural laser beams 2a having the energy suitable for forming fine holes having a hole diameter of <=50 μm in a ceramic green sheet. Next, the ceramic green sheet 10 is irradiated with separated plural laser beams 2a, plural fine holes each having a hole diameter of <=50 μm are formed to the ceramic green sheet 10.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method and an apparatus for processing a ceramic green sheet used for manufacturing a multilayer ceramic electronic component, and more particularly, to a through-hole (for example, a via hole or a through hole) formed in a ceramic green sheet. The present invention relates to a processing method and a processing apparatus for a ceramic green sheet for forming a hole for functioning as a ceramic green sheet.

[0002]

2. Description of the Related Art In a multilayer coil component, a multilayer substrate, and various other multilayer ceramic electronic components, usually, between internal electrodes (interlayer) laminated and disposed via a ceramic layer. Is electrically connected via via holes (through holes) formed in the ceramic green sheet.

Conventionally, as a processing method for forming a via hole (through hole) in a ceramic green sheet, a method of punching a ceramic green sheet using a mold and a pin, a YAG laser, a CO ₂ laser, or the like has been used. A laser processing method is used.

In recent years, as electronic components have become smaller and higher in density, it has been required to reduce the diameter of via holes formed in ceramic green sheets. However, in the case of the above punching method,
There is a problem that as the hole diameter (hole diameter) becomes smaller, the processing accuracy (shape accuracy) decreases.

In a laser processing method using a YAG laser or a CO ₂ laser, the hole diameter (hole diameter) is 50 μm.
m or less, it becomes difficult to form through holes with high shape accuracy and dimensional accuracy, and the minimum hole diameter that can be formed is 30
It is about μm. This is a YAG laser or CO ₂
This is because, in the case of a laser processing method using a laser, when the laser wavelength approaches the minimum hole diameter, it becomes difficult to perform sharp focusing.

In the conventional laser processing method, the output of a laser oscillator is adjusted so that a minute through hole can be formed. This is because the output (energy) of the laser oscillator and the width of the laser beam have a relationship as shown in FIG. 6, and when a through hole having a small hole diameter d is to be formed, the laser beam applied to the ceramic green sheet Is required to be d, but at the output level of a normal laser oscillator, the energy of the emitted laser beam is large, and the width is larger than the diameter d of the through hole to be formed. It is impossible to form a through hole having a hole diameter d, and the output of the laser oscillator is lowered to reduce the width of the laser beam to the hole diameter d of the through hole.
To try to make it smaller.

However, if the width of the laser beam is reduced to the diameter d of the through hole by lowering the output of the laser oscillator, stable laser oscillation cannot be performed, and the processing quality becomes unstable. In addition, there is a problem that it is difficult to form a minute through hole having high shape accuracy and dimensional accuracy.

[0008] The present invention solves the above-mentioned problems, and provides a ceramic green sheet capable of efficiently forming a plurality of minute holes having a hole diameter of 50 µm or less at predetermined positions of the ceramic green sheet. An object is to provide a processing method and a processing apparatus.

[0009]

In order to achieve the above object, a method for processing a ceramic green sheet according to the present invention is characterized in that a laser beam emitted from a laser light source is passed through a diffraction grating and has a hole diameter of 50 μm or less. Are divided into a plurality of laser beams having an energy suitable for forming the micro holes in the ceramic green sheet, and the separated laser beams are irradiated on the ceramic green sheet to form a plurality of holes having a hole diameter of 50 μm or less. It is characterized in that individual minute holes are formed.

A laser beam emitted from a laser light source is passed through a diffraction grating and split into a plurality of laser beams having energy suitable for forming micro holes having a hole diameter of 50 μm or less in a ceramic green sheet. By irradiating a plurality of split laser beams to the ceramic green sheet, a plurality of minute holes having a hole diameter of 50 μm or less can be efficiently formed in the ceramic green sheet.

According to the method of the present invention, as shown in FIG. 4, a diffraction grating 3 is used to split a laser beam 2 having a high energy level (see FIG. 5A) into a plurality of laser beams 2a. By doing so, the energy of each of the separated laser beams 2a is reduced to a level suitable for forming a microhole (that is, until the width of the laser beam becomes a width corresponding to the hole diameter d of the microhole). 5) It is possible to attenuate (see FIG. 5B), and it is possible to operate the laser oscillator with a stable output. Therefore, it is possible to efficiently form minute holes having a hole diameter of 50 μm or less with high positional accuracy and shape accuracy.

