JP2000284020A - Socket for device for inspecting semiconductor device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a socket for a device for inspecting a semiconductor device capable of accurately detecting and accurately controlling the temperature of the chip part of the semiconductor device. SOLUTION: A socket 10 for inspecting a semiconductor device includes a socket main body 11 provided with a cavity 11a to house a semiconductor, an end part connected to the chip part of the semiconductor device housed in the cavity 11a by a member of high thermal conductivity, a contact part 12 arranged accordingly to the end part. The socket 10 for inspecting a semiconductor device is characteristically provided with both a passage 11b in such a way that a flowable medium may be in contact with at least one part of the contact part 12 and a temperature detecting part in such a way that the temperature of the contact part 12 with which the flowable medium is in contact can be detected.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a socket used in a semiconductor device inspection apparatus for performing various measurements on a semiconductor device such as an IC, and more particularly to a socket for controlling the temperature of a semiconductor device to be mounted. .

[0002]

2. Description of the Related Art Conventionally, such a socket for a semiconductor device inspection apparatus is constructed, for example, as shown in FIG.

In FIG. 7, a semiconductor device inspection device socket 1 is configured as an IC socket having a pin insertion hole (not shown) at a position corresponding to a pin of an IC to be mounted. Temperature sensor 2 provided in
, A cooling / heating device 3, and a control device 4. The temperature sensor 2 and the cooling / heating device 3 are built in the socket 1.

[0004] The cooling / heating device 3 includes a cooling / heating body 3a disposed around the temperature sensor 2, a cooling / heating conduction member 3b connected to one end of the cooling / heating body 3a, and a cooling / heating body 3a. Cooling / heating conductive member 3 connected to the other end of the
and a cooling / heating circuit 3d for connecting the two cooling / heating conducting members 3b and 3c to each other and outputting heat at a temperature controlled by the control device 4 based on temperature information detected by the temperature sensor 2. Have been.

According to the semiconductor device inspection apparatus socket 1 having the above-described structure, the temperature sensor 2 detects the surface temperature of the package, that is, the mold portion of the IC mounted on the IC socket 1 and converts the surface temperature into temperature information. And sends it to the control device 4. The control device 4 performs, based on the received temperature information,
The temperature information is sent to the cooling / heating device 2 built in the IC socket 1 so that the cooling / heating device 2
The temperature of the IC mounted on the C socket 1 is adjusted.

[0006]

In controlling the temperature of a semiconductor device, it is particularly important to control the temperature of the chip in order to guarantee the operating characteristics of the IC chip when a temperature is applied. Since the resin is sealed and protected by a molding material, the thermal conductivity is not so good.

Accordingly, since the temperature difference between the chip portion and the mold portion of the semiconductor device actually varies to some extent, even if the surface temperature of the mold portion is measured, the temperature of the chip portion cannot be measured accurately. Further, even if the temperature of the mold portion is adjusted by the cooling / heating device 2, the temperature of the chip portion cannot be adjusted accurately.

Further, in the actual inspection process, since the semiconductor device is not always mounted in the socket, the temperature sensor detects the temperature of the space when the semiconductor device is not mounted. Therefore, accurate temperature control cannot be performed.

On the other hand, a socket for a semiconductor device inspection apparatus having the following configuration is also known.

That is, in a cavity provided on the upper surface of the socket, the semiconductor device is covered with a cover while the pins of the semiconductor device are in contact with the plurality of contact portions exposed on the bottom surface of the cavity. By blowing air at a predetermined temperature to the contact portion exposed to the outside from the cover, the contact portion cools or heats the chip in the semiconductor device via the pin.

However, in the socket for a semiconductor device inspection device having such a configuration, depending on the structure of the socket, if the contact portion is slightly exposed outside the cover, cooling or heating cannot be performed sufficiently. .

SUMMARY OF THE INVENTION In view of the above, it is an object of the present invention to provide a socket for a semiconductor device inspection device capable of accurately detecting and controlling the temperature of a chip portion of a semiconductor device.

[0013]

According to the first aspect of the present invention, there is provided a socket body having a cavity for accommodating a semiconductor device, and a chip portion of the semiconductor device accommodated in the cavity. A semiconductor device measuring socket including an end portion connected by a member having a high possibility and a contact portion provided corresponding to the end portion, wherein at least a part of the contact portion On the other hand, a semiconductor device inspection is provided, wherein a passage is provided so as to come into contact with the fluid medium, and a temperature detecting section is provided so as to detect the temperature of the contact portion where the fluid medium comes into contact. This is achieved by a device socket.

