JP2000280155A - Double surface grinder for thin circular workpiece - Google Patents

Double surface grinder for thin circular workpiece

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Publication number
JP2000280155A
JP2000280155A JP8765499A JP8765499A JP2000280155A JP 2000280155 A JP2000280155 A JP 2000280155A JP 8765499 A JP8765499 A JP 8765499A JP 8765499 A JP8765499 A JP 8765499A JP 2000280155 A JP2000280155 A JP 2000280155A
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workpiece
grinding
means
fluid supply
work
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JP2000280155A5 (en )
JP3951496B2 (en )
Inventor
Toshio Ishii
Kenji Okura
健司 大倉
利夫 石井
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Koyo Mach Ind Co Ltd
光洋機械工業株式会社
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Abstract

PROBLEM TO BE SOLVED: To provide a double surface grinder for a thin circular workpiece capable of grinding at high precision regardless of thickness reduction of the workpiece. SOLUTION: This grinder is provided with a pair of grinding wheels 8, 9 disposed in such a way that their end grinding surfaces face each other, and that they are relatively moved to each other in the axial directions, and a workpiece rotating means provided to support a workpiece at a grinding position between the grinding surfaces to be rotated so that both surfaces of the workpiece to be worked respectively face the grinding surfaces of the grinding wheels 8, 9, that an outer circumference of the workpiece crosses outer circumferences of the grinding surfaces, and that the center of the workpiece is positioned inside the grinding surfaces. The rotating means is provided with hydrostatic type axial direction support means 10, 11 to supply fluid from between the grinding wheels 8, 9 to both surfaces of the workpiece to be worked at outer parts for contactlessly supporting the workpiece in the axial directions. The hydrostatic type axial direction supporting means 10, 11 are provided with a hydrostatic control means 13 for keeping hydrostatic pressure constant to correspond to reduction of thickness of the workpiece as grinding goes on.

Description

【発明の詳細な説明】 DETAILED DESCRIPTION OF THE INVENTION

【0001】 [0001]

【発明の属する技術分野】本発明は、薄板円板状ワークの両面研削装置、さらに詳しくは、例えば半導体ウェハー等のような薄板円板状ワークの両面を同時に研削する装置に関する。 BACKGROUND OF THE INVENTION The present invention provides double-side grinding apparatus of the thin disk-shaped workpiece, more particularly, for example, to simultaneously grinding apparatus both surfaces of the thin disk-shaped workpiece such as a semiconductor wafer.

【0002】 [0002]

【従来の技術】薄板円板状ワークの両面を同時に研削する装置として、例えば、特開平10−217079号公報に記載のものがある。 Simultaneously as grinding an apparatus for both sides of the Related Art thin disk-shaped workpiece, for example, those described in JP-A-10-217079.

【0003】この研削装置は、水平なベッドおよびベッドの上面に左右に間隔を置いて設けられ、対向した面がそれぞれ研削面となされる一対の鉛直円板状砥石と、薄板鉛直円板状ワークの両面が砥石の研削面にそれぞれ対向するとともにワークの外周が研削面の外周と交差しかつワークの中心が研削面内に位置するようにワークを研削面の間の研削加工位置に支持して自転させるワーク自転装置とを備えている。 [0003] The grinding apparatus is provided at intervals in the left-right to the upper surface of the horizontal bed and the bed, and a pair of vertical discoid grindstone opposing surfaces are made respectively grinding surface, thin vertical discoid workpiece both surfaces is the outer periphery of the workpiece with facing each grinding surface of the grinding wheel to support the workpiece so periphery and crossed and center of the workpiece grinding surface is positioned in the grinding surface grinding position between the grinding surface of the and a workpiece rotation apparatus for rotating.

【0004】ワーク自転装置は、研削砥石の間から外に出ているワークの部分の両面に流体を供給してその静圧によりワークを軸方向に非接触支持する静圧軸方向支持装置と、ワークを径方向に支持して回転させる径方向支持駆動装置とを備えている。 [0004] workpiece rotation apparatus includes a hydrostatic bearing direction supporting device for non-contact support the workpiece in the axial direction by the static pressure from between the grinding wheel by supplying a fluid to both sides of the portion of the work that are on the outside, and a radial support driving device for rotating and supported radially work.

【0005】静圧軸方向支持装置は、ワークを差し入れることのできるスリットが形成された支持ブロックを有し、スリットを形成するブロックの両面から空気などの流体が吹き出され、この流体により生じる静圧によりワークが支持されるようになされている。 [0005] hydrostatic direction supporting device has a support block which slit can insert his work is formed, a fluid such as air is blown from both of blocks forming a slit, static caused by the fluid are adapted to the workpiece is supported by pressure.

【0006】 [0006]

【発明が解決しようとする課題】上記従来の研削装置においては、研削に伴うワークの厚みの変化に対応することができない。 In [0007] the conventional grinding apparatus can not respond to changes in the thickness of the workpiece with the grinding. すなわち、研削が進行してワークの厚みが減少すると静圧が低くなりワークが不安定になるため、ワークの研削精度が低くなり、ワークの加工面の平面度が低くなるという問題がある。 That is, since the grinding is static pressure when the thickness is reduced in the workpiece is lower traveling work becomes unstable, the grinding accuracy of the workpiece is lowered, there is a problem that the flatness of the machined surface of the workpiece is lowered.

【0007】本発明の目的は、上記問題を解決することを課題とするものであり、ワークの厚みの減少に関わらず高い精度で研削を行える薄板円板状ワークの両面研削装置を提供することにある。 An object of the present invention, which is an object to solve the above problems, to provide a double-sided grinding machine of the thin disk-shaped workpiece can perform grinding with high accuracy regardless of the reduction of the work of a thickness It is in.