In the method of the present invention, "to disperse a laser beam into a plurality of laser beams having an energy suitable for forming a fine hole having a hole diameter of 50 μm or less in a ceramic green sheet" means that the laser beam is diffracted. This is a concept that means that the width of each laser beam applied to the ceramic green sheet is reduced to 50 μm or less by lowering the energy level of each laser beam by dispersing the light by a grating. The appropriate energy level should be determined as appropriate depending on the composition of the ceramic green sheet, the shape and size of the minute holes to be formed, and the like.

Further, in the present invention, the minute hole is not limited to a through hole (through hole), but a bottomed hole which does not penetrate,
This is a concept that includes a partial through-hole that partially penetrates but does not penetrate other parts.

Further, the method for processing a ceramic green sheet according to claim 2 is characterized in that a laser beam is irradiated while moving the ceramic green sheet.

By irradiating a laser beam while moving the ceramic green sheet, it is possible to efficiently form a plurality of minute holes having a hole diameter of 50 μm or less at different positions on the ceramic green sheet.

A third aspect of the present invention is a method for processing a ceramic green sheet, wherein the laser beam is irradiated while the ceramic green sheet is intermittently moved.

By moving the ceramic green sheet intermittently and irradiating a laser beam at a timing when the ceramic green sheet is stationary, a plurality of minute holes with a hole diameter of 50 μm or less having high shape accuracy and position accuracy are obtained. Can be formed efficiently.

According to a fourth aspect of the present invention, the laser beam emitted from the laser light source is a pulsed laser beam.

By irradiating a pulsed laser beam, even when the ceramic green sheet is continuously moved, even when the laser beam is irradiated, a plurality of holes having a hole diameter of 50 μm or less having high shape accuracy and position accuracy can be obtained. The minute holes can be efficiently formed, and the present invention can be made more effective.

According to a fifth aspect of the present invention, there is provided a method for processing a ceramic green sheet, comprising: a laser light source for emitting a pulsed laser beam;
A diffraction grating that splits the laser beam into a plurality of laser beams having energy suitable for forming micro holes of m or less in the ceramic green sheet, a galvano scan mirror that reflects the laser beam at a predetermined reflection angle, and a galvano scan mirror A condensing lens for individually condensing the reflected laser beams and a ceramic green sheet are disposed in a predetermined positional relationship, and a pulsed laser beam emitted from a laser light source passes through the diffraction grating. Then, the microscopic hole having a hole diameter of 50 μm or less is split into a plurality of laser beams having an energy suitable for forming the ceramic green sheet, and the split pulsed laser beams are separated by a galvano scan mirror. Irradiate the ceramic green sheet by reflecting it, and place it at a predetermined position on the ceramic green sheet. After forming a plurality of micro holes having a hole diameter of 50 μm or less, changing the reflection angle of the galvano scan mirror, repeatedly irradiating the ceramic green sheet with the laser beam, at different predetermined positions of the ceramic green sheet, It is characterized in that a plurality of micro holes having a hole diameter of 50 μm or less are formed.

By repeatedly irradiating the ceramic green sheet with the laser beam by changing the reflection angle of the galvano scan mirror, a predetermined area of the ceramic green sheet can be moved at a plurality of positions without moving the ceramic green sheet. In addition, it is possible to form a plurality of micro holes having a hole diameter of 50 μm or less, and the present invention can be made more effective.

According to a sixth aspect of the present invention, there is provided a method for processing a ceramic green sheet, comprising: a laser light source for emitting a pulsed laser beam; a galvano scan mirror for reflecting the laser beam at a predetermined reflection angle; A diffraction grating for splitting a plurality of laser beams having energy suitable for forming micro holes having a hole diameter of 50 μm or less in the ceramic green sheet, and a collector for individually condensing the plurality of split laser beams. An optical lens and a ceramic green sheet are arranged so as to have a predetermined positional relationship, and a pulsed laser beam emitted from a laser light source is reflected by a galvano scan mirror, and then the laser reflected by the galvano scan mirror The beam is passed through the diffraction grating, and a fine hole having a hole diameter of 50 μm or less Into a plurality of laser beams having an energy suitable for forming the laser beam, irradiate the ceramic green sheet with a plurality of dispersed laser beams in a pulse form, and a hole diameter is formed at a predetermined position of the ceramic green sheet. After simultaneously forming a plurality of microholes of 50 μm or less, the reflection angle of the galvano scan mirror is changed, and the irradiation of the laser beam to the ceramic green sheet is repeated. It is characterized by forming a plurality of micro holes of 50 μm or less.

