JP2000287135A - Image pickup unit and device and method for detecting pixel defect in solid-state image pickup element - Google Patents

Abstract

PROBLEM TO BE SOLVED: To easily and correctly detect the pixel position of a black defect in a solid-state image pickup element by storing the pixel position detected by a black defect detecting means, reading it to interpolate an image pickup signal obtained from the pixel position and detecting the pixel position on the basis of an image pickup signal which is obtained from a solid-state image pickup element when an image pickup light which is blurred by an optical means and has a uniform lightness is inputted. SOLUTION: In a digital camera device 1, a micro-controller 8 reads defect address information from a non-volatile memory 11 and supplies the information to the interpolating circuit of an image processing circuit 5. The interpolating circuit 21 creates pixel data obtained by interpolating a pixel value from circumferential pixel data concerning the pixel indicated on the defect address information, replaces it with original pixel data and supplies it to a digital clamp circuit. A digital camera device 1 easily and correctly detects the pixel address of a black defect in a CCD image sensor 3 and interpolates the detected black defect so that the image pickup element can be used even when a black defect is present.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an image pickup apparatus using a solid-state image pickup device, and a device and a method for detecting a pixel defect of the solid-state image pickup device for detecting a pixel defect of the solid-state image pickup device.

[0002]

2. Description of the Related Art Commercial and home video cameras, etc.
A solid-state imaging device such as a CCD (Charge Coupled Device) image sensor is generally used.

In such a CCD image sensor, fixed pattern noise called white defect or black defect may occur due to a defect at the time of manufacturing or the like. These are caused, for example, by dark current of the photodiode, variations in the aperture, and the like, and always occur at predetermined pixel positions of the CCD image sensor.

Conventionally, when a manufactured CCD image sensor has a white defect, the defective pixel is interpolated and used. However, when a manufactured CCD image sensor has a black defect, it is difficult to detect the defect, and therefore, it is treated as a manufacturing defect in the inspection process.

[0005]

However, in recent years, CC
The number of pixels of the D image sensor is increasing. for that reason,
As the number of pixels increases, the number of black defects increases, the yield decreases, and the cost increases.

The present invention has been made in view of such circumstances, and can simply and accurately detect a pixel position of a black defect of a solid-state image pickup device and interpolate the detected black defect. It is an object to provide an imaging device.

Another object of the present invention is to provide an apparatus and a method for detecting a pixel defect of a solid-state image sensor which can easily and accurately detect a pixel position of a black defect of the solid-state image sensor.

[0008]

In order to solve the above-mentioned problems, an image pickup apparatus according to the present invention comprises: a solid-state image pickup device which takes in an image pickup light and converts it into an image pickup signal; Optical means for blurring using an optical low-pass filter, and comparing the imaging signal obtained from the solid-state imaging device with a predetermined threshold, and pixels of the solid-state imaging device where the imaging signal is equal to or less than the predetermined threshold Black defect detection means for detecting a position, storage means for storing the pixel position detected by the black defect detection means, and reading out the pixel position stored by the storage means, obtaining the pixel position from the pixel position of the solid-state imaging device. Interpolating means for interpolating an imaging signal to be obtained, wherein the black defect detecting means is provided from the solid-state imaging device when capturing imaging light of uniform brightness blurred by the optical means. And detecting the pixel position based on an image pickup signal is.

In this image pickup apparatus, an image pickup signal obtained from the solid-state image pickup device when the image pickup light of a blurred uniform brightness is taken in is compared with a predetermined threshold value. The following pixel position of the solid-state imaging device is detected. Then, the imaging device stores the detected pixel position and interpolates the imaging signal obtained from the pixel position.

The present invention also provides a pixel defect detection device for a solid-state image sensor for detecting a pixel defect of a solid-state image sensor that captures image light and converts it into an image signal. A subject for irradiating the solid-state imaging device with imaging light of uniform brightness, an optical unit for blurring the imaging light emitted from the subject using an optical low-pass filter, and an imaging signal obtained from the solid-state imaging device And a black defect detecting means for detecting a pixel position of the solid-state image sensor at which the imaging signal is equal to or less than the predetermined threshold value.

In the pixel defect detecting device for a solid-state image pickup device, an image pickup signal obtained from the solid-state image pickup device when the blurred image pickup light having a uniform brightness is taken in is compared with a predetermined threshold value. A pixel position of the solid-state imaging device at which a signal is equal to or less than the predetermined threshold is detected.