【0008】 [0008]

【課題を解決するための手段および発明の効果】上記課題を解決するために、本発明の薄板円板状ワークの両面研削装置は、端面の円形研削面同士が対向するとともに軸方向に相対的に移動しうるように配置されて回転させられる1対の研削砥石と、薄板円板状ワークの両面の加工面が前記1対の研削砥石の研削面にそれぞれ対向するとともに前記ワークの外周が前記研削面の外周と交差しかつ前記ワークの中心が前記研削面内に位置するように前記ワークを前記研削面の間の研削加工位置に支持して自転させるワーク自転手段とを備えており、前記ワーク自転手段が、前記研削砥石の間から外に出ているワークの部分の両面の加工面に流体を供給してその静圧により前記ワークを軸方向に非接触支持する静圧式軸方向支持手段と、前記ワー In order to solve the above described problems effect means and the invention of the Invention The double-sided grinding machine for thin disc-shaped workpiece of the present invention, relative to the axial direction together with the circular grinding surfaces of the end surfaces are opposed and grinding wheel pair to be rotated are arranged so may move, the outer periphery of the workpiece with both sides of the working surface of the thin disk-shaped workpiece is respectively facing the grinding surface of the grinding wheel of said pair said to periphery and intersect and the center of the workpiece grinding surface is provided with a workpiece rotation means for rotating and supporting the workpiece to be located on the ground plane to the grinding position between the grinding surface, the a work rotating means, the grinding wheel hydrostatic axial supporting means for non-contact support the workpiece in the axial direction by the static pressure by supplying a fluid to both sides of the working surface of a portion of the work that goes out from between the and, the word を径方向に支持して自転させる径方向支持駆動手段とを備えている薄板円板状ワークの両面研削装置において、静圧式軸方向支持手段が、研削の進行に伴うワークの厚みの減少に対応して静圧を一定に保つ静圧制御手段を備えていることを特徴とするものである。 In double-side grinding apparatus of the thin disk-shaped workpiece and a radial support driving means for rotating and supported radially and hydrostatic axial support means, corresponding to the reduction in the thickness of the workpiece with the progress of grinding and it is characterized in that it comprises a static pressure control means for keeping the static pressure constant by.

【0009】この薄板円板状ワークの両面研削装置においては、ワークの厚みの変化に関わらずワークを保持する静圧の値が一定に保たれるので、薄板円板状ワークの両面を高い精度で研削することができる。 [0009] In the double-sided grinding machine of the thin disk-shaped workpiece, the value of static pressure is maintained constant, high on both sides of the thin disk-shaped workpiece accuracy for holding the workpiece regardless of the change in the workpiece thickness in can be grinding.

【0010】上記、薄板円板状ワークの両面研削装置において、静圧式軸方向支持手段が、前記研削砥石の間から外に出ているワークの部分の面にそれぞれ対向する面を有する一対の流体供給部材を有し、静圧制御手段が、 [0010] above, in double-side grinding apparatus of the thin disk-shaped workpiece, hydrostatic axial support means, a pair of fluid with each surface facing the surface of the portion of the work that goes out from between said grinding wheel It has a supply member, the static pressure control unit,
少なくとも一方の流体供給部材をワークの軸方向に移動させる移動手段を有し、移動手段が、流体圧シリンダを有し、研削の進行に伴うワークの厚みの減少に対応して前記流体圧シリンダのロッドが伸びることにより、少なくとも一方の流体供給部材が、ワークの軸方向に移動し、静圧が一定に保たれるようになされていることがある。 A moving means for moving at least one of the fluid supply member in the axial direction of the workpiece, moving means has a fluid pressure cylinder, in response to a decrease in thickness of the workpiece with the progress of grinding of the fluid pressure cylinder the rod extends, at least one fluid supply member, to move in the axial direction of the workpiece, it may static pressure is adapted to be kept constant.

【0011】この装置においては、静圧制御手段を単純な構成で実現することができるとともに容易に静圧を一定に保つことができ、静圧の制御を確実に行うことができる。 [0011] In this apparatus, it is possible to realize a static pressure control means with a simple structure easily can be kept static pressure constant, it is possible to reliably control the static pressure. .

【0012】さらに、上記の両面研削装置が、一方の流体供給部材に接続された真空引き装置を備え、かつ他方の流体供給部材のみが流体圧シリンダにより移動するようになされ、研削開始前および研削終了後のワークを、 [0012] Furthermore, the above double-side grinding device comprises one vacuum device connected to a fluid supply member, and only the other fluid supply member is adapted to move by fluid pressure cylinder, grinding before and grinding the work after the end of,
吸着した状態で保持しうるようになされていることがある。 It may have been made so as to be able to hold in adsorbed state.

【0013】この装置においては、流体供給部材の研削砥石の間から外に出ているワークの部分の面に対向する面を正しく鉛直にしておけば、ワークを正確に鉛直状態で流体供給部材によって吸着保持した後にワークを非接触支持することができるので、非接触状態においてもワークを正確に鉛直な状態に保つことができる。 [0013] In this apparatus, if from between the grinding wheel of the fluid supply member and the surface facing the correct vertical to the plane of the portion of the work which are on the outside, by the fluid supply member work in exactly vertical position it is possible to non-contact support the workpiece after suction-held, it is possible to maintain the workpiece even in a non-contact state in exactly vertical state.

【0014】 [0014]

【発明の実施の形態】以下、図面を参照して本発明の薄板円板状ワークの両面研削装置について説明する。 DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, with reference to the accompanying drawings sided grinding machine of the thin disk-shaped workpiece of the present invention will be described.

【0015】図1〜図4は、本発明における第1の実施形態の薄板円板状ワークの両面研削装置を示したものである。 [0015] FIGS. 1-4, there is shown a double-sided grinding machine of the thin disk-shaped workpiece in the first embodiment of the present invention. なお、以下の説明において前後左右は図1を基準とするものとし、図1の左右を左右といい、図1の紙面表側を前、紙面裏側を後というものとする。 Incidentally, the left and right front and rear in the following description it is assumed that a reference to Figure 1, referred to as a left to right in FIG. 1, prior to the paper front side of FIG. 1, it is assumed that after the paper back.

【0016】研削装置(1) は、水平なベッド(2) の上面に取り付けられた前後面が開口し、上面にワーク差し入れ用開口(3a)があけられたフレーム(3) およびフレーム [0016] Grinding apparatus (1) is open at front and rear surfaces, which is attached to the upper surface of the horizontal bed (2), the frame (3) which work pledged opening (3a) is opened to the upper surface and the frame
(3)内に鉛直面が対向するように配された左右一対のベース(4)(5)を備えている。 (3) vertical plane in are provided with the disposed pair of right and left base to face (4) (5).