According to the first aspect of the present invention, the contact portion of the semiconductor device measuring socket corresponds to the end portion connected to the chip portion of the semiconductor device housed in the cavity by a member having high thermal conductivity. Therefore, the difference between the temperature of the contact portion and the temperature of the chip portion of the semiconductor device is relatively small.

Therefore, the temperature of the chip portion of the semiconductor device can be controlled by detecting the temperature of the contact portion with the temperature detecting portion and controlling the temperature with the fluid medium.

According to a second aspect of the present invention, in the configuration of the first aspect, a control unit that performs temperature control based on the temperature detected by the temperature detection unit, and a control unit that controls the temperature based on the control of the control unit. A heating or cooling unit for performing heating or cooling by heating, and the fluid medium is supplied by the heating or cooling unit.

According to a second aspect of the present invention, there is provided a control unit for performing temperature control based on the temperature detected by the temperature detecting unit, and a heating or cooling unit for performing heating or cooling based on the control of the control unit. Since the fluid medium is supplied by the heating or cooling section, the temperature of the contact section and the temperature of the chip section of the semiconductor device can be controlled more accurately.

According to a third aspect of the present invention, there is provided a socket for a semiconductor device inspection apparatus according to the first or second aspect, wherein the fluid medium is air.

According to a fourth aspect of the present invention, there is provided a semiconductor device inspection apparatus according to the first or second aspect, wherein the fluid medium is an insulating liquid. Socket.

According to the third or fourth aspect of the present invention, since the fluid medium is air or an insulating liquid, by heating or cooling them, the contact portion can be heated or cooled. Thus, the chip portion of the semiconductor device can be heated or cooled.

According to a fifth aspect of the present invention, a semiconductor device is mounted on a socket body, and the chip portion of the semiconductor device housed on the socket body is connected by a member having high thermal conductivity. A semiconductor device, comprising: an end portion, a contact portion corresponding to the end portion, and a cover that closes a surface of the socket body and defines a chamber for housing the semiconductor device. A socket for an apparatus inspection device, a heat conduction member disposed so as to connect a passage through which a fluid medium contacts at least a part of the contact portion, and to connect the inside of the chamber to the passage. This is achieved by a semiconductor device inspection device socket characterized by comprising:

According to the fifth aspect of the present invention, the chamber surrounds the semiconductor device, and is connected to the passage of the socket body by the chamber and the heat conductive member. Hot or cold air is conducted through the heat conducting member into the passage of the socket.

Thus, the temperature of the contact portion can be accurately adjusted without being affected by the outside air temperature.

[0024]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, a preferred embodiment of the present invention will be described in detail with reference to FIGS.

Although the embodiments described below are preferred specific examples of the present invention, they are subjected to various technically preferable limitations. However, the present invention is not limited to these embodiments unless otherwise described. (First Embodiment) FIGS. 1 to 5 show the configuration of a first embodiment of a socket for a semiconductor device inspection apparatus according to the present invention.

1 and 2, a semiconductor device inspection apparatus socket 10 includes a socket body 11 and a semiconductor device (for example, a BGA type) which is housed in a cavity 11a (described later) of the socket body 11. IC)
Contact portions 1 arranged corresponding to the pins at the ends of
2, a temperature detector 13 (see FIG. 5), and a temperature detector 13
And a heating / cooling device 15 for heating or cooling based on the control of the control unit 14 (see FIG. 5).
And

The socket body 11 is made of an insulating material, and has a cavity 11a capable of accommodating a semiconductor device to be inspected, and penetrates the socket body 11 laterally (horizontally) below the cavity 11a. Passage 11b. This passage 11b is a hatched portion in FIG.

Here, as shown in FIG. 3, the cavity 11a has a size that can accommodate the semiconductor device 16 to be inspected. A chip serving as a chip portion is housed inside the semiconductor device 16, and this chip is connected to the pin 16a by a member having high thermal conductivity. The pins 16a are also formed of a conductive material having high thermal conductivity.

The passage 11b of the socket body 11 is
As shown in FIG. 1, it has an inlet 11c and an outlet 11d.

As shown in FIG. 4, the contact portion 12 is made of a conductive material having high thermal conductivity, and one end 12a of the contact portion 12 is connected to the bottom of the cavity 11a of the socket body 11 by the semiconductor device 16. In addition to being exposed to correspond to the pin 16a, the other end 12b is exposed to the outside from the bottom surface of the socket body 11 in the case shown.

The temperature detecting section 13 has a known structure, and for example, as shown in FIG. 4 and FIG.
3a is attached to an intermediate portion of at least one contact portion 12 exposed in the passage 11b, and detects a temperature of the intermediate portion.

