JP2000260803A5 - - Google Patents
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- Publication number
- JP2000260803A5 JP2000260803A5 JP2000005026A JP2000005026A JP2000260803A5 JP 2000260803 A5 JP2000260803 A5 JP 2000260803A5 JP 2000005026 A JP2000005026 A JP 2000005026A JP 2000005026 A JP2000005026 A JP 2000005026A JP 2000260803 A5 JP2000260803 A5 JP 2000260803A5
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2000005026A JP2000260803A (ja) | 1999-01-05 | 2000-01-04 | 半導体装置とその製造方法 |
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11-309 | 1999-01-05 | ||
| JP30999 | 1999-01-05 | ||
| JP2000005026A JP2000260803A (ja) | 1999-01-05 | 2000-01-04 | 半導体装置とその製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2000260803A JP2000260803A (ja) | 2000-09-22 |
| JP2000260803A5 true JP2000260803A5 (da) | 2007-02-15 |
Family
ID=26333266
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2000005026A Pending JP2000260803A (ja) | 1999-01-05 | 2000-01-04 | 半導体装置とその製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2000260803A (da) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8368213B2 (en) | 2001-03-05 | 2013-02-05 | Megica Corporation | Low fabrication cost, fine pitch and high reliability solder bump |
Families Citing this family (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6642136B1 (en) | 2001-09-17 | 2003-11-04 | Megic Corporation | Method of making a low fabrication cost, high performance, high reliability chip scale package |
| US8021976B2 (en) | 2002-10-15 | 2011-09-20 | Megica Corporation | Method of wire bonding over active area of a semiconductor circuit |
| US6815324B2 (en) | 2001-02-15 | 2004-11-09 | Megic Corporation | Reliable metal bumps on top of I/O pads after removal of test probe marks |
| US7902679B2 (en) | 2001-03-05 | 2011-03-08 | Megica Corporation | Structure and manufacturing method of a chip scale package with low fabrication cost, fine pitch and high reliability solder bump |
| TWI313507B (en) | 2002-10-25 | 2009-08-11 | Megica Corporatio | Method for assembling chips |
| US7099293B2 (en) | 2002-05-01 | 2006-08-29 | Stmicroelectronics, Inc. | Buffer-less de-skewing for symbol combination in a CDMA demodulator |
| TWI245402B (en) | 2002-01-07 | 2005-12-11 | Megic Corp | Rod soldering structure and manufacturing process thereof |
| US8067837B2 (en) | 2004-09-20 | 2011-11-29 | Megica Corporation | Metallization structure over passivation layer for IC chip |
| US8294279B2 (en) | 2005-01-25 | 2012-10-23 | Megica Corporation | Chip package with dam bar restricting flow of underfill |
| KR101009192B1 (ko) * | 2008-12-10 | 2011-01-19 | 주식회사 네패스 | 반도체 장치의 범프 구조물 및 그 제조방법 |
| JP6729618B2 (ja) | 2018-03-15 | 2020-07-22 | 日亜化学工業株式会社 | 発光装置、及び、発光装置の製造方法 |
| CN113324202B (zh) * | 2021-06-07 | 2022-05-17 | 厦门天马微电子有限公司 | 灯条、包括灯条的背光模组及显示装置 |
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2000
- 2000-01-04 JP JP2000005026A patent/JP2000260803A/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8368213B2 (en) | 2001-03-05 | 2013-02-05 | Megica Corporation | Low fabrication cost, fine pitch and high reliability solder bump |