【0017】フレーム(3) の左右内面にはそれぞれ砥石ヘッド(6)(7)がそれぞれ左右のベース(4)(5)を貫通して対向状に取り付けられている。 [0017] attached to the frame (3), respectively grindstone head to the left and right inner surfaces of the (6) (7) is left of the base, respectively (4) (5) opposite shaped through the. 砥石ヘッド(6)(7)の対向面には、左右方向に伸びる円柱状の研削砥石(8)(9)が、 The opposing surface of the grinding head (6) (7), the cylindrical grinding wheel extending in the lateral direction (8) (9),
端面の円形研削面同士が対向するように、かつ各砥石 As circular grinding surfaces of the end faces are opposed, and the grinding wheel
(8)(9)の軸線が同一直線上に位置するように配されている。 (8) the axis is arranged so as to be positioned on the same straight line (9). 図示は省略したが、砥石ヘッド(6)(7)内には、砥石 Although not illustrated, in the grinding wheel head (6) (7), the grindstone
(8)(9)を左右方向に移動させる軸方向移動装置および砥石(8)(9)を軸線周りに回転させる回転装置がそれぞれ設けられている。 (8) (9) a rotating device for rotating about the axis of the axial direction moving device and the grinding wheel is moved (8) (9) in the left-right direction are respectively provided. なお、砥石(8)(9)は、非研削時には砥石 Incidentally, the grinding wheel (8) (9), when not in the grinding wheel
(8)(9)の相互間隔がワーク(w) の厚みより大きくなる待機位置に位置するようになされている。 (8) (9) spacing have been made so as to be positioned in larger standby position than the thickness of the workpiece (w).

【0018】左のベース(4) の右側および右のベース [0018] left on the right side and the right of the base of the base (4)
(5) の左側にはそれぞれ一対の流体供給部材(10)(11)が対向状に設けられている。 Each of the left pair of fluid supply member (5) (10) (11) is provided on the counter form. 流体供給部材(10)(11)は、短筒状部材(10e)(11e)と、これの開口をふさぐ蓋部材(10 Fluid feeding member (10) (11), the lid member (10 a short tubular member (10e) (11e), closing this opening
f)(11f)とにより構成されているものであり、全体としてそれぞれ左右方向に伸びる軸線を有する円板状をなし、かつ下部にそれぞれ砥石(8)(9)が位置しうる切り欠き(10c) が形成されている。 Are those which are constituted by a f) (11f), forms a disk shape having an axis extending in the left and right direction as a whole, and each grinding wheel (8 in the lower part) (9) notches may be located (10c ) are formed. また、流体供給部材(10)(1 The fluid supply member (10) (1
1)には流体噴き出し孔(10a)(11a)がそれぞれ多数設けられている。 Fluid ejection hole (10a) (11a) is provided with a number each of the 1). 各孔(10a)(11a)は、供給部材(10)(11)内に設けられた空間(10b)(11b)を介してつながっており、この空間(10b)(11b)と、図示は省略した流体供給装置とがそれぞれ接続されて各孔(10a)(11a)から流体が噴き出されるようになっている。 Each hole (10a) (11a) is connected via a supply member (10) (11) provided in the space (10b) (11b), and the space (10b) (11b), it is not shown so that the fluid is expelled from the fluid supply device and is connected to the holes (10a) (11a). また、左の流体供給部材(10)には複数のワーク吸引孔(10d) があけられている。 Further, a plurality of workpiece suction holes (10d) is opened to the left of the fluid supply member (10). この孔(1 This hole (1
0d) は、供給部材(10)内において流体噴き出し孔(10a) 0d) is ejection fluid in the feed member (10) within the hole (10a)
をつなぐ空間(10b) と隔てられた空間(10g) を介してつながっており、この空間(10g) に接続管(23)を介して図示しない真空ポンプなどの適当な真空引き装置が接続されている。 The are connected via a space (10b) and spaced space (10 g) connecting this space with a suitable vacuum device, such as a vacuum pump (not shown) via a connecting pipe (23) to (10 g) is connected to there.

【0019】そして、左の流体供給部材(10)は、左のベース(4) の右面に固定され、一方、右の流体供給部材(1 [0019] Then, the left of the fluid supply member (10) is fixed to the right surface of the base (4) of the left, whereas, the right of the fluid supply member (1
1)は、以下に述べるようにして左右方向に移動自在に設けられている。 1) is provided to be movable in the lateral direction as described below.

【0020】流体供給部材(11)は鉛直板状の支持部材(1 [0020] Fluid supply member (11) is vertical plate-like support member (1
2)を備えている。 It is equipped with a 2). 支持部材(12)は、左右方向に伸びるロッド(13a) を有する2つのエアシリンダ(13)のロッド(1 The support member (12), the rod of the two air cylinder having a rod (13a) extending in the lateral direction (13) (1
3a)先端に取付られている。 3a) is attached to the distal end. エアシリンダ(13)は、前後に間隔を置いてベース(5) に固定されている、さらに、 An air cylinder (13) is fixed to the base (5) at intervals in the front-rear, further,
支持部材(12)の右面には、前下隅および後上隅において左右方向に伸びる円柱状案内部材(14)が取り付けられ、 The right surface of the support member (12), the front cylindrical guide member extending in the horizontal direction in the lower corner and rear corner (14) is attached,
この案内部材(14)が、ベース(5) を摺動自在に貫通することにより流体供給部材(11)が左右方向に正しく移動するようになっている。 The guide member (14) is a fluid supply member (11) is adapted to move correctly in the lateral direction by passing through the base (5) slidably. なお、支持部材(12)には、砥石 Note that the support member (12), the grinding wheel
(9) が貫通するための貫通孔(12a) があけられている。 (9) through holes for penetrating (12a) is opened.
なお、右の流体供給部材(11)は、非研削時においては、 Incidentally, the right of the fluid supply member (11), at the time of non-grinding,
エアシリンダ(13)のロッド(13a) がもっとも縮んだ状態である待機位置に位置する。 Rod of the air cylinder (13) (13a) is located at the standby position is a most contracted state. なお、エアシリンダ(13) The air cylinder (13)
は、図示しない圧力調整弁を介して圧縮空気供給源に接続されており、圧力調整弁によってエアシリンダ(13)内の圧力が一定に保たれるようになっている。 It is connected to a compressed air source via a pressure regulating valve (not shown), so that the pressure in the air cylinder (13) is kept constant by the pressure regulating valve.

【0021】左のベース(4) には、流体供給部材(11)によって保持されたワークを径方向に支持して回転させる径方向支持駆動装置が以下のようにして設けられている。 The left of the base (4), radial support driving device for supporting and rotating the workpiece held by the fluid supply member (11) in the radial direction are provided in the following manner.