In the method for processing a ceramic green sheet according to the fifth aspect, the laser beam is passed through a diffraction grating to be split into a plurality of laser beams, and the split laser beam is reflected by a galvano scan mirror. We irradiate the ceramic green sheet,
It is also possible that the laser beam is reflected by a galvano scan mirror and then passes through a diffraction grating to separate the laser beam into a plurality of laser beams. The same effect as in the case of the configuration of claim 5 can be obtained.

Further, a method of processing a ceramic green sheet according to a seventh aspect is characterized in that irradiation of a pulsed laser beam is repeated while moving the ceramic green sheet.

In the fifth and sixth aspects, the reflection angle is changed by the galvano scan mirror so that the irradiation of the laser beam to the ceramic green sheet is repeated. It is possible to reliably form a plurality of micro holes having a hole diameter of 50 μm or less at an arbitrary position of the ceramic green sheet in a wide area without any restrictions, thereby making the present invention more effective. .

According to a eighth aspect of the present invention, in the method for processing a ceramic green sheet, the diffraction grating is formed by using a material having a high laser beam transmittance.

By using a material having a high laser beam transmittance for the optical system, in particular, for the diffraction grating, it is possible to improve the energy efficiency, and a plurality of ceramic green sheets having a hole diameter of 50 μm or less can be formed. The minute holes can be efficiently formed.

In a ninth aspect of the present invention, the laser emitted from the laser light source is a CO ₂ laser.

The CO ₂ laser has a low absorptance due to the ceramic itself constituting the ceramic green sheet and can prevent variations in characteristics due to deterioration of the ceramic itself. It is suitable to be used for.

As described above, the CO ₂ laser is hardly absorbed by the ceramic itself constituting the ceramic green sheet, but a substance having a high CO ₂ laser absorption rate is applied to the binder constituting the ceramic green sheet. By blending, efficient processing (removal) of ceramic green sheets even when using a CO ₂ laser
Can be performed.

In a tenth aspect of the present invention, the ceramic green sheet includes:
It is a ceramic green sheet with a carrier film supported on one side by a carrier film.

The present invention can also be applied to the processing of a ceramic green sheet with a carrier film supported on one side by a carrier film (usually a resin film). When a ceramic green sheet with a carrier film is processed, the ceramic green sheet can be handled while being supported by the carrier film. The dimensional accuracy and position accuracy of the holes can be improved.

[0033] The apparatus for processing a ceramic green sheet according to claim 11 is a supporting means for supporting the ceramic green sheet, a moving means for moving the ceramic green sheet in a predetermined direction, a laser light source, and a laser beam emitted from the laser light source. Through the laser beam,
A diffraction grating for splitting into a plurality of laser beams having energy suitable for forming micro holes of μm or less in the ceramic green sheet, and a laser beam passing through the diffraction grating and condensing the separated laser beams individually. And a condenser lens for irradiating the ceramic green sheet supported by the supporting means.

A support means for supporting the ceramic green sheet, a moving means for moving the ceramic green sheet in a predetermined direction, a laser light source, and a laser beam are allowed to pass through to form a fine hole having a hole diameter of 50 μm or less on the ceramic green sheet. Processing provided with a diffraction grating that splits into a plurality of laser beams having energy suitable for forming, and a focusing lens that individually focuses the split laser beams and irradiates the ceramic green sheet By using the apparatus, the above-described processing method of the present invention can be reliably performed, the ceramic green sheet can be processed efficiently, and a plurality of minute holes having a hole diameter of 50 μm or less can be formed.

The moving means for moving the ceramic green sheet in a predetermined direction includes moving the supporting means for supporting the ceramic green sheet in a predetermined direction, thereby moving the ceramic green sheet. It is also possible to use various structures such as those configured to directly move the ceramic green sheet.

According to a twelfth aspect of the present invention, there is provided an apparatus for processing a ceramic green sheet, comprising: a supporting means for supporting the ceramic green sheet; a laser light source; A diffraction grating that splits the laser beam into a plurality of laser beams having energy suitable for forming micro holes in the ceramic green sheet, and reflects the split laser beam through the diffraction grating at a predetermined reflection angle. A galvano scan mirror to be changed, and a galvano scan mirror driving unit for changing a reflection angle of the galvano scan mirror,
And a condenser lens for individually condensing the laser beams reflected at a predetermined reflection angle by the galvano scan mirror and irradiating the ceramic green sheet supported by the support means.