As shown in FIG. 5, the control unit 14 receives a detection signal of the temperature sensor 13, obtains temperature information from the detection signal, and based on the temperature information, determines a temperature suitable for an inspection. In this way, the drive of the heating / cooling device 15 is controlled.

The heating / cooling device 15 is driven and controlled by the control unit 14 to feed, for example, air, which is a fluid medium heated or cooled, from the inlet 11c to the passage 11b of the socket body 11, and Pass this air to passage 1
1b is brought into contact with each of the contact portions 12 exposed in
2 is heated or cooled.

Here, the air sent into the passage 11b passes between the contact portions 12 and then flows out of the outlet 11d. At this time, the air passes through the entire hatched portion including the contact portion 12 shown in FIG.

The semiconductor device inspection apparatus socket 10 according to the embodiment of the present invention is configured as described above.
It works as follows.

First, as shown in FIG.
The semiconductor device 16 to be inspected is placed in one cavity 11a.
Are accommodated, and each pin 16a is connected to one end 12 of the corresponding contact portion 12 exposed at the bottom surface of the cavity 11a.
a, the semiconductor device 16 is mounted.

From this state, the connection terminal of the inspection device (not shown) is electrically connected to the other end 12b of each contact portion 12 exposed on the bottom surface of the socket body 11 via a connection cord or the like, and the inspection by the inspection device is performed. Done.

At this time, as shown in FIG.
3 detects the temperature of the contact section 12 exposed in the passage 11b by the sensor section 13a and outputs a detection signal to the control section 1
4 is output. Thus, the control unit 14 obtains temperature information based on the detection signal from the temperature detection unit 13.

In this case, the obtained temperature information is
2 shows that the contact 16 is in contact with the pin 16a of the semiconductor device 16 so that the contact 12 is in contact with the chip 16 of the semiconductor device 16 through the pin 16a having a high thermal conductivity. The contact portion 12 is thermally connected to a portion (not shown), and the contact portion 12 has almost no temperature difference with the chip portion of the semiconductor device 16.

Accordingly, by detecting the temperature of the contact portion 12, the temperature of the chip of the semiconductor device 16 can be detected almost accurately.

The controller 13 controls the heating / cooling device 15 based on the temperature information so as to set the contact portion 12 and the chip portion of the semiconductor device 16 to a temperature suitable for inspection. Even when the temperature of the chip portion changes, the chip temperature can be corrected by supplying and removing heat from the contact portion.

That is, the control unit 13 sends out hot air from the heating / cooling device 15 when raising the temperature of the contact portion 12, and sends the heating / cooling device when lowering the temperature of the contact portion 12. The control is performed so that the cool air is sent from 15.

As a result, when hot or cold air is sent from the heating / cooling device 15, the hot or cold air enters the passage 11b of the socket body 11 from the inlet 11c, and each contact exposed in the passage 11b. Heat or cool the middle portion of section 12.

As described above, the contact portion 12 exposed in the passage 11b is heated or cooled by heating or cooling by the heating / cooling device 15, and is adjusted to a temperature suitable for inspection.

At this time, since the contact portion 12 and the chip of the semiconductor device 16 are thermally connected via a material having high thermal conductivity such as an internal lead frame and pins 16a, the semiconductor device 16 The chip portion can also be adjusted to a temperature suitable for inspection.

In this case, the temperature of the semiconductor device 16 is detected and the temperature is adjusted by contacting the pin 16a with the semiconductor device 1
6 through the contact portion 12 of the socket 10 which is thermally connected to the chip 6 by a material having a high thermal conductivity.
This can be performed more accurately and efficiently as compared with the conventional case where the process is performed through the surface of the package of the semiconductor device 16, that is, the mold portion.

As described above, according to the semiconductor device inspection apparatus socket 10 of the present embodiment, the temperature detecting section 13
The temperature of the contact portion 12 exposed in the passage 11b is detected. Here, since the contact portion 12 is connected from the pin 16a of the semiconductor device 16 to a chip inside the semiconductor device 16 via a lead, a solder ball or the like having a high thermal conductivity, the contact portion 12 of the semiconductor device 16 Chip part and contact part 1
2 is relatively small. Therefore, the temperature detector 13
Accordingly, the temperature of the chip of the semiconductor device 16 can be detected more accurately, and even if there is a change due to the high thermal conductivity, it can be detected quickly.