【0022】左のベース(4) の右面には、流体供給部材 [0022] The right side of the base (4) of the left, the fluid supply member
(10)(11)間の周りの前後に位置するローラ(15)(16)(17) (10) (11) rollers (15) located around the circumference of between (16) (17)
が、上、中、下にそれぞれ2個ずつ、合計6個設けられている。 But on, in, and two each in the lower, provided total of 6. それぞれのローラ(15)(16)(17)は、左右方向に伸びる水平軸周りに回転自在であり、さらに、下の2個のローラ(15)の相互間隔は、中の2個のローラ(16)の相互間隔よりも小さく、これら4個のローラ(15)(16)により鉛直状態のワーク(w) を受けて支持できるようになっている。 Each roller (15) (16) (17) is rotatable about a horizontal axis extending in the lateral direction, further, the spacing between the two rollers of the lower (15), two rollers in ( smaller than the mutual spacing of 16), so that it receive and support a vertical position the workpiece (w) by these four rollers (15) (16).

【0023】また、中の2個のローラ(16)は、駆動ローラであり、左のベース(4) に取り付けられた電動モータ Further, two rollers in (16) is a drive roller, an electric motor mounted to the left of the base (4)
(22)によってベルト(19)を介して駆動されるようになっている。 Is driven via a belt (19) by (22). 下の2個のローラ(15)は、従動ローラである。 Two rollers of the lower (15) is a driven roller.
上の2個のローラ(17)は、押さえローラであり、図示は省略したが、例えば、エアシリンダなどの移動装置によって前後に移動できるようになっており、押さえローラ Two rollers (17) above, a press roller, although not shown, for example, are adapted to be moved back and forth by the movement device such as an air cylinder, press roller
(17)は、ローラ(17)の相互間隔がワークの直径より大きくなる待機位置をとることができるようになっている。 (17), spacing between the rollers (17) is adapted to be able to take a standby position greater than the diameter of the workpiece.

【0024】詳細な図示は省略したが、研削装置におけるワーク(w) の搬入、搬出を自動的に行うためのワーク搬入出手段としてのオートローダ(21)がフレーム(3) の上方に設けられている。 [0024] DETAILED Although not shown, carrying the workpiece (w) in the grinding apparatus, autoloader (21) of the workpiece loading and unloading means for automatically performing the unloading is provided above the frame (3) there.

【0025】なお、この研削装置においては、ワーク [0025] It should be noted that, in this grinding device, work
(w) の直径に比し、流体供給部材(10)(11)の直径はわずかに小さく、砥石(8)(9)の直径は、流体供給部材(10)(1 Compared to the diameter of (w), slightly smaller diameter of the fluid supply member (10) (11), the diameter of the grinding wheel (8) (9), the fluid supply member (10) (1
1)の直径より小さい。 1) less than the diameter.

【0026】このような構成を有する研削装置(1) においては、押さえローラ(17)、砥石(8)(9)および右の流体供給部材(11)がそれぞれ待機位置をとった状態で、ワーク(w) が、鉛直な姿勢で駆動ローラ(16)と従動ローラ(1 [0026] In the state in grinding apparatus (1) having such a configuration, the pressing roller (17), the grinding wheel (8) (9) and the right of the fluid supply member (11) is taken to a waiting position, respectively, the workpiece (w) is in a vertical posture driving roller (16) and the driven roller (1
5)との上に載せられる。 5) is placed on top of the. 次に左の流体供給部材(10)内部が真空引きされ、ワーク(w) が左の流体供給部材(10)の右面に吸引されて吸着され、正確に鉛直な状態に保たれる。 Then the fluid supply member (10) inside the left is evacuated, the workpiece (w) in the input image is adsorbed is attracted to the right surface of the left of the fluid supply member (10) is kept exactly vertical state. このときワーク(w) の上側約半分の部分が流体供給部材(10)(11)の間に位置する。 The upper about half of this time the workpiece (w) is positioned between the fluid feeding member (10) (11). そしてワーク(w) の上部がわずかに流体供給部材(10)(11)より上方に突出しており、ワーク(w)のこの部分の一部を押さえるように押さえローラ(17)間の相互間隔が調整される。 Then protrudes from the work top is slightly fluid supply member (w) (10) (11) upwards, the mutual spacing between pressing part as press roller (17) of this part of the work (w) is It is adjusted.

【0027】そして、左の流体供給部材(10)と真空引き装置とが遮断されると即座に左右の流体供給部材(10)(1 [0027] Then, the fluid supply member of the left and right as soon as the left of the fluid supply member (10) and the vacuum device is interrupted (10) (1
1)から空気またはクーラントなどの流体が、流体供給部材(10)(11)間に位置するワーク(w) の部分に、すなわち、研削砥石(8)(9)の間から外に出ているワーク(w) の部分の両面の加工面に供給されてワーク(w) が研削加工位置に支持される。 Fluid such as air or coolant from 1), the portion of the workpiece (w) which is located between the fluid feeding member (10) (11), that is, to get out from between the grinding wheel (8) (9) is supplied to both sides of the working surface of a portion of the workpiece (w) workpiece (w) is supported in grinding position. 同時にエアシリンダ(13)のロッド(1 At the same time the rod of the air cylinder (13) (1
3a) が伸びて右の流体供給部材(11)が左方向に移動し、 3a) is extended right of the fluid supply member (11) is moved to the left,
流体供給部材(10)(11)間の静圧が所定の値になされ、その静圧によりワーク(w) が鉛直状態で非接触支持される。 Static pressure between the fluid feeding member (10) (11) it is made a predetermined value, the workpiece (w) is supported without contact in vertical state by its static pressure.

【0028】上記の状態において、駆動ローラ(16)が回転を開始し、駆動ローラ(16)とワーク(w) の外周との間の摩擦力によってワーク(w) が自転する。 [0028] In the above state, the drive roller (16) starts to rotate, the workpiece (w) is rotating by the friction force between the driving roller (16) and the outer periphery of the workpiece (w). ワーク(w) が時点を開始すると、左右の砥石(8)(9)が回転させられる。 When the work (w) starts to time, the left and right of the grinding wheel (8) (9) is rotated. 左右の砥石(8)(9)は、回転させられると同時に、それぞれ他方の砥石(8)(9)に向かって移動してワーク(w) Left and right of the grinding wheel (8) (9) and, at the same time are rotated, each other of the grinding wheel (8) moves toward the (9) work (w)
の下側の部分が砥石(8)(9)によって挟まる。 Lower portion of caught by the grindstone (8) (9). このようにして、ワーク(w) の外周が砥石(8)(9)の研削面の外周と交差し、かつワーク(w) の中心が砥石(8)(9)の研削面内に位置する。 In this way, the outer periphery of the workpiece (w) intersects the outer periphery of the grinding surface of the grinding wheel (8) (9), and the center of the workpiece (w) is positioned within the grinding surface of the grinding wheel (8) (9) .