The laser beam split and passed through the diffraction grating is reflected by a galvano scan mirror to irradiate the ceramic green sheet, and the angle of reflection of the galvano scan mirror is changed to change the laser beam to the ceramic green sheet. By repeating the irradiation, in a predetermined area of the ceramic green sheet, without moving the ceramic green sheet, at a plurality of positions,
A plurality of minute holes having a hole diameter of 50 μm or less can be formed, and the present invention can be made more effective.

According to a thirteenth aspect of the present invention, there is provided an apparatus for processing a ceramic green sheet, comprising: a support means for supporting the ceramic green sheet; a laser light source; a galvano scan mirror for reflecting the laser beam at a predetermined reflection angle; A galvano scan mirror driving means for changing a reflection angle of a mirror, and a laser beam reflected at a predetermined reflection angle by the galvano scan mirror, so as to form minute holes having a hole diameter of 50 μm or less in the ceramic green sheet. A diffraction grating that splits the laser beam into a plurality of laser beams having energy suitable for the laser beam; and the laser beams that pass through the diffraction grating and are split into individual laser beams, and irradiate the ceramic green sheet supported by the support unit. And a condensing lens.

The laser beam reflected at a predetermined reflection angle by the galvano scan mirror is applied to the ceramic green sheet, and the laser beam is repeatedly applied to the ceramic green sheet by changing the reflection angle of the galvano scan mirror. Also in this case, in a predetermined region of the ceramic green sheet, it is possible to form a plurality of micro holes having a hole diameter of 50 μm or less at a plurality of positions without moving the ceramic green sheet. Can be made more effective.

[0040] The apparatus for processing a ceramic green sheet according to claim 14 is characterized by comprising a moving means for moving the ceramic green sheet in a predetermined direction.

In the processing apparatus according to the twelfth and thirteenth aspects, the reflection angle is changed by the galvano scan mirror to repeatedly irradiate the laser beam to the ceramic green sheet. By moving the ceramic green sheet, it is possible to reliably form a plurality of micro holes having a hole diameter of 50 μm or less in any position of the ceramic green sheet over a wide area without positional restrictions. Thus, the present invention can be made more effective.

[0042]

BEST MODE FOR CARRYING OUT THE INVENTION Hereinafter, embodiments of the present invention will be shown and the features thereof will be described in more detail.

[Embodiment 1] FIG. 1 is a view showing a schematic configuration of a ceramic green sheet processing apparatus according to an embodiment of the present invention. FIG. 2 is a view showing a ceramic green sheet in which micro holes are formed using the processing apparatus of FIG.

In this embodiment, for example, a ceramic green sheet used for manufacturing a laminated coil component is processed, and as shown in FIG.
5 will be described as an example. The micro holes 15 function as via holes in a product (laminated coil component). In this embodiment, the micro holes having hole diameters of 50 μm and 30 μm are formed.

The processing apparatus used in this embodiment is:
As shown in FIG. 1, a supporting means (XY table in this embodiment) 11 configured to support the ceramic green sheet 10 and move the ceramic green sheet 10 in a predetermined direction, and a laser light source 1 and a laser beam 2 emitted from a laser light source 1
To form a plurality of laser beams 2a having energy suitable for forming micro holes 15 (FIG. 2) having a hole diameter of 50 μm or less (50 μm and 30 μm in this embodiment) in the ceramic green sheet 10. A diffraction grating 3 for splitting the light, a galvano scan mirror 4 that reflects the laser beam 2a passing through the diffraction grating 3 and split into a plurality at a predetermined reflection angle, and is reflected by the galvano scan mirror 4 at a predetermined reflection angle. A condenser lens 5 for individually condensing the laser beams 2a so that the laser beam 2a condensed through the condenser lens 5 is applied to the ceramic green sheet 10 on the XY table 11. Is configured.

This processing apparatus further moves the laser light source driving means 6 for driving the laser light source 1, the galvano scan mirror driving means 7 for changing the reflection angle of the galvano scan mirror 4, and the XY table 11 in a predetermined direction. And a ceramic green sheet 10 supported thereon.
And a table driving means (moving means) 12 for moving the table in a predetermined direction.

In this processing apparatus, a laser light source that emits a CO ₂ laser having a short pulse width is used as the laser light source 1. The diffraction grating 3, the galvano scan mirror 4, and the condenser lens 5 are made of ZnSe, which absorbs less CO ₂ laser.

Next, a method for forming micro holes in a ceramic green sheet using the processing apparatus for a ceramic green sheet configured as described above will be described.