The heating / cooling device 15 causes the contact portion 12 exposed in the passage 11b of the socket body 11 to flow heated or cooled insulating liquid such as air or chlorofluorocarbon, so that the contact portion 12 is exposed. Is heated or cooled, and the heating or cooling is applied to the pin 1 of the semiconductor device 16 from the contact portion.
6a, the semiconductor device 16
Of chips can be more efficiently and more accurately adjusted to a predetermined temperature.

According to the semiconductor device inspection apparatus socket 10 of the present embodiment, the semiconductor device 1 to be inspected is
Since the temperature required for the inspection can be accurately adjusted while the socket 6 is mounted on the socket body 11, a more accurate inspection can be performed.

In this case, the temperature of the contact portion 12 of the socket body 11 is detected instead of the temperature of the semiconductor device 16 itself to be inspected. The temperature can be detected, and more accurate and stable temperature control can be performed even when the semiconductor device 16 is not mounted.

(Second Embodiment) FIG. 6 shows a second embodiment of a socket for a semiconductor device inspection apparatus according to the present invention.

In FIG. 6, a semiconductor device inspection apparatus socket 20 includes a socket body 21 and a semiconductor device 26 housed in a cavity 21a of the socket body 21.
(In the case of the figure, a QFP type IC) a plurality of contact portions 22 arranged corresponding to the pins which are the ends, and a cover 24 for closing the cavity 21a to define the chamber 23.
And a heat pipe 25 as a heat conducting member.

The socket main body 21 is made of an insulating material, and has a mounting surface 21a on which the semiconductor device 26 to be inspected is mounted, and the socket main body 21 below the mounting surface 21a. Passage 2 penetrating (horizontally)
1b.

The contact portion 22 is made of a conductive material. One end 22a of the contact portion 22 is exposed on the mounting surface 21a of the socket body 21 so as to correspond to the pins of the semiconductor device. The other end 22b is exposed to the outside from the bottom surface of the socket body 21 in the case shown.

The chamber 23 includes the socket body 21
And the cover 24, and at the time of inspection,
For example, the temperature is about 125 ° C.

The heat pipe 25 has a known structure and has an extremely high thermal conductivity. The heat pipe 25 is provided so as to thermally connect the internal space of the chamber 23 and the passage 21 b of the socket body 21. Have been.

According to the semiconductor device inspection apparatus socket 20 having such a configuration, the mounting surface 21a of the socket body 21 is provided.
The semiconductor device 26 to be inspected is mounted thereon, and each of the pins 26a abuts on one end 22a of the corresponding contact portion 22 exposed on the mounting surface 21a, whereby the semiconductor device 26 is mounted. .

From this state, the connection terminal of the inspection device (not shown) is electrically connected to the other end 22b of each contact portion 22 exposed on the bottom surface of the socket body 21 via a connection cord or the like, and the inspection by the inspection device is performed. Done.

At this time, the inside of the chamber 23 is, for example, 12
The temperature in the chamber 23 is maintained at 5 ° C., and the temperature in the chamber 23 is transmitted through the heat pipe 25 into the passage 21 b of the socket body 21 to heat the intermediate portion of the contact portion 22 exposed in the passage 21 b. Will do.

When there is no heat pipe 25, the contact portion 22
Is exposed to the outside, heat is released to the outside from the other end 22b of the contact portion 22, and the contact portion 22 and the pin 26a of the semiconductor device 26
For example, the temperature drops to about 50 ° C., but the presence of the heat pipe 25 heats the contact section 22 and the pins 26 a of the semiconductor device 26 to about 125 ° C.
From the contact portion 22 via the pin 26a of the semiconductor device 26,
The chip portion of the semiconductor device 26 can also be adjusted to the same temperature of approximately 125 ° C. as in the chamber 23.

In this case, since the semiconductor device 26 is heated from the surface of the mold portion of the package in the chamber 23 and the chip portion is directly heated via the pins 26a, the entire semiconductor device 26 is suitable for inspection. Temperature can be adjusted.

As described above, according to the present embodiment, hot air or cold air in the chamber 23 surrounding the semiconductor device 26 is conducted into the passage 21 b of the socket body 21 via the heat pipe 25.

As a result, the contact portion of the socket is generally exposed to the outside, and the temperature of the chip portion of the semiconductor device tends to change under the influence of the outside air temperature. Since heat conduction is performed from hot air or cold air in the chamber 23, accurate temperature adjustment is possible without heat escaping to the outside via the contact portion 22 of the socket body 21 or heat entering the inside from the outside. become.