The present invention also provides a pixel defect detecting method for a solid-state imaging device for detecting a pixel defect of a solid-state imaging device which takes in imaging light and converts it into an imaging signal. The solid-state imaging device is irradiated with imaging light of uniform brightness, the imaging light emitted from the subject is blurred using an optical low-pass filter, and the imaging signal obtained from the solid-state imaging device is set to a predetermined threshold. In comparison, a pixel position of the solid-state imaging device at which the imaging signal is equal to or less than the predetermined threshold is detected.

In the pixel defect detecting method for a solid-state image pickup device, an image pickup signal obtained from the solid-state image pickup device when the blurred image pickup light of uniform brightness is taken in is compared with a predetermined threshold value. A pixel position of the solid-state imaging device at which a signal is equal to or less than the predetermined threshold is detected.

[0014]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, a digital camera device to which the present invention is applied as an embodiment of the present invention will be described with reference to the drawings.

The present invention is applied to a digital camera device as shown in FIG.

A digital camera device 1 shown in FIG. 1 includes a lens 2 for condensing image pickup light, a CCD image sensor 3 for converting the image pickup light condensed by the lens 2 into an image signal which is an electric signal, and a CCD image sensor. An analog / digital (A / D) converter 4 for digitizing an imaging signal from the sensor 3 and outputting imaging data; an image processing circuit 5 for performing image processing on the imaging data from the A / D converter 4 An external medium 6 for recording image data processed by the image processing circuit 5, and a RAM (Random Access) for storing image data processed by the image processing circuit 5, and the like.
Memory 7, a microcontroller 8 for controlling the image processing circuit 5 and the like, a driving circuit 9 for driving the lens 2 and the CCD image sensor 3, an external medium 6 and a RAM
And a non-volatile memory 11.

The lens 2 collects imaging light obtained from a subject. The lens 2 shifts the focal position, opens and closes the iris, zooms up, and optically processes the imaging light in accordance with a control signal from the drive circuit 9.

The CCD image sensor 3 photoelectrically converts the image pickup light into an image pickup signal which is an electric signal. This CC
The D image sensor 3 is provided with a color filter in which predetermined coding is performed on each pixel, and outputs a color imaging signal.

The A / D converter 4 digitizes an image signal output from the CCD image sensor 3 as an analog signal. The A / D converter 4 outputs digitized image data.

The image processing circuit 5 performs image processing on the image data digitized by the A / D converter 4.

More specifically, as shown in FIG. 2, the image processing circuit 5 includes an interpolation circuit 21, a digital clamp circuit 22,
It has a white balance circuit 23, a γ correction circuit 24, a luminance data generation circuit 25, and a color difference data generation circuit 26. Each circuit of the image processing circuit 5 is controlled by the microcontroller 8.

The interpolation circuit 21 performs a process of interpolating a defective portion of a pixel included in the image data based on defect address information detected by a pixel defect detection process described later. The digital clamp circuit 22 performs a clamp correction on the image data. Generally, when an image signal obtained from the CCD image sensor 3 is A / D converted by the A / D converter 4,
This is performed by adding a predetermined offset to the black level. In the clamp correction, a process of subtracting the offset and correcting the black level of the imaging data to the original black level is performed. The white balance circuit 23 is a circuit that adjusts the white balance of a color signal. When picking up white light, the CCD image sensor 3 does not have the same level of each color due to variations in the sensitivity of the color filters. The adjustment of the white balance is to adjust the level by applying an individual gain to the data of each color to correct the variation between the color codings. The gain given to each color may be given by the microcontroller 8 based on data measured in advance, or may be calculated by acquiring a clamp amount and an integrated value for each filter using a detection circuit. The gamma correction circuit 24 performs gamma correction by varying the linearity of the image data. The luminance data generation circuit 25
It generates and outputs luminance data from the imaging data. The color difference data generation circuit 26 generates and outputs color difference data from the imaging data.

The external medium 6 is, for example, an optical disk,
It is a removable recording medium such as a magnetic disk, a magnetic tape, and a memory card.

The RAM 7 is a storage device provided inside the digital camera device 1.