First, a vinyl acetate-based binder was added to a ceramic mainly composed of NiCuZn ferrite, mixed for 17 hours by a ball mill, and formed into a sheet-like ceramic green sheet 10 having a thickness of 50 μm by a doctor blade method. It is placed on the support means 11. Then, a pulsed laser beam 2 emitted from a laser light source 1 of a CO ₂ laser generator for drilling a rated output of 300 W is passed through a diffraction grating 3 so that the hole diameter becomes 50 μm.
The light is split into a plurality of laser beams 2a having energies suitable for forming the micro holes 15 (FIG. 2) of m and 30 μm in the ceramic green sheet 10. Then, the pulsed laser beam 2a split into a plurality of pieces is reflected by the galvano scan mirror 4 and radiated to the ceramic green sheet 10, and a predetermined position of the ceramic green sheet 10 is removed. 15 (FIG. 2). Then, the laser beam 2a is repeatedly irradiated onto the ceramic green sheet 10 by changing the reflection angle of the galvano scan mirror 4, and minute holes 15 (FIG. 2) are formed at different predetermined positions on the ceramic green sheet 10. Then, the process of irradiating the ceramic green sheet 10 with the laser beam 2a while changing the reflection angle of the galvano scan mirror 4 is repeated to change a predetermined area of the ceramic green sheet 10 (by changing the reflection angle of the galvano scan mirror, Micro holes 15 at different positions
XY table 11 is moved by a predetermined amount after the minute holes 15 are formed in all of the
Steps (1) to (4) are repeated to form micro holes 15 at predetermined positions on the entire ceramic green sheet 10.

According to the processing apparatus and the processing method of this embodiment, the light is passed through the diffraction grating 3 and is dispersed, and the hole diameter is 50 μm.
By irradiating the ceramic green sheet 10 with a plurality of laser beams 2a having an energy suitable for forming the micro holes 15 (FIG. 2) of m and 30 μm in the ceramic green sheet 10, Since the minute holes 15 (FIG. 2) are formed at the same time, the minute holes 15 can be efficiently formed at a predetermined position of the ceramic green sheet 10 with high positional accuracy and shape accuracy.

Table 1 shows the variation in the hole diameter and the roundness of the micro holes formed by the conventional laser processing method by adjusting the output of the laser oscillator, the micro holes formed by the method of the above embodiment, and Table 1. It is shown in Table 2. Table 1 shows that the hole diameter is 5
The data when a micro hole of 0 μm is formed is shown.
Table 2 shows data when a minute hole having a hole diameter of 30 μm was formed.

[0052]

[Table 1]

[0053]

[Table 2]

From Tables 1 and 2, it can be seen that according to the processing method (processing apparatus) of the above-described embodiment, it is possible to efficiently form fine holes having small hole diameter variations and high roundness.

In the above-described embodiment, the case where a minute hole having a circular plane shape is formed has been described as an example. However, in the present invention, the shape of the minute hole is not particularly limited, and the design pattern of the diffraction grating is changed. By doing so, it is possible to form minute holes of various shapes such as a square, a polygon other than a square, and an ellipse.

Further, in the above embodiment, the case where minute holes are formed in the ceramic green sheet used for manufacturing the laminated coil component has been described as an example. There is no particular restriction on the type and application, and for example, the present invention can be widely applied to the case where micro holes for via holes are formed in a ceramic green sheet used for a laminated substrate and other various laminated ceramic electronic components.

Although a CO ₂ laser is used in the above embodiment, other types of lasers can be used in the present invention.

In the above embodiment, a pulsed laser beam is used. However, in some cases, a laser beam other than the pulsed laser beam can be used.

In the above embodiment, the ceramic green sheet is directly placed on the XY table (support means) for processing. However, the ceramic green sheet supported on the carrier film is supported together with the carrier film by the support means. It is also possible to work by mounting on a surface. When a ceramic green sheet with a carrier film is processed, the ceramic green sheet can be handled while being supported by the carrier film. The dimensional accuracy and position accuracy of the holes can be improved.

[Embodiment 2] FIG. 3 is a view showing a schematic configuration of a ceramic green sheet processing apparatus according to another embodiment of the present invention.

In the processing apparatus of this embodiment, after the laser beam 2 is reflected by the galvano scan mirror 4 first,
Micro-hole 1 passing through diffraction grating 3 and having a hole diameter of 50 μm or less
5 (FIG. 2) into a plurality of laser beams 2 having an energy suitable for forming on the ceramic green sheet 10.
a.