【0029】この状態でワーク(w) が一回転する間にワーク(w) の両面の加工面全面が砥石(8)(9)の研削面の間を通過する。 The both surfaces of the processing surface entire of the workpiece (w) while the workpiece in this state (w) is one rotation passes between the grinding surface of the grinding wheel (8) (9). 右の砥石(9) は、研削の進行に伴い左へ徐々に移動する。 The right of the grinding wheel (9), gradually moving to the left with the progress of grinding. 一方、左の砥石(8) は、最初にワーク On the other hand, the left of the grinding wheel (8), first to work
(w) を挟んだ位置から動かない。 (W) does not move from the position across the. そして、右の砥石(9) Then, the right of the grinding wheel (9)
は、左の砥石(8) との相互間隔がワーク(w) の仕上がり厚さにより定まる値となる位置で所定時間停止し、スパークアウト研削が行われる。 Is a predetermined time stopping mutual spacing at a position where a value determined by the finished thickness of the workpiece (w) of the left of the grinding wheel (8), the spark-out grinding is performed. そしてワーク(w) が搬入時の厚みから所定の厚みへと研削される。 The workpiece (w) is ground from the thickness at the time of loading to a predetermined thickness.

【0030】ワーク(w) が研削されるさい、エアシリンダ(13)内の圧力は一定に保たれるため、ワーク(w) の厚みの減少に伴って流体供給部材(10)(11)間の静圧が低くなると即座に、エアシリンダ(13)のロッド(13a) がワーク(w) の厚みの減少分だけ伸び、流体供給部材(10)(11) [0030] again the work (w) are ground, the pressure in the air cylinder (13) is kept constant, while the workpiece (w) fluid supply member with decreasing thickness (10) (11) of immediately when the static pressure is low, the elongation rod of the air cylinder (13) (13a) only decrease in thickness of the workpiece (w), the fluid supply member (10) (11)
間の静圧は所定の値に戻される。 Static pressure between is returned to a predetermined value. この動作が殆ど時差を生じることなく行われるので、静圧は実質上一定に保たれる。 Since this operation is performed without almost causing time difference, static pressure is kept substantially constant.

【0031】ワーク(w) の研削が終了すると、砥石(8) [0031] When the grinding of the work (w) is completed, the grinding wheel (8)
(9)がワーク(w) から離れ待機位置へと移動する。 (9) is moved to the standby position away from the workpiece (w). 砥石 Grindstone
(8)(9)がワーク(w) から離れると、駆動ローラ(16)が停止させられ、これによってワーク(w) も自転を停止する。 (8) (9) away from the workpiece (w), the driving roller (16) is stopped, thereby stopping the even rotation work (w). ワーク(w) が自転を停止すると、流体供給部材(10) When the work (w) to stop rotation, the fluid supply member (10)
(11)からの流体の供給が停止される。 (11) the supply of fluid is stopped from. これと同時にワーク(w) が左の流体供給部材(10)の右面に吸引される。 At the same time the workpiece (w) is drawn on the right surface of the left of the fluid supply member (10). そして、ワーク(w) の上縁部がローダ(21)によって保持され、押さえローラ(17)および右の流体供給部材(11)がそれぞれ待機位置へと移動する。 The upper edge portion of the workpiece (w) in the input image is held by the loader (21), the pressing roller (17) and the right of the fluid supply member (11) is moved to the respective standby positions. そして、ワーク(w) がローダ(21)によって上方へ持ち上げられて研削装置(1) 外へと搬出される。 Then, the workpiece (w) is carried out to lifted upwardly grinding device (1) outside by the loader (21). この動作が繰り返されて研削が次々に行われる。 Grinding is carried out one after another the operation is repeated.

【0032】上記の研削装置(1) のように、一方の砥石(上記実施形態においては左の砥石(8) )を停止させて基準とし、他方の砥石(上記実施形態においては右の砥石(9) )を移動させるようにすれば、一方の砥石の研削面を基準として研削を行うことができるので、研削の精度が高くなる。 [0032] As described above the grinding device (1), one of the grinding wheel (in the embodiment left of the grinding wheel (8)) as a reference is stopped, and the other of the grinding wheel (in the above embodiment the right of the grinding wheel ( if to move 9)), since the grinding surface of one of the grinding wheel can be carried out grinding as the reference, grinding is done with high accuracy.

【0033】また、一方の流体供給部材(上記実施形態においては右の流体供給部材(11))を動かし、他方の流体供給部材(上記実施形態においては左の流体供給部材 Further, moving the one of the fluid supply member (right of the fluid supply member in the above embodiment (11)), the left of the fluid supply member is in the other fluid supply member (the above-described embodiment
(10))を固定して静圧を一定に保つようにすれば、静圧を高い精度で一定に保つことができるとともに装置の構成を単純にすることができる。 (10) If) to maintain a fixed and static pressure constant, it is possible to simplify the construction of the device it is possible to maintain a constant static pressure with high accuracy.

【0034】なお、ワーク(w) の搬入出およびワーク [0034] In addition, the loading and unloading and the work of the work (w)
(w) を支持する手順は上記の説明の手順に限るものではない。 (W) the procedure for supporting the is not limited to the procedure explained above.

【0035】次に図5および図6を参照して本発明における第2の実施形態の両面研削装置について説明する。 [0035] Next Fig. 5 and with reference to FIG. 6 double-side grinding apparatus of the second embodiment of the present invention will be described.
なお、以下の説明において第1の実施形態における研削装置に示したものと同一物および同一部分には同一符号を付して説明は省略する。 Incidentally, description thereof is omitted with the same reference numerals are given to the same components and same parts as those shown in the grinding apparatus of the first embodiment in the following description. また、以下の説明においては、図5の左右を左右というものとする。 In the following description, it is assumed that the left and right to left in FIG. 5.

