JP2000277883A - Method of mounting surface mounted type capacitor - Google Patents

Abstract

PROBLEM TO BE SOLVED: To obtain a method of mounting a surface mounted type capacitor, whereby the resonance sound level can be lowered when this capacitor is mounted on a printed wiring board. SOLUTION: A rubber sheet 4 is laid between component mounting pads 2a at two spots on a printed wiring board 2, electrodes 1b at both sides of a surface mounted type ceramic capacitor 1 are mounted on the mounting pads 2a, and a body 1a of the ceramic capacitor 1 is pressed by a jig, etc., and soldered with solder 3 to be electrically connected, thus completing the mounting on the printed board 2. The ceramic capacitor 1 is retained with the rubber sheet 4, and hence even if vibrating, the capacitor resonate will not with the wiring board 2 to produce a resonance sound.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for mounting a surface mount type capacitor.

[0002]

2. Description of the Related Art Conventionally, surface mount type capacitors, such as surface mount type ceramic capacitors, are mounted by soldering electrodes at both ends to component mounting pads of a printed wiring board in the same manner as other surface mounted chip components. I was FIG. 4 is a cross-sectional view showing a state in which a conventional surface mount type ceramic capacitor is mounted on a printed wiring board. In the figure, reference numeral 11 denotes a surface mount type ceramic capacitor, and electrodes 11b are provided at both ends of a main body 11a. Reference numeral 12 denotes a printed wiring board on which component mounting pads 12a are provided. Also, 1
3 is solder.

The surface mount type ceramic capacitor 11 is
Electrodes 11b are mounted on the component mounting pads 12a at both ends, and are electrically connected by soldering to the component mounting pads 12a with the solder 13, so that the printed wiring board 1
2 is implemented.

[0004]

In the method of mounting the surface mount type ceramic capacitor 11 on the printed wiring board 12, the printing is performed in such a manner that the main body 11a of the surface mount type ceramic capacitor 11 is supported by the electrodes 11b at both ends. Solder mounting is performed while floating from the wiring board 12. Therefore, when noise of 20 to 20,000 Hz, which is a human audible frequency range, intermittently enters the surface mount type ceramic capacitor, the main body 11a of the surface mount type ceramic capacitor vibrates and resonates with the printed wiring board 12. Sometimes produced resonance noise.

An object of the present invention is to provide a mounting method of a surface mount capacitor capable of reducing the level of resonance sound when a surface mount capacitor such as a surface mount ceramic capacitor is mounted on a printed wiring board. Aim.

[0006]

SUMMARY OF THE INVENTION In order to solve this problem, the present invention is to sandwich a sheet-shaped elastic body having vibration absorption and excellent heat resistance between a surface mount capacitor and a printed wiring board. This is implemented in. Or,
A plurality of surface mount capacitors are arranged in parallel and mounted on the same component mounting pad of a printed wiring board. Alternatively, an opening is provided at a position between the two component mounting pads of the printed wiring board and facing the surface mount capacitor.

In this way, the vibration of the surface mount type capacitor is absorbed by the sheet-like elastic body, or the resonance frequency with the printed wiring board is changed, or the printed wiring board is removed, so that the surface mounted capacitor and the printed wiring board are removed. Can resonate and reduce the level of the resonance sound generated.

[0008]

DESCRIPTION OF THE PREFERRED EMBODIMENTS The invention according to claim 1 of the present invention is characterized in that a vibration absorbing material is sandwiched between a surface mount capacitor and a printed wiring board on which the surface mount capacitor is soldered. This is a method of mounting a surface mount capacitor, which has an effect that vibration of the surface mount capacitor is absorbed and resonance with the printed wiring board is less likely to occur and resonance noise is less likely to be generated.

According to a second aspect of the present invention, in the method of mounting a surface mount type capacitor according to the first aspect, the vibration absorbing material has a heat resistance of at least 230 ° C. or more. It has the effect of being able to withstand the ambient temperature.

According to a third aspect of the present invention, in the method of mounting a surface mount type capacitor according to the first aspect, a sheet-like elastic body is used as the vibration absorbing material. Therefore, it has an effect that it can be easily processed to a required size, and an arbitrary number of surface-mounted capacitors arranged in parallel can be handled by one sheet.

According to a fourth aspect of the present invention, there is provided a method of mounting a surface mount type capacitor, comprising arranging a plurality of surface mount type capacitors in parallel and mounting them on the same component mounting pad of a printed wiring board. Since the plurality of surface mount capacitors vibrate together, the resonance frequency with the printed wiring board changes, and the level of the resonance sound decreases.

According to a fifth aspect of the present invention, an opening is provided between two component mounting pads of a printed wiring board on which the surface mount capacitor is soldered, at a position facing the surface mount capacitor. This is a method of mounting a surface-mounted capacitor that has the effect that even if the surface-mounted capacitor vibrates, the opposed parts of the printed wiring board are removed, so that resonance hardly occurs and resonance noise is hardly generated. .

An embodiment of the present invention will be described below with reference to the drawings.