The processing apparatus according to the second embodiment includes a diffraction grating 3
Is configured in the same manner as the processing apparatus used in the first embodiment, except that the ceramic green sheet is disposed between the galvano scan mirror 4 and the condenser lens 5. Since the processing method is the same in the case of processing, the description of the substantial part of the first embodiment is referred to, and the description is omitted here. Note that FIG.
In FIG. 1, the portions denoted by the same reference numerals as those in FIG. 1 indicate the same or corresponding portions. When the ceramic green sheet is processed by using the processing apparatus shown in FIG. 3, the same effect as that of the first embodiment can be obtained.

It should be noted that the present invention is applicable to the first and second embodiments.
The present invention is not limited to the above, and various applications and modifications can be made within the scope of the invention.

[0064]

As described above, in the method for processing a ceramic green sheet according to the present invention (claim 1), a laser beam is passed through a diffraction grating to form fine holes having a hole diameter of 50 μm or less in the ceramic green sheet. Since the laser beam is split into a plurality of laser beams having energy suitable for irradiating the ceramic green sheet,
A plurality of minute holes having a hole diameter of 50 μm or less can be efficiently formed in the ceramic green sheet.

That is, according to the method of the present invention, the laser beam is split by the diffraction grating, and the energy level of the split individual laser beam is reduced, whereby the individual laser beam applied to the ceramic green sheet is reduced. Can be reduced to 50 μm or less, so that it is not necessary to particularly reduce the output of the laser oscillator, and the laser oscillator can be operated with a stable output. Therefore, a plurality of micro holes having a hole diameter of 50 μm or less can be efficiently formed with high positional accuracy and shape accuracy.

Further, when the laser beam is irradiated while moving the ceramic green sheet as in the method of processing a ceramic green sheet according to claim 2, the hole diameter is 50 μm or less at a different position of the ceramic green sheet. Can be efficiently formed.

In the case where the ceramic green sheet is intermittently moved and the laser beam is irradiated at a timing when the ceramic green sheet is stationary as in the method for processing a ceramic green sheet according to claim 3, It becomes possible to efficiently form a plurality of micro holes having a high hole diameter of 50 μm or less with high precision and position accuracy.

Further, when a pulsed laser beam is applied as in the method of processing a ceramic green sheet according to the fourth aspect, a plurality of fine particles having a high hole shape with a hole diameter of 50 μm or less have high shape accuracy and position accuracy. The holes can be efficiently formed, and the present invention can be made more effective.

Further, when the reflection angle of the galvano scan mirror is changed to repeatedly irradiate the laser beam onto the ceramic green sheet as in the method of processing the ceramic green sheet according to the fifth aspect, In a predetermined area, the hole diameter is 5 at a plurality of positions without moving the ceramic green sheet.
It becomes possible to form a plurality of fine holes of 0 μm or less, and the present invention can be made more effective.

Further, as in the method for processing a ceramic green sheet according to the sixth aspect, the laser beam reflected by the galvano scan mirror is passed through a diffraction grating to be split into a plurality of laser beams, thereby forming a ceramic green sheet. Even in the case of irradiating, the same effect as in the case of the configuration of claim 5 can be obtained.

Further, even when the reflection angle is changed by the galvano scan mirror and the irradiation of the laser beam onto the ceramic green sheet is repeated so that minute holes can be formed at a plurality of positions, the invention is not limited thereto. As described in item 7, by making the ceramic green sheet movable, a hole diameter of 50 μm can be set at an arbitrary position of the ceramic green sheet in a wide area without positional restrictions.
It is possible to reliably form a plurality of micro holes of m or less, and the present invention can be made more effective.

Further, when a material having a high laser beam transmittance is used for the optical system, particularly the diffraction grating as in the method for processing a ceramic green sheet according to the eighth aspect, the energy efficiency can be improved. Thus, it becomes possible to efficiently form a plurality of minute holes having a hole diameter of 50 μm or less in the ceramic green sheet.

Further, when a CO ₂ laser is used as the laser as in the method for processing a ceramic green sheet according to the ninth aspect, since the ceramic constituting the ceramic green sheet has little absorption, the quality of the ceramic itself may change. Variations in characteristics can be prevented.

Further, as in the method for processing a ceramic green sheet according to the tenth aspect, the present invention is also applicable to the processing of a ceramic green sheet with a carrier film supported on one side by a carrier film (usually a resin film). In this case, the ceramic green sheet can be handled while being supported by the carrier film, so that the deformation and distortion of the ceramic green sheet is suppressed, and the dimensional accuracy and the position accuracy are high. The minute holes can be formed reliably.