As described above, the temperature detection and the temperature adjustment are performed via the contact portions 22 of the socket body 21, so that, for example, in a recently increasing semiconductor device such as a high-speed CPU (central processing unit), the density is increased. Even if the chip temperature rises sharply with the increase in the amount of heat generated inside the device due to the speeding up, in addition to the cooling by the ambient temperature with the cooling fan attached to the CPU, the contact point of the socket via the pin through the pin The chip portion can be cooled, a greater cooling effect can be obtained, and reliable temperature adjustment can be achieved.

In the embodiment described above, the passage 1
The heating or cooling of the contact portion 12 exposed in 1b is performed by using air heated or cooled by the heating / cooling device 15, but is not limited to this. Obviously, insulating liquids such as fluorine can also be used.

In the above-described embodiment, the semiconductor devices 16 and 26 are, for example, BGA type or QF type.
Although the socket for an inspection apparatus for inspecting a P-type IC has been described, the present invention is not limited thereto, and the present invention can be applied to a socket for an inspection apparatus for another type of IC or another type of semiconductor device. It is clear.

[0067]

As described above, according to the first aspect of the present invention, there is provided a socket for a semiconductor device inspection device capable of accurately detecting and controlling the temperature of a chip portion of a semiconductor device. can do.

According to the second aspect of the present invention, it is possible to provide a semiconductor device inspection device socket capable of controlling the temperature of the contact portion and the temperature of the chip portion of the semiconductor device more accurately. .

According to the third and fourth aspects of the present invention, the contact portion can be heated or cooled by heating or cooling the air or the insulating liquid.

According to the fifth aspect of the invention, the temperature can be adjusted more accurately without being affected by the outside air temperature.

[Brief description of the drawings]

FIG. 1 is a schematic plan view showing a configuration of a first embodiment of a socket for a semiconductor device inspection device according to the present invention.

FIG. 2 is a schematic side view showing a configuration of a second embodiment of the semiconductor device inspection device socket of FIG. 1;

3 is a schematic side view showing a housing state of the semiconductor device in the semiconductor device inspection device socket of FIG. 1;

FIG. 4 is an enlarged cross-sectional view of the socket for a semiconductor device inspection apparatus of FIG. 1, taken along the line AA in FIG. 1;

FIG. 5 is a block diagram showing the overall configuration of the semiconductor device inspection device socket of FIG. 1;

FIG. 6 is a schematic sectional view showing a configuration of a second embodiment of a socket for a semiconductor device inspection device according to the present invention.

FIG. 7 is a schematic perspective view showing an example of a conventional socket for a semiconductor device inspection device.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 10 ... Socket for semiconductor device inspection apparatus 11 ... Socket main body 11a ... Cavity 11b ... Pathway 12 ... Contact part 13 ... Temperature detection part 14 ... Control part 15 ... Heating・ Cooling device 16 ・ ・ ・ Semiconductor device 16a ・ ・ ・ Pin 20 ・ ・ ・ Socket for semiconductor device inspection device 21 ・ ・ ・ Socket body 21a ・ ・ ・ Surface, 21b ・ ・ ・ Path 22 ・ ・ ・ Contact portion 23 ・ ・・ Chamber 24 ・ ・ ・ Cover 25 ・ ・ ・ Heat pipe

Claims (5)

[Claims] 1. A socket body having a cavity for accommodating a semiconductor device, an end connected to a chip portion of the semiconductor device accommodated in the cavity by a member having high thermal conductivity, and an end connected to the end. A correspondingly arranged contact portion, comprising: a socket for semiconductor device measurement, wherein at least a part of the contact portion is provided with a passage so that the fluid medium is in contact with the contact portion. A socket for a semiconductor device inspection device, wherein a temperature detecting portion is provided so as to detect a temperature of a contact portion with which the fluid medium contacts. 2. A control section for performing temperature control based on the temperature detected by the temperature detection section, and a heating or cooling section for performing heating or cooling based on control of the control section. The semiconductor device inspection apparatus socket according to claim 1, wherein the fluid medium is supplied by a cooling unit. 3. The socket for a semiconductor device inspection apparatus according to claim 1, wherein the fluid medium is air. 4. The socket for a semiconductor device inspection device according to claim 1, wherein the fluid medium is an insulating liquid. 5. A socket body on which a semiconductor device is mounted, an end portion connected to a chip portion of the semiconductor device housed on the socket body by a member having high thermal conductivity, and an end portion corresponding to the end portion. And a cover for closing a surface of the socket body and defining a chamber for accommodating the semiconductor device, the semiconductor device inspection device socket comprising: For at least a part of the portion, a passage through which the fluid medium flows so as to contact, and a heat conducting member arranged to connect the inside of the chamber and the passage are provided.
Socket for semiconductor device inspection equipment.