The microcontroller 8 performs analog / digital conversion processing by the A / D converter 4 and the image processing circuit 5
, And controls the focus position of the lens 2, the speed of the electronic shutter, the opening and closing of the iris, the zoom distance, and the like via the drive circuit 9.

The memory controller 10 writes data to the external medium 6 and the RAM 7,
And control of reading data from the RAM 7.

The nonvolatile memory 11 stores defect address information indicating position information of a black defect portion of the CCD image sensor 3 detected by a pixel defect detection process described later.

In such a digital camera device 1, an image of a subject can be taken according to the operation of the user, and the taken image data can be recorded in the external medium 6 or the RAM 7.

Next, the CC by the digital camera device 1
The details of the black defect detection processing of the D image sensor 3 will be described.

In the digital camera device 1, as shown in the flowchart of FIG. 3, an image capturing preparation process (step S1), a data capturing process (step S2),
The microcontroller 8 sequentially performs a defect detection process (step S3) and an address storage process (step S4), thereby performing a black defect detection process of the CCD image sensor 3.

Image preparation processing (step S1)
Then, the processing of steps S11 to S15 shown in FIG. 4 is performed.

First, in step S11, the angle of view with the subject is adjusted. FIG. 5 shows a positional relationship between the subject and the digital camera device 1. The subject 20 emits light of uniform brightness from a rectangular display screen of a predetermined size, for example. Here, by matching the angle of view between the subject 20 and the digital camera device 1, the brightness of the image captured by the CCD image sensor 3 is made uniform within the screen. In this angle-of-view adjustment, a position where the subject 20 falls within the angle of view of the digital camera device 1 is obtained in advance, and the digital camera device 1 may be automatically arranged at this position, or the output may be performed. The positioning may be performed while visually observing the captured image.

Subsequently, in step S12, the microcontroller 8 turns off the gamma correction circuit 24 and sets not to perform gamma correction processing. That is, CC
The setting is made so that the imaging data obtained from the D image sensor 3 can be detected with linearity.

Subsequently, in step S13, the microcontroller 8 sets the level of the imaging light applied to the CCD image sensor 3 so that the imaging signal obtained from the CCD image sensor 3 reaches the maximum level in the range having linearity. Adjust the brightness. Specifically, the microcontroller 8 adjusts the brightness of the imaging light emitted to the CCD image sensor 3 by adjusting the iris opening and the brightness of the subject 20. The reason why the brightness is adjusted to obtain an image signal having linearity is that when the image signal is in a non-linear region, the signal level of a black point cannot be accurately calculated. The reason why the brightness is adjusted to obtain an image pickup signal having the maximum level is to increase the S / N ratio. Note that the iris opening and the subject 2
The brightness of 0 may be obtained in advance, and here, the iris opening and the brightness of the subject 20 may be set to the obtained value.

Subsequently, in step S14, the microcontroller 8 adjusts the focal position of the lens 2, the degree of opening of the iris, and the like, and blurs the imaging light taken in by the CCD image sensor 3. For example, the image captured by the CCD image sensor 3 is blurred by setting the focal position of the lens 2 at the Near end or the Far end, or adjusting the iris or the like to increase the depth of field. That is, optically low-pass filtering is performed. this is,
This is to prevent dust or the like from being detected as a black defect when dust or the like is attached to the subject or the lens.

Subsequently, in step S15, the microcontroller 8 causes the digital clamp circuit 22 and the white balance circuit 24 to perform clamp correction and white balance adjustment.

The digital camera device 1 performs the processing of steps S11 to S15 described above, and ends the image capturing preparation processing (step S1).

In the data fetching process (step S2), the subject 20 is imaged under the conditions set in the image fetching preparation process, and, for example, image data for one frame is stored in the RAM 7. In this data capture process,
The microcontroller 8 outputs the output of the gamma correction circuit 24 as it is to the RAM without generating the luminance data and the color difference data.
7 to control the memory controller 10. That is, the functions of the luminance data generation circuit 25 and the color difference data generation circuit 26 are turned off.

In the image defect detection process (step S3), the processes of steps S21 to S26 shown in FIG. 6 are performed based on, for example, one frame of image data stored in the RAM 7 captured by the data capture process. Will be

First, in step S21, the microcontroller 8 divides, for example, one frame of image data taken into the RAM 7 into a plurality of blocks.
That is, one frame is divided into a plurality of blocks. For example, as shown in FIG.
× 1600 pixels, one is 20
It is divided into 48 square blocks each consisting of 0 × 200 pixels. The reason why one frame is divided into a plurality of blocks is to reduce the influence of lens shading. The number of divisions is set such that the shading of the lens is measured in advance and does not affect the detection level.