Further, the apparatus for processing a ceramic green sheet according to the invention (claim 11) of the present invention includes a supporting means for supporting the ceramic green sheet, a moving means for moving the ceramic green sheet in a predetermined direction, a laser light source, and a laser beam. And a diffraction grating for splitting into a plurality of laser beams having an energy suitable for forming micro holes having a hole diameter of 50 μm or less in the ceramic green sheet, and individually splitting the laser beams into a plurality of laser beams. It has a configuration provided with a condenser lens for condensing and irradiating the ceramic green sheet, and by using such a processing apparatus, the processing method of the present invention described above is surely implemented,
It is possible to efficiently process a ceramic green sheet to form a plurality of minute holes having a hole diameter of 50 μm or less.

Further, since the ceramic green sheet processing apparatus according to the twelfth and thirteenth aspects includes the galvano scan mirror, the reflection angle of the galvano scan mirror is changed, and the laser beam that has passed through the diffraction grating is split. By repeatedly irradiating the ceramic green sheet of the above, in a predetermined area of the ceramic green sheet,
It is possible to efficiently form a plurality of micro holes having a hole diameter of 50 μm or less at a plurality of positions without moving the ceramic green sheet, and the present invention can be made more effective.

In the processing apparatus according to the twelfth and thirteenth aspects, the reflection angle is changed by the galvano scan mirror so that the laser beam is repeatedly irradiated on the ceramic green sheet. By moving the ceramic green sheet in this way, it is possible to reliably form a plurality of micro holes with a hole diameter of 50 μm or less at any position on the ceramic green sheet over a wide area without positional restrictions. Thus, the present invention can be made more effective.

[Brief description of the drawings]

FIG. 1 is a view showing a schematic configuration of a ceramic green sheet processing apparatus according to an embodiment (Embodiment 1) of the present invention.

FIG. 2 is a view showing a ceramic green sheet in which micro holes are formed by processing a ceramic green sheet using the processing apparatus of FIG. 1 in one embodiment (Embodiment 1) of the present invention.

FIG. 3 is a view showing a schematic configuration of a ceramic green sheet processing apparatus according to another embodiment (Embodiment 2) of the present invention.

FIG. 4 is a diagram showing a state in which a laser beam having a high energy level is separated into a plurality of laser beams by using a diffraction grating.

5A is a diagram showing the energy and the width of a laser beam before splitting using a diffraction grating, and FIG. 5B is a diagram showing the energy and width of the laser beam after splitting using a diffraction grating. is there.

FIG. 6 is a diagram showing the relationship between the output (energy) of a laser oscillator and the width of a laser beam.

[Explanation of symbols]

 REFERENCE SIGNS LIST 1 laser light source 2 laser beam 2 a laser beam after splitting by diffraction grating 3 diffraction grating 4 galvano scan mirror 5 condensing lens 6 laser light source driving means 7 galvano scan mirror driving means 10 ceramic green sheet 11 support means (XY table) 12 Table driving means 15 Micro hole

Continued on the front page (72) Inventor Masashi Morimoto 2-26-10 Tenjin, Nagaokakyo-shi, Kyoto F-term in Murata Manufacturing Co., Ltd. (Reference) 4E068 AF00 CA03 CD04 CD08 CD11 CE03 CE04 DA09 DA14 DB12

Claims (14)