(Embodiment 1) FIG. 1 is a sectional view showing a state in which a surface mount type ceramic capacitor according to a first embodiment of the present invention is mounted on a printed wiring board. In the figure, reference numeral 1 denotes a surface mount type ceramic capacitor;
Electrodes 1b are provided at both ends of a. Reference numeral 2 denotes a printed wiring board on which component mounting pads 2a are provided. 3 is solder. An elastic rubber sheet 4 is sandwiched between the main body 1 a of the surface mount type ceramic capacitor 1 and the printed wiring board 2. The rubber sheet 4 has a heat resistance of 230 ° C. or more so as to withstand the environmental temperature at the time of solder mounting. As for the hardness or the like, a material having a large vibration damping effect of the surface mount type ceramic capacitor 1 is selected. However, it is not necessary to completely suppress the vibration because it does not have to resonate at least with the printed wiring board 2.

In the mounting procedure in this embodiment, first, a rubber sheet 4 is attached between two component mounting pads 2a of a printed wiring board 2 on which a surface mount type ceramic capacitor 1 is mounted. This attachment may be performed with an adhesive or a double-sided tape. Next, the electrodes 1b on both sides of the surface-mount type ceramic capacitor 1 are placed on the component mounting pads 2a, and the main body 1a of the surface-mount type ceramic capacitor 1 is pressed by a jig or the like, and soldered by the solder 3 to electrically connect the electrodes. Connected to the printed wiring board 2
Is completed. Further, even if the surface mount type ceramic capacitor 1 vibrates, the vibration is suppressed by the rubber sheet 4, so that resonance does not occur due to resonance with the printed wiring board 2.

Since the rubber sheet 4 can be easily cut into any size and used, for example, if a plurality of surface mount type ceramic capacitors 1 are arranged in parallel, one sheet can be used to collectively handle the ceramic capacitors. It is also possible.

(Embodiment 2) FIG. 2 is a plan view showing a state in which a surface mount type ceramic capacitor according to a second embodiment of the present invention is mounted on a printed wiring board. In the figure, the same parts as those in the first embodiment are denoted by the same reference numerals, and description thereof is omitted. Reference numeral 2b denotes a component mounting pad provided on the printed wiring board 2, on which electrodes 1b of two surface-mounted ceramic capacitors 1 arranged in parallel are placed and both are soldered simultaneously.

In this way, when two surface-mounted ceramic capacitors 1 arranged in parallel vibrate,
Compared with the case where only one surface mount type ceramic capacitor is used, resonance with the printed wiring board 2 is less likely to occur, and thus resonance noise is less likely to be generated. Also, even if it occurs, it can be set to a low level.

In this embodiment, the case where two surface-mount type ceramic capacitors are arranged in parallel has been exemplified. However, it is needless to say that the number is not limited to two.

(Embodiment 3) FIG. 3 is a sectional view showing a state in which a surface mount type ceramic capacitor according to a third embodiment of the present invention is mounted on a printed wiring board. In the figure, the same parts as those in the first embodiment are denoted by the same reference numerals, and description thereof is omitted. Reference numeral 2c denotes a hole provided between the component mounting pads 2a of the printed wiring board 2 at a position where the main body of the surface mount type ceramic capacitor faces.

In this way, when the surface mount type ceramic capacitor 1 vibrates, there is no printed wiring board resonating at the position facing the vibrating main body 1a, so that resonance noise is hardly generated. Also, even if it occurs, it can be set to a low level.

In each of the above embodiments, a surface mount type ceramic capacitor has been described as an example of a surface mount type capacitor. However, the present invention is not limited to this. It can be applied to any of the surface mount type capacitors.

[0023]

As described above, according to the present invention, the vibration of the surface mount type capacitor is absorbed by the sheet-like elastic body or printed without adding a complicated method to the conventional mounting method of the surface mount type capacitor. Change the resonance frequency with the wiring board,
Alternatively, it is possible to obtain an advantageous effect that the printed wiring board is removed and the level of the resonance sound generated by the resonance between the surface mount capacitor and the printed wiring board can be reduced.

[Brief description of the drawings]

FIG. 1 is a cross-sectional view showing a state in which a surface-mount type ceramic capacitor according to a first embodiment of the present invention is mounted on a printed wiring board.

FIG. 2 is a plan view showing a state in which a surface mount type ceramic capacitor according to a second embodiment of the present invention is mounted on a printed wiring board.

FIG. 3 is a cross-sectional view showing a state where a surface-mount type ceramic capacitor according to a third embodiment of the present invention is mounted on a printed wiring board.

FIG. 4 is a cross-sectional view showing a state in which a conventional surface mount type ceramic capacitor is mounted on a printed wiring board.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Surface mount type ceramic capacitor 1a Body part 1b Electrode 2 Printed wiring board 2a, 2b Component mounting pad 2c Hole 3 Solder 4 Rubber sheet

Claims (5)

[Claims] 1. A method for mounting a surface mount capacitor, comprising: interposing a vibration absorbing material between a surface mount capacitor and a printed wiring board on which the surface mount capacitor is soldered. 2. The method according to claim 1, wherein the vibration absorbing material has a heat resistance of at least 230 ° C. or higher. 3. The method according to claim 1, wherein a sheet-like elastic body is used as the vibration absorbing material. 4. A method for mounting a surface mount capacitor, comprising arranging a plurality of surface mount capacitors in parallel and mounting them on the same component mounting pad of a printed wiring board. 5. A mounting method for a surface-mounted capacitor, wherein an opening is provided between two component mounting pads of the printed wiring board on which the surface-mounted capacitor is to be soldered, at a position facing the surface-mounted capacitor. Method.