Then, the following steps S22 to S
The process 25 is performed by selecting one of the divided blocks.

First, in step S22, the microcontroller 8 calculates an average detection level for each color filter on the CCD image sensor 3. This may be the average value of all the pixels in the block, or the average value of the pixels at the center of the block, for example. Alternatively, a median filter process may be performed to determine a median, and this value may be used as an average.

Subsequently, in step S23, a threshold value is obtained by multiplying the average value obtained in step S22 by a predetermined coefficient. This threshold is such that pixels at levels below this threshold are:
It is used to determine a black spot. Note that the value of the coefficient may be different for each color filter because the level may be different for each color due to the influence of an error due to color coding.

Subsequently, in step S24, the microcontroller 8 calculates the threshold value obtained in step S23,
The levels of all pixels in the block are compared with each other to detect a pixel whose level is equal to or lower than the threshold. The pixel detected here is a black defect portion of the CCD image sensor 3. That is, since the imaging light of uniform brightness is radiated to the CCD image sensor 3, signals of the same level should be detected from all pixels, but if a black defect exists, A low-level signal is detected from the pixel. In Step S24, Step S
By comparing the threshold value obtained in step 23 with the levels of all the pixels in the block, a pixel having a lower level is found.

In step S24, the microcontroller 8 writes the position information of the detected pixel of the black defect portion, that is, the address of the detected black defect portion on the CCD image sensor 3 into the RAM 7.

Subsequently, in step S25, the microcontroller 8 determines whether the processing from step S22 to step S25 has been performed up to the last block in the frame. That is, it is determined whether the black defect has been detected for all the blocks in the frame.

If the black defect detection processing has not been performed on all the blocks, the process proceeds to step S26. Then, in this step S26, the microcontroller 8 selects the next block and repeats the processing from step S22.

When the black defect detection processing has been performed for all the blocks, the image defect detection processing is terminated.

In the digital camera device 1, the pixel addresses of all black defects existing on the CCD image sensor 3 are stored in the RAM 7 by performing the above-described image defect detection processing in steps S 21 to S 26. Can be.

In the address storing process (step S4),
The CC stored in the RAM 7 by the image defect detection processing
The pixel address of the D image sensor 3 is stored in the nonvolatile memory 11 as defect address information indicating the position information of the black defect portion.

By performing the above processing, the digital camera device 1 can detect a black defect portion of the CCD image sensor 3.

In the digital camera device 1, at the time of photographing, the microcontroller 8 reads defect address information from the nonvolatile memory 11 and supplies the defect address information to the interpolation circuit 21 of the image processing circuit 5. Then, for the pixel indicated by the defect address information, the interpolation circuit 21 generates pixel data obtained by interpolating the pixel value from the surrounding pixel data, and supplies the pixel data to the digital clamp circuit 22 by replacing the original pixel data.

As described above, in the digital camera device 1,
C when capturing blurred imaging light of uniform brightness
The image data obtained from the CD image sensor 3 is compared with a predetermined threshold value, and a pixel address of the CCD image sensor 3 at which the image data becomes equal to or less than the predetermined threshold value is detected. In the digital camera device 1, the detected pixel address is stored in the non-volatile memory 11, and the image data obtained from the pixel address is interpolated at the time of photographing.

Thus, in the digital camera device 1, the pixel address of the black defect of the CCD image sensor 3 can be simply and accurately detected, and the detected black defect can be interpolated. Therefore, in the digital camera device 1, even the CCD image sensor 3 having the black defect can be used, and the cost can be reduced.

Although the digital camera device 1 has been described as an embodiment of the present invention, the present invention can also be applied to a defect detection device for a CCD image sensor.

In this case, the defect detecting device of the CCD image sensor includes the object 20, the lens 2, the A / D converter 4
, An image processing circuit 5, a RAM 7, a microcontroller 8, a drive circuit 9, and a memory controller 10 to detect an address of a black defect of the CCD image sensor. Further, the image processing circuit 5 does not need to include the interpolation circuit 21, the γ correction circuit 24, the luminance data generation circuit 25, and the color difference data generation circuit 26. Also, the digital clamp processing and the white balance adjustment processing can be performed by the microcontroller 8, so that the imaging data output from the A / D converter 4 can be directly converted into R data.
You may make it store in AM7.