[Claims] 1. A laser beam emitted from a laser light source is passed through a diffraction grating to form a plurality of laser beams having energy suitable for forming fine holes having a hole diameter of 50 μm or less in a ceramic green sheet. A method of processing a ceramic green sheet, comprising irradiating a ceramic green sheet with a plurality of laser beams that have been split and split to form a plurality of minute holes having a hole diameter of 50 μm or less. 2. The method according to claim 1, wherein the laser beam is irradiated while moving the ceramic green sheet.
The method for processing the ceramic green sheet described in the above. 3. The method for processing a ceramic green sheet according to claim 1, wherein a laser beam is irradiated while intermittently moving the ceramic green sheet. 4. The method for processing a ceramic green sheet according to claim 1, wherein the laser beam emitted from the laser light source is a pulsed laser beam. 5. A laser light source for emitting a pulsed laser beam, and a plurality of lasers having an energy suitable for forming a fine hole having a hole diameter of 50 μm or less in a ceramic green sheet by passing the laser beam. A diffraction grating that splits the beam into beams, a galvano scan mirror that reflects the laser beam at a predetermined reflection angle, a condenser lens that individually focuses the laser beams reflected by the galvano scan mirror, and a ceramic green sheet at a predetermined position. The laser light source emits a pulsed laser beam emitted from a laser light source.
Passing through the diffraction grating, splits into a plurality of laser beams having energy suitable for forming micro holes having a hole diameter of 50 μm or less in the ceramic green sheet, and splits a plurality of pulsed laser beams. Is reflected by a galvano scan mirror to irradiate the ceramic green sheet, and at a predetermined position of the ceramic green sheet,
After forming a plurality of micro holes having a hole diameter of 50 μm or less, changing the reflection angle of the galvano scan mirror, repeating irradiation of the ceramic green sheet with the laser beam, at different predetermined positions of the ceramic green sheet,
A method of processing a ceramic green sheet, comprising forming a plurality of micro holes having a hole diameter of 50 μm or less. 6. A laser light source that emits a pulsed laser beam, a galvano scan mirror that reflects the laser beam at a predetermined reflection angle, and a laser beam passing therethrough.
A diffraction grating that splits a plurality of laser beams having energy suitable for forming micro holes with a hole diameter of 50 μm or less in a ceramic green sheet, and a light collector that individually focuses the laser beams split into a plurality of laser beams A lens and a ceramic green sheet are arranged in a predetermined positional relationship, and a pulsed laser beam emitted from a laser light source is
After being reflected by the galvano scan mirror, the laser beam reflected by the galvano scan mirror is
Passing through the diffraction grating, splits into a plurality of laser beams having energy suitable for forming micro holes having a hole diameter of 50 μm or less in the ceramic green sheet, and splits a plurality of pulsed laser beams. Is irradiated on the ceramic green sheet, and a plurality of minute holes having a hole diameter of 50 μm or less are simultaneously formed at predetermined positions of the ceramic green sheet. Then, the reflection angle of the galvano scan mirror is changed, and the ceramic green of the laser beam is changed. Repeatedly irradiate the sheet, at different predetermined positions on the ceramic green sheet,
A method of processing a ceramic green sheet, comprising forming a plurality of micro holes having a hole diameter of 50 μm or less. 7. The method for processing a ceramic green sheet according to claim 5, wherein irradiation of a pulsed laser beam is repeated while moving the ceramic green sheet. 8. The method for processing a ceramic green sheet according to claim 1, wherein the diffraction grating is formed using a material having a high laser beam transmittance. 9. A laser emitted from the laser light source,
The method for processing a ceramic green sheet according to claim 1, wherein the method is a CO ₂ laser. 10. The method for processing a ceramic green sheet according to claim 1, wherein the ceramic green sheet is a ceramic green sheet with a carrier film supported on one side by a carrier film. 11. A supporting means for supporting a ceramic green sheet, a moving means for moving the ceramic green sheet in a predetermined direction, a laser light source, and a laser beam emitted from the laser light source, the hole diameter of which is 50 μm. A diffraction grating for dispersing into a plurality of laser beams having energy suitable for forming the following minute holes in the ceramic green sheet, and passing through the diffraction grating and individually condensing the dispersed laser beams, A condensing lens for irradiating the ceramic green sheet supported by the supporting means. 12. A means for supporting a ceramic green sheet, a laser light source, and a laser beam emitted from the laser light source are passed through to form a fine hole having a hole diameter of 50 μm or less in the ceramic green sheet. A diffraction grating that splits a plurality of laser beams having appropriate energy into a plurality of laser beams; a galvano scan mirror that passes through the diffraction grating and reflects the split laser beam at a predetermined reflection angle; and a reflection of the galvano scan mirror. A galvano scan mirror driving unit for changing an angle; and a condenser lens for individually condensing laser beams reflected at a predetermined reflection angle by the galvano scan mirror and irradiating the ceramic green sheet supported by the support unit. Processing of ceramic green sheet characterized by comprising: Location. 13. A supporting means for supporting a ceramic green sheet, a laser light source, a galvano scan mirror for reflecting the laser beam at a predetermined reflection angle, and a galvano scan mirror driving means for changing a reflection angle of the galvano scan mirror. And passing a laser beam reflected at a predetermined reflection angle by the galvano scan mirror into a plurality of laser beams having an energy suitable for forming micro holes having a hole diameter of 50 μm or less in the ceramic green sheet. A diffraction grating for separating light, and a condenser lens for individually condensing the separated laser beams passing through the diffraction grating and irradiating the ceramic green sheet supported by the supporting means, Processing equipment for ceramic green sheets. 14. An apparatus for processing a ceramic green sheet according to claim 12, further comprising a moving means for moving the ceramic green sheet in a predetermined direction.