【0036】この研削装置(20)は、ベース(4) および支持部材(12)に対する流体供給部材(25)(26)の取付手段および径方向支持駆動手段が異なるものである。 [0036] The grinding device (20) comprises a base (4) and the mounting means and the radial support drive means of the fluid supply member with respect to the support member (12) (25) (26) are different.

【0037】左の流体供給部材(25)はベース(4) の右向面に、右の流体供給部材(26)は、支持部材(12)に、それぞれ以下のようにして取り付けられている。 The left fluid supplying member (25) to the right direction surface of the base (4), the right of the fluid supply member (26), the support member (12), respectively mounted in the following manner.

【0038】左右の流体供給部材(25)(26)には、周方向に間隔を置いて3個の貫通孔(25a)(26a)が形成されている。 The right and left of the fluid supply member (25) (26), three through holes at intervals in the circumferential direction (25a) (26a) are formed. 左の流体供給部材(25)の貫通孔(25a) を、ベース The through hole of the left of the fluid supply member (25) and (25a), the base
(4) にねじ込まれた3本のスタッドボルト(29)が、右の流体供給部材(26)の貫通孔(26a) を、支持部材(12)にねじ込まれた3本のスタッドボルト(30)がそれぞれ貫通している。 (4) a threaded the three stud bolts (29), the through hole of the right of the fluid supply member (26) (26a) and three stud bolts screwed into the support member (12) (30) There has been through, respectively. そして、スタッドボルト(29)(30)における流体供給部材(25)(26)の左右にそれぞれナット(31)が球面座金(36)を介してねじ合わされており、ナット(31)を回転させることにより左の流体供給部材(25)とベース(4) との間隔および右の流体供給部材(26)と支持部材(12)との間隔がそれぞれ同じになるように調整され、流体供給部材(25)(26)が正確に鉛直な状態に保たれるようになっている。 Then, the fluid supply member (25) in the stud bolt (29) (30) (26) the nut (31) respectively to the left and right have been screwed through the spherical washers (36), rotating the nut (31) distance of the left fluid supply member (25) and the base (4) spacing and right of the fluid supply member (26) and the support member (12) is adjusted so that the respective same way, the fluid supply member (25 ) (26) is adapted to be kept exactly vertical state.

【0039】この実施形態においては、ワーク(w) を径方向に支持して自転させる径方向支持駆動手段が以下のようにして形成されている。 [0039] In this embodiment, the radial supporting and drive means for rotating and supporting a workpiece (w) in the radial direction are formed in the following manner.

【0040】左右の流体供給部材(25)(26)との間には、 [0040] Between the left and right of the fluid supply member (25) (26)
鉛直円板状をなすとともに中央にワーク(w) が嵌め入れられる穴(33d) があけられたワーク嵌め入れ部材(33)が設けられている。 Work fitted into member workpiece (w) hole is fitted (33d) is opened in the center with forming the vertical discoid (33) is provided. 嵌め入れ部材(33)は、左右方向に伸びる水平軸周りに回転する3個の支持ローラ(32)がベース Fitted into member (33) comprises three support rollers for rotation about a horizontal axis extending in the lateral direction (32) of the base
(4) に取り付けられており、このローラ(32)によって嵌め入れ部材(33)が支持されている。 (4) it is attached to, member fitted by the roller (32) (33) is supported. なお、支持ローラ(3 The support rollers (3
2)は、嵌め入れ部材(33)の周方向に等間隔をおいて配されている。 2) is arranged at equal intervals in the circumferential direction of the fitting put member (33).

【0041】ワーク嵌め入れ部材(33)は、外周に歯車の歯が切られた肉厚のあつい周縁部(33a) と、これから半径方向内側に突出したワーク保持部(33b) とよりなる。 The workpiece fitted into member (33) is hot periphery of wall thickness gear teeth cut into the outer periphery and (33a), the more future work holder which projects radially inwardly and (33b).
ワーク保持部(33b) の厚みは、ワーク(w) の厚みより薄い。 The thickness of the workpiece holding portion (33b) is thinner than the thickness of the workpiece (w). 本実施形態においては、周縁部(33a) とワーク保持部(33b) とは、別の部材によって構成され、周縁部(33 In the present embodiment, the peripheral portion and (33a) work holder and (33b), is constituted by another member, the peripheral edge (33
a) とワーク保持部(33b) とは、相互にねじ止めされている。 a) a work holder and (33b) is screwed to one another.

【0042】周縁部(33a) の歯は、ベース(4) に取り付けられた駆動モータ(34)のモータ軸に固定された歯車とかみ合い、駆動モータ(34)によって、嵌め入れ部材(33) The teeth of the peripheral portion (33a), the base mesh with the gear fixed to the motor shaft of a drive motor mounted to (4) (34), by a drive motor (34), fitted into members (33)
が軸方向に回転駆動されるようになっている。 There is adapted to be rotated in the axial direction.

【0043】ワーク保持部(33b) の内縁部には半径方向内側に向かって突出した突部(33c)が形成されている。 [0043] The inner edge of the work holder (33b) projections projecting radially inwardly (33c) is formed.
この突部(33c) は、ワーク(w) の周縁部に形成されたいわゆるノッチと呼ばれる切り欠き(wa)の形状に適合している。 The projection (33c) is adapted to the shape of the notch so-called notch formed in the periphery of the workpiece (w) (wa).

【0044】この研削装置(20)においては、装置(20)の中央よりやや右側の上方に設けられたローダ(35)により以下のようにしてワーク(w) の搬入出が行われる。 [0044] In the grinding device (20), loading and unloading of the workpiece (w) is performed as follows by the loader slightly provided on the right side of the above the central unit (20) (35).

【0045】ローダ(35)は、吸盤(35a) を備え、この吸盤(35a) に、切り欠き(wa)が所定の位置、この装置においては上側に位置するようにワーク(w) が吸着されている。 The loader (35) comprises a suction cup (35a), to the suction cup (35a), cutout (wa) is a predetermined position, the workpiece (w) in the input image is adsorbed so as to be positioned on the upper side in this device ing. 一方、ワーク嵌め入れ部材(33)は、ワーク保持部(3 On the other hand, the workpiece fitted into member (33), the workpiece holder (3
3b) の突部(33c) が上側にくるような状態をとっている。 Projection of 3b) (33c) is taking state so that the upper side.

