JP2000260854A - Semiconductor wafer push-up mechanism - Google Patents

Abstract

PROBLEM TO BE SOLVED: To allow cleaning in a short time by, with a holder to which a push-up pin is fitted provided, mounting/dismounting a head part deformable under elastic force from a groove part formed in the holder so that one side of the head part is fitted to the shaft on a ground side. SOLUTION: Related to the semiconductor wafer push-up mechanism, a push-up pin 3 and a shaft 8 are clamped with a holder 6 and a plug 7 in one- touch structure. The plug 7 is fixed to the shaft 8 with a screw, while the push-up pin 3 is fixed to the holder 6. The holder 6 and the plug 7 are provided with a structure for dismounting in a single action. An oval head part 8A is formed of an elastic member, one side of the head part 8A is connected to a conductive rod 8B, and the conductive rod 8B is connected to the shaft 8 on the ground side through the plug 7. Thus, a cleaning time is shortened. Further, an induction current is easy to flow, so even if an operator touches the holder 6 with a driver, etc., there is no fear of metal fine particles evaporated by spark, etc., flying to a semiconductor wafer 1.

Description

DETAILED DESCRIPTION OF THE INVENTION

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor manufacturing apparatus, and more particularly to a semiconductor manufacturing apparatus having a wafer push-up structure disposed in a plasma apparatus.

2. Description of the Related Art The wafer push-up mechanism shown in FIG. 1 is fixed by inserting a push-up pin into a holder below an electrode and tightening a nut. Therefore, every time cleaning is performed, work under the electrode is required, which takes a long time.

In a semiconductor manufacturing apparatus, it is necessary to periodically clean the periphery of a wafer push-up pin by depositing a product or the like, and it is necessary to easily remove the wafer push-up pin from the upper part of the electrode. Accordingly, an object of the present invention is to provide a semiconductor wafer pushing-up mechanism which can perform cleaning of a wafer pushing-up pin and its periphery in a short time, and improve a work yield by a fine processing work of a semiconductor wafer.

According to the present invention, there is provided a semiconductor wafer pushing-up mechanism for placing a semiconductor wafer on an electrode and a semiconductor wafer on the electrode by pushing-up pins formed by inserting a plurality of through holes provided in the electrode. In a wafer push-up mechanism of a semiconductor manufacturing apparatus for raising and lowering push-up pins, a holder to which push-up pins are fixed and a head deformable by elastic force in a groove formed in the holder are attached and detached, and one side of the head is connected to a ground side. It is characterized by being attached to a shaft.

DESCRIPTION OF THE PREFERRED EMBODIMENTS This embodiment shows a wafer pushing-up mechanism for transferring a wafer on an electrode in a semiconductor manufacturing apparatus. FIG. 1 shows a prior art wafer lifting mechanism. The semiconductor wafer 1 is transferred onto the electrodes 2 by a transfer mechanism (not shown). After the semiconductor wafer 1 is pushed up once with the push-up pins 3 for placing the semiconductor wafer 1 above the electrodes 2 with a space therebetween, the transport mechanism is retracted, the push-up pins 3 are lowered, and the wafer is placed on the electrodes 2. Push-up pin 3
Must be made of a material such as ceramics due to problems such as metal contamination. Therefore, the fastening is performed in the middle of the shaft 8. The electrode 2 has a plurality of through holes into which the push-up pins 3 are inserted. In the prior art wafer lifting mechanism, the pin 3 is inserted into the shaft 5 and tightened with the fixing screw 4. For this reason, every time the pin 3 is removed for cleaning, it is necessary to loosen the fixing screw 4 below the electrode. FIG. 2 shows the present invention. The operation of placing the semiconductor wafer 1 on the electrode 2 is the same as in the prior art, but the present invention is characterized in that the push-up pin 3 and the shaft 8 are fastened by the holder 6 and the plug 7 in a one-touch structure.
The plug 7 is fixed to the shaft 8 with a screw, and the push-up pin 3 is fixed to the holder 6. The holder 6 and the plug 7 have a structure that can be removed with one touch. That is, the elliptical head 8A is made of an elastic member, and the head 8A
Is connected to a conductive rod 8B, and the conductive rod 8B passes through the plug 7 and is connected to the shaft 8 on the ground side. When the head 8A is inserted into the groove in the holder 6, if the head 8A is pressed inward, the head 8A is inserted into the holder 6 in a state where the cross-sectional area of the head 8A is contracted, and the head 8A returns to the original state in the inserted state. The holder 8 is inflated by the elastic force and is supported while the head 8A is pressing the holder 6. The head 8A may be provided with a plurality of deformable elastic members and a plurality of vertical grooves. When the plug 7 is pulled downward, the head 8A moves while pressing the holder 6 and comes off the holder 6, so that the push-up pin 3 can be removed from the upper part of the electrode 2. At this time, if the push-up pin 3 and the shaft 8 are misaligned or tilted,
Since contact with the electrode 2 occurs, the head 8A is formed on an elliptical concentric circle. Since the shaft 8 and the push-up pin 3 also need to be electrically connected, the conductive rod 8B serves to electrically connect the push-up pin 3 and the holder 6 to the shaft 8 by the head 8A, thereby pushing up the ceramic material. The induced current from the capacitance stored on pin 3 is passed to ground via shaft 8. Further, in the present invention, each time the head 8A moves into and out of the holder 6, the head 8A moves while pressing the holder 6, so that the contact surfaces of the two are always rubbed, and the contact resistance is smaller by the amount rubbed. The current easily flows, and even if the worker touches the holder 6 with a driver or the like, there is no danger that the evaporated fine gold particles due to the supermarket or the like will fly to the semiconductor wafer 1 and the work yield by the fine processing of the semiconductor wafer 1 will be improved. did. The present invention can be applied not only to the wafer lifting mechanism but also to parts that need to be disassembled during cleaning and maintenance.

As described above, according to the present invention, it is possible to easily remove the wafer push-up pins at the time of cleaning as compared with the prior art, thereby shortening the cleaning time and increasing the production amount. Can be achieved. Further, in the present invention, the head 8A
When the head 8A moves into and out of the holder 6, the head 8A moves while pressing the holder 6, so that the contact surface between the two is constantly rubbed, and the contact resistance is reduced by the rubbed contact. Even when the driver touches the holder 6 with a driver or the like, there is no fear that the evaporated fine gold particles due to the supermarket or the like fly to the semiconductor wafer 1, and the work yield by the fine processing of the semiconductor wafer 1 is improved.

[Brief description of the drawings]

FIG. 1 is a configuration diagram of a conventional wafer push-up pin structure.

FIG. 2 is a configuration diagram of a wafer lifting pin structure showing one embodiment of the present invention.

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 1 ... Semiconductor wafer, 2 ... Electrode, 3 ... Wafer push-up pin, 4 ... Fixing screw, 6 ... Holder, 7 ... Plug, 8 ...
Shaft, 8A ... head.

 ────────────────────────────────────────────────── ─── Continuing from the front page (72) Inventor Saburo Kanai 794, Higashi-Toyoi, Kazamatsu-shi, Yamaguchi Prefecture F-term in the Kasado Plant of Hitachi, Ltd.

Claims (1)

[Claims] 1. A wafer lifting mechanism of a semiconductor manufacturing apparatus for lifting a semiconductor wafer on an electrode and a semiconductor wafer on an electrode by means of a lifting pin in which a plurality of through holes provided in the electrode are inserted. And a holder to which a push-up pin is fixed, and a head deformable by elastic force in a groove formed in the holder, and a head that is deformable by an elastic force, and one side of the head is attached to a shaft on the ground side.