[0057]

According to the image pickup apparatus of the present invention, the image pickup signal obtained from the solid-state image pickup device when the image pickup light of the blurred uniform brightness is taken in is compared with a predetermined threshold value, and this image pickup signal is obtained. A pixel position of the solid-state imaging device which is equal to or less than the predetermined threshold is detected. Then, the imaging device stores the detected pixel position and interpolates the imaging signal obtained from the pixel position.

Thus, in this imaging apparatus, the pixel position of the black defect of the solid-state imaging device can be simply and accurately detected, and the detected black defect can be interpolated. Therefore, in this imaging device, even a solid-state imaging device having a black defect can be used, and the cost can be reduced.

In the apparatus and method for detecting a pixel defect in a solid-state image pickup device according to the present invention, an image pickup signal obtained from the solid-state image pickup device when a blurred image pickup light of a uniform brightness is captured is set to a predetermined threshold value. The pixel position of the solid-state imaging device at which the imaging signal is equal to or less than the predetermined threshold is detected.

Thus, the apparatus and method for detecting a pixel defect of a solid-state image sensor can easily and accurately detect the pixel position of a black defect of the solid-state image sensor. Therefore, in the apparatus and method for detecting a pixel defect of the solid-state imaging device, by providing information on the pixel position of the detected black defect, a video camera or other products using the solid-state imaging device can be interpolated. Therefore, in the device and method for detecting a pixel defect of a solid-state imaging device, even a solid-state imaging device having a black defect can be treated as a good product, and the cost of the solid-state imaging device can be reduced.

[Brief description of the drawings]

FIG. 1 is a block diagram of a digital camera device to which the present invention has been applied.

FIG. 2 is a block diagram of an image processing circuit of the digital camera device.

FIG. 3 is a flowchart showing the processing content of a black defect detection process of the digital camera device.

FIG. 4 is a flowchart showing the contents of an image capture preparation process in the black defect detection process.

FIG. 5 is a diagram illustrating an angle-of-view adjustment process in the image capture preparation process.

FIG. 6 is a flowchart showing the processing content of a defect detection process in the black defect detection process.

FIG. 7 is a diagram illustrating a block division process in the defect detection process.

[Explanation of symbols]

1 digital camera device, 2 lens, 3 CCD image sensor, 4 A / D converter, 5 image processing circuit, 6
External media, 7 RAM, 8 microcontroller, 9 drive circuit, 10 memory controller, 11
Non-volatile memory

Claims (22)