【0046】砥石(8)(9)および右の流体供給部材(26)はそれぞれ待機位置をとっている状態において、ローダ(3 [0046] In a state in which taking grindstone (8) (9) and the right of the fluid supply member (26), each standby position, the loader (3
5)が下降して保持部(33b) の穴(33d) の中心とワーク The center of the hole (33d) of 5) is lowered holding portion (33b) and the workpiece
(w) の中心とが同一の左右方向に伸びる水平直線上に位置させられる。 And the center of the (w) is is positioned in a horizontal straight line extending in the same lateral direction. 次にローダ(35)が左方向に移動してワーク(w) の切り欠き(wa)に保持部(33b) の突部(33c) が嵌まるように、ワーク(w) が穴(33d) に嵌め入れられる。 Then the loader (35) is moved to the left notch of the workpiece (w) held portion to fit the protrusion of (33b) (33c) to (wa), the workpiece (w) hole (33d) It is fitted put in.
この後吸盤(35a) からワーク(w) が離れ、ローダ(35)が研削装置(20)の右上方へ移動する。 Work from this after sucker (35a) (w) is away, the loader (35) is moved to the upper right of the grinding device (20). ワーク(w) の搬出は、上記の手順と逆に行われる。 Unloading of the workpiece (w) is carried out in the above procedure in reverse.

【0047】砥石(8)(9)および右の流体供給部材(26)が移動して研削が行われる手順は第1の実施形態の研削装置の場合と同様である。 The procedure grindstone (8) (9) and the right of the fluid supply member (26) is grinding is performed by moving the same as in the grinding apparatus of the first embodiment.

【図面の簡単な説明】 BRIEF DESCRIPTION OF THE DRAWINGS

【図1】本発明における第1の実施形態の薄板円板状ワークの両面研削装置の部分切り欠き正面図である。 1 is a partially cut-away front view of a double-side grinding apparatus of the first embodiment of the thin disk-shaped workpiece according to the present invention.

【図2】同薄板円板状ワークの両面研削装置の要部の拡大断面図である。 2 is an enlarged sectional view of a main part of the double-side grinding apparatus of the thin disk-shaped workpiece.

【図3】同薄板円板状ワークの両面研削装置の側面図である。 3 is a side view of a double-side grinding apparatus of the thin disk-shaped workpiece.

【図4】同薄板円板状ワークの両面研削装置の要部の斜視図である。 4 is a perspective view of a main part of the double-side grinding apparatus of the thin disk-shaped workpiece.

【図5】本発明における第2の実施形態の薄板円盤状ワークの両面研削装置における用部の正面図である。 5 is a front view of a use section in the double-sided grinding machine for thin disc-shaped workpiece of a second embodiment of the present invention.

【図6】同両面研削装置の側面図である。 6 is a side view of the double-sided grinding machine.

【符号の説明】 DESCRIPTION OF SYMBOLS

(1) 研削装置 (8)(9) 研削砥石 (10)(11) 流体供給部材 (13) エアシリンダ (13a) ロッド (20) 研削装置 (25)(26) 流体供給部材 (w) ワーク (1) grinding device (8) (9) grinding wheel (10) (11) fluid supply member (13) an air cylinder (13a) Rod (20) grinding device (25) (26) fluid supply member (w) Work

Claims (3)

    【特許請求の範囲】 [The claims]
  1. 【請求項1】 端面の円形研削面同士が対向するとともに軸方向に相対的に移動しうるように配置されて回転させられる1対の研削砥石と、 薄板円板状ワークの両面の加工面が前記1対の研削砥石の研削面にそれぞれ対向するとともに前記ワークの外周が前記研削面の外周と交差しかつ前記ワークの中心が前記研削面内に位置するように前記ワークを前記研削面の間の研削加工位置に支持して自転させるワーク自転手段とを備えており、 前記ワーク自転手段が、前記研削砥石の間から外に出ているワークの部分の両面の加工面に流体を供給してその静圧により前記ワークを軸方向に非接触支持する静圧式軸方向支持手段と、前記ワークを径方向に支持して自転させる径方向支持駆動手段とを備えている薄板円板状ワークの両面研削装置におい 1. A and the grinding wheel pair to be rotated are arranged as can relatively move in the axial direction together with the circular grinding surfaces of the end faces are opposed, both sides of the working surface of the thin disk-shaped workpiece during the work of the ground surface so that the center of the outer periphery of the workpiece crosses the periphery of the grinding surface and the workpiece with facing each grinding surface of the grinding wheel of the pair is positioned on the ground plane of which a workpiece rotating means for rotating and supporting the grinding position, said workpiece rotation means, to supply fluid to both sides of the working surface of a portion of the work that goes out from between said grinding wheel a hydrostatic axial supporting means for non-contact support the workpiece in the axial direction by the static pressure, both sides of which thin disk-shaped workpiece and a radial support driving means for rotating and supporting the workpiece in the radial direction grinding apparatus smell 、 静圧式軸方向支持手段が、研削の進行に伴うワークの厚みの減少に対応して静圧を一定に保つ静圧制御手段を備えていることを特徴とする薄板円板状ワークの両面研削装置。 , Hydrostatic axial support means, double-side grinding of the thin disk-shaped workpiece, characterized in that it comprises a static pressure control means for keeping the static pressure constant in response to a decrease in thickness of the workpiece with the progress of grinding apparatus.
  2. 【請求項2】 静圧式軸方向支持手段が、前記研削砥石の間から外に出ているワークの部分の面にそれぞれ対向する面を有する一対の流体供給部材を有し、 静圧制御手段が、少なくとも一方の流体供給部材をワークの軸方向に移動させる移動手段を有し、 移動手段が、流体圧シリンダを有し、 研削の進行に伴うワークの厚みの減少に対応して前記流体圧シリンダのロッドが伸びることにより、少なくとも一方の流体供給部材が、ワークの軸方向に移動し、静圧が一定に保たれるようになされていることを特徴とする請求項1記載の薄板円板状ワークの両面研削装置。 2. A hydrostatic axial support means comprises a pair of fluid supply members having a respective surface facing the surface of the portion of the work that goes out from between the grinding wheel, the static pressure control unit At least one of the fluid supply member comprises a moving means for moving in the axial direction of the workpiece, moving means has a fluid pressure cylinder, the fluid pressure in response to a decrease in thickness of the workpiece with the progress of the grinding cylinder by the rod extends, at least one fluid supply member, moves in the axial direction of the work, according to claim 1 thin disc-shaped, wherein the static pressure is adapted to be kept constant double-sided grinding machine of work.
  3. 【請求項3】一方の流体供給部材に接続された真空引き装置を備え、かつ他方の流体供給部材のみが流体圧シリンダにより移動するようになされ、研削開始前および研削終了後のワークを、吸着した状態で保持しうるようになされていることを特徴とする請求項2記載の薄板円板状ワークの両面研削装置。 3. A comprising one vacuum device connected to a fluid supply member, and only the other fluid supply member is adapted to move by fluid pressure cylinder, the workpiece after grinding before and grinding ends, adsorption double-side grinding apparatus of the thin disk-shaped workpiece according to claim 2, characterized in that it is adapted to be held in a state of being.
JP8765499A 1999-03-30 1999-03-30 Double-side grinding apparatus of the thin disk-shaped workpiece Expired - Fee Related JP3951496B2 (en)

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Cited By (11)

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WO2005070620A1 (en) 2004-01-22 2005-08-04 Koyo Machine Industries Co.,Ltd. Double-end surface grinding machine
WO2005095054A1 (en) * 2004-03-19 2005-10-13 Memc Electronic Materials, Inc. Wafer clamping device for a double side grinder
US6997779B2 (en) 2004-03-11 2006-02-14 Siltronic Ag Device for the simultaneous double-side grinding of a workpiece in wafer form
JP2006332281A (en) * 2005-05-25 2006-12-07 Komatsu Electronic Metals Co Ltd Semiconductor wafer manufacturing method, semiconductor wafer double-sided grinding method, and semiconductor wafer double-sided grinding apparatus
DE102008026782A1 (en) 2008-06-04 2009-07-09 Siltronic Ag Double sided grinding machine for simultaneous bilateral grinding of e.g. semiconductor wafer, has hydro-pad for hydrostatic storage of discoidal work-piece, where hydro-pad is made of titanium and not laminated
US7601049B2 (en) 2006-01-30 2009-10-13 Memc Electronic Materials, Inc. Double side wafer grinder and methods for assessing workpiece nanotopology
US7662023B2 (en) 2006-01-30 2010-02-16 Memc Electronic Materials, Inc. Double side wafer grinder and methods for assessing workpiece nanotopology
DE102009025242A1 (en) 2009-06-17 2010-12-30 Siltronic Ag A method for reversible chemical grinding a semiconductor wafer
WO2011023297A1 (en) 2009-08-26 2011-03-03 Siltronic Ag Method for producing a semiconductor wafer
US7930058B2 (en) 2006-01-30 2011-04-19 Memc Electronic Materials, Inc. Nanotopography control and optimization using feedback from warp data
JP2013215813A (en) * 2012-04-05 2013-10-24 Koyo Mach Ind Co Ltd Method for carrying workpiece in/out in double disk grinding and double disk grinder

Cited By (22)

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US7347770B2 (en) 2004-01-22 2008-03-25 Koyo Machine Industries Co., Ltd. Two-sided surface grinding apparatus
WO2005070620A1 (en) 2004-01-22 2005-08-04 Koyo Machine Industries Co.,Ltd. Double-end surface grinding machine
US6997779B2 (en) 2004-03-11 2006-02-14 Siltronic Ag Device for the simultaneous double-side grinding of a workpiece in wafer form
DE102004011996B4 (en) * 2004-03-11 2007-12-06 Siltronic Ag An apparatus for simultaneous double-side grinding of disc-shaped workpieces,
US8066553B2 (en) 2004-03-19 2011-11-29 Memc Electronic Materials, Inc. Wafer clamping device for a double side grinder
JP2007529332A (en) * 2004-03-19 2007-10-25 エムイーエムシー・エレクトロニック・マテリアルズ・インコーポレイテッドMemc Electronic Materials,Incorporated Wafer clamping device for both sides grinding apparatus
US8267745B2 (en) 2004-03-19 2012-09-18 Memc Electronic Materials, Inc. Methods of grinding semiconductor wafers having improved nanotopology
WO2005095054A1 (en) * 2004-03-19 2005-10-13 Memc Electronic Materials, Inc. Wafer clamping device for a double side grinder
KR101141474B1 (en) * 2004-03-19 2012-05-07 엠이엠씨 일렉트로닉 머티리얼즈, 인크. Wafer clamping device for a double side grinder
JP2006332281A (en) * 2005-05-25 2006-12-07 Komatsu Electronic Metals Co Ltd Semiconductor wafer manufacturing method, semiconductor wafer double-sided grinding method, and semiconductor wafer double-sided grinding apparatus
US8145342B2 (en) 2006-01-30 2012-03-27 Memc Electronic Materials, Inc. Methods and systems for adjusting operation of a wafer grinder using feedback from warp data
US7662023B2 (en) 2006-01-30 2010-02-16 Memc Electronic Materials, Inc. Double side wafer grinder and methods for assessing workpiece nanotopology
US7927185B2 (en) 2006-01-30 2011-04-19 Memc Electronic Materials, Inc. Method for assessing workpiece nanotopology using a double side wafer grinder
US7930058B2 (en) 2006-01-30 2011-04-19 Memc Electronic Materials, Inc. Nanotopography control and optimization using feedback from warp data
US7601049B2 (en) 2006-01-30 2009-10-13 Memc Electronic Materials, Inc. Double side wafer grinder and methods for assessing workpiece nanotopology
DE102008026782A1 (en) 2008-06-04 2009-07-09 Siltronic Ag Double sided grinding machine for simultaneous bilateral grinding of e.g. semiconductor wafer, has hydro-pad for hydrostatic storage of discoidal work-piece, where hydro-pad is made of titanium and not laminated
US8376810B2 (en) 2009-06-17 2013-02-19 Siltronic Ag Method for chemically grinding a semiconductor wafer on both sides
DE102009025242A1 (en) 2009-06-17 2010-12-30 Siltronic Ag A method for reversible chemical grinding a semiconductor wafer
WO2011023297A1 (en) 2009-08-26 2011-03-03 Siltronic Ag Method for producing a semiconductor wafer
US8343873B2 (en) 2009-08-26 2013-01-01 Siltronic Ag Method for producing a semiconductor wafer
DE102009038941A1 (en) 2009-08-26 2011-03-10 Siltronic Ag A process for producing a semiconductor wafer
JP2013215813A (en) * 2012-04-05 2013-10-24 Koyo Mach Ind Co Ltd Method for carrying workpiece in/out in double disk grinding and double disk grinder

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