[Claims] 1. An image pickup device that captures imaging light and converts it into an imaging signal, an optical unit that blurs the imaging light captured by the solid-state imaging device using an optical low-pass filter, and a solid-state imaging device. A black defect detecting means for comparing a captured image signal with a predetermined threshold value to detect a pixel position of the solid-state image sensor at which the image signal is equal to or less than the predetermined threshold value; and the pixel position detected by the black defect detecting means. Storage means for storing the pixel position stored by the storage means, and interpolation means for interpolating an image signal obtained from the pixel position of the solid-state imaging device, wherein the black defect detection means comprises: An image pickup device for detecting a pixel position based on an image pickup signal obtained from the solid-state image pickup device when image pickup light of uniform brightness blurred by the means is taken in 2. The image forming apparatus according to claim 1, wherein said black defect detecting means is provided with a maximum level of brightness at which the linearity of the image signal is maintained, and when the image light of uniform brightness blurred by said optical means is captured. The imaging device according to claim 1, wherein a pixel position is detected based on an imaging signal obtained from the solid-state imaging device. 3. The imaging apparatus according to claim 1, wherein said black defect detection means detects a pixel position by correcting a black level of an imaging signal obtained from said solid-state imaging device. 4. The black defect detecting means divides an image signal obtained from the solid-state image sensor into screens for each predetermined block, and converts an image signal obtained by screen division for each block into a threshold value determined for each block. 2. The imaging device according to claim 1, wherein a pixel position of the solid-state imaging device at which the imaging signal is equal to or less than the predetermined threshold value is detected. 5. The imaging apparatus according to claim 4, wherein said black defect detection means obtains an average value of the imaging signal for each of said blocks, and determines a threshold value for each of said blocks based on the average value. 6. The solid-state imaging device according to claim 1, wherein the black defect detection unit detects, for each color filter of the solid-state imaging device, a pixel position of the solid-state imaging device at which the imaging signal is equal to or less than a predetermined threshold. An imaging device according to any one of the preceding claims. 7. The imaging apparatus according to claim 6, wherein the black defect detection unit detects a pixel position by adjusting a white balance of an imaging signal obtained from the solid-state imaging device. 8. The solid-state imaging device according to claim 1, wherein the interpolation unit interpolates an image signal obtained from the pixel position of the solid-state imaging device based on a signal around the pixel position of the solid-state imaging device. Imaging device. 9. A pixel defect detection device for a solid-state imaging device for detecting a pixel defect of a solid-state imaging device that captures imaging light and converts the imaging light into an imaging signal, comprising: An optical means for blurring the imaging light emitted from the subject using an optical low-pass filter, and comparing the imaging signal obtained from the solid-state imaging device with a predetermined threshold value, A pixel defect detection device for a solid-state imaging device, comprising: a black defect detection unit configured to detect a pixel position of the solid-state imaging device that is equal to or less than a threshold. 10. The black defect detecting means detects a pixel position based on an imaging signal obtained from the solid-state imaging device when capturing imaging light having a maximum level of brightness that maintains the linearity of the imaging signal. 10. The pixel defect detection device for a solid-state imaging device according to claim 9, wherein: 11. A pixel according to claim 9, wherein said black defect detecting means detects a pixel position by correcting a black level of an image signal obtained from said solid-state image sensor. Defect detection device. 12. The black defect detecting means divides an image signal obtained from the solid-state image sensor into screens for each predetermined block, and converts an image signal divided for each block into a threshold value determined for each block. 10. The pixel defect detection device for a solid-state imaging device according to claim 9, wherein a pixel position of the solid-state imaging device at which the imaging signal is equal to or less than the predetermined threshold is detected. 13. The method according to claim 12, wherein the black defect detecting means calculates an average value of the image pickup signal for each block, and determines a threshold value for each block based on the average value.
13. A pixel defect detection device for a solid-state imaging device according to claim 1. 14. The solid-state imaging device according to claim 9, wherein the black defect detection unit detects, for each color filter of the solid-state imaging device, a pixel position of the solid-state imaging device at which the imaging signal is equal to or less than a predetermined threshold. 13. A pixel defect detection device for a solid-state imaging device according to claim 1. 15. The pixel defect of the solid-state imaging device according to claim 14, wherein the black defect detection unit detects a pixel position by adjusting a white balance of an imaging signal obtained from the solid-state imaging device. Detection device. 16. A method for detecting a pixel defect of a solid-state imaging device for detecting a pixel defect of a solid-state imaging device that takes in imaging light and converts the imaging light into an imaging signal, comprising: The imaging light is blurred using an optical low-pass filter, and the imaging signal obtained from the solid-state imaging device is compared with a predetermined threshold, and the pixels of the solid-state imaging device where the imaging signal is equal to or less than the predetermined threshold A method for detecting a pixel defect in a solid-state imaging device, comprising detecting a position. 17. The method according to claim 16, wherein said solid-state imaging device captures imaging light having the maximum brightness at which the linearity of the imaging signal is maintained. 18. The method according to claim 16, wherein the pixel position is detected by correcting a black level of an image signal obtained from the solid-state image sensor. 19. An imaging signal obtained from the solid-state imaging device is divided into screens for each predetermined block, and the imaging signal divided for each block is compared with a threshold value determined for each block, and the imaging signal is calculated. 17. The method according to claim 16, wherein a pixel position of the solid-state image sensor at which a signal is equal to or less than the predetermined threshold is detected. 20. The method according to claim 19, wherein an average value of the image signal is obtained for each block, and a threshold value is determined for each block based on the average value. 21. For each color filter of the solid-state imaging device,
17. The pixel defect detection method for a solid-state imaging device according to claim 16, wherein a pixel position of the solid-state imaging device at which the imaging signal is equal to or less than a predetermined threshold is detected. 22. The method according to claim 21, wherein a pixel position is detected by adjusting a white balance of an imaging signal obtained from the solid-state imaging device.